Die bonding equipment and die bonding method

Abstract

The invention relates to the technical field of semiconductor die bonding equipment, in particular to die bonding equipment and a die bonding method. According to the die bonding equipment, a track module comprises a first track and a second track, the second track is arranged in the connecting line direction of a feeding module and a discharging module, and the first track is arranged between the feeding module and the second track and extends downwards in the width direction of the first track; the dispensing module comprises a first dispensing mechanism and a second dispensing mechanism. The first dispensing mechanism is arranged at the end, away from the second track, of the first track. The crystal supply module and the transfer table module are located on the side face, close to the first dispensing mechanism, of the second track and correspond to the dispensing module; and the mounting binding head module is arranged above the second track, and a second visual detector and a second dispensing mechanism are arranged on the mounting binding head module. The die bonding equipment can realize two working modes of first dispensing and then identification and first identification and then dispensing, is suitable for mounting of different types of chips, and has higher applicability.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor die bonding equipment, and in particular to a die bonding equipment and a die bonding method. Background Art

[0002] Die bonding equipment is the middle-stage equipment in the semiconductor packaging production line and is also the most important part of semiconductor packaging.

[0003] Traditional die bonding equipment first dispenses glue at a specific location on the substrate, then identifies the location where the chip is to be mounted, and finally grabs the chip from the wafer ring and mounts it on the substrate, that is, the chip and substrate are connected by glue.

[0004] With the rapid development of the semiconductor industry, a variety of chip types have emerged. After some chips undergo the glue dispensing process, the glue will affect the subsequent mounting identification. The existing die bonding equipment is not suitable for chip mounting processes that require glue dispensing before mounting identification. Summary of the invention

[0005] In order to solve the problem of poor compatibility of existing die bonding equipment, the present invention provides a die bonding equipment and a die bonding method.

[0006] In order to solve the above technical problems, the present invention provides the following technical solutions: a crystal bonding device, comprising a workbench and a loading module, a track module, a dispensing module, a crystal supply module, a transfer table module, a mounting head module and a unloading module arranged on the workbench; the loading module and the unloading module are respectively arranged at opposite ends of the workbench, the track module comprises a first track and a second track, the second track is arranged along the connecting direction of the loading module and the unloading module, the first track is arranged between the loading module and the second track, and extends downward along the width direction of the first track; the dispensing module comprises a first dispensing mechanism and a second dispensing mechanism, the first dispensing mechanism is arranged at one end of the first track away from the second track; the crystal supply module and the transfer table module are located on the side of the second track close to the first dispensing mechanism; the mounting head module is arranged above the second track, and the mounting head module is provided with a second visual detector and a second dispensing mechanism.

[0007] Preferably, the first dispensing mechanism is provided with a first visual detector, and the detection accuracy of the second visual detector is higher than the detection accuracy of the first visual detector.

[0008] Preferably, the first glue dispensing mechanism corresponds to the first track, the mounting head binding module corresponds to the second track, and the first glue dispensing mechanism and the mounting head binding module can work simultaneously or in time-sharing.

[0009] Preferably, a carrier plate is provided on the first track. The carrier plate is slidably connected to the first track. A secondary track parallel to the second track is provided on the carrier plate. When the carrier plate is located at the end of the second track, the secondary track is connected to the second track.

[0010] Preferably, the transfer table module includes a transfer track and a transfer table. The transfer track is located on the side of the crystal supply module and extends towards the second track. A first top-view detector is provided at one end of the transfer track close to the crystal supply module, and a second top-view detector is provided at one end close to the second track. The transfer table is slidably connected to the transfer track. The crystal supply module includes a crystal suction and bonding head mechanism, and the crystal suction and bonding head mechanism can move between the crystal supply module and the transfer table.

[0011] Preferably, the workbench is further provided with a material table, and the material table is arranged at one end of the transfer track close to the first track.

[0012] Preferably, the die bonding equipment further includes a control module. A detection unit is provided on the loading module and / or the crystal supply module. The control module is in signal connection with the detection unit, the first dispensing mechanism, and the second dispensing mechanism. The control module controls the operation of the first dispensing mechanism or the second dispensing mechanism according to the detection result of the detection unit.

[0013] To solve the above technical problems, the present invention provides another technical solution as follows: A die bonding method, using the die bonding equipment described in any one of the above to fix a chip to a substrate, includes: The loading module loads the substrate onto the first track; the crystal supply module supplies the chips to the second track through the transfer table module; the dispensing module performs dispensing treatment on the substrate, and the second vision detector performs mounting recognition on the substrate, wherein the sequence of performing dispensing treatment and mounting recognition on the substrate can be changed; the mounting and bonding head module sucks the chips from the transfer table module and performs mounting treatment on the substrate; the substrate containing the mounted chips is unloaded through the unloading module.

[0014] Preferably, the dispensing module performs dispensing treatment on the substrate, and the second vision detector performs mounting recognition on the substrate, including: Moving the substrate to the corresponding position of the first dispensing mechanism based on the first track, performing dispensing recognition on the substrate through the first vision detector, and then performing dispensing treatment on the substrate through the first dispensing mechanism; Moving the substrate onto the second track, and performing mounting recognition on the substrate that has completed the dispensing treatment through the second vision detector.

[0015] Preferably, the dispensing module performs dispensing on the substrate, and the second vision detector performs mounting recognition on the substrate, including: moving the substrate to the corresponding position of the mounting head module based on the second track, and performing mounting recognition on the substrate through the second vision detector; based on the recognition result of the second vision detector, performing dispensing on the substrate through the second dispensing mechanism.

[0016] Compared with the prior art, a die bonding device and a die bonding method provided by the present invention have the following beneficial effects: 1. In a die bonding device provided by an embodiment of the present invention, the dispensing module and the mounting head module are respectively arranged corresponding to the first track and the second track. The substrate to be mounted can be quickly moved to the dispensing or mounting station through the corresponding track for corresponding process operations. In addition, for the mounting of conventional chips, that is, chips whose dispensing will not affect the mounting recognition, the dispensing and mounting processes can be processed in parallel, thereby improving the overall efficiency of die bonding. Since the first track and the second track are independently arranged, when the substrate is performing the dispensing or mounting process, it will not affect the other process, ensuring the accuracy of dispensing or mounting.

[0017] It can be understood that a second dispensing mechanism and a high-precision second vision detector are also arranged on the mounting head module. For some chips, if glue is coated on their substrates, it will affect the subsequent mounting position recognition and cause mounting failure. For the mounting of such chips, the mounting can be recognized by the second vision detector first, and then the second dispensing mechanism can perform dispensing based on the recognition result.

