Mounting assembly, circuit board assembly, electronic equipment and circuit board assembly processing method

Abstract

The invention relates to the technical field of transistors, in particular to a mounting assembly, a circuit board assembly, electronic equipment and a circuit board assembly processing method. The installation assembly is used for being installed between a circuit board and a radiator and comprises a connecting piece. The connecting piece comprises a connecting structure and two clamping parts, and the two clamping parts are arranged in the first direction; the clamping part comprises a first clamping structure and a second clamping structure which are oppositely arranged in a spaced mode in the first direction. A clamping space is formed between the first clamping structure and the second clamping structure. In the first direction, the first clamping structures of the two clamping parts are arranged adjacently. The first clamping structure comprises a first clamping part and a second clamping part, and the first clamping part tightly presses the transistor on the second clamping structure; the second clamping part is of a rigid structure; in one clamping part, the first clamping part is closer to the side face, located in the clamping space, of the second clamping structure than the second clamping part in the first direction.

Description

Technical Field

[0001] The present application relates to the technical field of transistors, and particularly to a mounting component, a circuit board component, an electronic device, and a method for processing a circuit board component. Background Art

[0002] Currently, transistors are increasingly widely used in the power supply field, and the operating power of transistors is also increasing. Technicians usually use a radiator to dissipate the heat of the transistors. When installing a transistor, the transistor is attached to the surface of the radiator so as to transfer the heat generated by the transistor to the radiator.

[0003] In order to ensure the attachment between the radiator and the transistor, when installing the transistor, it is generally first placed on the circuit board and then flipped together with the circuit board and installed on the radiator. During this process, the transistor is likely to fall off the circuit board. On the one hand, this is likely to damage the transistor, thereby affecting the yield and production cost of the final product; on the other hand, it is also inconvenient to install the transistor, thereby affecting the overall production efficiency of the product. Summary of the Invention

[0004] In order to solve the above problems, embodiments of the present invention provide a mounting component, a circuit board component, an electronic device, and a method for processing a circuit board component.

[0005] In a first aspect, embodiments of the present invention provide a mounting component. The mounting component of the present application is used to be mounted between a circuit board and a radiator and includes a connecting member;

[0006] The connecting member includes a connecting structure and two clamping portions, and the two clamping portions are arranged along a first direction;

[0007] The connecting structure and the clamping portion are respectively arranged on two opposite sides of the connecting member, and the connecting structure is used to connect with the circuit board;

[0008] The clamping portion includes a first clamping structure and a second clamping structure that are relatively spaced apart along the first direction; a clamping space is formed between the first clamping structure and the second clamping structure, and the clamping space is used to clamp a transistor. Along the first direction, the first clamping structures of the two clamping portions are arranged adjacent to each other;

[0009] The first clamping structure includes a first clamping portion and a second clamping portion. The first clamping portion is used to press the transistor against the second clamping structure when the transistor is inserted into the clamping space;

[0010] The second clamping portion is a rigid structure; in one clamping portion, along the first direction, the first clamping portion is closer to the side of the second clamping structure located in the clamping space than the second clamping portion.

[0011] Optionally, the connecting member includes a first housing and a second housing, and the first housing is fixedly connected to the second housing.

[0012] Optionally, the first clamping portion is provided on the first housing, and the second clamping structure and the second clamping portion are provided on the second housing; a first through hole is provided on the second housing, and the first clamping portion is inserted into the first through hole.

[0013] Optionally, the mounting assembly includes a fastener for fixedly mounting the second housing on the radiator.

[0014] Optionally, the mounting assembly includes a fastener gasket;

[0015] A second through hole is provided on the fastener gasket, and the fastener passes through the second through hole and presses the fastener gasket against the second housing.

[0016] Optionally, the second housing includes a receiving groove;

[0017] The fastener gasket is disposed in the receiving groove, and a third through hole is formed at the bottom of the receiving groove, and the fastener passes through the second through hole and the third through hole.

[0018] Optionally, the fastener gasket is an elastic gasket and has a flat structure; a convex structure is provided at the bottom of the receiving groove, and the convex structure contacts the fastener gasket so that there is a spaced arrangement between the fastener gasket and the bottom of the receiving groove.

[0019] Optionally, a surrounding frame is provided on the first housing, and the surrounding frame protrudes in a direction towards the second housing; a groove is provided on the second housing, and the depth direction of the groove is the same as the protruding direction of the surrounding frame; the surrounding frame and the groove are inserted and matched.

[0020] Optionally, a snap structure is provided on the first housing, and a connection hole is provided on the second housing, and the snap structure is snap-fitted with the connection hole.

[0021] Optionally, a first inclined surface is provided on the snap structure, and a second inclined surface is provided at the edge of the connection hole, and the inclination directions of the first inclined surface and the second inclined surface are both arranged at an acute angle with respect to the extending direction of the snap structure.

[0022] In a second aspect, an embodiment of the present invention provides a circuit board assembly, and the circuit board assembly includes a mounting assembly as described in any one of the above.

[0023] Optionally, the circuit board assembly includes a radiator, a transistor, and an insulating heat-conducting gasket;

[0024] The radiator is fixedly connected to the connecting member, the transistor is clamped in the clamping space, and the insulating heat-conducting gasket is clamped between the radiator and the transistor.

[0025] Optionally, a gasket mounting groove is provided on one side of the radiator facing the mounting assembly, and the insulating heat-conducting gasket is mounted in the gasket mounting groove.

[0026] In a third aspect, an embodiment of the present invention provides an electronic device, which includes a circuit board assembly of any one of the above.

[0027] In a fourth aspect, an embodiment of the present invention provides a method for manufacturing a circuit board assembly. The circuit board assembly includes a circuit board, a transistor, and a mounting assembly of any one of the above. The method includes:

[0028] When one side of the circuit board having pads is close to the ground, the transistor is fixedly connected to the side of the circuit board having pads by using the mounting assembly, wherein the transistor is clamped and fixed in the clamping space;

[0029] When the side of the circuit board having pads is turned over and away from the ground, the transistor is welded and fixed.

[0030] Optionally, the step of fixedly connecting the transistor to the side of the circuit board having pads by using the mounting assembly includes:

[0031] First connect the circuit board to the mounting assembly, and then clamp and fix the transistor in the clamping space; or

[0032] First clamp and fix the transistor in the clamping space, and then connect the circuit board to the mounting assembly.

