Micro-led chip multi-station raman detection device

Abstract

The application belongs to the technical field of chip detection, and particularly relates to a multi-station Raman detection device for Micro-LED chips, which comprises a bottom plate, a receiving box fixedly installed on the top of the bottom plate, a circular plate fixedly installed on the top of the receiving box, a plurality of detection cavities fixedly installed on the top of the circular plate, a plurality of chip placing boxes arranged on the top of the circular plate, and the chip placing boxes being used for placing chips, wherein the plurality of detection cavities are arranged directly above the plurality of chip placing boxes and can coincide with the positions of the plurality of chip placing boxes respectively. When the mass balance block slides on the bottom of the chip placing plate, the mass balance block pulls the pushing plate rod to move above the chip placing plate through two connecting rods, so that when the mass balance block pulls down and drives the chip placing plate to rotate, the mass balance block drives the pushing plate rod to push the chips on the top of the chip placing plate to slide downward, the speed of the chips moving in the chip placing plate can be accelerated, and the phenomenon that the chips cannot slide off the top of the chip placing plate can be prevented.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of chip detection, and in particular to a Micro-LED chip multi-station Raman detection device. BACKGROUND

[0002] A Micro-LED chip is a new type of light-emitting chip and plays an important role in the field of display technology. The structure of a Micro-LED chip mainly includes a substrate, an epitaxial layer, electrodes, and the like. The substrate is usually made of sapphire, silicon carbide, or the like, and provides mechanical support and electrical conduction paths for the chip. The epitaxial layer is the core light-emitting area of the chip and is formed by growing different semiconductor materials to form a P-N structure. When a forward voltage is applied to the chip, electrons and holes recombine at the P-N junction, releasing energy and emitting light in the form of photons, thereby realizing light emission.

[0003] A Chinese patent with publication number CN118549342A discloses an LED chip multi-station rapid Raman detection system, which includes a feeding unit, a detection unit, and a discharging unit cooperating with a material transfer unit. The system can sequentially realize the feeding, detection, and discharging of LED chips, and the transition between adjacent two links is smooth, which helps to improve the efficiency of the LED chip detection process. The overall execution logic can be operated by a background control system, and the execution process is orderly. The system can also run smoothly in the face of large quantities of LED chip detection.

[0004] In the prior art, when unqualified chips are removed, a mechanical arm is usually used to replace human beings to take out the chips, so as to prevent the chips from being left inside the detection device and affecting subsequent detection. However, when the mechanical arm is used to take out the chips, the mechanical arm needs to have a certain movement process, which will reduce the efficiency of taking out the chips to some extent and is not conducive to large-scale chip detection work.

[0005] Therefore, the application provides a Micro-LED chip multi-station Raman detection device. SUMMARY

[0006] In order to make up for the deficiencies of the prior art and solve at least one technical problem proposed in the background art.

[0007] The technical scheme adopted by the present application to solve its technical problems is: the Micro-LED chip multi-station Raman detection device comprises a bottom plate, a receiving box is fixedly installed on the top of the bottom plate, a circular plate is fixedly installed on the top of the receiving box, a plurality of detection cavities are fixedly installed at the middle position of the top of the circular plate, a plurality of chip placing boxes are arranged at the outer periphery of the top of the circular plate, the chip placing boxes are used for placing chips, the plurality of detection cavities are arranged directly above the plurality of chip placing boxes and can coincide with the positions of the plurality of chip placing boxes respectively, a chip taking assembly is arranged in each of the plurality of chip placing boxes, the chip taking assembly comprises a chip pushing rod, and the chip taking assembly is used for driving the chip pushing rod to move the chip out of the chip placing box, a plurality of opening control assemblies are arranged at the bottom of the circular plate, the number and positions of the opening control assemblies correspond to the number and positions of the plurality of detection cavities, and the opening control assemblies are used for controlling the chip taking assembly to perform a chip taking operation.

[0008] Before use, each detection system such as an appearance detection system and a function detection system is arranged in each of the plurality of detection cavities 3, when it is necessary to detect the chip, the chip is placed in the chip placing box 6, then the chip placing box 6 is driven to move intermittently and enter the detection systems in the plurality of detection cavities 3 in sequence, and the detection systems in the plurality of detection cavities 3 detect the entering chip, so that multi-station detection of the chip is realized, when the detection system in the detection cavity 3 detects that the chip in the chip placing box 6 is unqualified, the opening control assembly corresponding to the detection cavity 3 controls the chip taking assembly to perform a chip taking operation, the chip taking assembly drives the chip pushing rod 607 to move the chip out of the chip placing box 6, so that the unqualified chip is prevented from continuing to be placed in the chip placing box 6, and the chip taking operation is facilitated when the chip is detected in the multi-station, and the energy loss and time of the mechanical arm 201 during movement can be saved.

[0009] Preferably, a motor is fixedly installed at the bottom of the circular plate, an arch rod is fixedly installed at the output end of the motor, a plurality of connecting ends of the arch rod are fixedly connected with the outer walls of the plurality of chip placing boxes respectively, a ring plate is fixedly installed on the outer wall of the circular plate, and the bottoms of the plurality of chip placing boxes are slidably connected with the top of the circular plate and the ring plate, when the chip is placed into the chip placing box, the arch rod is driven by the motor to rotate intermittently, when the arch rod rotates, the arch rod drives the plurality of chip placing boxes to rotate on the top of the circular plate, so that the plurality of chip placing boxes enter the detection cavities in sequence through rotation and each item of detection operation is performed on the chip in the chip placing box in sequence, and the chip is driven to be detected in sequence.

