Heating and cooling device for load lock chamber

Abstract

The present invention relates to an apparatus for heating and cooling a load lock chamber, comprising: an upper chamber which is formed at the upper part of the inner side of the chamber body of the load lock chamber and in which a wafer waits before a process; a lower chamber which is formed at the lower part of the inner side of the chamber body and in which a wafer waits after the process; a vortex tube which is provided on the lower side of the chamber body, supplies compressed air, discharges hot air to the long-axis end, and discharges cold air to the short-axis end; a hot air flow path which is connected between the long-axis end of the vortex tube and the upper chamber and supplies hot air to the upper chamber; and a cold air flow path which is connected between the short-axis end of the vortex tube and the lower chamber and supplies cold air to the lower chamber. According to the invention, the heating and cooling device is formed by a single system, is easy to design and manufacture, does not generate power consumption during operation, and can solve the problem of water leakage of process cooling water (PCW).

Description

Technical Field

[0001] The present invention relates to a heating and cooling device for a load lock chamber, and more particularly to a heating and cooling device for a load lock chamber that heats (preheats) and cools wafers carried in and out through the load lock chamber. Background Art

[0002] A load lock chamber is located between an equipment front end module (EFEM) in an atmospheric pressure state and a transfer chamber in a vacuum state. By quickly switching between the vacuum state and the atmospheric state, it can maintain the vacuum state of the transfer chamber while quickly carrying in and out wafers.

[0003] The above load lock chamber is provided with a heating device for preheating wafers to an appropriate temperature before being introduced into a process chamber. Also, the above load lock chamber is provided with a cooling device to quickly reduce the temperature of the wafers discharged from the process chamber.

[0004] Generally, as the heating device of the above load lock chamber, an electrically heated heater is used, and as the cooling device, a PCW device that circulates process cooling water (PCW) is used.

[0005] However, the above heater and the above PCW device are independent individual systems and must be separately constituted by separate systems, so a large amount of time and cost are consumed in design and production.

[0006] Also, the above heater and the above PCW device respectively require separate energy sources, resulting in a complex device structure and inevitable power consumption and loss during operation.

[0007] Also, there is a possibility of leakage and loss of PCW in the above PCW device.

[0008] The prior art is technical information that the inventor has or obtained in the process of deriving the present invention, and is not necessarily publicly known prior art disclosed to the general public before applying for the present invention.

[0009] Prior Art Documents

[0010] Patent Documents

[0011] (Patent Document 1) Korean Patent Publication No. 10-2008-0072275 (published on August 6, 2008) Summary of the Invention

[0012] Technical Problem

[0013] In the process of solving the above problems, an object of the present invention is to provide a heating and cooling device for a load lock chamber formed by a system, which is easy to design and manufacture, does not consume power during operation, and can fundamentally solve the PCW leakage problem.

[0014] The problems to be solved by the present invention are not limited to the above-mentioned problems. Those of ordinary skill in the technical field to which the present invention pertains can clearly understand other problems to be solved not mentioned from the following description.

[0015] Solution to the problem

[0016] The heating and cooling device for a load lock chamber according to an embodiment of the present invention includes: an upper chamber formed in the upper inner part of the chamber body of the load lock chamber, where the wafer waits before the process; a lower chamber formed in the lower inner part of the chamber body, where the wafer waits after the process; a vortex tube provided on the lower side of the chamber body, supplied with compressed air, discharging hot air from the long-axis end and cold air from the short-axis end; a hot air flow path connected between the long-axis end of the vortex tube and the upper chamber to supply hot air to the upper chamber; and a cold air flow path connected between the short-axis end of the vortex tube and the lower chamber to supply cold air to the lower chamber.

[0017] Moreover, the vortex tube can be connected to a compressed gas supply source provided at a place far from the load lock chamber to supply compressed gas.

