A distributed DTU terminal device

Abstract

The present invention belongs to the technical field of DTU terminals, and discloses a distributed DTU terminal device, which includes an inner housing and an outer housing arranged in a sealed manner. A circuit board is provided inside the inner housing. Negative pressure suction ports are provided on both the left and right sides of the inner housing, and the negative pressure suction ports are arranged opposite to the circuit board. An air return port is provided on the upper side of the inner housing; the outer housing is arranged outside the inner housing and at least completely covers the negative pressure suction ports and the air return port of the inner housing; a cooling chamber communicated with the air return port is provided on the outer housing, and a refrigeration component is provided in the cooling chamber; the negative pressure suction ports on both sides are respectively communicated with the left and right side inlets of the cooling chamber through a connecting air duct, and a negative pressure fan is provided in each connecting air duct. The present invention realizes two-way internal circulation under the action of the negative pressure fan, making the heat distribution inside the inner housing more uniform; the circulated air returns to the inner housing after being cooled to cool the circuit board and the components on the circuit board.

Description

Technical Field

[0001] The present invention belongs to the technical field of DTU terminals, and particularly relates to a distributed DTU terminal device. Background Art

[0002] A DTU (Data Transmission Unit) is a unit used to transmit data between networks. It can transmit data from one network to another, thereby achieving cross-network data transmission. DTUs can be divided into distributed DTUs and centralized DTUs. A distributed DTU is a distributed data transmission unit that allows multiple nodes to share data, thereby achieving cross-network data transmission. The advantage of a distributed DTU is that it can be distributed on multiple nodes, thereby improving the efficiency of data transmission and automatically synchronizing data.

[0003] In actual use, distributed DTU terminal devices have requirements for dust prevention and waterproofing. Therefore, small distributed DTU terminal devices are often designed to be enclosed. However, in a high-temperature environment, the heat of the circuit board inside the DTU terminal device is not easily dissipated. Local overheating during use in a high-temperature environment will shorten the service life of components, and too high a temperature may cause changes in electrical performance. At the same time, uneven heat distribution may lead to solder joint failure. Currently, DTU terminal devices also have heat dissipation holes provided on the housing, which dissipate heat on the premise of sacrificing the waterproof level, and at the same time, the problem of dust prevention cannot be solved. Dust accumulation is likely to occur during long-term use, affecting the use. Summary of the Invention

[0004] The present invention aims to solve the above technical problems at least to a certain extent. For this purpose, the present invention aims to provide a distributed DTU terminal device.

[0005] The technical solution adopted by the present invention is as follows:

[0006] A distributed DTU terminal device includes an inner housing. A circuit board is provided inside the inner housing. An antenna is provided on the upper side of the inner housing, and an interface is provided on the lower side. Both the antenna and the interface are connected to the circuit board. It also includes an outer housing that is hermetically arranged. Negative pressure suction ports are provided on both the left and right sides of the inner housing, which are arranged opposite to the circuit board. An air return port is provided on the upper side of the inner housing. The outer housing is arranged outside the inner housing and at least completely covers the negative pressure suction ports and the air return port of the inner housing. A cooling chamber communicating with the air return port is provided on the outer housing, and a refrigeration component is provided inside the cooling chamber. The negative pressure suction ports on both sides are respectively connected to the left and right side inlets of the cooling chamber through a connecting air duct, and a negative pressure fan is provided in each connecting air duct. Temperature sensors are respectively provided on the left and right sides inside the inner housing, and the temperature sensors are electrically connected to the negative pressure fans. The control module is electrically connected to the temperature sensors, the negative pressure fans, and the refrigeration component respectively. When the temperature collected by the temperature sensor on one side reaches the threshold value, the control module controls the corresponding negative pressure fan on that side to start and controls the refrigeration component to start. After both negative pressure fans on both sides are started, the control module controls and adjusts the corresponding rotation speeds of the negative pressure fans on both sides according to the different temperatures of the temperature sensors on both sides.

[0007] Preferably, a flow disturbing component is floatingly arranged inside the inner housing. The flow disturbing component is arranged opposite to the air return port, and an exhaust fan is provided at the air return port. An installation cylinder is provided inside the inner housing. Guide grooves are provided on the inner wall of the installation cylinder. The flow disturbing component includes a flow disturbing ring slidably installed on the guide grooves and flow disturbing strips staggered inside the flow disturbing ring. The cross-section of the flow disturbing strips gradually becomes larger and then smaller along the air flow direction. An elastic member is provided in the guide grooves. A slider is provided on the outer wall of the flow disturbing ring, and the slider is installed in the guide grooves and contacts the elastic member.

