Focusing ring temperature control system and electrostatic chuck mechanism

Abstract

The invention discloses a focusing ring temperature control system and an electrostatic chuck mechanism, the focusing ring temperature control system comprises a focusing ring assembly and a cooling device, the focusing ring assembly is provided with a cooling cavity, and the cooling cavity is provided with a liquid inlet channel and a liquid outlet channel; the cooling device at least comprises a first output pipeline communicated with the liquid inlet channel and a first liquid return pipeline communicated with the liquid outlet channel, so that cooling liquid of the cooling device can circularly flow into the cooling cavity to adjust the temperature of the focusing ring assembly. The focusing ring temperature control system is mounted around the electrostatic chuck, and the focusing ring assembly is provided with the cooling cavity and is circularly communicated with the cooling device, so that the temperature of the focusing ring assembly can be adjusted through the cooling device, and the temperature of the focusing ring assembly can be better matched with the temperature of the edge position of a wafer placed on the electrostatic chuck; therefore, the problem that the process effect is affected due to the temperature difference between the wafer and the focusing ring main body is avoided.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor processing equipment, and more particularly, to a focusing ring temperature control system and an electrostatic chuck mechanism. Background Art

[0002] Plasma etching, also known as dry etching, is an important process in microelectronics manufacturing, especially semiconductor manufacturing. This is a process of engraving patterns onto a substrate (mainly silicon) to form microscopic circuits and structures in devices such as computer chips and integrated circuits.

[0003] During the etching process of a wafer, due to physical or chemical reaction limitations, the etchant can only etch specific areas on the wafer surface, resulting in uneven etching effects in the boundary area, that is, there is a marginal effect. The etching marginal effect will cause deformation, residues, or uneven etching depth of the microstructures on the wafer surface in the boundary area, resulting in a longer residence time of the etchant in the boundary area of the wafer surface, so that the etching depth in the boundary area is deeper than that in other areas.

[0004] In the prior art, a focusing ring is usually installed around the outer circle of the wafer to reduce the influence of the marginal effect. During the process, the wafer often adopts different temperatures, and at the same time during the etching process, the temperature of the wafer will also increase. Although the temperature of the wafer can be adjusted by an electrostatic chuck, the edge of the wafer will be affected by the temperature of the focusing ring, and the process effect will also be affected by the temperature difference between the wafer and the focusing ring.

[0005] In summary, how to solve the problem that the process effect is affected by the temperature difference between the wafer and the focusing ring has become an urgent technical problem for those skilled in the art. Summary of the Invention

[0006] In view of this, the present invention provides a focusing ring temperature control system and an electrostatic chuck mechanism to solve the problem that the process effect is affected by the temperature difference between the wafer and the focusing ring.

[0007] To achieve the above object, the present invention provides the following technical solutions:

[0008] A focusing ring temperature control system, comprising:

[0009] A focusing ring assembly having a cooling cavity, the cooling cavity having a liquid inlet channel and a liquid outlet channel;

[0010] A cooling device including at least a first output pipeline communicating with the liquid inlet channel and a first return pipeline communicating with the liquid outlet channel, so that the coolant of the cooling device can circulate into the cooling cavity to adjust the temperature of the focusing ring assembly.

[0011] Optionally, a first flow valve is connected in series on the first output pipeline.

[0012] Optionally, the focusing ring assembly includes a focusing ring body and a sealing ring. The focusing ring body has a receiving cavity with an open bottom end. The sealing ring is sealingly connected to the focusing ring body and encloses the cooling cavity together with the receiving cavity.

[0013] Optionally, the focusing ring body and the sealing ring are sealingly connected by fasteners, and are also sealingly connected by a first sealing member between the focusing ring body and the sealing ring.

[0014] Optionally, the focusing ring body is provided with a countersunk hole, the sealing ring is provided with a threaded blind hole, the fastener is configured as a bolt, the bolt is threadedly connected to the threaded blind hole, the bolt head is located in the countersunk hole, and is sealingly fitted with the sunken end face of the countersunk hole through a second sealing member.

[0015] Optionally, the focusing ring assembly further includes a cap for plugging the countersunk hole.

[0016] Optionally, the sealing connection manner between the focusing ring body and the sealing ring is configured as welding, bonding or rotary crimping.

