Radiator for IGCT device
By using external phase change material and aluminum alloy shell connection design on IGCT devices and combined with the rib structure in the flow channel, the problem of poor heat dissipation effect of IGCT devices is solved, achieving efficient heat removal and low energy consumption heat dissipation effect.
Patent Information
- Application Number
- CN202510378036.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-27
- Publication Date
- 2025-06-17
AI Technical Summary
The existing technology is difficult to effectively and promptly take away excess heat from IGCT devices, resulting in poor heat dissipation effect.
The external phase change material is used to contact the IGCT device, and the phase change material is connected to the phase change material inside the flow channel through an aluminum alloy shell. Ribbons are added between the internal phase change material and the flow channel to increase the heat transfer area, and the cooling medium takes away heat through convection heat transfer and heat conduction.
It realizes efficient heat dissipation of IGCT devices, can quickly take away excess heat, ensure the safe operation of IGCT devices, and reduces the heat sink's own thermal resistance and energy loss.
Smart Images
Figure CN120164862A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of radiators, and in particular to a radiator used for an IGCT device. Background Art
[0002] IGCT (Interleaved Gate Commutated Thyristor) is a new type of power electronic device that combines the advantages of GTO (Gate Turn-Off Thyristor) and IGBT (Insulated Gate Bipolar Transistor). IGCT devices have lower switching losses and higher current carrying capacity, and are suitable for high-voltage, high-current power electronic applications such as high-voltage DC transmission, flexible AC transmission systems, and large inverters. IGCT devices play an important role in power systems due to their high power density and high efficiency, but since they generate a lot of heat during operation, effective heat dissipation solutions are required to ensure their stable operation.
[0003] A water-cooled radiator is a radiator that uses water as a cooling medium. Its main function is to dissipate heat from core power electronic devices (IGCT) to maintain these components operating within a safe junction temperature range. Compared to air cooling, water cooling has higher heat dissipation efficiency and can provide a more stable heat dissipation effect. Therefore, it is often used in scenarios that require high stability and high-performance computing. The existing technology usually designs circulation channels of different shapes. These circulation channels of different shapes are in contact with the IGCT device and absorb the internal heat of the chip through heat conduction. The water in the circulation channel transfers the heat of the channel through convection exchange, thereby reducing the internal temperature of the IGCT. However, it is difficult for existing means to remove excess heat from the IGCT device in a timely manner, and the heat dissipation effect is not good. Summary of the invention
[0004] Based on this, the embodiment of the present application provides a heat sink for an IGCT device, which can promptly remove excess heat, meet the heat dissipation requirements of the IGCT device, and ensure its safe operation. While playing a heat dissipation role, the heat dissipation device can ensure the safe passage of a large current of 2000A. The low thermal resistance of the heat sink can effectively reduce the additional power loss when the heat sink is running.
[0005] The present application provides a heat sink for an IGCT device, comprising:
[0006] The contact surfaces of the top and bottom of the outer side of the heat sink and the anode and cathode of the IGCT device are provided with external phase change materials, and the phase change materials are filled between the heat sink and the IGCT device;
[0007] The surface of the heat sink is an aluminum alloy shell, which is used to encapsulate the internal flow channel of the heat sink and serves as a conductive path to connect the phase change materials inside and outside the heat sink; the internal phase change material absorbs the heat of the phase change material in direct contact with the IGCT device through heat conduction;
[0008] The flow channel contacts the internal phase change material and is used to cool the internal material by a cooling medium.
[0009] Optionally, fins are added between the circulation channel and the internal phase change material to increase the heat transfer area, and the cooling medium efficiently takes away the heat of the fins through convection heat transfer and heat conduction.
[0010] Optionally, the amount of phase change material filling and the fin area on both sides of the top and bottom of the heat sink can be adjusted to ensure uniform heat transfer on both sides.
[0011] Optionally, the ribs are shaped like shovel-tooth ribs.
[0012] Optionally, the cooling medium includes at least water and helium.
[0013] Optionally, the side surface of the aluminum alloy shell has at least two openings for the inflow and outflow of cooling medium and the filling and replacement of phase change material.
[0014] Optionally, the radiator further includes an external heat dissipation device for receiving the heated cooling medium and cooling it down to achieve recycling of the cooling medium.
[0015] Optionally, the heat sink further includes a temperature sensor and a control system for monitoring the temperature of the IGCT device and the heat sink and automatically adjusting the flow rate and flow velocity of the cooling medium.