[0018] The die bonding device provided by the embodiment of the present invention is provided with two independent dispensing mechanisms, so that the die bonding device can realize different mounting processes through different dispensing mechanisms, that is, adopt the first dispensing mechanism to realize the working mode of dispensing first and then recognizing. At this time, dispensing and recognition are completed on two independent modules respectively, so that the synchronization operation of dispensing and recognition can be realized, improving the overall mounting efficiency; adopt the second dispensing mechanism to realize the working mode of recognizing first and then dispensing to meet the mounting requirements of chips whose dispensing will affect the mounting recognition.

[0019] Through the above design, the device of the present invention can adapt to the mounting of different types of chips, and has higher applicability and efficiency.

[0020] 2. In the die bonding equipment provided by the embodiments of the present invention, the first dispensing mechanism corresponds to the first track, and the mounting and bonding head module corresponds to the second track. Therefore, in the working mode of dispensing first and then identifying, the first dispensing mechanism and the mounting and bonding head module can work simultaneously. Secondly, since the accuracy requirement for identifying the dispensing position is usually lower than that for identifying the mounting position during the chip mounting process, in this embodiment, a first vision detector with low accuracy is equipped on the first dispensing mechanism for dispensing identification, which improves the detection speed and also plays a role in reducing costs.

[0021] 3. In the die bonding equipment provided by the embodiments of the present invention, a secondary track connecting the loading module and the second track is provided on the carrier plate. The loading module sends the substrate to the secondary track. After the carrier plate moves down along the first track to send the substrate to the first dispensing mechanism for dispensing, it then moves up to dock with the secondary track and transfers the substrate from the secondary track to the first track for mounting, quickly and stably transferring the substrate to each operating station located on different tracks through the carrier plate, thereby improving the production efficiency and mounting quality.

[0022] 4. In the die bonding equipment provided by the embodiments of the present invention, a transfer track is provided between the crystal supply module and the second track. After the crystal suction and bonding head mechanism grabs the chip, it performs preliminary calibration on the chip through the first top vision detector, and then quickly and stably transfers the preliminarily calibrated chip to the second track through the transfer table, performs mounting calibration through the second top vision detector, and finally performs the mounting process. By performing multiple calibrations, the mounting accuracy is ensured, and the chip is quickly transferred to the mounting station through the transfer table, reducing the waiting time for mounting, thereby improving the overall mounting efficiency.

[0023] 6. In the die bonding equipment provided by the embodiments of the present invention, a material table for placing chips is also provided near the mounting station. Through different chips placed on the transfer table on the material table, the mounting and bonding head module can obtain different chips from the material table and the transfer table for mounting, realizing multi-chip mounting. Secondly, when the transfer table is waiting for the crystal supply module to pick up the material, the mounting and bonding head module can first perform the mounting operation through the chips on the material table, that is, the mounting of the mounting and bonding head module and the material picking of the transfer table can be carried out synchronously, thereby improving the overall chip mounting efficiency.

[0024] 7. In the die bonding equipment provided by the embodiments of the present invention, a detection unit for detecting the chip type and a control module for controlling the operation of each module are provided. Through the cooperation of the detection unit and the control module, the die bonding equipment can automatically match the corresponding mounting process according to different chip types, improving the automation of the equipment.

[0025] 8. The embodiment of the present invention further provides a die bonding method for fixing a chip to a substrate by using the die bonding equipment described in any one of the above. The method includes: feeding the substrate onto the first track by a loading module; supplying the chip to the second track by a chip supply module through a transfer table module; performing glue dispensing on the substrate by a glue dispensing module, and performing mounting recognition on the substrate by a second vision detector, wherein the order of performing glue dispensing on the substrate and mounting recognition can be interchanged; sucking the chip from the transfer table module by a mounting head module to perform mounting processing on the substrate; and discharging the substrate with the mounted chip through a discharging module.

[0026] It can be understood that in the die bonding method provided in this embodiment, the order of glue dispensing and mounting recognition can be interchanged. By swapping the order of the two, two working modes of dispensing first and then recognizing, and recognizing first and then dispensing can be achieved to meet the mounting requirements of different types of chips.

[0027] Specifically, the die bonding method provided in this embodiment also has the same beneficial effects as the die bonding equipment described in any one of the above, which will not be elaborated here.

[0028] 9. In the die bonding method provided by the embodiment of the present invention, a working mode of dispensing first and then recognizing is provided. Specifically, the substrate is first moved to the corresponding position of the first glue dispensing mechanism through the first track for glue dispensing recognition and glue dispensing, and then the substrate is moved to the second track for mounting recognition.

[0029] It can be understood that the first track and the second track are independently arranged, and the first glue dispensing mechanism and the second vision detector are also independent of each other. Therefore, when the first glue dispensing mechanism works, it will not affect the work of the second vision detector, ensuring the accuracy of glue dispensing or recognition. Therefore, the first glue dispensing mechanism and the second vision detector can work simultaneously, that is, the glue dispensing and recognition processes are processed in parallel, thereby improving the overall mounting efficiency.

[0030] 10. In the die bonding method provided by the embodiment of the present invention, a working mode of recognizing first and then dispensing is also provided. Specifically, the substrate is moved to the corresponding position of the mounting head module, and the second vision detector is first used for recognition processing, and glue dispensing is performed by the second glue dispensing mechanism based on the recognition result.

[0031] It can be understood that the mounting position of the substrate is recognized by the second vision detector before glue dispensing, avoiding the situation that the glue coated on the substrate affects recognition caused by dispensing first, so as to ensure the accuracy of mounting; at the same time, the detection result of the second vision detector can also be applied to both the glue dispensing and mounting processes, reducing the number of recognitions and improving the work efficiency. Description of the Drawings

[0032] To more clearly illustrate the technical solutions in the embodiments of the present invention, the following will briefly introduce the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0033] Figure 1 is a schematic diagram of the overall framework of the die bonding equipment provided by the first embodiment of the present invention Figure 1 。

[0034] Figure 2 is a schematic diagram of the overall framework of the die bonding equipment provided by the first embodiment of the present invention Figure 2 。

[0035] Figure 3 is a schematic diagram of the framework of the track module provided by the first embodiment of the present invention.

[0036] Figure 4 is a schematic diagram of the framework of the dispensing module provided by the first embodiment of the present invention.

[0037] Figure 5 is a schematic diagram of the structure of the carrier plate provided by the first embodiment of the present invention.

[0038] Figure 6 is a schematic diagram of the partial framework of the die bonding equipment provided by the first embodiment of the present invention.

[0039] Figure 7 is a schematic diagram of the framework of the workbench provided by the first embodiment of the present invention.

