Surge protection device and surge protection module thereof

Abstract

According to the surge protection module provided by the invention, the observation window is arranged at the top of the shell, and the fault state indication area and the normal state indication area which directly face the observation window are respectively arranged at the top of the bearing frame and the third end corner, so that the normal state indication area is observed in the observation window when the piezoresistor is normally used; when the thermal tripping piece is unsoldered due to overheating or other reasons, the rotating piece continues to rotate and drives the third end corner to be far away from the observation window, so that the fault state indication area is located under the observation window, indication of the working state of the surge protection module can be visually observed, the faulted surge protection module can be quickly found, and the service life of the surge protection module is prolonged. Meanwhile, the anti-theft device has the advantages of being simple in structure and low in manufacturing cost. The invention further provides the surge protection device, the microswitch and the remote signaling mechanism are integrated in the base, and therefore the surge protection device can monitor the contact state of the abutting rod and the microswitch in real time.

Description

Technical Field

[0001] The present invention relates to the technical field of surge protectors, and more particularly to a surge protector and a surge protection module thereof. Background Art

[0002] In a power system, a surge protection module is one of the common safety protection devices and is widely used in various electrical devices and circuits to prevent transient overvoltage caused by lightning, switching overvoltage, etc. from damaging the devices.

[0003] Traditional surge protection modules usually only have basic overvoltage protection functions and lack indication of their working states and fault conditions. Usually, multiple surge protection modules are provided on a socket, and it is often difficult for users to intuitively understand whether there is a fault in the operation of which surge protection module. As a result, when the surge protection module fails or malfunctions, users cannot take corresponding measures in time for the faulty surge protection module, thereby increasing the risk of damage to electrical devices and circuits. Among existing surge protection modules, electronic sensors and other electronic components are often used for status feedback. However, electronic components rely on external power supply and signal processing circuits, with relatively complex structures, being prone to false triggering in high-temperature, high-humidity or strong electromagnetic interference environments, having short sensor lifetimes, being difficult to maintain, and having relatively high usage costs.

[0004] Therefore, it is necessary to provide a surge protection module with a simple structure, low manufacturing cost and working state indication. Summary of the Invention

[0005] Based on the technical problem that existing surge protection modules lack a working state indication with a simple structure and low cost, the present invention provides a surge protector and a surge protection module thereof.

[0006] A surge protection module, comprising a housing, a varistor, a first electrode connecting member, a second electrode connecting member and a thermal trip mechanism; a carrier is provided inside the housing; an installation plate is provided inside the carrier, and the varistor is installed on a first side of the installation plate; the varistor includes a varistor chip, a first electrode is provided on the surface of the varistor chip, a second electrode is provided on the bottom surface of the varistor chip, and an insulating encapsulation layer is coated on the connection part of the first electrode and the second electrode and the outer surface of the varistor chip; the first electrode connecting member includes a first pin and a thermal release part, and the thermal release part is welded to the first pin and the first electrode respectively through a low-melting-point alloy; one end of the second electrode connecting member is welded to the second electrode, and the other end is provided with a second pin; an observation window is provided on the top of the housing, and a fault state indication area is provided on the top of the carrier; the fault state indication area faces the observation window; the thermal trip mechanism includes a rotating shaft and a rotating member provided on a second side of the installation plate, the rotating member is provided with a first end angle, a second end angle and a third end angle, and the first end angle is rotatably installed on the rotating shaft and is connected with an abutting rod near one end of the housing, and the second end angle is located on one side of the thermal release part; the third end angle is located above the fault state indication area, and a normal state indication area is provided on one side of the third end angle facing the observation window; an opening is provided at the bottom of the housing, when the surge protection module is inserted into a socket, the abutting rod passes through the opening to trigger a micro switch in the socket, the rotating member rotates around the rotating shaft in a direction close to the thermal release part so that the second end angle is in tight contact with the thermal release part, and the normal state indication area is located directly below the observation window; after the thermal release part is de-soldered, the rotating member rotates around the rotating shaft in a direction close to the thermal release part and drives the abutting rod to disengage from the micro switch, and the third end angle moves away from the observation window, so that the fault state indication area is located directly below the observation window.

[0007] Preferably, the installation plate is provided with installation holes penetrating both sides; an installation groove communicated with the second electrode is provided on one side of the carrier, the first electrode passes through the installation hole and is welded to the thermal release part, and the second electrode passes through the installation groove and is welded to the second electrode connecting member.

