Integrated circuit packaging wire bonding method and system

Abstract

The present invention discloses a method and system for wire bonding of integrated circuit packages. The method comprises: obtaining the package structure of the integrated circuit, determining multiple welding points and position parameters of each welding point based on the package structure, and generating a welding path based on the position parameters of each welding point; obtaining welding process requirement parameters for each welding point, and determining post-weld morphological parameters of each welding point based on the welding process requirement parameters; determining standard ultrasonic feedback signal parameters for each welding point based on the post-weld morphological parameters of each welding point, and generating welding qualification assessment criteria based on the standard ultrasonic feedback signal parameters; controlling a welding robot to perform wire bonding on the package structure according to the welding path, detecting the real-time ultrasonic feedback signal of each welding point and adjusting the welding force accordingly, and performing qualification assessment on the welding status of each welding point based on the welding qualification assessment criteria. Efficient welding can be achieved through intelligent control of the welder.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit packaging and welding, and in particular to a packaging wire bonding method and system for an integrated circuit. Background Art

[0002] With the rapid development of electronics, integrated circuit (IC) packaging technology is also advancing. The primary functions of IC packaging are chip protection, electrical connectivity, and heat dissipation. Wire bonding is a common electrical connection method used during the packaging process, connecting the chip's pads to the package substrate or lead frame using metal wires (such as gold, copper, or aluminum). Traditional wire bonding relies on manual bonding and qualification assessment by human operators, resulting in low production efficiency and a lack of objective and reliable assessment results, reducing product quality and user experience. Summary of the Invention

[0003] In response to the above-mentioned problems, the present invention provides an integrated circuit packaging wire bonding method and system to solve the problems mentioned in the background technology. The traditional wire bonding technology relies on operators to perform manual wire bonding and qualification evaluation, which not only has low production efficiency but also cannot guarantee the objectivity and reliability of the evaluation results, thereby reducing product quality and user experience.

[0004] A method for packaging wire bonding of an integrated circuit comprises the following steps:

[0005] Acquire a package structure of the integrated circuit, determine a plurality of welding points and position parameters of each welding point according to the package structure, and generate a welding path according to the position parameters of each welding point;

[0006] Obtain welding process requirement parameters for each welding point, and determine post-weld morphological parameters of each welding point based on the welding process requirement parameters;

[0007] Determine the standard ultrasonic feedback signal parameters of each welding point based on the post-weld morphological parameters of each welding point, and generate welding qualification assessment criteria according to the standard ultrasonic feedback signal parameters;

[0008] The welding robot is controlled according to the welding path to perform wire welding on the packaging structure, the real-time ultrasonic feedback signal of each welding point is detected and the welding force is adjusted accordingly, and the welding status of each welding point is qualified according to the welding qualification assessment criteria.

[0009] Preferably, the step of obtaining the package structure of the integrated circuit, determining a plurality of welding points and position parameters of each welding point according to the package structure, and generating a welding path according to the position parameters of each welding point includes:

[0010] Retrieving a data sheet of the integrated circuit, determining a package structure of the integrated circuit according to the data sheet, and retrieving a standard package model from a package database based on the package structure;

[0011] Determine the pinout of the integrated circuit according to the standard package model, determine multiple solder joints based on the pinout, and extract the three-dimensional coordinates of each solder joint using EDA tools;

[0012] Determine the position parameters of each welding point according to the three-dimensional coordinates of each welding point, and generate multiple welding paths through a path planning algorithm based on the position parameters;

[0013] Determine the welding parameter requirements for each welding path, determine the feasibility of each welding path based on the welding parameter requirements, and screen out the best welding path based on the feasibility and preset welding resources.

[0014] Preferably, the obtaining of welding process requirement parameters of each welding point and determining the post-weld morphological parameters of each welding point according to the welding process requirement parameters include:

[0015] Determine the quality of each welding point, determine the optimal welding conditions based on the welding quality, and determine the welding process parameters required for each welding point based on the optimal welding conditions;

[0016] Determine welding time and welding temperature according to welding process requirement parameters, and determine solder strain coverage data of each welding point under high temperature load according to the welding time and welding temperature and the first high temperature deformation parameter of the scalar solder;

[0017] Determine the multi-view point cloud data of each welding point according to the solder strain coverage data, and extract the first morphological description feature of each welding point after welding based on the multi-view point cloud data;

[0018] Evaluate the internal void rate of each solder joint based on the first form description feature, and evaluate whether the first form description feature meets the standard based on the internal void rate of the solder joint;

[0019] If so, determining the post-weld morphological parameters of each weld point based on the first morphological description feature;

[0020] If not, obtain the second morphological description characteristics of each welding spot after welding by reducing the second high-temperature deformation parameters of the solder, repeatedly evaluate the internal void rate of the solder spot on the second morphological description characteristics until the second morphological description characteristics meet the standards, and determine the post-weld morphological parameters of each welding spot based on the second morphological description characteristics.

[0021] Preferably, determining the standard ultrasonic feedback signal parameters of each welding point based on the post-weld morphological parameters of each welding point, and generating welding qualification assessment criteria according to the standard ultrasonic feedback signal parameters, includes:

[0022] Determine the post-weld surface concave-convex state vector of each weld point according to the post-weld morphological parameters of each weld point, and determine the ultrasonic echo feedback amplitude variation parameter and signal feedback delay parameter at each weld point according to the post-weld surface concave-convex state vector;

[0023] Determine the standard ultrasonic feedback signal parameters of each welding point according to the ultrasonic echo feedback amplitude change parameters and the signal feedback delay parameters;

[0024] Extract the key features of the morphological parameters of each welding spot after welding, and determine the correlation mapping relationship between the standard ultrasonic feedback signal parameters of each welding point and the key features of the morphological parameters of the welding spot after welding;

[0025] An evaluation criterion for welding qualification judgment based on ultrasonic feedback for each welding point is generated according to the correlation mapping relationship.