[0040] Figure 8 is a structural block diagram of the die bonding equipment provided by the first embodiment of the present invention.

[0041] Figure 9 is a step flowchart of the die bonding method provided by the second embodiment of the present invention.

[0042] Figure 10 is the detailed step flow of step three of the die bonding method provided by the second embodiment of the present invention Figure 1 。

[0043] Figure 11 is the detailed step flow of step three of the die bonding method provided by the second embodiment of the present invention Figure 2 。

[0044] Explanation of the attached drawing reference numerals: 100, die bonding equipment; 10. Workbench; 20. Track module; 30. Dispensing module; 40. Crystal feeding module; 50. Chip mounting and bonding head module; 60. Loading module; 70. Unloading module; 80. Transfer table module; 90. Control module; 101. Feeding port; 102. Discharging port; 103. Mounting structure; 104. Material table; 105. Mounting bracket; 201. First track; 2011. Carrier plate; 2012. Sub-track; 202. Second track; 301. First dispensing mechanism; 3011. First vision detector; 302. Second dispensing mechanism; 401. Crystal suction and bonding head mechanism; 501. Second vision detector; 502. Chip mounting mechanism; 601. Detection unit; 701. Transfer track; 702. Transfer table; 703. First top vision detector; 704. Second top vision detector. Detailed implementation manners

[0045] In order to make the objectives, technical solutions and advantages of the present invention clearer and more understandable, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0046] In the embodiments provided by the present invention, it should be understood that "B corresponding to A" means that B is associated with A, and B can be determined according to A. However, it should also be understood that determining B according to A does not mean determining B only according to A, and B can also be determined according to A and / or other information.

[0047] It should be understood that the "one embodiment" or "an embodiment" mentioned throughout the specification means that the specific features, structures or characteristics related to the embodiment are included in at least one embodiment of the present invention. Therefore, the "in one embodiment" or "in an embodiment" appearing throughout the specification does not necessarily refer to the same embodiment. In addition, these specific features, structures or characteristics can be combined in one or more embodiments in any suitable manner. Those skilled in the art should also know that the embodiments described in the specification are all optional embodiments, and the actions and modules involved are not necessarily essential to the present invention.

[0048] In various embodiments of the present invention, it should be understood that the size of the serial numbers of the various processes does not necessarily mean the inevitable sequence of execution. The execution sequence of each process should be determined according to its function and internal logic, and should not constitute any limitation to the implementation process of the embodiments of the present invention.

[0049] The flowcharts and block diagrams in the accompanying drawings of the present invention illustrate the possible architectures, functions, and operations of systems, methods, and computer program products according to various embodiments of the present application. In this regard, each block in the flowchart or block diagram may represent a module, a segment of a program, or a part of code that contains one or more executable instructions for implementing a specified logical function. It should also be noted that in some alternative implementations, the functions marked in the blocks may occur in a different order than marked in the accompanying drawings. For example, two consecutive blocks shown may actually be executed substantially in parallel, and they may sometimes be executed in the reverse order, depending on the functions involved. It should be particularly noted that each block in the block diagram and / or flowchart, as well as combinations of blocks in the block diagram and / or flowchart, can be implemented by a dedicated hardware-based system that performs the specified functions or operations, or can be implemented by a combination of dedicated hardware and computer instructions.

[0050] Please refer to Figure 1 - Figure 4 , the first embodiment of the present invention provides a die bonding device 100, which includes a workbench 10 and a track module 20, a dispensing module 30, a crystal supply module 40, a mounting and bonding head module 50, a loading module 60, a unloading module 70, and a transfer table module 80 arranged on the workbench 10; the loading module 60 and the unloading module 70 are respectively arranged at opposite ends of the workbench 10, the track module 20 includes a first track 201 and a second track 202, the second track 202 is arranged along the connection direction of the loading module 60 and the unloading module 70, the first track 201 is arranged between the loading module 60 and the second track 202 and extends downward along the width direction of the first track 201; the dispensing module 30 includes a first dispensing mechanism 301 and a second dispensing mechanism 302, and the first dispensing mechanism 301 is arranged at one end of the first track 201 away from the second track 202; the crystal supply module 40 and the transfer table module 80 are located on the side of the second track 202 close to the first dispensing mechanism 301 and correspond to the dispensing module 30; the mounting and bonding head module 50 is arranged above the second track 202, and a second vision detector 501 and a second dispensing mechanism 302 are arranged on the mounting and bonding head module 50.

[0051] The die bonding device 100 provided by the embodiment of the present invention can be used in the semiconductor industry to bond chips to a substrate after dispensing to realize the application of the glue process; the die bonding device 100 can place components at high speed and with high precision to complete a series of key steps such as positioning, alignment, and mounting, and is an indispensable device in the integrated circuit packaging process and also the most important link in semiconductor packaging.

[0052] As a feasible implementation manner, the first track 201 and the second track 202 are vertically arranged along their lengths, and the dispensing module 30 and the mounting and bonding head module 50 are respectively arranged corresponding to the first track 201 and the second track 202, specifically at the non-adjacent ends of the first track 201 and the second track 202, so as to avoid mutual obstruction when the dispensing module 30 and the mounting and bonding head module 50 work and move, thereby affecting the mounting process; the substrate to be mounted can be quickly moved to the dispensing or mounting station through the corresponding track for corresponding process operations. Through the arrangement of the first track 201 and the second track 202, the moving speed of the substrate in each process is increased, and the waiting time of the dispensing module 30 or the mounting and bonding head module 50 is reduced, thereby improving the overall mounting efficiency.

[0053] It can be understood that the mounting and bonding head module 50 and the first dispensing mechanism 301 are respectively arranged at opposite ends in the length direction of the first track 201 for dispensing and mounting the substrate; the crystal supply module 40 is arranged in parallel with the first dispensing mechanism 301 on the side of the second track 202 away from the mounting and bonding head module 50, and the crystal supply module 40 is used to provide chips to the transfer table module 80; the mounting and bonding head module 50, the first dispensing mechanism 301 and the crystal supply module 40 are respectively used to implement processes such as mounting, dispensing, and chip loading in the chip mounting process. In actual work, the movement ranges of the mounting and bonding head module 50, the first dispensing mechanism 301 and the crystal supply module 40 do not interfere with each other, so that each module can work synchronously, thereby improving the overall mounting efficiency.

[0054] Specifically, the first track 201 and the second track 202 are independently arranged. Therefore, when the dispensing module 30 or the mounting and bonding head module 50 performs dispensing or mounting, it will not affect other processes, ensuring the accuracy of dispensing or mounting; secondly, by using different operating components to perform process processing at different stations, such as using the first dispensing mechanism 301 to perform dispensing processing on the first track 201 and using the mounting and bonding head module 50 to perform mounting processing on the second track 202, conditions for parallel processing are provided for the dispensing process or the mounting process, that is, the die bonding equipment 100 provided in this embodiment can simultaneously perform dispensing and mounting process processing, improving the overall efficiency of die bonding.