[0008] Preferably, the low-melting-point alloy is Field’s alloy.

[0009] Preferably, a limiting plate is provided on the installation plate, and the limiting plate is located above the thermal release part. After the thermal release part is de-soldered, the rotating member rotates around the rotating shaft in a direction close to the thermal release part until it abuts against the limiting plate.

[0010] Preferably, the normal state indication area and the fault state indication area are marked with different colors.

[0011] Preferably, the method for preparing the varistor includes: Step S1: Preparation of the varistor chip: After mixing the ZnO matrix and the composite dopant in proportion, they are ground by high-energy ball milling to form a uniformly mixed powder, and then pre-sintered at 560-600 °C for 2 h by heating at 80 °C / h in a nitrogen atmosphere, and then main-sintered at 1150-1180 °C for 4-6 h by heating at 120 °C / h to form the varistor chip; wherein, the composite dopant includes Bi2O3, SrTiO3, Co3O4 and boron nitride nanosheets; Step S2: Treatment of the electrodes: The first electrode and the second electrode are respectively produced by magnetron sputtering deposition on the surface of the varistor chip, and an alumina insulating layer is covered on the surfaces of the first electrode and the second electrode; Step S3: Coating of the encapsulation layer: An epoxy resin-silicone composite layer is coated at the connection of the first electrode and the second electrode and on the outer surface of the varistor chip to form the encapsulation layer.

[0012] Preferably, the components of the ZnO matrix and the composite dopant are calculated by weight, and specifically include: 92-95 parts of ZnO matrix; 3-4 parts of Bi2O3; 1.5-3.5 parts of SrTiO3; 0.5-1.2 parts of Co3O4 and 0.2-0.6 parts of boron nitride nanosheets.

[0013] Preferably, the SrTiO3 is pre-synthesized by the sol-gel method, which specifically includes: mixing Sr(NO3)2 and tetrabutyl titanate in a molar ratio of 1:1.2, adding a citric acid complexing agent, forming a transparent sol at 80 °C, then drying at 120 °C, and then calcining at 650 °C for 3 h to obtain the SrTiO3 nanoparticles.

[0014] Preferably, the rotation speed of the high-energy ball milling is ≥400 rpm, and the grinding time is ≥6 h.

[0015] The present invention also provides a surge protector, including: a base and a surge protection module as described above; a microswitch and a telemetry mechanism are provided in the base, when the abutting rod triggers the microswitch, the telemetry mechanism indicates a first status signal, when the abutting rod disengages from the microswitch and triggers a telemetry signal, the telemetry mechanism indicates a second status signal; plug holes corresponding to the first pin and the second pin and used for electrical connection with the circuit are further provided on the base, and the first pin and the second pin of the surge protection module are correspondingly inserted into the plug holes.

[0016] The beneficial effects of the present invention are as follows: The present invention provides a surge protection module. By providing an observation window at the top of the housing, and respectively providing a fault state indication area and a normal state indication area facing the observation window at the top and the third end corner of the carrier, when the varistor is in normal use, the normal state indication area can be observed through the observation window; when the thermal release fastener is de-soldered due to overheating or other reasons, the rotating member will continue to rotate and drive the third end corner away from the observation window, so that the fault state indication area is located directly below the observation window, thus facilitating the user to directly observe the indication of the working state of the surge protection module, quickly find the faulty surge protection module, reduce the risk of damage to electrical equipment and circuits, and at the same time has the characteristics of simple structure and low manufacturing cost.

[0017] The present invention also provides a surge protector. By integrating a micro switch and a telemetry mechanism in the base, the surge protector can monitor the contact state between the abutting rod and the micro switch in real time. When the abutting rod triggers the micro switch, the telemetry mechanism emits a first state signal, indicating that the surge protection module is in a normal working state; when the abutting rod is separated from the micro switch, the telemetry mechanism emits a second state signal, indicating that there may be a fault or an abnormal situation, thereby enhancing the state monitoring ability of the surge protector, enabling the user to remotely or centrally monitor the working state of the surge protector, and improving the reliability and safety of the system. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 is a three-dimensional structural schematic diagram of a varistor provided by the present invention;

[0019] Figure 2 is an overall structural schematic diagram of a surge protection module provided by the present invention;

[0020] Figure 3 is a front schematic diagram of a carrier and its internal structure provided by the present invention;

[0021] Figure 4 is a back schematic diagram of a carrier and its internal structure provided by the present invention;

[0022] Figure 5 is a tripping state schematic diagram of a surge protection module provided by the present invention;

[0023] Figure 6 is a structural schematic diagram of a first electrode connecting member provided by the present invention;

[0024] Figure 7 is a structural schematic diagram of a second electrode connecting member provided by the present invention;

[0025] Figure 8 is a structural schematic diagram of a surge protector provided by the present invention.

