Die bonding equipment and method

Abstract

The invention relates to the technical field of semiconductors, in particular to die bonding equipment and a die bonding method, and the die bonding equipment comprises a bearing table, and a feeding device, a discharging device, a mounting device, a glue dipping device, a transfer table device and a die supply device which are mounted in the bearing table; the feeding device and the discharging device are arranged at the two opposite ends of the bearing table in parallel, the surface mounting device is arranged between the discharging end of the feeding device and the feeding end of the discharging device, the glue dipping device is located on one side of the feeding device, and the glue dipping device and the transfer table device are arranged on the two sides of the surface mounting device respectively. The crystal supply device is located on the side, away from the mounting device, of the transfer table device. A movable main binding head assembly, a first binding head assembly and a second binding head assembly are arranged in the bearing table, the main binding head assembly is arranged on one side of the discharging device, the first binding head assembly is arranged on one side of the feeding device, and the second binding head assembly is arranged on one side of the crystal supplying device.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and particularly relates to a die bonding device and method. Background Art

[0002] A die bonder, also known as a chip mounter, is an indispensable device in the integrated circuit packaging process; the work content of the die bonder is to pick up chips from a blue film, transport them to a carrier that has been pre-dispensed with glue, and bond the chips to the substrate. The die bonder can place components at high speed and with high precision to complete a series of key steps such as positioning, alignment, and mounting. With the rapid development of the semiconductor industry, there will be an increasing pursuit of higher working efficiency for die bonding equipment during the chip packaging process.

[0003] However, existing die bonding equipment has certain drawbacks when in use: on the one hand, the layout of each module in the die bonding equipment is relatively scattered and the coherence is low, thus affecting the die bonding efficiency; on the other hand, the die bonding equipment usually can only perform a single soldering or bonding operation, and manual adjustment is required when changing products, which is not only time-consuming and laborious but also prone to introducing errors, thus affecting the die bonding efficiency. Summary of the Invention

[0004] To solve the technical problems of the existing die bonding equipment being bulky and having low die bonding efficiency, the present invention provides a die bonding device and method.

[0005] The technical solution for the present invention to solve the technical problems is to provide a die bonding device, which includes a carrying platform and a loading device, an unloading device, a mounting device, a dipping device, a transfer table device, and a crystal supply device installed inside the carrying platform; the loading device and the unloading device are arranged in parallel at opposite ends of the carrying platform, the mounting device is arranged between the discharging end of the loading device and the feeding end of the unloading device, the dipping device is located on one side of the loading device, and the dipping device and the transfer table device are respectively arranged on both sides of the mounting device, the crystal supply device is located on the side of the transfer table device away from the mounting device; inside the carrying platform, there are movable main binding head components, first binding head components, and second binding head components, the main binding head components are arranged on one side of the unloading device, the first binding head components are arranged on one side of the loading device, and the second binding head components are arranged on one side of the crystal supply device.

[0006] Preferably, the mounting device includes a workbench component and a first linear module; the workbench component can slide in the length direction of the first linear module, so that the workbench component can slide to correspond to the discharging end of the loading device or the feeding end of the unloading device.

[0007] Preferably, the transfer table device includes a transfer table body and a second linear module; the transfer table body can slide in the length direction of the second linear module, so that the transfer table body can slide into the working area of the second tying head assembly or the working area of the main tying head assembly; the second linear module is arranged in parallel with the first linear module.

[0008] Preferably, the die bonding equipment further includes an up-view positioning device installed inside the carrier table, and the up-view positioning device includes a first up-view detector and a second up-view detector; the first up-view detector cooperates with the second tying head assembly, and the first up-view detector is arranged at one end of the second linear module close to the crystal supply device; the second up-view detector cooperates with the main tying head assembly, and the second up-view detector is arranged at the other end of the second linear module.

[0009] Preferably, the carrier table is provided with a first opening and a second opening; the feeding end of the feeding device extends outwards to the outside of the carrier table through the first opening, and the discharging end of the discharging device extends outwards to the outside of the carrier table through the second opening, and the feeding end of the feeding device and the discharging end of the discharging device are distributed at both ends of the carrier table.

[0010] Preferably, the feeding device includes a carrying component, a lifting component and a cylinder blocking component; the carrying component passes through the first opening, the lifting component is arranged on one side of the carrying component close to the mounting device, and the cylinder blocking component is arranged at the bottom of the lifting component.

[0011] Preferably, the first tying head assembly includes a first robotic arm cooperating with the dipping device and a first down-view detector, and the second tying head assembly includes a second robotic arm cooperating with the crystal supply device and a second down-view detector; the detection accuracy of the first down-view detector is lower than that of the second down-view detector.

[0012] Preferably, the die bonding equipment further includes a material table device installed inside the carrier table; the material table device is located between the transfer table device and the discharging device, and the material table cooperates with the main tying head assembly.

[0013] Preferably, the die bonding equipment further includes a nozzle holder device installed inside the carrier table; the nozzle holder device is located between the material table device and the discharging device, the material table device is arranged on one side close to the transfer table device, and the nozzle holder device is arranged on one side close to the feeding end of the discharging device.