[0033] Optionally, the circuit board assembly further includes a radiator; the step of welding and fixing the transistor when the side of the circuit board having pads is turned over and away from the ground includes:

[0034] Dust the gasket mounting groove on the radiator, and apply thermal grease to the bottom of the gasket mounting groove;

[0035] Install an insulating heat-conducting gasket in the gasket mounting groove;

[0036] Turn over the side of the circuit board having pads and away from the ground, fixedly mount the mounting assembly on the radiator through fasteners, and make the transistor adhere to the insulating heat-conducting gasket;

[0037] Weld and fix the pins of the transistor to the pads of the circuit board.

[0038] Optionally, the distance between the edge of the area coated with the thermal grease on the bottom of the gasket mounting groove and the groove wall of the gasket mounting groove is a, the thickness of the thermal grease is b, and 70b ≥ a ≥ 5b.

[0039] In some implementation manners of the present application, the mounting assembly includes a connecting member. The connecting member includes a connecting structure and two clamping portions arranged along the first direction. The clamping portion includes a first clamping structure and a second clamping structure which are relatively spaced apart.

[0040] During installation, the mounting assembly can be installed on the circuit board through the connecting structure, and the transistor can be clamped in the clamping space formed between the first clamping structure and the second clamping structure. The first clamping structure includes a first clamping portion and a second clamping portion. The first clamping portion can provide an elastic force towards the second clamping structure to the transistor when the transistor is inserted into the installation space, and press the transistor tightly against the second clamping structure. The second clamping portion is a rigid structure. When the transistor moves towards the first clamping portion, the second clamping portion can restrict the moving stroke of the transistor to prevent the first clamping portion from being plastically deformed or broken due to the extrusion of the transistor. Along the first direction, the first clamping structures of the two clamping portions are arranged adjacent to each other. At this time, the second clamping structures of the two clamping portions are arranged outside the two first clamping structures, or in other words, the two first clamping structures are arranged between the two second clamping structures in the first direction. In this way, during use and transportation, the second clamping structure can provide protection for the first clamping structure and prevent the first clamping structure from being plastically deformed or broken due to external influences.

[0041] Under the retention of the mounting assembly, the transistor is not likely to fall off the circuit board when the circuit board is flipped over, so the probability of damage to the transistor due to falling can be reduced. This can ensure the yield rate of the final product and also avoid the additional production cost caused by transistor damage. At the same time, this also provides convenience for the installation of the transistor and is conducive to improving the overall production efficiency of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] The above and / or additional aspects and advantages of the present application will become apparent and be readily understood from the following description of embodiments in conjunction with the accompanying drawings, where:

[0043] Figure 1 is a sectional view of the mounting assembly in some embodiments of the present application;

[0044] Figure 2 is an exploded view of the circuit board assembly in some embodiments of the present application;

[0045] Figure 3 is a sectional view of the circuit board assembly in some embodiments of the present application;

[0046] Figure 4 is Figure 2 An exploded view of the installation components in

[0047] Figure 5 is Figure 2 A schematic cross-sectional view of the installation components in

[0048] Figure 6 is Figure 5 An enlarged partial view of part A in

[0049] Figure 7 is a schematic diagram of the process of clamping the installation components onto the circuit board;

[0050] Figure 8 is a schematic diagram of the process of clamping the transistor onto the installation components;

[0051] Figure 9 is Figure 8 A schematic diagram of the structure after being installed in place;

[0052] Figure 10 is Figure 9 A schematic diagram of the structure after flipping;

[0053] Figure 11 is Figure 2 An isometric view of the assembled radiator and the frame in

[0054] Figure 12 is a flowchart of the processing method of the circuit board assembly in some embodiments of the present application;

[0055] Reference numerals: 1, connecting member; 11, connecting structure; 12, clamping portion; 121, first clamping structure; 1211, first clamping portion; 1212, second clamping portion; 122, second clamping structure; 123, clamping space; 13, first housing; 131, surrounding frame; 132, snap structure; 1321, first inclined surface; 133, first base portion; 14, second housing; 141, first through hole; 142, receiving groove; 143, third through hole; 144, protruding structure; 145, groove; 146, connecting hole; 1461, second inclined surface; 147, second base portion; 2, circuit board; 3, radiator; 31, gasket installation groove; 4, fastener; 5, transistor; 6, insulating heat-conducting gasket; 7, frame; 8, cover plate; 9, fastener gasket; 91, second through hole; X - first direction. Detailed implementation manners

[0056] Embodiments of the present invention will be described in detail below. Examples of the embodiments are shown in the accompanying drawings, where like or similar reference numerals denote like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the accompanying drawings are exemplary and are only used to explain the present invention and should not be construed as a limitation of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in this application without creative efforts fall within the scope of protection of this application.

[0057] With the booming development of the power supply industry, the application of transistors in power supplies has become increasingly widespread, and the operating power of transistors has also become larger and larger. The increase in the operating power of transistors means that the heat generated by the transistors also increases accordingly. If the heat generated by the transistors cannot be dissipated in time, it will cause the temperature of the internal environment of the device to rise, which will in turn affect the service life of other components inside the device. Therefore, existing transistors all need to be equipped with radiators. The radiator can transfer the heat dissipated by the transistors to the outside of the device through heat exchange with the medium outside the device, thereby reducing the temperature of the internal environment of the device. This is beneficial to extending the service life of the components inside the device and thus extending the service life of the entire device.

[0058] When installing a transistor, good fitting between the transistor and the radiator must be ensured to ensure that the heat dissipated by the transistor can be discharged well through the radiator. In order to ensure that the transistor will not be deformed by processes such as soldering during installation, currently, technicians usually first install the transistor on the circuit board, and then turn the circuit board together with the transistor and install it on the radiator. After ensuring good fitting between the transistor and the radiator, finally, the pins of the transistor are soldered to the circuit board. During this process, since the transistor is not fixed on the circuit board when it is turned over, the transistor is likely to fall off the circuit board when it is turned over. On the one hand, this is likely to damage the transistor, which will in turn affect the yield rate and production cost of the final product; on the other hand, it is also not convenient to install the transistor, which will in turn affect the overall production efficiency of the product.

[0059] In order to prevent the transistor from falling off the circuit board when it is turned over. An embodiment of the present invention provides a mounting assembly, which can pre-constrain the transistor on the circuit board to prevent the transistor from falling off the circuit board when the circuit board is turned over.