[0018] Moreover, the hot air flow path may include: a lower flow path provided on the lower side of the chamber body and connected to the long-axis end of the vortex tube; a connecting flow path formed by vertically penetrating the chamber body, with the lower inlet connected to the lower flow path; and an upper branch flow path provided on the upper side of the chamber body, connected to the upper outlet of the connecting flow path, branching to both sides, and respectively connected to the upper chambers provided on the left and right sides of the chamber body.

[0019] Moreover, the cold air flow path may include: a central flow path provided on the lower side of the chamber body and connected to the short-axis end of the vortex tube; and a lower branch flow path branching from the central flow path to both sides and respectively connected to the lower chambers provided on the left and right sides of the chamber body.

[0020] Moreover, the upper branch flow path can be connected to a diffuser penetrating and provided at the center of the upper surface of the upper chamber.

[0021] Moreover, the lower branch flow path can be connected to a diffuser penetrating and provided at the center of the lower surface of the lower chamber.

[0022] Further, the lower flow path described above may be provided with a regulator for adjusting the flow rate of the hot air supplied to the upper chamber.

[0023] Further, the central flow path described above may be provided with a regulator for adjusting the flow rate of the cold air supplied to the lower chamber.

[0024] Further, the upper branch flow path described above may be provided with a filter for filtering particles of the hot air supplied to the upper chamber.

[0025] Further, the lower branch flow path described above may be provided with a filter for filtering particles of the cold air supplied to the lower chamber.

[0026] Effects of the Invention

[0027] As described above, the heating and cooling device for a load lock chamber according to the present invention is formed by one system, is easy to design and manufacture, does not consume power during operation, and can fundamentally solve the problem of PCW leakage.

[0028] The effects of the present invention are not limited to the effects mentioned above, and those of ordinary skill in the technical field to which the present invention pertains can clearly understand other effects not mentioned from the following description. Description of the Drawings

[0029] Figure 1 The front view of the load lock chamber to which the heating and cooling device according to an embodiment of the present invention is applied.

[0030] Figure 2 For application according to Figure 1 The top view of the load lock chamber to which the heating and cooling device according to the embodiment of the present invention shown is applied.

[0031] Figure 3 For application according to Figure 1 The bottom view of the load lock chamber to which the heating and cooling device according to the embodiment of the present invention shown is applied.

[0032] Figure 4 For the sectional view taken along line Ⅳ-Ⅳ of Figure 1

[0033] (Description of Reference Numerals)

[0034] 10: Chamber body 11: Upper chamber

[0035] 12: Lower chamber 20: Door module

[0036] 21: Upper opening 22: Lower opening

[0037] 30: Door driving unit 100: Compressed gas supply source

[0038] ​200: Vortex tube 300: Hot air flow path

[0039] 310: Lower flow path 320: Connecting flow path

[0040] 330: Upper branch flow path 340: Diffuser

[0041] 400: Cold air flow path 410: Central flow path

[0042] 420: Lower branch flow path 430: Diffuser

[0043] F1, F2: Filters R1, R2: Regulators

[0044] V1, V3, V5: On-off valves V2, V4: Bypass valves Detailed implementation mode

[0045] In the present invention, the attached drawings may be represented in an exaggerated manner for the purpose of differentiating from the prior art, clarity, and technical understanding. Moreover, the terms described hereinafter are terms defined in consideration of the functions in the present invention, and may vary according to the intentions or conventions of users and operators. Therefore, these terms should be defined based on the technical content throughout this specification. On the other hand, the embodiments only belong to the exemplary matters of the structural elements proposed within the scope of the rights of the present invention, and do not limit the scope of the rights of the present invention. The scope of rights should be interpreted based on the technical concept throughout the specification of the present invention.

[0046] Throughout the specification, when a structure "includes" another structure, unless there is a particularly contrary description, it means that other structures may also be included, without excluding the remaining other structures.