[0014] Another technical solution for the present invention to solve the above technical problems is to provide a die bonding method, which is applied to the above die bonding equipment. The die bonding method includes: providing a substrate, the loading device moves the substrate into the working area of the first bonding head assembly, and the first bonding head assembly cooperates with the glue dipping device to perform glue dotting on the substrate; the chip supply device provides chips, and the second bonding head assembly transports the chips to the transfer table device; the loading device moves the substrate onto the mounting device, and the mounting device and the transfer table device respectively move the substrate and the chips to the working area of the main bonding head assembly; the main bonding head assembly mounts the chips on the transfer table device onto the substrate; the unloading device receives the substrate after mounting from the mounting device.

[0015] Compared with the prior art, a die bonding equipment and method provided by the present invention have the following advantages: 1. In the die bonding equipment provided by the embodiments of the present invention, the movable main bonding head assembly, the first bonding head assembly and the second bonding head assembly are independently arranged, ensuring that the main bonding head assembly can achieve high-speed chip mounting, and avoiding the glue dotting and chip picking processes of the other bonding head assemblies from affecting the chip mounting effect of the main bonding head assembly; the first bonding head assembly performs glue dotting on the substrate located on the loading device through the glue dipping device, and the second bonding head assembly picks up the chips through the chip supply device and transports the chips to the transfer table device. The glue dotting and chip picking processes are processed in parallel, improving the overall efficiency of die bonding; and the first bonding head assembly is used for glue dotting on the substrate, and the second bonding head assembly is used for picking and placing chips. Since the main bonding head assembly needs to mount chips and has relatively high precision requirements, separating the working areas of the first bonding head assembly, the second bonding head assembly and the main bonding head assembly requires relatively lower precision for the first bonding head assembly and the second bonding head assembly, playing a role in cost savings.

[0016] It can be understood that the layout inside the carrier table is compact. When the substrate after glue dotting is transported to the mounting area for mounting, the loading device can receive a new substrate to be processed for glue dotting again and wait for the substrate after the previous glue dotting to complete mounting; when the transfer table device transports the chips to the mounting area and the main bonding head assembly takes away the chips, it can receive new chips from the chip supply device again; the glue dotting and chip picking processes in the embodiments of the present invention do not affect each other, and through the design of parallel assembly line, the overall efficiency of the die bonding equipment is further improved.

[0017] 2. In the die bonding equipment provided by the embodiments of the present invention, the workbench assembly can slide in the length direction of the first linear module, so that the workbench assembly can slide to correspond to the discharge end of the loading device or the feed end of the unloading device. Through this layout, the unnecessary time occupied by the substrate during transportation can be saved, and the efficiency of mounting the chips onto the substrate is further improved.

[0018] 3. In the die bonding equipment provided by the embodiments of the present invention, the transfer table device can quickly and stably transfer chips, reduce the waiting time for mounting, and improve production efficiency.

[0019] It can be understood that when the transfer table body slides into the working area of the second bonding head assembly, the second bonding head assembly picks up the chips on the crystal supply device and places them on the transfer table body. When the transfer table body slides into the working area of the main bonding head assembly, the main bonding head assembly picks up the chips on the transfer table body and mounts them on the substrate. Among them, the second linear module is arranged in parallel with the first linear module. While realizing parallel operation, it can reduce the overall volume of the die bonding equipment.

[0020] 4. In the die bonding equipment provided by the embodiments of the present invention, when the second bonding head assembly takes out the chips on the crystal supply device, the first top view detector performs the first calibration on the chips. When the chips move to the mounting area through the transfer table device and the main bonding head assembly picks up the chips on the transfer table device, the second top view detector performs the second calibration on the chips. The first top view detector and the second top view detector can identify the bottom of the chips. Through two calibrations, the accuracy of chip mounting can be greatly improved, ensuring that the main bonding head assembly realizes high-precision mounting of the chips. And through multiple calibrations, it is possible to avoid selecting top view detectors with high precision, thereby reducing the cost of the die bonding equipment.

[0021] 5. In the die bonding equipment provided by the embodiments of the present invention, the relative two ends of the carrier table are provided with a first opening and a second opening. The feeding end of the loading device and the discharging end of the unloading device respectively extend outwards to the outside of the carrier table through the first opening and the second opening. Through this design, a device for transferring the substrate to be processed and taking away the finished substrate after mounting can be externally connected at both ends respectively. By incorporating the die bonding equipment into the corresponding production line, it is beneficial to both the assembly of the production line and the dynamic adjustment of the production line.

[0022] 6. In the die bonding equipment provided by the embodiments of the present invention, the carrier assembly allows the substrate to be processed to move through. The lifting assembly can lift the substrate and move the substrate to the mounting device. The cylinder blocking assembly can control the lifting action of the lifting assembly.

[0023] 7. In the die bonding equipment provided by the embodiments of the present invention, the first robotic arm dips glue from the glue dipping device and then performs glue dotting operation on the substrate through the first bottom view detector. The second robotic arm picks up the chips from the crystal supply device through the second bottom view detector and then places them on the transfer table device. By setting two bottom view detectors to realize the separate operations of the first bonding head assembly for glue dipping and dotting and the second bonding head assembly for picking up and placing chips, the corresponding bottom view detectors can be adaptively configured according to the detection accuracy required in the actual operation of different processes. While reducing the cost, the detection efficiency can be improved.

[0024] 8. In the die bonding equipment provided by the embodiments of the present invention, different types of chips transported by the transfer table device can be placed on the material stage device to achieve multi-chip mounting; when the second bonding head assembly picks up a chip from the crystal supply device and places it on the transfer table device, the main bonding head assembly can pick up the chip on the material stage device for mounting to improve the mounting efficiency.