[0010] Preferably, the outer wall of the ring plate is symmetrically fixed with a conveying belt, one side of the two conveying belts is fixed with a mechanical arm, and a plurality of chip boxes can be placed between the two mechanical arms. When the chip needs to be loaded, one of the conveying belts is driven to move the chip. When the chip is moved to the mechanical arm, the motor drives the chip box to the two mechanical arms through the frame rod. One of the mechanical arms takes out the qualified chip in the chip box and places it on the other conveying belt, so that it is driven to move away. At the same time, the other mechanical arm drives the chip transmitted by the conveying belt to place it in the chip box, loads the chip, and plays a role in placing the chip.

[0011] Preferably, the top of the cavity tube is fixed with a plurality of cavity tubes, the number of cavity tubes is the same as the number of detection cavities, and the top ends of the plurality of cavity tubes are respectively placed directly below the plurality of detection cavities. When the chip in the chip box is determined to be unqualified by detection, the chip taking assembly is controlled by the control assembly to take the chip. The chip taking assembly drives the chip pushing rod to move the chip out of the chip box. The chip moved out of the chip box will fall from the top end of the cavity tube downward, and finally be collected in the material box for waste collection, playing a role in transmitting and collecting defective chips.

[0012] Preferably, the inner wall of the plurality of chip boxes is hinged with a chip placing plate, the inner wall of the plurality of chip boxes is fixed with a sleeve rod, the inner wall of the plurality of sleeve rods is slidingly connected with a sliding rod, the top end of the plurality of sliding rods can be attached to the bottom of the plurality of chip placing plates, and the bottom end of the plurality of sliding rods is slidingly connected with the inner wall of the ring plate. When the mechanical arm places the chip in the chip placing plate in the chip box, the motor drives the chip box to move through the frame rod. The chip box drives the sliding rod at the bottom to move in the ring plate, providing a chip taking path for the chip taking assembly controlled by the control assembly to take out the chip, and providing an access point for the chip box to rotate in the ring plate, improving the stability during rotation.

[0013] Preferably, the control assembly comprises a telescopic cylinder fixedly installed at the bottom of the circular plate, the inner wall of the ring plate is provided with a plurality of corner grooves, the positions of the plurality of corner grooves correspond to the positions of the plurality of detection cavities, the output end of the telescopic cylinder is fixedly installed with a contract plate, the outer wall of the contract plate is in sliding connection with the inner wall of the ring plate and the outer wall of the contract plate can coincide with the top opening position of the corner groove, the bottom end of the plurality of slide rods is in sliding connection with the inner wall of the plurality of corner grooves, when the chip placing box rotates in the ring plate through the slide rods, the movement of the chip placing box is stopped when the slide rods move to the middle position of the top of the contract plate, at this time, the chip placing box moves directly below the detection cavity, the detection system in the detection cavity will detect the chip, when the detection system in the detection cavity detects that the chip in the chip placing box is unqualified, the corresponding telescopic cylinder is controlled to work through the detection system, the telescopic cylinder drives the contract plate to slide out from the bottom of the slide rod to the outside of the ring plate, the corner groove in the ring plate is exposed, at this time, the bottom of the slide rod is in a suspended state, under the action of gravity, the slide rod falls into the corner groove, the chip placing plate in the chip placing box loses the top limiting of the slide rod and is opened downward at the top of the chip placing box, thereby achieving the effect of controlling the chip placing plate to open downward.

[0014] Preferably, the inner wall of the plurality of chip placing plates is fixedly installed with a fixture device, when the mechanical arm drives the chip to be placed, the mechanical arm drives the chip to be placed on the fixture device at the top of the chip placing plate, when the chip is placed on the fixture device, the fixture device works to fix the chip, preventing the chip from running out of position when moving and affecting the detection system to detect the chip.

[0015] Preferably, the piece taking assembly further comprises two mass balance blocks, the top of each of the two mass balance blocks is hingedly connected with a round rod, the outer wall of each of the two round rods is slidably connected with the inner wall of the bottom of the piece placing plate, the outer wall of each of the two mass balance blocks is fixedly connected with a connecting rod, the pushing piece rod is fixedly connected between the two connecting rods, the outer wall of each of the two connecting rods is slidably connected with the inner wall of the piece placing plate, the bottom of the pushing piece rod is slidably connected with the top of the piece placing plate, the inner wall of each of the plurality of piece placing boxes is provided with an inclined sliding opening, the top of the piece placing plate is in the same straight line with the lower surface of the inclined sliding opening, when the piece placing plate in the piece placing box loses the top limiting of the sliding rod, at this time, the fastener device stops the work of fastening the chip, then the piece placing plate will rotate under the gravity pulling of the mass balance block, when the mass balance block moves downward by gravity, the mass balance block will slide downward at the bottom of the piece placing plate through the round rod, when the mass balance block moves downward, the two mass balance blocks pull the pushing piece rod to move above the piece placing plate through the two connecting rods, so that the pushing piece rod pushes the chip placed on the top of the piece placing plate to move, through the continuous pulling of the mass balance block, when the mass balance block cannot move downward, at this time, the piece placing plate rotates to the maximum position, the chip placed on the top of the piece placing plate will be pushed by the pushing piece rod and finally slide out of the inclined sliding opening in the piece placing box, and finally fall into the containing box through the cavity tube for collection, when the mass balance block pulls the piece placing plate to rotate, the mass balance block pulls the pushing piece rod to push the chip on the top of the piece placing plate to slide downward, which can speed up the speed of the chip moving in the piece placing plate, and can also prevent the chip from being unable to slide off the top of the piece placing plate.