[0055] It should be noted that with the continuous progress of technology and the change of market demands, the types of semiconductor chips are gradually refined and diversified. During the mounting process of some chips, if the substrate is first dispensed, the glue coated on the substrate will affect the subsequent mounting recognition, resulting in mounting failure.

[0056] Specifically, for microchips, flip chips, etc. with high-precision mounting requirements, if glue is applied first, the diffusion or slight deviation of the glue may block the positioning marks on the substrate and interfere with visual recognition. Secondly, due to the dense wiring on the high-density substrate, the positioning mark size is extremely small, and the glue may also cover the mark after glue application, interfering with recognition. In addition, for mounting processes with special process requirements such as flexible substrate mounting or multi-chip module mounting, it is necessary to identify and position first and then apply glue.

[0057] It can be understood that when there is a risk that the glue interferes with visual recognition (such as blocking marks, changing the optical properties of the substrate) or causes a decrease in mounting accuracy, the die bonding process needs to be adjusted to: identify first and then apply glue. Thus, relying on the capabilities of the equipment, such as coordinate memory, dynamic compensation, etc., precise operation is achieved by pre-storing substrate feature data.

[0058] As a preferred embodiment of the present invention, a second glue application mechanism 302 and a high-precision second vision detector 501 are further provided on the mounting bonding head module 50. Before applying glue, the substrate can be mounted and identified by the second vision detector 501 first, then the second glue application mechanism 302 is used to apply glue to it, and finally, the chip mounting process is performed by the mounting bonding head module 50.

[0059] Through this design, the die bonding equipment 100 can meet the mounting requirements of various types of chips, with higher adaptability and market competitiveness. At the same time, by setting the second glue application mechanism 302 on the mounting bonding head module 50, the glue application and mounting processes can share the detection results of the second vision detector 501, reducing the overall number of detections and improving the detection and mounting efficiency.

[0060] It can be understood that the die bonding equipment 100 provided in the embodiment of the present invention is provided with two glue application mechanisms, so that the die bonding equipment 100 can realize different mounting processes through different glue application mechanisms, that is, the working mode of applying glue first and then identifying with the first glue application mechanism 301, and the working mode of identifying first and then applying glue with the second glue application mechanism 302, so that the equipment can adapt to the mounting of different types of chips, with higher applicability and stronger market competitiveness.

[0061] It should be noted that the first glue application mechanism 301 corresponds to the first track 201, the mounting bonding head module 50, and the second glue application mechanism 302 provided thereon correspond to the second track 202. The first glue application mechanism 301 and the mounting bonding head module 50 can work simultaneously or at different times.

[0062] Specifically, the first dispensing mechanism 301 is located at one end of the first track 201 away from the second track 202. In the working mode of dispensing first and then performing pick-and-place recognition: the substrate is dispensed at this end and then transferred to the second track 202 at the other end for pick-and-place recognition and chip pick-and-place. That is, in this working mode, the dispensing and pick-and-place processes are actually carried out using different structural modules at different positions. Therefore, in the working mode of dispensing first and then performing pick-and-place recognition, the dispensing process and the pick-and-place process can be processed in parallel. That is, on the first track 201, the first dispensing mechanism 301 dispenses one substrate, and at the same time, on the second track 202, the pick-and-place head module 50 performs chip pick-and-place on another substrate, thereby improving the overall pick-and-place efficiency.

[0063] In some embodiments, the pick-and-place head module 50 includes a second vision detector 501 and a pick-and-place mechanism 502. A second dispensing mechanism 302 is also provided on the pick-and-place head module 50. The second dispensing mechanism 302 and the movement of the pick-and-place head module 50 are controlled by the same drive assembly to move synchronously. In the working mode of performing pick-and-place recognition first and then dispensing: the substrate is sent to the corresponding position of the pick-and-place head module 50, and first, the second vision detector 501 performs pick-and-place recognition. Based on the recognition result, the second dispensing mechanism 302 is used for dispensing treatment, and finally, the chip is pick-and-placed through the pick-and-place mechanism 502. That is, both the dispensing treatment and the chip pick-and-place are based on the detection result of the second vision detector 501.

[0064] Specifically, through one detection of the second vision detector 501, it simultaneously guides the second dispensing mechanism 302 and the pick-and-place mechanism 502 to perform precise dispensing and pick-and-place treatment on the substrate, improving the utilization rate of detection data; performing pick-and-place recognition on the substrate before dispensing effectively avoids the glue coated on the substrate from affecting the recognition of the second vision detector 501 and ensures the pick-and-place quality.

[0065] Furthermore, a first vision detector 3011 is provided on the first dispensing mechanism 301, and the detection accuracy of the second vision detector 501 is higher than that of the first vision detector 3011.

[0066] It should be noted that usually, before performing dispensing or pick-and-place treatment on the substrate, it is necessary to detect and recognize the dispensing position and pick-and-place position of the substrate, and the accuracy requirement for recognizing the dispensing position is less than the accuracy requirement for recognizing the pick-and-place position; therefore, for conventional chip pick-and-place, that is, chip pick-and-place where dispensing does not affect pick-and-place recognition, a detection device with a lower detection accuracy can be used for recognition detection, avoiding using a high-precision detection device to detect a low-precision process and causing waste of resources.

[0067] Understandably, in the working mode of dispensing first and then identifying, after the substrate is dispensed, chip mounting needs to be performed only after mounting identification. Therefore, the first dispensing mechanism 301 in this embodiment uses a low-precision first vision detector 3011 to perform identification detection before dispensing to improve detection efficiency and reduce costs. At the same time, the first dispensing mechanism 301 and the mounting head module 50 are independent of each other and are located at two different stations. Therefore, the operation of the first dispensing mechanism 301 does not affect the operation of the mounting head module 50. Therefore, when the first dispensing mechanism 301 is used for dispensing, the mounting head module 50 can perform mounting synchronously, thereby improving the overall efficiency of die bonding.

[0068] Further, please refer to Figure 5 simultaneously. There is a carrier plate 2011 on the first track 201. The carrier plate 2011 is slidably connected to the first track 201. There is a secondary track 2012 parallel to the second track 202 on the carrier plate 2011. When the carrier plate 2011 is located at the end of the second track 202, the secondary track 2012 is connected to the second track 202.

