Pin specification detection device and method for chip packaging

Abstract

The invention discloses a pin specification detection device and method for chip packaging, and relates to the technical field of chip packaging detection. The pin specification detection device for chip packaging comprises a detection table and a three-axis moving module on the detection table, the three-axis moving module is provided with a taking and placing structure used for taking and placing a chip, a traditional mode of directly sucking the chip and placing the chip on a detection element is changed into a mode of adopting airflow buffering, and the detection efficiency is greatly improved. According to the technical scheme, the chip pins can be prevented from being damaged and deformed by pressure at the moment of falling and collision of the chip, the problem that original qualified products fail due to detection reasons can be avoided, the chip is carried to fall by adopting the throwing type suction structure, the throwing type suction structure can stabilize and guide, deviation and shaking caused by blowing of the thin chip by airflow are avoided, and the production efficiency is improved. In addition, the device can adapt to chips of different models, is high in adaptability, avoids position deviation and collision effects through guiding and buffering, is high in protection for chip pins, and avoids accidental damage.

Description

Technical Field

[0001] The present invention relates to the technical field of chip package detection, and specifically provides a pin specification detection device and method for chip packaging. Background Art

[0002] Chip pins, also known as pin feet, are the wiring drawn from the internal circuit of the chip to the peripheral circuit, equivalent to the interface of the chip. Chip pin detection is a key step to ensure the reliability and performance of the chip. The main purpose of chip pin detection is to ensure that each pin is correctly connected without problems such as missing, damaged, skewed or short-circuited pins. These problems may affect the electrical performance of the chip and even cause the chip to malfunction.

[0003] For chips with fine and dense bottom pins such as CPUs, visual detection is usually used for pin detection. For example, a chip vision detection system disclosed in Publication No. CN105448782B uses a chip frame with a chip installed to move on a guide rail, and a camera set on the guide rail takes pictures of the chip in the chip frame to obtain a chip image, and then uses an image detection system to process the chip image to determine whether the chip is qualified. This invention can automatically detect the chip using the above chip vision detection system, overcoming the deficiency of the existing detection technology that relies on manual judgment of chip qualification, and is more efficient than manual detection.

[0004] However, such detection methods can only detect whether there are problems such as deformation and missing of chip pins from the appearance, and cannot perform electrical detection. Therefore, when detecting the quality of chip pins electrically, a dedicated electrical detection component needs to be used for contact detection. The conventional method is to use a suction cup or the like to suck the chip above the detection component and then place the chip on the detection component for detection. However, whether the chip is directly placed or released at a certain height, if the chip pins are slightly deformed, it is easy to cause the pins to be squeezed and deformed more severely due to collision, which instead increases the unqualified rate and the difficulty of repair. And precisely and carefully placing the chip requires too high requirements for the equipment, and there are many chip specifications, and it is difficult to solve such problems currently. Summary of the Invention

[0005] Aiming at the deficiencies of the prior art, the present invention provides a pin specification detection device and method for chip packaging, which solves the problem that the current chip detection equipment may increase the defective rate.

[0006] To achieve the above object, the present invention is realized by the following technical solutions: A pin specification detection device for chip packaging, including a detection table and a three-axis movement module thereon. A pick-and-place structure for picking and placing chips is installed on the three-axis movement module. On the detection table, there are also a front placement station for placing the chips to be detected, a rear placement station for placing the chips after detection, and a detection station for detecting the chips to be detected. A drop-type suction structure for sucking or dropping chips is also provided on the detection table. The detection station includes two groups of detection seats. After being connected by the pick-and-place structure, the drop-type suction structure sucks the chip and drops it from above the detection seat. The detection seat has a function of guiding and positioning the drop-type suction structure and a wind buffering function, and the wind buffering function enables the drop-type suction structure to carry the chip and fall slowly;

[0007] The drop-type suction structure is connected or separated from the pick-and-place structure by an electromagnetic method. The drop-type suction structure sucks the chip by negative pressure, and when the drop-type suction structure is magnetically attracted by the pick-and-place structure, negative pressure is synchronously generated by the magnetic force to attract the chip;

[0008] The execution end of the three-axis movement module installs the pick-and-place structure through a clamp. A positioning rod is also installed on the execution end of the three-axis movement module and on one side of the clamp. A calibration seat corresponding to the positioning rod for positioning the origin position of the pick-and-place structure is also installed on the top of the detection table. An origin positioning sleeve for positioning and placing the drop-type suction structure is installed at the origin position on the top of the detection table, and the shape of the origin positioning sleeve is similar to that of a guiding sleeve.

[0009] Preferably, the drop-type suction structure includes:

[0010] A housing, the top of which is snap-connected with an iron upper cover, and a hollow-out groove is opened at the bottom of the housing;

[0011] A piston, with a sealing ring sleeved on its surface and sliding in a sealed manner with the inner surface of the housing;

[0012] A first magnetic sheet, fixed to the top of the piston;

[0013] A one-way valve structure, detachably installed at the center of the bottom of the piston, and a through hole communicating with the one-way valve structure is opened at the center of the piston;

[0014] A soft film, pasted on the bottom of the housing, and a number of negative pressure holes communicating with the hollow-out groove are opened inside the soft film;

[0015] A guiding sleeve, fixed to the top of the iron upper cover in a funnel shape;

[0016] The one-way valve structure includes a valve sleeve that penetrates up and down, and a valve block is slidably arranged inside the valve sleeve. The bottoms of the valve sleeve and the valve block are both frustum-shaped, so that when the valve block falls, the bottom hole of the valve sleeve is closed, and air channels are opened on the side and top of the valve block.

