Radiator

Abstract

The invention relates to the technical field of heat dissipation, in particular to a radiator. The radiator comprises a first liquid cooling plate and a second liquid cooling plate, and a first boiling cavity is formed between the first liquid cooling plate and the second liquid cooling plate; the first liquid cooling plate comprises a jet flow cavity, a liquid inlet and a plurality of first jet flow holes, the liquid inlet is communicated with the jet flow cavity, and the plurality of first jet flow holes are used for communicating the jet flow cavity with the first boiling cavity; a liquid outlet is formed in one side of the first boiling cavity and communicates with the first boiling cavity, and the side, away from the first liquid cooling plate, of the second liquid cooling plate is used for being attached to a plurality of heat sources; the liquid inlet is used for allowing a cooling medium to flow in, the cooling medium enters the first boiling cavity through the multiple first jet flow holes after circulating through the jet flow cavity, and the cooling medium flows out through the liquid outlet after circulating through the first boiling cavity. According to the radiator, the heat dissipation effect on the heat source can be improved, and the heat source can work stably.

Description

Technical Field

[0001] This application relates to the field of heat dissipation technology, and in particular to a radiator. Background Art

[0002] When two-phase cold plates are used in heat dissipation scenarios with multiple heat sources, one heat source is attached to each cold plate, and multiple cold plates are connected in parallel. However, the lengths of the liquid inlet branch pipes between the main pipe supplying the refrigerant to each cold plate and the inlets of each cold plate are different, and the lengths of the liquid outlet branch pipes between the outlets of each cold plate and the return pipe may also be different, which may cause different flow resistances in each branch pipe, and further lead to inconsistent flow rates in each branch, affecting the heat dissipation performance of the cold plates corresponding to each branch. Summary of the Invention

[0003] An embodiment of this application provides a radiator. This radiator can improve the heat dissipation effect on the heat source.

[0004] This application provides a radiator, which includes: a first liquid cooling plate and a second liquid cooling plate, and a first boiling chamber is formed between the first liquid cooling plate and the second liquid cooling plate; the first liquid cooling plate includes a jet chamber, a liquid inlet, and a plurality of first jet holes, the liquid inlet is communicated with the jet chamber, and the plurality of first jet holes are used to communicate the jet chamber and the first boiling chamber; an outlet is arranged on one side of the first boiling chamber, and the outlet is communicated with the first boiling chamber, wherein, on the side of the second liquid cooling plate facing away from the first liquid cooling plate is used to attach a plurality of heat sources; the liquid inlet is used to flow in a cooling medium, the cooling medium circulates through the jet chamber and then enters the first boiling chamber through the plurality of first jet holes, and the cooling medium circulates through the first boiling chamber and then flows out through the outlet. In this radiator, the second liquid cooling plate attaches to a plurality of heat sources, the cooling medium first enters the jet chamber through the liquid inlet, and the paths of the cooling medium in the jet chamber shooting into the first boiling chamber are the same, and a plurality of heat sources share the first boiling chamber, and the flow resistances encountered by the cooling medium in the jet chamber when shooting into the first boiling chamber are the same, so as to ensure the flow rate of the cooling medium at the positions corresponding to each heat source, thereby ensuring the heat dissipation performance of the radiator.

[0005] Wherein, the aperture and density of the first jet holes can be adjusted according to the different powers of the heat sources attached to the second liquid cooling plate. The larger the aperture of the first jet hole, the higher the power consumption of the heat source at the corresponding position. Similarly, the greater the density of the first jet holes, the higher the power consumption of the heat source at the corresponding position.