[0069] It should be noted that when the carrier plate 2011 is located between the loading module 60 and the second track 202, the secondary track 2012 thereon connects the loading module 60 and the second track 202. That is, the loading module 60 can transfer the substrate to the secondary track 2012 and then convey it to the second track 202 through the secondary track 2012.

[0070] As a feasible implementation manner, after receiving the substrate from the loading module 60, the carrier plate 2011 moves along the length direction of the first track 201 towards the first dispensing mechanism 301, and the substrate is dispensed at the first dispensing mechanism 301. Then, the carrier plate 2011 is reset to the other end of the first track 201 to dock the secondary track 2012 with the second track 202, thereby transferring the substrate to the second track 202 for mounting processing.

[0071] As another feasible implementation manner, after receiving the substrate from the loading module 60, the carrier plate 2011 transfers the substrate to the second track 202 through the secondary track 2012. The substrate is identified and detected by the second vision detector 501 on the mounting head module 50, and then dispensed by the second dispensing mechanism 302 also provided on the mounting head module 50.

[0072] Optionally, the mounting head module 50 can also move above the carrier plate 2011 to perform dispensing and / or mounting operations on the substrate.

[0073] Understandably, by using the carrier board 2011 to carry the substrate and then sliding the carrier board 2011 along the track, the substrate can be quickly and stably transferred to each operation station located on different tracks, accelerating the turnover speed of the substrate and thus improving production efficiency.

[0074] Further, please refer back to Figure 1 and Figure 2 , an installation bracket 105 is further provided on the workbench 10. The installation bracket 105 is arranged parallel to the first track 201. The chip mounting and bonding head module 50 is slidably connected to the installation bracket 105, and the chip mounting and bonding head module 50 can move along the length direction of the second track 202 through the installation bracket 105.

[0075] Optionally, the installation bracket 105 is a gantry bracket.

[0076] Specifically, the installation bracket 105 straddles the first track 201 and the second track 202, so that the chip mounting and bonding head module 50 provided thereon can move above the first track 201 and the second track 202, and thus quickly move to the corresponding operation points, improving the coverage range of the operation of the chip mounting and bonding head module 50.

[0077] Optionally, a UV lamp can also be provided on the chip mounting and bonding head module 50 or on the installation bracket 105 for UV curing of the chip.

[0078] In some embodiments, the chip mounting and bonding head module 50 moves on the mounting station of the second track 202, so as to perform operations such as mounting identification, dispensing, mounting, and / or UV curing on the substrate at this station.

[0079] In some other embodiments, the chip mounting and bonding head module 50 can move above the first track 201 and the second track 202 through the installation bracket 105; specifically, the chip mounting and bonding head module 50 can move to one end of the first track 201 close to the second track 202, perform mounting identification, dispensing, and / or mounting on the substrate at this position, and then move the substrate to the second track for UV curing.

[0080] As a feasible implementation manner, the entire installation bracket 105 can move along the width direction of the second track 202, that is, through the movement of the installation bracket 105 itself and the movement of the chip mounting and bonding head module 50 on the installation bracket 105, the chip mounting and bonding head module 50 can accurately move to any point on the mounting plane for mounting or dispensing.

[0081] Understandably, the mounting and bonding head module 50 is slidably connected to the mounting bracket 105, so that the mounting and bonding head module 50 can move quickly and stably on the mounting bracket 105, ensuring that the mounting and bonding head module 50 can quickly and accurately reach the corresponding processing positions to perform dispensing and / or mounting operations on the substrate, guaranteeing the quality and accuracy of the mounting and improving the overall die bonding efficiency.

[0082] Further, please refer to Figure 6 , the workbench 10 is further provided with a transfer track 701 and a transfer table 702. The transfer track 701 is located on the side of the crystal supply module 40 and extends in the direction of the second track 202. A first top-view detector 703 is provided at one end of the transfer track 701 close to the crystal supply module 40, and a second top-view detector 704 is provided at one end close to the second track. The transfer table 702 is slidably connected to the transfer track 701. The crystal supply module 40 includes a crystal suction and bonding head mechanism 401, and the crystal suction and bonding head mechanism 401 can move between the crystal supply module 40 and the transfer table 702.

[0083] In some embodiments, the transfer track 701 is disposed between the first track 201 and the crystal supply module 40 and is arranged parallel to the first track 201. A first top-view detector 703 and a second top-view detector 704 are respectively provided at both ends in the length direction of the transfer track 701. Specifically, the first top-view detector 703 is provided at one end of the transfer track 701 close to the crystal supply module 40 for performing initial calibration on the chip, and the second top-view detector 704 is provided at one end of the transfer track 701 close to the second track 202 for performing mounting calibration on the chip.

[0084] Optionally, the top-view detector is a top-view CCD (Charge Coupled Device). A CCD is a semiconductor device that can convert an optical image into a digital signal to implement operations such as image acquisition, storage, and transmission processing.

[0085] Understandably, after the crystal suction and bonding head mechanism 401 grabs the chip on the crystal supply module 40, it first moves to the first top-view detector 703 for identification and detection, and performs the first calibration on the chip in accordance with the detection result. Then, the initially calibrated chip is placed on the transfer table 702, and the chip is transferred to the second track 202 through the transfer table 702 to wait for mounting; a mounting mechanism 502 for grabbing the chip is further provided on the mounting and bonding head module 50. After the mounting mechanism 502 grabs the chip on the transfer table 702, it also first moves to the second top-view detector 704 for identification and detection and the second calibration, and then performs the mounting.

[0086] It should be noted that the first top view detector 703 and the second top view detector 704 are specifically used to identify the bottom of the chip. It should be understood that generally, vision detectors are equipped on both the chip suction and bonding head mechanism 401 and the mounting mechanism 502 to identify the chip from above the chip. However, the key features of some chips are on the bottom, and relying solely on the vision detectors equipped on the chip suction and bonding head mechanism 401 and the mounting mechanism 502 cannot well identify the relevant features of the chip.

[0087] In this embodiment, by setting the first top view detector 703 and the second top view detector 704, the chip can be comprehensively identified, improving the accuracy of identification; through two calibrations, the mounting accuracy of the chip is further improved.

[0088] As a feasible implementation manner, the detection accuracy of the first top view detector 703 is lower than that of the second top view detector 704; it can be understood that the top view detector can be adaptively configured according to the detection accuracy required in actual operations of different processes, avoiding using a high-precision top view detector to identify and detect the crystal supply process with a lower accuracy requirement, which can improve the detection efficiency while reducing costs.