[0016] Preferably, the top of the piece placing plate is fixedly and symmetrically provided with two rectangular boxes, the internal structure of each of the two rectangular boxes is the same, the inner wall of each of the two rectangular boxes is fixedly provided with a rectangular plate, the inner wall of the rectangular plate is slidably connected with a plurality of limiting blocks, one end of each of the plurality of limiting blocks is fixedly provided with a pressing rod, a reset spring is arranged between each of the plurality of limiting blocks and the rectangular plate, the outer wall of the pushing piece rod is fixedly provided with a pushing block, the outer wall of the pushing block is slidably connected with the outer wall of the pressing rod, the connecting end outer wall of the pushing block is slidably connected with the inner wall of the rectangular plate and the rectangular box, when the mass balance block pulls and slides downward at the bottom of the piece placing plate, the pushing piece rod pulls the pushing block to slide in the rectangular box, when the pushing block slides, the pushing block pushes the pressing rod to move, the pressing rod pushes the plurality of limiting blocks to pull the reset spring to move, the plurality of limiting blocks will extend out of the rectangular box and be placed on both sides of the chip to limit the top of the chip, preventing the chip from being warped and stuck in the piece placing plate when the chip slides downward due to the light weight of the chip, and playing a role of limiting the sliding of the chip.

[0017] Preferably, the outer wall of the sleeve rod is symmetrically fixedly provided with a baffle, the top end of the sliding rod is symmetrically fixedly provided with an electromagnet, the top of each of the two mass balance blocks is fixedly provided with a magnetic block, the positions of the two electromagnets correspond to the positions of the two magnetic blocks respectively, the two baffles are arranged between the two electromagnets and the mass balance blocks, and the bottom of the chip placing plate can be attached to the top of the two baffles.

[0018] The beneficial effects of the present application are as follows:

[0019] 1. The Micro-LED chip multi-station Raman detection device provided by the present application can accelerate the speed of the chip moving in the chip placing plate and prevent the chip from being unable to slide off the top of the chip placing plate when the chip is placed on the top of the chip placing plate.

[0020] 2. The Micro-LED chip multi-station Raman detection device provided by the present application can prevent the chip from being unable to slide off the top of the chip placing plate when the chip is placed on the top of the chip placing plate.

[0021] 3. The Micro-LED chip multi-station Raman detection device provided in the application, when the chip slides out of the inclined sliding port and falls into the receiving box, the motor drives the chip placing box to rotate in the ring plate at this time, the slide rod will slide out of the corner groove, the top of the slide rod will be retracted to the bottom of the chip placing plate, thereby the inclined chip placing plate is pushed back to the original position on the top of the inner wall of the chip placing box, the chip placing plate is reset, when the chip placing plate is reset, the electromagnet connected to the outer wall of the chip placing box magnetically attracts the magnetic block on the top of the mass balance block, thereby the two mass balance blocks are moved from one end of the bottom of the chip placing plate to the middle of the bottom, and the magnetic attraction reset mass balance block is achieved.

[0022] 4. The Micro-LED chip multi-station Raman detection device provided in the application, when the detection system in the detection cavity detects that the chip in the chip placing box is unqualified, the detection system controls the corresponding telescopic cylinder to work, the telescopic cylinder drives the contract plate to slide out of the bottom of the slide rod to the outside of the ring plate, the corner groove in the ring plate is exposed, at this time the bottom of the slide rod is in a suspended state, under the action of gravity, the slide rod falls into the corner groove, and the chip placing plate in the chip placing box loses the top limit of the slide rod and rotates downward and opens on the top of the chip placing box, thereby the downward rotation and opening of the chip placing plate is controlled.

[0023] 5. The Micro-LED chip multi-station Raman detection device provided in the application, when the chip in the chip placing box is determined to be unqualified by detection, the chip taking assembly is controlled by the control assembly to take the chip, the chip taking assembly drives the chip pushing rod to move the chip out of the chip placing box, the chip moved out of the chip placing box falls downward from the top end of the cavity tube and finally concentrates in the receiving box for waste collection, thereby the transmission and collection of defective chips are achieved. BRIEF DESCRIPTION OF DRAWINGS

[0024] The application will be further described below with reference to the drawings.

[0025] Figure 1 is the front view of the application;

[0026] Figure 2 is the structure schematic view of the round plate in the application;

[0027] Figure 3 is the structure schematic view of the bracket rod in the application;

[0028] Figure 4 is the structure schematic view of the contract plate in the application;

[0029] Figure 5 is the structure schematic view of the corner groove in the application;

[0030] Figure 6 is the structure schematic view of the ring plate in the application;

[0031] Figure 7 is the structure schematic diagram of the sheet placing box in the application;

[0032] Figure 8 is the structure schematic diagram of the sleeve rod in the application;

[0033] Figure 9 is the structure schematic diagram of the connecting rod in the application;

[0034] Figure 10 is the structure schematic diagram of the round rod in the application;

[0035] Figure 11 is the structure schematic diagram of the pushing sheet rod in the application;

[0036] Figure 12 is the structure schematic diagram of the limiting block in the application;

[0037] Figure 13 is the structure schematic diagram of the extruding rod in the application.