[0047] Moreover, when a structure is "connected to", "linked to", or "combined with" another structure, this means that there are cases of "directly connected to", "directly linked to", or "directly combined with", and there may also be cases of "connected in a state where other structures are interposed therebetween", "linked in a state where other structures are interposed therebetween", or "combined in a state where other structures are interposed therebetween". On the contrary, when a structure is "directly connected to", "directly linked to", or "directly combined with" another structure, it should be understood that there are no other structures in between.

[0048] Moreover, when directional terms such as "front", "rear", "upper", "lower", "left", "right", "one end", "the other end", "both ends", etc. are used, they are used exemplarily in relation to the directions of the disclosed drawings, and thus cannot be restrictively interpreted. When terms such as "first", "second", etc. are used, they are terms used to distinguish each structure and cannot be restrictively interpreted.

[0049] To more clearly illustrate the features of the embodiments of the present invention, detailed descriptions of matters well-known to those of ordinary skill in the technical field to which the following embodiments pertain are omitted. Also, detailed descriptions of portions in the drawings that are not relevant to the description of the embodiments are omitted.

[0050] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0051] Figure 1 The front view of the load lock chamber applicable to the heating and cooling device according to an embodiment of the present invention Figure 2 For application according to Figure 1 The top view of the load lock chamber applicable to the heating and cooling device according to the embodiment of the present invention shown Figure 3 For application according to Figure 1 The bottom view of the load lock chamber applicable to the heating and cooling device according to the embodiment of the present invention shown Figure 4 For along Figure 1 The cross-sectional view taken along line Ⅳ-Ⅳ of

[0052] Referring to Figures 1 to 4 , the heating and cooling device of the load lock chamber according to an embodiment of the present invention includes the upper chamber 11 and the lower chamber 12 of the above-mentioned load lock chamber, a vortex tube 200, a hot air flow path 300, and a cold air flow path 400.

[0053] The above-mentioned upper chamber 11 and the above-mentioned lower chamber 12 may be formed in the chamber body 10 of the above-mentioned load lock chamber.

[0054] The above-mentioned load lock chamber is a device that is provided between an equipment front end module (EFEM) and a transfer chamber in semiconductor processing equipment and can carry wafers in and out without vacuum loss in the transfer chamber and the process chamber.

[0055] The above-mentioned load lock chamber may be a double chamber in which a pair of the above-mentioned upper chamber 11 and the above-mentioned lower chamber 12 are respectively formed on both inner sides of the above-mentioned chamber body 10.

[0056] The above-mentioned upper chamber 11 is formed in the upper inner side of the above-mentioned chamber body 10 of the above-mentioned load lock chamber, and is a structure in which the wafer W waits before the process. That is, the above-mentioned upper chamber 11 is a chamber for loading the wafer W, and is a space where the wafer W waits to be loaded into the above-mentioned transfer chamber before the process and is input from the above-mentioned EFEM.

[0057] The lower chamber 12 is formed at the lower inner portion of the chamber body 10 of the load lock chamber, and is a structure in which the wafer W waits after the process. That is, the lower chamber 12 is a chamber for unloading the wafer W, and is a space in which the wafer W waits to be unloaded to the EFEM after the process of unloading from the transfer chamber.

[0058] A supporting device for supporting the wafer W may be provided inside the upper chamber 11 and the lower chamber 12 .

[0059] Door modules 20 may be installed on the left and right sides of the front and rear surfaces of the chamber body 10. That is, the door modules 20 are respectively installed on the inlet and outlet sides of each pair of the upper chamber 11 and the lower chamber 12, and the chamber body 10 may be provided with a total of four door modules 20.

[0060] The door module 20 may include: openings corresponding to the chambers formed in the chamber body 10 in a one-to-one manner; and doors (not shown) for opening and closing the openings.

[0061] That is, one door module 20 may include an upper opening 21 of the upper chamber 11 and a lower opening 22 of the lower chamber 12 , and may be provided with doors (not shown) for opening and closing the openings 21 and 22 .

