Display panel, manufacturing method thereof and gray scale mask

Abstract

The invention discloses a display panel, a manufacturing method of the display panel and a gray scale mask. The display panel comprises a bending area arranged on one side, far away from a display area, of a non-display area; a substrate; the display panel is arranged in a display area and a non-display area; the plurality of display units are arranged in the display area; the first touch lead is arranged in the bending area; the packaging layer is arranged on one side, far away from the substrate, of the display unit; the packaging layer extends from the display area to the non-display area and covers the display area and the bending area, the packaging layer located in the bending area comprises a through hole, the packaging layer comprises a thinning part surrounding the through hole and a packaging part surrounding the thinning part, and the thickness of the thinning part is smaller than that of the packaging part; the touch layer and the second touch lead are arranged on the side, away from the substrate, of the packaging layer; the second touch lead is electrically connected with the touch layer, extends to the bending area and is electrically connected with the first touch lead through the through hole. According to the invention, the first touch lead is prevented from being separated from the second touch lead, and the yield of the display panel is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of display panels, and particularly to a display panel, a manufacturing method thereof, and a grayscale mask. Background Art

[0002] With the development of display technology, curved display panels are increasingly widely used. However, the existing curved display panels are prone to touch failure. Summary of the Invention

[0003] The present invention provides a display panel, a manufacturing method thereof, and a grayscale mask to avoid the separation of the first touch lead and the second touch lead and improve the yield of the display panel.

[0004] According to one aspect of the present invention, a display panel is provided. The display panel includes:

[0005] A display area and a non-display area provided on at least one side of the display area; the non-display area includes a bending area provided on the side of the non-display area away from the display area;

[0006] A substrate provided in the display area and the non-display area;

[0007] A plurality of display units provided in the display area;

[0008] A first touch lead provided in the bending area; and

[0009] An encapsulation layer provided on the side of the display unit away from the substrate; the encapsulation layer extends from the display area to the non-display area, covering the display area and the bending area. The encapsulation layer in the bending area includes a through hole. The encapsulation layer includes a thinning portion surrounding the through hole and an encapsulation portion provided around the thinning portion. The thickness of the thinning portion is less than the thickness of the encapsulation portion; a touch layer and a second touch lead provided on the side of the encapsulation layer away from the substrate; the second touch lead is electrically connected to the touch layer, and the second touch lead extends to the bending area and is electrically connected to the first touch lead through the through hole.

[0010] Further, the thickness of the thinning portion is equal to the thickness of the encapsulation portion, or the thickness of the thinning portion gradually decreases along the direction from the thinning portion to the through hole.

[0011] Further, the thickness of the thinning portion linearly decreases or decreases stepwise along the direction from the thinning portion to the through hole.

[0012] Further, the angle between the side wall and the bottom surface of the through hole is greater than 90 degrees;

[0013] The angle between the side surface of the other area of the encapsulation portion connected to the thinning area and the surface of the thinning portion away from the substrate is greater than 90 degrees.

[0014] Further, the thickness of the thinning portion along the first direction is less than or equal to 6.9 μm, where the first direction is the direction pointing from the substrate to the encapsulation portion.

[0015] Further, the width of the thinning portion along the second direction is 5 - 10 μm, where the second direction is the direction pointing from the encapsulation portion to the through hole.

[0016] Further, the encapsulation portion includes at least two inorganic layers and at least one organic layer. The at least two inorganic layers extend from the display area to the non - display area, covering the display area and the bending area. The through hole is provided in the at least two inorganic layers.

[0017] Optionally, the non - display area further includes a bonding area. The bonding area is provided on the side of the bending area away from the display area. The bonding area includes a plurality of bonding pins, and the first touch lead is electrically connected to the bonding pins.

[0018] Optionally, in the display area, a plurality of metal layers are provided between the display unit and the substrate. The first touch lead is provided on the same layer as one of the metal layers and uses the same material.

[0019] Optionally, the touch layer includes a plurality of touch electrodes. The encapsulation portion includes a plurality of through holes. On the side of the encapsulation portion away from the substrate, there are a plurality of second touch leads. The second touch leads correspond to the through holes one by one. Each second touch lead is electrically connected to a first touch lead through a through hole, and different touch electrodes are connected to different second touch leads.