[0038] In the figure: 1, bottom plate; 2, conveying belt; 201, mechanical arm; 3, detection cavity; 4, cavity pipe; 401, material receiving box; 5, round plate; 6, sheet placing box; 601, sliding rod; 602, sleeve rod; 603, baffle; 604, electromagnet; 605, mass balance block; 606, connecting rod; 607, pushing sheet rod; 608, round rod; 609, magnetic block; 7, ring plate; 701, angle groove; 8, motor; 801, frame rod; 9, telescopic air cylinder; 901, contract plate; 10, fastener device; 11, sheet placing plate; 12, square box; 1201, limiting block; 1202, pushing block; 1203, reset spring; 1204, extruding rod; 1205, square plate. DETAILED DESCRIPTION

[0039] In order to make the technical means, creative features, purposes and effects of the application easy to understand, the application is further described below in combination with specific embodiments.

[0040] As Figures 1 to 13As shown, the Micro-LED chip multi-station Raman detection device provided by the embodiment of the application comprises a bottom plate 1, a receiving box 401 is fixedly installed on the top of the bottom plate 1, a circular plate 5 is fixedly installed on the top of the receiving box 401, a plurality of detection cavities 3 are fixedly installed at the top middle position of the circular plate 5, a plurality of chip placing boxes 6 are arranged at the top outer periphery of the circular plate 5, the chip placing boxes 6 are used for placing chips, the plurality of detection cavities 3 are arranged directly above the plurality of chip placing boxes 6 and can respectively coincide with the positions of the plurality of chip placing boxes 6, a chip taking assembly is arranged in each of the plurality of chip placing boxes 6, the chip taking assembly comprises a chip pushing rod 607, and the chip taking assembly is used for driving the chip pushing rod 607 to move the chip out of the chip placing box 6, a plurality of opening control assemblies are arranged at the bottom of the circular plate 5, the number and positions of the opening control assemblies correspond to the number and positions of the plurality of detection cavities 3, and the opening control assemblies are used for controlling the chip taking assembly to perform a chip taking operation.

[0041] When the mechanical arm is used to take out the material, the mechanical arm needs to have a certain movement process, which will reduce the efficiency of taking out to a certain extent and is not conducive to large-batch chip detection work.

[0042] Before use, each detection system such as an appearance detection system and a function detection system is arranged in the plurality of detection cavities 3, when it is necessary to detect the chip, the chip is placed in the chip placing box 6, then the chip placing box 6 is driven to move intermittently, so that the chip placing box 6 enters the detection system in the detection cavity 3 in sequence, and the detection system in the detection cavity 3 detects the entering chip, so that multi-station detection of the chip is realized, when the detection system in the detection cavity 3 detects that the chip in the chip placing box 6 is unqualified, the opening control assembly corresponding to the detection cavity 3 controls the chip taking assembly to perform a chip taking operation, the chip taking assembly drives the chip pushing rod 607 to move the chip out of the chip placing box 6, so that the unqualified chip is prevented from continuing to be placed in the chip placing box 6, and the chip taking operation is facilitated when the chip is detected in the multi-station by the mutual cooperation of the opening control assembly and the chip taking assembly to take out the chip relative to the movement of the mechanical arm 201.

[0043] As shown in Figures 2 to 3 the bottom of the circular plate 5 is fixedly installed with a motor 8, the output end of the motor 8 is fixedly installed with a frame rod 801, a plurality of connection ends of the frame rod 801 are fixedly connected with the outer walls of the plurality of chip placing boxes 6, the outer wall of the circular plate 5 is fixedly installed with a ring plate 7, and the bottoms of the plurality of chip placing boxes 6 are slidably connected with the top of the circular plate 5 and the ring plate 7;

[0044] When the chip is placed into the chip placing box 6, the frame rod 801 is driven to rotate intermittently by the motor 8. When the frame rod 801 rotates, the frame rod 801 drives the plurality of chip placing boxes 6 to rotate on the top of the circular plate 5, so that the plurality of chip placing boxes 6 enter the respective detection cavities 3 in sequence through rotation, and the chips in the chip placing boxes 6 are sequentially detected, thereby achieving the function of sequentially detecting the chips.

[0045] As shown in Figures 1 to 2 , the outer wall of the ring plate 7 is symmetrically fixedly installed with the conveying belts 2. The sides of the two conveying belts 2 are fixedly installed with the mechanical arms 201. The plurality of chip placing boxes 6 can be placed between the sides of the two mechanical arms 201.

[0046] When the chips need to be loaded, one of the conveying belts 2 is driven to move the chips. When the chips are moved to the mechanical arms 201 by the conveying belt 2, the motor 8 drives the chip placing box 6 to be between the two mechanical arms 201 by the frame rod 801. One of the mechanical arms 201 takes out the qualified chips in the chip placing box 6 and places them on the other conveying belt 2, so that the chips are moved away by transmission. At the same time, the other mechanical arm 201 places the chips transmitted by the conveying belt 2 in the chip placing box 6, thereby loading the chips and achieving the function of placing the chips. It should be noted that the two conveying belts 2 and the motor 8 are synchronous.

[0047] As shown in Figures 1 to 2 , the top of the cavity tube 4 is fixedly installed with a plurality of cavity tubes 4. The number of the cavity tubes 4 is the same as the number of the detection cavities 3. The top ends of the plurality of cavity tubes 4 are respectively placed directly below the plurality of detection cavities 3.

