Eutectic machine and eutectic process method

Abstract

The present invention relates to the field of chip eutectic technology, and in particular to a eutectic machine and a eutectic process method. A eutectic machine of the present invention includes an operating table, a first loading component, a second loading component, a eutectic table, a head binding component and a transfer component; the operating table surface includes a central area and a first loading area and a second loading area; the first loading area is provided with a first loading component, the second loading area is provided with a second loading component, the central area is provided with a eutectic table and a head binding component, and the head binding component is movably connected to the operating table; a transfer component is provided on the side of the eutectic table close to the second loading component, and one end of the transfer component is provided close to the second loading component, and the other end is provided close to the eutectic table; the chip carried on the second loading component passes through the transfer component, and is transported from the side of the transfer component close to the second loading area to the side of the transfer component close to the central area, and the head binding component absorbs the chip and mounts it on the substrate of the eutectic table. Solve the problem of low eutectic efficiency of traditional eutectic machines.

Description

Technical Field

[0001] The present invention relates to the field of chip eutectic technology, and in particular to a eutectic machine and a eutectic process method. Background Art

[0002] With the advent of the intelligent era, the demand for chips in electronic devices is steadily increasing. Eutectic bonding technology combines chips and substrates. Eutectic bonding refers to the ability of two materials, melted at high temperatures, to mix and form a new alloy, thus achieving a connection. The traditional eutectic bonding process involves first using a robotic arm to transport the substrate to a eutectic table. The robotic arm then picks up the chip, and after a series of positioning and adjustments, the chip is aligned with the substrate for bonding. However, using traditional eutectic machines for eutectic bonding takes a long time, resulting in low eutectic efficiency. Summary of the Invention

[0003] In order to solve the problem of low eutectic efficiency of traditional eutectic machines, the present invention provides a eutectic machine and a eutectic process method. In order to solve the above technical problems, the present invention provides the following technical solutions: a eutectic machine for mounting chips on a substrate, the eutectic machine includes an operating table, a first loading assembly, a second loading assembly, a eutectic table, a head binding assembly, a positioning assembly and a transfer assembly; the eutectic table includes a servo motor, a rotating platform, a first eutectic part and a second eutectic part, the servo motor is arranged on the rotating platform, and drives the rotating platform to rotate and connect with the operating table, the first eutectic part and the second eutectic part are respectively arranged on opposite sides of the rotating platform; the surface of the operating table includes a central area and a first loading area and a second loading area arranged on one side or on opposite sides of the central area; the operating table is provided with a first loading assembly and a second loading assembly; the first loading assembly includes a first sliding table and a first robotic arm, the second loading assembly includes a second sliding table and a second robotic arm; the transfer assembly includes a transfer table and a transfer slide, and the transfer slide is fixedly connected to the operating table;

[0004] The first loading area is provided with a first sliding table and a first robotic arm, and the first sliding table is used to carry the substrate; the second loading area is provided with a second sliding table and a second robotic arm, and the second sliding table is used to carry the chip; the positioning assembly is arranged close to and between the eutectic table and the transfer assembly;

[0005] The eutectic table and the head binding assembly are provided in the central area, and the head binding assembly is movably connected to the operating table; the first robotic arm is used to transport the substrate to the eutectic table; the transfer slide is provided on the side of the eutectic table close to the second robotic arm, and one end of the transfer slide is provided close to the second robotic arm, and the other end is provided close to the eutectic table; the chip carried by the second robotic arm passes through the transfer table and is transported from the side of the transfer slide close to the second loading area to the side of the transfer slide close to the central area, and the head binding assembly absorbs the chip transported to the central area The positioning component positions the chip sucked by the head binding component and controls the head binding component to adjust the position of the chip so as to mount the chip on the substrate of the eutectic table; the first robotic arm, the second robotic arm and the head binding component are independently controlled; when the first robotic arm transports the substrate to the first eutectic part, the head binding component simultaneously mounts the chip on the substrate of the second eutectic part; or, when the first robotic arm transports the substrate to the second eutectic part, the head binding component simultaneously mounts the chip on the substrate of the first eutectic part.

[0006] Preferably, the operating accuracy of the head binding assembly on the chip is greater than the operating accuracy of the second robotic arm on the chip.

[0007] Preferably, the direction in which the first eutectic portion approaches the second eutectic portion is a first direction, the length direction of the transfer assembly is parallel to the first direction, and the length directions of the first sliding table and the second sliding table are perpendicular to the first direction.

[0008] Preferably, the first sliding table includes a first material table assembly and a first blue film assembly, the first material table assembly and the first blue film assembly are both arranged in the first loading area, and there is a gap between the first material table assembly and the first blue film assembly, and the substrate is placed on a side of the first material table assembly and / or the first blue film assembly away from the operating table;

[0009] The second sliding table includes a second material table assembly and a second blue film assembly. The second material table assembly and the second blue film assembly are both arranged in the second loading area, and there is a gap between the second material table assembly and the second blue film assembly. The chip is placed on the side of the second material table assembly and / or the second blue film assembly away from the operating table.

[0010] Preferably, the head binding assembly includes a head binding rail fixed on the operating table and a head binding system movably connected to the head binding rail. The head binding system includes a head binding frame, a head binding motor and a head binding body. The head binding frame is movably connected to the head binding rail. The head binding body is arranged on the side of the head binding frame close to the operating table, and the head binding motor is arranged on the side away from the operating table.

[0011] Preferably, the binding head body includes a first binding head assembly, which includes a first binding head, a first nozzle mounting frame, a mounting seat, a buffer member and a limit member. The first binding head is arranged on a side of the binding head frame away from the binding head guide rail, and the first binding head is provided with the limit member and the mounting seat movably connected to the first binding head on a side close to the operating table, and there is a gap between the mounting seat and the limit member.

[0012] The end of the mounting base away from the first binding head is rotatably connected to the first nozzle mounting bracket, the limiting member is provided with a clearance channel, the buffer member is sleeved on the mounting base, and the end of the buffer member away from the mounting base is at least partially accommodated in the clearance channel;

[0013] And / or, the head binding body includes at least one second head binding assembly, the second head binding assembly includes a second head binding and a second suction nozzle mounting bracket, the second head binding is arranged on the side of the head binding bracket away from the head binding guide rail, and the second suction nozzle mounting bracket rotatably connected to the second head is arranged on the side of the second head binding close to the operating table.

[0014] Preferably, the transfer component is provided with a vacuum suction hole corresponding to the chip on the side away from the operating table; the positioning component includes a first positioning module and a second positioning module, the first positioning module is arranged between the second sliding table and the transfer component, and the second positioning module is arranged between the eutectic table and the transfer component, and the first positioning module and the second positioning module are cameras.

