Automatic onboard temperature testing device for quartz crystal oscillator

By designing an automatic device including a positioning frame, a flip disk, a lower tray and an upper cover plate, the problem of unstable oscillator flip in the prior art is solved, and stable flip and automatic detection of quartz crystal oscillator is realized, and detection accuracy and efficiency are improved.

CN120176879AActive Publication Date: 2025-06-20TANGSHAN GUOXIN JINGYUAN ELECTRONICS CO LTD
View PDF 7 Cites 0 Cited by

Patent Information

Application Number
CN202510652999.6
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-05-21
Publication Date
2025-06-20
Estimated Expiration
2045-05-21

AI Technical Summary

Technical Problem

The existing test machine flip mechanism or feeding structure cannot stably flip the quartz crystal oscillator, resulting in the oscillator being unable to be properly aligned during the detection process, affecting the detection accuracy and efficiency.

Method used

An automatic device including a positioning frame, a flip disk, a lower tray and an upper cover plate is designed. Through the relative movement of the flip disk and a positioning frame, the stable flip of the oscillator is realized, and automatically recognized and detected through the test mechanism and camera module.

Benefits of technology

It realizes stable flip and automatic detection of quartz crystal oscillator, improves detection accuracy and efficiency, and meets the needs of automotive-grade products for high and low temperature testing.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN120176879A_ABST
    Figure CN120176879A_ABST
Patent Text Reader

Abstract

The invention relates to the technical field of oscillator automatic detection, and provides quartz crystal oscillator onboard temperature test automatic equipment, which comprises a positioning frame, a rotating device, a positioning groove penetrating up and down, the positioning groove is used for accommodating an oscillator main body, and an overturning disc, and the rotating device, the overturning disc and the positioning frame are arranged in a relative movement manner along the axis direction; the lower tray is arranged on the overturning disc, the lower tray is provided with lower supporting blocks and lower through holes, the lower supporting blocks and the lower through holes are used for being opposite to the positioning grooves in position, and the lower supporting blocks and the lower through holes are arranged in the axis direction of the overturning disc at intervals; the upper cover plate is arranged above the lower tray, the upper cover plate is provided with an upper supporting block and an upper through hole which are opposite to the positioning groove in position, the upper through hole and the lower supporting block are oppositely arranged up and down, the upper supporting block and the lower through hole are oppositely arranged up and down, and the oscillator main body penetrates through the upper through hole or the lower through hole and then is placed in the positioning groove. According to the technical scheme, the problem that the crystal oscillator cannot be stably overturned by an existing overturning mechanism or feeding structure of the testing machine is solved.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] The present invention relates to the technical field of automatic detection of oscillators, and particularly to an on-board temperature test automatic device for a quartz crystal oscillator. Background Art

[0002] Currently, with the development of product miniaturization, the requirements for product temperature parameters are getting higher and higher. The number of oscillator temperature measurements is increasing. Originally, only random sampling of the same batch of products was sent for inspection and temperature measurement, and the number of samples was very small. Now, the production of automotive-grade products has increased explosively, and more and more high and low temperature tests at various temperatures are required. The production capacity of manual placement and loading can no longer meet the production demand.

[0003] During testing, the crystal oscillator needs to be placed in a special test socket to detect its various parameters. The pins of the crystal oscillator need to correspond one by one and be uniquely electrically connected to the test probes of the test socket. Therefore, during the automatic detection process, it is necessary to identify the front and back of the crystal oscillator and quickly flip the crystal oscillator placed on the reverse side. The existing test machine flipping mechanism or feeding structure cannot stably flip the crystal oscillator. Summary of the Invention

[0004] The technical problem to be solved by the present invention is, in view of the above-mentioned existing technical deficiencies, to provide an on-board temperature test automatic device for a quartz crystal oscillator, which solves the problem that the existing test machine flipping mechanism or feeding structure cannot stably flip the crystal oscillator.

[0005] The technical solution adopted by the present invention is: to provide an on-board temperature test automatic device for a quartz crystal oscillator, including: A positioning frame, rotatably arranged, having a positioning groove that penetrates up and down, and the positioning groove is used to accommodate the oscillator body. A flipping disk, rotatably arranged, the positioning frame is located on the axis of the flipping disk, and the flipping disk and the positioning frame are arranged to move relative to each other along the axis direction. A lower tray, arranged on the flipping disk, the lower tray has a lower supporting block and a lower through hole that are opposite to the position of the positioning groove, and the lower supporting block and the lower through hole are arranged at intervals in the axis direction of the flipping disk. An upper cover plate, arranged above the lower tray, the upper cover plate has an upper supporting block and an upper through hole that are opposite to the position of the positioning groove, the upper through hole is arranged opposite to the lower supporting block up and down, the upper supporting block is arranged opposite to the lower through hole up and down, and the oscillator body passes through the upper through hole or the lower through hole and is placed in the positioning groove. In the vertical direction, the oscillator body is located between the lower supporting block and the upper supporting block.