[0048] When the chips in the chip placing box 6 are determined to be unqualified by detection, the chip taking assembly is controlled by the control assembly to take the chips. The chip taking assembly drives the chip pushing rod 607 to move the chips out of the chip placing box 6. The chips moved out of the chip placing box 6 will fall from the top end of the cavity tube 4 downward, and finally be collected in the material receiving box 401, thereby achieving the function of transmitting and collecting the defective chips.

[0049] As shown in Figures 6 to 8 , the inner wall of the plurality of chip placing boxes 6 is hingedly connected with the chip placing plates 11. The plurality of chip placing boxes 6 is fixedly installed with the sleeve rods 602. The inner wall of the plurality of sleeve rods 602 is slidably connected with the slide rods 601. The top ends of the plurality of slide rods 601 can be respectively attached to the bottoms of the plurality of chip placing plates 11. The bottoms of the plurality of slide rods 601 are slidably connected with the inner wall of the ring plate 7.

[0050] When the mechanical arm 201 carries the chip to place, the mechanical arm 201 carries the chip to place on the chip placing plate 11 in the chip placing box 6, and then when the motor 8 drives the chip placing box 6 to move through the frame rod 801, the chip placing box 6 drives the bottom sliding rod 601 to move in the ring plate 7 through the sleeve rod 602, provides a chip taking path for the subsequent control opening assembly to control the chip taking assembly to take out the chip, and provides an access point for the chip placing box 6 to rotate in the ring plate 7, improves the stability during rotation.

[0051] As shown in Figures 6 to 7 , the control opening assembly includes a telescopic cylinder 9 fixedly installed at the bottom of the circular plate 5, the inner wall of the ring plate 7 has a plurality of corner grooves 701, the positions of the plurality of corner grooves 701 correspond to the positions of the plurality of detection cavities 3, the output end of the telescopic cylinder 9 is fixedly installed with a contract plate 901, the outer wall of the contract plate 901 is in sliding connection with the inner wall of the ring plate 7 and can coincide with the top opening position of the corner groove 701, and the bottom ends of the plurality of sliding rods 601 are in sliding connection with the inner walls of the plurality of corner grooves 701, respectively.

[0052] When the chip placing box 6 rotates in the ring plate 7 through the sliding rod 601, when the sliding rod 601 moves to the middle position of the top of the contract plate 901, the movement of the chip placing box 6 is stopped, at this time, the chip placing box 6 moves directly below the detection cavity 3, and the detection system in the detection cavity 3 detects the chip, when the detection system in the detection cavity 3 detects that the chip in the chip placing box 6 is unqualified, the corresponding telescopic cylinder 9 is controlled to work through the detection system, the telescopic cylinder 9 drives the contract plate 901 to slide out from the bottom of the sliding rod 601 to the outside of the ring plate 7, the corner groove 701 in the ring plate 7 is exposed, at this time, the bottom of the sliding rod 601 is in a suspended state, under the action of gravity, the sliding rod 601 falls in the corner groove 701, and the chip placing plate 11 in the chip placing box 6 loses the top limiting of the sliding rod 601 and rotates downwardly and opens at the top of the chip placing box 6, thereby controlling the chip placing plate 11 to rotate downwardly and open.

[0053] As shown in Figures 7 to 8 , the inner wall of the plurality of chip placing plates 11 is fixedly installed with a fastener device 10.

[0054] When the mechanical arm 201 carries the chip to be placed, the mechanical arm 201 carries the chip to be placed on the fixture device 10 on the top of the chip placing plate 11. When the chip is placed on the fixture device 10, the fixture device 10 operates to fix the chip, preventing the chip from moving out of position and affecting the detection of the detection system. It should be noted that the fixture device 10 can be a vacuum adsorption device. The vacuum pump is used to extract the air in the adsorption cavity, so that a negative pressure is formed between the adsorption head and the surface of the chip, thereby generating an adsorption force to firmly adsorb the chip. By controlling the size of the vacuum degree, the adsorption force can be accurately controlled to ensure that the chip can be firmly adsorbed without causing damage to the chip. When the chip needs to be released, the valve is controlled to slowly release the vacuum in the adsorption cavity, so that the adsorption force disappears, and the chip is accurately placed.

[0055] As shown in Figures 8 to 10 The chip taking assembly further includes two mass balance blocks 605. The top of each mass balance block 605 is hingedly connected to a circular rod 608. The outer wall of each circular rod 608 is slidably connected to the inner wall of the bottom of the chip placing plate 11. The outer wall of each mass balance block 605 is fixedly connected to a connecting rod 606. A chip pushing rod 607 is fixedly connected between the two connecting rods 606. The outer wall of each connecting rod 606 is slidably connected to the inner wall of the chip placing plate 11. The bottom of the chip pushing rod 607 is slidably connected to the top of the chip placing plate 11. The inner wall of each chip placing box 6 is provided with an inclined sliding opening. The top of the chip placing plate 11 is in the same straight line as the lower surface of the inclined sliding opening.