[0020] According to another aspect of the present invention, a manufacturing method of a display panel is provided. The display panel includes a display area and a non - display area provided on at least one side of the display area. The non - display area includes a bending area provided on the side of the non - display area away from the display area. The manufacturing method includes:

[0021] Providing a substrate; the substrate is provided in the display area and the non - display area;

[0022] Setting a plurality of display units in the display area;

[0023] Setting a first touch lead in the bending area;

[0024] Setting an encapsulation layer on the side of the display unit away from the substrate. The encapsulation layer extends from the display area to the non - display area, covering the display area and the bending area. The encapsulation layer located in the bending area is etched through a gray - scale mask to form a through hole, a thinning portion surrounding the through hole, and an encapsulation portion provided around the thinning portion, where the thickness of the thinning portion is less than the thickness of the encapsulation portion.

[0025] Setting a touch layer and second touch leads on the side of the encapsulation layer away from the substrate; the second touch leads are electrically connected to the touch layer, the second touch leads extend to the bending area, and are electrically connected to the first touch leads through the through holes.

[0026] Further, according to another aspect of the present invention, a grayscale mask is provided for forming the display panel described in any of the above embodiments, including:

[0027] Etching through-holes and a shielding strip region surrounding the etching through-holes; the shielding strip region includes a plurality of shielding strips arranged at intervals; wherein, the grayscale mask is used for patterning the encapsulation layer of the display panel, the etching through-holes are used to form the through-holes, and the shielding strip region is used to form the thinning portion.

[0028] Further, the width range of the shielding strips in the shielding strip region is 0.75 - 1.1 μm;

[0029] The spacing range between two adjacent shielding strips in the shielding strip region is 0.75 - 1.1 μm;

[0030] Optionally, the spacing between two adjacent shielding strips gradually increases in the third direction, or the spacing between two adjacent shielding strips is equal, and any two adjacent shielding strips are parallel to each other; wherein, the third direction is the direction pointing from the shielding strip region to the etching through-hole;

[0031] Optionally, all the shielding strips in the shielding strip region are parallel to each other, or the shielding strip region includes a first region and a second region. The first region includes a plurality of first shielding strips, and the second region includes a plurality of second shielding strips. The first shielding strips extend along a fourth direction, and the second shielding strips extend along a fifth direction. The first region is located on both sides of the etching through-hole along the fourth direction, and the second region is located on both sides of the etching through-hole along the fifth direction. The fourth direction and the fifth direction are perpendicular to each other.

[0032] In the display panel provided by the embodiment of the present invention, by providing a thinning portion at a position surrounding the through-hole in the encapsulation layer of the bending region, such that the thickness of the thinning portion is less than the thickness of the encapsulation portion, the stress magnitude at the position near the through-hole at the bottom of the encapsulation layer in the thinning portion is effectively reduced. Furthermore, it can effectively prevent the position near the through-hole at the bottom of the encapsulation layer in the thinning portion from warping, and further effectively prevent the separation of the first touch lead and the second touch lead, avoid the failure of touch signal transmission, avoid touch failure, and improve the yield of the display panel.

[0033] It should be understood that the content described in this part is not intended to identify the key or important features of the embodiments of the present invention, nor is it used to limit the scope of the present invention. Other features of the present invention will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for the description of the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0035] Figure 1 is a partial structural schematic diagram of a display panel in the prior art;

[0036] Figure 2 is a partial structural schematic diagram of another display panel in the prior art;

[0037] Figure 3 is a structural schematic diagram of a display panel provided according to an embodiment of the present invention;

[0038] Figure 4 is Figure 3 a cross-sectional structural schematic diagram along the A-A' direction;

[0039] Figure 5 is Figure 4 a magnified structural schematic diagram of the S1 region in;

[0040] Figure 6 is Figure 4 another magnified structural schematic diagram of the S1 region in;

[0041] Figure 7 is Figure 4 yet another magnified structural schematic diagram of the S1 region in;

[0042] Figure 8 is Figure 4 still another magnified structural schematic diagram of the S1 region in;

[0043] Figure 9 is Figure 3 a magnified structural schematic diagram of the M1 region in;

[0044] Figure 10 is Figure 4 a magnified structural schematic diagram of the S1 region in;

[0045] Figure 11 is a flowchart of a manufacturing method of a display panel provided according to an embodiment of the present invention;

[0046] Figure 12 is a structural schematic diagram of a grayscale mask provided according to an embodiment of the present invention;

[0047] Figure 13 is a structural schematic diagram of another grayscale mask provided according to an embodiment of the present invention;

[0048] Figure 14 is a structural schematic diagram of yet another grayscale mask provided according to an embodiment of the present invention;

[0049] Figure 15 is a structural schematic diagram of still another grayscale mask provided according to an embodiment of the present invention. Detailed implementation manners

[0050] To enable those skilled in the art to better understand the solution of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0051] It should be noted that the terms "first", "second", etc. in the description and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged under appropriate circumstances so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "comprising" and "having" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device comprising a series of steps or units does not necessarily have to be limited to those steps or units clearly listed, but may include other steps or units not clearly listed or inherent to these processes, methods, products or devices.