[0006] In one embodiment, the first liquid cooling plate includes a first sub-plate and a second sub-plate arranged in a stacked manner. The first sub-plate and the second sub-plate enclose a jet cavity, and a first boiling cavity is formed between the first sub-plate and the second liquid cooling plate. The first sub-plate includes a liquid inlet and a plurality of first jet holes; the radiator further includes a third liquid cooling plate, and a second boiling cavity is formed between the third liquid cooling plate and the second sub-plate. The first boiling cavity is communicated with the second boiling cavity. A plurality of second jet holes are provided on the second sub-plate, and the plurality of second jet holes are used to communicate the second boiling cavity and the jet cavity; the side of the third liquid cooling plate facing away from the second liquid cooling plate is used to fit a plurality of heat sources; the cooling medium circulates through the jet cavity and then enters the second boiling cavity through the plurality of second jet holes, and the cooling medium circulates through the second boiling cavity and then flows out through the liquid outlet. In this way, the cooling medium first enters the jet cavity through the liquid inlet. The paths of the cooling medium in the jet cavity shooting into the first boiling cavity are the same, the paths of the cooling medium in the jet cavity shooting into the second boiling cavity are the same, and the first boiling cavity and the second boiling cavity are communicated, and the pressures in the first boiling cavity and the second boiling cavity are the same. The flow resistance encountered by the cooling medium in the jet cavity when shooting into the first boiling cavity and the flow resistance encountered when shooting into the second boiling cavity will not change due to the different numbers and power consumptions of the heat sources attached to the second liquid cooling plate and the third liquid cooling plate. Furthermore, the flow rate of the cooling medium at the corresponding positions of each heat source can be ensured, thereby ensuring the heat dissipation performance of the radiator.

[0007] Among them, the aperture and density of the second jet holes can be adjusted according to the different powers of the heat sources attached to the third liquid cooling plate. The larger the aperture of the second jet hole, the higher the power consumption of the heat source at the corresponding position. Similarly, the greater the density of the first jet holes, the higher the power consumption of the heat source at the corresponding position.

[0008] In one embodiment, the liquid outlet can be arranged on any one of the first sub-plate, the second sub-plate or the second liquid cooling plate as required.

[0009] In one embodiment, the first sub-plate includes a main board and a partition board. The first jet holes are arranged on the main board. One end of the partition board is fixed to the side of the main board facing the second sub-plate, and the other end of the partition board is fixedly connected to the second sub-plate. The main board, the partition board and the second sub-plate enclose a jet cavity, and the main board and the second sub-plate can be arranged in parallel.

[0010] In one embodiment, the radiator further includes at least one first strengthening structure. One end of the at least one strengthening structure is connected to the side of the first sub-plate facing the second sub-plate, and the other end of the at least one first strengthening structure is connected to the second sub-plate. The first strengthening structure can improve the connection stability between the first sub-plate and the second sub-plate.

[0011] In one embodiment, the at least one first strengthening structure is arranged in an array between the first sub-plate and the second sub-plate. Facilitate the setting of the first jet holes and the second jet holes. Among them, the first strengthening structure can be in the shape of a column, a rectangle or a frustum of a cone, etc.

[0012] In one embodiment, the radiator further includes at least one second reinforcement structure, one end of the at least one second reinforcement structure is connected to a side of the first liquid cooling plate facing the third liquid cooling plate, and the other end of the at least one second reinforcement structure is connected to the third liquid cooling plate. The second reinforcement structure can improve the stability of the connection between the first liquid cooling plate and the third liquid cooling plate.

[0013] In one embodiment, at least one second reinforcement structure is distributed in an array between the first liquid cooling plate and the third liquid cooling plate, so as to improve the stability of the second boiling chamber, wherein the second reinforcement structure may be in a columnar, rectangular or truncated cone shape.

[0014] In one embodiment, the radiator further includes at least one third reinforcement structure, one end of the at least one third reinforcement structure is connected to a side of the second liquid cooling plate facing the first liquid cooling plate, and the other end of the at least one third reinforcement structure is connected to the first liquid cooling plate. The second reinforcement structure can improve the stability of the connection between the first liquid cooling plate and the second liquid cooling plate.

[0015] In one embodiment, at least one third reinforcement structure is distributed in an array between the first liquid cooling plate and the second liquid cooling plate, so as to improve the stability of the first boiling chamber, wherein the second reinforcement structure may be in a columnar, rectangular or truncated cone shape.

[0016] In one embodiment, the radiator further includes a first bracket and a first elastic connector, the first bracket is disposed on a side of the second liquid cooling plate away from the first liquid cooling plate, the first elastic connector elastically connects the first bracket to the second liquid cooling plate, and the first bracket and the second liquid cooling plate are used to accommodate multiple heat sources. The first elastic connector can make it more convenient to connect the second liquid cooling plate to the first bracket, and can also make it easier to arrange the heat source between the second liquid cooling plate and the first bracket.