[0015] In order to solve the above technical problems, the present invention provides another technical solution as follows: a eutectic process method, using the above-mentioned eutectic machine, characterized in that the specific steps of the eutectic process method include:

[0016] Provide substrates and chips;

[0017] transporting the substrate to the eutectic table by a first robotic arm;

[0018] After the second robotic arm performs the first adjustment operation on the chip, the chip is transported to the transfer assembly;

[0019] The chips are transported from one end of the transfer assembly close to the second loading area to the other end close to the binding head assembly;

[0020] The chips transported on the transfer component are sucked by the binding head component;

[0021] After the sucked chip is subjected to a second adjustment operation, the chip is mounted on the substrate of the eutectic stage.

[0022] Preferably, the eutectic table includes a first eutectic part and a second eutectic part; the first robot arm, the second robot arm and the head binding assembly are independently controlled. When the first robot arm transports the substrate to the first eutectic part, the head binding assembly can simultaneously mount the chip to the substrate of the second eutectic part; or, when the first robot arm transports the substrate to the second eutectic part, the head binding assembly can simultaneously mount the chip to the substrate of the first eutectic part.

[0023] Compared with the prior art, the eutectic machine and eutectic process method provided by the present invention have the following beneficial effects:

[0024] 1. An embodiment of the present invention provides a eutectic machine, which includes an operating table, a first loading assembly, a second loading assembly, a eutectic table, a head binding assembly and a transfer assembly; the operating table surface includes a central area and a first loading area and a second loading area arranged on one side or opposite sides of the central area; a first loading assembly for carrying a substrate is provided in the first loading area, and a second loading assembly for carrying a chip is provided in the second loading area, and a eutectic table and a head binding assembly are provided in the central area, which is movably connected to the operating table; the first loading assembly is used to transport the substrate to the eutectic table; a transfer assembly is provided on the side of the eutectic table close to the second loading assembly, and one end of the transfer assembly is provided close to the second loading assembly, and the other end is provided close to the eutectic table; the chip carried on the second loading assembly passes through the transfer assembly and is transported from the side of the transfer assembly close to the second loading area to the side of the transfer assembly close to the central area, and the head binding assembly absorbs the chip transported to the central area and mounts the chip on the substrate of the eutectic table. The first feeding assembly, the second feeding assembly and the head binding assembly are independently arranged in three partitions, and do not interfere with each other during the eutectic process, which greatly improves the efficiency of eutectic.

[0025] 2. The eutectic machine of the present invention further includes a positioning assembly, wherein the first loading assembly, the second loading assembly, and the head binding assembly are independently controlled; the first loading assembly includes a first sliding table and a first robotic arm, and the second loading assembly includes a second sliding table and a second robotic arm; the transfer assembly includes a transfer table and a transfer slide rail, and the transfer slide rail is fixedly connected to the operating table;

[0026] The first loading area is provided with a first sliding table and a first robotic arm, and the first sliding table is used to carry the substrate; the second loading area is provided with a second sliding table and a second robotic arm, and the second sliding table is used to carry the chip; the positioning assembly is arranged close to the eutectic table and the transfer assembly;

[0027] The first robotic arm is used to transport the substrate to the eutectic table, and the second robotic arm is used to transport the chip to the transfer table. The transfer table is slidably connected to the transfer slide, and the chip is transported from the side of the transfer slide closest to the second slide table to the side of the transfer slide closest to the eutectic table. The head assembly is used to absorb the chip transported by the transfer table to the side closest to the eutectic table. The positioning assembly positions the chip absorbed by the head assembly and controls the head assembly to adjust the position of the chip to attach the chip to the substrate of the eutectic table. The head assembly's chip operation accuracy is greater than that of the second robotic arm. The first loading assembly, second loading assembly, and head assembly can all be independently controlled, so the three components can operate simultaneously without interfering with each other, thereby improving the chip's eutectic efficiency.

[0028] 3. The system includes a servo motor, a rotating platform, a first eutectic section, and a second eutectic section. The servo motor is mounted on the rotating platform and drives the platform to rotate and connect to the operating table. The first and second eutectic sections are located on opposite sides of the rotating platform. One eutectic section performs substrate placement, while the other performs chip placement. The two processes operate independently, allowing substrate placement and chip placement to coexist, improving eutectic efficiency.

[0029] 4. The first sliding table of the present invention includes a first material table assembly and a first blue film assembly, both of which are arranged in the first loading area, and there is a gap between the first material table assembly and the first blue film assembly, and a substrate is placed on the side of the first material table assembly and / or the first blue film assembly away from the operating table. Different types of substrates can be adapted. The adaptability of the substrate is improved. The second sliding table includes a second material table assembly and a second blue film assembly, both of which are arranged in the second loading area, and there is a gap between the second material table assembly and the second blue film assembly, and a chip is placed on the side of the second material table assembly and / or the second blue film assembly away from the operating table. Different types of chips can be adapted. The adaptability of the substrate is improved.

[0030] 5. The present invention's head assembly includes a head rail fixed to an operating table and a head system movably connected to the head rail. The head system comprises a head frame, a head motor, and a head body. The head frame is movably connected to the head rail. The head body is located on the side of the head frame closest to the operating table, and the head motor is located on the side away from the operating table. Unlike conventional manipulators, the head body requires ultra-high operational precision, capable of fine-tuning the chip angle and ensuring that the chip is not damaged during the placement process.

[0031] 6. The binding head body of the present invention includes a first binding head assembly, which includes a first binding head, a first nozzle mounting bracket, a mounting seat, a buffer member, and a limit member. The first binding head is arranged on a side of the binding head bracket away from the binding head guide rail. The first binding head is provided with a limit member and a mounting seat movably connected to the first binding head on a side of the first binding head close to the operating table. There is a gap between the mounting seat and the limit member.

[0032] The end of the mounting base remote from the first binding head is rotatably connected to the first nozzle mounting bracket. The limiting member defines a clearance channel. The buffer member is mounted on the mounting base, with the end of the buffer member remote from the mounting base at least partially accommodated within the clearance channel. The end of the buffer member remote from the mounting base rubs against the inner wall of the clearance channel, and the frictional force partially offsets the reaction force, thereby preventing damage to the chip or substrate.

[0033] 7. The present invention's binding head body includes at least one second binding head assembly, which includes a second binding head and a second nozzle mounting bracket. The second binding head is positioned on the side of the binding head bracket away from the binding head guide rail, and the second nozzle mounting bracket, rotatably connected to the second binding head, is positioned on the side of the second binding head closer to the operating table. This reduces the repeated chip pickup, positioning, and placement operations, significantly improving die bonding efficiency.