[0017] Preferably, the picking and placing structure includes:

[0018] An upper housing, inside which a power connection device is installed;

[0019] A lower housing, which is threadedly connected to the upper housing;

[0020] An electromagnetic column, which slidably penetrates through the bottom of the upper housing and the lower housing, and the power connection device is slidably and electrically connected to the electromagnetic column through a carbon brush;

[0021] A spring, the electromagnetic column is of stepped shaft type, the spring is sleeved outside the electromagnetic column, and both ends of the spring respectively abut against the electromagnetic column and the upper housing;

[0022] An iron plate, fixedly connected to the bottom of the electromagnetic column for diffusing the magnetic force of the electromagnetic column, and the guiding sleeve is used to guide the coaxial docking of the iron plate and the dropping type suction structure.

[0023] Preferably, the detection base includes:

[0024] A guiding sleeve, the top of which is flared, for guiding the dropping type suction structure to be put in;

[0025] A blowing ring, fixedly connected to the bottom of the guiding sleeve, for blowing air upward towards the center of the guiding sleeve in a circumferential direction to slow down the falling of the dropping type suction structure;

[0026] A ring pipe, arranged on the top of the blowing ring, and the ring pipe is communicated with the top of the blowing ring through a plurality of shunt pipes uniformly distributed at the bottom;

[0027] A stable cotton sheet, attached to the inner wall around the guiding sleeve, for stabilizing the dropping type suction structure to keep vertical;

[0028] A gas pump is installed on the top of the detection table, a filter cover is installed at the air inlet end of the gas pump, and the air outlet end of the gas pump is communicated with the two ring pipes through a charging pipe and a three-way joint.

[0029] Preferably, the detection station further includes:

[0030] A backing plate, fixed on the detection table through fixing seats at the four corners;

[0031] A mounting plate, fixedly connected to the bottom of the blowing ring and installed on the backing plate through bolts;

[0032] A pull-out plate, a slot adapted to the pull-out plate is opened at the bottom of the backing plate, a handle is installed at the front end of the pull-out plate, a receiving groove is opened at the top of the pull-out plate, and a magnet for magnetically attracting the inner wall of the slot is embedded at the rear side of the pull-out plate;

[0033] The detection board is placed in the accommodation groove and adsorbed on the inner wall of the accommodation groove by a magnetic block, and a detection groove for detecting the pins of the corresponding accommodation chip is arranged on the top;

[0034] An inclined opening for conveniently buckling the detection board is arranged at the rear end of the accommodation groove, and corresponding electrodes are arranged on the front side of the bottom of the inner wall of the accommodation groove and the front side of the bottom of the detection board.

[0035] Preferably, the front placement station includes:

[0036] Two columns of first sliding rails are fixedly arranged in parallel on the detection table, and half of the top of the first sliding rail is T-shaped and the other half is triangular;

[0037] There are four sliders, and two in a group slide on two columns of first sliding rails respectively. A sliding groove adapted to the first sliding rail is arranged on the top of the slider. The main body of the sliding groove is a T-shaped groove, and a triangular groove is arranged in the middle of the T-shaped groove;

[0038] A tray is fixedly connected to the tops of the four sliders by bolts, and a handle is screwed on the front side of the tray;

[0039] A placement tray is placed on the top of the tray through a positioning pin and is used for placing the chips to be detected;

[0040] A first positioning seat is fixedly connected to the detection table and is arranged between the right ends of the two columns of first sliding rails. A second magnetic sheet for magnetically attracting the tray is arranged on the left side of the first positioning seat.

[0041] Preferably, the rear placement station includes:

[0042] Two columns of second sliding rails are fixedly arranged in parallel on the detection table and are located on one side of the first sliding rails. The top of the second sliding rail is triangular;

[0043] Several groups of placing seats, each group of placing seats straddle and slide on two columns of second sliding rails at the same time, and adjacent two placing seats are magnetically connected. Several groups of placing seats are used for placing the detected chips, and the qualified products and unqualified products among the detected chips are placed from both sides to the middle in turn. After the chips on each placement tray are all placed on the placing seats, there is a spare group of placing seats to distinguish the qualified chips and unqualified chips;

[0044] A pick-up bracket is used for simultaneously supporting several groups of placing seats;

[0045] A second positioning seat is fixedly connected to the detection table and is arranged between the right ends of the two columns of second sliding rails. A third magnetic sheet for magnetically attracting the placing seat is arranged on the left side of the second positioning seat.

[0046] Preferably, fourth magnetic pieces are embedded on both sides of the placing base so that adjacent placing bases are magnetically attracted to each other. Convex ribs adapted to the cross-section of the second slide rail are provided on both sides of the top of the object-taking bracket, and a plug shaft is fixedly connected to the right end of the convex rib. A jack adapted to the plug shaft is provided at the left end of the second slide rail so that the object-taking bracket is aligned with the second slide rail, and then the placing base can slide directly onto the object-taking bracket.

[0047] Preferably, iron pipes penetrate through both sides inside the placing base. The object-taking bracket is formed by bending an iron rod. The middle of the iron rod is folded in half into an inverted U shape, and the other lengths are horizontally bent into two parallel inserting rods corresponding to the iron pipes. A cross bar is welded at the connection between the inverted U-shaped part and the horizontal part of the iron rod, and a magnetic sleeve is sleeved on the cross bar so that the whole object-taking bracket is magnetized.