[0056] When the chip placing plate 11 in the chip placing box 6 loses the top limit of the sliding rod 601, the fixture device 10 stops the fixing operation of the chip at this time. Then the chip placing plate 11 will rotate under the gravity pull of the mass balance block 605. When the mass balance block 605 moves downward by gravity, the mass balance block 605 will slide downward at the bottom of the chip placing plate 11 through the circular rod 608. When the mass balance block 605 moves downward, the two mass balance blocks 605 pull the chip pushing rod 607 to move above the chip placing plate 11 through the two connecting rods 606, so that the chip pushing rod 607 pushes the chip placed on the top of the chip placing plate 11 to move. Through the continuous pulling of the mass balance block 605, when the mass balance block 605 cannot move downward, the chip placing plate 11 rotates to the maximum position at this time. The chip placed on the top of the chip placing plate 11 will be pushed by the chip pushing rod 607 and finally slide out of the inclined sliding opening in the chip placing box 6, and finally fall into the receiving box 401 through the cavity tube 4 for collection. When the mass balance block 605 pulls the chip placing plate 11 to rotate, the mass balance block 605 pushes the chip on the top of the chip placing plate 11 to slide downward, which can speed up the movement of the chip in the chip placing plate 11, and also can prevent the chip from being placed on the top of the chip placing plate 11 from sliding off.

[0057] like Figures 11 to 13 As shown, rectangular boxes 12 are symmetrically fixedly installed on the top of the plate 11. The internal structures of the two rectangular boxes 12 are the same. A rectangular plate 1205 is fixedly installed on the inner wall of the rectangular box 12. Multiple limiting blocks 1201 are slidably connected to the inner wall of the rectangular plate 1205. A squeezing rod 1204 is fixedly installed on one end of each of the multiple limiting blocks 1201. A return spring 1203 is provided between the multiple limiting blocks 1201 and the rectangular plate 1205. A pushing block 1202 is fixedly installed on the outer wall of the pushing rod 607. The outer wall of the pushing block 1202 is slidably connected to the outer wall of the squeezing rod 1204. The outer wall of the connecting end of the pushing block 1202 is slidably connected to the inner wall of the rectangular plate 1205 and the rectangular box 12.

[0058] When the mass balance block 605 slides down at the bottom of the chip placement plate 11, the push rod 607 drives the push block 1202 to slide inside the rectangular box 12. When the push block 1202 slides, it pushes the extrusion rod 1204 to move. The extrusion rod 1204 then pushes multiple limit blocks 1201 to pull the reset spring 1203 to move. The multiple limit blocks 1201 extend from inside the rectangular box 12 and are placed on both sides of the chip to limit its top position. This prevents the chip from tilting and getting stuck in the chip placement plate 11 when it slides down due to its light weight, thus limiting the chip's sliding.

[0059] like Figures 8 to 9 As shown, baffles 603 are symmetrically fixedly installed on the outer wall of the sleeve rod 602, electromagnets 604 are symmetrically fixedly installed on the outer wall of the top of the slide rod 601, and magnetic blocks 609 are fixedly installed on the top of the two mass balance blocks 605. The positions of the two electromagnets 604 correspond to the positions of the two magnetic blocks 609 respectively. The two baffles 603 are respectively placed between the two electromagnets 604 and the mass balance blocks 605. The bottom of the plate 11 can fit against the top of the two baffles 603.

[0060] When the chip slides out from the inclined slot and falls into the storage box 401, the motor 8 drives the chip holder 6 to rotate within the ring plate 7. The slide rod 601 then slides out from the corner groove 701, and its top retracts towards the bottom of the chip holder 11, thus pushing the tilted chip holder 11 back to its original position on the inner wall of the chip holder 6, resetting the chip holder 11. Once the chip holder 11 has been reset, the electrical circuit connected to the outer wall of the chip holder 6... Magnet 604 magnetically attracts and pulls the magnetic block 609 on top of the mass balance block 605, thereby moving the two mass balance blocks 605 from one bottom end of the plate 11 back to the middle position of the bottom end, which serves to magnetically reset the mass balance blocks 605. When the slide rod 601 moves out of the corner groove 701, the telescopic cylinder 9 drives the wedge plate 901 to re-insert into the ring plate 7, sealing the corner groove 701 and providing a support point for the arrival of the next plate box 6.

[0061] Working principle: before use, by setting in the corresponding each detection system in multiple detection cavities 3, such as appearance detection system, function detection system, etc., when the chip needs to be detected, by placing the chip in the chip box 6, then driving the chip box 6 to move intermittently, so that it enters the detection system in multiple detection cavities 3 in turn, the detection system in multiple detection cavities 3 will detect the entering chip, so as to realize the multi-station detection of chip, when the detection system in detection cavity 3 detects the chip in chip box 6 is unqualified, the control opening assembly corresponding to detection cavity 3 controls the chip taking assembly to take chip work, the chip taking assembly will drive the chip pushing rod 607 to move the chip out of the chip box 6, so as to prevent the unqualified chip from continuing to be placed in the chip box 6, and the chip taking is realized by the mutual cooperation of the control opening assembly and the chip taking assembly, which can save the energy consumption and time of mechanical arm 201 in motion, and is more conducive to the chip taking work when the chip is detected in multiple stations;

[0062] When the chip is placed into the chip box 6, the motor 8 drives the frame rod 801 to rotate intermittently, when the frame rod 801 rotates, the frame rod 801 drives multiple chip boxes 6 to rotate on the top of the circular plate 5, so that multiple chip boxes 6 enter each detection cavity 3 in turn through rotation, and each item of the chip in the chip box 6 is detected in turn, which plays a role in driving the chip to be detected in turn;