[0006] To further optimize this technical solution, a guiding hole is provided in the middle of the flipping disk, and the guiding hole is slidably sleeved outside the positioning frame, and the positioning frame drives the flipping disk to rotate; further comprising: A flipping driving unit for driving the positioning frame to rotate; A workbench, and the flipping driving unit is arranged on the workbench; A reciprocating driving unit is arranged on the workbench and has a moving end. The moving end abuts against the flipping disk to drive the flipping disk to move relative to the positioning frame, and the moving end is rotatably arranged relative to the flipping disk.

[0007] To further optimize this technical solution, a testing mechanism is further included, and the testing mechanism includes: A testing base is arranged on the workbench and has a testing groove for placing the oscillator main body. The testing base also has testing probes for electrically connecting with the oscillator main body, and a clamping portion is provided at the end of the testing base; A testing pressing cover is rotatably connected to the testing base through a first torsion spring, and the first torsion spring is used to provide an elastic force for opening the testing pressing cover; A fastening member. The middle of the fastening member is rotatably connected to the end of the testing pressing cover through a second torsion spring. A clamping head is provided at the lower part of the fastening member. After the testing pressing cover is buckled on the upper end of the testing base, the clamping head is clamped with the clamping portion to fix the oscillator main body. The second torsion spring is used to provide the pressure for the clamping head to be clamped in the clamping portion. A triggering portion is provided at the upper end of the fastening member. After the triggering portion rotates, the clamping head disengages from the clamping portion.

[0008] To further optimize this technical solution, there are several testing mechanisms, and further comprising: A carrying platform is movably arranged on the workbench, and several testing mechanisms are arranged in an array on the carrying platform; A loading slider is movably arranged on the workbench, and the moving direction of the loading slider is perpendicular to the moving direction of the carrying platform; A fastening pressing rod is arranged on the loading slider in a lifting manner, and after the fastening pressing rod descends, it approaches the testing mechanism; A loading suction nozzle is arranged on the loading slider in a lifting manner. The loading suction nozzle is communicated with an external negative pressure mechanism, and the loading suction nozzle is used to transfer the oscillator main body in the positioning groove to the testing groove.

[0009] To further optimize this technical solution, further comprising: A pin discrimination camera module is located between the positioning frame and the carrying platform and below the positioning frame. When the loading suction nozzle slides following the loading slider, it passes through the pin discrimination camera module, and the pin discrimination camera module is used to take pictures and identify the pins of the oscillator main body. The positioning stepping motor is lifted and lowered on the loading slide block and is used to drive the loading nozzle to rotate.

[0010] Further optimization of this technical solution also includes: A loading tray, movably arranged on the workbench, for carrying bulk materials of the oscillator body; A loading slider is slidably disposed on the workbench and slides between the loading tray and the positioning frame; A loading nozzle is lifted and lowered on the loading slide block, and the loading nozzle is used to transfer the oscillator body on the loading tray to the positioning groove.

[0011] Further optimization of this technical solution also includes: An appearance identification camera module is movably arranged above the loading tray and is used to take photos and identify the appearance of the bulk material of the oscillator body; An angle discrimination camera module is located between the loading tray and the positioning frame and below the positioning frame. The loading nozzle passes through the angle discrimination camera module when sliding along with the loading slider. The angle discrimination camera module is used to identify the angle of the oscillator body. An angle-adjustable stepping motor is lifted and lowered on the feeding slide block and is used to drive the feeding nozzle to rotate.

[0012] Further optimization of this technical solution also includes: The front and back distinguishing camera module is arranged above the positioning groove and is used for identifying the front and back of the oscillator body in the positioning groove.

[0013] Further optimization of this technical solution also includes: The test monitoring camera module is movably arranged above the test mechanism and is used to monitor the use status of the test mechanism.

[0014] Further optimization of this technical solution also includes: The classification collection box is rotatably arranged on the workbench and is located beside the supporting platform. The classification collection box has six collection slots distributed along the circumference, and the collection slots are used to accommodate the oscillator body after the test.

[0015] The beneficial effects of the present invention are: 1. In the initial state, the upper cover plate is located on the upper side of the lower tray, the oscillator body can enter the positioning groove from the upper through hole, and the lower support block is located below and can abut or space with the lower end of the oscillator body to prevent the oscillator body from falling.