[0008] Preferably, an adjusting component is provided at the negative pressure suction port, and the adjusting component is used to adjust the opening size of the negative pressure suction port. The negative pressure suction port is rectangular. The adjusting component includes a plurality of adjusting plates provided inside the side wall of the inner housing and locking screws provided on the adjusting plates. A limiting groove is provided on the inner housing corresponding to each adjusting plate, and the locking screws are arranged through the limiting grooves.

[0009] Preferably, the refrigeration component includes a semiconductor refrigeration sheet, a first heat sink group provided on the refrigeration end of the semiconductor refrigeration sheet, and a second heat sink group provided on the heating end of the semiconductor refrigeration sheet. The first heat sink group is located inside the cooling chamber, and the second heat sink group is located outside the outer housing.

[0010] Preferably, heat dissipation mounting plates are provided on both the left and right sides of the outer housing. A third heat sink group is provided on the front surface of the heat dissipation mounting plate, and mounting holes are provided on the heat dissipation mounting plate.

[0011] The beneficial effects of the present invention are as follows:

[0012] A distributed DTU terminal device provided by the present invention, on the premise of ensuring the overall sealing of the device, realizes two-way internal circulation under the action of a negative pressure fan by arranging two connecting air ducts for air internal circulation, making the heat distribution inside the inner housing more uniform; the circulated air returns to the inner housing after being cooled to cool the circuit board and the components on the circuit board; by controlling the rotation speed of the negative pressure fan, targeted cooling can be carried out on the locally overheated parts. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 is a schematic diagram of the distributed DTU terminal device of the present invention.

[0014] Figure 2 is a cross-sectional view of the distributed DTU terminal device of the present invention.

[0015] Figure 3 is a schematic diagram of the flow disturbance component of the present invention.

[0016] Figure 4 is a cross-sectional view of the flow disturbance strip of the present invention.

[0017] Figure 5 is a side view of the circuit board of the present invention.

[0018] Figure 6 is a side view of the inner housing of the present invention.

[0019] Figure 7 is a schematic diagram of the distributed DTU terminal device in another embodiment.

[0020] In the figure: 1 - inner housing; 2 - circuit board; 3 - antenna; 4 - interface; 5 - outer housing; 6 - negative pressure suction port; 7 - air return port; 8 - cooling chamber; 9 - connecting air duct; 10 - negative pressure fan; 11 - slider; 12 - mounting cylinder; 13 - guide groove; 14 - flow disturbance ring; 15 - flow disturbance strip; 16 - adjusting plate; 17 - locking screw; 18 - limiting groove; 19 - semiconductor refrigeration sheet; 20 - first heat sink group; 21 - second heat sink group; 22 - heat insulation layer; 23 - heat dissipation mounting plate; 24 - third heat sink group; 25 - mounting hole. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0021] The embodiments of the present invention will be described in detail below. The examples of the embodiments are shown in the drawings, where the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described by referring to the drawings here are exemplary and are intended to explain the present invention and should not be construed as limiting the present invention. The components of the embodiments of the present invention described and shown in the drawings here can be arranged and designed in various different configurations.

[0022] Such as Figure 1 、Figure 2 and Figure 5 As shown in Figure 5 , a distributed DTU terminal device according to this embodiment mainly includes an inner housing 1, an outer housing 5, and a control module. The inner housing 1 is arranged approximately airtight, with only one negative pressure suction port 6 provided on each of the left and right sides of the inner housing 1 and an air return port 7 provided on the upper side of the inner housing 1. A circuit board 2 is provided inside the inner housing 1. The negative pressure suction ports 6 are arranged opposite to both sides of the circuit board 2. An antenna 3 is provided on the upper side of the inner housing 1, and an interface 4 is provided on the lower side. Both the antenna 3 and the interface 4 are connected to the circuit board 2. The interface 4 is used to access power and data communication.

[0023] The outer housing 5 is arranged airtight. The outer housing 5 is arranged outside the inner housing 1 and completely covers the negative pressure suction ports 6 and the air return port 7 of the inner housing 1, so that the inner housing 1 and the outer housing 5 form a hermetically arranged structure as a whole, meeting the usage requirements of waterproof and dustproof. A cooling chamber 8 communicated with the air return port 7 is provided on the outer housing 5, and a refrigeration component is provided inside the cooling chamber 8. The negative pressure suction ports 6 on both sides are respectively communicated with the left and right side inlets of the cooling chamber 8 through a connecting air duct 9, that is, the negative pressure suction port 6 on the left is communicated with the left inlet of the cooling chamber 8 through a connecting air duct 9, and the negative pressure suction port 6 on the right is communicated with the right inlet of the cooling chamber 8 through a connecting air duct 9. A negative pressure fan 10 is provided in each connecting air duct 9.