[0025] 9. In the die bonding equipment provided by the embodiments of the present invention, the replacement of various different types of suction nozzles can be achieved by setting up the suction nozzle holder device.

[0026] 10. The embodiments of the present invention further provide a die bonding method, which is applied to the above-mentioned die bonding equipment. The die bonding method includes: providing a substrate, and the loading device moves the substrate into the working area of the first bonding head assembly. The first bonding head assembly cooperates with the glue dipping device to perform dotting glue treatment on the substrate; the crystal supply device provides chips, and the second bonding head assembly transports the chips to the transfer table device; the loading device moves the substrate onto the mounting device, and the mounting device and the transfer table device respectively move the substrate and the chips into the working area of the main bonding head assembly; the main bonding head assembly mounts the chips on the transfer table device onto the substrate; the unloading device receives the substrate after the mounting is completed from the mounting device.

[0027] It should be noted that this die bonding method has the same beneficial effects as the above-mentioned die bonding equipment, and will not be elaborated here. Description of the Drawings

[0028] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0029] Figure 1 is the overall framework schematic diagram of the die bonding equipment according to the embodiments of the present invention Figure 1 .

[0030] Figure 2 is the overall framework schematic diagram of the die bonding equipment according to the embodiments of the present invention Figure 2 .

[0031] Figure 3 is the structural schematic diagram of the mounting device of the die bonding equipment according to the embodiments of the present invention.

[0032] Figure 4 is the structural schematic diagram of the transfer table device of the die bonding equipment according to the embodiments of the present invention.

[0033] Figure 5 is the overall framework schematic diagram of the die bonding equipment according to the embodiments of the present invention Figure 3 .

[0034] Figure 6 It is a schematic diagram of the frame of the upward vision positioning device of the die bonding equipment according to an embodiment of the present invention.

[0035] Figure 7 It is a schematic structural diagram of the feeding device of the die bonding equipment according to an embodiment of the present invention.

[0036] Figure 8 It is a schematic diagram of the frame of the first bonding head assembly in the die bonding equipment according to an embodiment of the present invention.

[0037] Figure 9 It is a schematic diagram of the frame of the second bonding head assembly in the die bonding equipment according to an embodiment of the present invention.

[0038] Figure 10 It is a schematic structural diagram of the material table device of the die bonding equipment according to an embodiment of the present invention.

[0039] Figure 11 It is a schematic structural diagram of the nozzle holder device of the die bonding equipment according to an embodiment of the present invention.

[0040] Figure 12 It is a schematic flow diagram of the die bonding method according to an embodiment of the present invention.

[0041] Description of the reference numerals in the drawings: 100, die bonding equipment; 1, carrier table; 11, main bonding head assembly; 12, first bonding head assembly; 121, first robotic arm; 122, first downward vision detector; 13, second bonding head assembly; 131, second robotic arm; 132, second downward vision detector; 14, first opening; 15, second opening; 2, feeding device; 21, carrying assembly; 22, lifting assembly; 23, cylinder blocking assembly; 3, discharging device; 4, mounting device; 41, workbench assembly; 42, first linear module; 43, first drag chain; 5, dipping glue device; 6, turntable device; 61, turntable body; 62, second linear module; 63, second drag chain; 7, crystal supply device; 8, upward vision positioning device; 81, first upward vision detector; 82, second upward vision detector; 9, material table device; 91, material table body; 92, first support column; 93, first base; 10, nozzle holder device; 101, nozzle holder body; 1010, receiving groove; 102, second support column; 103, second base. Detailed implementation manners

[0042] In order to make the objectives, technical solutions and advantages of the present invention clearer and more understandable, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0043] It should be noted that when an element is referred to as "fixed to" another element, it can be directly on the other element or there may also be an intermediate element. When an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intermediate element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0044] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention are used to distinguish different objects, rather than to describe a specific order.

[0045] In the present invention, the orientation or positional relationship indicated by the terms "upper", "lower", "left", "right", "front", "rear", "top", "bottom", "inner", "outer", "middle", "vertical", "horizontal", "lateral", "longitudinal", etc. is based on the orientation or positional relationship shown in the drawings. These terms are mainly used to better describe the present invention and its embodiments, and are not used to limit that the indicated devices, elements or components must have a specific orientation, or be constructed and operated in a specific orientation.

[0046] Moreover, in addition to being able to represent an orientation or positional relationship, some of the above terms may also be used to represent other meanings. For example, the term "upper" may also be used to represent a certain attachment relationship or connection relationship in some cases. For those of ordinary skill in the art, the specific meanings of these terms in the present invention can be understood according to specific circumstances.

[0047] In addition, the terms "mount", "set", "provided with", "connected", "coupled" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, or there can also be internal communication between two devices, elements or components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0048] Please refer to Figure 1, an embodiment of the present invention provides a die bonding device 100. The die bonding device 100 includes a carrier table 1, and a loading device 2, an unloading device 3, a mounting device 4, a glue dipping device 5, a transfer table device 6, and a crystal supply device 7 installed inside the carrier table 1; the loading device 2 and the unloading device 3 are arranged in parallel at opposite ends of the carrier table 1, the mounting device 4 is arranged between the discharge end of the loading device 2 and the feed end of the unloading device 3, the glue dipping device 5 is located on one side of the loading device 2, and the glue dipping device 5 and the transfer table device 6 are respectively arranged on both sides of the mounting device 4, the crystal supply device 7 is located on the side of the transfer table device 6 away from the mounting device 4; inside the carrier table 1, there are movable main bonding head assemblies 11, first bonding head assemblies 12, and second bonding head assemblies 13. The main bonding head assembly 11 is arranged on one side of the unloading device 3, the first bonding head assembly 12 is arranged on one side of the loading device 2, and the second bonding head assembly 13 is arranged on one side of the crystal supply device 7.