[0052] Figure 1 is a partial structural schematic diagram of a display panel in the prior art Figure 2 is a partial structural schematic diagram of another display panel in the prior art. Refer to Figure 1 and Figure 2 , because the encapsulation layer 03 in the display panel is too thick, the encapsulation layer 03 on both sides of the formed wire-changing hole 01 is too thick, and then the stress at the position of the bottom of the encapsulation layer 03 close to the wire-changing hole 01 is relatively large. During the environmental reliability test, the position of the bottom of the encapsulation layer 03 close to the wire-changing hole 01 is likely to warp, and then the touch lead 02 is separated from the metal layer 04 at the bottom of the encapsulation layer 03, resulting in the inability to transmit signals between the touch lead 02 and the metal layer 04 and causing touch failure.

[0053] Based on the above problems, the embodiments of the present invention provide a display panel Figure 3 is a structural schematic diagram of a display panel provided according to an embodiment of the present invention Figure 4 is Figure 3 a cross-sectional structural schematic diagram along the A-A' direction Figure 5 is Figure 4 a magnified structural schematic diagram of the S1 area in Figures 3 - 5 , the display panel includes:[[]]

[0054] A display area 11 and a non-display area 12 disposed on at least one side of the display area 11; the non-display area 12 includes a bending area 121, and the bending area 121 is disposed on a side of the non-display area 12 away from the display area 11; a substrate 1; disposed in the display area 11 and the non-display area 12; a plurality of display units 2, disposed in the display area 11; a first touch lead 4, disposed in the bending area 121; and a packaging layer 3 disposed on a side of the display unit 2 away from the substrate 1; the packaging layer 3 extends from the display area 11 to the non-display area 12, covering the display area 11 and the bending area 121, the packaging layer 3 located in the bending area 121 includes a through hole 31, the packaging layer 3 includes a thinning portion 32 surrounding the through hole 31 and a packaging portion 33 disposed around the thinning portion 32, and the thickness of the thinning portion 32 is less than the thickness of the packaging portion 33; a touch layer 5 and a second touch lead 6 disposed on a side of the packaging portion 33 away from the substrate 1; the second touch lead 6 is electrically connected to the touch layer 5, the second touch lead 6 extends to the bending area 121, and is electrically connected to the first touch lead 4 through the through hole 31.

[0055] Among them, the display area 11 is used for displaying a picture, and the non-display area 12 does not display a picture. At least one side can be understood as one side or more than one side. Exemplarily, the non-display area 12 surrounds the display area 11. The display panel can be a flexible display panel or a curved screen with at least one curved edge. Exemplarily, the bending area 121 can be disposed on one side, two sides or multiple sides of the display area 11. Exemplarily, the bending area 121 can be disposed on opposite sides of the display area 11. At this time, the two opposite edges of the display panel are curved display panels, or the bending area 121 is disposed around the display area 11. At this time, the display panel is a display panel with all four edges being curved. The display unit 2 can be an organic light-emitting display unit, a liquid crystal display unit, or an inorganic light-emitting display unit. The packaging layer 3 is used to protect the display unit 2 and prevent the display unit 2 from being eroded by water and oxygen. The non-display area 12 can also include a touch chip. The touch chip can be disposed on a side of the bending area 121 away from the display area 11. The touch chip is electrically connected to the first touch lead 4. The touch chip is used to send a touch signal to the touch layer 5 and receive the touch signal sent by the touch layer 5. Exemplarily, the touch layer 5 includes a sensing electrode 51 and a driving electrode 52. The touch chip is used to send a touch driving signal to the driving electrode 52 and receive the touch sensing signal sent by the sensing electrode 51, and determine the touch position according to the touch driving signal and the touch sensing signal.

[0056] Specifically, a halftone mask or a grayscale mask can be used to etch the encapsulation layer 3 in the bending area 121 to form an encapsulation layer 3 having a through hole 31, a thinning portion 32 surrounding the through hole 31, and an encapsulation portion 33 disposed around the thinning portion 32. By providing the thinning portion 32 at a position surrounding the through hole 31 in the encapsulation layer 3, the stress magnitude at the position of the bottom of the encapsulation layer 3 close to the through hole 31 can be effectively reduced, thereby effectively preventing the bottom of the encapsulation layer 3 close to the through hole 31 from warping, preventing the separation of the first touch lead 4 and the second touch lead 6, and preventing the failure of touch signal transmission. The thickness of the thinning portion 32 can be set to be equal everywhere, or it can be set such that the thickness of the thinning portion 32 gradually decreases in the direction pointing from the thinning portion 32 to the through hole 31. The embodiments of the present invention do not limit this.