[0024] As Figure 5 shown, a large number of components are soldered on the circuit board 2. The sizes and heights of these components are different, and the heat generated is also different. For example, the chip on the circuit board 2 has a large area but a low height and generates a large amount of heat. The thermal distribution of the circuit board 2 can be simulated through thermal analysis software. When the air in the inner housing 1 enters the connecting air duct 9, the air should be made to pass through the circuit board 2 and the components as much as possible, especially through the parts with large heat generation, so as to take away the heat as much as possible. This can make the thermal distribution of the circuit board 2 more uniform and the temperature drop faster at the same time.

[0025] Temperature sensors are respectively provided on the left and right sides inside the inner housing 1, mainly used to monitor the temperatures on the left and right sides of the circuit board 2. The control module is electrically connected to the temperature sensors, the negative pressure fans 10, and the refrigeration component respectively. The two temperature sensors are normally open, and the negative pressure fans 10 and the refrigeration component are normally closed. The temperature sensors collect the temperature inside the inner housing 1 in real time. When the temperatures collected by the temperature sensors on both sides have a temperature difference, and the temperature difference is greater than the set temperature difference, it means that the thermal distribution on both sides is uneven. The control module controls the negative pressure fans 10 on both sides to start, forming a negative pressure in both connecting air ducts. The air on the left and right sides inside the inner housing 1 respectively passes through the circuit board 2 and the components on the circuit board 2 and enters the connecting air duct, and finally enters the inner housing 1 from the air return port 7. Through the continuous circulation of the air, until the temperature difference is less than the set temperature difference, the control module controls the negative pressure fans 10 on both sides to close. In this mode, the refrigeration component does not start.

[0026] In another mode, when the temperature collected by the temperature sensor on one side reaches the threshold value, it means that the temperature on this side is too high and the thermal distribution on both sides is uneven. The control module controls the negative pressure fan 10 on the corresponding side to start, and at the same time controls the refrigeration component to start. A negative pressure is formed in the connecting air duct on this side, and the air inside the inner shell 1 passes through the circuit board 2 on this side and the components on the circuit board 2 on this side and enters the connecting air duct on this side, and then enters the cooling chamber 8 to be cooled and then enters the inner shell 1 from the return air outlet 7, so that the inside of the inner shell 1 can be cooled as a whole, and the side with a higher temperature is cooled more significantly. Thus, the thermal distribution is made uniform through air circulation and finally the temperature collected by the temperature sensor is lower than the threshold value.

[0027] In yet another mode, when the temperatures collected by the temperature sensors on both sides reach the threshold value, the control module controls the negative pressure fans 10 on both sides to start, and at the same time controls the refrigeration component to start. The control module adjusts the corresponding rotational speeds of the negative pressure fans 10 on both sides in real time according to the differences in the temperature sensors on both sides. One control logic is that the ratio of the rotational speeds of the negative pressure fans 10 on both sides is equal to the ratio of the temperatures collected by the temperature sensors on both sides, so that the rotational speed of the negative pressure fan 10 on the side with a higher temperature is faster, making the air flow rate in the connecting air duct 9 on this side faster, and being able to take away more heat on this side, making the temperatures on both sides more evenly distributed after cooling.

[0028] In order to further disrupt the cold air returning from the return air outlet 7 into the inner shell 1, so that it can be more evenly distributed inside the inner shell 1 and come into contact with the circuit board 2 and the components on the circuit board 2, a flow disturbing component is floatingly arranged inside the inner shell 1. The flow disturbing component is arranged opposite to the return air outlet 7. The flow disturbing component can effectively disrupt the passing air and form a turbulent flow, making the temperature inside the inner shell 1 more uniform.