[0049] The die bonding device 100 provided by the embodiment of the present invention can be used in the semiconductor industry to bond chips to a substrate after dispensing to realize the application of the glue process; the die bonding device 100 can place components at high speed to complete a series of key steps such as positioning, alignment, and mounting. It is an indispensable device in the integrated circuit packaging process and also the most important link in semiconductor packaging.

[0050] It should be noted that the movable main bonding head assembly 11, the first bonding head assembly 12, and the second bonding head assembly 13 are independently arranged, which can ensure that the main bonding head assembly 11 realizes the high-speed mounting of chips and avoid the glue dipping, dispensing, and chip taking processes of the other bonding heads from affecting the mounting effect of the main bonding head assembly 11 on the chips.

[0051] Furthermore, the first bonding head assembly 12 dispenses glue to the substrate located on the loading device 2 through the glue dipping device 5, and the second bonding head assembly 13 picks up the chips through the crystal supply device 7 and transports the chips to the transfer table device 6. The processes of glue dipping, dispensing, and chip taking are processed in parallel, improving the overall efficiency of die bonding.

[0052] In the die bonding device 100 of the embodiment of the present invention, the first bonding head assembly 12, the second bonding head assembly 13, and the main bonding head assembly 11 are separated and arranged in different areas. The working areas between the main bonding head assembly 11, the first bonding head assembly 12, and the second bonding head assembly 13 do not overlap. Through this design, on the one hand, it can avoid the mutual influence between the bonding head assemblies during work and improve the overall efficiency of die bonding.

[0053] On the other hand, the first bonding head assembly 12 is used for dispensing glue on the substrate, and the second bonding head assembly 13 is used for picking and placing chips. Since the main bonding head assembly has relatively high precision requirements for chip mounting, the working areas of the first bonding head assembly 12, the second bonding head assembly 13 and the main bonding head assembly 11 are separated. The precision requirements for the first bonding head assembly 12 and the second bonding head assembly 13 are relatively low, which also plays a role in cost saving on the premise that the precision of the main bonding head assembly 11 is guaranteed.

[0054] It can be understood that the layout inside the carrier 1 is compact. The carrier 1 is used to install and fix the loading device 2, the unloading device 3, the mounting device 4, the glue dipping device 5, the transfer table device 6, the crystal supply device 7, and the movable main bonding head assembly 11, the first bonding head assembly 12 and the second bonding head assembly 13. Among them, the mounting device 4 of this embodiment is arranged in parallel with the transfer table device 6.

[0055] Specifically, Figure 2 shows the movement ranges of the first bonding head assembly 12, the second bonding head assembly 13 and the main bonding head assembly 11; the first bonding head assembly 12 is arranged on one side close to the loading device 2 and the glue dipping device 5. When the substrate is located at the loading device 2, the first bonding head assembly 12 dips glue from the glue dipping device 5 and coats it on the substrate; the second bonding head assembly 13 is arranged on one side close to the crystal supply device 7 and the transfer table device 6. When the chip is located at the crystal supply device 7, the second bonding head assembly 13 picks up the chip and places it on the transfer table device 6, and the transfer table device 6 transports the chip to the mounting area; the main bonding head assembly 11 is arranged on one side close to the mounting device 4 and the unloading device 3. The substrate after glue dispensing moves to the mounting device 4 through the discharge end of the loading device 2, and the mounting device 4 also transports the substrate to the mounting area. The main bonding head assembly 11 picks up the chip on the transfer table device 6 and bonds it to the substrate to complete the mounting step.

[0056] Furthermore, it should be noted that inside the carrier 1, when the substrate after glue dispensing is transported to the mounting area for mounting, the loading device 2 can receive a new substrate to be processed for glue dispensing again and wait for the previous substrate after glue dispensing to complete the mounting; after the transfer table device 6 transports the chip to the mounting area and the main bonding head assembly 11 takes away the chip, it can receive a new chip from the crystal supply device 7 again.

[0057] The processes of glue dipping, glue dispensing and chip picking in the embodiment of the present invention do not affect each other. Through the design of parallel pipeline, the overall efficiency of the die bonding equipment 100 is further improved to solve the technical problems of the existing die bonding equipment being bulky and having low die bonding efficiency.

[0058] Please refer to Figure 1 and Figure 3, the mounting device 4 includes a workbench assembly 41, a first linear module 42, and a first drag chain 43; the workbench assembly 41 can slide in the length direction of the first linear module 42, so that the workbench assembly 41 can slide to correspond to the discharge end of the feeding device 2 or the feeding end of the discharging device 3, and the first drag chain 43 is arranged on the side of the first linear module 42.

[0059] Specifically, when the workbench assembly 41 slides to correspond to the discharge end of the feeding device 2, the workbench assembly 41 can receive the substrate after the dispensing process from the feeding device 2; when the first linear module 42 operates, it can drive the workbench assembly 41 to slide to correspond to the feeding end of the discharging device 3. After the main bonding head assembly 11 completes the mounting operation, the discharging device 3 receives the chip after the mounting process.

