Display module and display device

Abstract

According to the display module and the display device, the display module comprises a display panel and a flexible circuit board, the display panel comprises a display area and a binding area located on one side of the display area in the first direction, and the flexible circuit board is connected with the binding area in a binding mode; the binding area comprises a first surface located on the light emitting side of the display panel and a second surface located on the backlight side of the display panel, the first surface is provided with a driving IC, and the second surface is connected with the flexible circuit board in a binding mode. The flexible circuit board is connected to the second surface of the binding area in a binding mode, the second surface is located on the backlight side of the display panel, and compared with the binding mode that the flexible circuit board is connected to the light emitting side of the display panel in a binding mode, the length of the area, stacked on the display panel, of the flexible circuit board can be omitted, and the display effect is improved. And a narrow frame can be further realized.

Description

Technical Field

[0001] The present invention relates to the technical field of display product manufacturing, and particularly relates to a display module and a display device. Background Art

[0002] In the mobile phone market, users pursue an ultimate visual experience, and the demand for narrow bezels is increasing. In order to further meet the requirement of reducing the bezel, based on the existing mass production design scheme, the bending radius of the FPC (flexible printed circuit board) has been continuously reduced from 1.0 mm @ max. However, currently, for the bonded connection between the flexible printed circuit board and the display panel, generally, the flexible printed circuit board is bonded and connected to the light-emitting side of the display panel. Such a bonding method limits the further narrowing of the bezel. Summary of the Invention

[0003] In order to solve the above technical problems, the present invention provides a display module and a display device.

[0004] To achieve the above object, the technical solution adopted in the embodiment of the present invention is: a display module, including a display panel and a flexible printed circuit board, the display panel includes a display area and a bonding area located on one side of the display area in a first direction, and the flexible printed circuit board is bonded and connected to the bonding area;

[0005] The bonding area includes a first surface located on the light-emitting side of the display panel and a second surface located on the backlight side of the display panel, a driving IC is disposed on the first surface, and the second surface is bonded and connected to the flexible printed circuit board.

[0006] Optionally, a first end of the flexible printed circuit board includes a first bonding pin bonded and connected to the bonding area, and a protective fixing glue is disposed between the first bonding pin and the bonding area.

[0007] Optionally, the display module includes a backlight structure opposite to the backlight side of the display panel, the flexible printed circuit board is bent to the side of the backlight structure away from the display panel to be connected to the main circuit board, and a support glue layer is filled between the flexible printed circuit board and the side surface of the backlight structure.

[0008] Optionally, the display panel includes a substrate and a plurality of functional layers stacked along a direction away from the substrate, the flexible printed circuit board and the bonding area are connected through a connection trace, and the connection trace is bonded and connected to a second bonding pin of the bonding area through a via hole penetrating through the substrate and the plurality of functional layers.

[0009] Optionally, the connection trace includes a plurality of connection lines disposed in different layers, and the plurality of connection lines are connected in parallel to form the connection trace.

[0010] Optionally, the multiple functional layers include a light-shielding metal layer, a gate metal layer, and a source-drain metal layer. The connection traces include a first connection line and a second connection line arranged in parallel. The first connection line and the second connection line are formed by using any two of the functional layers among the light-shielding metal layer, the gate metal layer, and the source-drain metal layer.

[0011] Optionally, the multiple functional layers include a light-shielding metal layer, a gate metal layer, and a source-drain metal layer. The connection traces include a first connection line, a second connection line, and a third connection line arranged in parallel. The first connection line is formed by using the light-shielding metal layer, the second connection line is formed by using the gate metal layer, and the third connection line is formed by using the source-drain metal layer.

[0012] Optionally, the first connection line and the second connection line are connected through a first via hole provided on a functional layer between the light-shielding metal layer and the gate metal layer, and the second connection line and the third connection line are connected through a second via hole provided on a functional layer between the gate metal layer and the source-drain metal layer;

[0013] The orthographic projection of the first via hole on the substrate and the orthographic projection of the second via hole on the substrate are at least partially overlapped.