[0057] In the display panel provided by the embodiment of the present invention, by providing the thinning portion 32 at a position surrounding the through hole 31 in the encapsulation layer 3 of the bending area 121, such that the thickness of the thinning portion 32 is less than the thickness of the encapsulation portion 33, the stress magnitude at the position of the bottom of the encapsulation layer 3 in the thinning portion 32 close to the through hole 31 is effectively reduced, thereby effectively preventing the bottom of the encapsulation layer 3 in the thinning portion 32 close to the through hole 31 from warping, further effectively preventing the separation of the first touch lead 4 and the second touch lead 6, preventing the failure of touch signal transmission, preventing touch failure, and improving the yield of the display panel.

[0058] Based on the above embodiments, optionally, Figure 6 Yes Figure 4 is another enlarged structural schematic diagram of the S1 area in Figure 5 , the thickness of the thinning portion 32 is equal, or, referring to Figure 6 , in the direction of the thinning portion 32 pointing to the through hole 31, the thickness of the thinning portion 32 gradually decreases.

[0059] Specifically, by setting the thickness of the thinning portion 32 to be equal, the manufacturing process difficulty of the encapsulation layer 3 can be reduced on the premise of ensuring that the bottom of the encapsulation layer 3 in the thinning portion 32 close to the through hole 31 does not warp and preventing the separation of the first touch lead 4 and the second touch lead 6 from causing touch signal transmission failure.

[0060] By setting that in the direction of the thinning portion 32 pointing to the through hole 31, the thickness of the thinning portion 32 gradually decreases, the stress received by the thinning portion 32 can be further reduced, further preventing the encapsulation layer 3 from warping, preventing the separation of the first touch lead 4 and the second touch lead 6 from causing touch failure, and further improving the yield of the display panel.

[0061] Based on the above embodiments, optionally, Figure 7 Yes Figure 4 is yet another enlarged structural schematic diagram of the S1 area in Figure 6, along the direction from the thinning portion 32 to the through hole 31, the thickness of the thinning portion 32 decreases linearly, or, with reference to Figure 7 , the thickness of the thinned portion 32 is reduced stepwise.

[0062] Specifically, the thickness of the thinned portion 32 decreases linearly, which means that the thickness of the thinned portion 32 decreases continuously, and the surface of the thinned portion 32 away from the substrate 1 is an inclined plane. The thickness of the thinned portion 32 decreases in steps, that is, the thickness of the thinned portion 32 decreases in steps, and the surface of the thinned portion 32 away from the substrate 1 is a stepped surface.

[0063] By setting the thickness of the thinned portion 32 to decrease in a stepwise or linear manner, the thickness of the thinned portion 32 is uniformly reduced, further reducing the stress on the thinned portion 32, avoiding the encapsulation layer 3 from warping, and avoiding the first touch lead 4 from being separated from the second touch lead 6 to cause touch failure. At the same time, the thinned portion 32 with a stepwise or linearly reduced thickness is easier to manufacture, which can reduce the difficulty of the manufacturing process of the display panel.

[0064] Based on the above embodiment, optionally, refer to Figure 5 , the angle α1 between the side wall of the through hole 31 and the bottom surface of the through hole 31 is greater than 90 degrees;

[0065] An angle α2 between the side surface of the packaging portion 33 connected to the thinning portion 32 and the surface of the thinning portion 32 away from the substrate 1 is greater than 90 degrees.

[0066] Specifically, the second touch lead 6 extends from the surface of the thinned portion 32 away from the substrate 1 along the side wall of the through hole 31 to the bottom of the through hole 31, and the angle α1 between the side wall of the through hole 31 and the bottom surface of the through hole 31 is set to be greater than 90 degrees, so that the second touch lead 6 extends smoothly to the bottom of the through hole 31, avoiding the occurrence of dead corners, reducing the stress of the second touch lead 6 at the intersection of the bottom surface and the side wall of the through hole 31, avoiding the second touch lead 6 from warping due to stress, avoiding the separation of the first touch lead 4 and the second touch lead 6, avoiding the failure of touch signal transmission, and improving the yield of the display panel.