[0060] It can be understood that the workbench assembly 41 can slide relative to the first linear module 42. The first linear module 42 serves as the center, and its two ends respectively correspond to the discharge end of the feeding device 2 and the feeding end of the discharging device 3. Through this layout, the unnecessary time occupied by the substrate during transportation can be saved, and the efficiency of mounting the chip onto the substrate can be further improved.

[0061] During the operation of the first linear module 42, cables and pipelines are required for connection to transmit power and data. In the embodiment of the present invention, the cables and pipelines of the first linear module 42 are fixed in the first drag chain 43. It can be understood that the drag chain can orderly wrap these cables and pipelines to play a protective role, preventing the cables and pipelines from being pulled, damaged, or exposed to the external environment during the movement of the first linear module 42, causing safety hazards.

[0062] It should be noted that using the drag chain can significantly improve the running stability of the first linear module 42. By fixing the cables and pipelines in the first drag chain 43, the interference and resistance that may be generated during their movement can also be reduced, so that the movement of the first linear module 42 is more stable and reliable.

[0063] The first linear module 42 in the embodiment of the present invention is a key component of the automated equipment, and its performance will directly affect the running efficiency and stability of the entire die bonding equipment 100; by using the first linear module 42 in combination with the first drag chain 43, not only can the cables and pipelines be protected, but also foreign objects can be blocked from entering to improve the safety of the die bonding equipment 100, extend the service life of the first linear module 42. In addition, it can also reduce energy loss and improve the overall performance of the die bonding equipment 100.

[0064] Please refer to Figure 2 、 Figure 3 and Figure 4, the transfer table device 6 includes a transfer table body 61, a second linear module 62, and a second cable chain 63; the transfer table body 61 can slide in the length direction of the second linear module 62, so that the transfer table body 61 can slide into the working area of the second tying head assembly 13 or the working area of the main tying head assembly 11; the second linear module 62 is arranged in parallel with the first linear module 42, and the second cable chain 63 is arranged on the side of the second linear module 62.

[0065] It should be noted that in the transfer table device 6 of the embodiment of the present invention, a vacuum adsorption hole is provided on the transfer table body 61 for fixing the chip when the second tying head assembly 13 picks up and places the chip on the transfer table body 61. The die bonding equipment 100 can quickly and stably transfer the chip by using the transfer table device 6, reduce the waiting time for mounting, and improve the production efficiency.

[0066] Specifically, when the transfer table body 61 slides into the working area of the second tying head assembly 13, the transfer table body 61 can receive the chips from the crystal supply device 7; when the second linear module 62 operates, it can drive the transfer table body 61 to slide into the working area of the main tying head assembly 11, and the main tying head assembly 11 picks up the chips on the transfer table body 61 for mounting.

[0067] It can be understood that when the transfer table body 61 slides into the working area of the second tying head assembly 13, the second tying head assembly 13 picks up the chips on the crystal supply device 7 and places them on the transfer table body 61. When the transfer table body 61 slides into the working area of the main tying head assembly 11, the main tying head assembly 11 picks up the chips on the transfer table body 61 and mounts them on the substrate; the second linear module 62 is arranged in parallel with the first linear module 42. While realizing parallel operation to improve the overall working efficiency, it can reduce the overall volume of the die bonding equipment 100.

[0068] Similar to the first linear module 42, during the operation of the second linear module 62, cables and pipelines are also required for connection to transmit power and data. In the embodiment of the present invention, the cables and pipelines of the second linear module 62 are also fixed in the second cable chain 63. By setting the second cable chain 63, the cables and pipelines of the second linear module 62 can be protected, the operation stability of the second linear module 62 can be significantly improved, and the service life of the second linear module 62 can be extended. The beneficial effects are the same as those achieved by the cooperation of the first linear module 42 and the first cable chain 43, and will not be elaborated here.

[0069] Drag chains are widely used in various automated devices and play an indispensable role in technical fields such as industrial robots, numerical control equipment, and automated production lines. The drag chain can not only protect the safe operation of the circuit but also improve the reliability and service life of the automated device; by reasonably selecting the material and installation method of the drag chain, the needs of different automated devices can be met, and the efficiency and safety of the entire mechanical system can be improved.

[0070] Please refer to Figure 4 、 Figure 5 and Figure 6 For the die bonding equipment 100, it further includes an upward vision positioning device 8 installed inside the carrier 1. The upward vision positioning device 8 includes a first upward vision detector 81 and a second upward vision detector 82.

[0071] Among them, the first upward vision detector 81 cooperates with the second bonding head assembly 13, and the first upward vision detector 81 is arranged at one end of the second linear module 62 close to the crystal supply device 7; the second upward vision detector 82 cooperates with the main bonding head assembly 11, and the second upward vision detector 82 is arranged at the other end of the second linear module 62.

[0072] It can be understood that when the second bonding head assembly 13 takes out the chip on the crystal supply device 7, the first upward vision detector 81 performs the first calibration on the chip; when the chip moves to the mounting area through the transfer table device 6 and the main bonding head assembly 11 picks up the chip on the transfer table device 6, the second upward vision detector 82 performs the second calibration on the chip.