[0014] Optionally, the first connection line and the second connection line are connected through a first via hole provided on a functional layer between the light-shielding metal layer and the gate metal layer, and the second connection line and the third connection line are connected through a second via hole provided on a functional layer between the gate metal layer and the source-drain metal layer;

[0015] The orthographic projection of the first via hole on the substrate and the orthographic projection of the second via hole on the substrate are non-overlapped.

[0016] Optionally, the orthographic projection of the first bonding pin of the flexible printed circuit board on the substrate at least partially overlaps with the orthographic projection of the first via hole and / or the second via hole on the substrate, or the orthographic projection of the first bonding pin of the flexible printed circuit board on the substrate does not overlap with the orthographic projections of the first via hole and the second via hole on the substrate.

[0017] An embodiment of the present invention further provides a display device, including the above display module.

[0018] The beneficial effects of the present invention are as follows: The flexible printed circuit board is bound and connected to the second surface of the binding area, and the second surface is located on the backlight side of the display panel. Compared with the binding method in which the flexible printed circuit board is bound and connected to the light-emitting side of the display panel, the length of the area where the flexible printed circuit board is stacked on the display panel can be omitted, and a narrow border can be further achieved. Description of the Drawings

[0019] Figure 1 Schematic diagram showing the display module in an embodiment of the present invention;

[0020] Figure 2 Schematic diagram showing the connection traces in an embodiment of the present invention;

[0021] Figure 3 Schematic diagram showing the connection traces in an embodiment of the present invention;

[0022] Figure 4 Schematic diagram showing the connection traces in an embodiment of the present invention. Detailed Embodiments

[0023] To make the objectives, technical solutions, and advantages of the embodiments of the present disclosure clearer, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present disclosure. Obviously, the described embodiments are some, but not all, of the embodiments of the present disclosure. All other embodiments obtained by those of ordinary skill in the art based on the described embodiments of the present disclosure without creative efforts shall fall within the scope of protection of the present disclosure.

[0024] Unless otherwise defined, the technical terms or scientific terms used in the present disclosure shall have the ordinary meanings understood by those of ordinary skill in the art to which the present disclosure pertains. The "first", "second", and similar terms used in the present disclosure do not denote any order, quantity, or importance, but are only used to distinguish different components. Similarly, the terms such as "a", "an", or "the" do not denote a quantity limitation, but mean that there is at least one. The terms such as "comprising" or "including" mean that the elements or items appearing before the term cover the elements or items listed after the term and their equivalents, without excluding other elements or items. The terms such as "connected" or "coupled" are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. The terms such as "upper", "lower", "left", "right", etc. are only used to represent relative positional relationships, and when the absolute position of the object being described changes, the relative positional relationship may also change accordingly.

[0025] In the embodiments of the present disclosure, features such as "parallel", "perpendicular", and "identical" used herein include the strict sense of "parallel", "perpendicular", "identical", etc., as well as cases with certain tolerances such as "substantially parallel", "substantially perpendicular", "substantially identical", etc. Considering measurement and tolerances associated with the measurement of a specific quantity (e.g., limitations of the measurement system), it means within an acceptable deviation range for a specific value determined by those of ordinary skill in the art. For example, "substantially" can mean within one or more standard deviations, or within 3% or 5% of the value.

[0026] In addition, in this document, unless otherwise defined, the terms "substantially", "essentially", "about", and "approximately" are used to describe and explain small variations. When used in conjunction with an event or situation, these terms can cover the case where the event or situation occurs precisely, as well as the case where the event or situation occurs approximately. For example, when used with a numerical value, these terms can include a variation range of less than or equal to 10% of the numerical value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, less than or equal to ±0.05%. The term "substantially coplanar" can mean that two surfaces are arranged in the same plane within a micron range, for example, arranged in the same plane within 40μm, 30μm, 20μm, 10μm, or 1μm.