[0016] The beneficial effects brought by the technical solution provided by the embodiment of the present application include at least:
[0017] (1) By arranging phase change materials with different characteristics on both sides, the heat dissipation efficiency of the traditional water-cooled radiator is improved, and the heat generated inside the IGCT device can be quickly removed.
[0018] (2) The internal circulation channel does not adopt the traditional complex circulation channel design, but only lays fins to increase the heat transfer area. This method effectively reduces the difficulty and cost of equipment manufacturing, and at the same time overcomes the problem of using microchannel water cooling to dissipate heat. The water in the complex flow channel is easy to evaporate and produce gas, which then blocks the channel, resulting in local heat transfer deterioration.
[0019] (3) The shell is used to connect the inside and outside, and the internal flow channel is simple. This structural design can effectively reduce the amount of metal used and the size of the structure, effectively reduce the thermal resistance of the radiator during operation, and thus reduce energy loss. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] In order to more clearly illustrate the implementation methods of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for the implementation methods or the description of the prior art. Obviously, the drawings in the following description are only exemplary, and for ordinary technicians in this field, other implementation drawings can be derived from the provided drawings without creative work.
[0021] Figure 1 A schematic diagram of the overall structure of the radiator provided for this application;
[0022] Figure 2 This is a schematic diagram of the AA cross section of the radiator provided in this application. DETAILED DESCRIPTION
[0023] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.
[0024] In addition, the terms "comprises", "has" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or apparatus that includes a series of steps or units is not necessarily limited to those steps or units that have been explicitly listed, but may also include other steps or units that are not explicitly listed but are inherent to these processes, methods, products or apparatuses, or steps or units that are added based on further optimization schemes conceived by the present invention.
[0025] A water-cooled radiator is a radiator that uses water as a cooling medium. Its main function is to dissipate heat from core power electronic devices (IGCT) to keep these components operating within a safe junction temperature range. Compared to air cooling, water cooling has higher heat dissipation efficiency and can provide a more stable heat dissipation effect, so it is often used in scenarios that require high stability and high-performance computing. The existing technology usually designs circulation channels of different shapes. These circulation channels of different shapes are in contact with the IGCT device and absorb the heat inside the chip through heat conduction. The water in the circulation channel transfers the heat of the channel through convection exchange, thereby reducing the internal temperature of the IGCT.
[0026] Through research, we know that there are several water cooling flow channel methods on the market, and the advantages and disadvantages are shown in the following table.
[0027] Table 1 Investigation of internal flow channels of radiator
[0028]
[0029] Existing means are difficult to remove the excess heat of the IGCT device in time and thus achieve the heat dissipation effect. The present invention can remove the excess heat in time, meet the heat dissipation requirements of the IGCT device, and ensure its safe operation. While achieving the heat dissipation effect, the heat dissipation device can ensure the safe passage of a large current of 2000A. The low thermal resistance of the heat dissipation device can effectively reduce the additional power loss during the operation of the heat sink.
[0030] Specifically, please refer to Figure 1 , which shows a schematic diagram of the overall structure of a heat sink for an IGCT device provided in an embodiment of the present application, the heat sink includes an external phase change material, an aluminum alloy shell, an internal phase change material, a circulation channel and fins. The contact surfaces of the top and bottom of the outer side of the heat sink with the positive and negative poles of the IGCT device are provided with external phase change materials, and the phase change material is filled between the heat sink and the IGCT device to achieve efficient heat conduction. The surface of the heat sink is an aluminum alloy shell, which is used to encapsulate the internal circulation channel of the heat sink and serves as a conductive path to connect the phase change materials inside and outside the heat sink. The internal phase change material absorbs the heat of the phase change material in direct contact with the IGCT device through thermal conduction, and the circulation channel is in contact with the internal phase change material, which is used to cool the internal material through a cooling medium.
[0031] The top and bottom of the outer side of the radiator are in contact with the anode and cathode of the IGCT device with external phase change materials, which are filled between the radiator and the IGCT device; the surface of the radiator is an aluminum alloy shell, which is used to encapsulate the internal flow channel of the radiator and serve as a conductive path to connect the phase change materials inside and outside the radiator; the internal phase change material absorbs the heat of the phase change material in direct contact with the IGCT device through thermal conduction; the flow channel is in contact with the internal phase change material and is used to cool the internal material through a cooling medium.
[0032] In the embodiment of the present application, fins are added between the circulation channel and the internal phase change material to increase the heat transfer area, and the cooling medium efficiently removes the heat from the fins through convection heat transfer and heat conduction. The amount of phase change material filling and the fin area on both sides of the top and bottom of the radiator can be adjusted to ensure uniform heat transfer on both sides. The shape of the fins is a shovel-tooth fin.