[0026] Preferably, controlling the welding robot to perform wire welding on the package structure according to the welding path, detecting the real-time ultrasonic feedback signal of each welding point and adjusting the welding force accordingly, and performing a welding qualification assessment on the welding state of each welding point according to welding qualification assessment criteria include:

[0027] Determining welding control parameters for the welding robot according to the welding path, and controlling the welding robot to perform wire welding on the package structure through the welding control parameters;

[0028] The ultrasonic sensor detects the real-time feedback signal of the welding robot when welding each welding point, determines the signal difference of each welding point according to the real-time feedback signal, and determines the force adjustment direction based on the signal difference, wherein the force adjustment direction includes: increasing the force and decreasing the force;

[0029] Determine the force adjustment difference according to the signal difference, and adjust the welding force based on the force adjustment difference and the force adjustment direction;

[0030] The welding qualification assessment criteria are used to determine the final morphological characteristics after welding based on the real-time ultrasonic feedback signal parameters of each welding point by the welding robot, and the welding status of each welding point is qualified according to the final morphological characteristics.

[0031] A packaging wire bonding system for an integrated circuit, the system comprising:

[0032] A first generating module is configured to obtain a package structure of an integrated circuit, determine a plurality of welding points and position parameters of each welding point according to the package structure, and generate a welding path according to the position parameters of each welding point;

[0033] A determination module is used to obtain welding process requirement parameters of each welding point and determine the post-weld morphological parameters of each welding point according to the welding process requirement parameters;

[0034] a second generating module, configured to determine a standard ultrasonic feedback signal parameter of each welding point based on the post-weld morphological parameters of each welding point, and generate welding qualification assessment criteria according to the standard ultrasonic feedback signal parameter;

[0035] The welding force adjustment and welding qualification assessment module is used to control the welding robot to perform wire welding on the packaging structure according to the welding path, detect the real-time ultrasonic feedback signal of each welding point and adjust the welding force accordingly, and perform qualification assessment on the welding status of each welding point according to the welding qualification assessment criteria.

[0036] Preferably, the first generating module includes:

[0037] A retrieval submodule is used to retrieve a data sheet of the integrated circuit, determine a package structure of the integrated circuit according to the data sheet, and retrieve a standard package model from a package database based on the package structure;

[0038] A first extraction submodule is configured to determine the pinout of the integrated circuit according to a standard packaging model, determine a plurality of solder joints based on the pinout, and extract the three-dimensional coordinates of each solder joint using an EDA tool;

[0039] A first generating submodule is used to determine the position parameters of each welding point according to the three-dimensional coordinates of each welding point, and generate multiple welding paths according to the position parameters through a path planning algorithm;

[0040] The screening submodule is used to determine the welding parameter requirements of each welding path, determine the feasibility of each welding path based on the welding parameter requirements, and screen out the best welding path based on the feasibility and preset welding resources.

[0041] Preferably, the determining module includes:

[0042] A first determination submodule is configured to determine the quality of each welding point, determine optimal welding conditions based on the welding quality, and determine welding process requirement parameters for each welding point based on the optimal welding conditions;

[0043] A second determination submodule is configured to determine welding time and welding temperature according to welding process requirement parameters, and determine solder strain coverage data of each welding point under high temperature load according to the welding time and welding temperature and a first high temperature deformation parameter of the scalar solder;

[0044] A first extraction submodule is used to determine multi-view point cloud data of each welding point according to the solder strain coverage data, and extract a first morphological description feature of each welding point after welding based on the multi-view point cloud data;

[0045] An evaluation submodule, configured to evaluate the internal void ratio of each solder joint according to the first morphological description feature, and evaluate whether the first morphological description feature meets the standard according to the internal void ratio of the solder joint;

[0046] a third determining submodule, configured to, if yes, determine the post-weld morphological parameters of each welding point according to the first morphological description feature;

[0047] The fourth determination submodule is used to obtain the second morphological description characteristics of each welding spot after welding by reducing the second high-temperature deformation parameters of the solder, repeatedly evaluate the internal void rate of the solder spot on the second morphological description characteristics until the second morphological description characteristics meet the standard, and determine the post-weld morphological parameters of each welding spot according to the second morphological description characteristics.

[0048] Preferably, the second generating module includes:

[0049] A fifth determination submodule is configured to determine a post-weld surface concave-convex state vector of each weld point based on the post-weld morphological parameters of each weld point, and determine an ultrasonic echo feedback amplitude variation parameter and a signal feedback delay parameter at each weld point based on the post-weld surface concave-convex state vector;

[0050] a sixth determining submodule, configured to determine a standard ultrasonic feedback signal parameter for each welding point according to the ultrasonic echo feedback amplitude variation parameter and the signal feedback delay parameter;

[0051] a seventh determination submodule, configured to extract key features of the morphological parameters of each welding spot after welding, and determine a correlation mapping relationship between the standard ultrasonic feedback signal parameters of each welding spot and the key features of the morphological parameters of the welding spot after welding;

[0052] The second generation submodule is used to generate, according to the correlation mapping relationship, an evaluation criterion for welding qualification judgment based on ultrasonic feedback for each welding point.