[0027] In the related art, a display module includes a display panel and a flexible printed circuit board. The display panel includes a display area and a bonding area located on one side of the display area in a first direction. A driving IC is provided on the bonding area. The flexible printed circuit board is bonded to the bonding area, and the flexible printed circuit board and the driving IC are located on the same side of the display panel, that is, both the flexible printed circuit board and the driving IC are located on the light-emitting side of the display panel. With such a bonding method, a gap needs to be reserved between the driving IC and the flexible printed circuit board to avoid interference. The area where the flexible printed circuit board is superimposed on the display panel also occupies a certain space in the first direction. Therefore, the above-mentioned bonding method limits the realization of further narrow bezels.

[0028] Referring to Figures 1-4 , in view of the above problems, the present embodiment provides a display module, including a display panel 1 and a flexible printed circuit board 2. The display panel 1 includes a display area and a bonding area located on one side of the display area in a first direction. The flexible printed circuit board 2 is bonded to the bonding area;

[0029] The bonding area includes a first surface located on the light-emitting side of the display panel 1 and a second surface located on the backlight side of the display panel 1. The driving IC 11 is provided on the first surface, and the second surface is bonded to the flexible printed circuit board 2.

[0030] Bond the flexible printed circuit board 2 to the second surface of the bonding area. The second surface is located on the backlight side of the display panel 1. Compared with the bonding method in which the flexible printed circuit board 2 is bonded to the light-emitting side of the display panel 1, the flexible printed circuit board 2 and the driving IC 11 are located on different sides of the display panel 1. In this way, there is no need to reserve a gap between the driving IC 11 and the flexible printed circuit board 2 in the first direction. In some embodiments, the cancellation of this gap can reduce the widening by 0.2 mm. Moreover, the bonding method in this embodiment can also cancel the length of the area where the flexible printed circuit board 2 overlaps the display panel 1 in the first direction. In some embodiments, the cancellation of the length of the area where the flexible printed circuit board 2 overlaps the display panel 1 in the first direction can reduce the border by 0.3 mm. By adopting the bonding method provided in this embodiment, a narrower border can be further achieved.

[0031] In some embodiments, compared with the traditional bonding method, the lower border of the display module adopting the bonding method of this embodiment can be reduced by 0.38 mm, but this is not limited thereto.

[0032] In an exemplary embodiment, the first end of the flexible printed circuit board 2 includes a first bonding pin 21 that is bonded to the bonding area, and a protective fixing glue 3 is provided between the first bonding pin 21 and the bonding area.

[0033] The flexible printed circuit board 2 is bonded to the backlight side of the display panel 1. The flexible printed circuit board 2 needs to be bent to the backlight side of the display panel 1 to connect to the main circuit board located on the backlight side of the display panel 1. In order to prevent the separation between the flexible printed circuit board 2 and the display panel 1, a protective fixing glue 3 is provided between the first bonding pin 21 and the bonding area, effectively ensuring the connection stability between the flexible printed circuit board 2 and the bonding area, and preventing the invasion of water and oxygen.

[0034] In some embodiments, the protective fixing glue 3 is formed on the side of the display panel 1 after the flexible printed circuit board 2 is bonded to the bonding area and before bending, but this is not limited thereto.

[0035] In an exemplary embodiment, the display module includes a backlight structure 5 located on the backlight side of the display panel 1. The flexible printed circuit board 2 is bent to the side of the backlight structure 5 away from the display panel 1 to connect to the main circuit board, and a support glue layer 4 is filled between the flexible printed circuit board 2 and the side of the backlight structure 5.

[0036] In the traditional technology, the flexible printed circuit board 2 is bonded and connected to the light-emitting side of the display panel 1. The flexible printed circuit board 2 needs to wrap both the display panel 1 and the backlight structure 5 and be bent to the backlight side of the display panel 1. The bending radius is large, and the space occupied in the first direction is large. In this embodiment, the flexible printed circuit board 2 is bonded and connected to the backlight side of the display panel 1. When the flexible printed circuit board 2 is bent, it only needs to wrap the backlight structure 5, which can reduce the bending radius of the flexible printed circuit board 2, and further reduce the size of the space occupied by the bending area of the flexible printed circuit board 2 in the first direction, and further reduce the size of the border.