[0048] The present invention also discloses a method for using a pin specification detection device for chip packaging, which specifically includes the following steps:

[0049] Step 1: First, place the chip to be detected on the front placement station, and then the device can be started to detect the chip pins.

[0050] Step 2: The three-axis movement module first carries the picking and placing structure to move and perform origin calibration. Then, the picking and placing structure sucks the dropping type sucking structure, and then moves the dropping type sucking structure to the chip to be detected, sucks the chip to be detected by negative pressure, and then moves to above the detection seat. Then, the dropping type sucking structure and the chip are dropped together. At this time, the air flow blown upward by the detection seat buffers the chip and the dropping type sucking structure, so that the chip slowly falls onto the detection element, and the chip pins are detected through the circuit.

[0051] Step 3: After the detection is completed, the dropping type sucking structure and the chip are sucked up again and moved to the rear placement station, and are placed at different positions on the rear placement station according to the detection results of the chip. Then, the negative pressure of the dropping type sucking structure is eliminated by controlling the power of the electromagnet to separate from the chip, and then the dropping type sucking structure is carried away for subsequent detection.

[0052] The present invention provides a pin specification detection device and method for chip packaging. Compared with the prior art, the following beneficial effects are achieved:

[0053] 1. The pin specification detection device for chip packaging replaces the traditional method of directly sucking the chip and placing it on the detection element with the air flow buffering method adopted in this application. This can avoid the pressure damage and deformation of the chip pins caused by the instantaneous collision when the chip drops, and can prevent the problem that the original qualified products malfunction due to detection reasons. Moreover, the chip is carried down by the dropping suction structure, and the dropping suction structure itself can be stabilized and guided, avoiding the deviation and shaking of the thin chip blown by the air flow. It can also adapt to different models of chips, with strong adaptability. Through guidance and buffering, the deviation and collision are avoided, and the air film between the chip and the detection part can also avoid direct collision, providing strong protection for the chip pins and preventing accidental damage.

[0054] 2. The pin specification detection device for chip packaging has a soft film with negative pressure holes at the bottom of the dropping suction structure, which can better fit the surface of the chip without causing pressure damage to the chip. The dropping suction structure generates negative pressure by the upward movement of the piston, and the upward movement force of the piston comes from the magnetic force generated by the electromagnetic column on the first magnetic sheet on the piston. At the same time, it also enables the picking and placing structure to pick up the dropping suction structure for carrying and moving. When it is necessary to put down the dropping suction structure, a low-intensity reverse magnetic force can be generated to create a repulsive force with the first magnetic sheet, thereby putting down the dropping suction structure. At this time, the dropping suction structure can still maintain suction to hold the chip. If it is necessary to separate the chip, the reverse magnetic force can be increased to further push the piston to eliminate the negative pressure, and at this time, the reverse magnetic force will also attract the iron upper cover and still be able to adsorb the dropping suction structure. In summary, by controlling the power of the electromagnetic column, different effects can be achieved, the control is simple and convenient, and a good protection effect on the chip can also be achieved.

[0055] 3. The pin specification detection device for chip packaging uses a drawer-type structure for installing the detection board for detecting the chip. The detection board is directly placed in the drawer board, and the drawer-type matching and clamping method is adopted, which is convenient for replacing detection boards of different specifications, thereby adapting to the detection of different types of chips, improving the versatility, and being simple and convenient to operate.

[0056] 4. The storage tray for placing the chip in the pin specification detection device for chip packaging can be directly placed on the tray, and the tray is positioned by the first positioning seat to ensure the accuracy of the tray coordinate position. The tray is installed on the first slide rail through the slider, and the distance between the sliders can also be adjusted to install trays of different sizes, thereby installing storage trays of different sizes and adapting to different models and quantities of chips.

[0057] 5. The pin specification detection device for chip packaging uses a split-type holding seat to hold the detected chips. By classifying and placing good and bad chips from left to right towards the middle, it is convenient to classify the chips. And a fixed number of holding seats are installed in a limited space, which can hold chips with different ratios of good and bad chips without setting extra placement positions, saving space. At the same time, it is equipped with a pick-up bracket, which is convenient to lift multiple holding seats containing chips together, making it easy to use. And two forms of holding seats and pick-up brackets are designed. One is used after the detection, and the other is always placed on the detection table during the detection, and the two forms can be selectively used. BRIEF DESCRIPTION OF THE DRAWINGS

[0058] Figure 1 is a schematic diagram of the overall structure of the present invention;

[0059] Figure 2 is a schematic diagram of the picking and placing structure, the dropping-type suction structure and the detection seat of the present invention;

[0060] Figure 3 is an exploded view of the dropping-type suction structure of the present invention;

[0061] Figure 4 is a cross-sectional schematic diagram of the piston and one-way valve structure of the present invention;

[0062] Figure 5 is a cross-sectional schematic diagram of the picking and placing structure of the present invention;

[0063] Figure 6 is a cross-sectional schematic diagram of the detection seat of the present invention;

[0064] Figure 7 is a schematic diagram of the overall structure of the detection station of the present invention;

[0065] Figure 8 is a schematic diagram of the first slide rail and the slider of the present invention;

[0066] Figure 9 is a schematic diagram of the slider, the tray and the first positioning seat of the present invention;

[0067] Figure 10 is a schematic diagram of the holding seat of Form 1 of the present invention;

[0068] Figure 11 is a schematic diagram of the pick-up bracket of Form 1 and the second slide rail of the present invention;

[0069] Figure 12 is a schematic diagram of the holding seat and the pick-up bracket of Form 2 of the present invention.