[0053] Preferably, the welding force adjustment and welding qualification assessment module includes:

[0054] A control submodule is used to determine welding control parameters for the welding robot according to the welding path, and control the welding robot to perform wire welding on the package structure through the welding control parameters;

[0055] an eighth determination submodule, configured to detect, via an ultrasonic sensor, a real-time feedback signal from the welding robot when welding at each welding point, determine a signal difference at each welding point based on the real-time feedback signal, and determine a force adjustment direction based on the signal difference, wherein the force adjustment direction includes increasing the force and decreasing the force;

[0056] A welding force adjustment submodule is used to determine a force adjustment difference according to the signal difference, and to adjust the welding force based on the force adjustment difference and the force adjustment direction;

[0057] The welding qualification assessment submodule is used to determine the final morphological characteristics after welding based on the real-time ultrasonic feedback signal parameters of each welding point of the welding robot according to the welding qualification assessment criteria, and to perform qualification assessment on the welding status of each welding point according to the final morphological characteristics.

[0058] Other features and advantages of the present invention will be described in the following description, and in part will become apparent from the description, or will be understood by practicing the present invention. The purpose and other advantages of the present invention can be realized and obtained by the structures particularly pointed out in the written description and the accompanying drawings.

[0059] The technical solution of the present invention is further described in detail below through the accompanying drawings and embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0060] The accompanying drawings are used to provide further understanding of the present invention and constitute a part of the specification. They are used to explain the present invention together with the embodiments of the present invention and do not constitute a limitation of the present invention.

[0061] Figure 1 A flowchart of a packaging wire bonding method for an integrated circuit provided by the present invention;

[0062] Figure 2 Another working flow chart of the integrated circuit packaging wire bonding method provided by the present invention;

[0063] Figure 3 This is a schematic structural diagram of an integrated circuit packaging wire bonding system provided by the present invention;

[0064] Figure 4 This is a structural schematic diagram of a first generation module in an integrated circuit packaging wire bonding system provided by the present invention. DETAILED DESCRIPTION

[0065] Exemplary embodiments will be described in detail herein, with examples illustrated in the accompanying drawings. In the following description, when referring to the drawings, identical numerals in different figures represent identical or similar elements, unless otherwise indicated. The embodiments described in the following exemplary embodiments are not intended to represent all possible embodiments consistent with the present disclosure. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present disclosure, as detailed in the appended claims.

[0066] Currently, with the rapid development of electronic technology, integrated circuit (IC) packaging technology is also constantly improving. The main functions of IC packaging are to protect the chip, provide electrical connections, and dissipate heat. During the packaging process, wire bonding is a commonly used electrical connection method, connecting the chip's pads to the packaging substrate or lead frame using metal wires (such as gold, copper, or aluminum wires). Traditional wire bonding technology relies on operators to perform manual wire bonding and qualification assessments. This not only has low production efficiency but also cannot guarantee the objectivity and reliability of the assessment results, reducing product quality and user experience. To address the above issues, this embodiment discloses a wire bonding method for integrated circuit packaging.

[0067] A packaging wire bonding method for an integrated circuit, such as Figure 1 As shown, the following steps are included:

[0068] Step S101: obtaining a package structure of an integrated circuit, determining a plurality of welding points and position parameters of each welding point according to the package structure, and generating a welding path according to the position parameters of each welding point;

[0069] Step S102: Obtain welding process requirement parameters for each welding point, and determine post-weld morphological parameters of each welding point according to the welding process requirement parameters;

[0070] Step S103: determining standard ultrasonic feedback signal parameters of each welding point based on the post-weld morphological parameters of each welding point, and generating welding qualification assessment criteria according to the standard ultrasonic feedback signal parameters;

[0071] Step S104: Control the welding robot to perform wire welding on the package structure according to the welding path, detect the real-time ultrasonic feedback signal of each welding point and adjust the welding force accordingly, and perform a welding qualification assessment on the welding status of each welding point according to the welding qualification assessment criteria.

[0072] The working principle of the above technical solution is: obtain the packaging structure of the integrated circuit, determine multiple welding points and the position parameters of each welding point according to the packaging structure, and generate a welding path according to the position parameters of each welding point; obtain the welding process requirement parameters of each welding point, and determine the post-weld morphological parameters of each welding point according to the welding process requirement parameters; determine the standard ultrasonic feedback signal parameters of each welding point based on the post-weld morphological parameters of each welding point, and generate welding qualification assessment criteria according to the standard ultrasonic feedback signal parameters; control the welding robot to perform wire welding on the packaging structure according to the welding path, detect the real-time ultrasonic feedback signal of each welding point and adjust the welding force accordingly, and perform qualification assessment on the welding status of each welding point according to the welding qualification assessment criteria.

[0073] The beneficial effects of the above technical solution are: by generating a welding path and formulating welding qualification assessment criteria for each welding point, efficient welding work can be achieved through intelligent control of the welder, and the welding results of the welding robot can be effectively qualified based on the post-weld morphology of each welding point, thereby improving the objectivity and accuracy of the evaluation and the evaluation efficiency, ensuring the quality of the product and the user experience, and solving the problem mentioned in the prior art that the traditional welding wire technology relies on operators to perform manual welding and qualification assessment, which not only has low production efficiency but also cannot guarantee the objectivity and reliability of the evaluation results, thereby reducing product quality and user experience.