[0037] Exemplarily, in order to ensure the bending radius of the flexible printed circuit board 2 and reduce the influence of the rebound force of the flexible printed circuit board 2, a support glue layer 4 is filled between the side surface of the flexible printed circuit board 2 and the backlight structure 5.

[0038] In an exemplary implementation manner, the display panel 1 includes a substrate and a plurality of functional layers stacked in a direction away from the substrate. The flexible printed circuit board 2 and the bonding area are connected through a connection trace 30. The connection trace 30 is bonded and connected to the second bonding pin of the bonding area through a via hole penetrating the substrate and the plurality of functional layers.

[0039] In an exemplary implementation manner, in order to meet the resistance requirement of the connection trace 30, the connection trace 30 includes a plurality of connection lines arranged in different layers, and the plurality of connection lines are connected in parallel to form the connection trace 30.

[0040] In an exemplary implementation manner, the plurality of functional layers include a light-shielding metal layer, a gate metal layer, and a source-drain metal layer. The connection trace 30 includes a first connection line and a second connection line arranged in parallel. The first connection line and the second connection line are formed by using any two of the functional layers of the light-shielding metal layer, the gate metal layer, and the source-drain metal layer. For example, the first connection line is formed by using the light-shielding metal layer, and the second connection line is formed by using the gate metal layer; or, the first connection line is formed by using the light-shielding metal layer, and the second connection line is formed by using the source-drain metal layer; or, the first connection line is formed by using the gate metal layer, and the second connection line is formed by using the source-drain metal layer.

[0041] It should be noted that the first connection line can be formed by using the same material as the original film layer of the display module. In this way, the first connection line can be fabricated through the same lithography process while fabricating the corresponding film layer of the display panel 1, reducing the number of lithography processes for fabricating the display substrate. The second connection line can be formed by using the same material as the original film layer of the display module. In this way, the second connection line can be fabricated through the same lithography process while fabricating the corresponding film layer of the display panel 1, reducing the number of lithography processes for fabricating the display substrate.

[0042] It should be noted that, referring to Figure 2 , along the direction away from the substrate (Glass) 101, the multiple functional layers sequentially include a light-shielding metal layer (LS) 102, a buffer layer (Buffer) 103, a gate insulating layer (GI) 104, a gate metal layer (gate) 105, an interlayer insulating layer (ILD) 106, a source-drain metal layer (SD) 107, and a passivation layer (PVX) 108. The first connection line and the second connection line are connected through vias in the functional layers disposed between the corresponding two metal layers.

[0043] In an exemplary embodiment, the multiple functional layers include a light-shielding metal layer 102, a gate metal layer 105, and a source-drain metal layer 107. The connection trace 30 includes a first connection line 301, a second connection line 302, and a third connection line 303 arranged in parallel. The first connection line 301 is formed by using the light-shielding metal layer 102, the second connection line 302 is formed by using the gate metal layer 105, and the third connection line 303 is formed by using the source-drain metal layer 107.

[0044] The connection trace 30 adopts a first connection line 301, a second connection line 302, and a third connection line 303 arranged in parallel, further reducing the resistance of the connection trace 30.

[0045] In an exemplary embodiment, the first connection line 301 and the second connection line 302 are connected through a first via 201 on the functional layer disposed between the light-shielding metal layer 102 and the gate metal layer 105, and the second connection line 302 and the third connection line 303 are connected through a second via 202 on the functional layer disposed between the gate metal layer 105 and the source-drain metal layer 107.

[0046] The orthographic projection of the first via 201 on the substrate 101 and the orthographic projection of the second via 202 on the substrate 101 are at least partially overlapped.