[0016] 2. When the oscillator body is in the reverse position, i.e., when the pins of the oscillator body are facing upward, the positioning frame and the flipping disk rotate for turning over, the lower tray rotates to the upper side, and the flipping disk moves relative to the positioning frame, so that the lower through hole of the lower tray is opposite to the position of the oscillator body, facilitating the removal of the oscillator body. The upper supporting block is located below the oscillator body to prevent the oscillator body from falling, and the stable turning over of the oscillator body is completed. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 Schematic diagram of the three-dimensional general assembly structure of the present invention; Figure 2 of the present invention Figure 1 Schematic diagram of the partial enlarged structure at a in Figure 3 of the present invention Figure 1 Schematic diagram of the partial enlarged structure at b in Figure 4 Front view structure schematic diagram of the present invention; Figure 5 Top view structure schematic diagram of the present invention; Figure 6 Schematic diagram of the turning-over mechanism structure of the present invention; Figure 7 Top view structure schematic diagram of the turning-over mechanism of the present invention; Figure 8 of the present invention Figure 7 Schematic diagram of the sectional structure at the A-A position in Figure 9 of the present invention Figure 8 Schematic diagram of the partial enlarged structure at c in Figures 10 - 12 Schematic diagram of the turning-over process of the present invention; Figure 13 Schematic diagram of the testing mechanism structure of the present invention; Figure 14 Vertical sectional structure schematic diagram of the testing mechanism of the present invention; Figure 15 Schematic diagram of the partial structure of the positioning frame of the present invention; Figure 16 Schematic diagram of the oscillator body structure of the present invention; Marking Explanation in the Figures: 1. Oscillator body; 101. Pin; 2. Workbench; 3. Positioning frame; 301. Positioning groove; 302. Spline shaft; 4. Flipping disk; 401. Lower tray; 4011. Lower supporting block; 4012. Lower through-hole; 402. Upper cover plate; 4021. Upper supporting block; 4022. Upper through-hole; 403. Guide hole; 404. Flipping drive unit; 405. Reciprocating drive unit; 4051. Mobile end; 406. Positive / negative discrimination camera module; 5. Testing mechanism; 501. Testing base; 5011. Testing groove; 5012. Testing probe; 5013. Clamping part; 502. Testing pressing cover; 5021. First torsion spring; 503. Fastening part; 5031. Second torsion spring; 5032. Chuck; 5033. Trigger part; 504. Carrying platform; 5041. PCB detection board; 505. Testing monitoring camera module; 6. Loading slider; 601. Fastening pressure rod; 602. Loading suction nozzle; 603. Pin discrimination camera module; 604. Alignment stepping motor; 7. Feeding tray; 701. Feeding slider; 702. Feeding suction nozzle; 703. Appearance discrimination camera module; 704. Angle discrimination camera module; 705. Angle adjustment stepping motor; 8. Classification collection box; 801. Collection groove. Detailed Implementation Manner

[0018] The present invention will be further described in detail below with reference to the accompanying drawings and the detailed implementation manner.

[0019] For the sake of simplicity of the drawings, only the parts related to the invention are schematically shown in each figure, and they do not represent the actual structure of the product. In addition, for the sake of simplicity and easy understanding of the drawings, in some figures, parts with the same structure or function are only schematically shown for one of them, or only one of them is marked. In this article, "one" not only means "only this one", but also can mean "more than one" situation, and "several" includes "two" and "more than two".

[0020] In this article, it should be noted that unless otherwise clearly specified and limited, the terms "installation", "connection", and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0021] In addition, in the description of the present application, the terms "first", "second", etc. are only used for distinguishing descriptions, and cannot be understood as indicating or implying relative importance.

[0022] As Figures 1 - 16As shown in the figure, an on-board temperature test automatic device for a quartz crystal oscillator includes a positioning frame 3, which is rotatably arranged and has a positioning groove 301 that penetrates up and down. The positioning groove 301 is used to accommodate the oscillator body 1. A flipping disk 4 is rotatably arranged. The positioning frame 3 is located on the axis of the flipping disk 4, and the flipping disk 4 and the positioning frame 3 are arranged to move relative to each other along the axis direction. A lower tray 401 is arranged on the flipping disk 4. The lower tray 401 has a lower supporting block 4011 and a lower through hole 4012 that are opposite to the position of the positioning groove 301. The lower supporting block 4011 and the lower through hole 4012 are arranged at intervals in the axis direction of the flipping disk 4. An upper cover plate 402 is arranged above the lower tray 401. The upper cover plate 402 has an upper supporting block 4021 and an upper through hole 4022 that are opposite to the position of the positioning groove 301. The upper through hole 4022 is vertically opposite to the lower supporting block 4011, and the upper supporting block 4021 is vertically opposite to the lower through hole 4012. The oscillator body 1 is placed in the positioning groove 301 after passing through the upper through hole 4022 or the lower through hole 4012. In the vertical direction, the oscillator body 1 is located between the lower supporting block 4011 and the upper supporting block 4021.