[0017] In one embodiment, the radiator further includes a second bracket and a second elastic connector, the second bracket is disposed on a side of the third liquid cooling plate away from the first liquid cooling plate, the second elastic connector elastically connects the second bracket and the third liquid cooling plate, and the second bracket and the third liquid cooling plate are used to accommodate multiple heat sources. The provision of the second elastic connector can make the connection between the third liquid cooling plate and the second bracket more convenient, and can also make it easier to arrange the heat source between the third liquid cooling plate and the second bracket. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 A schematic diagram of the structure of a radiator provided in an embodiment of the present application;

[0019] Figure 2 A schematic diagram of another structure of the radiator provided in the embodiment of the present application;

[0020] Figure 3A partial structural schematic diagram of the radiator provided by the embodiment of the present application;

[0021] Figure 4 It is Figure 3 a cross-sectional view of.

[0022] Reference numerals:

[0023] 10 - First liquid cooling plate; 11 - Jet cavity; 12 - First sub-plate; 120 - First jet hole; 121 - First notch; 122 - Main board; 123 - Partition board; 13 - Second sub-plate; 130 - Second jet hole; 131 - Second notch; 14 - Liquid inlet; 15 - Liquid outlet; 16 - First strengthening structure; 20 - Second liquid cooling plate; 21 - First boiling cavity; 22 - First fitting surface; 23 - Second fitting surface; 24 - Third strengthening structure; 25 - First connecting portion; 26 - First recessed portion; 30 - First bracket; 31 - First sub-bracket; 32 - Second sub-bracket; 40 - First elastic connecting member; 50 - Heat source; 60 - Third liquid cooling plate; 61 - Second boiling cavity; 62 - Second strengthening structure; 70 - Second bracket; 80 - Second elastic connecting member. Detailed implementation manners

[0024] In order to make the objectives, technical solutions and advantages of the present application clearer, the present application will be further described in detail below with reference to the accompanying drawings.

[0025] In the prior art, multiple cold plates are generally connected in parallel to dissipate heat from multiple heat sources. Among them, the lengths of the branch pipes between the main pipeline that supplies refrigerant to the multiple cold plates and the inlets of each cold plate are different, and the branches between the outlets of each cold plate and the return pipe are also different, which will cause different flow resistances in each branch pipe, and further lead to different refrigerant flows in each cold plate, affecting the heat dissipation performance of each cold plate.

[0026] In addition, the power consumption fluctuation of the same heat source or the difference in power consumption of different heat sources will also exacerbate the situation of different refrigerant flows in each cold plate. Specifically, when the flow rate is constant, an increase in the heat source power will cause an increase in the vaporization rate of the refrigerant flowing through the cold plate, and the flow resistance of the refrigerant will also increase accordingly. Correspondingly, in the cold plate that fits a low heat source power, the vaporization rate of the refrigerant is low and the pressure drop is also relatively low. In this way, when the flow rate of the refrigerant in the main pipeline is constant, the greater the heat exchange amount of the two-phase cold plate, the greater the flow resistance of the two-phase cold plate. Therefore, when the heat source powers corresponding to each of the parallel-connected cold plates are inconsistent, due to the high flow resistance, the amount of refrigerant flowing into the cold plate that fits the high power consumption will decrease, and due to the low flow resistance, the amount of refrigerant flowing into the cold plate that fits the low power consumption will increase.

[0027] In summary, for the cold plate with high power consumption, due to the decrease in flow rate, the heat dissipation performance decreases. For the cold plate with low power consumption, due to the increase in flow rate, the performance of the cold plate will increase. As a result, the cold plate that requires a high flow rate cannot obtain sufficient refrigerant, affecting the heat dissipation performance of the parallel cold plates.

[0028] Based on this, the embodiments of the present application provide a radiator to solve the above problems.

[0029] The terms used in the following embodiments are only for the purpose of describing specific embodiments and are not intended to limit the present application. As used in the specification and appended claims of the present application, the singular forms "a", "an", "the", "above", "said", "this" are also intended to include, for example, the expression "one or more", unless clearly indicated to the contrary in the context.

[0030] Reference to "one embodiment" or "some embodiments" etc. described in this specification means that a specific feature, structure or characteristic described in connection with the embodiment is included in one or more embodiments of the present application. Thus, the statements "in one embodiment", "in some embodiments", "in other some embodiments", "in still other embodiments" etc. that appear in different places in this specification do not necessarily all refer to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized. The terms "comprising", "including", "having" and their variants all mean "including but not limited to", unless otherwise specifically emphasized.