[0047] In an exemplary embodiment, the first connection line 301 and the second connection line 302 are connected through a first via 201 disposed on a functional layer between the light-shielding metal layer 102 and the gate metal layer 105, and the second connection line 302 and the third connection line 303 are connected through a second via 202 disposed on a functional layer between the gate metal layer 105 and the source / drain metal layer 107;

[0048] The orthographic projection of the first via 201 on the substrate 101 and the orthographic projection of the second via 202 on the substrate 101 are non-overlappingly arranged.

[0049] Figure 3 A schematic diagram showing that the orthographic projection of the first bonding pin 21 of the flexible printed circuit board 2 on the substrate completely overlaps with the orthographic projections of the first via 201 and the second via 202 on the substrate. Figure 4 A schematic diagram showing that the orthographic projection of the first bonding pin 21 of the flexible printed circuit board 2 on the substrate does not overlap at all with the orthographic projections of the first via 201 and the second via 202 on the substrate.

[0050] In an exemplary embodiment, the orthographic projection of the first bonding pin 21 of the flexible printed circuit board 2 on the substrate at least partially overlaps with the orthographic projections of the first via 201 and / or the second via 202 on the substrate, or the orthographic projection of the first bonding pin 21 of the flexible printed circuit board 2 on the substrate does not overlap with the orthographic projections of the first via 201 and the second via 202 on the substrate.

[0051] In an exemplary embodiment, the first via 201 and / or the second via 202 may be an oval via, a circular via or a rectangular via. When the first via 201 and / or the second via 202 is an oval via, it means that the cross-section of the first via 201 and / or the second via 202 in the direction parallel to the substrate is oval. When the first via 201 and / or the second via 202 is a circular via, it means that the cross-section of the via in the direction parallel to the substrate is circular. When the first via 201 and / or the second via 202 is a rectangular via, it means that the cross-section of the via in the direction parallel to the substrate is rectangular. There is no limitation here.

[0052] In an exemplary embodiment, the parallel connection of the first connection line and the second connection line can be achieved through a jumper design between the light-shielding metal layer and the source / drain metal layer to meet the resistance requirement of the connection trace 30.

[0053] Exemplarily, the display panel includes a first substrate and a second substrate which are arranged in a pair. The first substrate includes a single-layer board area exposed outside the second substrate, and the bonding area is disposed on the single-layer board area.

[0054] Exemplarily, the first substrate is an array substrate, and the manufacturing method of the array substrate is as follows:

[0055] S1: Provide a substrate;

[0056] S2: Form a light-shielding metal layer on the substrate;

[0057] S3: Form a buffer layer on a side of the light-shielding metal layer away from the substrate;

[0058] S4: Form an active layer on a side of the buffer layer away from the substrate;

[0059] S5: Form a gate insulating layer on a side of the active layer away from the substrate;

[0060] S6: Form a gate metal layer on a side of the gate insulating layer away from the substrate, and form gate lines and gates through a patterning process;

[0061] S7: Form an interlayer insulating layer on a side of the gate metal layer away from the substrate;

[0062] S8: Form a source / drain metal layer on a side of the interlayer insulating layer away from the substrate, and form data lines and source / drain electrodes through a patterning process, wherein the source / drain electrodes are connected to the active layer through vias;

[0063] S9: Form a passivation layer on a side of the source / drain metal layer away from the substrate.

[0064] The substrate can be a transparent substrate, for example, a quartz substrate, a glass substrate or an organic resin substrate.

[0065] The material of the gate metal layer can be a metal such as molybdenum (Mo), aluminum (Al), copper (Cu) or an alloy of the above metals.

[0066] The gate insulating layer can be a combination of one or more of a silicon nitride (SiNx) film layer, a silicon oxide (SiOx) film layer, and a silicon oxynitride (SiON) film layer, which functions as insulation, barrier and planarization.

[0067] The material of the source / drain metal layer can be a single-layer or multi-layer composite stack formed by one or more of Mo, Al, Cu and titanium (Ti), preferably a single-layer or multi-layer composite film composed of Mo, Al or an alloy containing Mo and Al.

[0068] The material of the passivation layer can be polyimide, silicon nitride, aluminum oxide, etc.