[0067] The angle α2 between the side surface where the packaging portion 33 and the thinning area 32 are connected and the surface of the thinning portion 32 away from the substrate 1 is greater than 90 degrees, so that the second touch lead 6 extends smoothly to the surface of the thinning portion 32 away from the substrate 1, avoiding the occurrence of dead angles, reducing the stress of the second touch lead 6 at the intersection of the surface of the thinning portion 32 away from the substrate 1 and the side surface where the packaging portion 33 and the thinning portion 32 are connected, avoiding the second touch lead 6 from being warped due to stress at the surface of the thinning portion 32 away from the substrate 1, and further avoiding the second touch lead 6 from being warped at the intersection of the bottom surface and the side wall of the through hole 31 due to the joint effect, avoiding the first touch lead 4 and the second touch lead 6 from being separated, avoiding the failure of touch signal transmission, and improving the yield of the display panel.

[0068] Based on the above embodiments, optionally, continue to refer to Figure 5 , the thickness h1 of the thinning portion 32 in the first direction is less than or equal to 6.9 μm; wherein, the first direction is the direction from the substrate 1 to the encapsulation portion 33.

[0069] Specifically, when the thickness h1 of the thinning portion 32 is too thick, the stress cannot be reduced well, and warping cannot be avoided well. By setting the thickness h1 of the thinning portion 32 in the first direction to be less than or equal to 6.9 μm, the thickness difference between the thinning portion 32 and the encapsulation portion 33 can be reduced to a large extent, effectively avoiding warping at the position of the bottom of the encapsulation layer 3 in the thinning portion 32 near the through hole 31, thereby avoiding the separation of the first touch lead 4 and the second touch lead 6, avoiding the failure of touch signal transmission, and improving the yield of the display panel. Exemplarily, the thickness h1 of the thinning portion 32 can be 6 μm, 5 μm, 4 μm, etc.

[0070] Based on the above embodiments, optionally, continue to refer to Figure 5 , the width h2 of the thinning portion 32 in the second direction is 5 - 10 μm; wherein, the second direction is the direction from the encapsulation portion 33 to the through hole 31.

[0071] Specifically, when the width h2 of the thinning portion 32 in the second direction is too small, on the one hand, the manufacturing process is difficult, and on the other hand, the stress of the thinning portion 32 cannot be reduced well, and warping cannot be avoided well. By setting the width h2 of the thinning portion 32 in the second direction to be 5 - 10 μm, while reducing the manufacturing process difficulty of the encapsulation layer 3, the stress of the thinning portion 32 can be effectively reduced, avoiding warping at the position of the bottom of the thinning portion 32 near the through hole 31, thereby avoiding the separation of the first touch lead 4 and the second touch lead 6, avoiding the failure of touch signal transmission, and improving the yield of the display panel.

[0072] Based on the above embodiments, optionally, Figure 8 Yes Figure 4 Another enlarged structural schematic diagram of the S1 area in Figure 8 , the encapsulation layer 3 includes at least two inorganic layers and at least one organic layer, the at least two inorganic layers extend from the display area 11 to the non-display area 12, cover the display area 11 and the bending area 121, and the through hole 31 is arranged in the at least two inorganic layers.

[0073] Among them, at least two layers can be understood as two or more layers. Exemplarily, the encapsulation layer 3 of the embodiments of the present invention may include two inorganic layers, namely a first inorganic layer 34 and a second inorganic layer 35. At least one organic layer can be understood as one or more layers. The encapsulation layer 3 may include one organic layer, and the organic layer is disposed between the first inorganic layer 34 and the second inorganic layer 35. The organic layer extends from the display area to one side of the bending area adjacent to the display area. After the encapsulation layer 3 is prepared, the first inorganic layer 34 and the second inorganic layer 35 may be etched to form a thinning portion 32 and a through hole 31.

[0074] Optionally, referring to Figure 3 , the non-display area 12 further includes a bonding area. The bonding area is disposed on the side of the bending area 121 away from the display area 11. The bonding area includes a plurality of bonding pins 1221, and the first touch lead 4 is electrically connected to the bonding pins 1221.

[0075] Among them, a plurality can be understood as two or more. The number of bonding pins 1221 in the bonding area can be set according to actual situations. The bonding pins 1221 are used to bond a driving chip, and the driving chip can be reused as a touch chip.

[0076] Optionally, in the display area, a plurality of metal layers are disposed between the display unit and the substrate. The first touch lead is disposed on the same layer as one of the metal layers and uses the same material.

[0077] Specifically, a plurality can be understood as at least two. The number of metal layers between the display unit and the substrate can be set according to actual situations. The plurality of metal layers may include a gate layer, a capacitor plate layer, a data line layer, a power line layer, etc. Exemplarily, the first touch lead may be disposed on the same layer as the data line or on the same layer as the power line.