[0070] In the figure: 1. Detection table; 11. Calibration seat; 12. Origin positioning sleeve; 13. Air pump; 14. Inflation pipe; 15. Fixed seat;

[0071] 2. Three-axis moving module; 21. Claw; 22. Positioning rod;

[0072] 3. Pick-and-place structure; 31. Upper housing; 32. Power connection device; 33. Lower housing; 34. Electromagnetic column; 35. Spring; 36. Iron plate;

[0073] 4. Front placement station; 41. First slide rail; 42. Slide block; 421. Slide groove; 43. Tray; 44. Object placement tray; 45. First positioning seat; 46. Second magnetic sheet;

[0074] 5. Rear placement station; 51. Second slide rail; 52. Placing seat; 53. Object picking bracket; 531. Magnetic sleeve; 54. Second positioning seat; 55. Third magnetic sheet; 56. Fourth magnetic sheet; 57. Insertion shaft; 58. Insertion hole; 59. Iron pipe;

[0075] 6. Detection station; 61. Detection seat; 611. Guide sleeve; 612. Blowing ring; 613. Ring pipe; 614. Stable cotton sheet; 62. Base plate; 621. Slot; 63. Mounting plate; 64. Pull-out plate; 641. Accommodation groove; 642. Magnet; 643. Oblique opening; 644. Electrode; 65. Detection plate; 651. Detection groove; 66. Magnetic block;

[0076] 7. Drop-type suction structure; 71. Outer shell; 72. Buckle; 73. Iron upper cover; 74. Piston; 75. Sealing ring; 76. First magnetic sheet; 77. Soft film; 771. Negative pressure hole; 78. Driving sleeve; 79. Valve sleeve; 710. Valve block; 711. Air passage. Detailed implementation manners

[0077] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0078] The present invention discloses a pin specification detection device for chip packaging and provides the following five technical solutions:

[0079] Figures 1-2The first embodiment is shown: It includes a detection table 1 and a three-axis moving module 2 thereon. A pick-and-place structure 3 for picking and placing chips is installed on the three-axis moving module 2. On the detection table 1, there are also a front placement station 4 for placing chips to be detected, a rear placement station 5 for placing chips after detection, and a detection station 6 for detecting chips to be detected. On the detection table 1, there is also a drop-type suction structure 7 for sucking or dropping chips. The detection station 6 includes two groups of detection seats 61. After the drop-type suction structure 7 is connected by the pick-and-place structure 3, it sucks the chip and drops it from above the detection seat 61. The detection seat 61 has the functions of guiding and positioning the drop-type suction structure 7 and wind buffering. The wind buffering function enables the drop-type suction structure 7 to carry the chip and fall slowly;

[0080] The drop-type suction structure 7 is connected or separated from the pick-and-place structure 3 by an electromagnetic method. The drop-type suction structure 7 sucks the chip through negative pressure, and when the drop-type suction structure 7 is magnetically attracted by the pick-and-place structure 3, negative pressure is generated synchronously by the magnetic force to attract the chip;

[0081] The execution end of the three-axis moving module 2 installs the pick-and-place structure 3 through a clamp 21. A positioning rod 22 is also installed on the execution end of the three-axis moving module 2 and on one side of the clamp 21. On the top of the detection table 1, a calibration seat 11 corresponding to the positioning rod 22 for positioning the origin position of the pick-and-place structure 3 is installed. An origin positioning sleeve 12 for positioning and placing the drop-type suction structure 7 is installed at the origin position on the top of the detection table 1.

[0082] By changing the traditional method of directly sucking the chip and placing it on the detection element to the method of using air flow buffering in this application, it can avoid the pressure damage and deformation of the chip pins at the moment when the chip falls and collides, and can avoid the problem that the original qualified products malfunction due to detection reasons. Moreover, the drop-type suction structure 7 is used to carry the chip and fall. The drop-type suction structure 7 itself can be stabilized and guided, avoiding the thin chip being blown and deviated by the air flow, and can also adapt to different models of chips, with strong adaptability. After being guided and buffered, it avoids the deviation and collision, and the air film between the chip and the detection part can also avoid direct collision, providing strong protection for the chip pins and avoiding accidental damage.

[0083] Figures 3-5 The second embodiment is shown. The main difference from the first embodiment is that the drop-type suction structure 7 includes:

[0084] A housing 71, the top of the housing 71 is snap-connected with an iron upper cover 73 through a buckle 72. The iron upper cover 73 is made of iron alloy material, and the attraction between it and the magnet is slightly weaker, requiring a stronger magnetic attraction. And a hollow groove is opened at the bottom of the housing 71;

[0085] A piston 74, with a sealing ring 75 sleeved on its surface and sliding in a sealed manner with the inner surface of the housing 71;

[0086] The first magnetic disc 76 is fixed to the top of the piston 74;

[0087] The one-way valve structure is detachably installed at the center of the bottom of the piston 74, and a through hole communicating with the one-way valve structure is provided in the center of the piston 74;

[0088] The soft film 77 is pasted on the bottom of the outer shell 71, and a plurality of negative pressure holes 771 communicating with the hollow groove are provided inside the soft film 77;

[0089] The driving sleeve 78 is fixed to the top of the iron upper cover 73 in a funnel shape;

[0090] The one-way valve structure includes a valve sleeve 79 that penetrates up and down, and a valve block 710 is slidably arranged inside the valve sleeve 79. The bottoms of the valve sleeve 79 and the valve block 710 are both frustum-shaped, so that the bottom hole of the valve sleeve 79 is closed when the valve block 710 drops. Air channels 711 are provided on the side and top of the valve block 710, and the air channels 711 enable the air to pass smoothly through the side when the valve block 710 rises to eliminate negative pressure.