[0026] Reference Signs

[0027] 1. Housing; 2. Varistor; 201. Varistor chip; 202. First electrode; 203. Second electrode; 204. Insulating encapsulation layer; 3. First electrode connector; 301. First pin; 302. Thermal release fastener; 4. Second electrode connector; 401. Second pin; 5. Thermal release mechanism; 501. Rotating shaft; 502. Rotating member; A. First end corner; B. Second end corner; C. Third end corner; 6. Carrier; 7. Mounting plate; 8. Mounting hole; 9. Mounting groove; 10. Observation window; 11. Fault status indication area; 12. Normal status indication area; 13. Opening; 14. Socket; 141. Microswitch; 142. Insertion hole; 15. Limiting plate. Detailed implementation manners

[0028] To further introduce the present invention in detail, the following will be described with reference to the accompanying drawings. It should be specifically noted that the embodiments described below are only a part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without making creative efforts belong to the scope of protection of the present invention.

[0029] Reference Figure 1 and Figure 2 As shown, a surge protection module includes a housing 1, a varistor 2, a first electrode connector 3, a second electrode connector 4 and a thermal release mechanism 5.

[0030] Specifically, as shown in reference Figure 3 and Figure 4 a carrier 6 is provided inside the housing 1; an installation plate 7 is provided inside the carrier 6, and the varistor 2 is installed on the first side of the installation plate 7.

[0031] Among them, as shown in reference Figure 1 the varistor 2 includes a varistor chip 201, a first electrode 202 is provided on the surface of the varistor chip 201, a second electrode 203 is provided on the bottom surface of the varistor chip 201, and an insulating encapsulation layer 204 is coated on the connection part of the first electrode 202 and the second electrode 203 and the outer surface of the varistor chip 201.

[0032] By providing the insulating encapsulation layer 204, it can effectively insulate and protect the varistor chip 201 and the connection positions of the first electrode 202 and the second electrode 203 with the varistor chip 201 through the insulating encapsulation layer 204, and avoid the problem that the varistor chip 201 is damaged by the influence of the internal and external environments after long-term use, achieving a good insulation effect, effectively isolating the electrical contact between the varistor chip 201 and the external environment, and improving the arc resistance performance during use.

[0033] In some embodiments, the method for preparing the varistor includes:

[0034] Step S1: Preparation of the varistor chip 201: After mixing the ZnO matrix and the composite dopant in proportion, they are ground by high-energy ball milling to form a uniformly mixed powder, and then pre-sintered at 560 - 600 °C for 2 h by heating at 80 °C / h in a nitrogen atmosphere, and then main-sintered at 1150 - 1180 °C for 4 - 6 h by heating at 120 °C / h to form the varistor chip; wherein, the composite dopant includes Bi2O3, SrTiO3, Co3O4 and boron nitride nanosheets. Among them, the rotation speed of the high-energy ball milling is ≥400 rpm, and the grinding time is ≥6 h.

[0035] Bi2O3 combines with the dielectric enhancement characteristics of SrTiO3 as a grain boundary former, reducing the leakage current of the fabricated varistor chip 201, while improving the non-linear coefficient and enhancing the local electric field regulation ability. Co3O4 can improve the carrier mobility at the grain boundary, and the boron nitride nanosheets serve as the skeleton of the heat conduction network, increasing the energy absorption density, thereby improving the thermal conductivity and mechanical strength of the varistor chip 201. Sintering is carried out in a nitrogen atmosphere by means of gradient sintering, which can optimize the grain uniformity, prevent the material from oxidizing at high temperatures, ensure good sintering and performance of the varistor chip 201, and reduce the aging rate.

[0036] Specifically, the components of the ZnO matrix and the composite dopant are calculated according to parts by weight, and specifically include: 92 - 95 parts of the ZnO matrix; 3 - 4 parts of Bi2O3; 1.5 - 3.5 parts of SrTiO3; 0.5 - 1.2 parts of Co3O4 and 0.2 - 0.6 parts of boron nitride nanosheets.