[0034] 8. The positioning assembly of the present invention includes a first positioning module and a second positioning module. The first and second positioning modules are cameras. The first positioning module is positioned between the second sliding stage and the transfer assembly, while the second positioning module is positioned between the eutectic stage and the transfer assembly. These two adjustments allow the chip to be precisely mounted at a predetermined position on the substrate.

[0035] 9. An embodiment of the present invention also provides a eutectic process method, which has the same beneficial effects as the above-mentioned eutectic machine and will not be described in detail here. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Figure 1 1 is a top view of the eutectic machine provided in the first embodiment of the present invention.

[0037] Figure 2a Schematic diagram of the distribution of the first loading area and the second loading area in the operating table of the eutectic machine provided in the first embodiment of the present invention Figure 1 .

[0038] Figure 2b Schematic diagram of the distribution of the first loading area and the second loading area in the operating table of the eutectic machine provided in the first embodiment of the present invention Figure 1 .

[0039] Figure 2c This is a motion path diagram of the eutectic machine chip and substrate provided by the first embodiment of the present invention.

[0040] Figure 3It is a top view of the first loading area of ​​the eutectic machine provided by the first embodiment of the present invention.

[0041] Figure 4 1 is a top view of the second loading area and the central area of ​​the eutectic machine provided by the first embodiment of the present invention.

[0042] Figure 5 It is a structural schematic diagram of the eutectic table of the eutectic machine provided in the first embodiment of the present invention.

[0043] Figure 6 It is a structural schematic diagram of the second material table assembly of the eutectic machine provided in the first embodiment of the present invention.

[0044] Figure 7 It is a structural schematic diagram of the head binding system of the eutectic machine provided in the first embodiment of the present invention.

[0045] Figure 8 yes Figure 7 A magnified view of some structures.

[0046] Figure 9 It is a structural schematic diagram of the second head binding assembly of the eutectic machine provided by the first embodiment of the present invention.

[0047] Figure 10 It is a partial structural diagram of the eutectic machine provided in the first embodiment of the present invention.

[0048] Figure 11 It is a front view of the eutectic machine provided by the first embodiment of the present invention.

[0049] Figure 12 It is a flow chart of the eutectic process method provided by the second embodiment of the present invention.

[0050] Description of the accompanying drawings:

[0051] 10. Eutectic machine;

[0052] 1. Operating table; 2. First loading assembly; 3. Eutectic table; 4. Head binding assembly; 5. Positioning assembly; 6. Transfer assembly; 7. Second loading assembly;

[0053] 11. Central area; 12. First loading area; 13. Second loading area; 21. First sliding platform; 22. First robotic arm; 23. Second sliding platform; 24. Second robotic arm; 31. Servo motor; 32. Rotating platform; 33. First eutectic section; 34. Second eutectic section; 40. Header system; 41. Header guide rail; 42. Header rack; 43. Header motor; 44. Header body; 45. First header assembly; 46. Second header assembly; 51. First positioning module; 52. Second positioning module; 61. Transfer platform; 62. Transfer rail;

[0054] 211, first material platform assembly; 212, first blue film assembly; 231, second material platform assembly; 232, second blue film assembly; 451, first binding head; 452, first nozzle mounting bracket; 453, mounting base; 454, buffer; 455, limiter; 461, second binding head; 462, second nozzle mounting bracket;

[0055] 4551. Give way. DETAILED DESCRIPTION

[0056] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention will be further described in detail below with reference to the accompanying drawings and implementation examples. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0057] In the embodiments provided herein, it should be understood that "B corresponding to A" means that B is associated with A and B can be determined based on A. However, it should also be understood that determining B based on A does not mean determining B based solely on A; B can also be determined based on A and / or other information.

[0058] It should be understood that references to "one embodiment" or "an embodiment" throughout this specification mean that specific features, structures, or characteristics associated with the embodiment are included in at least one embodiment of the present invention. Therefore, the appearance of "in one embodiment" or "in an embodiment" throughout this specification does not necessarily refer to the same embodiment. Furthermore, these specific features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. Those skilled in the art should also be aware that the embodiments described in this specification are all optional embodiments, and the actions and modules involved are not necessarily required for the present invention.

[0059] In various embodiments of the present invention, it should be understood that the size of the serial numbers of the above-mentioned processes does not necessarily mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present invention.

[0060] The flow charts and block diagrams in the accompanying drawings of the present invention illustrate the possible implementation architecture, functions and operations of the system, method and computer program product according to various embodiments of the present application. In this regard, each box in the flow chart or block diagram can represent a module, program segment or a part of code, and the module, program segment or a part of code contains one or more executable instructions for realizing the specified logical function. It should also be noted that in some alternative implementation schemes, the functions marked in the box can also occur in a different order than those marked in the accompanying drawings. For example, two boxes represented in succession can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, which is determined based on the functions involved. It should be noted that each box in the block diagram and / or flow chart, and the combination of the boxes in the block diagram and / or flow chart can be implemented by a dedicated hardware-based system that performs the specified function or operation, or can be implemented by a combination of dedicated hardware and computer instructions.

[0061] With the advent of the intelligent era, the demand for chips in electronic devices is increasing. Eutectic bonding technology is a technique for bonding chips to substrates. "Eutectic" refers to the ability of two materials, melted at high temperatures, to mix and form a new alloy, thus achieving a connection.

[0062] Usually the eutectic process is completed on the eutectic table. The traditional eutectic process is to first use a robotic arm to transport the substrate to the eutectic table, and then use the robotic arm to suck the chip. After a series of positioning and adjustment, the chip is aligned with the substrate for mounting. First of all, in the traditional eutectic process, there is usually only one loading area and one robotic arm. The substrate and chip are both in the loading area. The robotic arm needs to be used to separately suck the substrate and chip in the loading area. Specifically, the robotic arm sucks the substrate and places it on the eutectic table, then sucks the chip. After positioning and adjustment, the chip is adjusted to a suitable angle and the chip is mounted on the substrate. Therefore, it takes a long time to use a traditional eutectic machine for eutectic, resulting in low eutectic efficiency.

[0063] To solve the above technical problems, please combine Figure 1 、 Figure 3 and Figure 4 The first embodiment of the present invention provides a eutectic machine 10, which includes an operating table 1, a first loading assembly 2, a second loading assembly 7, a eutectic table 3, a head binding assembly 4, and a transfer assembly 6; the surface of the operating table 1 includes a central area 11 and a first loading area 12 and a second loading area 13 arranged on one side or opposite sides of the central area 11. It should be understood that the operating table 11 in this embodiment is divided into a central area 11 and two loading areas. As an embodiment, Figure 2b As shown in , the two loading areas are respectively arranged on opposite sides of the central area 11. As another embodiment, as Figure 2a As shown in FIG, the two loading areas are respectively arranged on the same side of the central area 11, and no further restrictions are imposed here.