[0017] Optionally, the focusing ring body is assembled by at least two arc segments. Each arc segment has a receiving cavity with an open bottom end. Each arc segment is sealingly connected to the sealing ring, and the receiving cavities where the arc segments are located respectively enclose independent cooling cavities with the sealing ring.

[0018] Optionally, the assembling positions of two adjacent arc segments are assembled and connected in an overlapping manner. One of the arc segments is provided with an upper convex edge corresponding to the overlapping position, and the other arc segment is provided with a lower convex edge that overlaps and fits with the upper convex edge corresponding to the overlapping position.

[0019] Optionally, both the liquid inlet channel and the liquid outlet channel are sealingly connected to the sealing ring. Both the liquid inlet channel and the liquid outlet channel are configured as external thread pipes. The sealing ring is provided with a stepped through hole. The position of the external thread pipe near the top is provided with a limiting step adapted to the stepped through hole. The main body part of the external thread pipe is threadedly connected to the small-diameter section of the stepped through hole, and the limiting step and the step surface of the stepped through hole are sealed by a third sealing member.

[0020] Optionally, it further includes a cover ring for carrying the focusing ring assembly. The sealing ring is integrated with the cover ring. A screwing slot is provided on the cover ring, and a wedge-shaped convex card is provided on the outer ring side of the focusing ring body. The wedge-shaped convex card is screwed into the cover ring from the screwing slot, enabling the focusing ring body to be hermetically connected to the cover ring.

[0021] Optionally, a positioning block is further provided on the cover ring, and a positioning opening is provided on the screwing slot. When the wedge-shaped convex card is screwed into the screwing slot to a preset position, the positioning block is installed in the positioning opening.

[0022] Compared with the content of the background technology introduction, the above-mentioned focusing ring temperature control system includes a focusing ring assembly and a cooling device. Among them, the focusing ring assembly has a cooling cavity, and the cooling cavity has a liquid inlet channel and a liquid outlet channel; the cooling device at least includes a first output pipeline communicated with the liquid inlet channel and a first return pipeline communicated with the liquid outlet channel, so that the coolant of the cooling device can circulate into the cooling cavity to adjust the temperature of the focusing ring assembly. In the actual application process, by installing this focusing ring temperature control system around the electrostatic chuck, since the focusing ring assembly has a cooling cavity and is circulated and communicated with the cooling device, the temperature of the focusing ring assembly can be adjusted by the cooling device, so that the temperature of the focusing ring assembly can be better adapted to the temperature of the edge position of the wafer placed on the electrostatic chuck. By adjusting different temperatures, the process etching rate and etching uniformity can achieve better effects, thus avoiding the problem that the temperature difference between the wafer and the focusing ring body affects the process effect.

[0023] In addition, the present invention also provides an electrostatic chuck mechanism, including an electrostatic chuck and the focusing ring temperature control system described in any of the above solutions. A cooling flow channel is provided in the electrostatic chuck, and the cooling device further includes a second output pipeline communicated with the inlet of the cooling flow channel and a second return pipeline communicated with the outlet of the cooling flow channel. Since the foregoing focusing ring temperature control system has the foregoing technical effects, the electrostatic chuck mechanism having this focusing ring temperature control system should also have corresponding technical effects, which will not be elaborated here.

[0024] Optionally, a second flow valve is connected in series on the second output pipeline. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0026] Figure 1Schematic diagram of the principle structure of the focusing ring temperature control system provided by the embodiment of the present invention;

[0027] Figure 2 Schematic cross-sectional structure diagram of the focusing ring assembly provided by the embodiment of the present invention;

[0028] Figure 3 Schematic structure diagram of the focusing ring body assembled by multiple arc segments provided by the embodiment of the present invention;

[0029] Figure 4 Schematic structure diagram of the overlapping structure of two adjacent arc segments at the assembly position provided by the embodiment of the present invention;

[0030] Figure 5 Schematic structure diagram of the sealing connection between the sealing ring and the liquid inlet channel provided by the embodiment of the present invention;

[0031] Figure 6 Schematic structure diagram of the rotational snap fit between the focusing ring body and the cover ring provided by the embodiment of the present invention.