[0023] The middle part of the flipping disk 4 has a guiding hole 403, and the guiding hole 403 is slidably sleeved outside the positioning frame 3, and the positioning frame 3 drives the flipping disk 4 to rotate. It further includes: a flipping driving unit 404 for driving the positioning frame 3 to rotate; a workbench 2, and the flipping driving unit 404 is arranged on the workbench 2; a reciprocating driving unit 405 is arranged on the workbench 2 and has a moving end 4051. The moving end 4051 abuts against the flipping disk 4 for driving the flipping disk 4 to move relative to the positioning frame 3, and the moving end 4051 is rotatably arranged relative to the flipping disk 4.

[0024] When in use, taking the initial state where the upper cover plate 402 is on the upper side as an example, the pin 101 of the oscillator body 1 is on one side. It is required that the pins 101 of the oscillator body 1 face down uniformly. The positioning groove 301 is vertically opposite to the upper through hole 4022, and the lower supporting block 4011 is located below the positioning groove 301.

[0025] The oscillator body 1 realizes positive and negative flipping in the flipping mechanism. As Figure 9 shown, the oscillator body 1 enters the positioning groove 301 from the upper through hole 4022. The oscillator body 1 can be clamped in the positioning groove 301 and is positioned by relying on the positioning groove 301. There is a gap between the lower end and the lower supporting block 4011, and the lower supporting block 4011 can prevent the oscillator body 1 from falling. It is also possible that the oscillator body 1 is clamped in the positioning groove 301 and the lower end abuts against the lower supporting block 4011, which can more accurately position the oscillator body 1. When the pin 101 of the oscillator body 1 faces down, it can be taken out from the upper through hole 4022. When the pin 101 of the oscillator body 1 faces up, it is necessary to flip the oscillator body 1. The following flipping process can be adopted. As Figures 10 - 12 shown, the first step is as Figure 10As shown, the flip plate 4 moves to the right side along the axial direction as shown in the figure, so that the lower through hole 4012 and the upper supporting block 4021 are close to the positioning groove 301, and the upper through hole 4022 and the lower supporting block 4011 are away from the positioning groove 301 to the right. At this time, the oscillator body 1 is located in the positioning groove 301, and the left side of the oscillator body 1 is located below the right part of the upper supporting block 4021, and the right side is located above the left part of the lower supporting block 4011; the second step, as shown in FIG. Figure 11 As shown, the flip plate 4 and the positioning frame 3 are synchronously rotated 180° to turn over, and the lower tray 401 is turned upward. At this time, the pin 101 of the oscillator body 1 is turned downward, and the left part of the lower support block 4011 covers the upper right side of the oscillator body 1; the third step, as shown in FIG. Figure 12 As shown, the flip plate 4 continues to move to the right side, so that the lower through hole 4012 and the positioning groove 301 are opposite to each other, and the upper supporting block 4021 is located below the oscillator body 1, and the lower supporting block 4011 is separated from the oscillator body 1, and the oscillator body 1 that has been flipped over can be taken out from the lower through hole 4012. Then, the flipped state can be maintained and a new oscillator body 1 can be placed. When it is necessary to flip over, the above flipping process can be reversed to reset to the initial state.

[0026] The shape of the positioning groove 301 is adapted to the shape of the oscillator body 1 . The positioning groove 301 may be a rectangular structure, and the four corners are expanded to facilitate the smooth entry of the oscillator body 1 and reduce obstacles.

[0027] The flip disk 4 is movably sleeved outside the positioning frame 3. The positioning frame 3 may include a spline shaft 302. The spline shaft 302 is transmission-connected with the flip drive unit 404. The guide hole 403 is slidably sleeved on the spline shaft 302, so that the flip disk 4 can be moved. When the positioning frame 3 rotates, the rotation can be transmitted to drive the flip disk 4 to rotate synchronously. The flip drive unit 404 can use a stepper motor to realize the rotation angle control and is installed on the workbench 2. The reciprocating drive unit 405 can use a cylinder assembly, etc. to reciprocate the flip disk 4 left and right. The moving end 4051 can be "U"-shaped. The outer periphery of the flip disk 4 has an annular convex edge. The moving end 4051 is stuck on the convex edge. The convex edge can rotate in the "U"-shaped structure. The moving end 4051 can drive the flip disk 4 to move left and right. The flip disk 4 can rotate freely without affecting the moving end 4051.