[0064] A first loading assembly 2 for carrying a substrate is provided in the first loading area 12, a second loading assembly 7 for carrying a chip is provided in the second loading area 13, a eutectic table 3 and a head binding assembly 4 are provided in the central area 11, and the head binding assembly 4 is movably connected to the operating table 1; the first loading assembly 2 is used to transport the substrate to the eutectic table 3; a transfer assembly 6 is provided on the side of the eutectic table 3 close to the second loading assembly 7, and one end of the transfer assembly 6 is provided close to the second loading assembly 7, and the other end is provided close to the eutectic table 3; the chip carried on the second loading assembly 7 passes through the transfer assembly 6, and is transported from the side of the transfer assembly 6 close to the second loading area 13 to the side of the transfer assembly 6 close to the central area 11, and the head binding assembly 4 absorbs the chip transported to the central area 11, and mounts the chip on the substrate of the eutectic table 3.

[0065] It can be understood that in this embodiment, the first loading assembly 2 in the first loading area 12, the second loading assembly 7 in the second loading area 13 and the head binding assembly 4 in the central area 11 are all independently arranged on the operating table 1, and in this embodiment, a transfer assembly 6 that can move relative to the operating table 1 is specifically set. Specifically, when the substrate is transported to the eutectic table 3 through the first loading area 12 of the first loading assembly 2, the second loading assembly 7 can transport the chips in the second loading area 13 to the transfer assembly 6, and because the transfer assembly 6 can move relative to the operating table 1, the chips in the second loading area 13 can be transported to the central area 11, so that the head binding assembly 4 can absorb the chips transported to the central area 11, and then mount the absorbed chips on the substrate of the eutectic table 3 to complete the mounting. The first loading assembly 2, the second loading assembly 7 and the head binding assembly 4 are independently arranged in three partitions, and do not interfere with each other during the eutectic process, which greatly improves the efficiency of the eutectic. For example, when the first loading assembly 2 is moving the substrate, the second loading assembly 7 can simultaneously transport the chip to the transfer assembly 6. When the transfer assembly 6 transports the chip from the second loading area 13 to the central area 11, the first loading assembly 2 and the second loading assembly 7 can be reset. When the head binding assembly 4 absorbs the chip transported to the central area 11 for mounting, the transfer assembly 6 can be reset.

[0066] Furthermore, the eutectic machine 10 further includes a positioning assembly 5, a first loading assembly 2, a second loading assembly 7 and a head binding assembly 4 which are independently controlled from each other, the first loading assembly 2 including a first sliding table 21 and a first robotic arm 22, the second loading assembly 7 including a second sliding table 23 and a second robotic arm 24; the transfer assembly 6 including a transfer table 61 and a transfer slide 62, and the transfer slide 62 is fixedly connected to the operating table 1;

[0067] The first loading area 12 is provided with a first sliding table 21 and a first robotic arm 22, and the first sliding table 21 is used to carry the substrate; the second loading area 13 is provided with a second sliding table 23 and a second robotic arm 24, and the second sliding table 23 is used to carry the chip; the positioning assembly 5 is arranged close to the eutectic table 3 and the transfer assembly 6;

[0068] The first robotic arm 22 is used to transport the substrate to the eutectic table 3, and the second robotic arm 24 is used to transport the chip to the transfer table 61. The transfer table 61 is slidably connected to the transfer slide 62 to transport the chip from the side of the transfer slide 62 close to the second sliding table 23 to the side of the transfer slide 62 close to the eutectic table 3. The head binding assembly 4 is used to absorb the chip transported by the transfer table 61 to the side close to the eutectic table 3. The positioning assembly 5 positions the chip absorbed by the head binding assembly 4 and controls the head binding assembly 4 to adjust the position of the chip so as to mount the chip on the substrate of the eutectic table 3. That is, in this embodiment, the first loading assembly 2, the second loading assembly 7 and the head binding assembly 4 can all be independently controlled, so the three components can operate simultaneously without interfering with each other, so as to improve the eutectic efficiency of the chip.

[0069] Specifically, the two loading areas have different functions. The first slide table 21 is primarily used to place substrates, while the second slide table 23 is primarily used to place chips. Because multiple chips are typically mounted on a substrate, the operating speed of the first robotic arm 22 can be slower than that of the second robotic arm 24. Furthermore, during the eutectic process, the first robotic arm 22, the second robotic arm 24, and the movable mechanical components of the head-binding assembly 4 do not overlap in their operating ranges. This means there is no need to worry about interference or obstruction between the first robotic arm 22, the second robotic arm 24, and the mechanical components of the head-binding assembly 4 during the eutectic process.

[0070] It should be understood that the eutectic table 3, the core component of the eutectic, is placed in the central area 11. The eutectic table 3 will provide eutectic conditions, such as temperature. Eventually, the chip and the substrate will fuse and connect under the high temperature of the eutectic table 3. The purpose of setting the eutectic table 3 in the central area 11 is also to improve the eutectic efficiency. It should be understood that the above referred to in this embodiment is the direction of the eutectic table 3 away from the side of the operating table 1. No more details will be given below. The first robot arm 22 can move back and forth above the first sliding table 21 and the eutectic table 3, and the second robot arm 24 can move back and forth above the second sliding table 23 and the eutectic table 3. Since the central area 11 is in the central area of ​​the entire operating table, the distance from the central area 11 to the first loading area 12 and the second loading area 13 is very close, thereby shortening the length of the entire running path of the chip or substrate to the eutectic table 3, thereby greatly improving the efficiency of the entire eutectic process.

[0071] It should be noted that during eutectic formation, the chip is not randomly mounted on the substrate. The position of the chip on the substrate and the angle at which it is mounted need to be determined according to the actual needs of the user, that is, the chip is mounted on the substrate with certain precision requirements. In this embodiment, after the second robotic arm 24 absorbs the chip, it is not directly mounted on the substrate. The second robotic arm 24 has low chip operation accuracy, and its function is to quickly transport the chip on the second operating table 23 to the transfer component 6. It should be noted that when the second robotic arm 24 absorbs the chip on the second operating table 23, it can absorb one chip at a time or multiple chips at a time. The second robotic arm 24 is characterized by fast transportation speed and low operation accuracy, ensuring that the chip can be quickly transported to the transfer component 6. Specifically, the transfer component is provided with a plurality of vacuum suction holes for fixing the chip on the side away from the operating table. When the chip is transported from the second loading area 13 to the transfer component 6, the chip is placed on the vacuum suction hole by the second robotic arm 24. In this embodiment, the transfer assembly 6 can handle multiple chips at once, and the time it takes to transport a chip from the end of the transfer assembly 6 near the second loading area 13 to the end near the head assembly 4 is relatively short. Furthermore, the head assembly 4 can move back and forth above the transfer assembly 6 and the eutectic table 3 while transporting the chip. The head assembly 4 has high operational precision, allowing for fine adjustment of the chip angle. Since the end of the transfer assembly 6 near the head assembly 4 is closer to the eutectic table 3, the head assembly 4 does not need to travel very far to absorb the chip from the transfer assembly 6, thereby shortening the path the head assembly 4 takes to transport the chip.

