Air pressure sintering device and method

Abstract

The invention provides an air pressure sintering device which is internally provided with a pressure maintaining cabin and a vacuum cabin which are separated by a flexible film, the vacuum cabin is provided with a tray, the tray surface of the tray corresponds to the film surface of the flexible film, and a product to be sintered can be placed on the tray. The invention further provides an air pressure sintering method. According to the sintering method, the air pressure sintering device is adopted for sintering operation. The device has the beneficial effects that the pressure maintaining cabin and the vacuum cabin are separated through the flexible film, so that flexible gas can replace a rigid pressure head to uniformly apply pressure to products to be sintered, and sintering connection of the products with uneven surfaces and complex shapes is achieved.

Description

Technical Field

[0001] The present invention relates to the technical field of power semiconductor sintering, and particularly to a gas pressure sintering device and method. Background Art

[0002] With the increase in the voltage and current levels of power modules, more heat will be generated during use. The connection materials between the chip / substrate and the substrate / heatsink, as the key channels for heat transfer, will directly affect the reliability and service life of the module. The traditional solders in power modules have a low melting point, and creep intensifies in high-temperature application scenarios, presenting bottlenecks in terms of reliability. In contrast, metal sintering (Ag, Cu) or transient liquid-phase diffusion bonding (TLPS) not only has the characteristics of high-temperature service but also can improve the service reliability of the connection layer, and has become the preferred connection method for high-power modules.

[0003] Currently, applying mechanical loads is required to assist diffusion and wetting when using metal sintering or transient liquid-phase diffusion bonding to achieve connection, so as to strengthen interfacial diffusion and improve connection quality. The mechanical loads of traditional equipment are applied to the product surface by rigid hard punches, and can only be used to prepare products with simple surface forms and flat shapes, and it is difficult to produce products with height differences on the surface or with bonding wires. For example, the Chinese invention patent with the publication number CN115954287A discloses a silver sintering device, which uses a rigid pressing block. Although the pressing block is buffered by a buffer spring, it still cannot be applied to products with relatively complex structures.

[0004] In general, copper / aluminum wires are bonded to the surfaces of chips and substrates during the production of power devices, and there are also components such as resistors on the surface of the substrate that are not at the same height as the chips. The bonding wires cannot be protected during the pressurization process of traditional sintering equipment, and the pressure cannot be applied to the surfaces of products with different heights at the same time, resulting in a long production process for power modules, generally sintering and connecting the chip / substrate and the substrate / heatsink first and then performing wire bonding. In addition, limited by the size of the punch and the uniformity of pressure application, the number of products that can be produced in a single furnace is generally 1 - 6, and the number of products is limited, resulting in low equipment productivity, high production cost per product, and poor structural uniformity during large-size connection.

[0005] Therefore, it is necessary to study a gas pressure sintering device and method to solve the above problems or alleviate the impacts brought by the above problems. Summary of the Invention

[0006] On the one hand, the present invention provides a gas pressure sintering device, which separates the pressure-holding chamber and the vacuum chamber through a flexible film, enabling it to uniformly press the product to be sintered with flexible gas instead of a rigid punch, so as to achieve the sintering connection of products with uneven surfaces and complex shapes.

[0007] The internal structure of the pressure sintering device of the present invention has a pressure maintaining chamber and a vacuum chamber separated by a flexible film. The vacuum chamber is provided with a tray, and the tray surface corresponds to the film surface of the flexible film. The product to be sintered can be placed on the tray. Among them, the flexible film can at least cover the surface of the product to be sintered when the pressure maintaining chamber is pressurized, so that the high-pressure gas in the pressure maintaining chamber uniformly presses the product to be sintered.

[0008] In one embodiment, telescopic locking devices are connected to both sides of the flexible film. The telescopic locking devices can adjust the surface area of the corresponding part between the flexible film and the tray surface, so that the flexible film can cover different specifications and / or different quantities of the products to be sintered.