[0031] Figure 1 FIG. is a schematic structural diagram of the radiator provided by the embodiment of the present application. Refer to Figure 1, the heat sink includes a first liquid cooling plate 10, a second liquid cooling plate 20, a first bracket 30, and a first elastic connecting member 40. The first bracket 30 is disposed on a side of the second liquid cooling plate 20 facing away from the first liquid cooling plate 10. The first elastic connecting member 40 elastically connects the first bracket 30 and the second liquid cooling plate 20. A plurality of heat sources 50 are accommodated between the first bracket 30 and the second liquid cooling plate 20. The first liquid cooling plate 10 includes a jet cavity 11. A first boiling cavity 21 is formed between the first liquid cooling plate 10 and the second liquid cooling plate 20. The cooling medium in the jet cavity 11 can flow into the first boiling cavity 21 through the liquid inlet. The cooling medium in the first boiling cavity 21 can absorb the heat generated by the heat sources 50, so that the heat sources 50 can operate stably. Since the cooling medium flowing into the corresponding parts of each heat source 50 in the first boiling cavity 21 is in the same space, the degree of influence of the liquefaction of the cooling medium on the amount of the cooling medium flowing into the corresponding parts of the high-power heat sources 50 is relatively low. It can be understood that the flow rate of the cooling medium flowing into the first boiling cavity 21 through the jet cavity 11 is not affected by the power of the heat sources between the second liquid cooling plate 20 and the first bracket 30, or is less affected by the power of the heat sources between the second liquid cooling plate 20 and the first bracket 30. Furthermore, it can ensure that the heat generated by each heat source 50 can be quickly dissipated through the second liquid cooling plate 20, improving the heat dissipation capacity of the heat sink.

[0032] The first elastic connecting member 40 includes a first screw and a first spring. The first spring is sleeved on the first screw. The first screw passes through the first bracket and the second liquid cooling plate to fix the second liquid cooling plate to the first bracket.

[0033] In one embodiment, a surface of the second liquid cooling plate 20 facing away from the first liquid cooling plate 10 includes a first fitting surface 22 and a second fitting surface 23. An included angle is formed between the first fitting surface 22 and the second fitting surface 23. The first bracket 30 includes a first sub-bracket 31 and a second sub-bracket 32. The first sub-bracket 31 corresponds to the first fitting surface 22, and the second fitting surface 23 corresponds to the second sub-bracket 32. In this way, the first fitting surface 22 and the second fitting surface 23 can be perpendicularly arranged or arranged at a certain angle. When the first fitting surface 22 and the second fitting surface 23 are perpendicularly arranged, the second liquid cooling plate 20 can be arranged in an L shape. When the second liquid cooling plate 20 is arranged in an L shape, the first liquid cooling plate 10 is also arranged in an L shape, and the first boiling cavity 21 formed between the first liquid cooling plate 10 and the second liquid cooling plate 20 is also arranged in an L shape, so that the heat sources 50 arranged on the first fitting surface 22 and the second fitting surface 23 can all be provided with sufficient cooling medium for heat dissipation.

[0034] It is worth mentioning that the heat sources 50 can be fixed to the first fitting surface 22 and the second fitting surface 23, or the heat sources 50 can also be fixed to the first sub-bracket 31 or the second sub-bracket 32.