[0073] It should be noted that the first upward vision detector 81 and the second upward vision detector 82 can identify the bottom of the chip. Through two calibrations, the accuracy of chip mounting can be greatly improved, ensuring that the main bonding head assembly 11 can achieve high-precision mounting of the chip. And through multiple calibrations, it is possible to avoid using upward vision detectors with higher precision, thereby reducing the cost of the die bonding equipment 100.

[0074] In some embodiments, the upward vision detector is an upward vision CCD (Charge Coupled Device). A CCD is a semiconductor device that can convert an optical image into a digital signal to realize operations such as image acquisition, storage, and transmission processing.

[0075] Please refer to Figure 5 As shown in, the carrier 1 is provided with a first opening 14 and a second opening 15; the feeding end of the feeding device 2 extends outwards through the first opening 14 to the outside of the carrier 1, and the discharging end of the discharging device 3 extends outwards through the second opening 15 to the outside of the carrier 1, and the feeding end of the feeding device 2 and the discharging end of the discharging device 3 are distributed at both ends of the carrier 1.

[0076] Understandably, the opposite ends of the carrier table 1 are provided with a first opening 14 and a second opening 15. The feeding end of the loading device 2 and the discharging end of the unloading device 3 respectively extend and expose to the outside of the carrier table 1 through the first opening 14 and the second opening 15. Through this design, devices for transporting the substrate to be processed and removing the finished substrate after chip mounting can be externally connected at both ends respectively.

[0077] It should be noted that by incorporating the die bonding equipment 100 into the corresponding production line, it is beneficial to both the assembly of the production line and the dynamic adjustment of the production line.

[0078] In an embodiment of the present invention, the first opening 14 and the second opening 15 are respectively located at the opposite ends of the carrier table 1, and the first opening 14 and the second opening 15 are arranged staggeredly to stagger the loading device 2 and the unloading device 3, which is adapted to the independent layout among the main bonding head assembly 11, the first bonding head assembly 12, and the second bonding head assembly 13, making the layout inside the carrier table 1 more compact and having higher coherence, and further improving the efficiency of the die bonding process.

[0079] Please refer to Figure 5 and Figure 7 , the loading device 2 includes a carrying component 21, a lifting component 22, and a cylinder blocking component 23; it can be understood that the carrying component 21 is used to place the substrate. The first bonding head assembly 12 dips glue in the gluing device 5 and coats the glue on the substrate on the carrying component 21. The carrying component 21 can also allow the substrate after dispensing to move through. The lifting component 22 can lift the substrate and move the substrate to the chip mounting device 4, and the lifting action of the lifting component 22 can be controlled through the cylinder blocking component 23.

[0080] Furthermore, the carrying component 21 passes through the first opening 14, the lifting component 22 is arranged on one side of the carrying component 21 close to the chip mounting device 4, and the cylinder blocking component 23 is arranged at the bottom of the lifting component 22.

[0081] It should be noted that the two ends of the carrying component 21 are respectively the feeding end and the discharging end of the loading device 2. Among them, the discharging end of the loading device 2 corresponds to the side of the carrying component 21 close to the chip mounting device 4. When there is a substrate on the feeding end of the loading device 2, the carrying component 21 can transport the substrate, and during the transportation process, it moves through the first opening 14 to the inside of the carrier table 1.

[0082] In some embodiments, the cylinder blocking component 23 is arranged at the bottom of the lifting component 22 and cooperates with the lifting component 22 to lift and move the substrate to the chip mounting device 4; the cylinder blocking component 23 can be driven by air pressure to control or prevent the movement of an object. Its main function in the embodiment of the present invention is to ensure that the substrate can accurately stop at a predetermined position to prevent its continuous movement from affecting the steps of the chip mounting process.

[0083] Understandably, the cylinder blocking assembly 23 is a device widely used in automated production lines and mechanical equipment. Its working principle is as follows: When compressed air flows into the upper part of the cylinder through the control valve, it will push the piston downward, thereby causing the shift lever to descend, and thus releasing the tooling plate (i.e., the substrate in the embodiments of the present invention) that was previously blocked; conversely, when the control valve releases gas, the piston will return to its original position under the elastic force of the spring and be ready to block the next tooling plate (i.e., after moving the previous substrate to the mounting device 4, it is ready to block the new substrate) to ensure that the substrates placed on the loading device 2 in this embodiment can be controlled in sequence and accurately.

[0084] Please refer to Figure 5 、 Figure 8 and Figure 9 , the first tying head assembly 12 includes a first robotic arm 121 cooperating with the glue dipping device 5 and a first downward vision detector 122, and the second tying head assembly 13 includes a second robotic arm 131 cooperating with the crystal supply device 7 and a second downward vision detector 132.

[0085] Understandably, the first robotic arm 121 dips glue from the glue dipping device 5 and then performs a glue dotting operation on the substrate through the first downward vision detector 122. The second robotic arm 131 picks up the chip from the crystal supply device 7 through the second downward vision detector 132 and then places it on the transfer table device 6.

[0086] In some embodiments, the first downward vision detector 122 is connected to the first robotic arm 121, or the first downward vision detector 122 is relatively stationary with respect to the first robotic arm 121, that is, the first downward vision detector 122 also moves along with the first robotic arm 121 during the movement of the first robotic arm 121; after the first robotic arm 121 dips glue from the glue dipping device 5, it moves above the substrate, and the first downward vision detector 122 identifies the glue dotting position on the substrate. After the first robotic arm 121 is adjusted to the glue dotting position, it performs a glue dotting operation on the substrate.