[0028] Further, it further includes a testing mechanism 5, and the testing mechanism 5 includes: a testing base 501, which is arranged on the workbench 2 and has a testing slot 5011 for placing the oscillator body 1. The testing base 501 also has testing probes 5012 for electrically connecting with the oscillator body 1, and a clamping portion 5013 at the end of the testing base 501; a testing pressing cover 502, which is rotatably connected to the testing base 501 through a first torsion spring 5021, and the first torsion spring 5021 is used to provide an elastic force for opening the testing pressing cover 502; a fastening member 503, the middle of the fastening member 503 is rotatably connected to the end of the testing pressing cover 502 through a second torsion spring 5031. The lower part of the fastening member 503 has a clamping head 5032. After the testing pressing cover 502 is buckled on the upper end of the testing base 501, the clamping head 5032 is clamped with the clamping portion 5013 for fixing the oscillator body 1. The second torsion spring 5031 is used to provide the pressure for the clamping head 5032 to be clamped with the clamping portion 5013. The upper end of the fastening member 503 has a triggering portion 5033. After the triggering portion 5033 rotates, the clamping head 5032 disengages from the clamping portion 5013.

[0029] There are several testing mechanisms, and it further includes: a bearing platform 504, which is movably arranged on the workbench 2, and several testing mechanisms 5 are arranged in an array on the bearing platform 504; a loading slider 6, which is movably arranged on the workbench 2, and the moving direction of the loading slider 6 is perpendicular to the moving direction of the bearing platform 504; a fastening pressure rod 601, which is arranged to move up and down on the loading slider 6, and after the fastening pressure rod 601 descends, it approaches the testing mechanism; a loading suction nozzle 602, which is arranged to move up and down on the loading slider 6, and the loading suction nozzle 602 is communicated with an external negative pressure mechanism. The loading suction nozzle 602 is used to transfer the oscillator body 1 in the positioning slot 301 into the testing slot 5011.

[0030] It further includes: a pin 101 discrimination camera module, which is located between the positioning frame 3 and the bearing platform 504 and below the positioning frame 3. When the loading suction nozzle 602 slides along with the loading slider 6, it passes by the pin 101 discrimination camera module. The pin 101 discrimination camera module is used to take pictures and identify the pins 101 of the oscillator body 1; a positioning stepping motor 604, which is arranged to move up and down on the loading slider 6 and is used to drive the loading suction nozzle 602 to rotate.

[0031] It further includes: a testing monitoring camera module 505, which is movably arranged above the testing mechanism 5 and is used to monitor the usage status of the testing mechanism 5.

[0032] It further includes: a classification collection box 8, which is rotatably arranged on the workbench 2 and beside the bearing platform 504. The classification collection box 8 has six collection slots 801 distributed circumferentially, and the collection slots 801 are used to accommodate the oscillator bodies 1 after the testing is completed.

[0033] During use, after turning over at the positioning frame 3, the pins 101 of the oscillator body 1 face downward uniformly. After being taken out from the positioning groove 301, it can be placed in the testing mechanism 5 for detection. The oscillator body 1 is placed in the testing groove 5011, and testing probes 5012 are arranged in the testing groove 5011 and are connected to the pins 101 of the oscillator body 1 one by one. Then, the testing cover 502 is closed, and the buckle of the buckling member 503 is clamped on the clamping portion 5013. The testing cover 502 can press the oscillator body 1 tightly in the testing groove 5011 to ensure stable electrical connection between the pins 101 and the testing probes 5012. After the detection is completed, the testing cover 502 is opened and the oscillator body 1 is taken out.

[0034] The carrier 504 may include a PCB detection board 5041. The PCB detection board 5041 is connected to the testing probes 5012. A number of testing mechanisms 5 are arranged in an array on the PCB detection board 5041 of the carrier 504, which is convenient for batch detection. The oscillator body 1 can be automatically placed into the testing groove 5011 through the buckling pressure rod 601 and the loading nozzle 602. By moving the loading slider 6, the buckling pressure rod 601 and the loading nozzle 602 are driven to move between the positioning groove 301 and the testing groove 5011. The loading nozzle 602 can be controlled by an external negative pressure mechanism to achieve negative pressure adsorption for picking and placing. After the loading nozzle 602 descends, it adsorbs the oscillator body 1 in the positioning groove 301, then rises to take out the oscillator body 1 and follows the slider to slide and transfer to the testing groove 5011. The loading nozzle 602 descends to place the oscillator body 1 in the testing groove 5011. As Figure 3 shown, the buckling pressure rod 601 descends, and then the carrier 504 moves to make the testing cover 502 approach the buckling pressure rod 601. The testing cover 502 is in an inclined state when it is open, and the outer inclined surface faces the buckling pressure rod 601. During the movement, the lower end of the buckling pressure rod 601 abuts against the testing cover 502, driving the testing cover 502 to be gradually pressed down and buckled closed. Subsequently, the buckling pressure rod 601 quickly retracts, completing the loading of the oscillator body 1 in the testing mechanism 5, and various parameter detections can be carried out.