[0009] In one embodiment, the sintering device further includes a gas pressurization system. The gas pressurization system includes a first pipeline and a pressurization device. The first pipeline connects the pressurization device and the pressure maintaining chamber, and the pressurization device is used to compress gas.

[0010] In one embodiment, a first electric valve is provided on the first pipeline, and a pressure sensor is provided in the pressure maintaining chamber. The pressure sensor is electrically connected to the first electric valve. The pressure sensor can monitor the pressure in the pressure maintaining chamber and control the opening and closing of the first electric valve.

[0011] In one embodiment, the sintering device further includes a vacuum pumping system. The vacuum pumping system includes a second pipeline and a vacuum pump. The second pipeline connects the vacuum pump and the vacuum chamber, and a second electric valve is provided on the second pipeline. The second electric valve is linked with the vacuum pump.

[0012] In one embodiment, the sintering device further includes a sintering system built in the vacuum chamber. The sintering system includes a heating component and a temperature sensor that are electrically connected. The heating component is used to heat the product to be sintered, and the temperature sensor can monitor the temperature of the product to be sintered and control the heating temperature of the heating component.

[0013] In one embodiment, the sintering device further includes a lifting system arranged at the bottom of the vacuum chamber. The lifting system is used to lift and adjust the tray so that the tray can enter and exit the vacuum chamber to open and close the vacuum chamber. The lifting system includes a plurality of vertically arranged piston lifting columns.

[0014] In one embodiment, the sintering device further includes a cooling system. The cooling system includes a third pipeline and an air cooling device. The third pipeline is connected to the air cooling device and its air outlet corresponds to the position of the lowered tray. A third electric valve is provided on the third pipeline, and the third electric valve is linked with the air cooling device.

[0015] In one embodiment, the sintering device further includes a safety system, and the safety system includes a safety valve disposed in the pressure-holding chamber, and the safety valve is used to protect the pressure-holding chamber against overpressure.

[0016] On the other hand, the present invention provides a gas-pressure sintering method, and the sintering operation is carried out by using the gas-pressure sintering device as described above, and at least includes the following steps:

[0017] Place the product to be sintered on the tray, and raise the tray into the vacuum chamber through the lifting system so that the product to be sintered contacts the flexible film;

[0018] Start the gas pressurization system to pressurize the pressure-holding chamber, and start the vacuum pumping system to pump the vacuum chamber, so that the flexible film is coated on the surface of the product to be sintered under the action of the pressure difference, so that the product to be sintered is uniformly pressed;

[0019] Start the sintering system to heat the product to be sintered for sintering operation.

[0020] Compared with the prior art, the gas-pressure sintering device provided by the present invention at least has the following beneficial effects:

[0021] The gas-pressure sintering device of the present invention separates the pressure-holding chamber and the vacuum chamber through a flexible film, so that it can uniformly press the product to be sintered by using a flexible gas instead of a rigid punch head, so as to realize the sintering connection of products with uneven surfaces and complex shapes; moreover, the number of products produced at one time is not limited by the size of the punch head, which can greatly improve the production efficiency; furthermore, the flexible film wraps the product to form an impermeable layer of the gas pressure medium, which can block the gas from entering the interface delamination, can strengthen the interface diffusion, and improve the quality of the sintered product.

[0022] The gas-pressure sintering method of the present invention also has the above beneficial effects because the above sintering device is adopted. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Hereinafter, the present invention will be described in more detail based on embodiments and with reference to the drawings.

[0024] Figure 1 It is a schematic structural diagram of the gas-pressure sintering device according to an embodiment of the present invention.

[0025] In the drawings, the same components are denoted by the same reference numerals. The drawings are not drawn to actual scale.