[0078] Optionally, Figure 9 is Figure 3 an enlarged structural schematic diagram of the M1 area in Figure 3 , Figure 4 , Figure 5 and Figure 9 , the touch layer 5 includes a plurality of touch electrodes, the encapsulation layer 3 includes a plurality of through holes 31, and on the side of the encapsulation layer 3 away from the substrate 1, there are a plurality of second touch leads 6. The second touch leads 6 and the through holes 31 correspond one by one. Each second touch lead 6 is electrically connected to a first touch lead 4 through a through hole 31, and different touch electrodes are connected to different second touch leads 6.

[0079] Specifically, the touch layer 5 includes a plurality of sensing electrodes 51 and a plurality of driving electrodes 52. The sensing electrodes 51 are electrically connected to the corresponding first touch leads 4 through the second touch leads 6 and the through holes 31, and the plurality of driving electrodes 52 are electrically connected to the corresponding first touch leads 4 through the second touch leads 6 and the through holes 31.

[0080] Optionally, Figure 10 is Figure 4 Another enlarged structural schematic diagram of the S1 area in Figure 10 , the touch layer 5 further includes an insulating layer 7, and the insulating layer 7 is disposed between the second touch lead 6 and the encapsulation layer 3.

[0081] An embodiment of the present invention provides a method for manufacturing a display panel. Figure 11 is a flowchart of a method for manufacturing a display panel according to an embodiment of the present invention. Refer to Figure 11 , the display panel includes a display area and a non-display area disposed on at least one side of the display area; the non-display area includes a bending area, and the bending area is disposed on a side of the non-display area away from the display area. The manufacturing method includes:

[0082] S110, providing a substrate; the substrate is disposed in the display area and the non-display area.

[0083] S120, disposing a plurality of display units in the display area.

[0084] S130, disposing a first touch lead in the bending area.

[0085] S140, disposing an encapsulation layer on a side of the display unit away from the substrate. The encapsulation layer extends from the display area to the non-display area, covering the display area and the bending area. The encapsulation layer located in the bending area is etched through a gray-scale mask to form a through hole, a thinning portion surrounding the through hole, and an encapsulation portion disposed around the thinning portion. Wherein, the thickness of the thinning portion is less than the thickness of the encapsulation portion.

[0086] Specifically, a photoresist needs to be prepared first on a side of the encapsulation layer located in the bending area away from the substrate, and the photoresist is exposed and developed according to the gray-scale mask. Then, the encapsulation layer located in the bending area is etched through the gray-scale mask to form a through hole, a thinning portion surrounding the through hole, and an encapsulation portion disposed around the thinning portion.

[0087] S150, disposing a touch layer and a second touch lead on a side of the encapsulation layer away from the substrate; the second touch lead is electrically connected to the touch layer, and the second touch lead extends to the bending area and is electrically connected to the first touch lead through the through hole.

[0088] In the manufacturing method corresponding to the display panel provided by the embodiment of the present invention, by disposing a thinning portion around the position of the through hole in the encapsulation layer of the bending area, such that the thickness of the thinning portion is less than the thickness of the encapsulation portion, the stress magnitude at the position near the through hole at the bottom of the encapsulation layer in the thinning portion is effectively reduced, thereby effectively avoiding the warping of the position near the through hole at the bottom of the encapsulation layer in the thinning portion, further effectively avoiding the separation of the first touch lead and the second touch lead, avoiding the failure of touch signal transmission, avoiding touch failure, and improving the yield of the display panel.

[0089] An embodiment of the present invention provides a gray - scale mask. Figure 12 It is a schematic structural diagram of a gray - scale mask provided according to an embodiment of the present invention. Refer to Figure 5 and Figure 12 , which is used to form the display panel described in any of the above - mentioned embodiments. The gray - scale mask 8 includes:

[0090] An etching through - hole 81 and a shielding strip region 82 surrounding the etching through - hole 31; the shielding strip region 82 includes a plurality of shielding strips 821 arranged at intervals; wherein, the gray - scale mask 8 is used to pattern the encapsulation layer 3 of the display panel, the etching through - hole 31 is used to form the through - hole 81, and the shielding strip region 821 is used to form the thinning portion 32.

[0091] Specifically, in the gray - scale mask 8 (Gray Tone Mask, GTM), the larger the distance between two adjacent shielding strips 821, the smaller the thickness h1 of the thinning portion 32 in the first direction, and the smaller the distance between two adjacent shielding strips, the larger the thickness h1 of the thinning portion 32 in the first direction; the smaller the width of the shielding strip 821, the smoother the surface of the thinning portion 32 away from the substrate 1, and the larger the width of the shielding strip 821, the rougher the surface of the thinning portion 32 away from the substrate 1. Therefore, the etching pattern of the thinning portion 32 can be adjusted by adjusting the width of the shielding strip 821 and the distance between two adjacent shielding strips 821.