[0072] For example, please refer to Figure 2cAs shown by the path of dotted line A, the first robot arm 22 is used to transport the substrate to the eutectic table 3. Since the substrate is not as small as the chip, and the contact area between the substrate and the eutectic table 3 is also large, it is relatively simple to align and place the substrate on the eutectic table 3. No additional positioning operation is required or only rough positioning is required. After the first robot arm 22 absorbs the substrate, it can move to the top of the eutectic table 3 and then place the substrate on the eutectic table 3 accordingly, which is simple and convenient. As shown by the path of dotted line B, the second robot arm 24 is used to transport the chip to the transfer assembly 6. Usually, multiple chips need to be eutectic on one substrate, so the operation efficiency of the second robot arm 24 is faster than that of the first robot arm 22. Specifically, the second robot arm 24 can make the operation speed faster than the first robot arm 22, or the second robot arm 24 can absorb multiple chips at a time, while the first robot arm 22 only needs to pick up one substrate at a time. It should be noted that the first robot arm 22 and the second robot arm 24 do not interfere with each other during the transportation process and can operate simultaneously, that is, when the first robot arm 22 is sucking the substrate, the second robot arm 24 may be sucking the chip or may be transporting the chip. After the second robot arm 24 places the chip on the transfer assembly 6, as shown by the path of the dotted line C, the chip is transported from the end of the transfer assembly 6 close to the second sliding table 23 to the end close to the head binding assembly 4. The function of the transfer assembly 6 is to quickly transport a large number of chips to a position close to the head binding assembly 4 at one time to improve the efficiency of the entire solid crystal. Further, as shown by the path of the dotted line D, the head binding assembly 4 can be used to suck the chip on the transfer assembly 6, and adjust the position of the chip after positioning by the positioning assembly 5, and mount the chip on the substrate of the eutectic table 3 to complete the chip mounting. After the chip is mounted on the substrate, eutectic is completed on the substrate. Finally, after the eutectic is completed, the substrate and the eutectic chip are transported from the operating table 1.

[0073] It should be noted that the chip manipulation accuracy of the head binding assembly 4 is greater than that of the second robotic arm 24. Generally, during the eutectic process, the higher the accuracy of the chip placement and angle, the better the final eutectic effect. Since the second robotic arm 24 only functions to pick up the chip, it can be equipped with a low-precision, high-speed manipulator. The head binding assembly 4, on the other hand, can be equipped with a high-precision, high-speed manipulator, saving costs while effectively utilizing the characteristics of each manipulator.

[0074] It should be understood that this embodiment rationally arranges two loading areas, allowing the first robotic arm 22 to absorb the substrate and the second robotic arm 24 to absorb the chip to be performed separately or simultaneously. In addition, the positional relationship between the second sliding table 23, the transfer assembly 6, the binding head assembly 4, and the eutectic table 3 is specifically planned based on the operating accuracy of the binding head assembly 4 and the second robotic arm 24. This allows the second robotic arm 24, which is farther away from the eutectic table 3, to quickly pick up the chip and place it on the transfer assembly 6 to perform a rough operation before chip placement. The transfer assembly 6 can also quickly transport the chip to the central area 11. The binding head assembly 4 can also perform a fine operation on the chip transported on the transfer assembly 6, thereby enabling the chip to be more efficiently and accurately placed on the substrate, improving the efficiency of the eutectic.

[0075] Furthermore, please combine Figure 5 The eutectic table 3 includes a servo motor 31, a rotating platform 32, a first eutectic portion 33 and a second eutectic portion 34. The servo motor 31 is arranged on the rotating platform 32 and drives the rotating platform 32 to rotate and connect with the operating table 1. The first eutectic portion 33 and the second eutectic portion 34 are respectively arranged on opposite sides of the rotating platform 32.

[0076] It is understood that in this embodiment, to more quickly improve eutectic efficiency, two eutectic sections can be provided on the eutectic stage 3. Specifically, the first eutectic section 33 and the second eutectic section 34 are located on opposite sides of the rotating platform 32. Driven by the servo motor 31, the first eutectic section 33 and the second eutectic section 34 can rotate 180°.

[0077] It is understood that initially, when the first robotic arm 22 transports the substrate to the first eutectic section 33, no operations are performed on the second eutectic section 34. However, once the substrate is placed on the first eutectic section 33, the servo motor 31 drives the rotating platform 32 and the operating table 1 to rotate 180°, swapping the positions of the second eutectic section 34 and the first eutectic section 33. The substrate on the first sliding table 21 can then be transported to the empty second eutectic section 34. It should be understood that the two eutectic sections mean that two substrates can be placed simultaneously on the eutectic table 3. At this point, when the first robotic arm 22 transports the substrate to the second eutectic section 34, the head assembly 4 can simultaneously attach a chip to the substrate in the first eutectic section 33. That is, on the eutectic table 3, one eutectic section completes substrate placement while the other eutectic table 3 completes chip attachment. The two operations do not interfere with each other, allowing substrate placement and chip attachment to coexist, thereby improving eutectic efficiency. Furthermore, after the substrate of the first eutectic part 33 completes the mounting work, the first eutectic part 33 and the second eutectic part 34 exchange positions again. At this time, the head binding assembly 4 will absorb the chip and mount it on the substrate on the second eutectic part 34, and the first robotic arm 22 can unload the substrate on which the chip has been mounted on the first eutectic part 33, and re-absorb the empty substrate and transport it to the first eutectic part 33. Repeating this step can greatly improve the mounting efficiency.

[0078] Specifically, the direction in which the first eutectic portion 33 approaches the second eutectic portion 34 is the first direction, the length direction of the transfer assembly 6 is parallel to the first direction, and the length directions of the first sliding table 21 and the second sliding table 23 are perpendicular to the first direction.