[0026] Reference numerals:

[0027] 1 - Pressure - holding chamber, 2 - Vacuum chamber, 3 - Flexible film, 4 - Tray, 5 - Furnace body, 6 - Furnace door, 7 - Conveyor belt, 8 - Telescopic locking device, 9 - Pressurizing device, 10 - First pipeline, 11 - First electric valve, 12 - Pressure sensor, 13 - Vacuum pump, 14 - Second pipeline, 15 - Second electric valve, 16 - Temperature sensor, 17 - Piston lifting column, 18 - Air - cooling device, 19 - Third pipeline, 20 - Third electric valve, 21 - Safety valve. Detailed implementation mode

[0028] The present invention will be further described below in conjunction with the drawings.

[0029] As Figure 1 shown, the internal structure of the air - pressure sintering device of the present invention has a pressure - holding chamber 1 and a vacuum chamber 2 separated by a flexible film 3. The vacuum chamber 2 is provided with a tray 4, and the tray surface of the tray 4 corresponds to the film surface of the flexible film 3. Products to be sintered can be placed on the tray 4. Among them, the flexible film 3 can at least cover the surface of the product to be sintered when the pressure - holding chamber 1 is pressurized, so that the high - pressure gas in the pressure - holding chamber 1 uniformly presses on the product to be sintered.

[0030] Specifically, the air - pressure sintering device separates the pressure - holding chamber 1 and the vacuum chamber 2 through the flexible film 3, enabling it to uniformly press on the product to be sintered by using flexible gas instead of a rigid pressure head. Since the gas pressure cooperates with the flexible film 3 to evenly press on all aspects of the product, it is not affected by the height, precision, and complex shape of the product. And the number of products produced at one time is not limited by the size of the pressure head. It can realize the production and preparation of hundreds of products simultaneously at one time, greatly improving the single - time production capacity, and having higher pressure uniformity and better product performance stability.

[0031] The air - pressure sintering device is particularly suitable for the metal sintering of power modules and can protect the bonding wires. When the power module conducts copper / silver metal sintering, the raw materials used are generally copper paste / silver paste. During the sintering process, the pressure generated by the cracking and volatilization of organic matter is extremely likely to cause delamination between the chip and the substrate or between the substrate and the radiator. During general air - pressure sintering, high - pressure gas is easily pressed into the delamination interface, affecting the diffusion and connection quality. However, the air - pressure sintering device of the present invention uses the flexible film 3 to cover the product to be sintered, forming an impermeable layer for the gas pressure medium, thereby blocking the gas from entering the interface delamination, strengthening the interface diffusion, and improving the quality of the sintered product.

[0032] Furthermore, the flexible film 3 is made of a flexible high - temperature - resistant material and has high - temperature resistance. When the product is sintered, the flexible film 3 covers the surface of the product and needs to withstand the high - temperature environment during sintering. Good high - temperature resistance can prevent the flexible film 3 from rupturing, resulting in the inter - communication between the pressure - holding chamber 1 and the vacuum chamber 2 and the failure of high - pressure gas pressure application.

[0033] Furthermore, the pressure sintering device may further include a furnace body 5 that wraps the pressure maintaining chamber 1 and the vacuum chamber 2. The furnace body 5 has a closable structure, which can isolate the pressure maintaining chamber 1 and the vacuum chamber 2 from the outside world and can keep the temperature for the sintering operation. A furnace door 6 may be provided on one side of the bottom of the furnace body 5, and a conveyor belt 7 for conveying the tray 4 may be provided at the bottom of the furnace body 5.

[0034] Specifically, the tray 4 is required to place the products to be sintered for loading and unloading. Before and after the sintering operation, the tray 4 needs to be moved into or out of the furnace body 5 relative to the furnace body 5. The tray 4 can be used as the bottom plate of the vacuum chamber 2 for easy movement and installation. And the tray 4 enters the furnace body 5 and moves to the position corresponding to the flexible film 3, and a sealed vacuum chamber 2 is formed between the upper surface of the tray 4 and the film surface of the flexible film 3. It should be noted that considering that the tray 4 is moved and installed more frequently, it is difficult to ensure the installation accuracy of the sealed space. It can be set that when the tray 4 moves to the position corresponding to the flexible film 3, the vacuum chamber 2 is not formed, but the space between the inner wall of the furnace body 5 and the outer wall of the pressure maintaining chamber 1 is used as the vacuum chamber 2, so that the sealing problem does not need to be considered when moving and installing the tray 4.