[0037] The SrTiO3 is pre-synthesized by the sol-gel method, specifically including: mixing Sr(NO3)2 and tetrabutyl titanate in a molar ratio of 1:1.2, adding a citric acid complexing agent, forming a transparent sol at 80 °C, and then drying at 120 °C, and then calcining at 650 °C for 3 h to obtain the SrTiO3 nanoparticles. The SrTiO3 nanoparticles pre-synthesized by the sol-gel method form a denser grain boundary network in the ZnO matrix, and the change rate of the varistor voltage after thermal cycling is smaller.

[0038] Step S2: Treatment of the electrodes: The first electrode 202 and the second electrode 203 are respectively produced by magnetron sputtering deposition on the surface of the varistor chip, and an alumina insulating layer is covered on the surfaces of the first electrode 202 and the second electrode 203. Alumina insulation can provide good electrical isolation, prevent short circuits between the electrodes, and at the same time is beneficial to improving the withstand voltage ability of the varistor.

[0039] Step S3: Coating of the encapsulation layer: An epoxy resin-silicone composite layer is coated on the connection between the first electrode 202 and the second electrode 203 and on the outer surface of the varistor chip, thereby forming the encapsulation layer 204. The epoxy resin-silicone composite layer provides good moisture-proof, dust-proof and insulation properties.

[0040] Through the co-doping of Bi2O3 and nano-SrTiO3, a dense grain boundary potential barrier can be formed in the ZnO matrix, improving the varistor voltage gradient of the prepared varistor chip 201, reducing the leakage current, while increasing the non-linear coefficient and significantly improving the surge response accuracy. And Co3O4 and boron nitride nanosheets are used to construct a heat conduction network to improve the energy absorption density and achieve good heat conduction effect.

[0041] Reference Figure 6 , Figure 7 and Figure 3 , Figure 4 As shown in

[0042] When an abnormal current or an over-high temperature appears in the circuit, the low-melting-point alloy will melt, causing the connection between the thermal release part 302 and the first pin 301 and the first electrode 202 to be disconnected, thereby quickly cutting off the circuit and preventing safety accidents such as equipment damage or fire, and thus improving the reliability and safety of the surge protector.

[0043] Among them, the mounting plate 7 is provided with mounting holes 8 penetrating through both sides; one side of the carrier 8 is provided with a mounting groove 9 communicating with the second electrode 202, the first electrode 202 passes through the mounting hole 8 and is welded to the thermal release part 302, and the second electrode 203 passes through the mounting groove 9 and is welded to the second electrode 203 connecting member.

[0044] Reference Figure 3 and Figure 5As shown, an observation window 10 is provided on the top of the housing 1, and a fault status indication area 11 is provided on the top of the carrier 6; the fault status indication area 11 is opposite to the observation window 10; the thermal release mechanism 5 includes a rotating shaft 501 and a rotating member 502 provided on the second side of the mounting plate 7. The rotating member 502 is provided with a first end angle A, a second end angle B, and a third end angle C. The first end angle A is rotatably mounted on the rotating shaft 501, and a contact rod 503 is connected to the end close to the housing 1. The second end angle B is located on one side of the thermal release part 302; the third end angle B is located above the fault status indication area 11, and a normal status indication area 12 is provided on the side of the third end angle B opposite to the observation window 10.

[0045] An opening 13 is provided at the bottom of the housing 1. When the surge protection module is inserted into a socket 14, the contact rod 503 passes through the opening 13 to trigger the microswitch 141 in the socket. The rotating member 502 rotates around the rotating shaft 501 in the direction close to the thermal release part 302, so that the second end angle B is in tight contact with the thermal release part 302. The normal status indication area 12 is located directly below the observation window 10, and the normal status indication area 12 is located above the fault status indication area 11.

[0046] When the surge protection module is inserted into a socket 14, the microswitch 141 is in contact with the contact rod 503 and gives an upward force to the contact rod 503. The contact rod 503 is connected to the first end angle, so that the rotating member 502 rotates around the rotating shaft 501 in the direction close to the thermal release part 302, that is, rotates clockwise until it is in tight contact with the thermal release part 302. At this time, the varistor 2 works normally, and it can be observed through the observation window 10 that the normal status indication area 12 indicates that the varistor is in normal use.

[0047] After the thermal release part 302 is de-soldered, the rotating member 502 rotates around the rotating shaft 501 in the direction close to the thermal release part 302 and drives the contact rod 503 to disengage from the microswitch 141. The third end angle C is away from the observation window 10, so that the fault status indication area 11 is located directly below the observation window 10.