[0063] When the chip needs to be loaded, one of the conveyors 2 is driven to move the chip, when the conveyor 2 moves the chip to the mechanical arm 201, at this time, the motor 8 drives the chip box 6 to come between the two mechanical arms 201 through the frame rod 801, one of the mechanical arms 201 drives the qualified chip in the chip box 6 to be taken out and placed on the other conveyor 2, so that it is driven to move away, and the other mechanical arm 201 drives the chip transmitted by the conveyor 2 to be placed in the chip box 6, which plays a role in placing the chip;

[0064] When the chip in the chip box 6 is determined to be unqualified by detection, the control opening assembly controls the chip taking assembly to take chip work, the chip taking assembly drives the chip pushing rod 607 to move the chip out of the chip box 6, the chip moved out of the chip box 6 will fall from the top end of the cavity tube 4 downward, and finally be collected in the material box 401, which plays a role in transmitting and collecting defective chips;

[0065] When the mechanical arm 201 drives the chip to be placed, the mechanical arm 201 drives the chip to be placed on the chip placing plate 11 in the chip placing box 6, and then when the motor 8 drives the chip placing box 6 to move through the frame rod 801, the chip placing box 6 drives the bottom sliding rod 601 to move in the ring plate 7 through the sleeve rod 602, provides a chip taking path for the subsequent control opening assembly to control the chip taking assembly to take out the chip, and provides an access point for the chip placing box 6 to rotate in the ring plate 7, thereby improving the stability during rotation;

[0066] When the chip placing box 6 rotates in the ring plate 7 through the sliding rod 601, when the sliding rod 601 moves to the middle position of the top of the notch plate 901, the movement of the chip placing box 6 is stopped, at this time, the chip placing box 6 is moved directly below the detection cavity 3, and the detection system in the detection cavity 3 detects the chip to perform detection work, when the detection system in the detection cavity 3 detects that the chip in the chip placing box 6 is unqualified, the corresponding telescopic cylinder 9 is controlled to work through the detection system, the telescopic cylinder 9 drives the notch plate 901 to slide out from the bottom of the sliding rod 601 to the outside of the ring plate 7, and the corner groove 701 in the ring plate 7 is exposed, at this time, the bottom of the sliding rod 601 is in a suspended state, under the action of gravity, the sliding rod 601 falls into the corner groove 701, and the chip placing plate 11 in the chip placing box 6 loses the top limiting of the sliding rod 601 and rotates downward to open at the top of the chip placing box 6, thereby controlling the chip placing plate 11 to rotate downward and open;

[0067] When the mechanical arm 201 drives the chip to be placed, the mechanical arm 201 drives the chip to be placed on the chip placing plate 11 in the chip placing box 6, and then when the motor 8 drives the chip placing box 6 to move through the frame rod 801, the chip placing box 6 drives the bottom sliding rod 601 to move in the ring plate 7 through the sleeve rod 602, provides a chip taking path for the subsequent control opening assembly to control the chip taking assembly to take out the chip, and provides an access point for the chip placing box 6 to rotate in the ring plate 7, thereby improving the stability during rotation;

[0068] When the chip placement plate 11 inside the chip placement box 6 loses the top limit of the slide bar 601, the firmware device 10 stops operating to stop the chip fixing operation. Subsequently, the chip placement plate 11 will rotate under the gravity pull of the mass balance block 605. When the mass balance block 605 moves downward by gravity, it will slide downward at the bottom of the chip placement plate 11 via the round rod 608. When the mass balance block 605 moves downward, the two mass balance blocks 605 pull the push rod 607 above the chip placement plate 11 via the two connecting rods 606, thereby causing the push rod 607 to push the chip placed on top of the chip placement plate 11 to move. When the mass balance block 605 is pulled down continuously, and the mass balance block 605 can no longer move down, the chip placement plate 11 rotates to its maximum position. The chip placed on top of the chip placement plate 11 will be pushed by the chip pusher 607 and eventually slide out of the inclined sliding opening in the chip placement box 6. Finally, it falls into the storage box 401 through the cavity tube 4 for collection. When the mass balance block 605 pulls down and drives the chip placement plate 11 to rotate, the mass balance block 605 drives the chip pusher 607 to push the chip downward on the top of the chip placement plate 11. This can speed up the movement of the chip in the chip placement plate 11 and also prevent the chip from being unable to slide off the top of the chip placement plate 11.

[0069] When the mass balance block 605 slides down at the bottom of the chip placement plate 11, the push rod 607 drives the push block 1202 to slide inside the rectangular box 12. When the push block 1202 slides, it pushes the extrusion rod 1204 to move. The extrusion rod 1204 then pushes multiple limit blocks 1201 to pull the reset spring 1203 to move. The multiple limit blocks 1201 extend from the rectangular box 12 and are placed on both sides of the chip to limit its top position. This prevents the chip from tilting and getting stuck in the chip placement plate 11 when it slides down due to its light weight, thus limiting the chip's sliding.

[0070] When the chip slides out from the inclined slot and falls into the storage box 401, the motor 8 drives the chip holder 6 to rotate within the ring plate 7. The slide rod 601 then slides out from the corner groove 701, and its top retracts towards the bottom of the chip holder 11, thus pushing the tilted chip holder 11 back to its original position on the inner wall of the chip holder 6, resetting the chip holder 11. Once the chip holder 11 has been reset, the electrical circuit connected to the outer wall of the chip holder 6... Magnet 604 magnetically attracts and pulls the magnetic block 609 on top of the mass balance block 605, thereby moving the two mass balance blocks 605 from one bottom end of the plate 11 back to the middle position of the bottom end, which serves to magnetically reset the mass balance blocks 605. When the slide rod 601 moves out of the corner groove 701, the telescopic cylinder 9 drives the wedge plate 901 to re-insert into the ring plate 7, sealing the corner groove 701 and providing a support point for the arrival of the next plate box 6.