[0032] Among them, Figures 1-6 In:

[0033] Wafer 100, focusing ring body 200, first arc segment 200-1, second arc segment 200-2, third arc segment 200-3, fourth arc segment 200-4, cap 201, fastener 202, second sealing member 203, upper convex edge 204, lower convex edge 205, first sealing member 300, third sealing member 400, sealing ring 500, liquid inlet channel 600, cover ring 700, first positioning block 701-1, second positioning block 701-2, electrostatic chuck 800, second output pipeline 801, temperature control system 900, cooling device 901, second flow valve 902, first flow valve 903. Detailed implementation manners

[0034] The core of the present invention lies in providing a focusing ring temperature control system and an electrostatic chuck mechanism to solve the problem that the process effect is affected by the temperature difference between the wafer and the focusing ring.

[0035] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0036] Refer to Figures 1-6As shown in the figure, the present invention specifically provides a focusing ring temperature control system, including a focusing ring assembly and a cooling device 901. Among them, the focusing ring assembly has a cooling cavity, and the cooling cavity has a liquid inlet channel 600 and a liquid outlet channel; the cooling device 901 at least includes a first output pipeline communicated with the liquid inlet channel 600 and a first return liquid pipeline communicated with the liquid outlet channel (wherein, Figures 1-6 the first return liquid pipeline is not shown in the figure), so that the coolant of the cooling device 901 can circulate into the cooling cavity to adjust the temperature of the focusing ring assembly.

[0037] In the actual application process, by installing the focusing ring temperature control system around the electrostatic chuck 800, since the focusing ring assembly has a cooling cavity and is in circular communication with the cooling device 901, the temperature of the focusing ring assembly can be adjusted by the cooling device 901, so that the temperature of the focusing ring assembly can better match the temperature of the edge position of the wafer 100 placed on the electrostatic chuck 800. By adjusting different temperatures, the process etching rate and etching uniformity can achieve better effects, thus avoiding the problem that the temperature difference between the wafer 100 and the focusing ring main body 200 affects the process effect.

[0038] It should be noted that, referring to Figure 1 , the cooling device 901 of the focusing ring temperature control system can be specifically controlled by a temperature control system 900, and a first flow valve 903 can be connected in series on the first output pipeline. By adjusting the opening degree of the first flow valve 903 on the first output pipeline, the temperature of the focusing ring assembly can be adjusted. The temperature control system 900 can adjust the opening degree of the first flow valve 903 according to the demand to adjust the temperature of the focusing ring main body 200. In addition, in the scenario where the focusing ring assembly is applied, the electrostatic chuck 800 generally also has a cooling flow channel. In addition to circulating and supplying a cooling medium to the cooling cavity of the focusing ring assembly, the cooling device 901 can also convey the coolant to the cooling flow channel of the electrostatic chuck 800 through a second output pipeline 801, and the coolant in the cooling flow channel is circulated and returned to the cooling device 901 by a second return liquid pipeline (wherein, the second return liquid pipeline is not shown in the figure). Among them, a second flow valve 902 can be arranged on the second output pipeline 801, and the temperature control system 900 can adjust the first flow valve 903 and the second flow valve 902 according to the demand. Of course, it can be understood that the cooling of the above-mentioned electrostatic chuck 800 and the cooling of the focusing ring assembly can share a set of temperature control system 900 and cooling device 901, or the two can adopt two sets of independently controlled temperature control systems 900 and cooling devices 901. In the actual application process, it can be configured according to the actual demand and will not be more specifically limited here.

[0039] In addition, it should be noted that, in addition to adjusting the temperature by connecting a first flow valve 903 in series on the first output pipeline, the cooling device 901 can also adjust the temperature of the focusing ring assembly in other ways. For example, the cooling device 901 can cooperate with its temperature control system 900 to adjust the temperature of the coolant discharged from the first output pipeline by adjusting the cooling output power, so as to adjust the temperature of the focusing ring assembly. Similarly, when adjusting the temperature of the electrostatic chuck 800, in addition to setting a second flow valve 902 on the second output pipeline, the temperature can also be adjusted by the cooling device 901 cooperating with its temperature control system 900 to adjust the cooling output power, or in other ways. In addition, the focusing ring body 200 can be made of corresponding materials according to different process requirements, such as quartz, ceramic, SiC materials, etc.