[0048] When the low-melting-point alloy at both ends of the thermal release fastener 302 melts at high temperature, the connection between the thermal release fastener 302 and the first electrode 202 and the first pin is disconnected, causing the thermal release fastener 302 to become desoldered, and the varistor is in the tripped state. At this time, the thermal release fastener 302 drops, causing the second end angle B to lose the limiting support of the thermal release fastener 302. Since the position of the rotating shaft is at the first end angle A, that is, the center of gravity shifts to the side of the first end angle A. Under the action of gravity, the second end angle B without contact drives the rotating member 502 to rotate around the rotating shaft 501 in the direction close to the thermal release fastener 302, that is, continues to rotate in the clockwise direction, so that the normal state indication area 12 on the first end angle A moves away from the observation window 10, and further makes the fault state indication area 11 located directly below the observation window 10. It can be seen from the observation window 10 that the fault state indication area 11 indicates that the varistor 2 is in the tripped state.

[0049] Wherein, a limiting plate 15 is provided on the mounting plate 7, and the limiting plate 15 is located above the thermal release fastener 302. After the thermal release fastener 302 becomes desoldered, the rotating member 502 continues to rotate around the rotating shaft in the direction close to the thermal release fastener 302 until it abuts against the limiting plate 15, that is Figure 5 The state of the rotating member 502 shown, thereby restricting the excessive rotation of the rotating member 502.

[0050] In this embodiment, the normal state indication area 12 and the fault state indication area 11 are marked with different colors. Specifically, the normal state indication area 12 is marked with green, and the fault state indication area 11 is marked with red. Through the linkage design of the observation window 10 with the fault state indication area 11 and the normal state indication area 12, the user can intuitively judge the equipment state, enabling the user to quickly troubleshoot faults.

[0051] Reference Figure 2 and Figure 8 As shown, the present invention also provides a surge protector, including: a base 14 and a surge protection module as described above.

[0052] Specifically, a micro switch 141 and a telemetry mechanism (not shown in the figure) are provided in the base 14. When the abutting rod 503 triggers the micro switch 141, the telemetry mechanism indicates a first state signal. When the abutting rod 503 is separated from the micro switch 141 and triggers a telemetry signal, the telemetry mechanism indicates a second state signal.

[0053] By integrating a microswitch 141 and a signaling mechanism within the base 14, the surge protector can monitor in real time the contact state between the abutting rod 503 and the microswitch 141, that is, the plugging and unplugging state of the surge protection module and the base 14. When the abutting rod 503 triggers the microswitch 141, the signaling mechanism emits a first status signal, indicating that the surge protection module is in a normal working state; while when the abutting rod 503 disengages from the microswitch 141, the signaling mechanism emits a second status signal, indicating that there may be a fault or an abnormal condition, enabling the user to remotely or centrally monitor the working state of the surge protector, thereby improving the reliability and safety of the use of the surge protector.

[0054] In actual use, multiple surge protection modules are provided on the socket 14. When the user receives the first status signal, they can go to check the surge protection modules on the socket 14 and identify the specific surge protection module with problems through the indication area observed through the observation window 10.

[0055] The base 14 is further provided with plug holes 142 corresponding to the first pin 301 and the second pin 401 respectively and used for electrical connection with the circuit, and the first pin 301 and the second pin 401 of the surge protection module are correspondingly inserted into the plug holes 142.

[0056] The preferred embodiments of the present invention disclosed above are only used to help illustrate the present invention and do not limit the invention to the specific embodiments described. Obviously, other modifications and changes can be made according to the content of this specification. The embodiments selected and specifically described in this specification are for better explaining the principle and practical application of the present invention, so that those skilled in the art can well understand and utilize the present invention. It is not a limitation of the present invention, and any simply deformed solution of the present invention belongs to the protection scope of the present invention.