[0074] In this embodiment, after generating the welding path according to the position parameters of each welding point, the following steps are further included:

[0075] Determine the welding gun movement trajectory between two adjacent welding points according to the welding path, and analyze the welding gun movement trajectory to determine the kinematic parameters of the welding robot's welding gun fixing arm;

[0076] According to the kinematic parameters of the welding gun fixed arm, the process posture change parameters of the welding gun fixed arm when welding two adjacent welding points are determined;

[0077] The motion space parameters of the welding robot's welding gun fixed arm are determined based on the process posture change parameters, and a three-dimensional monitoring space model of the welding gun fixed arm is constructed according to the motion space parameters;

[0078] Collect the standard motion state parameters of the welding gun fixed arm when welding at two adjacent welding points;

[0079] Determine the pheromone concentration of the welding gun fixed arm according to standard motion parameters by monitoring the three-dimensional model of the space, wherein the pheromone concentration includes: the movement frequency information concentration of the welding gun fixed arm and the synchronous motion detection information concentration of the welding gun fixed arm and the welding gun;

[0080] According to the pheromone concentration of the welding gun fixing arm, the welding regularity synchronization factor between two adjacent welding points of the welding gun fixing arm under the welding path is determined;

[0081] Determine a welding requirement value of a welding sub-path between two adjacent welding points based on a welding regularity synchronization factor, and determine a welding weight of the welding sub-path between the two adjacent welding points according to the welding requirement value;

[0082] determining a welding energy interval between two adjacent welding points according to the welding weight, and determining welding parameters of a welding subpath between the two adjacent welding points by a preset welding energy-mass ratio based on the welding energy interval;

[0083] Determine whether the welding sub-path between two adjacent welding points meets the weld quality requirements and weld appearance requirements according to the welding parameters, preset quality indicators and preset image indicators;

[0084] If so, it is confirmed that the welding sub-path between the two adjacent welding points is designed reasonably. If not, it is confirmed that the welding sub-path between the two adjacent welding points is unreasonable and an adjustment reminder is issued.

[0085] The beneficial effects of the above technical solution are: by splitting the welding path to determine the welding sub-path between two adjacent welding points and evaluating its specifications, quality and appearance requirements, it is possible to ensure the welding stability and reliability between key welding points. At the same time, based on the minimum welding energy requirements between two adjacent welding points, it is determined whether the welding sub-path between two adjacent welding points is reasonable, so as to provide timely adjustment reminders, thereby ensuring the stability and reliability of the welding process. At the same time, the welding arm movement parameters of the welding robot are also accurately monitored and corrected, further ensuring the welding stability and reliability.

[0086] In one embodiment, Figure 2 As shown, the method of obtaining the package structure of the integrated circuit, determining a plurality of welding points and position parameters of each welding point according to the package structure, and generating a welding path according to the position parameters of each welding point includes:

[0087] Step S201: retrieve the data sheet of the integrated circuit, determine the package structure of the integrated circuit according to the data sheet, and retrieve a standard package model from a package database based on the package structure;

[0088] Step S202: Determine the pinout of the integrated circuit according to the standard packaging model, determine multiple solder joints based on the pinout, and extract the three-dimensional coordinates of each solder joint using an EDA tool;

[0089] Step S203: determining the position parameters of each welding point according to the three-dimensional coordinates of each welding point, and generating multiple welding paths according to the position parameters using a path planning algorithm;

[0090] Step S204: determining welding parameter requirements for each welding path, determining the feasibility of each welding path based on the welding parameter requirements, and selecting the optimal welding path based on the feasibility and preset welding resources.

[0091] The beneficial effects of the above technical solution are: by determining the position parameters of each welding point based on the three-dimensional coordinates, the position parameters of the welding point can be determined more accurately, thereby ensuring the accuracy of position determination. Furthermore, by performing a feasibility evaluation on the generated multiple welding paths, the optimal welding path can be selected based on the welding material consumption, time loss, etc. of each welding path, thereby saving welding time costs and material costs to a certain extent and improving practicality.

[0092] In one embodiment, obtaining the welding process requirement parameters of each welding point and determining the post-weld morphological parameters of each welding point according to the welding process requirement parameters includes:

[0093] Determine the quality of each welding point, determine the optimal welding conditions based on the welding quality, and determine the welding process parameters required for each welding point based on the optimal welding conditions;

[0094] Determine welding time and welding temperature according to welding process requirement parameters, and determine solder strain coverage data of each welding point under high temperature load according to the welding time and welding temperature and the first high temperature deformation parameter of the scalar solder;

[0095] Determine the multi-view point cloud data of each welding point according to the solder strain coverage data, and extract the first morphological description feature of each welding point after welding based on the multi-view point cloud data;

[0096] Evaluate the internal void rate of each solder joint based on the first form description feature, and evaluate whether the first form description feature meets the standard based on the internal void rate of the solder joint;

[0097] If so, determining the post-weld morphological parameters of each weld point based on the first morphological description feature;

[0098] If not, obtain the second morphological description characteristics of each welding spot after welding by reducing the second high-temperature deformation parameters of the solder, repeatedly evaluate the internal void rate of the solder spot on the second morphological description characteristics until the second morphological description characteristics meet the standards, and determine the post-weld morphological parameters of each welding spot based on the second morphological description characteristics.

[0099] The beneficial effects of the above technical solution are: by determining the post-weld morphological parameters of each welding point based on the temperature deformation parameters of the Korean material, the welding coverage can be guaranteed while avoiding the occurrence of welding cracks caused by a large void rate inside the weld, providing the most intuitive and effective post-weld morphological reference parameters, laying a reference foundation for the stability of subsequent welding, and further improving practicality.