[0060] Reference can be made to Figures 1 to 5 . Specifically, the mounting assembly described in the embodiment of the present invention is used to be installed between the circuit board 2 and the radiator 3 of the device, and includes a connecting member 1. Reference can be made to Figure 1As shown, the connecting member 1 includes a connecting structure 11 and two clamping portions 12, and the two clamping portions 12 are arranged along the first direction X. The connecting structure 11 and the clamping portions 12 are respectively arranged on two opposite sides of the connecting member 1. Among them, the connecting structure 11 is used to connect with the circuit board 2, and the clamping portions 12 are used to clamp the transistor 5. In this embodiment, the connecting structure 11 may specifically be a snap structure or the like.

[0061] For reference Figure 1 As shown, the clamping portion 12 specifically includes a first clamping structure 121 and a second clamping structure 122 that are relatively spaced apart along the first direction X. The interval between the first clamping structure 121 and the second clamping structure 122 is the clamping space 123 for clamping the transistor 5. Along the direction in which the first clamping structure 121 and the second clamping structure 122 are relatively spaced apart, that is, along the first direction X, the first clamping structures 121 of the two clamping portions are arranged adjacent to each other. In other words, the two first clamping structures 121 are arranged between the two second clamping structures 122 in the first direction X. In this way, during use and transportation, the second clamping structure 122 can provide protection for the first clamping structure 121 and prevent the first clamping structure 121 from undergoing plastic deformation or breakage due to external influences.

[0062] The first clamping structure 121 includes a first clamping portion 1211 and a second clamping portion 1212. Among them, the first clamping portion 1211 can be made of an elastic material. When the transistor 5 is inserted into the clamping space 123, the first clamping portion 1211 is deformed by the extrusion of the transistor 5, and the end of the first clamping portion 1211 is displaced in a direction away from the second clamping structure 122, and provides an elastic reaction force to the transistor 5 to press the transistor 5 against the second clamping structure 122.

[0063] The second clamping portion 1212 is a rigid structure; in the direction in which the first clamping structure 121 and the second clamping structure 122 are relatively spaced apart, the first clamping portion 1211 is closer to the second clamping structure 122 than the second clamping portion 1212. The direction in which the first clamping structure 121 and the second clamping structure 122 are relatively spaced apart is Figure 5 the first direction X in Figure 1 and Figure 5As shown, L1 < L2. When the transistor 5 moves towards the first clamping portion 1211, the second clamping portion 1212 can restrict the moving stroke of the transistor 5 to prevent the first clamping portion 1211 from being plastically deformed or broken due to the extrusion of the transistor 5.

[0064] In some embodiments of the present invention, the first clamping portion 1211 is also a cantilever-like structure. The extending direction of this cantilever-like structure is set opposite to the main body of the connecting member 1, and the extending end has a raised convex bump. The second clamping structure 122 can be a plate-like structure extending in the same direction as the first clamping portion 1211. The second clamping structure 122 can be a plate-like structure spaced opposite to the first clamping structure 121. The clamping space 123 is the space between the first clamping structure 121 and the second clamping structure 122. When the transistor 5 is inserted into the clamping space 123, the transistor 5 first pushes open the first clamping portion 1211, causing the first clamping portion 1211 to undergo elastic deformation. The extending end of the first clamping portion 1211 moves in the direction away from the second clamping structure 122 to prevent the convex bump on the first clamping portion 1211 from interfering with the insertion of the transistor 5. After the transistor 5 is inserted in place, the convex bump on the first clamping portion 1211 provides an elastic reaction force towards the second clamping structure 122 to the transistor 5 and presses the transistor 5 tightly against the second clamping structure 122. Under the retention of the frictional force, the transistor 5 is fixedly installed in the clamping space 123.

[0065] During installation, reference can be made to Figure 7 , the mounting assembly can be movably connected to the circuit board 2 through the connecting structure 11. Reference can be made to Figure 8 and Figure 9 , the transistor 5 can be clamped in the clamping space 123 of the mounting assembly. Reference can be made to Figure 10 , under the retention of the mounting assembly, when the transistor 5 is flipped together with the circuit board 2, it is not easy to fall off the circuit board 2, so the probability of damage to the transistor 5 due to falling can be reduced. This can ensure the yield rate of the final product and also avoid the additional production cost caused by the damage of the transistor 5. At the same time, this also provides convenience for the installation of the transistor 5, which is beneficial to improving the overall production efficiency of the product.

[0066] In the direction in which the first clamping structure 121 and the second clamping structure 122 are oppositely and spaced apart, that is, along the first direction X, the first clamping portion 1211 is closer to the second clamping structure 122 than the second clamping portion 1212. Since the second clamping portion 1212 is a rigid structure, when the transistor 5 is installed, the movement of the transistor 5 toward the first clamping portion 1211 is easily interfered by the second clamping portion 1212, so that the first clamping portion 1211 cannot swing too much. This can avoid plastic deformation or even fracture of the first clamping portion 1211 due to excessive yaw, thereby ensuring the reliability of the clamping connection between the mounting component and the transistor 5. In order to ensure the rigidity and structural strength of the second clamping portion 1212, in some embodiments of the present invention, a rib plate extends from a side of the second clamping portion 1212 facing away from the second clamping structure 122.

[0067] Reference can be made to Figure 4 、 Figure 5 , in some embodiments of the present invention, the connecting member 1 includes a first housing 13 and a second housing 14 that are fixedly connected to each other. In other words, the connecting member 1 is formed by split molding. The first housing 13 and the second housing 14 can be fixedly connected by means of structural cooperation, screws, bolts, rivet fixing, gluing, etc. The connecting member 1 is formed by split molding, which can reduce the processing difficulty of the connecting member 1, and thus reduce the processing cost of the connecting member 1. Of course, in some embodiments, the connecting member 1 can also be formed by integral molding.

[0068] Reference can be made to Figure 4 、 Figure 5 , in some embodiments of the present invention, the first housing 13 specifically includes a first base portion 133, a first clamping portion 1211, and a connecting structure 11. The first base portion 133 is a structure on the first housing 13 that provides a setting basis for structures such as the first clamping portion 1211 and the connecting structure 11. In order to save installation space and prevent the distance between the circuit board 2 and the radiator 3 from being too large, the first base portion 133 can be a flat plate-like structure. This can also reduce the processing difficulty and processing cost of the first housing 13. The connecting structure 11 is fixed on a side of the first base portion 133 facing away from the second housing 14 for connection with the circuit board 2. The first clamping portion 1211 is provided on a side of the first base portion 133 facing the second housing 14.