[0092] Furthermore, continue to refer to Figure 5 and Figure 12 , the width range of the shielding strip 821 in the shielding strip region 82 is 0.75 - 1.1 μm;

[0093] The distance range between two adjacent shielding strips 821 in the shielding strip region 82 is 0.75 - 1.1 μm.

[0094] Specifically, by setting both the width of the shielding strip 821 and the distance between two adjacent shielding strips 821 in the shielding strip region 82 within the range of 0.75 - 1.1 μm, the thickness of the thinning portion 32 can be effectively reduced, avoiding the warping of the position of the bottom of the thinning portion 32 close to the through - hole 31, thereby avoiding the separation of the first touch lead 4 and the second touch lead 6, and further avoiding the failure of touch signal transmission, and improving the yield of the display panel.

[0095] On the basis of the above - mentioned embodiment, optionally, Figure 13 It is a schematic structural diagram of another gray - scale mask provided according to an embodiment of the present invention, Figure 14 It is a schematic structural diagram of yet another gray - scale mask provided according to an embodiment of the present invention, Figure 15 It is a schematic structural diagram of still another gray - scale mask provided according to an embodiment of the present invention. Refer to Figures 12 - 15 , as Figure 13As shown, the distance between two adjacent light-shielding bars 821 gradually increases in the third direction. Alternatively, as Figure 12 and Figure 14 shown, the distance between two adjacent light-shielding bars 821 is equal, and any two adjacent light-shielding bars 821 are parallel to each other; wherein, the third direction is the direction from the light-shielding bar region 82 to the etching through-hole 81.

[0096] Specifically, if the distance between two adjacent light-shielding bars 821 gradually and uniformly increases in the third direction, a display panel with a linearly decreasing thickness of the thinning portion 32 as shown in Figure 6 can be formed at this time; if the distance between two adjacent light-shielding bars 821 gradually increases in the third direction, and at least one node has a sudden change in the distance during the process of the gradual increase in the distance, a display panel with a stepwise decreasing thickness of the thinning portion 32 as shown in Figure 7 can be formed at this time.

[0097] It is also possible to set the distance between two adjacent light-shielding bars 821 to be equal, and all the light-shielding bars 821 in the light-shielding bar region 82 are parallel to each other. At this time, a display panel with an equal thickness of the thinning portion 32 as shown in Figure 5 can be formed.

[0098] Optionally, as Figure 12 and Figure 14 shown, all the light-shielding bars 821 in the light-shielding bar region 82 are parallel to each other. Alternatively, as Figure 15 shown, the light-shielding bar region 82 includes a first region 822 and a second region 823. The first region 822 includes a plurality of first light-shielding bars 8221, and the second region 823 includes a plurality of second light-shielding bars 8231. The first light-shielding bars 8221 extend along the fourth direction X, and the second light-shielding bars 8231 extend along the fifth direction Y. The first region 822 is located on both sides of the etching through-hole 81 along the fourth direction X, and the second region 823 is located on both sides of the etching through-hole 81 along the fifth direction Y. The fourth direction X and the fifth direction Y are perpendicular to each other.

[0099] Exemplarily, the etching through-hole 81 is quadrilateral, including a first side, a second side, a third side, and a fourth side that are sequentially adjacent. The fourth direction X is the direction from the first side to the third side, and the fifth direction Y is the direction from the second side to the fourth side.

[0100] It should be understood that the various forms of the processes shown above can be used, and the steps can be reordered, added, or deleted. For example, the steps described in the present invention can be executed in parallel, sequentially, or in a different order, as long as the desired results of the technical solution of the present invention can be achieved, and no limitation is made herein.

[0101] The above specific embodiments do not constitute a limitation on the protection scope of the present invention. Those skilled in the art should understand that various modifications, combinations, sub-combinations and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions and improvements made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A display panel, characterized in that: include: a display area and a non-display area disposed on at least one side of the display area; The non-display area includes a bending area, and the bending area is arranged on a side of the non-display area away from the display area; substrate; Set in the display area and the non-display area; A plurality of display units are arranged in the display area; A first touch lead, disposed in the bending area; as well as A packaging layer is arranged on a side of the display unit away from the substrate; the packaging layer extends from the display area to the non-display area, covering the display area and the bending area, the packaging layer located in the bending area includes a through hole, the packaging layer includes a thinning portion surrounding the through hole and a packaging portion arranged around the thinning portion, and the thickness of the thinning portion is less than the thickness of the packaging portion; a touch layer and a second touch lead are arranged on a side of the packaging layer away from the substrate; the second touch lead is electrically connected to the touch layer, the second touch lead extends to the bending area, and is electrically connected to the first touch lead through the through hole.