[0100] In one embodiment, determining the standard ultrasonic feedback signal parameters of each welding point based on the post-weld morphological parameters of each welding point, and generating welding qualification assessment criteria according to the standard ultrasonic feedback signal parameters, includes:

[0101] Determine the post-weld surface concave-convex state vector of each weld point according to the post-weld morphological parameters of each weld point, and determine the ultrasonic echo feedback amplitude variation parameter and signal feedback delay parameter at each weld point according to the post-weld surface concave-convex state vector;

[0102] Determine the standard ultrasonic feedback signal parameters of each welding point according to the ultrasonic echo feedback amplitude change parameters and the signal feedback delay parameters;

[0103] Extract the key features of the morphological parameters of each welding spot after welding, and determine the correlation mapping relationship between the standard ultrasonic feedback signal parameters of each welding point and the key features of the morphological parameters of the welding spot after welding;

[0104] An evaluation criterion for welding qualification judgment based on ultrasonic feedback for each welding point is generated according to the correlation mapping relationship.

[0105] The beneficial effect of the above technical solution is: by determining the standard ultrasonic feedback signal parameters according to the surface concave-convex state vector of the post-weld morphology, the standard ultrasonic feedback signal can be accurately determined based on the object feedback characteristics of the ultrasonic sensor, thereby ensuring data quality and reference value.

[0106] In one embodiment, controlling the welding robot to perform wire welding on the package structure according to the welding path, detecting the real-time ultrasonic feedback signal of each welding point and adjusting the welding force accordingly, and performing a welding qualification assessment on the welding status of each welding point according to welding qualification assessment criteria include:

[0107] Determining welding control parameters for the welding robot according to the welding path, and controlling the welding robot to perform wire welding on the package structure through the welding control parameters;

[0108] The ultrasonic sensor detects the real-time feedback signal of the welding robot when welding each welding point, determines the signal difference of each welding point according to the real-time feedback signal, and determines the force adjustment direction based on the signal difference, wherein the force adjustment direction includes: increasing the force and decreasing the force;

[0109] Determine the force adjustment difference according to the signal difference, and adjust the welding force based on the force adjustment difference and the force adjustment direction;

[0110] The welding qualification assessment criteria are used to determine the final morphological characteristics after welding based on the real-time ultrasonic feedback signal parameters of each welding point by the welding robot, and the welding status of each welding point is qualified according to the final morphological characteristics.

[0111] The beneficial effects of the above technical solution are: by determining the force adjustment parameters and adjustment direction based on the signal difference, the real-time operating parameters of the welding robot during the welding process can be quickly and reasonably and efficiently adjusted for feedback, thereby ensuring the welding quality and stability. Furthermore, by determining the final morphological characteristics after welding based on the real-time ultrasonic feedback signal parameters of the welding robot for each welding point according to the welding qualification assessment criteria and then making a qualified judgment on the welding status, the evaluation angle can be selected more intuitively and accurately for qualification assessment, thereby improving the assessment accuracy and efficiency.

[0112] In one embodiment, this embodiment also discloses a packaging wire bonding system for an integrated circuit, such as Figure 3 As shown, the system includes:

[0113] A first generating module 301 is configured to obtain a package structure of an integrated circuit, determine a plurality of welding points and position parameters of each welding point according to the package structure, and generate a welding path according to the position parameters of each welding point;

[0114] Determination module 302, for obtaining welding process requirement parameters of each welding point, and determining post-weld morphological parameters of each welding point according to the welding process requirement parameters;

[0115] A second generating module 303 is configured to determine a standard ultrasonic feedback signal parameter for each welding point based on the post-weld morphological parameters of each welding point, and generate welding qualification assessment criteria according to the standard ultrasonic feedback signal parameter;

[0116] The welding force adjustment and welding qualification assessment module 304 is used to control the welding robot to perform wire welding on the package structure according to the welding path, detect the real-time ultrasonic feedback signal of each welding point and adjust the welding force accordingly, and perform qualification assessment on the welding status of each welding point according to the welding qualification assessment criteria.

[0117] The working principle and beneficial effects of the above technical solution have been explained in the method embodiment and will not be repeated here.

[0118] In one embodiment, Figure 4 As shown, the first generating module 301 includes:

[0119] The retrieving submodule 3011 is used to retrieve the data sheet of the integrated circuit, determine the package structure of the integrated circuit according to the data sheet, and retrieve the standard package model from the package database based on the package structure;

[0120] A first extraction submodule 3012 is configured to determine the pinout of the integrated circuit according to a standard packaging model, determine a plurality of solder joints based on the pinout, and extract the three-dimensional coordinates of each solder joint using an EDA tool;

[0121] The first generating submodule 3013 is used to determine the position parameters of each welding point according to the three-dimensional coordinates of each welding point, and generate multiple welding paths according to the position parameters using a path planning algorithm;

[0122] The screening submodule 3014 is used to determine the welding parameter requirements of each welding path, determine the feasibility of each welding path based on the welding parameter requirements, and screen out the best welding path based on the feasibility and preset welding resources.

[0123] In one embodiment, the determining module includes:

[0124] A first determination submodule is configured to determine the quality of each welding point, determine optimal welding conditions based on the welding quality, and determine welding process requirement parameters for each welding point based on the optimal welding conditions;

[0125] A second determination submodule is configured to determine welding time and welding temperature according to welding process requirement parameters, and determine solder strain coverage data of each welding point under high temperature load according to the welding time and welding temperature and a first high temperature deformation parameter of the scalar solder;

[0126] A first extraction submodule is used to determine multi-view point cloud data of each welding point according to the solder strain coverage data, and extract a first morphological description feature of each welding point after welding based on the multi-view point cloud data;

[0127] An evaluation submodule, configured to evaluate the internal void ratio of each solder joint according to the first morphological description feature, and evaluate whether the first morphological description feature meets the standard according to the internal void ratio of the solder joint;

[0128] a third determining submodule, configured to, if yes, determine the post-weld morphological parameters of each welding point according to the first morphological description feature;

[0129] The fourth determination submodule is used to obtain the second morphological description characteristics of each welding spot after welding by reducing the second high-temperature deformation parameters of the solder, repeatedly evaluate the internal void rate of the solder spot on the second morphological description characteristics until the second morphological description characteristics meet the standard, and determine the post-weld morphological parameters of each welding spot according to the second morphological description characteristics.