[0040] In some specific embodiments, referring to Figure 2 , the above-mentioned focusing ring assembly may specifically include a focusing ring body 200 and a sealing ring 500. The focusing ring body 200 is configured to have a receiving cavity with an open bottom end. The sealing ring 500 is sealingly connected to the focusing ring body 200 and encloses a cooling cavity with the receiving cavity. By designing the structure in the above form, it is more convenient to process and manufacture the cooling cavity of the focusing ring assembly. Of course, other methods commonly used by those skilled in the art to form a cooling cavity can also be adopted, such as the blow molding method to form a cooling cavity. In the actual application process, the corresponding structure and processing method can be selected according to actual needs, and no more specific limitations are made here.

[0041] In a further embodiment, referring to Figure 2 , the above-mentioned focusing ring body 200 and the sealing ring 500 can be specifically sealed and connected by a fastener 202, and are sealed and connected by a first sealing member 300 (such as a sealing ring) between the focusing ring body 200 and the sealing ring 500. Specifically, the focusing ring body 200 can be provided with a countersunk hole, the sealing ring 500 is provided with a threaded blind hole, the fastener is configured as a bolt, the bolt is threadedly connected to the threaded blind hole, the bolt head is located in the countersunk hole, and is sealingly matched with the sunken end face of the countersunk hole through a second sealing member 203 (such as a sealing ring). By sealing and connecting the focusing ring body 200 and the sealing ring 500 in the above way of combining the fastener and the sealing member, the process is simple, the processing and manufacturing are convenient, and the disassembly, assembly and maintenance are also convenient.

[0042] In a further embodiment, referring to Figure 2 , the above-mentioned focusing ring assembly may further include a cap 201 for plugging the countersunk hole. By designing the above cap 201, the top surface of the focusing ring body 200 is made more flat and the appearance is more beautiful, and the cap 201 can play a certain protective role for the fastener.

[0043] It should be noted that, in addition to being configured as a structure form of fastener connection and cooperating with the first sealing member 300, the sealing connection mode between the above-mentioned focusing ring body 200 and the sealing ring 500 can also be configured as welding, bonding or rotary crimping, etc. In the actual application process, the corresponding sealing connection mode can be selected according to actual needs, and no more specific limitations are made here.

[0044] In some other specific implementation schemes, referring to Figure 2 and 3 , the above-mentioned focusing ring body 200 can specifically be assembled by at least two arc segments. Each arc segment has a receiving cavity with an open bottom end. Each arc segment is hermetically connected to the sealing ring 500, and the receiving cavities where the respective arc segments are located respectively form independent cooling cavities with the sealing ring 500. For example, referring to Figure 3 shown, the focusing ring body 200 is assembled and connected end to end in sequence by four arc segments, which are respectively the first arc segment 200-1, the second arc segment 200-2, the third arc segment 200-3 and the fourth arc segment 200-4. By designing it into the above-mentioned structure form, the focusing ring assembly forms multiple partitions, and each partition has its own corresponding and independent cooling cavity. Therefore, by controlling the temperature of the cooling cavities in each partition through the temperature control system 900, a more matching temperature control method for the focusing ring body 200 can be carried out according to different use conditions, so that the etching rate can be adjusted for each partition.

[0045] In a further implementation scheme, referring to Figure 4 , the assembly positions of two adjacent arc segments can specifically be assembled and connected in a mutually overlapping manner. For example, an upper convex edge 204 is provided at the corresponding overlapping position of one arc segment, and a lower convex edge 205 that overlaps and fits with the upper convex edge 204 is provided at the corresponding overlapping position of the other arc segment. By designing it into this mutually overlapping assembly method, on the one hand, it is convenient for assembly operation positioning, and it is easier to ensure the adaptation and corresponding relationship between the focusing ring body 200 and the outer edge of the wafer 100.