[0035] Figure 2A schematic structural diagram of the radiator provided by an embodiment of the present application, refer to Figure 2 In one embodiment, the radiator further includes a third liquid cooling plate 60, a second bracket 70, and a second elastic connecting member 80. The third liquid cooling plate 60 and the second liquid cooling plate 20 are disposed on both sides of the first liquid cooling plate 10. A second boiling cavity 61 is formed between the third liquid cooling plate 60 and the second liquid cooling plate 20. The second bracket 70 is disposed on the side of the third liquid cooling plate 60 away from the first liquid cooling plate 10. The second elastic connecting member 80 elastically connects the second bracket 70 and the third liquid cooling plate. A plurality of heat sources 50 are accommodated between the second bracket 70 and the third liquid cooling plate 60. In this way, the first bracket 30 and the second bracket 70 can be oppositely disposed, and both the third liquid cooling plate 60 and the second liquid cooling plate 20 can be used to fit the heat source 50. Among them, the cooling medium in the jet cavity 11 flows into the first boiling cavity 21 and the second boiling cavity 61. The cooling medium in the first boiling cavity 21 and the second boiling cavity 61 can absorb the heat generated by the heat source 50, so that the heat source 50 can work stably. Among them, since the cooling medium in the part corresponding to each heat source 50 in the first boiling cavity 21 is in the same space, and the cooling medium in the part corresponding to each heat source in the second boiling cavity 61 is in the same space, the degree to which the amount of the cooling medium flowing into the corresponding part of the high-power heat source 50 is affected by the liquefaction of the cooling medium is relatively low. It can be understood that the flow rate of the cooling medium flowing into the first boiling cavity 21 and the second boiling cavity 61 through the jet cavity 11 will not or is less affected by the power of the heat source. Furthermore, it can ensure that the heat generated by each heat source can be quickly dissipated through the second liquid cooling plate 20 and the third liquid cooling plate 60, improving the heat dissipation capacity of the radiator. In addition, the first boiling cavity 21 and the second boiling cavity 61 are connected. Even if the power consumption of the heat source corresponding to the first boiling cavity 21 and the heat source corresponding to the second boiling cavity 61 is different, it will not affect the heat dissipation capacity of the first boiling cavity 21 and the second boiling cavity 61, further improving the heat dissipation effect of the radiator.

[0036] It is worth mentioning that the heat source can be fixedly arranged on the second liquid cooling plate 20 and the third liquid cooling plate 60, or the heat source is fixedly arranged on the first bracket 30 or the second bracket 70. The structural form of the second elastic connecting member 80 can be the same as that of the first elastic connecting member 40.

[0037] Next, a detailed description will be given of the specific layout form among the first liquid cooling plate, the second liquid cooling plate, and the third liquid cooling plate.

[0038] Figure 3 A partial structural schematic diagram of the radiator provided by an embodiment of the present application; Figure 4 is Figure 3 a cross-sectional view of. Refer to Figure 3 and Figure 4, a first boiling chamber 21 is formed between the first liquid cooling plate 10 and the second liquid cooling plate 20. The first liquid cooling plate 10 includes a jet chamber 11, a liquid inlet 14, and a plurality of first jet holes 120. The liquid inlet 14 is communicated with the jet chamber, and the plurality of first jet holes 120 are used to communicate the jet chamber 11 and the first boiling chamber 21. An outlet 15 is arranged on one side of the first boiling chamber 21, and the outlet 15 is communicated with the first boiling chamber 21. The second liquid cooling plate 20 faces away from the first liquid cooling plate 10 and is used to fit a plurality of heat sources. The liquid inlet 14 is used to flow in a cooling medium. After circulating through the jet chamber 11, the cooling medium enters the first boiling chamber 21 through the plurality of first jet holes 120. After circulating through the first boiling chamber 21, the cooling medium flows out through the outlet 15. The plurality of heat sources fitted by the second liquid cooling plate 20 are all cooled through the first boiling chamber 21. The pressure drops of the corresponding parts of each heat source in the first boiling chamber 21 are substantially the same. In this way, the resistance received by the cooling medium injected into each part of the first boiling chamber 21 through the first jet holes 120 is also substantially the same. The flow rate of the cooling medium injected into the first boiling chamber 21 through the first jet holes 120 will not be affected by the different power consumptions of each heat source. The amount of the cooling medium injected into the first boiling chamber 21 through the first jet holes 120 is also substantially the same, so that the flow rate of the cooling medium corresponding to each heat source in the first boiling chamber 21 will not be affected by the different power consumptions of the heat sources, ensuring that the heat generated by the heat sources can be quickly dissipated.

[0039] Among them, the density and aperture of the first jet holes 120 can be adjusted according to the different power consumptions of the heat sources corresponding to the first jet holes 120. The aperture of the first jet holes 120 arranged at the positions with high heat source power consumption on the second liquid cooling plate 20 is larger or the density is higher. Correspondingly, the aperture of the first jet holes 120 arranged at the positions with low heat source power consumption on the second liquid cooling plate 20 is smaller or the density is lower.