[0069] The second housing 14 specifically includes a second base portion 147, a second clamping structure 122, and a second clamping portion 1212. The second base portion 147 is the structure on the second housing 14 that provides a setting basis for the second clamping structure 122. There is a first through hole 141 provided on the second base portion 147 of the first base portion 133 second base portion 147. The first through hole 141 may specifically be a rectangular through hole, and its position on the second base portion 147 corresponds to the position of the first clamping portion 1211 on the first housing 13 and extends through in the thickness direction of the second base portion 147. The second clamping structure 122 is specifically a plate-like structure, which is provided at the end of the second base portion 147 and extends in the same direction as the first clamping portion 1211. In other words, a plate-like structure extending away from the first housing 13 is provided at the end of the second base portion 147, and this plate-like structure is the second clamping structure 122 on the second housing 14.

[0070] After the second housing 14 is fixedly connected to the first housing 13, the first clamping portion 1211 is inserted into the first through hole 141, and the extending end of the first clamping portion 1211 extends out of the first through hole 141. At this time, there is a relatively large gap between the second clamping structure 122 and the part of the first clamping portion 1211 extending out of the first through hole 141, and this gap is the clamping space 123 on the mounting assembly described in the embodiment of the present invention for fixedly mounting the transistor 5. Since the first clamping portion 1211 and the second clamping structure 122 are respectively provided on the first housing 13 and the second housing 14, the first clamping portion 1211 and the second clamping structure 122 can be separately processed and formed during processing. This reduces the processing difficulty of the first clamping portion 1211 and the second clamping structure 122, and is also more conducive to ensuring the dimensional accuracy and structural strength of the first clamping portion 1211 and the second clamping structure 122.

[0071] In some embodiments of the present invention, the first base 133 is specifically a rectangular plate-like structure, that is, the projection of the first base 133 in its thickness direction is a rectangle, and the length direction of the rectangle is arranged along the direction in which the first clamping structure 121 and the second clamping structure 122 are oppositely and spaced apart. There are two pairs of first clamping portions 1211, which are respectively arranged at the middle positions of the two side edges of the first base 133 in the width direction. The two first clamping portions 1211 in the same pair are spaced apart along the length direction of the first base 133, and the protruding directions of the convex hulls are opposite to each other. The first clamping portion 1211 extends along the thickness direction of the first base 133. Correspondingly, the second base 147 is also a rectangular plate-like structure, that is, the projection of the second base 147 in its thickness direction is also a rectangle, and the length direction of the rectangle is arranged along the direction in which the first clamping structure 121 and the second clamping structure 122 are oppositely and spaced apart. Reinforcing ribs can be provided on the side of the second base 147 facing away from the first housing 13 to ensure the structural strength of the second base 147. Four first through holes 141 corresponding to the first clamping portions 1211 are provided on the second base 147, and plate-like structures connected to each other extend along the thickness direction of the four side edges of the second base 147. The two plate-like structures of the second base 147 in the length direction serve as the second clamping structure 122 and respectively form a clamping space 123 with two adjacent first clamping portions 1211, so that the mounting assembly has two clamping spaces 123 for clamping the transistor 5. A relief notch is provided in a plate-like structure of the second base 147 in the width direction to avoid the pins of the transistor 5.

[0072] In some embodiments of the present invention, the other structures on the first housing 13 and the second housing 14 are basically symmetrically designed. That is, the two pairs of first clamping portions 1211 are symmetrically arranged with respect to the central plane of the first base 133 in the width direction, and any pair of first clamping portions 1211 is symmetrically arranged with respect to the central plane of the first base 133 in the length direction. The four first through holes 141 on the second base 147 corresponding to the first clamping portions 1211 are symmetrically arranged with respect to the central plane of the second base 147 in the width direction, and each symmetric side has two first through holes 141. The two first through holes 141 on any symmetric side are symmetrically arranged with respect to the central plane of the second base 147 in the length direction. The relief notch is symmetrically arranged with respect to the central plane of the second base 147 in the length direction. This can facilitate the processing of the first housing 13 and the second housing 14, and thus improve the processing efficiency.

[0073] The mounting assembly based on the above structure has good adaptability to the transistor 5. For example, for the mounting assembly adapted to the TO247 transistor 5, the above structure can be compatible with the installation of TO247 transistors 5 with or without holes, plastic encapsulation, semi-plastic encapsulation, two-legged, three-legged, four-legged tubes, etc.

[0074] For reference Figure 4 、 Figure 5 In some embodiments of the present invention, the mounting assembly includes a fastener 4, and the fastener 4 can fixedly mount the second housing 14 on the radiator 3. The fastener 4 can be a screw, a bolt, a rivet, etc. For example, when the fastener 4 is a screw, the screw head of the screw can be pressed against the second housing 14, and the threaded part of the screw can be screwed into the threaded hole of the radiator 3. By tightening the screw, the second housing 14 can be fixed on the surface of the radiator 3.

[0075] For reference Figure 4 、 Figure 5 In some embodiments of the present invention, the mounting assembly further includes a fastener gasket 9. During installation, the transistor 5 is snap-fitted onto the mounting assembly, and the mounting assembly is snap-fitted onto the circuit board 2. Then, the transistor 5 and the mounting assembly are flipped together with the circuit board 2 and placed on the radiator 3. The fastener gasket 9 of the mounting assembly is fixedly mounted on the radiator 3 through fasteners 4 such as screws, bolts, and rivets. At this time, the fastener gasket 9 can be pressed against the second housing 14, and the second housing 14 can be made as close as possible to the radiator 3, thereby pressing the transistor 5 as tightly as possible against the radiator 3. This can ensure that the transistor 5 can be as closely attached to the radiator 3 as possible, and further ensure that the heat dissipated by the transistor 5 can be well transferred to the radiator 3. The provision of the fastener gasket 9 can disperse the pressing force applied by the fastener 4 to the second housing 14, preventing local crushing of the second housing 14; at the same time, it can also ensure that the pressing force applied by the fastener 4 to the second housing 14 acts uniformly on the second housing 14, preventing the second housing 14 from warping due to excessive local stress.

[0076] For reference Figure 4 、 Figure 5 In some embodiments of the present invention, the second housing 14 includes a receiving groove 142. The fastener gasket 9 is disposed in the receiving groove 142, and a third through hole 143 for the fastener 4 to pass through is formed in the bottom of the receiving groove 142. A second through hole 91 is correspondingly formed on the fastener gasket 9. During installation, the fastener gasket 9 can be fixedly connected to the radiator 3 through fasteners 4 such as screws, bolts, and rivets, and the fastener gasket 9 is pressed against the second housing 14. The fastener gasket 9 is installed in the receiving groove 142 of the second housing 14, which can avoid the fastener gasket 9 occupying the space outside the second housing 14. Therefore, it is beneficial to the miniaturized design of the mounting assembly, can save the installation space, and avoid an excessive distance between the circuit board 2 and the radiator 3.