[0046] In some other specific implementation schemes, referring to Figure 5 , the above-mentioned liquid inlet channel 600 and liquid outlet channel can both be designed to be hermetically connected to the sealing ring 500, and the liquid inlet channel 600 and the liquid outlet channel are both configured as external thread pipes. The sealing ring 500 is provided with a stepped through hole. A limiting step adapted to the stepped through hole is provided at a position near the top end of the external thread pipe. The main body part of the external thread pipe is threadedly connected to the small-diameter section of the stepped through hole, and the limiting step and the stepped surface of the stepped through hole are sealed by the third sealing member 400. By designing it into the above-mentioned structure form, the connection and installation between the liquid inlet channel 600 and the liquid outlet channel and the sealing ring 500 are more convenient, and it is also easy to achieve a sealing effect.

[0047] In some specific embodiments, with reference to Figure 6 , the above-mentioned focusing ring temperature control system may further include a cover ring 700 for carrying the focusing ring assembly. The sealing ring 500 is integrated on the cover ring 700. A screwing slot is provided on the cover ring 700, and a wedge-shaped convex card is provided on the outer ring side of the focusing ring body 200. When the wedge-shaped convex card is screwed into the cover ring 700 from the screwing slot, the focusing ring body 200 can be hermetically connected to the cover ring 700. By designing the above-mentioned rotational press-fitting sealing method, the operation is more concise.

[0048] Specifically, the cover ring 700 may also be configured with a positioning block matching it. A positioning opening is provided on the screwing slot. When the wedge-shaped convex card is screwed into the screwing slot to a preset position, the positioning block is installed in the positioning opening. Among them, the number of the positioning opening and the positioning block may specifically be one, or two or more, and can be selected and configured according to actual needs. For example, with reference to Figure 6 shown in the figure, two positioning openings are provided on the cover ring 700, and the positioning blocks corresponding to the two positioning openings are the first positioning block 701-1 and the second positioning block 701-2 respectively. By designing the structure of the above-mentioned positioning opening and positioning block, the overall appearance of the cover ring 700 is more beautiful, and it can play a certain role in limiting the installation position of the focusing ring body 200 to prevent automatic detachment during use.

[0049] In addition, the present invention also provides an electrostatic chuck mechanism, including an electrostatic chuck 800 and the focusing ring temperature control system described in any of the above solutions. A cooling flow channel is provided in the electrostatic chuck 800. The cooling device 901 further includes a second output pipeline 801 communicated with the inlet of the cooling flow channel and a second return liquid pipeline communicated with the outlet of the cooling flow channel, and a second flow valve 902 is connected in series on the second output pipeline 801. Since the foregoing focusing ring temperature control system has the foregoing technical effects, the electrostatic chuck mechanism having the focusing ring temperature control system should also have corresponding technical effects, which will not be elaborated here.

[0050] It should be noted that the embodiments in this specification are all described in a progressive manner. Each embodiment focuses on the differences from other embodiments. The same and similar parts among the embodiments can be referred to each other.

[0051] As shown in this application and the claims, unless the context clearly indicates otherwise, words such as "a", "an", "one", and / or "the" are not specifically singular and may also include the plural. Generally speaking, the terms "comprising" and "including" only indicate the inclusion of the steps and elements that have been clearly identified, and these steps and elements do not constitute an exclusive list. A method or device may also include other steps or elements. An element defined by the statement "comprising one..." does not exclude the existence of other identical elements in the process, method, article, or device that includes the element.

[0052] Among them, in the description of the embodiments of this application, unless otherwise specified, " / " means "or". For example, A / B can mean A or B; "and / or" herein is merely a description of the association relationship of associated objects, indicating that there can be three relationships. For example, A and / or B can mean: A exists alone, A and B exist simultaneously, and B exists alone. In addition, in the description of the embodiments of this application, "a plurality of" means two or more than two.

[0053] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of such features.

[0054] Specific examples are used in this article to elaborate on the principles and implementation manners of the present invention. The description of the above embodiments is only used to help understand the core idea of the present invention. It should be noted that for those of ordinary skill in the art, without departing from the principle of the present invention, several improvements and modifications can be made to the present invention, and these improvements and modifications also fall within the protection scope of the claims of the present invention.

Claims

1. A focusing ring temperature control system, characterized in that, Comprising: A focusing ring assembly having a cooling cavity with a liquid inlet channel (600) and a liquid outlet channel; A cooling device (901) including at least a first output pipeline communicating with the liquid inlet channel (600) and a first return liquid pipeline communicating with the liquid outlet channel, so that the coolant of the cooling device (901) can circulate into the cooling cavity to adjust the temperature of the focusing ring assembly.