[0130] In one embodiment, the second generating module includes:

[0131] A fifth determination submodule is configured to determine a post-weld surface concave-convex state vector of each weld point based on the post-weld morphological parameters of each weld point, and determine an ultrasonic echo feedback amplitude variation parameter and a signal feedback delay parameter at each weld point based on the post-weld surface concave-convex state vector;

[0132] a sixth determining submodule, configured to determine a standard ultrasonic feedback signal parameter for each welding point according to the ultrasonic echo feedback amplitude variation parameter and the signal feedback delay parameter;

[0133] a seventh determination submodule, configured to extract key features of the morphological parameters of each welding spot after welding, and determine a correlation mapping relationship between the standard ultrasonic feedback signal parameters of each welding spot and the key features of the morphological parameters of the welding spot after welding;

[0134] The second generation submodule is used to generate, according to the correlation mapping relationship, an evaluation criterion for welding qualification judgment based on ultrasonic feedback for each welding point.

[0135] In one embodiment, the welding force adjustment and welding qualification assessment module includes:

[0136] A control submodule is used to determine welding control parameters for the welding robot according to the welding path, and control the welding robot to perform wire welding on the package structure through the welding control parameters;

[0137] an eighth determination submodule, configured to detect, via an ultrasonic sensor, a real-time feedback signal from the welding robot when welding at each welding point, determine a signal difference at each welding point based on the real-time feedback signal, and determine a force adjustment direction based on the signal difference, wherein the force adjustment direction includes increasing the force and decreasing the force;

[0138] A welding force adjustment submodule is used to determine a force adjustment difference according to the signal difference, and to adjust the welding force based on the force adjustment difference and the force adjustment direction;

[0139] The welding qualification assessment submodule is used to determine the final morphological characteristics after welding based on the real-time ultrasonic feedback signal parameters of each welding point of the welding robot according to the welding qualification assessment criteria, and to perform qualification assessment on the welding status of each welding point according to the final morphological characteristics.

[0140] Those skilled in the art should understand that the first and second in the present invention simply refer to different application stages.

[0141] Other embodiments of the present disclosure will readily occur to those skilled in the art after considering the specification and practicing the disclosure herein. This application is intended to cover any variations, uses, or adaptations of the present disclosure that follow from the general principles of the present disclosure and include common knowledge or customary techniques in the art not disclosed herein. The description and examples are to be considered as exemplary only, with the true scope and spirit of the present disclosure being indicated by the following claims.

[0142] It should be understood that the present disclosure is not limited to the exact structures that have been described above and shown in the drawings, and that various modifications and changes can be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims

1. A method for packaging wire bonding of an integrated circuit, characterized in that: The following steps are involved: Acquire a package structure of the integrated circuit, determine a plurality of welding points and position parameters of each welding point according to the package structure, and generate a welding path according to the position parameters of each welding point; Obtain welding process requirement parameters for each welding point, and determine post-weld morphological parameters of each welding point based on the welding process requirement parameters; Determine the standard ultrasonic feedback signal parameters of each welding point based on the post-weld morphological parameters of each welding point, and generate welding qualification assessment criteria according to the standard ultrasonic feedback signal parameters; Control the welding robot to perform wire bonding on the package structure according to the welding path, detect the real-time ultrasonic feedback signal of each welding point and adjust the welding force accordingly, and conduct qualification assessment on the welding status of each welding point according to the welding qualification assessment criteria; After generating the welding path according to the position parameters of each welding point, it also includes: Determine the welding gun movement trajectory between two adjacent welding points according to the welding path, and analyze the welding gun movement trajectory to determine the kinematic parameters of the welding robot's welding gun fixing arm; According to the kinematic parameters of the welding gun fixed arm, the process posture change parameters of the welding gun fixed arm when welding two adjacent welding points are determined; The motion space parameters of the welding robot's welding gun fixed arm are determined based on the process posture change parameters, and a three-dimensional monitoring space model of the welding gun fixed arm is constructed according to the motion space parameters; Collect the standard motion state parameters of the welding gun fixed arm when welding at two adjacent welding points; Determine the pheromone concentration of the welding gun fixed arm according to standard motion parameters by monitoring the three-dimensional model of the space, wherein the pheromone concentration includes: the movement frequency information concentration of the welding gun fixed arm and the synchronous motion detection information concentration of the welding gun fixed arm and the welding gun; According to the pheromone concentration of the welding gun fixing arm, the welding regularity synchronization factor between two adjacent welding points of the welding gun fixing arm under the welding path is determined; Determine a welding requirement value of a welding sub-path between two adjacent welding points based on a welding regularity synchronization factor, and determine a welding weight of the welding sub-path between the two adjacent welding points according to the welding requirement value; determining a welding energy interval between two adjacent welding points according to the welding weight, and determining welding parameters of a welding subpath between the two adjacent welding points by a preset welding energy-mass ratio based on the welding energy interval; Determine whether the welding sub-path between two adjacent welding points meets the weld quality requirements and weld appearance requirements according to the welding parameters, preset quality indicators and preset image indicators; If so, it is confirmed that the welding sub-path between the two adjacent welding points is designed reasonably. If not, it is confirmed that the welding sub-path between the two adjacent welding points is unreasonable and an adjustment reminder is issued.