[0077] In some embodiments of the present invention, the receiving groove 142 is specifically provided at the center of the second base 147 of the second housing 14, and the notch of the receiving groove 142 is arranged toward the first housing 13. A circular third through hole 143 is provided on the bottom of the receiving groove 142, and the extension direction of the third through hole 143 is consistent with the depth direction of the receiving groove 142. After the fastener gasket 9 is installed in the receiving groove 142, the fastener gasket 9 is fastened and installed on the radiator 3 by means of screws. At this time, the screw head of the screw is pressed against the fastener gasket 9, the nail body portion of the screw passes through the third through hole 143, and the threaded portion of the screw is screwed into the screw hole on the radiator 3.

[0078] For reference Figure 4 , Figure 5 In some embodiments of the present invention, the fastener gasket 9 may be an elastic gasket, which is a straight structure. Correspondingly, a protruding structure 144 is provided at the bottom of the receiving groove 142. The fastener gasket 9 may be a rectangular sheet structure, and a second through hole 91 is provided at its center for the fastener 4 to pass through. The groove shape of the receiving groove 142 is also rectangular, that is, the cross-sectional projection of the receiving groove 142 in its depth direction is a rectangle. The protruding structure 144 is a long strip structure protruding on the bottom of the receiving groove 142, and its length direction is preferably arranged along the width direction of the receiving groove 142. During installation, the fastener gasket 9 is placed in the receiving groove 142, and the two end sections of the fastener gasket 9 are in contact with the protruding structure 144 respectively. The protruding structure 144 supports the fastener gasket 9 and arranges the fastener gasket 9 and the bottom of the receiving groove 142 at intervals. The fastener 4 passes through the second through hole 91 and the third through hole 143 on the bottom of the receiving groove 142 and is fixed on the heat sink 3 so that the two end sections of the fastener gasket 9 are pressed against the raised structure 144. At this time, the fastener gasket 9 is bent and deformed toward the bottom of the receiving groove 142, and provides an elastic force along the axial direction of the fastener 4 to the fastener 4 to prevent the fastener 4 from loosening. No matter how the fastener gasket 9 is deformed, the part of the second shell 14 that bears the pressing force is always the raised structure 144. In other words, this can ensure that the force point on the second shell 14 that bears the pressing force remains unchanged, and the transistor 5 installed on the mounting assembly will not be warped due to the change in the position of the force point, thereby ensuring that the transistor 5 and the heat sink 3 always have a good fit relationship. In some embodiments described in the present invention, the fastener gasket 9 can also use an arched spring. The arched spring has a straight middle section and two end sections that are tilted relative to the middle section. During installation, the end section of the arched spring piece is directly pressed against the bottom of the receiving groove 142, and the middle section is connected to the radiator 3 through the fastener 4. Alternatively, the fastener gasket 9 can also use a rigid gasket.

[0079] For reference Figure 4 , Figure 5, in some embodiments of the present invention, a surrounding frame 131 is provided on one side of the first housing 13 facing the second housing 14, and the surrounding frame 131 protrudes in the direction facing the second housing 14. A groove 145 is provided on one side of the second housing 14 facing the first housing 13, and the depth direction of the groove is arranged in the same direction as the protruding direction of the surrounding frame. During installation, the surrounding frame 131 is inserted and fitted with the groove 145. This increases the creepage distance between the transistor 5 and the circuit board 2. At the same time, the design of the surrounding frame 131 also increases the structural strength of the first housing 13. To meet the safety distance requirements, in the prior art, a no-placement area is generally provided on the circuit board 2 corresponding to the position of the transistor 5. That is, on the circuit board 2, no devices or connections are allowed in this area. This will cause the circuit board 2 to have to be designed larger, resulting in a larger occupied space and production cost of the circuit board 2. The prior art also adds insulating paper between the transistor 5 and the circuit board 2, but this will increase the workload of installing the transistor 5 and is not conducive to improving the assembly efficiency. By providing the surrounding frame 131 on the first housing 13 and the groove 145 on the second housing 14, and inserting the surrounding frame 131 into the groove 145, this design can, on the one hand, avoid setting a no-placement area on the circuit board 2, which is beneficial to reducing the occupied space and production cost of the circuit board 2; on the other hand, it can also avoid setting insulating paper between the transistor 5 and the circuit board 2, simplifying the assembly process of installing the transistor 5 and improving the installation efficiency of the transistor 5.

[0080] for reference Figure 4 , Figure 5, in some embodiments of the present invention, a buckle structure 132 is provided on the first housing 13, and a connection hole 146 is provided on the second housing 14. The buckle structure 132 is snap-fitted with the connection hole 146 to achieve the fixed connection between the first housing 13 and the second housing 14. The buckle structure 132 is a cantilever-like structure. This cantilever-like structure extends towards the second housing 14, and a raised convex is provided at the end of the extension. The connection hole 146 is provided on the second base 147 of the second housing 14, and specifically, it can be a rectangular through-hole. The through direction of the connection hole 146 is arranged along the thickness direction of the second base 147. During installation, the buckle structure 132 can extend into the connection hole 146. During this process, the buckle structure 132 deforms, and the end of its extension displaces to avoid interference between the convex on the buckle structure 132 and the edge of the connection hole 146. After being installed in place, the buckle structure 132 resets, and the convex at the end of its extension is stuck at the edge of the connection hole 146 facing away from the radiator 3. Under the fixation of the buckle structure 132, the first housing 13 cannot be separated from the second housing 14 in the direction away from the second housing 14, and under the interference between the first base 133 and the second base 147, the first housing 13 cannot move towards the second housing 14 either. In other words, the first housing 13 is fixed on the second housing 14. When the second housing 14 and the radiator 3 are fixedly connected by the fastener 4, the first housing 13 is synchronously fixed on the radiator 3.