[0062] Furthermore, a door driving unit 30 for opening and closing the door may be provided on the upper and lower surfaces of the door module 20. A driving device such as a pneumatic cylinder and a motor is built into the door driving unit 30, and the door can be opened and closed by moving the door in the upward and downward directions.

[0063] The vortex tube 200 is disposed at the lower side of the chamber body 10, and is supplied with compressed air, and discharges hot air to the end of the long axis and discharges cold air to the end of the short axis. That is, the vortex tube 200 may be disposed between the hot air flow path 300 and the cold air flow path 400 disposed at the lower side of the chamber body 10. Although not shown in the figure, the hot air flow path 300 and the cold air flow path 400 may be fixedly disposed in a state of being suspended on the lower surface of the chamber body 10 by means of respective devices.

[0064] The vortex tube 200 is a device that, when compressed gas is supplied by a swirling chamber provided on one side of the tube, emits hot gas at one end (long axis end) of the tube and emits cold gas at the other end (short axis end). As the compressed gas, air (Air) or nitrogen (N2) can be used.

[0065] The above-described vortex tube 200 can be supplied with compressed gas by being connected to a compressed gas supply source 100 such as a compressed gas cylinder filled with compressed gas. The above-described compressed gas supply source 100 is a device independent of the semiconductor processing equipment including the above-described load lock chamber and is provided at a location a predetermined distance away from the above-described load lock chamber.

[0066] An on-off valve V1 for opening and closing the flow path may be provided on the flow path connecting the above-described compressed gas supply source 100 and the above-described vortex tube 200.

[0067] The compressed gas injected into the above-described rotating chamber rotates at high speed (above 1 million RPM) along the long axis portion of the tube, flows while generating a vortex, and heat is generated at this time, and hot gas can be generated. A part of the above-described hot gas is discharged toward the long axis end of the tube, and the remaining part moves through the inner side portion of the above-described vortex toward the other end (short axis end) of the tube, and the heat is carried away by the outer vortex and becomes cold gas. This cold gas can be discharged toward the short axis end of the tube.

[0068] The above-described vortex tube 200 operating in the above-described manner has been widely commercialized, so the description of its detailed structure is omitted.

[0069] The above-described hot gas flow path 300 is connected between the long axis end of the above-described vortex tube 200 and the above-described upper chamber 11, and supplies hot gas to the above-described upper chamber 11. That is, the above-described hot gas flow path 300 is a flow path for supplying the hot gas discharged from the long axis end of the above-described vortex tube 200 to the inside of the above-described upper chamber 11 where the above-described wafer W waits before the process.

[0070] The above-described hot gas flow path 300 may be connected between the long axis end of the above-described vortex tube 200 and a diffuser 340 provided at the center of the upper surface of the above-described upper chamber 11.

[0071] The above-described hot gas flow path 300 may include a lower flow path 310, a connecting flow path 320, and an upper branch flow path 330.

[0072] The above-described lower flow path 310 is provided at the lower part of the above-described chamber body 10 and is connected to the long axis end of the above-described vortex tube 200. That is, the above-described lower flow path 310 is the part from the long axis end of the above-described vortex tube 200 to the lower side inlet of the above-described connecting flow path 320.

[0073] The above-described lower flow path 310 may be provided with a regulator R1. The above-described regulator R1 appropriately controls the flow rate of the hot gas supplied to the above-described upper chamber 11 through the above-described hot gas flow path 300, and functions to prevent the above-described wafer W waiting in the above-described upper chamber 11 from being damaged by physical force when an excessive flow rate is supplied.

[0074] A bypass valve V2 may be provided on one end side of the lower flow path 310. The bypass valve V2 prevents the hot air flow discharged from the vortex tube 200 from flowing toward the connection flow path 320 side, and instead makes it flow to other places or be discharged to the atmosphere.