[0091] The picking and placing structure 3 includes:

[0092] The upper housing 31, and a power connection device 32 is installed inside the upper housing 31;

[0093] The lower housing 33, and the upper housing 31 is threadedly connected to the lower housing 33;

[0094] The electromagnetic column 34 slidably penetrates through the bottoms of the upper housing 31 and the lower housing 33, and the power connection device 32 is slidably electrically connected to the electromagnetic column 34 through a brush;

[0095] The spring 35, the electromagnetic column 34 is a stepped shaft type, the spring 35 is sleeved outside the electromagnetic column 34, and the two ends of the spring 35 respectively abut against the electromagnetic column 34 and the upper housing 31;

[0096] The iron disc 36 is fixedly connected to the bottom of the electromagnetic column 34 for diffusing the magnetic force of the electromagnetic column 34, and the driving sleeve 78 is used to guide the coaxial docking of the iron disc 36 and the dropping and sucking structure 7.

[0097] The detection seat 61 includes:

[0098] The guiding sleeve 611, the top of which is flared, is used to guide the dropping and sucking structure 7 to be put in, and the shape of the origin positioning sleeve 12 is similar to that of the guiding sleeve 611;

[0099] The blowing ring 612 is fixedly connected to the bottom of the guiding sleeve 611 and is used to blow air upward toward the center of the guiding sleeve 611 in a circumferential direction to slow down the falling of the dropping and sucking structure 7;

[0100] The annular pipe 613 is arranged at the top of the blowing ring 612, and the annular pipe 613 is communicated with the top of the blowing ring 612 through a plurality of shunt pipes evenly distributed at the bottom;

[0101] The stable cotton sheet 614 is attached to the inner wall around the guiding sleeve 611 and is used to keep the vertical placement suction structure 7 stable;

[0102] An air pump 13 is installed on the top of the detection table 1. A filter cover is installed at the air inlet end of the air pump 13, and the air outlet end of the air pump 13 is communicated with the two annular pipes 613 through a charging pipe 14 and a tee.

[0103] The bottom of the placement suction structure 7 uses a soft film 77 with negative pressure holes 771, which can better fit the surface of the chip and will not cause damage to the chip. The placement suction structure 7 generates negative pressure by the upward movement of the piston 74, and the upward movement force of the piston 74 comes from the attraction of the magnetic force generated by the electromagnetic column 34 on the first magnetic sheet 76 on the piston 74. At the same time, it also enables the picking and placing structure 3 to pick up the placement suction structure 7 for carrying and moving. When it is necessary to put down the placement suction structure 7, a low-intensity reverse magnetic force can be generated to generate a repulsive force between it and the first magnetic sheet 76. This repulsive force between the magnets is kept less than the resistance of the sealing ring 75 and greater than the suction force on the iron upper cover 73, so as to keep the piston 74 from sliding down while avoiding sucking the iron upper cover 73. Furthermore, the placement suction structure 7 can be put down. At this time, the placement suction structure 7 can still maintain the suction force to hold the chip. If it is necessary to separate the chip, the reverse magnetic force can be increased to further push the piston 74 to eliminate the negative pressure, and at this time the reverse magnetic force will also attract the iron upper cover 73, so that the placement suction structure 7 can still be adsorbed; In summary, by controlling the power of the electromagnetic column 34, different effects can be achieved, the control is simple and convenient, and a better protection effect on the chip can be achieved.

[0104] Figures 6-7 The third implementation mode is shown. The main difference from the first implementation mode is that the detection station 6 further includes:

[0105] The backing plate 62 is fixed on the detection table 1 through the fixing seats 15 at the four corners;

[0106] The mounting plate 63 is fixedly connected to the bottom of the blowing ring 612 and is installed on the backing plate 62 through bolts;

[0107] The draw plate 64. A slot 621 adapted to the draw plate 64 is opened at the bottom of the backing plate 62. A handle is installed at the front end of the draw plate 64. A receiving groove 641 is opened at the top of the draw plate 64. A magnet 642 for magnetically attracting the inner wall of the slot 621 is embedded and installed at the rear side of the draw plate 64;

[0108] The detection board 65 is placed in the accommodation groove 641 and adsorbed on the inner wall of the accommodation groove 641 by a magnetic block 66. A detection groove 651 for detecting the pins of the chip is provided at the top.

[0109] An inclined opening 643 for conveniently taking out the detection board 65 is provided at the rear end of the accommodation groove 641. Corresponding electrodes 644 are provided at the front side of the bottom of the inner wall of the accommodation groove 641 and the front side of the bottom of the detection board 65.

[0110] The detection board 65 for detecting the chip is installed in a pull-out structure. The detection board 65 is directly placed in the pull-out board 64. The pull-out and clamping combination method is convenient for replacing detection boards 65 of different specifications, and thus can be adapted to the detection of different types of chips, improving the versatility and being simple and convenient to operate.

[0111] Figures 8-9 The fourth implementation mode is shown. The main difference from the first implementation mode is that the front placement station 4 includes:

[0112] Two columns of first sliding rails 41 are fixedly arranged in parallel on the detection table 1. Half of the top of the first sliding rail 41 is T-shaped and the other half is triangular. The design of the two-section structure of the first sliding rail 41 enables the slider 42 to be directly placed on the left half section and then slide directly to the right to be engaged with the T-shaped structure. The slider 42 is convenient to install and remove. Compared with directly using a T-shaped sliding rail, its installation is more convenient.