[0089] It can be understood that after the chip suction and bonding head mechanism 401 grabs the chip, the chip is initially calibrated by the first top view detector 703, and then the initially calibrated chip is quickly and stably transferred to the second track 202 through the transfer table 702, and is calibrated for mounting by the second top view detector 704, and finally the mounting process is performed. The mounting accuracy is ensured through multiple calibrations, and the chip is quickly transferred to the mounting station through the transfer table 702.

[0090] Furthermore, the workbench 10 is further provided with a material table 104, and the material table 104 is arranged at one end of the transfer track 701 close to the first track 201.

[0091] It should be noted that the material table 104 is used to place the chip for the mounting and bonding module 50 to perform the mounting process.

[0092] As an embodiment, the types of chips placed on the material table 104 are different from those on the transfer table 702, and the mounting and bonding module 50 can grab chips on the material table 104 and the transfer table 702 respectively for mounting to achieve the mounting of multiple types of chips.

[0093] As a preferred implementation manner, when the transfer table 702 is moving or waiting for the crystal supply module 40 to pick up the material, the mounting and bonding module 50 can first grab the chip from the material table 104 for the mounting process, that is, the mounting and bonding module 50 and the transfer table 702 can work simultaneously, thereby improving the overall chip mounting efficiency.

[0094] Furthermore, please refer to Figure 7, the workbench 10 is also provided with a feeding port 101 and a discharging port 102. The feeding port 101 is correspondingly arranged with the feeding module 60, and the discharging port 102 is correspondingly arranged with the discharging module 70. Installation structures 103 are arranged outside the feeding port 101 and the discharging port 102. The feeding module 60 and the discharging module 70 are connected to external devices through the installation structures 103.

[0095] Understandably, the die bonding equipment 100 is the middle-section equipment of a semiconductor packaging production line. By presetting the installation structures 103 at the feeding end and the discharging end of the workbench 10, it is convenient for the die bonding equipment 100 to be connected to its upstream and downstream equipment, assembled into a complete production line equipment, and also convenient for later maintenance and servicing.

[0096] Furthermore, please refer to Figure 8 , the die bonding equipment 100 further includes a control module 90. A detection unit 601 is provided on the feeding module 60 and / or the crystal supply module 40. The control module 90 is signal-connected to the detection unit 601, the first dispensing mechanism 301, and the second dispensing mechanism 302. The control module 90 controls the operation of the first dispensing mechanism 301 or the second dispensing mechanism 302 according to the detection result of the detection unit 601.

[0097] It should be noted that the control module 90 is respectively signal-connected to the track module 20, the dispensing module 30, the crystal supply module 40, the mounting and bonding head module 50, the feeding module 60, the discharging module 70, and the transfer table module 80 to control the operation of each module. The detection unit 601 is used to detect the types of the substrate and the chip, that is, to detect whether it is a chip that can be mounted using the conventional process of dispensing first and then identifying.

[0098] Understandably, if the detection result of the detection unit 601 is that the current chip is a conventional chip, the control module 90 controls the other modules to execute the working mode of dispensing first and then identifying, that is, sending the substrate to the corresponding position of the first dispensing mechanism 301 for dispensing. If the detection result of the detection unit 601 is that for the current chip, after the dispensing process, the glue will affect the subsequent mounting and identification, the control module controls the other modules to execute the working mode of identifying first and then dispensing, that is, sending the substrate to the corresponding position of the mounting and bonding head module 50, first using the second vision detector 501 for mounting and identification, and then using the second dispensing mechanism 302 for dispensing treatment.

[0099] Through the cooperation of the detection unit and the control module, the die bonding equipment can automatically match the corresponding mounting process according to different chip types, improving the automation of the equipment.

[0100] Please refer to Figure 9 , the second embodiment of the present invention provides a die bonding method. Using the die bonding equipment 100 described in any one of the above to fix the chip to the substrate, it includes: Step S1: The loading module loads the substrate onto the first track; Step S2: The crystal supply module supplies chips to the second track through the transfer table module; Step S3: The dispensing module performs dispensing on the substrate, and the second vision detector performs mounting recognition on the substrate. Among them, the order of performing dispensing and mounting recognition on the substrate can be changed; Step S4: The mounting head module picks up chips from the transfer table module and performs mounting on the substrate; Step S5: The substrate with mounted chips is unloaded through the unloading module.

[0101] It should be noted that in Step S2, the crystal supply module 40 supplies chips to the second track 202 through the transfer table module 80. Specifically, the chip suction and binding mechanism 401 grabs the chips in the crystal supply module 40 for initial calibration, and then transports the initially calibrated chips to the mounting station of the second track 202 through the transfer table 702 to wait for mounting.

[0102] It can be understood that the order of dispensing and mounting recognition in Step S3 can be changed. By swapping the order of the two, two working modes of dispensing first and then recognizing, and recognizing first and then dispensing can be achieved to meet the mounting requirements of different types of chips.

[0103] It should be further noted that the die bonding method provided in this embodiment needs to go through steps such as feeding, crystal supply, dispensing, recognition and mounting, and discharging in sequence. It should be understood that the above crystal supply steps are all carried out in different areas of the workbench 10, and the working modules used for the corresponding operations are also different. Therefore, in actual operation, some steps can be carried out synchronously to improve production efficiency.

[0104] As a feasible implementation method, in Step S3, the substrate is first dispensed and then mounting recognition is performed; at this time, after receiving the substrate, the carrier plate 2011 will transfer the substrate through the first track 201 to the dispensing station, that is, to the corresponding position of the first dispensing mechanism 301 for dispensing. Therefore, Step S1 and Step S3 need to be carried out in sequence; and since the first dispensing mechanism 301, the crystal supply module 40, and the mounting head module 50 are located in different areas of the workbench 10 and do not interfere with each other during their work, they can work in parallel, that is, Step S2, Step S3, Step S4, and Step S5 can all be carried out synchronously to improve the mounting efficiency.

[0105] As another feasible implementation, in step S3, the substrate is first subjected to mounting recognition and then dispensing treatment. At this time, the overall die bonding process is as follows: The carrier 2011 is located between the feeding port 101 and the second track 202, the secondary track 2012 is docked with the feeding port 101 and the second track 202, the substrate is transported from the feeding port 101 to the secondary track 2012 and moved to the corresponding position of the mounting head module 50, and recognition, dispensing, and mounting treatments are performed through the mounting head module 50 and the second dispensing mechanism 302.

[0106] It should be understood that since the second dispensing mechanism 302 is provided on the mounting head module 50 and is controlled by the same driving mechanism, the movements of the two are synchronized, that is, the mounting head module 50 and the second dispensing mechanism 302 cannot operate on two different substrates simultaneously; therefore, when the substrate is first subjected to mounting recognition and then dispensing treatment in step S3, step S3 and step S4 cannot be processed in parallel; in this working mode, step S1, step S2, step S3 and step S5, or step S1, step S2, step S4 and step S5 can be processed in parallel to improve the mounting efficiency.