[0040] In one embodiment, the first liquid-cooled plate 10 includes a first sub-plate 12 and a second sub-plate 13 which are stacked, the first sub-plate 12 and the second sub-plate 13 enclose a jet cavity 11, and a first boiling cavity 21 is formed between the first sub-plate 12 and the second liquid-cooled plate 20. The third liquid-cooled plate 60 is disposed on the side of the second sub-plate 13 away from the first sub-plate 12, and a second boiling cavity 61 is formed between the third liquid-cooled plate 60 and the second sub-plate 13, and the first boiling cavity 21 and the second boiling cavity 61 are connected. The first sub-plate 12 and the second sub-plate 13 may be a split structure, and the first sub-plate 12 and the second sub-plate 13 may be fixed by bonding or other connection methods. Alternatively, the first sub-plate 12 and the second sub-plate 13 may be an integrated structure. As long as the first liquid cooling plate 10 formed by the first sub-plate 12 and the second sub-plate 13 can have a jet cavity 11, and the cooling medium can be sprayed into the first boiling cavity 21 and the second boiling cavity 61 through the jet cavity 11, and the first boiling cavity 21 and the second boiling cavity 61 can be connected. A plurality of second jet holes 130 are provided on the second sub-plate 13, and the plurality of second jet holes 130 are used to connect the second boiling cavity 61 and the jet cavity 11. Among them, the side of the third liquid cooling plate 60 away from the second liquid cooling plate 20 is used to attach multiple heat sources. When the heat source attached to the third liquid cooling plate 60 and the second liquid cooling plate 20 is dissipated, the cooling medium circulates through the jet cavity 11 and then enters the first boiling cavity 21 through the first jet hole 120, and enters the second boiling cavity 61 through the second jet hole 130. The cooling medium circulates through the second boiling cavity 61 and then flows out through the liquid outlet 15. When the temperature of the heat source attached to the second liquid cold plate 20 is high, the cooling medium in the first boiling cavity 21 cools down the heat source, and at least part of the cooling medium in the first boiling cavity 21 will vaporize. When the temperature of the heat source attached to the third liquid cold plate 60 is high, the cooling medium in the second boiling cavity 61 cools down the heat source, and at least part of the cooling medium in the second boiling cavity 61 will vaporize. Since the power consumption of each heat source is different, the vaporization amount of the cooling medium is different. However, since the first boiling chamber 21 and the second boiling chamber 61 are connected, after the cooling medium in the first boiling chamber 21 and the second boiling chamber 61 is vaporized, the pressure drop in the first boiling chamber 21 and the second boiling chamber 61 is also roughly the same, and thus the flow rate injected into the first boiling chamber 21 and the second boiling chamber 61 through the first jet hole 120 and the second jet hole 130 will not be affected, thereby ensuring the heat dissipation performance of the second liquid cooling plate 20 and the third liquid cooling plate 60, thereby ensuring that the heat sources attached to the second liquid cooling plate 20 and the third liquid cooling plate 60 can quickly dissipate heat.

[0041] Among them, the density and aperture of the second jet holes 130 can be adjusted according to the different power consumptions of the heat sources corresponding to the second jet holes 130. The second jet holes 130 provided at the positions where the third liquid cooling plate 60 has high heat source power consumption have a larger aperture or higher density. Correspondingly, the second jet holes 130 provided at the positions where the third liquid cooling plate 60 has low heat source power consumption have a smaller aperture or lower density.

[0042] The second liquid cooling plate 20 includes a first connecting portion 25 and a first recessed portion 26 connected to the first connecting portion 25. The first recessed portion 26 extends away from the first sub-board 12. The first connecting portion 25 is stacked with the first sub-board 12. There is a gap between the first recessed portion 26 and the first sub-board 12, and the gap between the first recessed portion 26 and the first sub-board 12 can form a first boiling cavity 21. Among them, the first recessed portion 26 is formed by die-casting of the second liquid cooling plate 20.

[0043] The third liquid cooling plate 60 includes a second connecting portion and a second recessed portion connected to the second connecting portion. The second recessed portion extends away from the second sub-board 13. The second connecting portion is stacked with the second sub-board 13. There is a gap between the second recessed portion and the second sub-board 13, and the gap between the second recessed portion and the second sub-board 13 can form a second boiling cavity 61. Among them, the second recessed portion is formed by die-casting of the third liquid cooling plate 60.

[0044] In one embodiment, the liquid outlet 15 can be provided on any one of the first sub-board 12, the second sub-board 13 or the second liquid cooling plate 20. When specifically setting the liquid outlet 15, the liquid outlet 15 can be provided on the first sub-board 12, which can simplify the preparation processes of the second sub-board 13 and the second liquid cooling plate 20, and the liquid outlet 15 and the liquid inlet 14 can be provided on both sides of the first sub-board 12.