[0113] There are four sliders 42, and two of them are in a group and slide on two columns of first sliding rails 41 respectively. A sliding groove 421 adapted to the first sliding rail 41 is provided at the top of the slider 42. The main body of the sliding groove is a T-shaped groove, and a triangular groove is provided in the middle of the T-shaped groove.

[0114] The tray 43 is fixed to the tops of the four sliders 42 by bolts, and a handle is screwed to the front side of the tray 43. The tray 43 can be pushed to move through the handle, so that the storage tray 44 can be moved away from the detection station to avoid accidental injury, and thus non-stop operation can be realized.

[0115] The storage tray 44 is placed on the top of the tray 43 through a positioning pin and is used for holding the chips to be detected.

[0116] The first positioning seat 45 is fixedly connected to the detection table 1 and is arranged between the right ends of the two columns of first sliding rails 41. A second magnetic sheet 46 for magnetically attracting the tray 43 is provided on the left side of the first positioning seat 45.

[0117] The storage tray 44 for holding the chips can be directly placed on the tray 43, and the tray 43 is positioned by the first positioning seat 45, ensuring the accuracy of the coordinate position of the tray 43. The tray 43 is installed on the first sliding rail 41 through the slider 42, and the distance between the sliders 42 can also be adjusted to install trays 43 of different sizes, and thus storage trays 44 of different sizes can be installed to adapt to different models and quantities of chips.

[0118] Figures 10-12 The fifth implementation manner is shown. The main difference from the first implementation manner is that the post-placement station 5 includes:

[0119] Two columns of second sliding rails 51, which are fixedly arranged in parallel on the inspection table 1 and on one side of the first sliding rail 41, and the top of the second sliding rail 51 is triangular;

[0120] A number of groups of placing seats 52, each group of placing seats 52 simultaneously straddles and slides on the two columns of second sliding rails 51, and adjacent two placing seats 52 are magnetically connected. The number of groups of placing seats 52 is used to place the inspected chips, and the qualified products and unqualified products among the inspected chips are placed from both sides to the middle in sequence. After the chips on each tray 44 are all placed on the placing seats 52, there is a spare group of placing seats 52 to distinguish the qualified chips and unqualified chips;

[0121] A pick-up bracket 53, which is used to support multiple groups of placing seats 52 simultaneously;

[0122] A second positioning seat 54, which is fixedly connected to the inspection table 1 and is arranged between the right ends of the two columns of second sliding rails 51. A third magnetic sheet 55 for magnetically attracting the placing seat 52 is arranged on the left side of the second positioning seat 54.

[0123] Among them, the placing seat 52 and the pick-up bracket 53 are provided in two forms:

[0124] Form 1: Fourth magnetic sheets 56 are embedded and installed on both sides of the placing seat 52 to magnetically attract adjacent placing seats 52. The two sides of the top of the pick-up bracket 53 are provided with convex ribs adapted to the cross-section of the second sliding rail 51, and a plug shaft 57 is fixedly connected to the right end of the convex rib. A jack 58 adapted to the plug shaft 57 is opened at the left end of the second sliding rail 51 so that the pick-up bracket 53 is aligned with the second sliding rail 51, and then the placing seat 52 directly slides onto the pick-up bracket 53.

[0125] Form 2: Iron pipes 59 penetrate through both sides inside the placing seat 52. The pick-up bracket 53 is formed by bending an iron rod. The middle of the iron rod is folded in half into an inverted U shape, and the other lengths are horizontally bent into two parallel insertion rods corresponding to the iron pipes 59. A cross bar is welded at the connection between the inverted U-shaped part and the horizontal part of the iron rod, and a magnetic sleeve 531 is sleeved on the cross bar so that the whole pick-up bracket 53 is magnetized.

[0126] By setting up a split-type holding base 52 to hold the tested chips, and classifying the good and bad chips in order from left to right towards the middle, it is convenient to classify the chips. Moreover, a quantitative number of holding bases 52 are installed within a limited space, enabling the placement of chips with different ratios of good and bad chips without setting extra placement positions, saving space. Meanwhile, in cooperation with the fetching bracket 53, it is convenient to lift multiple holding bases 52 containing chips together, making it easy to use. Additionally, two forms of holding bases 52 and fetching brackets 53 are designed. One is used after the detection, and the other is always placed on the detection table 1 during the detection, and the two forms can be selectively used.

[0127] The present invention also discloses a usage method of a pin specification detection device for chip packaging, which is characterized in that it specifically includes the following steps:

[0128] Step 1: First, place the chip to be detected on the front placement station 4, and then the device can be started to detect the chip pins.