[0035] In an example, telescopic locking devices 8 are connected to both sides of the flexible film 3. The telescopic locking devices 8 can adjust the surface area of the corresponding part of the flexible film 3 and the tray 4, so that the flexible film 3 can cover different specifications and / or different quantities of products to be sintered.

[0036] Specifically, the telescopic locking devices 8 can increase or decrease the surface area of the corresponding part of the flexible film 3 and the tray 4 by means of winding. When the specifications of the products to be sintered placed on the tray 4 are larger or the quantity of single sintering is more, the area of the flexible film 3 required to cover the products to be sintered becomes larger. Before sintering, the telescopic locking devices 8 can appropriately increase the surface area of the corresponding part of the flexible film 3 and the tray 4; when the specifications of the products to be sintered placed on the tray 4 are smaller or the quantity of single sintering is less, the area of the flexible film 3 required to cover the products to be sintered becomes smaller. Before sintering, the telescopic locking devices 8 can appropriately decrease the surface area of the corresponding part of the flexible film 3 and the tray 4. This can make the area of the flexible film 3 covering the products to be sintered appropriate, and avoid the surface area of the corresponding part of the flexible film 3 and the tray 4 being too large or too small, which affects the uniform pressure of the high-pressure gas in the pressure maintaining chamber 1 on the products to be sintered. Further, the telescopic locking devices 8 can be controllable mechanical drums.

[0037] It should be noted that the flexible membrane 3 separating the pressure-maintaining cabin 1 and the vacuum cabin 2 needs to ensure the sealing of the separation connection. The telescopic locking device 8 can fix the roll of the rolled flexible membrane 3 on the inner wall of the connection between the pressure-maintaining cabin 1 and the vacuum cabin 2, and connect the power device to the outside to provide power input, and ensure the sealing by the telescopic locking device 8 itself; or the telescopic locking device 8 is arranged as a whole on the outside of the connection between the pressure-maintaining cabin 1 and the vacuum cabin 2, and the flexible membrane 3 needs to be sealed through the cabin wall, such as setting a close-fitting sealing ring to ensure the sealing.

[0038] In one example, the sintering device further includes a gas pressurization system, which includes a first pipeline 10 and a pressurization device 9, wherein the first pipeline 10 connects the pressurization device 9 with the pressure-maintaining cabin 1, and the pressurization device 9 is used to compress the gas. When the pressure-maintaining cabin 1 needs to be pressurized, the pressurization device 9 is started to compress the gas and transmit it into the pressure-maintaining cabin 1 through the first pipeline 10 to achieve pressurization. The pressurization device 9 can be arranged outside the pressure-maintaining cabin 1.

[0039] In one example, a first electric valve 11 is provided on the first pipeline 10, and a pressure sensor 12 is provided in the pressure maintaining cabin 1. The pressure sensor 12 is electrically connected to the first electric valve 11. The pressure sensor 12 can monitor the pressure in the pressure maintaining cabin 1 and control the opening and closing of the first electric valve 11.

[0040] Specifically, the pressure sensor 12 can detect the pressure in the pressure-maintaining chamber 1 in real time. During the sintering operation, the pressure sensor 12 can control the pressurizing device 9 and the first electric valve 11 to close when the pressure in the pressure-maintaining chamber 1 reaches a set value, and can control the pressurizing device 9 and the first electric valve 11 to open for pressurization when the pressure in the pressure-maintaining chamber 1 is lower than the set value.