[0045] In one embodiment, when the first sub-board 12 includes a liquid outlet 15, the first sub-board 12 includes a first notch 121, and the second sub-board 13 includes a second notch 131. The first notch 121 is communicated with the liquid outlet 15, and the first notch 121 and the second notch 131 are communicated, so that the first boiling cavity 21 and the second boiling cavity 61 are communicated through the first notch 121 and the second notch 131. Among them, in the projection of the first sub-board 12, the second notch 131 at least partially overlaps with the first notch 121 to ensure the communication between the first boiling cavity 21 and the second boiling cavity 61.

[0046] In one embodiment, the first sub-board 12 includes a main board 122 and a partition board 123. The first jet hole 120 is provided on the main board 122. One end of the partition board 123 is fixed to the side of the main board 122 facing the second sub-board 13, and the other end of the partition board 123 is fixedly connected to the second sub-board 13. The main board 122, the partition board 123, and the second sub-board 13 enclose a jet cavity 11. Among them, the main board 122 and the partition board 123 are integrally formed, and the gap between the partition board 123 and the liquid outlet 15 is the first notch 121. In one embodiment, the partition board 123 can be formed by bending the side of the main board 122 near the outlet towards the second sub-board 13 immediately.

[0047] In the above embodiment, the radiator further includes at least one first strengthening structure 16. At least one first strengthening structure 16 is disposed in the jet cavity 11. One end of at least one first strengthening structure 16 is connected to the side of the first sub-board 12 facing the second sub-board 13, and the other end of at least one first strengthening structure 16 is connected to the second sub-board 13. At least one first strengthening structure 16 disposed in the jet cavity 11 can improve the strength of the jet cavity 11. The radiator includes a plurality of first strengthening structures 16, and the plurality of first strengthening structures 16 are arranged in an array between the first sub-board 12 and the second sub-board 13, thereby being able to improve the strength of the jet cavity 11.

[0048] Among them, the first strengthening structure 16 can be cylindrical, rectangular, or rectangular, etc.

[0049] In the above embodiment, the radiator further includes at least one second strengthening structure 62. At least one second strengthening structure 62 is disposed in the second boiling cavity 61. One end of at least one second strengthening structure 62 is connected to the side of the first liquid cooling plate 10 facing the third liquid cooling plate 60, and the other end of at least one second strengthening structure 62 is connected to the third liquid cooling plate 60. It can be understood that one end of the second strengthening structure 62 is connected to the side of the second sub-board 13 facing the third liquid cooling plate 60, and the other end of at least one second strengthening structure 62 is connected to the third liquid cooling plate 60. At least one second strengthening structure 62 disposed in the second boiling cavity 61 can improve the strength of the second boiling cavity 61. The radiator includes a plurality of second strengthening structures 62, and the plurality of second strengthening structures 62 can be arranged in an array between the third liquid cooling plate 60 and the second sub-board 13, thereby being able to improve the strength of the second boiling cavity 61.

[0050] Among them, the second strengthening structure 62 can be cylindrical, rectangular, or rectangular, etc.

[0051] In the above embodiments, the radiator further includes at least one third strengthening structure 24. The at least one third strengthening structure 24 is disposed in the first boiling cavity 21. One end of the at least one third strengthening structure 24 is connected to the side of the first liquid cooling plate 10 facing the second liquid cooling plate 20, and the other end of the at least one second strengthening structure 62 is connected to the second liquid cooling plate 20. It can be understood that one end of the third strengthening structure 24 is connected to the side of the first sub-plate 12 facing the second liquid cooling plate 20, and the other end of the at least one third strengthening structure 24 is connected to the second liquid cooling plate 20. The at least one third strengthening structure 24 is disposed in the first boiling cavity 21, which can improve the strength of the first boiling cavity 21. The radiator may include a plurality of third strengthening structures 24, and the plurality of third strengthening structures 24 may be arranged in an array between the first liquid cooling plate 10 and the first sub-plate 12, thereby improving the strength of the first boiling cavity 21.

[0052] Among them, the third strengthening structure 24 can be cylindrical, rectangular or rectangular, etc.

[0053] Obviously, those skilled in the art can make various changes and modifications to the present application without departing from the scope of the present application. Thus, if these modifications and variations of the present application fall within the scope of the claims of the present application and their equivalent technologies, the present application is also intended to include these changes and modifications.