[0075] The connection flow path 320 is formed to penetrate the chamber body 10 in the vertical direction and is a flow path whose lower inlet is connected to the lower flow path 310. A pair of the upper chambers 11 and the lower chambers 12 are respectively formed on the left side and the right side inside the chamber body 10. Therefore, the connection flow path 320 can be formed by penetrating the side portion of the chamber body 10 where the upper chambers 11 and the lower chambers 12 are not formed. That is, the connection flow path 320 does not penetrate the upper chambers 11 and the lower chambers 12.

[0076] The lower flow path 310 may be connected to the lower inlet of the connection flow path 320, and the upper branch flow path 330 may be connected to the upper inlet.

[0077] The upper branch flow path 330 may be provided at the upper part of the chamber body 10, connected to the upper outlet of the connection flow path 320, branched to both sides, and respectively connected to the upper chambers 11 provided on the left and right sides of the chamber body 10. That is, the upper branch flow path 330 is a part connecting the upper outlet of the connection flow path 320 and the diffuser 340 provided at the center of the upper chambers 11 on both sides, and is connected to the diffuser 340 penetrating and provided at the center of the upper surface of the upper chamber 11. One upper chamber 11 is provided on each of the two sides of the chamber body 10. Therefore, the upper branch flow path 330 can be formed by a structure branched from the part connected to the outlet side of the connection flow path 320 to both sides. The two upper branch flow paths 330 branched to both sides can be respectively connected to the diffuser 340 of the left upper chamber 11 and the diffuser 340 of the right upper chamber 11.

[0078] The diffuser 340 is provided by penetrating the center of the upper surface of the upper chamber 11, exposed to the internal space of the upper chamber 11, and a plurality of diffusion holes are formed on the exposed surface, enabling the hot air supplied through the upper branch flow path 330 to smoothly diffuse into the entire internal space of the upper chamber 11.

[0079] The upper branch flow path 330 may be provided with an on-off valve V3 for opening and closing the flow path.

[0080] In addition, the upper branch flow path 330 may be provided with a filter F1. The filter F1 filters the particles included in the hot air, prevents the particles from flowing into the interior of the upper chamber 11, and adhering to the wafer W.

[0081] The above-mentioned cold air flow path 400 is connected between the short-axis end of the above-mentioned vortex tube 200 and the above-mentioned lower chamber 12, and supplies cold air to the above-mentioned lower chamber 12. That is, the above-mentioned cold air flow path 400 is a flow path for supplying the cold air discharged from the short-axis end of the above-mentioned vortex tube 200 to the inside of the above-mentioned lower chamber 12 where the wafer W waits after the process.

[0082] The above-mentioned cold air flow path 400 can be connected between the short-axis end of the above-mentioned vortex tube 200 and a diffuser 430 provided at the center of the lower surface of the above-mentioned lower chamber 12.

[0083] The above-mentioned cold air flow path 400 includes a central flow path 410 and a lower branch flow path 420. The above-mentioned cold air flow path 400 is provided on the lower side of the above-mentioned chamber body 10, and may include the above-mentioned central flow path 410 corresponding to the above-mentioned lower flow path 310 of the above-mentioned hot air flow path 300 and the above-mentioned lower branch flow path 420 corresponding to the above-mentioned upper branch flow path 330. That is, the above-mentioned cold air flow path 400 does not include a flow path that penetrates the above-mentioned chamber body 10 corresponding to the above-mentioned connection flow path 320.

[0084] The above-mentioned central flow path 410 is provided on the lower side of the above-mentioned chamber body 10 and is connected to the short-axis end of the above-mentioned vortex tube 200. That is, the above-mentioned central flow path 410 is the part up to the connection part of the short-axis end of the above-mentioned vortex tube 200 and the above-mentioned lower branch flow path 420, and can transfer the cold air discharged from the above-mentioned vortex tube 200 to the above-mentioned lower branch flow path 420.