[0033] The aluminum alloy shell has at least two openings on its side for the inflow and outflow of cooling medium and the filling and replacement of phase change material. The cooling medium includes water and helium. The radiator also includes an external heat dissipation device for receiving the heated cooling medium and cooling it to achieve the circulation of the cooling medium.
[0034] Optionally, the heat sink further includes a temperature sensor and a control system for monitoring the temperature of the IGCT device and the heat sink and automatically adjusting the flow rate and flow velocity of the cooling medium.
[0035] Specifically, Figure 1It is a schematic diagram of the overall structure of the radiator. The two sides of the radiator are respectively in contact with the anode and cathode of adjacent series-connected IGCT devices. The phase change material on the contact surface effectively fills the gap between the radiator and the IGCT device, and at the same time plays the role of taking away heat. The aluminum alloy shell encapsulates the internal flow channel of the radiator and connects the phase change materials on the inner and outer sides. The inner phase change material takes away the heat of the shell. Fins are added between the inner phase change material and the flow channel to increase the heat transfer area. The cooling medium efficiently takes away the heat on the fins and related contact surfaces through convective heat transfer and heat conduction. Due to the different heat generation amounts of the anode and cathode, the filling amounts of the phase change materials on both sides and the fin area can be adjusted according to the actual situation to ensure uniform heat transfer on both sides. After the cooling medium is heated, it is sent to an externally added heat dissipation device for cooling, and then enters the next working cycle. As Figure 2 shows Figure 1 the schematic diagram of the A-A cross-section of the radiator in
[0036] In summary, it can be seen that the key points of this application are as follows:
[0037] (1) Using a conductive phase change material to directly contact the anode and cathode to efficiently take away the heat generated by the two-side IGCT devices.
[0038] (2) Using an aluminum alloy shell to connect the phase change material and the phase change material inside the flow channel, and at the same time playing a conductive role.
[0039] (3) Using a phase change material without electrical conductivity inside the channel to directly contact the shell, and absorbing the heat of the phase change material directly contacting the IGCT device through heat conduction.
[0040] (4) Adding heat dissipation fins on the surface of the inner phase change material shell to increase the heat dissipation area and strengthen the heat transfer performance of the cooling fluid.
[0041] (5) Due to the different heat generation amounts of the anode and cathode of the IGCT device, the filling amounts of the phase change materials on both sides and the areas of the fins are different to ensure uniform heat transfer on both sides.
[0042] The technical features of the above-described embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope described in this specification.
[0043] The above-described embodiments only represent several implementation manners of this application. Their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the patent application. It should be noted that for those of ordinary skill in the art, without departing from the concept of this application, several modifications and improvements can still be made, and these all belong to the protection scope of this application. Therefore, the protection scope of this application patent should be subject to the appended claims.
Claims
1. A heat sink for an IGCT device, characterized in that: include: The contact surfaces of the top and bottom of the outer side of the heat sink and the anode and cathode of the IGCT device are provided with external phase change materials, and the phase change materials are filled between the heat sink and the IGCT device; The surface of the heat sink is an aluminum alloy shell, which is used to encapsulate the internal flow channel of the heat sink and serves as a conductive path to connect the phase change materials inside and outside the heat sink; the internal phase change material absorbs the heat of the phase change material in direct contact with the IGCT device through heat conduction; The flow channel contacts the internal phase change material and is used to cool the internal material by a cooling medium.
2. The heat sink according to claim 1, characterized in that: Fins are added between the flow channel and the internal phase change material to increase the heat transfer area, and the cooling medium efficiently takes away the heat of the fins through convection heat transfer and heat conduction.
3. The heat sink according to claim 2, characterized in that: The amount of phase change material filling and the fin area on both the top and bottom sides of the heat sink can be adjusted to ensure uniform heat transfer on both sides.
4. The heat sink according to claim 2, characterized in that: The shape of the fin is a shovel-tooth fin.
5. The heat sink according to claim 1, characterized in that The cooling medium includes at least water and helium.
6. The heat sink according to claim 1, characterized in that The side surface of the aluminum alloy shell is provided with at least two openings for the inflow and outflow of cooling medium and the filling and replacement of phase change material.
7. The heat sink according to claim 1, characterized in that: The radiator also includes an external heat dissipation device for receiving the heated cooling medium and cooling it down to achieve the circulation of the cooling medium.
8. The heat sink according to claim 7, characterized in that: The heat sink also includes a temperature sensor and a control system for monitoring the temperature of the IGCT device and the heat sink and automatically adjusting the flow rate and flow velocity of the cooling medium.