[0069] In some embodiments, the first connection line can be made of the light-shielding metal layer. Then, in step S2, the light-shielding metal layer located in the display area and the first connection line are formed through a synchronous process.

[0070] The second connection line can be made of the gate metal layer. Then, in step S6, the gate line, the gate electrode, and the second connection line are formed through a synchronous patterning process. The second connection line is connected to the first connection line through a via hole.

[0071] In some embodiments, the first connection line can be made of the light-shielding metal layer. Then, in step S2, the light-shielding metal layer located in the display area and the first connection line are formed through a synchronous process.

[0072] The second connection line can be made of the source-drain metal layer. Then, in step S8, the data line, the source-drain electrode, and the second connection line are formed through a patterning process. The second connection line is connected to the first connection line through a via hole.

[0073] In some embodiments, the first connection line can be made of the gate metal layer. Then, in step S6, the gate line, the gate electrode, and the first connection line are formed through a synchronous patterning process.

[0074] The second connection line can be made of the source-drain metal layer. Then, in step S8, the data line, the source-drain electrode, and the second connection line are formed through a patterning process. The second connection line is connected to the first connection line through a via hole.

[0075] In some embodiments, the first connection line can be made of the light-shielding metal layer. Then, in step S2, the light-shielding metal layer located in the display area and the first connection line are formed through a synchronous process.

[0076] The second connection line can be made of the gate metal layer. Then, in step S6, the gate line, the gate electrode, and the second connection line are formed through a synchronous patterning process. The second connection line is connected to the first connection line through a via hole.

[0077] The third connection line can be made of the source-drain metal layer. Then, in step S8, the data line, the source-drain electrode, and the third connection line are formed through a patterning process. The third connection line is connected to the first connection line through a via hole, and the third connection line is connected to the second connection line through a via hole.

[0078] An embodiment of the present invention further provides a display device, including the above-mentioned display module.

[0079] The display device includes, but is not limited to: a radio frequency unit, a network module, an audio output unit, an input unit, a sensor, a display unit, a user input unit, an interface unit, a memory

[0080] , a processor, and components such as a power supply. Those skilled in the art can understand that the structure of the above display device does not constitute a limitation on the display device. The display device may include more or fewer of the above components, or combine some components, or have different component arrangements. In the embodiments of the present invention, the display device includes, but is not limited to, a display, a mobile phone, a tablet computer, a television, a wearable electronic device, a navigation display device, etc.

[0081] The display device may be: a television, a display, a digital photo frame, a mobile phone, a tablet computer, or any product or component with a display function.

[0082] In addition, embodiments of the present disclosure provide an electronic device, including a memory, a processor, and one or more programs stored in the memory and executable on the processor. When the one or more programs are executed by the processor, the electronic device executes the silicon wafer picking and placing method as described above.

[0083] In one embodiment, the present disclosure also provides a computer-readable storage medium, on which a computer program is stored. When the computer program is executed by a processor, the steps in the above method embodiments are implemented.

[0084] For the above computer-readable storage medium, since the computer program stored in its memory implements the steps in the above method embodiments when executed by the processor, similarly, the beneficial effects brought by the above silicon wafer picking and placing method can be obtained, which will not be elaborated here.

[0085] Those of ordinary skill in the art can understand that all or part of the processes in the methods of the above embodiments can be completed by instructing relevant hardware through a computer program. The computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above methods. Among them, any reference to a memory, storage, database, or other medium used in the embodiments provided in the present application can include at least one of non-volatile and volatile memories. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, or optical memory, etc. Volatile memory can include random access memory (RAM) or external cache memory. By way of illustration and not limitation, RAM can be in various forms, such as static random access memory (SRAM) or dynamic random access memory (DRAM), etc.

[0086] The following points need to be explained:

[0087] (1) The accompanying drawings of the embodiments of the present disclosure only relate to the structures involved in the embodiments of the present disclosure, and other structures can refer to the usual designs.