[0079] It should be understood that the loading areas for substrates and chips, namely the first loading area 12 and the second loading area 13, are perpendicular to the transport direction of the transfer assembly. This design maximizes the use of the operating space of the operating table while ensuring that the operating range of the machinery in the two loading areas does not overlap with the transport path of the transfer assembly, that is, it avoids spatial interference between the robotic arm and the transfer assembly, and also forms an efficient division of labor between the storage area of ​​the substrate and the chip and the central area of ​​the eutectic table. The substrate and the chip enter the eutectic area from both sides respectively, reducing cross-interference and improving the efficiency of parallel operation. Furthermore, the transport path of the transfer assembly 6 is consistent with the first direction. This layout makes one end of the transfer assembly 6 closer to the second sliding table 23 and the other end closer to the binding head assembly 4, and after the eutectic table 3 rotates, the transport path of the transfer assembly 6 is still aligned with the direction of the currently working eutectic part, and there is no need to adjust the layout of the transfer assembly due to changes in the position of the eutectic part.

[0080] For example, when the first eutectic portion 33 rotates to the original position of the second eutectic portion 34, the transport path of the transfer assembly 6 still directly points to the new working area, ensuring that the path for the head assembly 4 to pick up the chip from the transfer table 61 is the shortest and does not need to be replanned. It should be understood that the positional relationship between the transfer assembly 6 and the eutectic table 3 is fixed. After the head assembly 4 has mounted the chips of the first eutectic portion 33, there is no need to recalibrate the direction of the suction nozzle on the head assembly 6 after sucking a batch of chips. It can directly suck the chips on the transfer assembly 6 and directly enter the chip fine-tuning stage, and then mount the chips on the substrate. This parallel operation makes the chip mounting process almost seamless, further reducing non-productive time. It should be understood that this embodiment is set with respect to the positions of the first sliding table 21, the second sliding table 23 and the transfer assembly 6, avoiding spatial conflicts, making full use of the central area and the two side areas of the operating table 1, and improving the efficiency of chip mounting.

[0081] In another embodiment, when the first robot arm 22 transports the substrate to the first eutectic portion 33 , the head assembly 4 can simultaneously mount the chip onto the substrate of the second eutectic portion 34 . This method will not be described in detail.

[0082] It can be understood that by rotating the first eutectic portion 33 and the second eutectic portion 34 180° under the drive of the servo motor 31, the first eutectic portion 33 and the second eutectic portion 34 can be switched so that their positions are swapped, thereby improving the efficiency of the eutectic.

[0083] Specifically, see Figure 3 The first sliding table 21 includes a first material table assembly 211 and a first blue film assembly 212. The first material table assembly 211 and the first blue film assembly 212 are both arranged in the first loading area 12, and there is a gap between the first material table assembly 211 and the first blue film assembly 212. The first material table assembly 211 and / or the first blue film assembly 212 are away from the side of the operating table 1 for placing the substrate.

[0084] It should be understood that blue tape is a commonly used semiconductor packaging material, mainly used in the wafer cutting stage, and plays a role in bearing and positioning. It fixes the chip on the film through adhesive material to prevent the chip from scattering or being damaged during the cutting process‌12. The blue tape has moderate viscosity and is suitable for supporting and fixing most conventional-sized chips. The style of the substrate is usually determined according to the previous process flow of the eutectic, and in this embodiment, a first material table assembly 211 and / or a first blue film assembly 212 can be set in the first loading area 12, which can adapt to different types of substrates. The adaptability of the substrate is improved.‌

[0085] Furthermore, please combine Figure 4 and Figure 6The second sliding table 23 includes a second material table assembly 231 and a second blue film assembly 232. The second material table assembly 231 and the second blue film assembly 232 are both arranged in the second loading area 13, and there is a gap between the second material table assembly 231 and the second blue film assembly 232. A chip is placed on the side of the second material table assembly 231 and / or the second blue film assembly 232 away from the operating table 1. Similarly, the style of the chip is usually determined according to the previous process flow of the eutectic. For example, the chip can be glued to the blue film after cutting, or it can be taken out and placed in the material box, and the second material table assembly 231 and / or the second blue film assembly 232 can be set in the second loading area 13 in this embodiment, which can adapt to different types of chips. The adaptability of the substrate is improved.

[0086] Furthermore, please combine Figure 4 、 Figure 7 、 Figure 11 and Figure 12 The head binding assembly 4 includes a head binding guide rail 41 fixed to the operating table 1 and a head binding system 40 movably connected to the head binding guide rail 41. The head binding system 40 includes a head binding frame 42, a head binding motor 43 and a head binding body 44. The head binding frame 42 is movably connected to the head binding guide rail 41. The head binding body 44 is provided on the side of the head binding frame 42 close to the operating table 1, and the head binding motor 43 is provided on the side away from the operating table 1. It should be understood that the head binding motor 43 is used to drive the head binding frame 42 to drive the head binding body 44 to slide on the head binding guide rail 41. Usually, when the turntable 61 moves to the end close to the head binding assembly 4, the head binding body 44 can also be moved to the top of the turntable 61 away from the operating table 1, so that the head binding body 44 can absorb the chip on the turntable 61. In addition, the head binding body 44 can be moved to the top of the eutectic table 3 away from the operating table 1, so that the head binding body 44 can mount the chip on the substrate on the eutectic table 3. It should be noted that the binding head body 44 is different from ordinary manipulators and requires ultra-high operating precision, can fine-tune the angle of the chip, and can ensure that the chip is not damaged during the mounting process.

[0087] It should be noted that the binding head body 44 can be a plurality of types of binding heads or a combination of a plurality of types of binding heads.

[0088] Please combine Figure 7 and Figure 8In one type of head binding body 44, the head binding body 44 includes a first head binding assembly 45, and the first head binding assembly 45 includes a first head binding 451, a first suction nozzle mounting frame 452, a mounting seat 453, a buffer 454 and a limiting member 455. The first head binding 451 is arranged on the side of the head binding frame 42 away from the head binding guide rail 41, and the side of the first head binding 451 close to the operating table 1 is provided with a limiting member 455 and a mounting seat 453 movably connected to the first head binding 451, and there is a gap between the mounting seat 453 and the limiting member 455; the end of the mounting seat 453 away from the first head binding 451 is rotatably connected to the first suction nozzle mounting frame 452, and a clearance channel 4551 is opened on the limiting member 455, and the buffer 454 is sleeved on the mounting seat 453, and the end of the buffer 454 away from the mounting seat 453 is at least partially accommodated in the clearance channel 4551.

[0089] It can be understood that this type of binding head body 44 has a buffer 454 added compared to the traditional binding head. The side of the first suction nozzle mounting bracket 452 close to the operating table 1 can cooperate with various suction nozzles, and the end of the suction nozzle away from the first suction nozzle mounting bracket 452 is used to contact and suck the chip. After the chip is sucked, the chip will first be moved to a preset position for positioning, and then the first suction nozzle mounting bracket 452 will rotate with the suction nozzle and the chip relative to the mounting seat 453, so that the angle of the chip mounted on the substrate can be adjusted. Further, the chip will be mounted on the substrate, and when the chip contacts the substrate, the force of the chip on the substrate will react on the chip itself. If the force applied by the binding head body 44 is too large, it will cause damage to the chip or substrate. In this embodiment, if the force applied by the binding head body 44 is too large, the force will first react on the first suction nozzle mounting bracket 452, causing the first suction nozzle mounting bracket 452 to move together with the mounting seat 453 toward the first binding head 451. At this time, the end of the buffer 454 away from the mounting seat 453 rubs against the inner wall of the clearance channel 4551, and the friction force can partially offset the reaction force to avoid damage to the chip or substrate.