Claims

1. A surge protection module, characterized in that: It includes a shell, a varistor, a first electrode connector, a second electrode connector and a thermal release mechanism; A carrier is provided inside the housing; a mounting plate is provided inside the carrier, and the varistor is mounted on a first side of the mounting plate; The varistor comprises a varistor sheet, a first electrode is provided on the surface of the varistor sheet, a second electrode is provided on the bottom surface of the varistor sheet, and an insulating encapsulation layer is coated on the connection between the first electrode and the second electrode and the outer surface of the varistor sheet; The first electrode connector includes a first pin and a thermal release member, and the thermal release member is welded to the first pin and the first electrode respectively through a low melting point alloy; one end of the second electrode connector is welded to the second electrode, and the other end is provided with a second pin; An observation window is provided on the top of the shell, and a fault status indication area is provided on the top of the carrier; the fault status indication area is opposite to the observation window; the thermal release mechanism includes a rotating shaft and a rotating member arranged on the second side of the mounting plate, the rotating member is provided with a first end angle, a second end angle and a third end angle, and the first end angle is rotatably mounted on the rotating shaft, and is connected to an abutment rod close to one end of the shell, and the second end angle is located on one side of the thermal release member; the third end angle is located above the fault status indication area, and a normal status indication area is provided on the side of the third end angle facing the observation window; The bottom of the housing is provided with an opening. When the surge protection module is plugged into a socket, the abutment rod passes through the opening to trigger a micro switch in the socket, and the rotating member rotates around the rotating shaft in a direction close to the thermal release member so that the second end angle is in close contact with the thermal release member, and the normal state indication area is located directly below the observation window; After the thermal release part is unsoldered, the rotating part continues to rotate around the rotating shaft in the direction close to the thermal release part and drives the abutment rod to disengage from the micro switch, and the third end angle is away from the observation window, so that the fault status indication area is located directly below the observation window.

2. A surge protection module according to claim 1, characterized in that: The mounting plate is provided with mounting holes running through both sides; one side of the support frame is provided with a mounting groove connected to the second electrode, the first electrode passes through the mounting hole and is welded to the thermal release component, and the second electrode passes through the mounting groove and is welded to the second electrode connector.

3. A surge protection module according to claim 1, characterized in that: The low melting point alloy is Field's alloy.

4. A surge protection module according to claim 1, characterized in that: A limit plate is arranged on the mounting plate, and the limit plate is located above the thermal release part. After the thermal release part is unsoldered, the rotating part continues to rotate around the rotating shaft in a direction close to the thermal release part until it abuts against the limit plate.

5. A surge protection module according to claim 1, characterized in that: The normal state indication area and the fault state indication area are marked with different colors.

6. A surge protection module according to claim 1, characterized in that: The preparation method of the varistor comprises: Step S1: Preparation of varistor sheet: After the ZnO matrix and the composite dopant are mixed in proportion, a uniform mixed powder is formed by high-energy ball milling, and the mixture is pre-sintered at 560-600°C at 80°C / h for 2h in a nitrogen atmosphere, and then the mixture is sintered at 120°C / h for 4-6h to form a varistor sheet; wherein the composite dopant comprises Bi2O3, SrTiO3, Co3O4 and boron nitride nanosheets; Step S2: electrode processing: producing a first electrode and a second electrode on the surface of the varistor sheet by magnetron sputtering deposition, and covering the surface of the first electrode and the second electrode with an aluminum oxide insulating layer; Step S3: coating with an encapsulation layer: coating the connection between the first electrode and the second electrode and the outer surface of the varistor sheet with an epoxy resin-silicone composite layer, thereby forming the encapsulation layer.

7. A surge protection module according to claim 6, characterized in that: The components of the ZnO matrix and the composite dopant are calculated by weight and specifically include: 92-95 parts of ZnO matrix; 3-4 parts of Bi2O3; 1.5-3.5 parts of SrTiO3; 0.5-1.2 parts of Co3O4 and 0.2-0.6 parts of boron nitride nanosheets.

8. A surge protection module according to claim 6, characterized in that: The SrTiO3 is pre-synthesized by a sol-gel method, specifically comprising: mixing Sr(NO3)2 and tetrabutyl titanate in a molar ratio of 1:1.2, adding a citric acid complexing agent, forming a transparent sol at 80°C, and then drying at 120°C, and then calcining at 650°C for 3h to obtain the SrTiO3 nanoparticles.

9. A surge protection module according to claim 6, characterized in that: The high-energy ball mill has a rotation speed of ≥400 rpm and a grinding time of ≥6 h.

10. A surge protector, characterized in that: include: A base and a surge protection module as claimed in any one of claims 1 to 9; A micro switch and a remote signaling mechanism are arranged in the base. When the abutment rod triggers the micro switch, the remote signaling mechanism indicates a first state signal. When the abutment rod is separated from the micro switch and a remote signaling signal is triggered, the remote signaling mechanism indicates a second state signal. The base is also provided with plug holes corresponding to the first plug pin and the second plug pin respectively and used for electrically connecting to the circuit, and the first plug pin and the second plug pin of the surge protection module are correspondingly inserted into the plug holes.

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