[0029] An installation cylinder 12 is arranged inside the inner shell 1. The installation cylinder 12 is cylindrical. Two symmetrically distributed guide grooves 13 are arranged on the inner wall of the installation cylinder 12. The guide grooves 13 are respectively located on the left and right sides of the inner wall of the installation cylinder 12. As Figure 3 shown, the flow disturbing component includes a flow disturbing ring 14 and flow disturbing strips 15. The flow disturbing ring 14 is cylindrical. The outer wall diameter of the flow disturbing ring 14 is smaller than the inner wall diameter of the installation cylinder 12. Two sliders 11 are symmetrically arranged on the outer wall of the flow disturbing ring 14. The sliders 11 are respectively installed in the guide grooves 13 in a one-to-one correspondence. Two flow disturbing strips 15 are arranged in a crosswise manner inside the flow disturbing ring 14. As Figure 4 shown, the flow disturbing strips 15 are of a hollow structure. The width of the cross section of the flow disturbing strips 15 becomes larger from small and then smaller along the air flow direction. The flow disturbing strips 15 divide the inner space of the flow disturbing ring 14 into four structures similar to Venturi tubes. When the air flows through the flow disturbing strips 15, it is squeezed and the flow rate increases, and it can be dispersed more quickly after entering the inner shell 1. In order to further disrupt the air, the flow disturbing strips 15 can be arranged obliquely.

[0030] An elastic member is provided in the guide groove 13. The slider 11 is installed in the guide groove 13 and contacts the elastic member. In this embodiment, one elastic member is provided in each guide groove 13. One end of the elastic member contacts the lower surface of the slider 11, and the other end contacts the lower end of the guide groove 13. Since the spoiler strip 15 is impacted by air, the spoiler assembly will move downward in the guide groove 13 and compress the elastic member. And when the rotational speeds of the two negative pressure fans 10 are different, the wind speeds of the air entering the spoiler assembly from the left and right are different and will change with the adjustment of the rotational speed of the negative pressure fan 10, resulting in different degrees of compression of the elastic members on both sides, and the spoiler assembly shows a tendency to swing left and right, thereby further disturbing the air.

[0031] Since the sizes and heights of the components on the circuit board 2 are different, in order to make the air pass through the circuit board 2 and the corresponding components as much as possible, an adjustment assembly is provided at the negative pressure suction port 6. The adjustment assembly is used to adjust the opening size of the negative pressure suction port 6, so that the opening of the negative pressure suction port 6 matches the shape of the circuit board 2 and the components on the circuit board 2.

[0032] As Figure 6 shown, the negative pressure suction port 6 is rectangular. The adjustment assembly includes adjustment plates 16 and locking screws 17. There are multiple adjustment plates 16, and each adjustment plate 16 is arranged adjacent to each other in sequence. Each adjustment plate 16 is slidably installed inside the side wall of the inner housing 1. Each adjustment plate 16 is provided with a locking screw 17, and the inner housing 1 is provided with a limit groove 18 opposite to each adjustment plate 16, and the locking screw 17 passes through the limit groove 18. When assembling the distributed DTU terminal device, according to the different models of the circuit board 2, move the corresponding adjustment plate 16 up and down, and then tighten the locking screw 17 to fix the adjustment plate 16, so that part of the negative pressure suction port 6 is closed, and the unclosed part matches the shape of the circuit board 2 and the components on the circuit board 2.

[0033] In this embodiment, the refrigeration assembly includes a semiconductor refrigeration chip 19, a first heat sink group 20, and a second heat sink group 21. The first heat sink group 20 is provided at the refrigerating end of the semiconductor refrigeration chip 19, and the second heat sink group 21 is provided at the heating end of the semiconductor refrigeration chip 19. The first heat sink group 20 is located in the cooling chamber 8, and the second heat sink group 21 is located outside the outer housing 5; the air entering the cooling chamber 8 exchanges heat with the first heat sink group 20 and then its temperature drops, and then returns to the inner housing 1 through the return air port 7. The second heat sink group 21 can dissipate the heat on the heating end of the semiconductor refrigeration chip 19 to the outside. In order to further increase the heat dissipation effect, a cooling fan is provided on the second heat sink group 21. The semiconductor refrigeration chip 19 and the cooling fan are both electrically connected to the control module.

[0034] A heat conduction silicone grease layer is provided between the first heat sink group 20 and the semiconductor refrigeration chip 19, and a heat conduction silicone grease layer is also provided between the second heat sink group 21 and the semiconductor refrigeration chip 19. The heat conduction silicone grease layer can increase the heat conduction efficiency. In order to minimize the heat transfer from the second heat sink group 21 to the outer housing 5, heat insulation layers 22 are provided at all the parts where the second heat sink group 21 contacts the outer housing 5.