[0090] Please combine Figure 7 and Figure 9 In another type of head binding body 44, the head binding body 44 includes at least one second head binding assembly 46, the second head binding assembly 46 includes a second head binding 461 and a second suction nozzle mounting bracket 462, the second head binding 461 is arranged on the side of the head binding bracket 42 away from the head binding guide rail 41, and the second suction nozzle mounting bracket 462 rotatably connected to the second head binding 461 is arranged on the side of the second head binding 461 close to the operating table 1.

[0091] It can be understood that the advantage of this type of head binding body 44 over the traditional head binding is that it can combine multiple head binding components 4. The traditional head binding can only absorb one chip at a time, so its actual process is: place several chips on the turntable 61 and move it to one end close to the head binding component 4, move the head binding head above the turntable 61, absorb the chip, move it to the preset position to position the chip, and then rotate the chip to adjust the chip, and mount the adjusted chip on the substrate of the eutectic table 3. Repeat the above process. The second head binding component 46 in this embodiment can be combined with multiple heads. Various types of suction nozzles can be installed on the end of the second suction nozzle mounting frame 462 away from the second head binding 461. The end of the suction nozzle away from the first suction nozzle mounting frame 452 is used to contact and absorb the chip. After the chip is absorbed. Unlike traditional head binding, there is no need to rush to position, but to take advantage of the advantages of multiple second head binding components 46 to absorb multiple chips at one time. Once each second binding head assembly 46 has picked up a chip, it is then moved to a pre-set position for positioning. The first nozzle mounting bracket 452 then rotates the nozzle and chip relative to the mounting base 453 to adjust the angle at which the chip is attached to the substrate. This means that the binding head in this embodiment reduces the repeated steps of chip pickup, positioning, and placement, significantly improving die bonding efficiency.

[0092] Specifically, see Figure 4 The positioning assembly 5 includes a first positioning module 51 and a second positioning module 52. The first positioning module 51 is positioned between the second slide table 23 and the transfer assembly 6, while the second positioning module 52 is positioned between the eutectic table 3 and the transfer assembly 6. It should be understood that the first positioning module 51 and the second positioning module 52 may be cameras. The positioning assembly 5 is primarily used to detect the angle of the chip when the chip manipulator or the head assembly 4 picks up the chip, facilitating the final placement of the chip on the substrate at the desired angle.

[0093] It should be noted that the recognition accuracy of the first positioning module 51 is lower than that of the second positioning module 52. The first positioning module 51 is positioned between the second slide table 23 and the transfer assembly 6. After the second robotic arm 24 picks up a chip on the second slide table 23, it is first transported to the top of the first positioning module 51. After positioning by the first positioning module 51, the chip's position is adjusted, and then it is transported to the transfer table 61. The chip on the transfer table 61 is transported from the end near the second loading area 13 to the end near the head assembly 4. The head assembly 4 picks up the chip from the transfer table 61 and transports it to the top of the second positioning module 52 for secondary positioning and position adjustment. After these adjustments, the chip can be mounted on the substrate. This embodiment uses two positioning modules based on the position of each component, one for coarse adjustment and one for fine adjustment. The first coarse adjustment does not require high accuracy, so the adjustment speed can be faster and the workload of the second fine adjustment can be shared. These two adjustments allow the chip to be precisely mounted at the preset position on the substrate. In addition, the movement range of the higher-cost binding head assembly 4 in this embodiment only needs to cover the distance from the transfer assembly 6 to the eutectic table 3, and the chip loading is operated by the lower-cost second robot arm 24, which can greatly reduce equipment costs.

[0094] Please combine Figure 1 and Figure 12 In order to solve the above technical problems, the second embodiment of the present invention further provides a eutectic process method. Using the above eutectic machine, the specific steps of the eutectic process method include:

[0095] S1, provides substrate and chip;

[0096] S2, transporting the substrate to the eutectic table by the first robotic arm;

[0097] S3, after performing the first adjustment operation on the chip by the second robotic arm, the chip is transported to the transfer assembly;

[0098] S4, the chip is transported from the end of the transfer assembly close to the second loading area to the end close to the binding head assembly;

[0099] S5, the chip transported on the transfer component is sucked by the head binding component;

[0100] S6, after performing a second adjustment operation on the sucked chip, the chip is mounted on the substrate of the eutectic table;

[0101] S7, performing eutectic treatment on the substrate and the chip mounted on the substrate to complete eutectic.

[0102] It can be understood that in order to improve the efficiency of eutectic. In this embodiment, two loading areas can be set up. First, the first robotic arm transports the substrate to the eutectic table and the second robotic arm performs adjustment operations on the chip and then transports the chip to the transfer assembly. It can be performed simultaneously. It should be understood that the first adjustment operation on the chip is a rough adjustment of the chip. Its advantage is that the adjustment speed is fast. Furthermore, the adjusted chip can be transported to one end of the transfer assembly close to the binding head assembly through the transfer assembly. At this time, the binding head assembly will absorb the chip transported on the transfer assembly and perform a second adjustment operation on the chip. It should be understood that the second adjustment operation on the chip is a fine adjustment of the chip, so the purpose of the second adjustment is to make the accuracy of the chip mounted on the substrate meet the user's expected requirements. After completing the two positioning and adjustments, the chip has completed the mounting work. At this time, if there is no need to mount extra chips on the substrate, the substrate and the chip mounted on the substrate can be eutectic processed to complete the eutectic, which is simple and convenient.

[0103] Specifically, the first robotic arm, the second robotic arm and the head binding assembly are independently controlled; the eutectic table includes a first eutectic portion and a second eutectic portion;

[0104] It should be understood that having two eutectic sections can significantly improve eutectic efficiency. For example, while the first robotic arm transports a substrate to the first eutectic section, the bonding head assembly can simultaneously attach a chip to a substrate in the second eutectic section. In this case, the first eutectic section can be used to support the substrate, while the substrate in the second eutectic section completes the attachment.

[0105] Alternatively, while the first robotic arm is transporting the substrate to the second eutectic section, the head assembly can simultaneously attach the chip to the substrate on the first eutectic section. At this point, the second eutectic section can be used to hold the substrate, while the substrate on the first eutectic section is being attached.