2. The focusing ring temperature control system according to claim 1, characterized in that, A first flow valve (903) is connected in series on the first output pipeline.

3. The focusing ring temperature control system according to claim 1, characterized in that, The focusing ring assembly includes a focusing ring main body (200) and a sealing ring (500). The focusing ring main body (200) has a receiving cavity with an open bottom end. The sealing ring (500) is sealingly connected to the focusing ring main body (200) and encloses the cooling cavity with the receiving cavity.

4. The focusing ring temperature control system according to claim 3, characterized in that, The focusing ring main body (200) and the sealing ring (500) are sealingly connected by a fastener (202), and are also sealingly connected by a first sealing member (300) between the focusing ring main body (200) and the sealing ring (500).

5. The focusing ring temperature control system according to claim 4, characterized in that, The focusing ring main body (200) is provided with a counterbore, and the sealing ring (500) is provided with a threaded blind hole. The fastener is configured as a bolt which is threadedly connected to the threaded blind hole. The bolt head is located in the counterbore and is sealingly fitted with the sunken end face of the counterbore through a second sealing member (203).

6. The focusing ring temperature control system according to claim 5, characterized in that, The focusing ring assembly further includes a cap (201) for plugging the counterbore.

7. The focusing ring temperature control system according to claim 3, characterized in that, The sealing connection mode between the focusing ring main body (200) and the sealing ring (500) is configured as welding, bonding or rotary crimping.

8. The focusing ring temperature control system according to any one of claims 3-7, characterized in that, The focusing ring main body (200) is assembled by at least two arc segments. Each arc segment has a receiving cavity with an open bottom end. Each arc segment is sealingly connected to the sealing ring (500), and the receiving cavities where the arc segments are located respectively enclose independent cooling cavities with the sealing ring (500).

9. The focusing ring temperature control system according to claim 8, characterized in that, The splicing positions of two adjacent arc segments are spliced and connected in an overlapping manner. One of the arc segments is provided with an upper convex edge (204) corresponding to the overlapping position, and the other arc segment is provided with a lower convex edge (205) that overlaps and fits with the upper convex edge (204) corresponding to the overlapping position.

10. The focusing ring temperature control system according to claim 3, characterized in that, The liquid inlet channel (600) and the liquid outlet channel are both sealingly connected to the sealing ring (500). Both the liquid inlet channel (600) and the liquid outlet channel are configured as external thread pipes. The sealing ring (500) is provided with a stepped through hole. The position of the external thread pipe near the top is provided with a limiting step adapted to the stepped through hole. The main body part of the external thread pipe is threadedly connected to the small-diameter section of the stepped through hole, and the limiting step and the stepped surface of the stepped through hole are sealed by a third sealing member (400).

11. The focusing ring temperature control system according to claim 3, characterized in that, It further includes a cover ring (700) for carrying the focusing ring assembly. The sealing ring (500) is integrated with the cover ring (700). A screw-in card slot is provided on the cover ring (700). A wedge-shaped convex card is provided on the outer ring side of the focusing ring body (200). The wedge-shaped convex card is screwed into the cover ring (700) from the screw-in card slot, enabling the focusing ring body (200) to be hermetically connected to the cover ring (700).

12. The focusing ring temperature control system according to claim 11, characterized in that, A positioning block is further provided on the cover ring (700), and a positioning opening is provided on the screw-in card slot. When the wedge-shaped convex card is screwed into the screw-in card slot to a preset position, the positioning block is installed in the positioning opening.

13. An electrostatic chuck mechanism, characterized in that, It includes an electrostatic chuck (800) and a focusing ring temperature control system according to any one of claims 1-12. A cooling flow channel is provided in the electrostatic chuck (800). The cooling device (901) further includes a second output pipeline (801) communicated with the inlet of the cooling flow channel and a second return liquid pipeline communicated with the outlet of the cooling flow channel.

14. The electrostatic chuck mechanism according to claim 13, characterized in that, A second flow valve (902) is connected in series on the second output pipeline (801).

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