[0107] Specifically, the die bonding method provided in this embodiment also has the same beneficial effects as the die bonding device 100 described in any one of the above, which will not be elaborated here.

[0108] Further, please refer to Figure 10 , the dispensing module 30 performs dispensing treatment on the substrate, and the second vision detector 501 performs mounting recognition on the substrate, including: Step S31a: Move the substrate to the corresponding position of the first dispensing mechanism based on the first track, perform dispensing recognition on the substrate through the first vision detector, and then perform dispensing treatment on the substrate through the first dispensing mechanism; Step S32a: Move the substrate onto the second track and perform mounting recognition on the substrate that has completed the dispensing treatment through the second vision detector.

[0109] In some embodiments, the carrier 2011 quickly transfers the substrate to the first dispensing mechanism 301 through the first track 201 for dispensing, and then returns along the original path to transfer the substrate onto the second track 202 for mounting.

[0110] It can be understood that the first track 201 and the second track 202 are independently arranged. Therefore, when the first dispensing mechanism 301 is working, it will not affect the work of the second vision detector 501, ensuring the accuracy of dispensing or recognition. Therefore, the first dispensing mechanism 301 and the second vision detector 501 can work simultaneously, that is, the dispensing and recognition processes are processed in parallel, thereby improving the overall mounting efficiency.

[0111] Further, please refer to Figure 11, the dispensing module 30 performs dispensing on the substrate, and the second vision detector 501 performs mounting recognition on the substrate, including: Step S31b: Move the substrate to the corresponding position of the mounting bonding head module based on the second track, and perform mounting recognition on the substrate through the second vision detector; Step S32b: Based on the recognition result of the second vision detector, perform dispensing on the substrate through the second dispensing mechanism.

[0112] It can be understood that before dispensing, the second vision detector 501 is first used to recognize the mounting position of the substrate, and then the substrate is dispensed, avoiding the situation that the glue coated on the substrate affects the recognition due to prior dispensing, so as to ensure the mounting accuracy.

[0113] Compared with the prior art, a die bonding device and a die bonding method provided by the present invention have the following beneficial effects: 1. In a die bonding device provided by an embodiment of the present invention, the dispensing module and the mounting bonding head module are respectively arranged corresponding to the first track and the second track. The substrate to be mounted can be quickly moved to the dispensing or mounting station through the corresponding track for corresponding process operations. In addition, for the mounting of conventional chips, that is, the chips whose glue does not affect the mounting recognition, the dispensing and mounting processes can be processed in parallel, thereby improving the overall die bonding efficiency. Since the first track and the second track are independently arranged, when the substrate is performing the dispensing or mounting process, it will not affect other processes, ensuring the accuracy of dispensing or mounting.

[0114] It can be understood that a second dispensing mechanism and a high-precision second vision detector are also arranged on the mounting bonding head module. For some chips, if glue is coated on their substrates, it will affect the subsequent mounting position recognition and cause mounting failure. For the mounting of such chips, the second vision detector can be used to perform mounting recognition on them first, and then the second dispensing mechanism is used to perform dispensing based on the recognition result.

[0115] The die bonding device provided by the embodiment of the present invention is provided with two independent dispensing mechanisms, so that the die bonding device can realize different mounting processes through different dispensing mechanisms, that is, adopt the first dispensing mechanism to realize the working mode of dispensing first and then recognizing. At this time, dispensing and recognition are completed on two independent modules respectively, so that the synchronous operation of dispensing and recognition can be realized, improving the overall mounting efficiency; adopt the second dispensing mechanism to realize the working mode of recognizing first and then dispensing to meet the mounting requirements of chips whose glue will affect the mounting recognition.

[0116] Through the above design, the device can adapt to the mounting of different types of chips and has higher applicability.

[0117] 2. In the die bonding equipment provided by the embodiments of the present invention, the first dispensing mechanism corresponds to the first track, and the mounting and bonding head module corresponds to the second track. Therefore, in the working mode of dispensing first and then identifying, the first dispensing mechanism and the mounting and bonding head module can work simultaneously. Secondly, since the accuracy requirement for identifying the dispensing position is usually lower than that for identifying the mounting position during the chip mounting process, in this embodiment, a first vision detector with low accuracy is equipped on the first dispensing mechanism for dispensing identification, which improves the detection speed and also plays a role in reducing costs.

[0118] 3. In the die bonding equipment provided by the embodiments of the present invention, a secondary track connecting the loading module and the second track is provided on the carrier plate. The loading module sends the substrate to the secondary track. After the carrier plate moves down along the first track to send the substrate to the first dispensing mechanism for dispensing, it then moves up to the secondary track to dock with the first track, and transfers the substrate from the secondary track to the first track for mounting. The substrate is quickly and stably transferred to each operating station located on different tracks through the carrier plate, thereby improving the production efficiency and mounting quality.

[0119] 4. In the die bonding equipment provided by the embodiments of the present invention, a transfer track is provided between the crystal supply module and the second track. After the crystal suction and bonding head mechanism grabs the chip, the chip is initially calibrated by the first top vision detector, and then the initially calibrated chip is quickly and stably transferred to the second track through the transfer table, and is calibrated for mounting by the second top vision detector, and finally the mounting process is performed. The mounting accuracy is ensured through multiple calibrations, and the chip is quickly transferred to the mounting station through the transfer table, reducing the waiting time for mounting, thereby improving the overall mounting efficiency.

[0120] 6. In the die bonding equipment provided by the embodiments of the present invention, a material table for placing chips is also provided near the mounting station. Through different chips placed on the transfer table on the material table, the mounting and bonding head module can obtain different chips from the material table and the transfer table for mounting, realizing multi-chip mounting. Secondly, when the transfer table is waiting for the crystal supply module to pick up the material, the mounting and bonding head module can first perform the mounting operation through the chips on the material table, that is, the mounting of the mounting and bonding head module and the material picking of the transfer table can be synchronized, thereby improving the overall chip mounting efficiency.

[0121] 7. In the die bonding equipment provided by the embodiments of the present invention, a detection unit for detecting the chip type and a control module for controlling the operation of each module are provided. Through the cooperation of the detection unit and the control module, the die bonding equipment can automatically match the corresponding mounting process according to different chip types, improving the automation of the equipment.