[0041] In one example, the sintering device further includes a vacuum pumping system, which includes a second pipe 14 and a vacuum pump 13. The second pipe 14 connects the vacuum pump 13 and the vacuum chamber 2, and a second electric valve 15 is provided on the second pipe 14. The second electric valve 15 is linked to the vacuum pump 13. When the vacuum chamber 2 needs to form a negative pressure, the vacuum pump 13 is started and the second electric valve 15 is opened at the same time, and the vacuum chamber 2 is vacuumed through the second pipe 14. When the vacuum degree of the vacuum chamber 2 reaches a set value, the vacuum pump 13 and the second electric valve 15 can be closed. The vacuum pump 13 can be arranged outside the vacuum chamber 2.

[0042] In one example, the sintering device also includes a sintering system built into the vacuum chamber 2, the sintering system includes an electrically connected heating component (not shown in the drawings) and a temperature sensor 16, the heating component is used to heat the sintered product, and the temperature sensor 16 can monitor the temperature of the sintered product and control the heating temperature of the heating component.

[0043] Specifically, the heating component can adopt a heating table integrated with the tray 4, and the temperature sensor 16 can adopt a thermocouple to measure the surface temperature of the tray 4 and the product surface, and the signal obtained by the temperature sensor 16 can be transmitted to the central control system of the sintering device, so that the central control system can adjust the heating power of the heating component according to the temperature signal transmitted by the temperature sensor 16.

[0044] In one example, the sintering device also includes a lifting system arranged at the bottom of the vacuum chamber 2, and the lifting system is used to lift and adjust the tray 4 so that the tray 4 can enter and exit the vacuum chamber 2 to realize the opening and closing of the vacuum chamber 2. The lifting system includes multiple vertically arranged piston lifting columns 17.

[0045] Specifically, the lifting system can be arranged at the bottom of the furnace body 5, and the lifting system can lift the tray 4 to a position corresponding to the flexible film 3, or lower it onto the conveyor belt 7, so as to cooperate with the conveyor belt 7 to assist the tray 4 in loading and unloading. When the tray 4 is used as the bottom plate of the vacuum chamber 2, the tray 4 is raised to a position corresponding to the flexible film 3, so as to realize the sealed installation of the vacuum chamber 2, and the lowering of the tray 4 can release the vacuum chamber 2 to realize ventilation. The lifting system includes a plurality of piston lifting columns 17 evenly distributed at the bottom of the tray 4, and the piston lifting columns 17 can be lifted and lowered by hydraulic means to ensure the stability of the lifting tray 4.

[0046] In one example, the sintering device further includes a cooling system, which includes a third pipe 19 and an air cooling device 18. The third pipe 19 is connected to the air cooling device 18 and its air outlet corresponds to the position of the lowered tray 4. The third pipe 19 is provided with a third electric valve 20, which is linked to the air cooling device 18. After the sintering operation is completed, the tray 4 is lowered onto the conveyor belt 7, the air cooling device 18 is started and the third electric valve 20 is opened at the same time, and the tray 4 and the sintered product on the tray 4 are air-cooled through the air outlet of the third pipe 19, so as to shorten the interruption time in continuous production and improve production capacity. The air cooling device 18 can be arranged outside the furnace body 5.

[0047] In one example, the sintering device further includes a safety system, which includes a safety valve 21 provided on the pressure-maintaining cabin 1, and the safety valve 21 is used to protect the pressure-maintaining cabin 1 from overpressure. When the pressure in the pressure-maintaining cabin 1 exceeds a limit value, the safety valve 21 opens to release gas outward until the gas in the pressure-maintaining cabin 1 is maintained at a set pressure. The safety system may also include a prestressed metal wire wound around the outer wall of the pressure-maintaining cabin 1 to enhance the stability of the pressure-maintaining cabin 1.

[0048] In one example, the sintering device further includes a central control system (not shown in the drawings), which is electrically connected to other devices of the sintering device to achieve automatic control. The central control system can control the telescopic locking device 8, the gas booster system, the vacuum system, the sintering system, the lifting system, the cooling system, and the safety system in a linked manner to complete the sintering operation.