[0035] As Figure 7 shown, in another embodiment, heat dissipation mounting plates 23 are provided on both the left and right sides of the outer housing 5. A third heat sink group 24 is provided on the front surface of the heat dissipation mounting plate 23. Mounting holes 25 are provided on the heat dissipation mounting plate 23, which facilitate the installation and fixation of the distributed DTU terminal device. Since the relatively hot air inside the inner housing 1 transfers some heat to the outer housing 5 when passing through the connection air duct 9, the third heat sink group 24 on the heat dissipation mounting plate 23 also contacts the outer wall of the connection air duct 9, and can dissipate this part of the heat to the outside more quickly.

[0036] The present invention is not limited to the above optional embodiments. Anyone can obtain other various forms of products under the inspiration of the present invention. However, no matter what changes are made in its shape or structure, as long as the technical solutions fall within the scope defined by the claims of the present invention, they are all within the protection scope of the present invention.

Claims

1. A distributed DTU terminal device, comprising an inner housing (1), a circuit board (2) is provided inside the inner housing (1), an antenna (3) is provided on the upper side of the inner housing (1), an interface (4) is provided on the lower side, and both the antenna (3) and the interface (4) are connected to the circuit board (2); characterized in that: The invention also comprises a sealed outer shell (5), wherein the left and right sides of the inner shell (1) are provided with negative pressure air intake ports (6), the negative pressure air intake ports (6) are arranged opposite to the circuit board (2), and the upper side of the inner shell (1) is provided with a return air port (7); the outer shell (5) is arranged outside the inner shell (1) and at least completely covers the negative pressure air intake port (6) and the return air port (7) of the inner shell (1); the outer shell (5) is provided with a cooling chamber (8) connected to the return air port (7), and a refrigeration component is arranged in the cooling chamber (8); the negative pressure air intake ports (6) on both sides are respectively connected to the left and right inlets of the cooling chamber (8) through a connecting air duct (9), and each connecting air duct (9) is provided with a negative pressure fan (10); the left and right sides of the inner shell (1) are respectively provided with temperature sensors, and the temperature sensors are electrically connected to the negative pressure fan (10); the control module is electrically connected to the temperature sensor, the negative pressure fan (10) and the refrigeration component respectively; when the temperature sensor on one side is When the temperature collected by the sensor reaches a threshold value, the control module controls the negative pressure fan (10) on the corresponding side to start, and controls the refrigeration component to start; when the negative pressure fans (10) on both sides are started, the control module adjusts the corresponding rotation speeds of the negative pressure fans (10) on both sides according to the different controls of the temperature sensors on both sides; a spoiler component is provided in a floating manner inside the inner shell (1), and the spoiler component is arranged opposite to the return air port (7); a mounting cylinder (12) is provided inside the inner shell (1), and a guide groove (13) is provided on the inner wall of the mounting cylinder (12); the spoiler component includes a spoiler ring (14) slidably mounted on the guide groove (13) and spoiler strips (15) staggered in the spoiler ring (14), and the cross section of the spoiler strips (15) changes from small to large and then to small along the air flow direction; an elastic member is provided in the guide groove (13), and a slider (11) is provided on the outer wall of the spoiler ring (14), and the slider (11) is installed in the guide groove (13) and contacts with the elastic member.

2. The distributed DTU terminal device according to claim 1, characterized in that: The negative pressure air intake port (6) is provided with an adjustment component, and the adjustment component is used to adjust the opening size of the negative pressure air intake port (6).

3. The distributed DTU terminal device according to claim 2, characterized in that: The negative pressure air inlet (6) is rectangular, and the adjustment component comprises a plurality of adjustment plates (16) arranged inside the side wall of the inner shell (1) and locking screws (17) arranged on the adjustment plates (16). A limiting groove (18) is provided on the inner shell (1) relative to each adjustment plate (16), and the locking screw (17) is arranged through the limiting groove (18).

4. The distributed DTU terminal device according to claim 1, characterized in that: The refrigeration component comprises a semiconductor refrigeration plate (19), a first heat sink group (20) provided on the cooling end of the semiconductor refrigeration plate (19), and a second heat sink group (21) provided on the heating end of the semiconductor refrigeration plate (19), wherein the first heat sink group (20) is located in the cooling chamber (8), and the second heat sink group (21) is located outside the outer shell (5).

5. The distributed DTU terminal device according to claim 1 or 4, characterized in that: The outer shell (5) is provided with heat dissipation mounting plates (23) on both left and right sides, a third heat dissipation fin group (24) is provided on the front side of the heat dissipation mounting plate (23), and a mounting hole (25) is provided on the heat dissipation mounting plate (23).

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