2. The integrated circuit packaging wire bonding method according to claim 1, characterized in that: The step of obtaining a package structure of an integrated circuit, determining a plurality of welding points and position parameters of each welding point according to the package structure, and generating a welding path according to the position parameters of each welding point includes: Retrieving a data sheet of the integrated circuit, determining a package structure of the integrated circuit according to the data sheet, and retrieving a standard package model from a package database based on the package structure; Determine the pinout of the integrated circuit according to the standard package model, determine multiple solder joints based on the pinout, and extract the three-dimensional coordinates of each solder joint using EDA tools; Determine the position parameters of each welding point according to the three-dimensional coordinates of each welding point, and generate multiple welding paths through a path planning algorithm based on the position parameters; Determine the welding parameter requirements for each welding path, determine the feasibility of each welding path based on the welding parameter requirements, and screen out the best welding path based on the feasibility and preset welding resources.

3. The integrated circuit packaging wire bonding method according to claim 1, characterized in that: The step of obtaining welding process requirement parameters for each welding point and determining post-weld morphological parameters of each welding point according to the welding process requirement parameters includes: Determine the quality of each welding point, determine the optimal welding conditions based on the welding quality, and determine the welding process parameters required for each welding point based on the optimal welding conditions; Determine welding time and welding temperature according to welding process requirement parameters, and determine solder strain coverage data of each welding point under high temperature load according to the welding time and welding temperature and the first high temperature deformation parameter of the scalar solder; Determine the multi-view point cloud data of each welding point according to the solder strain coverage data, and extract the first morphological description feature of each welding point after welding based on the multi-view point cloud data; Evaluate the internal void rate of each solder joint based on the first form description feature, and evaluate whether the first form description feature meets the standard based on the internal void rate of the solder joint; If so, determining the post-weld morphological parameters of each weld point based on the first morphological description feature; If not, obtain the second morphological description characteristics of each welding spot after welding by reducing the second high-temperature deformation parameters of the solder, repeatedly evaluate the internal void rate of the solder spot on the second morphological description characteristics until the second morphological description characteristics meet the standards, and determine the post-weld morphological parameters of each welding spot based on the second morphological description characteristics.

4. The integrated circuit packaging wire bonding method according to claim 1, wherein: The method of determining the standard ultrasonic feedback signal parameters of each welding point based on the post-weld morphological parameters of each welding point and generating welding qualification assessment criteria according to the standard ultrasonic feedback signal parameters includes: Determine the post-weld surface concave-convex state vector of each weld point according to the post-weld morphological parameters of each weld point, and determine the ultrasonic echo feedback amplitude variation parameter and signal feedback delay parameter at each weld point according to the post-weld surface concave-convex state vector; Determine the standard ultrasonic feedback signal parameters of each welding point according to the ultrasonic echo feedback amplitude change parameters and the signal feedback delay parameters; Extract the key features of the morphological parameters of each welding spot after welding, and determine the correlation mapping relationship between the standard ultrasonic feedback signal parameters of each welding point and the key features of the morphological parameters of the welding spot after welding; An evaluation criterion for welding qualification judgment based on ultrasonic feedback for each welding point is generated according to the correlation mapping relationship.

5. The integrated circuit packaging wire bonding method according to claim 1, characterized in that: The method controls the welding robot to perform wire welding on the package structure according to the welding path, detects the real-time ultrasonic feedback signal of each welding point and adjusts the welding force accordingly, and performs a welding qualification assessment on the welding status of each welding point according to the welding qualification assessment criteria, including: Determining welding control parameters for the welding robot according to the welding path, and controlling the welding robot to perform wire welding on the package structure through the welding control parameters; The ultrasonic sensor detects the real-time feedback signal of the welding robot when welding each welding point, determines the signal difference of each welding point according to the real-time feedback signal, and determines the force adjustment direction based on the signal difference, wherein the force adjustment direction includes: increasing the force and decreasing the force; Determine the force adjustment difference according to the signal difference, and adjust the welding force based on the force adjustment difference and the force adjustment direction; The welding qualification assessment criteria are used to determine the final morphological characteristics after welding based on the real-time ultrasonic feedback signal parameters of each welding point by the welding robot, and the welding status of each welding point is qualified according to the final morphological characteristics.