[0087] In some embodiments, the second downward vision detector 132 is connected to the second robotic arm 131, or the second downward vision detector 132 is relatively stationary with respect to the second robotic arm 131; when the second robotic arm 131 is about to pick up the chip from the crystal supply device 7, the second downward vision detector 132 identifies the adsorption position where the second robotic arm 131 picks up the chip on the crystal supply device 7. After the second robotic arm 131 is adjusted to the adsorption position, it picks up the chip and places it on the transfer table device 6.

[0088] It should be noted that the first tying head assembly 12 and the second tying head assembly 13 in the embodiments of the present invention are independent of each other, and the separate operations of glue dipping and dotting, and chip picking and placing are realized by respectively setting the first downward vision detector 122 and the second downward vision detector 132.

[0089] In this embodiment, the detection accuracy of the first downward-looking detector 122 is lower than that of the second downward-looking detector 132. It can be understood that the downward-looking detector can be adaptively configured according to the detection accuracy required in the actual operation of different processes, so as to avoid using a high-precision downward-looking detector to identify the processes of dip gluing and dispensing, and picking and placing chips with relatively low accuracy requirements, which can improve the detection efficiency while reducing costs.

[0090] Please refer to Figure 5 , Figure 10 and Figure 11 , as an alternative embodiment, the die bonding equipment 100 further includes a material table device 9 installed inside the carrier 1; the material table device 9 is located between the transfer table device 6 and the blanking device 3, and the material table cooperates with the main bonding head assembly 11.

[0091] In some embodiments, the material table device 9 includes a material table body 91, a first support column 92 and a first base 93. The first base 93 is fixedly installed on the carrier 1, and the material table body 91 is supported by the first support column 92. It can be understood that different types of chips transported by the transfer table device 6 can be placed on the material table body 91 of the material table device 9 to achieve multi-chip mounting.

[0092] It should be noted that when the second bonding head assembly 13 picks up the chip from the crystal supply device 7 and places it on the transfer table device 6, the main bonding head assembly 11 can pick up the chip on the material table device 9 for mounting, so as to improve the mounting efficiency of the chip on the substrate.

[0093] As another alternative embodiment, the die bonding equipment 100 further includes a nozzle holder device 10 installed inside the carrier 1; the nozzle holder device 10 is located between the material table device 9 and the blanking device 3, the material table device 9 is arranged on the side close to the transfer table device 6, and the nozzle holder device 10 is arranged on the side close to the feeding end of the blanking device 3.

[0094] In some embodiments, the nozzle holder device 10 includes a nozzle holder body 101, a second support column 102 and a second base 103. The second base 103 is fixedly installed on the carrier 1, and the nozzle holder body 101 is supported by the second support column 102. A receiving groove 1010 for receiving vacuum nozzles of different sizes is provided on the nozzle holder body 101. It can be understood that the nozzle holder device 10 is a device with replaceable vacuum nozzles. The working end of the main bonding head assembly 11 can be detachably connected to vacuum nozzles of different sizes, and the main bonding head assembly 11 can replace the vacuum nozzles through the nozzle holder device 10 either automatically or manually by workers, which can be set according to the actual situation. The embodiments of the present invention can meet the compatibility requirements for replacing vacuum nozzles of different sizes by setting the nozzle holder device 10.

[0095] Please refer toFigure 12 , embodiments of the present invention further provide a die bonding method, which is applied to the above die bonding equipment, and the die bonding method includes: S1: Provide a substrate, the loading device moves the substrate into the working area of the first bonding head assembly, and the first bonding head assembly cooperates with the glue dipping device to perform glue dotting treatment on the substrate; S2: The crystal supply device provides chips, and the second bonding head assembly transports the chips to the transfer table device; S3: The loading device moves the substrate to the mounting device, and the mounting device and the transfer table device respectively move the substrate and the chips to the working area of the main bonding head assembly; S4: The main bonding head assembly mounts the chips on the transfer table device onto the substrate; S5: The unloading device receives the substrate after mounting from the mounting device.

[0096] It can be understood that the die bonding equipment provided by the embodiments of the present invention integrates processes such as glue dipping, dotting, and mounting required for chip mounting, realizing a pipeline-type mounting process from loading, glue dipping, chip picking, mounting to unloading, and improving the mounting efficiency.

[0097] In this embodiment, the main bonding head assembly, the first bonding head assembly, and the second bonding head assembly are independently arranged to split the processes required for chip mounting, so that the die bonding equipment can perform parallel processes in different areas, greatly improving the working efficiency.

[0098] Specifically, in step S1, the first bonding head assembly is arranged on one side close to the loading device and the glue dipping device. When the substrate is located on the loading device, the loading device moves the substrate into the working area of the first bonding head assembly, and the first bonding head assembly dips glue from the glue dipping device and coats it on the substrate.

[0099] Further, in step S2, the second bonding head assembly is arranged on one side close to the crystal supply device and the transfer table device. When the chips are located on the crystal supply device, the second bonding head assembly picks up the chips and places them on the transfer table device.

[0100] In steps S3 and S4, the main bonding head assembly is arranged on one side close to the mounting device and the unloading device. The substrate after glue dotting treatment moves to the mounting device through the discharge end of the loading device, and the mounting device also transports the substrate to the mounting area. The mounting area in the embodiments of the present invention is also the working area of the main bonding head assembly. The main bonding head assembly picks up the chips on the transfer table device and bonds them to the substrate to complete the mounting step.