[0106] It should be understood that on the eutectic table, the work of placing the substrate is completed on one eutectic part, and the work of chip mounting is completed on the other eutectic table. The two tasks do not interfere with each other. The work of substrate placement and chip mounting coexists, which improves the efficiency of eutectic.

[0107] The above is a detailed introduction to a eutectic machine and a eutectic process method disclosed in an embodiment of the present invention. Specific examples are used herein to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the method of the present invention and its core idea. At the same time, for those skilled in the art, according to the idea of ​​the present invention, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as a limitation on the present invention. Any modifications, equivalent replacements and improvements made within the principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A eutectic machine for mounting a chip on a substrate, characterized by: The eutectic machine includes an operating table, a first loading assembly, a second loading assembly, a eutectic table, a head binding assembly, a positioning assembly, and a transfer assembly; the eutectic table includes a servo motor, a rotating platform, a first eutectic portion, and a second eutectic portion. The servo motor is disposed on the rotating platform and drives the rotating platform to rotate in connection with the operating table. The first eutectic portion and the second eutectic portion are respectively disposed on opposite sides of the rotating platform. The operating table surface includes a central area and a first loading area and a second loading area arranged on one side or two opposite sides of the central area; the operating table is provided with a first loading assembly and a second loading assembly; the first loading assembly includes a first sliding table and a first robotic arm, and the second loading assembly includes a second sliding table and a second robotic arm; the transfer assembly includes a transfer table and a transfer slide rail, and the transfer slide rail is fixedly connected to the operating table; The first loading area is provided with a first sliding table and a first robotic arm, and the first sliding table is used to carry the substrate; the second loading area is provided with a second sliding table and a second robotic arm, and the second sliding table is used to carry the chip; the positioning assembly is arranged close to and between the eutectic table and the transfer assembly; The eutectic table and the head binding assembly are provided in the central area, and the head binding assembly is movably connected to the operating table; the first robotic arm is used to transport the substrate to the eutectic table; The transfer slide is provided on a side of the eutectic table close to the second robotic arm, and one end of the transfer slide is provided close to the second loading assembly, and the other end is provided close to the eutectic table; the chip carried by the second loading assembly passes through the transfer table and is transported from the side of the transfer slide close to the second loading area to the side of the transfer slide close to the central area; the head binding assembly absorbs the chip transported to the central area, the positioning assembly positions the chip absorbed by the head binding assembly, and controls the head binding assembly to adjust the position of the chip so as to mount the chip on the substrate of the eutectic table; The first robotic arm, the second robotic arm and the head binding assembly are independently controlled from each other; When the first robot arm transports the substrate to the first eutectic part, the head assembly simultaneously mounts the chip onto the substrate of the second eutectic part; Alternatively, when the first robot arm transports the substrate to the second eutectic portion, the head assembly simultaneously mounts the chip onto the substrate in the first eutectic portion.

2. The eutectic machine according to claim 1, wherein: The operating accuracy of the head binding assembly on the chip is greater than the operating accuracy of the second robot arm on the chip.

3. The eutectic machine according to claim 1, wherein: The direction in which the first eutectic portion approaches the second eutectic portion is a first direction, the length direction of the transfer component is parallel to the first direction, and the length directions of the first sliding platform and the second sliding platform are perpendicular to the first direction.

4. The eutectic machine according to claim 1, wherein: The first sliding table includes a first material table assembly and a first blue film assembly, both of which are arranged in the first loading area, and there is a gap between the first material table assembly and the first blue film assembly, and the substrate is placed on a side of the first material table assembly and / or the first blue film assembly away from the operating table; The second sliding table includes a second material table assembly and a second blue film assembly. The second material table assembly and the second blue film assembly are both arranged in the second loading area, and there is a gap between the second material table assembly and the second blue film assembly. The chip is placed on the side of the second material table assembly and / or the second blue film assembly away from the operating table.

5. The eutectic machine according to claim 1, wherein: The head binding assembly includes a head binding rail fixed on the operating table and a head binding system movably connected to the head binding rail. The head binding system includes a head binding frame, a head binding motor and a head binding body. The head binding frame is movably connected to the head binding rail. The head binding body is arranged on the side of the head binding frame close to the operating table, and the head binding motor is arranged on the side away from the operating table.

6. The eutectic machine according to claim 5, wherein: The binding head body includes a first binding head assembly, which includes a first binding head, a first nozzle mounting frame, a mounting seat, a buffer member and a limit member. The first binding head is arranged on a side of the binding head frame away from the binding head guide rail, and the first binding head is provided with the limit member and the mounting seat movably connected to the first binding head on a side close to the operating table, and there is a gap between the mounting seat and the limit member. The end of the mounting base away from the first binding head is rotatably connected to the first nozzle mounting bracket, the limiting member is provided with a clearance channel, the buffer member is sleeved on the mounting base, and the end of the buffer member away from the mounting base is at least partially accommodated in the clearance channel; And / or, the head binding body includes at least one second head binding assembly, the second head binding assembly includes a second head binding and a second suction nozzle mounting bracket, the second head binding is arranged on the side of the head binding bracket away from the head binding guide rail, and the second suction nozzle mounting bracket rotatably connected to the second head is arranged on the side of the second head binding close to the operating table.

7. The eutectic machine according to claim 1, wherein: The transfer component is provided with a vacuum suction hole corresponding to the chip on the side away from the operating table; the positioning component includes a first positioning module and a second positioning module, the first positioning module is arranged between the second sliding table and the transfer component, and the second positioning module is arranged between the eutectic table and the transfer component, and the first positioning module and the second positioning module are cameras; the recognition accuracy of the first positioning module is lower than that of the second positioning module.

8. A eutectic process method, using the eutectic machine according to any one of claims 1 to 7, characterized in that: The specific steps of the eutectic process include: Provide substrates and chips; transporting the substrate to the eutectic table by a first robotic arm; After the second robotic arm performs the first adjustment operation on the chip, the chip is transported to the transfer assembly; The chips are transported from one end of the transfer assembly close to the second loading area to the other end close to the binding head assembly; The chips transported on the transfer component are sucked by the binding head component; After the sucked chip is subjected to a second adjustment operation, the chip is mounted on the substrate of the eutectic stage.

9. The eutectic process according to claim 8, wherein: The eutectic table includes a first eutectic portion and a second eutectic portion; The first robotic arm, the second robotic arm and the head binding assembly are independently controlled from each other; When the first robot arm transports the substrate to the first eutectic part, the head assembly can simultaneously mount the chip to the substrate of the second eutectic part; Alternatively, when the first robot arm transports the substrate to the second eutectic portion, the bonding head assembly can simultaneously mount the chip onto the substrate in the first eutectic portion.

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