6. A wire bonding system for integrated circuit packaging, characterized in that: The system includes: A first generating module is configured to obtain a package structure of an integrated circuit, determine a plurality of welding points and position parameters of each welding point according to the package structure, and generate a welding path according to the position parameters of each welding point; A determination module is used to obtain welding process requirement parameters of each welding point and determine the post-weld morphological parameters of each welding point according to the welding process requirement parameters; a second generating module, configured to determine a standard ultrasonic feedback signal parameter of each welding point based on the post-weld morphological parameters of each welding point, and generate welding qualification assessment criteria according to the standard ultrasonic feedback signal parameter; The welding force adjustment and welding qualification assessment module is used to control the welding robot to perform wire welding on the package structure according to the welding path, detect the real-time ultrasonic feedback signal of each welding point and adjust the welding force accordingly, and perform qualification assessment on the welding status of each welding point according to the welding qualification assessment criteria; After generating the welding path according to the position parameters of each welding point, it also includes: Determine the welding gun movement trajectory between two adjacent welding points according to the welding path, and analyze the welding gun movement trajectory to determine the kinematic parameters of the welding robot's welding gun fixing arm; According to the kinematic parameters of the welding gun fixed arm, the process posture change parameters of the welding gun fixed arm when welding two adjacent welding points are determined; The motion space parameters of the welding robot's welding gun fixed arm are determined based on the process posture change parameters, and a three-dimensional monitoring space model of the welding gun fixed arm is constructed according to the motion space parameters; Collect the standard motion state parameters of the welding gun fixed arm when welding at two adjacent welding points; Determine the pheromone concentration of the welding gun fixed arm according to standard motion parameters by monitoring the three-dimensional model of the space, wherein the pheromone concentration includes: the movement frequency information concentration of the welding gun fixed arm and the synchronous motion detection information concentration of the welding gun fixed arm and the welding gun; According to the pheromone concentration of the welding gun fixing arm, the welding regularity synchronization factor between two adjacent welding points of the welding gun fixing arm under the welding path is determined; Determine a welding requirement value of a welding subpath between two adjacent welding points based on a welding regularity synchronization factor, and determine a welding weight of the welding subpath between the two adjacent welding points according to the welding requirement value; determining a welding energy interval between two adjacent welding points according to the welding weight, and determining welding parameters of a welding subpath between the two adjacent welding points by a preset welding energy-mass ratio based on the welding energy interval; Determine whether the welding sub-path between two adjacent welding points meets the weld quality requirements and weld appearance requirements according to the welding parameters, preset quality indicators and preset image indicators; If so, it is confirmed that the welding sub-path between the two adjacent welding points is designed reasonably. If not, it is confirmed that the welding sub-path between the two adjacent welding points is unreasonable and an adjustment reminder is issued.

7. The integrated circuit packaging wire bonding system according to claim 6, wherein: The first generating module includes: A retrieval submodule is used to retrieve a data sheet of the integrated circuit, determine a package structure of the integrated circuit according to the data sheet, and retrieve a standard package model from a package database based on the package structure; A first extraction submodule is configured to determine the pinout of the integrated circuit according to a standard packaging model, determine a plurality of solder joints based on the pinout, and extract the three-dimensional coordinates of each solder joint using an EDA tool; A first generating submodule is used to determine the position parameters of each welding point according to the three-dimensional coordinates of each welding point, and generate multiple welding paths according to the position parameters through a path planning algorithm; The screening submodule is used to determine the welding parameter requirements of each welding path, determine the feasibility of each welding path based on the welding parameter requirements, and screen out the best welding path based on the feasibility and preset welding resources.

8. The integrated circuit packaging wire bonding system according to claim 6, wherein: The determining module includes: A first determination submodule is configured to determine the quality of each welding point, determine optimal welding conditions based on the welding quality, and determine welding process requirement parameters for each welding point based on the optimal welding conditions; A second determination submodule is configured to determine welding time and welding temperature according to welding process requirement parameters, and determine solder strain coverage data of each welding point under high temperature load according to the welding time and welding temperature and a first high temperature deformation parameter of the scalar solder; A first extraction submodule is used to determine multi-view point cloud data of each welding point according to the solder strain coverage data, and extract a first morphological description feature of each welding point after welding based on the multi-view point cloud data; An evaluation submodule, configured to evaluate the internal void ratio of each solder joint according to the first morphological description feature, and evaluate whether the first morphological description feature meets the standard according to the internal void ratio of the solder joint; a third determining submodule, configured to, if yes, determine the post-weld morphological parameters of each welding point according to the first morphological description feature; The fourth determination submodule is used to obtain the second morphological description characteristics of each welding spot after welding by reducing the second high-temperature deformation parameters of the solder, repeatedly evaluate the internal void rate of the solder spot on the second morphological description characteristics until the second morphological description characteristics meet the standard, and determine the post-weld morphological parameters of each welding spot according to the second morphological description characteristics.

9. The integrated circuit packaging wire bonding system according to claim 6, wherein: The second generation module includes: A fifth determination submodule is configured to determine a post-weld surface concave-convex state vector of each weld point based on the post-weld morphological parameters of each weld point, and determine an ultrasonic echo feedback amplitude variation parameter and a signal feedback delay parameter at each weld point based on the post-weld surface concave-convex state vector; a sixth determining submodule, configured to determine a standard ultrasonic feedback signal parameter for each welding point according to the ultrasonic echo feedback amplitude variation parameter and the signal feedback delay parameter; a seventh determination submodule, configured to extract key features of the morphological parameters of each welding spot after welding, and determine a correlation mapping relationship between the standard ultrasonic feedback signal parameters of each welding spot and the key features of the morphological parameters of the welding spot after welding; The second generation submodule is used to generate, according to the correlation mapping relationship, an evaluation criterion for welding qualification judgment based on ultrasonic feedback for each welding point.

10. The integrated circuit packaging wire bonding system according to claim 6, wherein: The welding force adjustment and welding qualification assessment module includes: A control submodule is used to determine welding control parameters for the welding robot according to the welding path, and control the welding robot to perform wire welding on the package structure through the welding control parameters; an eighth determination submodule, configured to detect, via an ultrasonic sensor, a real-time feedback signal from the welding robot when welding at each welding point, determine a signal difference at each welding point based on the real-time feedback signal, and determine a force adjustment direction based on the signal difference, wherein the force adjustment direction includes increasing the force and decreasing the force; A welding force adjustment submodule is used to determine a force adjustment difference according to the signal difference, and to adjust the welding force based on the force adjustment difference and the force adjustment direction; The welding qualification assessment submodule is used to determine the final morphological characteristics after welding based on the real-time ultrasonic feedback signal parameters of each welding point of the welding robot according to the welding qualification assessment criteria, and to perform qualification assessment on the welding status of each welding point according to the final morphological characteristics.

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