Claims

1. A radiator, characterized in that, Comprising: A first liquid cooling plate and a second liquid cooling plate, with a first boiling chamber formed between the first liquid cooling plate and the second liquid cooling plate; The first liquid cooling plate includes a jet chamber, a liquid inlet, and a plurality of first jet holes. The liquid inlet is in communication with the jet chamber, and the plurality of first jet holes are used to communicate the jet chamber and the first boiling chamber; An outlet is provided on one side of the first boiling chamber, and the outlet is in communication with the first boiling chamber. Wherein, the side of the second liquid cooling plate facing away from the first liquid cooling plate is used to fit multiple heat sources; The liquid inlet is used to introduce a cooling medium. The cooling medium circulates through the jet chamber and then enters the first boiling chamber through the plurality of first jet holes. The cooling medium circulates through the first boiling chamber and then flows out through the outlet.

2. The radiator according to claim 1, characterized in that, The first liquid cooling plate includes a first sub-plate and a second sub-plate arranged in a stacked manner. The first sub-plate and the second sub-plate enclose to form the jet chamber. A first boiling chamber is formed between the first sub-plate and the second liquid cooling plate. The first sub-plate includes the liquid inlet and the plurality of first jet holes; The radiator further includes a third liquid cooling plate. A second boiling chamber is formed between the third liquid cooling plate and the second sub-plate. The first boiling chamber is in communication with the second boiling chamber. A plurality of second jet holes are provided on the second sub-plate, and the plurality of second jet holes are used to communicate the second boiling chamber and the jet chamber; The side of the third liquid cooling plate facing away from the second liquid cooling plate is used to fit multiple heat sources; The cooling medium circulates through the jet chamber and then enters the second boiling chamber through the plurality of second jet holes. The cooling medium circulates through the second boiling chamber and then flows out through the outlet.

3. The radiator according to claim 2, characterized in that, The outlet is provided on any one of the first sub-plate, the second sub-plate, or the second liquid cooling plate.

4. The radiator according to claim 3, characterized in that, The first sub-plate includes a main board and a partition board. The first jet holes are provided on the main board. One end of the partition board is fixed to the side of the main board facing the second sub-plate, and the other end of the partition board is fixedly connected to the second sub-plate.

5. The radiator according to any one of claims 2 to 4, characterized in that, The radiator further includes at least one first strengthening structure. One end of the at least one strengthening structure is connected to the side of the first sub-plate facing the second sub-plate, and the other end of the at least one first strengthening structure is connected to the second sub-plate.

6. The radiator according to claim 5, characterized in that, The at least one first strengthening structure is arranged in an array between the first sub-plate and the second sub-plate.

7. The radiator according to any one of claims 2 to 6, characterized in that, The radiator further includes at least one second strengthening structure. One end of the at least one second strengthening structure is connected to the side of the first liquid cooling plate facing the third liquid cooling plate, and the other end of the at least one second strengthening structure is connected to the third liquid cooling plate.

8. The radiator according to claim 7, characterized in that, The at least one second strengthening structure is arranged in an array between the first liquid cooling plate and the third liquid cooling plate.

9. The radiator according to any one of claims 1 to 8, characterized in that, The radiator further includes at least one third strengthening structure. One end of the at least one third strengthening structure is connected to the side of the second liquid cooling plate facing the first liquid cooling plate, and the other end of the at least one third strengthening structure is connected to the first liquid cooling plate.

10. The radiator according to claim 9, characterized in that, The at least one third reinforcing structure is distributed in an array between the first liquid cooling plate and the second liquid cooling plate.

11. The radiator according to any one of claims 1 to 10, characterized in that, The radiator further includes a first bracket and a first elastic connecting member. The first bracket is disposed on a side of the second liquid cooling plate facing away from the first liquid cooling plate. The first elastic connecting member elastically connects the first bracket and the second liquid cooling plate. A plurality of the heat sources are accommodated between the first bracket and the second liquid cooling plate.

12. The radiator according to any one of claims 1 to 11, characterized in that, The radiator further includes a second bracket and a second elastic connecting member. The second bracket is disposed on a side of the third liquid cooling plate facing away from the first liquid cooling plate. The second elastic connecting member elastically connects the second bracket and the third liquid cooling plate. A plurality of the heat sources are accommodated between the second bracket and the third liquid cooling plate.

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