[0081] for reference Figure 6 , in some embodiments of the present invention, a first inclined surface 1321 is provided on the buckle structure 132, and a second inclined surface 1461 is provided at the edge of the connection hole 146. The inclination directions of both the first inclined surface 1321 and the second inclined surface 1461 are arranged at an acute angle with the extension direction of the buckle structure 132. The first inclined surface 1321 and the second inclined surface 1461 can be in contact when the buckle structure 132 is snap-connected to the connection hole 146 and guide the elastic deformation of the buckle structure 132. Specifically, the first inclined surface 1321 is provided on the raised convex of the buckle structure 132. When the buckle structure 132 is inserted into the connection hole 146, the first inclined surface 1321 is pressed against the second inclined surface 1461. At this time, the reaction force exerted by the second inclined surface 1461 on the first inclined surface 1321 can drive the elastic deformation of the buckle structure 132 to avoid interference with the edge of the connection hole 146. After the buckle structure 132 is inserted in place, the buckle structure 132 resets, and the raised convex on it stops at the edge of the connection hole 146 facing away from the insertion direction of the buckle structure 132.

[0082] Second aspect, an embodiment of the present invention provides a circuit board assembly, which includes any one of the installation components described above. Specifically, the circuit board assembly includes a circuit board 2 and an installation component, and the installation component is movably connected to the circuit board 2 through a connection structure 11. A clamping space 123 on the installation component can be used to install a transistor 5, so that when assembling the circuit board assembly, the transistor 5 will not fall off as the circuit board 2 is flipped. Reference can be made to Figure 2 and Figure 11 , the circuit board assembly can be installed in a housing 7, and the side of the housing 7 facing away from the heat sink 3 is closed by a cover plate 8. The side of the housing 7 facing the heat sink 3 has an opening to facilitate heat exchange between the heat sink 3 and the transistor 5. The housing can be fixedly installed on the heat sink through structures such as screws, bolts, and rivets. During installation, a sealing strip can be used to seal between the surfaces of the housing in contact with the heat sink to achieve the purpose of dust and water protection. The sealing level can preferably be IP65 or IP55.

[0083] In some embodiments of the present invention, the circuit board assembly includes a heat sink 3, a transistor 5, and an insulating heat-conducting gasket 6. Among them, the heat sink 3 is specifically a metal structure, and a plurality of fins are provided on the side of the heat sink 3 facing away from the circuit board 2. The heat sink 3 is fixedly connected to the connecting member 1 through a fastener 4. The transistor 5 is clamped in the clamping space 123, and the insulating heat-conducting gasket 6 is sandwiched between the heat sink 3 and the transistor 5. The insulating heat-conducting gasket 6 can specifically adopt a ceramic gasket. In this way, after the circuit board assembly is assembled, while ensuring the heat conduction ability between the transistor 5 and the heat sink 3, good insulation protection effect is also achieved.

[0084] Reference can be made to Figure 2 and Figure 11 , in some embodiments of the present invention, a gasket installation groove 31 is provided on the side of the heat sink 3 facing the installation component, and the insulating heat-conducting gasket 6 is fixedly installed in the gasket installation groove 31. This can provide good positioning for the insulating heat-conducting gasket 6, avoid the displacement of the insulating heat-conducting gasket 6 during assembly, and thus greatly improve the production efficiency and yield rate of the product. At the same time, since the insulating heat-conducting gasket 6 can be well maintained between the transistor 5 and the heat sink 3, it is not easy to generate arc short circuit between the transistor 5 and the heat sink 3.

[0085] During installation, first movably clamp the installation component on the circuit board 2, and then clamp the transistor 5 in the clamping space 123 of the installation component. Subsequently, flip the circuit board 2 so that the side of the circuit board 2 with the transistor installed faces the heat sink 3, and fix and install the circuit board in the housing 7 through screws, etc. Since the installation component is movably clamped on the circuit board 2, the position of the installation component can be adjusted to make the transistor 5 clamped on the installation component fit the heat sink as much as possible. Finally, install the installation component on the heat sink 3 through the fastener 4, and cover the cover plate 8 on the housing 7 to complete the installation.

[0086] In a third aspect, an embodiment of the present invention provides an electronic device, which includes a circuit board assembly of any one of the above. The electronic device may specifically be a power device, a control device, or even consumer electronic products such as a laptop computer or a digital camera.

[0087] In a fourth aspect, an embodiment of the present invention provides a method for processing a circuit board assembly. The circuit board assembly includes a circuit board, a transistor, and an installation assembly of any one of the above. Refer to Figure 12 as shown, the method includes the following steps:

[0088] S100: When one side of the circuit board having pads is close to the ground, use the installation assembly to fixedly connect the transistor to the side of the circuit board having pads, wherein the transistor is snap-fitted and fixed within the snap-fitting space;

[0089] Specifically, when processing the circuit board assembly, the circuit board can be placed on a tray tooling to ensure the stability of the circuit board. The side of the circuit board where other electronic components are arranged faces the tray tooling. The installation assembly is installed on the side of the circuit board having pads through a connection structure, and the transistor is snap-fitted and fixed within the snap-fitting space of the installation structure.

[0090] S200: When the side of the circuit board having pads is flipped and away from the ground, perform soldering and fixing on the transistor.

[0091] In this process, since the transistor has been pre-installed on the circuit board through the installation assembly, the transistor will not fall off the circuit board during the process of flipping and transferring with the circuit board. This can avoid damage to the transistor, thereby improving the yield rate of the product; at the same time, it is also convenient for operation and can effectively improve production efficiency. Since the installation assembly is provided with a second clamping portion. When installing the transistor, the movement of the transistor towards the first clamping portion of the installation assembly is easily interfered by the second clamping portion, so the first clamping portion cannot swing too much. This can avoid the risk of plastic deformation or even fracture of the first clamping portion due to excessive swing, thereby ensuring the reliability of the installation assembly for clamping and restraining the transistor.

[0092] At the same time, the first housing of the installation assembly is provided with a surrounding frame; the second housing is provided with a groove, and the surrounding frame and the groove are inserted and matched to increase the creepage distance between the transistor and the circuit board. In this way, while meeting the safety distance requirements, it is possible to avoid setting a prohibited layout area at the position of the circuit board corresponding to the transistor, which is beneficial to realizing the miniaturization design of the circuit board. This can also avoid adding an insulating paper between the transistor and the circuit board, simplifying the production process of the circuit board assembly and improving the production efficiency of the circuit board assembly.