2. The display panel according to claim 1, characterized in that: The thickness of the thinned portion is equal, or the thickness of the thinned portion gradually decreases along the direction from the thinned portion to the through hole.

3. The display panel according to claim 2, characterized in that: Along the direction of the thinned portion pointing toward the through hole, the thickness of the thinned portion decreases linearly, or the thickness of the thinned portion decreases in steps.

4. The display panel according to claim 2, characterized in that: The angle between the side wall of the through hole and the bottom surface of the through hole is greater than 90 degrees; An angle between a side surface of the packaging portion connected to the thinning portion and a surface of the thinning portion away from the substrate is greater than 90 degrees.

5. The display panel according to claim 1, characterized in that: The thickness of the thinned portion along a first direction is less than or equal to 6.9 μm; wherein the first direction is a direction from the substrate to the packaging portion.

6. The display panel according to claim 1, characterized in that: The width of the thinned portion along the second direction is 5-10 μm; wherein the second direction is a direction from the packaging portion to the through hole.

7. The display panel according to claim 1, characterized in that: The encapsulation layer includes at least two inorganic layers and at least one organic layer, the at least two inorganic layers extend from the display area to the non-display area, covering the display area and the bending area, and the through holes are arranged in the at least two inorganic layers; Preferably, the non-display area further includes a binding area, the binding area is arranged on a side of the bending area away from the display area, the binding area includes a plurality of binding pins, and the first touch lead is electrically connected to the binding pins; Preferably, in the display area, a plurality of metal layers are provided between the display unit and the substrate, and the first touch lead is provided in the same layer as a metal layer and is made of the same material; Preferably, the touch layer includes a plurality of touch electrodes, the packaging layer includes a plurality of through holes, the packaging layer includes a plurality of second touch leads on a side away from the substrate, the second touch leads correspond to the through holes one by one, each of the second touch leads is electrically connected to one of the first touch leads through a through hole, and different touch electrodes are connected to different second touch leads.

8. A method for manufacturing a display panel, characterized in that: The display panel comprises a display area and a non-display area arranged on at least one side of the display area; The non-display area includes a bending area, and the bending area is arranged on a side of the non-display area away from the display area. The method includes: A substrate is provided; the substrate is disposed in the display area and the non-display area; Arrange a plurality of display units in the display area; Disposing a first touch lead in the bending area; A packaging layer is arranged on a side of the display unit away from the substrate, the packaging layer extends from the display area to the non-display area, covers the display area and the bending area, and the packaging layer located in the bending area is etched by a grayscale mask to form a through hole, a thinning portion surrounding the through hole, and a packaging portion arranged around the thinning portion, wherein the thickness of the thinning portion is less than the thickness of the packaging portion; A touch layer and a second touch lead are disposed on a side of the packaging layer away from the substrate; the second touch lead is electrically connected to the touch layer, and the second touch lead extends to the bending area and is electrically connected to the first touch lead through the through hole.

9. A grayscale mask, characterized in that: Used to form the display panel according to any one of claims 1 to 7, comprising: An etched through hole and a shielding strip area surrounding the etched through hole; the shielding strip area includes a plurality of shielding strips arranged at intervals; wherein the grayscale mask is used to pattern the encapsulation layer of the display panel, the etched through hole is used to form the through hole, and the shielding strip area is used to form the thinning portion.

10. The grayscale mask according to claim 9, characterized in that: The width of the shielding strip in the shielding strip area ranges from 0.75 to 1.1 μm; The spacing between two adjacent shielding strips in the shielding strip area is in the range of 0.75-1.1 μm; Preferably, the distance between two adjacent shielding bars gradually increases along the third direction, or the distance between two adjacent shielding bars is equal, and any two adjacent shielding bars are parallel to each other; wherein the third direction is the direction from the shielding bar area to the etched through hole; Preferably, all the shielding strips in the shielding strip area are parallel to each other, or the shielding strip area includes a first area and a second area, the first area includes a plurality of first shielding strips, the second area includes a plurality of second shielding strips, the first shielding strips extend along a fourth direction, the second shielding strips extend along a fifth direction, the first area is located on both sides of the etched through hole along the fourth direction, the second area is located on both sides of the etched through hole along the fifth direction, and the fourth direction and the fifth direction are perpendicular to each other.

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