[0071] The above shows and describes the basic principles, main features and advantages of the present application. Those skilled in the art should understand that the present application is not limited to the above-mentioned embodiments, and the above-mentioned embodiments and descriptions in the specification are only to illustrate the principles of the present application. Without departing from the spirit and scope of the present application, various changes and improvements can be made to the present application, and these changes and improvements all fall within the scope of the claimed present application. The scope of protection of the present application is defined by the appended claims and their equivalents.

Claims

1. A multi-station Raman detection device for Micro-LED chips, characterized in that: The utility model provides a kind of chip detection device, including bottom plate, the top of bottom plate is fixedly installed with taking box, the top of taking box is fixedly installed with round plate, the top of round plate is fixedly installed with multiple detection cavities, the outer periphery of the top of round plate is provided with multiple chip box, chip box is used to place chip, multiple detection cavities are set in the just above of multiple chip box and multiple detection cavities can be respectively coincided with the position of multiple chip box, the inside of multiple chip box is provided with pick-up component, pick-up component includes push piece rod, pick-up component is used to drive push piece rod and remove chip from chip box, the bottom of round plate is provided with multiple control opening components, the number and position of control opening component correspond with the number and position of multiple detection cavities, control opening component is used to control pick-up component to carry out pick-up operation; Control opening component includes telescopic cylinder, and the output end of the telescopic cylinder is fixedly installed with a board. The outer wall of the board is slidably connected with the inner wall of the ring plate, and the outer wall of the board can be coincided with the top opening position of the corner slot. The bottom end of the plurality of slide rods is slidably connected with the inner wall of the plurality of corner slots. The inner wall of the plurality of chip placing plates is fixedly installed with a fastener device. The pick-up component further includes a mass balance block, the number of the mass balance block is two, the top of the two mass balance blocks is hingedly connected with a round rod, the outer wall of the two round rods is slidably connected with the bottom inner wall of the chip placing plate, the outer wall of the two mass balance blocks is fixedly installed with a connecting rod, the push piece rod is fixedly installed between the two connecting rods, the outer wall of the two connecting rods is slidably connected with the inner wall of the chip placing plate, the bottom of the push piece rod is slidably connected with the top of the chip placing plate, the inner wall of the plurality of chip boxes is provided with an inclined sliding port, and the top of the chip placing plate is in the same straight line with the lower surface of the inclined sliding port. The top of the chip placing plate is symmetrically fixedly installed with a rectangular box, the internal structure of the two rectangular boxes is the same, the inner wall of the rectangular box is fixedly installed with a rectangular plate, the inner wall of the rectangular plate is slidably connected with a plurality of limiting blocks, one end of the plurality of limiting blocks is fixedly installed with a pressing rod, a return spring is arranged between the plurality of limiting blocks and the rectangular plate, the outer wall of the push piece rod is fixedly installed with a push block, the outer wall of the push block is slidably connected with the outer wall of the pressing rod, and the connecting end outer wall of the push block is slidably connected with the inner wall of the rectangular plate and the rectangular box. The outer wall of the sleeve rod is symmetrically fixedly installed with a baffle, the top outer wall of the slide rod is symmetrically fixedly installed with an electromagnet, the top of the two mass balance blocks is fixedly installed with a magnetic block, the positions of the two electromagnets correspond to the positions of the two magnetic blocks, the two baffles are respectively arranged between the two electromagnets and the mass balance blocks, and the bottom of the chip placing plate is attached to the top of the two baffles. 2.The Micro-LED chip multi-station Raman detection device according to claim 1, wherein: The bottom of the round plate is fixedly installed with a motor, the output end of the motor is fixedly installed with a frame rod, the plurality of connecting ends of the frame rod are fixedly connected with the outer wall of the plurality of chip boxes, the outer wall of the round plate is fixedly installed with a ring plate, and the bottom of the plurality of chip boxes is slidably connected with the top of the round plate and the ring plate. 3.The Micro-LED chip multi-station Raman detection device according to claim 2, wherein: The outer wall of the ring plate is symmetrically fixedly installed with a conveyor belt, one side of the two conveyor belts is fixedly installed with a mechanical arm, and the plurality of chip boxes can be arranged between one side of the two mechanical arms. 4.The Micro-LED chip multi-station Raman detection device of claim 3, wherein: The top of the cavity pipe is fixedly provided with a plurality of cavity pipes, the number of the cavity pipes is the same as the number of the detection cavities, and the top ends of the plurality of cavity pipes are respectively arranged directly below the plurality of detection cavities. 5.The Micro-LED chip multi-station Raman detection device according to claim 4, wherein: The inner walls of the plurality of film placing boxes are hingedly provided with film placing plates, the interiors of the plurality of film placing boxes are fixedly provided with sleeve rods, the inner walls of the plurality of sleeve rods are slidably connected with sliding rods, the top ends of the plurality of sliding rods can be attached to the bottoms of the plurality of film placing plates, and the bottom ends of the plurality of sliding rods are slidably connected with the inner wall of the ring plate.

Images