[0093] In some embodiments of the present invention, in step S100, the transistor is fixedly connected to the side of the circuit board having pads by using the mounting component, which may specifically include:

[0094] S101: Connect the circuit board to the mounting component;

[0095] S102: Snap-fit and fix the transistor in the snap-fitting space;

[0096] When the transistor is snap-fitted, it is necessary to pre-bend the pins of the transistor by using a bending tooling. This can ensure that after the transistor is snap-fitted in the snap-fitting space, the solder feet of the transistor can extend to the corresponding pad positions on the circuit board. The bending tooling can specifically be a steel sheet. When bending, the steel sheet is placed at the root of the pins of the transistor, and then a force is applied to the end of the pins of the transistor to bend the pins according to a predetermined scheme. The bending tooling can prevent the stress during pin bending from being transmitted to the body of the transistor, thereby avoiding damage to the body of the transistor due to stress. When snap-fitting the transistor, the operator needs to wear an anti-static bracelet or anti-static clothing, insert the pins of the transistor into the corresponding pads on the circuit board, and fixedly snap-fit the body of the transistor in the snap-fitting space of the mounting component. Since the mounting component has been pre-mounted on the circuit board, when installing the transistor, the operator only needs to align the pins of the transistor with the corresponding pads on the circuit board. This reduces the structures that need to be aligned between the circuit board and the transistor during transistor installation and can effectively improve the installation efficiency of transistor installation.

[0097] Alternatively, in step S100, the transistor is fixedly connected to the side of the circuit board having pads by using the mounting component, which may specifically include:

[0098] S101: Snap-fit and fix the transistor in the snap-fitting space;

[0099] S102: Connect the circuit board to the mounting component.

[0100] In some embodiments of the present invention, the circuit board assembly further includes a heat sink. On this basis, in the foregoing step S200, when turning over the side of the circuit board having pads and moving it away from the ground, and performing welding and fixing on the transistor, it may specifically further include:

[0101] S201: Remove dust from the gasket mounting groove on the heat sink and apply thermal grease to the bottom of the gasket mounting groove;

[0102] In this process, a blow gun can be used to blow air into the gasket mounting groove to discharge dust and other debris from the gasket mounting groove; then a lint-free cloth and alcohol are used to wipe the inside of the gasket mounting groove to further improve the dust removal effect.

[0103] S202: Install an insulating and heat-conducting gasket in the gasket installation groove;

[0104] Preferably, a ceramic gasket is selected as the insulating and heat-conducting gasket. The design of the insulating and heat-conducting gasket is beneficial to improving the heat transfer efficiency between the transistor and the radiator, and at the same time realizes the insulation protection between the transistor and the radiator. Applying thermal grease can fill the air gap between the insulating and heat-conducting gasket and the bottom of the gasket installation groove, preventing the thermal conductivity between the insulating and heat-conducting gasket and the radiator from being affected by this air gap.

[0105] S203: Flip the side of the circuit board with pads away from the ground, fixedly install the installation component on the radiator through fasteners, and press the transistor against the insulating and heat-conducting gasket;

[0106] After the circuit board is fixedly installed on the frame, the position of the installation component can be adjusted so that the transistor can fully fit with the radiator. After the adjustment is in place, the installation component can be fixedly installed on the radiator through connecting parts such as screws, bolts, and rivets. Under the action of connecting parts such as screws, bolts, and rivets, the installation component is pressed against the radiator, and the transistor mounted on the installation component can fit as closely as possible with the insulating and heat-conducting gasket on the radiator. This can improve the heat transfer efficiency between the radiator and the transistor, and thus ensure that the transistor can be well cooled during operation.

[0107] The installation component has a fastener gasket. The protruding structure on the installation component supports the fastener gasket and makes a spaced arrangement between the fastener gasket and the bottom of the receiving groove of the second housing. The fastener passes through the fastener gasket and is fixed to the radiator 3 with the second housing, so that the two end segments of the fastener gasket are pressed against the protruding structure. At this time, the fastener gasket undergoes a bending deformation towards the bottom of the receiving groove and provides an elastic force along the axial direction of the fastener to the fastener to prevent the fastener from loosening. No matter how the fastener gasket deforms, the part of the pressing force borne by the second housing is always the protruding structure. In other words, this can ensure that the force application point for the pressing force on the second housing remains unchanged, and the transistor mounted on the installation component will not warp due to the change in the force application point position, and thus ensure that the transistor and the radiator always have a good fitting relationship.

[0108] S204: Weld and fix the pins of the transistor on the pads of the circuit board;

[0109] During this process, since the installation component has been pre-fixed to the radiator, the fitting effect between the transistor and the radiator will not be affected during the welding of the transistor.

[0110] In some embodiments of the present invention, the distance between the edge of the area coated with thermal grease on the bottom of the gasket mounting groove and the groove wall of the gasket mounting groove is a, and the thickness of the thermal grease is b, where 70b ≥ a ≥ 5b. a ≥ 5b can ensure that there is enough clearance between the edge of the area coated with thermal grease on the bottom of the gasket mounting groove and the groove wall of the gasket mounting groove to prevent the relevant fixture from scraping the already applied thermal grease when installing the insulating thermal sheet. 70b ≥ a can prevent the excessive distance from affecting the area of the region coated with thermal grease on the bottom of the gasket mounting groove, thereby ensuring that there is sufficient thermal grease between the insulating thermal gasket and the gasket mounting groove.

[0111] Specifically, the thickness of the thermal grease applied on the bottom of the gasket mounting groove is 0.03 mm to 0.2 mm, and the distance between the edge of the area coated with the thermal grease on the bottom of the gasket mounting groove and the groove wall of the gasket mounting groove is 1 mm to 2 mm.

[0112] The thickness of the thermal grease in the gasket mounting groove is maintained between 0.03 mm and 0.2 mm. When it is too thick, the thermal grease will affect the thermal conductivity between the insulating thermal gasket and the radiator. When it is too thin, the thermal grease cannot completely fill the air gap between the insulating thermal gasket and the bottom of the gasket mounting groove. There is a 1 mm to 2 mm clearance between the thermal grease and the groove wall of the gasket mounting groove to prevent the clamping tool for clamping the insulating thermal gasket from scraping the thermal grease when the insulating thermal gasket is inserted into the gasket mounting groove. To achieve the above effects, a coating jig can be used to assist in the application of the thermal grease. The coating jig can specifically be a sheet-like structure, and a plurality of through holes are provided on the sheet body of the sheet-like structure. When applying the thermal grease, first place the coating jig in the gasket mounting groove, and then directly apply the thermal grease on the coating jig. At this time, part of the thermal grease can be applied on the bottom of the gasket mounting groove through the through holes on the coating jig. The thickness of the coating jig is also maintained between 0.03 and 0.2 millimeters, and there is a 1 mm to 2 mm clearance between the edge of the coating jig and the groove wall of the gasket mounting groove.