[0049] On the other hand, the present invention provides a gas pressure sintering method. The sintering method uses the above gas pressure sintering device to perform sintering operations, and at least includes the following steps:

[0050] Place the product to be sintered on the tray 4, and raise the tray 4 into the vacuum chamber 2 through the lifting system, so that the product to be sintered contacts the flexible film 3;

[0051] Start the gas pressurization system to pressurize the pressure holding chamber 1, and start the vacuum pumping system to pump the vacuum chamber 2, so that the flexible film 3 is coated on the surface of the product to be sintered under the action of the pressure difference, so that the product to be sintered is uniformly pressed;

[0052] Start the sintering system to heat the product to be sintered for sintering operations.

[0053] Furthermore, the operation steps of the gas pressure sintering method at least include:

[0054] (1) Check the status of each equipment and component of the gas pressure sintering device, and set the pressure values in the pressure holding chamber 1 and the vacuum chamber 2, import the sintering temperature control program, etc. through the central control system.

[0055] (2) Place the product to be sintered that has completed chip mounting on the tray 4 (with a built-in heating table), and convey it into the furnace body 5 through the conveyor belt 7, and then close the furnace door 6.

[0056] (3) Raise the tray 4 to the position corresponding to the flexible film 3 through the lifting system, turn on the vacuum system, and after the air pressure in the vacuum chamber 2 reaches the set value, turn on the gas pressurization system to introduce compressed gas into the pressure holding chamber 1 to reach the set value.

[0057] (4) Run the sintering system, and the heating component (heating table) starts the heating process. Measure the temperature of the product surface and the tray 4 surface through the temperature sensor 16, and the central control system adjusts the heating power of the heating component according to the temperature signal.

[0058] (5) After the sintering process is completed, the heating component (heating table) stops heating. The pressure holding chamber 1 first extracts the high-pressure gas, and the vacuum chamber 2 is filled with gas to eliminate the negative pressure and return to the atmospheric pressure state.

[0059] (6) The tray 4 descends to the conveyor belt 7 with the lifting system, and is cooled by the air cooling device 18. After cooling, open the furnace door 6, remove the tray 4 and the product from the furnace body 5, place the product to be sintered on the tray 4 again, and start the next batch of production.

[0060] The process parameters that need to be controlled in the above-mentioned gas pressure sintering method include: the temperature parameters in the sintering process include holding time, heating rate, sintering temperature, etc.; the pressure parameters of the pressure maintaining chamber 1 include gas inlet flow rate, gas pressure value, pressure maintaining time; and the vacuum parameters of the vacuum chamber 2 include vacuum degree, etc.

[0061] In summary, the beneficial effects of the present invention include:

[0062] (1) The gas pressure sintering device of the present invention uses flexible gas to replace the rigid indenter to apply pressure to the product, and can realize the connection between the chip and the liner, and between the liner and the radiator of products with uneven surfaces, complex shapes and bonding wires without designing complex molds.

[0063] (2) The gas pressure sintering method of the present invention can carry out continuous production, greatly improving production capacity and reducing production costs.

[0064] (3) The present invention uses high-pressure gas and a flexible film to evenly press on various parts of the product, which is not affected by the height and complex shape of the product, and can protect the bonding wires. In addition, the number of products produced in a single production is not limited by the size of the indenter, and hundreds of products can be produced and prepared simultaneously at one time, greatly improving the single production capacity, and having higher pressure uniformity and better product performance stability. Moreover, using a flexible film to wrap the product in the sintering device to form a non-permeable layer for the gas pressure medium, thereby blocking the gas from entering the interface delamination, can enable the cladding and sintering to be completed synchronously in the same device without additional expensive pressurizing molds, improving the connection quality while ensuring a short process, low cost and rapid increase in production capacity during the production process.