[0035] The oscillator body 1 can also be taken out of the test slot 5011 by using the loading nozzle 602. When taking it out, the carrier 504 moves so that the structure to be opened at this time moves to a position opposite to the position of the fastening lever 601. The fastening lever 601 descends and abuts on the trigger part 5033 of the fastening part 503, causing the fastening part 503 to rotate, and the chuck 5032 disengages from the engaging part 5013. The fastening lever 601 gradually rises, and under the elastic force of the first torsion spring 5021, the test cover 502 is bounced open, exposing the oscillator body 1 in the test slot 5011. The carrier 504 moves so that the oscillator body 1 is opposite to the loading nozzle 602. The loading nozzle 602 moves above the oscillator body 1 and takes out the oscillator body 1 from the test slot 5011 through the descending and ascending actions. Subsequently, the oscillator body 1 with the detection completed can be placed in the classification collection box 8.

[0036] When the pins 101 of the oscillator body 1 and the test probes 5012 are in one-to-one correspondence and are uniquely corresponding, the shape of one of the pins 101 of the oscillator body 1 is different from that of the other pins 101. By taking a picture of the lower pins 101 of the oscillator body 1 by the pin 101 discrimination camera module, it can be determined whether the positions of the pins 101 of the oscillator body 1 correspond correctly to the test probes 5012. When they do not correspond, the alignment stepping motor 604 can be rotated by 180°, and then the oscillator body 1 is placed in the test slot 5011.

[0037] The test monitoring camera module 505 can monitor the usage status of the lower test mechanism 5, such as the open / closed status of the test covers 502 of different test mechanisms 5, and whether there is an oscillator body 1 in the test slot 5011 of the test mechanism 5 in the open state, which is convenient for controlling the loading action.

[0038] The classification collection box 8 can collect the oscillator bodies 1 with the detection completed. According to the parameter requirements such as capacitance and resistance, they are divided into six levels. A database for each level classification can be established through the control center. By comparing the detection data of each oscillator body 1, different levels can be distinguished and placed in the corresponding collection slots 801. The classification collection box 8 can be driven to rotate by a component motor, which is convenient for rotating to change the position of the collection slot 801 to collect the oscillator bodies 1 of the corresponding level. Comparing the detection data with the database is prior art, and testing the parameters of the oscillator body 1 through the PCB board connecting the test probes 5012 and the detection system is prior art.

[0039] Furthermore, it also includes: a loading tray 7, which is movably set on the workbench 2 and is used to carry the bulk material of the oscillator body 1; a loading slider 701, which is slidably set on the workbench 2 and slides between the loading tray 7 and the positioning frame 3; a loading nozzle 702, which is lifted and lowered on the loading slider 701, and the loading nozzle 702 is used to transfer the oscillator body 1 on the loading tray 7 to the positioning groove 301.

[0040] The appearance identification camera module 703 is movably arranged above the loading tray 7, and is used to photograph and identify the appearance of the bulk material of the oscillator body 1; the angle identification camera module 704 is located between the loading tray 7 and the positioning frame 3, and is located below the positioning frame 3. When the loading nozzle 702 slides along with the loading slider 701, it passes through the angle identification camera module 704. The angle identification camera module 704 is used to identify the angle of the oscillator body 1; the angle adjustment stepping motor 705 is raised and lowered on the loading slider 701, and is used to drive the loading nozzle 702 to rotate.

[0041] When in use, the positioning groove 301 can be automatically loaded by the loading nozzle 702. The oscillator bodies 1 can be randomly placed on the loading tray 7, and the moving direction of the loading tray 7 can be perpendicular to the sliding direction of the loading slider 701, so that the loading nozzle 702 can move above each oscillator body 1. The loading nozzle 702 drops down to pick up an oscillator body 1, and then moves up to pass through the angle discrimination camera module 704 to obtain the angle data of the oscillator body 1, and then adjusts the rotation of the nozzle through the angle adjustment step motor control, and aligns the oscillator body 1 so that it can smoothly enter the positioning groove 301.

[0042] The appearance identification camera module 703 can take pictures of the oscillator bodies 1 scattered above the loading tray 7 to identify the appearance parameters. The products with a rectangular structure and four-side data within the preset parameters are qualified products in appearance. The loading nozzle 702 transfers the qualified oscillator bodies 1 to the positioning groove 301.

[0043] Furthermore, it also includes: a front and back distinguishing camera module 406 , which is arranged above the positioning groove 301 and is used to identify the front and back of the oscillator body 1 in the positioning groove 301 .