[0129] Step 2: The three-axis movement module 2 first carries the picking and placing structure 3 to move, and performs origin calibration by inserting the positioning rod 22 into the calibration seat 11. At this time, the picking and placing structure 3 will press on the suction and delivery type suction structure 7. A positive current is applied to the electromagnetic column 34 to generate a magnetic force, making the iron plate 36 attract the iron upper cover 73, thereby sucking the entire delivery type suction structure 7. Then, control the three-axis movement module 2 to move the delivery type suction structure 7 to the chip to be detected. After the delivery type suction structure 7 is lowered to press on the chip, increase the current of the electromagnetic column 34 to generate a larger magnetic field, which can attract the first magnetic sheet 76 and then attract the piston 74 upward, causing the negative pressure holes 771 of the soft film 77 to generate negative pressure to suck the chip. Then move to above the detection seat 61, and then apply a weak reverse current to the electromagnetic column 34, making the magnetic field repel the first magnetic sheet 76, but not strong enough to push the piston 74 to break through the resistance and slide down, thereby dropping the delivery type suction structure 7 together with the chip. At this time, use the air pump 13 and the air charging pipe 14 to blow air into the annular pipe 613, and the air flow is dispersed into the blowing ring 612, and then evenly blows air above the center of the detection seat 61. The blown air flow buffers the chip and the delivery type suction structure 7, making the chip slowly fall onto the detection slot 651 of the detection board 65, and the chip pins are detected through the circuit, and the detection data is output to the computer, thereby distinguishing whether there are faults in the chip pins to distinguish the quality of the chip.

[0130] Step 3: After the detection is completed, suck up the delivery type suction structure 7 and the chip again, and move them to the rear placement station 5, and place them at different positions on the rear placement station 5 according to the detection results of the chip. Then, increase the power of the electromagnetic field to press down the piston 74, thereby eliminating the negative pressure to release the chip, while the strong magnetic field can still adsorb the iron upper cover 73 to carry away the delivery type suction structure 7 for subsequent detection.

[0131] Step 4: After the detection of a tray of chips is completed, the storage tray 44 can be directly replaced with a new batch of chips. At the same time, slide the holding seat 52 onto the fetching bracket 53 (for Method 1), or directly lift the fetching bracket 53 to lift the holding seat 52 (for Method 2), and then directly replace the vacant holding seat 52;

[0132] Step 5: When it is necessary to replace the detection board 65 with different specifications, pull out the draw board 64, lift the detection board 65 from the bevel 643 for replacement, and then push the draw board 64 back until the magnet 642 attracts the inner wall of the backing plate 62.

[0133] Meanwhile, the content not described in detail in this specification belongs to the prior art well-known to those skilled in the art.

[0134] It should be noted that, in this text, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or sequence between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article or device.

[0135] Although the embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A pin specification detection device for chip packaging, characterized in that: The invention comprises a testing platform and a three-axis moving module thereon, wherein a pick-and-place structure for picking up and placing chips is installed on the three-axis moving module, and the testing platform is also provided with a front placement station for placing the chips to be tested and a rear placement station for placing the chips after testing, as well as a testing station for testing the chips to be tested, characterized in that: the testing platform is also provided with a drop-in suction structure for sucking or dropping chips, and the testing station comprises two groups of testing seats, the drop-in suction structure is connected with the pick-and-place structure and then sucks the chips and drops them from above the testing seat, and the testing seat has a guiding and positioning function for the drop-in suction structure and a wind buffering function, and the wind buffering function enables the drop-in suction structure to carry the chips and fall slowly; The drop-in suction structure is connected or separated from the pick-and-place structure by electromagnetic means, and the drop-in suction structure sucks the chip by negative pressure, and when the drop-in suction structure is magnetically attracted by the pick-and-place structure, the magnetic force is used to synchronously generate negative pressure to attract the chip; The execution end of the three-axis mobile module is installed with a pick-and-place structure through a clamp, and a positioning rod is also installed on the execution end of the three-axis mobile module and on one side of the clamp. A correction seat corresponding to the positioning rod is also installed on the top of the detection table for locating the origin position of the pick-and-place structure, and an origin positioning sleeve is installed on the top of the detection table and located at the origin position to position and place the drop-type suction structure.

2. A pin specification detection device for chip packaging according to claim 1, characterized in that: The delivery type suction structure comprises: The outer shell has an iron upper cover on the top thereof clamped by a buckle, and a hollow groove is formed on the bottom of the outer shell; The piston has a sealing ring sleeved on its surface and is sealed and slidable with the inner surface of the shell; A first magnetic sheet is fixed to the top of the piston; The one-way valve structure is detachably mounted at the center of the bottom of the piston, and a through hole communicating with the one-way valve structure is provided at the center of the piston; The soft film is adhered to the bottom of the shell, and a plurality of negative pressure holes connected with the hollow grooves are opened inside the soft film; The priming sleeve is bucket-shaped and fixed on the top of the iron cover; The one-way valve structure includes a valve sleeve that passes through from top to bottom, and a valve block is slidably arranged inside the valve sleeve. The bottoms of the valve sleeve and the valve block are both truncated cone-shaped, so that the bottom hole of the valve sleeve is closed when the valve block falls. Airways are opened on the sides and top of the valve block.

3. A pin specification detection device for chip packaging according to claim 2, characterized in that: The pick-and-place structure comprises: An upper shell, wherein a power connection device is installed inside the upper shell; A lower casing, wherein the upper casing is threadedly connected to the lower casing; An electromagnetic column, wherein the electromagnetic column slides through the bottom of the upper shell and the lower shell, and the power connection device is electrically connected to the electromagnetic column in a sliding manner through a brush; The spring, the electromagnetic column is a stepped shaft type, the spring is sleeved outside the electromagnetic column, and the two ends of the spring abut against the electromagnetic column and the upper sleeve shell respectively; The iron plate is fixedly connected to the bottom of the electromagnetic column to diffuse the magnetic force of the electromagnetic column, and the driving sleeve is used to guide the coaxial docking of the iron plate and the drop-type suction structure.