[0088] (2) For clarity, in the accompanying drawings used to describe the embodiments of the present disclosure, the thickness of layers or regions is enlarged or reduced, that is, these drawings are not drawn to actual scale. It can be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" or "under" another element, the element can be "directly" on or under the other element or there can be intermediate elements.

[0089] (3) Without conflict, the embodiments of the present disclosure and the features in the embodiments can be combined with each other to obtain new embodiments.

[0090] It can be understood that the above embodiments are merely exemplary embodiments adopted to illustrate the principles of the present invention, but the present invention is not limited thereto. For those of ordinary skill in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also regarded as the protection scope of the present invention.

Claims

1. A display module, characterized in that: It comprises a display panel and a flexible circuit board, wherein the display panel comprises a display area and a binding area located on one side of the display area in a first direction, and the flexible circuit board is bound and connected to the binding area; The binding area includes a first surface located on the light emitting side of the display panel and a second surface located on the backlight side of the display panel. The first surface is provided with a driver IC, and the second surface is bound and connected to the flexible circuit board.

2. The display module according to claim 1, characterized in that: The first end of the flexible circuit board includes a first binding pin that is bound and connected to the binding area, and a protective fixing glue is arranged between the first binding pin and the binding area.

3. The display module according to claim 1, characterized in that: The display module includes a backlight structure located opposite the backlight side of the display panel. The flexible circuit board is bent to the side of the backlight structure away from the display panel to connect with the main circuit board. A supporting glue layer is filled between the flexible circuit board and the side of the backlight structure.

4. The display module according to claim 1, characterized in that: The display panel includes a base substrate and multiple functional layers stacked in a direction away from the base substrate. The flexible circuit board and the binding area are connected by a connecting wire, and the connecting wire is bound and connected to the second binding pin of the binding area through a via hole that penetrates the base substrate and the multiple functional layers.

5. The display module according to claim 4, characterized in that: The connecting wires include a plurality of connecting wires arranged in different layers, and the plurality of connecting wires are connected in parallel to form the connecting wires.

6. The display module according to claim 4, characterized in that: The multiple functional layers include a shading metal layer, a gate metal layer and a source-drain metal layer. The connecting wiring includes a first connecting wire and a second connecting wire arranged in parallel. The first connecting wire and the second connecting wire are formed by using any two functional layers among the shading metal layer, the gate metal layer and the source-drain metal layer.

7. The display module according to claim 4, characterized in that: The multiple functional layers include a shading metal layer, a gate metal layer and a source-drain metal layer. The connecting lines include a first connecting line, a second connecting line and a third connecting line arranged in parallel. The first connecting line is formed by using the shading metal layer, the second connecting line is formed by using the gate metal layer, and the third connecting line is formed by using the source-drain metal layer.

8. The display module according to claim 7, characterized in that: The first connection line and the second connection line are connected through a first via hole provided on a functional layer between the light shielding metal layer and the gate metal layer, and the second connection line and the third connection line are connected through a second via hole provided on a functional layer between the gate metal layer and the source-drain metal layer; The orthographic projection of the first via hole on the base substrate and the orthographic projection of the second via hole on the base substrate are at least partially overlapped.

9. The display module according to claim 7, characterized in that: The first connection line and the second connection line are connected through a first via hole provided on a functional layer between the light shielding metal layer and the gate metal layer, and the second connection line and the third connection line are connected through a second via hole provided on a functional layer between the gate metal layer and the source-drain metal layer; The orthographic projection of the first via hole on the base substrate and the orthographic projection of the second via hole on the base substrate are arranged to be non-overlapping.

10. The display module according to claim 8 or 9, characterized in that: The orthographic projection of the first binding pin of the flexible circuit board on the substrate substrate at least partially overlaps with the orthographic projection of the first via hole and / or the second via hole on the substrate substrate, or the orthographic projection of the first binding pin of the flexible circuit board on the substrate substrate does not overlap with the orthographic projection of the first via hole and the second via hole on the substrate substrate.

11. A display device, characterized in that: A display module comprising any one of claims 1-10.

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