[0085] The above-mentioned central flow path 410 may be provided with a regulator R2. The regulator R2 appropriately controls the flow rate of the cold air supplied to the above-mentioned lower chamber 12 through the above-mentioned cold air flow path 400, and functions to prevent the above-mentioned wafer W waiting in the above-mentioned lower chamber 12 from being damaged by physical force when too much flow rate is supplied.

[0086] A bypass valve V4 may be provided on one end side of the above-mentioned central flow path 410. The bypass valve V4 prevents the cold air discharged from the above-mentioned vortex tube 200 from flowing to the side of the above-mentioned lower branch flow path 420, but makes it flow to other places or be discharged to the atmosphere.

[0087] The lower partial branch flow paths 420 branch from the central flow path 410 to both sides and are respectively connected to the lower chambers 12 provided on the left and right sides of the chamber body 10. That is, the lower partial branch flow paths 420 are two flow paths formed by branching from the ends of the central flow path 410 toward the lower chambers 12 on both sides, and the lower partial branch flow paths 420 on both sides can be respectively connected to diffusers 430 penetrating and provided at the center of the lower surface of the lower chamber 12. The diffuser 430 has the same structure as the diffuser 340 provided in the upper chamber 11 and can uniformly diffuse and supply the cold air supplied through the lower partial branch flow paths 420 to the entire interior of the lower chamber 12.

[0088] Of course, valves V5 for opening and closing the flow path and filters F2 for filtering particles included in the cold air to prevent the particles from flowing into the interior of the lower chamber 12 may also be provided in the lower partial branch flow paths 420 on both sides of the cold air flow path 400.

[0089] Next, the operation and effects of the heating and cooling device of the load lock chamber according to an embodiment of the present invention will be described.

[0090] Before the process, the wafer W can be loaded from the EFEM into the upper chamber 11 and wait to be transferred to the transfer chamber. After the process, the wafer W can be unloaded from the transfer chamber into the lower chamber 12 and wait to be transferred to the EFEM.

[0091] When the compressed gas supplied from the compressed gas supply source 100 flows into the vortex tube 200, hot air can be discharged from the long axis end of the vortex tube 200, and cold air can be discharged from the short axis end.

[0092] The hot air can be injected into the interior of the upper chamber 11 through the diffuser 340 via the hot air flow path 300, that is, the lower flow path 310, the connection flow path 320, and the upper partial branch flow paths 330.

[0093] Therefore, preheating the wafer W before the process waiting in the upper chamber 11 with hot air can reduce the time required to raise the temperature of the wafer W to the process implementation temperature in the subsequent process chamber, and thus reduce the overall cycle time.

[0094] Moreover, the cold air can be injected into the interior of the lower chamber 12 through the diffuser 430 via the cold air flow path 400, that is, the central flow path 410 and the lower partial branch flow paths 420.

[0095] Therefore, cooling the wafer W after the process waiting in the lower chamber 12 with cold air can reduce the thermal shock caused by the sharp temperature difference with the outside when the wafer W is unloaded to the outside of the processing equipment later.

[0096] As described above, the heating and cooling device of the load lock chamber according to an embodiment of the present invention utilizes the vortex tube 200 that discharges hot air and cold air from both ends respectively, and does not require a separate heating device and cooling device.

[0097] Therefore, compared with the conventional method of separately configuring a heater that uses electric heating and a PCW device that circulates PCW as individual systems, it is only necessary to configure a single gas flow path system centered on the above-mentioned vortex tube 200. Thus, the structure of the heating and cooling device can be made very simple.

[0098] Therefore, the time and cost required for the design and manufacture of the heating and cooling device of the above-mentioned load lock chamber can be greatly reduced.

[0099] Moreover, the heating and cooling device of the load lock chamber according to an embodiment of the present invention is operated by supplying compressed gas from the above-mentioned compressed gas supply source 100 that stores compressed gas. The compressed gas is supplied by tank pressure. Therefore, when supplying compressed gas to the above-mentioned vortex tube 200 and allowing it to pass through the flow path, no separate energy is consumed (wherein, the energy consumption when storing compressed gas in the tank is not considered). That is, the heating and cooling device of the load lock chamber according to an embodiment of the present invention does not consume electric power as operating energy, and no power loss occurs for this either.