[0065] Although the present invention has been described with reference to the preferred embodiments, various improvements can be made to it and components therein can be replaced with equivalents without departing from the scope of the present invention. In particular, as long as there is no structural conflict, the various technical features mentioned in each embodiment can be combined in any way. The present invention is not limited to the specific embodiments disclosed in the text, but includes all technical solutions falling within the scope of the claims.

Claims

1. A pressure sintering device, characterized in that, The internal structure of the sintering device has a pressure-holding chamber and a vacuum chamber separated by a flexible membrane. The vacuum chamber is provided with a tray, the tray surface corresponds to the membrane surface of the flexible membrane, and the product to be sintered can be placed on the tray. Among them, the flexible membrane can at least cover the surface of the product to be sintered when the pressure in the pressure-holding chamber increases, so that the high-pressure gas in the pressure-holding chamber uniformly presses the product to be sintered.

2. The pressure sintering device according to claim 1, characterized in that, Both sides of the flexible membrane are connected with telescopic locking devices, and the telescopic locking devices can adjust the surface area of the corresponding part of the flexible membrane and the tray surface, so that the flexible membrane can cover different specifications and / or different quantities of the products to be sintered.

3. The pressure sintering device according to claim 1, characterized in that, The sintering device also includes a gas pressurization system, and the gas pressurization system includes a first pipeline and a pressurization device. The first pipeline connects the pressurization device and the pressure-holding chamber, and the pressurization device is used to compress gas.

4. The pressure sintering device according to claim 3, characterized in that, A first electric valve is arranged on the first pipeline, a pressure sensor is arranged in the pressure-holding chamber, the pressure sensor is electrically connected with the first electric valve, and the pressure sensor can monitor the pressure in the pressure-holding chamber and control the opening and closing of the first electric valve.

5. The pressure sintering device according to claim 1, characterized in that, The sintering device also includes a vacuum pumping system, and the vacuum pumping system includes a second pipeline and a vacuum pump. The second pipeline connects the vacuum pump and the vacuum chamber, and a second electric valve is arranged on the second pipeline, and the second electric valve is linked with the vacuum pump.

6. The pressure sintering device according to claim 1, characterized in that, The sintering device also includes a sintering system built in the vacuum chamber, and the sintering system includes a heating component and a temperature sensor which are electrically connected. The heating component is used to heat the product to be sintered, and the temperature sensor can monitor the temperature of the product to be sintered and control the heating temperature of the heating component.

7. The pressure sintering device according to claim 1, characterized in that, The sintering device also includes a lifting system arranged at the bottom of the vacuum chamber, and the lifting system is used to lift and adjust the tray, so that the tray enters and exits the vacuum chamber to realize the opening and closing of the vacuum chamber. The lifting system includes a plurality of vertically arranged piston lifting columns.

8. The pressure sintering device according to claim 7, characterized in that, The sintering device also includes a cooling system, and the cooling system includes a third pipeline and an air-cooling device. The third pipeline is connected to the air-cooling device and its air outlet corresponds to the position of the lowered tray, and a third electric valve is arranged on the third pipeline, and the third electric valve is linked with the air-cooling device.

9. The pressure sintering device according to claim 1, characterized in that, The sintering device also includes a safety system, and the safety system includes a safety valve arranged on the pressure-holding chamber, and the safety valve is used for overpressure protection of the pressure-holding chamber.

10. A pressure sintering method, characterized in that, The sintering method uses the air pressure sintering device according to any one of claims 1 to 9 to carry out sintering operations, and at least includes the following steps: Place the product to be sintered on the tray, and lift the tray into the vacuum chamber through the lifting system, so that the product to be sintered contacts the flexible membrane. Start the gas pressurization system to pressurize the pressure-holding chamber, start the vacuum pumping system to pump the vacuum chamber, so that the flexible membrane covers the surface of the product to be sintered under the action of the pressure difference, so that the product to be sintered is uniformly pressed. Start the sintering system to heat the product to be sintered for sintering operations.

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