4. The pin specification detection device for chip packaging according to claim 1, characterized in that: The detection seat comprises: A guide sleeve, with a flared top, is used to guide the insertion of the drop-in suction structure; A blowing ring, fixedly connected to the bottom of the guide sleeve, is used to blow air in a circular direction above the center of the guide sleeve to slow down the falling of the guide drop-type suction structure; The ring pipe is arranged at the top of the blowing ring, and the ring pipe is connected with the top of the blowing ring through a plurality of shunt pipes evenly distributed at the bottom; The stabilizing cotton sheet is attached to the inner wall of the guide sleeve and is used to stabilize the drop-in suction structure and keep it vertical; An air pump is installed on the top of the testing platform, a filter cover is installed on the air inlet end of the air pump, and the air outlet end of the air pump is connected with two ring pipes through an air charging pipe and a tee.

5. The pin specification detection device for chip packaging according to claim 1, characterized in that: The detection station also includes: The pad is fixed on the test bench through the fixing seats at the four corners; A mounting plate, fixedly connected to the bottom of the blowing ring and mounted on the backing plate by bolts; A pull-out plate, wherein a slot adapted to the pull-out plate is provided at the bottom of the pad, a handle is installed at the front end of the pull-out plate, a receiving slot is provided at the top of the pull-out plate, and a magnet for magnetic attraction with the inner wall of the slot is embedded in the rear side of the pull-out plate; The detection board is placed in the receiving groove and adsorbed to the inner wall of the receiving groove by a magnetic block, and a detection groove corresponding to the pin of the receiving chip is arranged on the top; The rear end of the accommodating groove is provided with an oblique opening for buckling the detection plate, and the front side of the bottom of the inner wall of the accommodating groove and the front side of the bottom of the detection plate are provided with corresponding electrodes.

6. The pin specification detection device for chip packaging according to claim 1, characterized in that: The front placement station comprises: Two rows of first slide rails are fixed in parallel on the inspection table, wherein the top half of the first slide rail is T-shaped and the other half is triangular; The sliders are provided with four sliders and are arranged in groups of two to slide on the two rows of first slide rails respectively. The top of the slider is provided with a slide groove adapted to the first slide rail. The slide groove body is a T-shaped groove, and a triangular groove is provided in the middle of the T-shaped groove. The tray is fixed to the top of the four slide blocks by bolts, and a handle is screwed on the front side of the tray; The storage tray is placed on the top of the tray through positioning pins and is used to hold the chips to be tested; The first positioning seat is fixedly connected to the detection platform and arranged between the right ends of the two rows of first slide rails. The second magnetic sheet of the magnetic attraction tray is arranged on the left side of the first positioning seat.

7. The pin specification detection device for chip packaging according to claim 6, characterized in that: The post-placement station comprises: Two rows of second slide rails are fixed in parallel on the inspection table and located on one side of the first slide rail, and the top of the second slide rail is triangular; A plurality of groups of holding seats, each group of the holding seats slides across two rows of second slide rails at the same time, and two adjacent holding seats are magnetically connected, and the plurality of groups of the holding seats are used to place the tested chips, and the qualified and unqualified chips are placed in the middle in sequence from both sides, and after all the chips on each tray are placed on the holding seats, a group of holding seats is left to distinguish qualified chips from unqualified chips; The object-retrieving bracket is used to support multiple sets of holding seats at the same time; The second positioning seat is fixedly connected to the detection platform and arranged between the right ends of the two rows of second slide rails. A third magnetic sheet of the magnetic holding seat is arranged on the left side of the second positioning seat.

8. The pin specification detection device for chip packaging according to claim 7, characterized in that: Fourth magnetic sheets are embedded on both sides of the receiving seat to enable adjacent receiving seats to be magnetically attracted to each other. The two sides of the top of the picking bracket are arranged with ridges that are adapted to the cross-section of the second slide rail, and the right end of the ridge is fixedly connected to a plug shaft. The left end of the second slide rail is provided with a socket that is adapted to the plug shaft to align the picking bracket with the second slide rail, thereby allowing the receiving seat to slide directly onto the picking bracket.

9. The pin specification detection device for chip packaging according to claim 7, characterized in that: Iron pipes are passed through the two sides of the receiving seat, and the picking bracket is formed by bending an iron rod. The middle of the iron rod is folded into an inverted U shape, and the other length is horizontally bent into two parallel plug rods corresponding to the iron pipes. A cross bar is welded at the connection between the inverted U-shaped part and the horizontal part of the iron rod, and a magnetic sleeve is provided on the cross bar to make the picking bracket magnetic as a whole.

10. A method for using the pin specification detection device for chip packaging according to any one of claims 1 to 9, characterized in that: The specific steps include: Step 1: First, place the chip to be tested on the front placement station, and then turn on the equipment to test the chip pins; Step 2: The three-axis moving module first moves with the pick-and-place structure and performs origin calibration. Then, the pick-and-place structure absorbs the drop-type suction structure, and then moves the drop-type suction structure to the chip to be tested, uses negative pressure to suck the chip to be tested, and then moves it to the top of the test seat. Then, the drop-type suction structure is dropped together with the chip. At this time, the airflow blown upward by the test seat is used to buffer the chip and the drop-type suction structure, so that the chip slowly falls onto the test element, and the chip pins are tested through the circuit; Step 3: After the detection is completed, the drop-type suction structure and the chip are sucked up again and moved to the post-placement station. According to the results of the chip detection, they are placed at different positions on the post-placement station. Then, by controlling the electromagnetic power, the negative pressure of the drop-type suction structure is eliminated to separate from the chip, and then the drop-type suction structure is carried away for subsequent detection.

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