[0100] Moreover, the heating and cooling device of the load lock chamber according to an embodiment of the present invention does not use PCW, so there are no problems of PCW leakage and loss.

[0101] As described above, the heating and cooling device of the load lock chamber according to the present invention is formed by a single system, is easy to design and manufacture, does not consume electric power during operation, and can fundamentally solve the problem of PCW leakage.

[0102] As described above, the present invention is described with reference to the embodiments shown in the drawings. However, it should be understood that this is only exemplary, and various modifications and equivalent other embodiments can be made based on the common knowledge in the technical field to which this technology belongs. Therefore, the true technical protection scope of the present invention is based on the appended claims and should be determined based on the specific content of the above-mentioned invention.

[0103] Industrial Applicability

[0104] The present invention relates to a heating and cooling device for a load lock chamber, and can be used in industrial fields where there are heating and cooling objects using hot air and cold air.

Claims

1. A heating and cooling device for a load lock chamber, characterized in that: include: An upper chamber formed at an inner upper portion of a chamber body of the load lock chamber, in which a wafer waits before a process; A lower chamber is formed at the inner lower part of the chamber body, and the wafer waits therein after the process; A vortex tube is arranged at the lower side of the chamber body, supplied with compressed air, and discharges hot air to the end of the long axis and cold air to the end of the short axis; A hot air flow path is connected between the long axis end of the vortex tube and the upper chamber to supply hot air to the upper chamber; as well as The cold air flow path is connected between the short axis end of the vortex tube and the lower chamber to supply cold air to the lower chamber.

2. The heating and cooling device for a load lock chamber according to claim 1, wherein: The vortex tube is connected to a compressed gas supply source provided at a location away from the load lock chamber, and is supplied with compressed gas.

3. The heating and cooling device for a load lock chamber according to claim 1, wherein: The above-mentioned hot air flow path includes: A lower flow path, disposed at the lower side of the chamber body and connected to the long axis end of the vortex tube; A connecting flow path is formed to vertically penetrate the chamber body, and a lower inlet is connected to the lower flow path; and The upper branch flow path is arranged on the upper side of the chamber body, connected to the upper outlet of the connecting flow path, and branches to both sides, respectively connected to the upper chambers arranged on the left and right sides of the chamber body.

4. The heating and cooling device for a load lock chamber according to claim 1, wherein: The above-mentioned cold air flow path includes: A central flow path, disposed at the lower side of the chamber body and connected to the short axis end of the vortex tube; and The lower branch flow path branches from the central flow path to both sides and is respectively connected to the lower chambers disposed on the left and right sides of the chamber body.

5. The heating and cooling device for a load lock chamber according to claim 3, wherein: The upper branch flow path is connected to a diffuser that is provided through the center of the upper surface of the upper chamber.

6. The heating and cooling device for a load lock chamber according to claim 4, wherein: The lower branch flow path is connected to a diffuser that is provided through the center of the lower surface of the lower chamber.

7. The heating and cooling device for a load lock chamber according to claim 3, wherein: The lower flow passage is provided with a regulator for regulating the flow rate of hot air supplied to the upper chamber.

8. The heating and cooling device for a load lock chamber according to claim 4, wherein: The central flow passage is provided with a regulator for regulating the flow rate of cold air supplied to the lower chamber.

9. The heating and cooling device for a load lock chamber according to claim 3, wherein: The upper branch flow path is provided with a filter for filtering particles of the hot air supplied to the upper chamber.

10. The heating and cooling device for a load lock chamber according to claim 4, wherein: The lower branch flow path is provided with a filter for filtering particles of the cold air supplied to the lower chamber.

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