[0101] It should be noted that the die bonding method provided by the embodiments of the present invention has the same beneficial effects as the above-mentioned die bonding equipment. When the substrate after dispensing is transported to the working area of the main bonding head assembly for mounting, the feeding device can receive a new substrate to be processed for dispensing again and wait for the substrate after the previous dispensing to complete the mounting; when the transfer table device transports the chip to the mounting area and the main bonding head assembly takes away the chip, it can receive a new chip from the crystal supply device again; the dispensing and chip taking processes in the embodiments of the present invention do not affect each other, and through the design of parallel assembly line, the overall efficiency is further improved.

[0102] Among them, in the mounting process of step S4, the main bonding head assembly picks up the chip on the transfer table device in its working area and mounts the chip on the substrate. By setting three bonding head assemblies that can move independently, it is ensured that the main bonding head assembly can achieve high-speed mounting of the chip.

[0103] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements, and improvements made within the principles of the present invention shall be included within the protection scope of the present invention.

Claims

1. A die bonding device, characterized in that: The die bonding equipment includes a carrier platform and a loading device, a unloading device, a mounting device, a glue dipping device, a transfer table device and a die supply device installed inside the carrier platform; The loading device and the unloading device are arranged parallel to each other at opposite ends of the carrying platform, the mounting device is arranged between the discharging end of the loading device and the feeding end of the unloading device, the glue dipping device is located on one side of the loading device, and the glue dipping device and the transfer table device are respectively arranged on both sides of the mounting device, and the crystal supply device is located on the side of the transfer table device away from the mounting device; A movable main head-binding assembly, a first head-binding assembly and a second head-binding assembly are provided inside the supporting platform. The main head-binding assembly is arranged on one side of the unloading device, the first head-binding assembly is arranged on one side of the loading device, and the second head-binding assembly is arranged on one side of the crystal supply device.

2. The die bonding device according to claim 1, characterized in that: The mounting device comprises a workbench assembly and a first linear module; The workbench assembly can slide in the length direction of the first linear module, so that the workbench assembly can slide to correspond to the discharge end of the loading device or the feed end of the unloading device.

3. The die bonding device according to claim 2, characterized in that: The transfer table device includes a transfer table body and a second linear module; The transfer table body can slide in the length direction of the second linear module, so that the transfer table body can slide into the working area of ​​the second head binding assembly or the working area of ​​the main head binding assembly; the second linear module is arranged parallel to the first linear module.

4. The die bonding device according to claim 3, characterized in that: The die bonding device further comprises an upward-looking positioning device installed inside the carrier, wherein the upward-looking positioning device comprises a first upward-looking detector and a second upward-looking detector; The first upward-view detector cooperates with the second binding head assembly, and the first upward-view detector is arranged at one end of the second linear module close to the crystal supply device; The second upward-looking detector cooperates with the main binding head assembly, and the second upward-looking detector is arranged at the other end of the second linear module.

5. The die bonding device according to claim 1, characterized in that: The bearing platform is provided with a first opening and a second opening; The feed end of the loading device extends through the first opening to be exposed to the outside of the supporting platform, and the discharge end of the unloading device extends through the second opening to be exposed to the outside of the supporting platform, and the feed end of the loading device and the discharge end of the unloading device are distributed at both ends of the supporting platform.

6. The die bonding device according to claim 5, characterized in that: The feeding device comprises a bearing assembly, a lifting assembly and a cylinder blocking assembly; The bearing assembly is passed through the first opening, the lifting assembly is arranged on a side of the bearing assembly close to the mounting device, and the cylinder blocking assembly is arranged at the bottom of the lifting assembly.

7. The die bonding device according to claim 1, characterized in that: The first head binding assembly includes a first mechanical arm and a first downward-looking detector that cooperate with the glue dipping device, and the second head binding assembly includes a second mechanical arm and a second downward-looking detector that cooperate with the crystal supply device; The detection accuracy of the first downward-looking detector is lower than the detection accuracy of the second downward-looking detector.

8. The die bonding device according to claim 1, characterized in that: The die bonding equipment further includes a material table device installed inside the carrier table; The material table device is located between the transfer table device and the unloading device, and the material table cooperates with the main binding head assembly.

9. The die bonding device according to claim 8, characterized in that: The die bonding equipment further comprises a nozzle holder device installed inside the carrier platform; The suction nozzle holder device is located between the material table device and the unloading device. The material table device is arranged on a side close to the transfer table device, and the suction nozzle holder device is arranged on a side close to the feeding end of the unloading device.

10. A die bonding method, applied to the die bonding device according to any one of claims 1 to 9, characterized in that: The die bonding method comprises: Providing a substrate, the loading device moves the substrate into the working area of ​​the first head binding assembly, and the first head binding assembly cooperates with the glue dipping device to perform glue dispensing on the substrate; The wafer supply device provides chips, and the second binding head assembly transports the chips to the transfer table device; The loading device moves the substrate to the mounting device, and the mounting device and the transfer table device respectively move the substrate and the chip to the working area of ​​the main binding head assembly; The main head assembly mounts the chip on the transfer table device to the substrate; The unloading device receives the substrate after mounting from the mounting device.

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