[0044] When in use, the front and back distinguishing camera module 406 can take a photo of the oscillator body 1 in the positioning groove 301 to identify the front and back, that is, determine whether the pin 101 is facing up or down, and then determine whether to perform a flip after feedback information. The angle distinguishing camera module 704 can also determine the front and back of the oscillator body 1 through image processing.

[0045] The loading nozzle 602 and the feeding nozzle 702 have the same structure, both of which are conical hose heads.

[0046] The test monitoring camera module 505, the front and back discrimination camera module 406, the angle discrimination camera module 704, the appearance discrimination camera module 703, and the pin 101 discrimination camera module are all vision systems, which are prior arts. The vision systems can communicate with the control center, and the control center processes image information and performs drive control to control the movement of the loading tray 7, the sliding of the loading slider 701, the rotation of the angle adjustment stepping motor 705, and the lifting and adsorption switch of the loading suction nozzle 702 to achieve automatic feeding of the positioning groove 301; control the flipping drive unit 404 and the reciprocating drive unit 405 to perform automatic flipping; control the movement of the carrier plate, the sliding of the loading slider 6, the rotation of the alignment stepping motor 604, and the lifting of the loading suction nozzle 602 and the fastening pressure rod 601 to achieve automatic loading and unloading of the test; control the rotation of the classification collection to adjust the position of the collection groove 801. Sliding and lifting, etc. can all be achieved through prior arts, such as cylinder components, lead screw mechanisms, link structures, cam lifting structures, etc.

[0047] It can be understood that the present invention is described through some embodiments. Those skilled in the art know that without departing from the spirit and scope of the present invention, various changes or equivalent replacements can be made to these features and embodiments. In addition, under the teaching of the present invention, these features and embodiments can be modified to adapt to specific situations and materials without departing from the spirit and scope of the present invention. Therefore, the present invention is not limited by the specific embodiments disclosed herein, and all embodiments falling within the scope of the claims of this application belong to the scope protected by the present invention.

Claims

1. An automatic onboard temperature test device for a quartz crystal oscillator, characterized in that: include: The positioning frame (3) is rotatably arranged and has a positioning groove (301), the positioning groove (301) penetrates from top to bottom, and the positioning groove (301) is used to accommodate the oscillator body (1). The flip plate (4) is rotatably arranged, the positioning frame (3) is located on the axis of the flip plate (4), and the flip plate (4) and the positioning frame (3) are relatively movable along the axis direction; A lower tray (401) is arranged on the flip tray (4), the lower tray (401) having a lower supporting block (4011) and a lower through hole (4012) for being positioned opposite to the positioning groove (301), the lower supporting block (4011) and the lower through hole (4012) being arranged at intervals in the axial direction of the flip tray (4); An upper cover plate (402) is arranged above the lower tray (401), and the upper cover plate (402) has an upper supporting block (4021) and an upper through hole (4022) for being positioned opposite to the positioning groove (301); the upper through hole (4022) and the lower supporting block (4011) are arranged opposite to each other in vertical direction; the upper supporting block (4021) and the lower through hole (4012) are arranged opposite to each other in vertical direction; the oscillator body (1) is placed in the positioning groove (301) after passing through the upper through hole (4022) or the lower through hole (4012); in the vertical direction, the oscillator body (1) is located between the lower supporting block (4011) and the upper supporting block (4021).

2. The on-board temperature automatic test equipment of a quartz crystal oscillator according to claim 1, characterized in that: The flip plate (4) has a guide hole (403) in the middle, and the guide hole (403) is slidably sleeved outside the positioning frame (3), and the positioning frame (3) drives the flip plate (4) to rotate; and further comprises: A turning drive unit (404), used for driving the positioning frame (3) to rotate; A workbench (2), wherein the flip driving unit (404) is arranged on the workbench (2); A reciprocating drive unit (405) is arranged on the workbench (2) and has a movable end (4051). The movable end (4051) abuts against the flip disk (4) and is used to drive the flip disk (4) to move relative to the positioning frame (3). The movable end (4051) and the flip disk (4) are arranged to rotate relative to each other.