[0122] 8. The embodiment of the present invention also provides a die bonding method for fixing a chip to a substrate by using the die bonding equipment described in any one of the above. The method includes: feeding the substrate onto the first track by a loading module; supplying the chip to the second track by a chip supply module through a transfer table module; performing glue dispensing on the substrate by a glue dispensing module, and performing mounting recognition on the substrate by a second vision detector, wherein the sequence of performing glue dispensing on the substrate and mounting recognition can be interchanged; sucking the chip from the transfer table module by a mounting head module to perform mounting processing on the substrate; and discharging the substrate with the mounted chip through a discharging module.

[0123] It can be understood that in the die bonding method provided in this embodiment, the sequence of glue dispensing and mounting recognition can be interchanged. By swapping the two sequences, two working modes of dispensing first and then recognizing, and recognizing first and then dispensing can be achieved to meet the mounting requirements of different types of chips.

[0124] Specifically, the die bonding method provided in this embodiment also has the same beneficial effects as the die bonding equipment described in any one of the above, which will not be elaborated here.

[0125] 9. In the die bonding method provided by the embodiment of the present invention, a working mode of dispensing first and then recognizing is provided. Specifically, the substrate is first moved to the corresponding position of the first glue dispensing mechanism through the first track for glue dispensing recognition and glue dispensing, and then the substrate is moved to the second track for mounting recognition.

[0126] It can be understood that the first track and the second track are independently arranged, and the first glue dispensing mechanism and the second vision detector are also independent of each other. Therefore, when the first glue dispensing mechanism works, it will not affect the work of the second vision detector, ensuring the accuracy of glue dispensing or recognition. Therefore, the first glue dispensing mechanism and the second vision detector can work simultaneously, that is, the glue dispensing and recognition processes are processed in parallel, thereby improving the overall mounting efficiency.

[0127] 10. In the die bonding method provided by the embodiment of the present invention, a working mode of recognizing first and then dispensing is also provided. Specifically, the substrate is moved to the corresponding position of the mounting head module, and the second vision detector is first used for recognition processing, and glue dispensing is performed by the second glue dispensing mechanism based on the recognition result.

[0128] It can be understood that the second vision detector is used to recognize the mounting position of the substrate before glue dispensing, avoiding the situation that the glue coated on the substrate affects recognition caused by dispensing first, so as to ensure the accuracy of mounting; at the same time, the detection result of the second vision detector can also be applied to both the glue dispensing and mounting processes, reducing the number of recognitions and improving the work efficiency.

[0129] The above has introduced in detail a die bonding device and a die bonding method disclosed in the embodiments of the present invention. Specific examples are used in this article to elaborate on the principle and implementation manner of the present invention. The description of the above embodiments is only used to help understand the method and its core idea of the present invention; at the same time, for those of ordinary skill in the art, according to the idea of the present invention, there will be changes in the specific implementation manner and application scope. In summary, the content of this specification should not be construed as a limitation to the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the principle of the present invention should be included within the protection scope of the present invention.

Claims

1. A die bonding device, characterized in that: It includes a workbench and a loading module, a track module, a dispensing module, a crystal supply module, a transfer table module, a mounting head module and a unloading module arranged on the workbench; The loading module and the unloading module are respectively arranged at opposite ends of the workbench, the track module comprises a first track and a second track, the second track is arranged along the connecting direction of the loading module and the unloading module, the first track is arranged between the loading module and the second track, and extends downward along the width direction of the first track; The dispensing module comprises a first dispensing mechanism and a second dispensing mechanism, wherein the first dispensing mechanism is arranged at an end of the first track away from the second track; The crystal supply module and the transfer table module are located on the side of the second track close to the first dispensing mechanism; The mounting and binding head module is arranged above the second track, and the mounting and binding head module is provided with a second visual detector and the second glue dispensing mechanism.

2. The die bonding device according to claim 1, characterized in that: The first dispensing mechanism is provided with a first visual detector, and the detection accuracy of the second visual detector is higher than the detection accuracy of the first visual detector.

3. The die bonding device according to claim 1, characterized in that: The first glue dispensing mechanism corresponds to the first track, the mounting head binding module corresponds to the second track, and the first glue dispensing mechanism and the mounting head binding module can work simultaneously or in a time-sharing manner.

4. The die bonding device according to claim 1, characterized in that: A carrier plate is provided on the first track, the carrier plate is slidably connected to the first track, a secondary track parallel to the second track is provided on the carrier plate, and when the carrier plate is located at the end of the second track, the secondary track is connected to the second track.

5. The die bonding device according to claim 1, characterized in that: The transfer table module includes a transfer track and a transfer table. The transfer track is located on the side of the crystal supply module and extends in the direction of the second track. The transfer track is provided with a first upward-looking detector at one end close to the crystal supply module, and a second upward-looking detector is provided at one end close to the second track. The transfer table is slidably connected to the transfer track. The crystal supply module includes a crystal suction head binding mechanism, and the crystal suction head binding mechanism can move between the crystal supply module and the transfer table.

6. The die bonding device according to claim 5, characterized in that: The workbench is also provided with a material table, and the material table is arranged on the transfer track close to one end of the first track.

7. The die bonding device according to claim 1, characterized in that: The crystal bonding equipment also includes a control module. A detection unit is provided on the loading module and / or the crystal supply module. The control module is signal-connected with the detection unit, the first dispensing mechanism and the second dispensing mechanism. The control module controls the operation of the first dispensing mechanism or the second dispensing mechanism according to the detection result of the detection unit.

8. A die bonding method, using the die bonding device according to any one of claims 1 to 7 to fix a chip to a substrate, characterized in that: include: The loading module loads the substrate onto the first track; The wafer supply module supplies chips to the second track through the transfer table module; The glue dispensing module performs glue dispensing on the substrate, and the second visual detector performs mounting identification on the substrate, wherein the order of performing glue dispensing on the substrate and mounting identification can be changed; The mounting and binding head module takes the chip from the transfer table module and mounts it on the substrate; The mounted substrate containing the chip is unloaded through the unloading module.

9. The die bonding method according to claim 8, characterized in that: The dispensing module performs dispensing on the substrate, and the second visual detector performs mounting identification on the substrate, including: The substrate is moved to a corresponding position of the first dispensing mechanism based on the first track, the substrate is identified by the first visual detector, and then the substrate is processed by the first dispensing mechanism; The substrate is moved to the second track, and the second visual detector is used to perform placement identification on the substrate that has completed the dispensing process.

10. The die bonding method according to claim 8, characterized in that: The dispensing module performs dispensing on the substrate, and the second visual detector performs mounting identification on the substrate, including: The substrate is moved to a corresponding position of the mounting and binding head module based on the second track, and the mounting and identification of the substrate is performed through the second visual detector; Based on the recognition result of the second visual detector, the substrate is subjected to glue dispensing processing by the second glue dispensing mechanism.

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