3. The on-board temperature automatic test equipment of a quartz crystal oscillator according to claim 2, characterized in that: Also included is a testing mechanism (5), the testing mechanism (5) comprising: A test base (501) is arranged on the workbench (2) and has a test slot (5011), wherein the test slot (5011) is used to place the oscillator body (1), the test base (501) also has a test probe (5012) for electrically connecting to the oscillator body (1), and the end of the test base (501) has a clamping portion (5013); A test pressure cover (502) is rotatably connected to the test base (501) via a first torsion spring (5021), wherein the first torsion spring (5021) is used to provide an elastic force for opening the test pressure cover (502); A snap-fitting member (503), wherein the middle portion of the snap-fitting member (503) is rotatably connected to the end portion of the test pressure cover (502) via a second torsion spring (5031), wherein the lower portion of the snap-fitting member (503) has a clamping head (5032), and after the test pressure cover (502) is snap-fitted to the upper end of the test base (501), the clamping head (5032) is clamped to the clamping portion (5013) to fix the oscillator body (1), and the second torsion spring (5031) is used to provide pressure for the clamping head (5032) to be clamped to the clamping portion (5013), and the upper end of the snap-fitting member (503) has a triggering portion (5033), and after the triggering portion (5033) is rotated, the clamping head (5032) is disengaged from the clamping portion (5013).

4. The on-board temperature automatic test equipment of a quartz crystal oscillator according to claim 3, characterized in that: The testing mechanism (5) has several parts and also includes: A carrying platform (504) is movably arranged on the workbench (2), and a plurality of the testing mechanisms (5) are arranged in an array on the carrying platform (504); A loading slider (6) is movably arranged on the workbench (2), and the moving direction of the loading slider (6) is perpendicular to the moving direction of the carrying platform (504); A buckling pressure rod (601) is lifted and lowered on the loading slide block (6), and the buckling pressure rod (601) is moved closer to the testing mechanism after being lowered; A loading nozzle (602) is lifted and arranged on the loading slide block (6), the loading nozzle (602) is connected to an external negative pressure mechanism, and the loading nozzle (602) is used to transfer the oscillator body (1) in the positioning slot (301) to the test slot (5011).

5. The on-board temperature automatic test equipment for a quartz crystal oscillator according to claim 4, characterized in that: Also includes: A pin (101) identification camera module is located between the positioning frame (3) and the carrier platform (504), and is located below the positioning frame (3). The loading nozzle (602) passes through the pin (101) identification camera module when sliding along with the loading slide block (6). The pin (101) identification camera module is used to take a photo of the pin (101) of the oscillator body (1) for identification. A positioning stepping motor (604) is arranged on the loading slide block (6) for lifting and lowering, and is used to drive the loading suction nozzle (602) to rotate.

6. The on-board temperature automatic test equipment for a quartz crystal oscillator according to claim 2, characterized in that: Also includes: A loading tray (7) is movably arranged on the workbench (2) and is used to carry bulk materials of the oscillator body (1); A loading slider (701) is slidably disposed on the workbench (2) and is located between the loading tray (7) and the positioning frame (3); A loading suction nozzle (702) is lifted and arranged on the loading slider (701), and the loading suction nozzle (702) is used to transfer the oscillator body (1) on the loading tray (7) to the positioning groove (301).

7. The on-board temperature automatic test equipment for a quartz crystal oscillator according to claim 6, characterized in that: Also includes: An appearance identification camera module (703) is movably arranged above the loading tray (7) and is used to take photos of the appearance of the bulk material of the oscillator body (1) for identification; An angle discrimination camera module (704) is located between the loading tray (7) and the positioning frame (3), and below the positioning frame (3). When the loading nozzle (702) slides following the loading slider (701), it passes through the angle discrimination camera module (704). The angle discrimination camera module (704) is used to identify the angle of the oscillator body (1); An angle-adjustable stepping motor (705) is arranged on the feeding slider (701) for lifting and lowering, and is used to drive the feeding nozzle (702) to rotate.

8. The on-board temperature automatic test equipment for a quartz crystal oscillator according to claim 1, characterized in that: Also includes: A front and back distinguishing camera module (406) is arranged above the positioning groove (301) and is used to identify the front and back of the oscillator body (1) in the positioning groove (301).

9. The on-board temperature automatic test equipment for a quartz crystal oscillator according to claim 3, characterized in that: Also includes: A test monitoring camera module (505) is movably arranged above the test mechanism (5) and is used to monitor the use status of the test mechanism (5).

10. The on-board temperature automatic test equipment of a quartz crystal oscillator according to claim 4, characterized in that: Also includes: A classification collection box (8) is rotatably arranged on the workbench (2) and is located beside the supporting platform (504). The classification collection box (8) has six collection slots (801) distributed along the circumference. The collection slots (801) are used to accommodate the oscillator body (1) after the test.

Citation Information

Patent Citations

  • Method and device for SMD device arrangement, separation and stack mounting

    CN101168154A

  • Multi-station crystal oscillator testing, classifying, marking and braiding integrated device

    CN107499563A

  • Multifunctional quartz crystal oscillator test equipment

    CN115780318A

  • Chip test equipment and test method

    CN118549426A

  • Rotating disc type chip feeding device

    CN210449906U