[0113] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the technical field to which this application belongs; the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0114] The features of the terms "first" and "second" in the specification and claims of this application may explicitly or implicitly include one or at least two of such features. In the description of the present invention, unless otherwise stated, "at least two" means two or more. In addition, "and / or" in the specification and claims means at least one of the connected objects, and the character " / " generally indicates an "or" relationship between the associated objects before and after.

[0115] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "left", "right", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present invention.

[0116] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "mounted", "connected" and "coupled" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection or an integral connection; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

[0117] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples" or "some examples", etc. means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in a suitable manner in any one or at least two embodiments or examples.

[0118] Although the embodiments of the present invention have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present invention.

Claims

1. A mounting assembly, for mounting between a circuit board (2) and a heat sink (3), characterized in that: It comprises a connecting piece (1); The connecting member (1) comprises a connecting structure (11) and two clamping portions (12), wherein the two clamping portions (12) are arranged along a first direction (X); The connecting structure (11) and the clamping portion (12) are respectively arranged on two sides of the connecting member (1) that are away from each other, and the connecting structure (11) is used to be connected to the circuit board (2); The clamping portion (12) comprises a first clamping structure (121) and a second clamping structure (122) which are arranged relatively spaced apart along the first direction (X); a clamping space (123) is formed between the first clamping structure (121) and the second clamping structure (122), the clamping space being used to clamp a transistor (5); along the first direction (X), the first clamping structures (121) of the two clamping portions (12) are arranged adjacent to each other; the first clamping structure (121) comprises a first clamping portion (1211) and a second clamping portion (1212), the first clamping portion (1211) being used to press the transistor (5) against the second clamping structure (122) when the transistor (5) is clamped into the clamping space (123); The second clamping portion (1212) is a rigid structure; in one of the clamping portions (12), along the first direction (X), the first clamping portion (1211) is closer to the side of the second clamping structure (122) located in the clamping space (123) than the second clamping portion (1212).

2. The mounting assembly according to claim 1, characterized in that: The connecting member (1) comprises a first shell (13) and a second shell (14), and the first shell (13) and the second shell (14) are fixedly connected.

3. The mounting assembly according to claim 2, characterized in that: The first clamping portion (1211) is arranged on the first shell (13), and the second clamping structure (122) and the second clamping portion (1212) are arranged on the second shell (14); the second shell (14) is provided with the first through hole (141), and the first clamping portion (1211) is inserted into the first through hole (141).

4. The mounting assembly according to claim 2, characterized in that: The mounting assembly comprises a fastener (4), and the fastener (4) is used to fix the second shell (14) on the radiator (3).

5. The mounting assembly according to claim 4, characterized in that: The mounting assembly includes a fastener gasket (9); The fastener gasket (9) is provided with a second through hole (91), and the fastener (4) passes through the second through hole (91) and presses the fastener gasket (9) onto the second shell (14).

6. The mounting assembly according to claim 5, characterized in that: The second housing (14) comprises a receiving groove (142); The fastener gasket (9) is arranged in the receiving groove (142), a third through hole (143) is provided at the bottom of the receiving groove (142), and the fastener (4) passes through the second through hole (91) and the third through hole (143).

7. The mounting assembly according to claim 6, characterized in that: The fastener gasket (9) is an elastic gasket, and the fastener gasket (9) is a straight structure; the bottom of the receiving groove (142) has a protruding structure (144), and the protruding structure (144) is in contact with the fastener gasket (9), so that the fastener gasket (9) and the bottom of the receiving groove (142) are arranged at a distance.

8. The mounting assembly according to any one of claims 2 to 7, characterized in that: The first shell (13) is provided with a surrounding frame (131), and the surrounding frame (131) protrudes in a direction toward the second shell (14); the second shell (14) is provided with a groove (145), and the depth direction of the groove (145) is in the same direction as the protruding direction of the surrounding frame (131); the surrounding frame (131) and the groove (145) are plug-fitted.

9. The mounting assembly according to any one of claims 2 to 7, characterized in that: The first shell (13) is provided with a buckle structure (132), and the second shell (14) is provided with a connecting hole (146), and the buckle structure (132) is snap-fitted with the connecting hole (146).

10. The mounting assembly according to claim 9, characterized in that: The buckle structure (132) is provided with a first inclined surface (1321), and the edge of the connecting hole (146) is provided with a second inclined surface (1461), and the inclination direction of the first inclined surface (1321) and the inclination direction of the second inclined surface (1461) are both arranged at an acute angle to the extension direction of the buckle structure (132).

11. A circuit board assembly, characterized in that: The circuit board assembly comprises the mounting assembly according to any one of claims 1-10.

12. The circuit board assembly according to claim 11, characterized in that: The circuit board assembly comprises a heat sink (3), a transistor (5) and an insulating thermally conductive pad (6); The heat sink (3) is fixedly connected to the connecting member (1), the transistor (5) is clamped in the clamping space (123), and the insulating thermally conductive gasket (6) is sandwiched between the heat sink (3) and the transistor (5).

13. The circuit board assembly according to claim 12, characterized in that: A gasket installation groove (31) is provided on one side of the heat sink (3) facing the installation assembly, and the insulating heat-conducting gasket (6) is installed in the gasket installation groove (31).

14. An electronic device, characterized in that: The electronic device comprises the circuit board assembly according to any one of claims 11-13.

15. A circuit board assembly processing method, characterized in that: The circuit board assembly comprises a circuit board, a transistor and a mounting assembly according to any one of claims 1 to 10, and the method comprises: When the side of the circuit board with the pad is close to the ground, the transistor is fixedly connected to the side of the circuit board with the pad by using the mounting assembly, wherein the transistor is fixed in the mounting space by clamping; When the side of the circuit board with the solder pad is turned over and away from the ground, the transistor is soldered and fixed.

16. The circuit board assembly processing method according to claim 15, characterized in that: The method of using the mounting assembly to fix the transistor to a side of the circuit board having a pad includes: Firstly, the circuit board and the mounting assembly are connected, and then the transistor is clamped and fixed in the clamping space; or, Firstly, the transistor is clamped and fixed in the clamping space, and then the circuit board and the mounting assembly are connected.

17. The circuit board assembly processing method according to claim 15, characterized in that: The circuit board assembly also includes a heat sink; when the side of the circuit board with the pad is turned over and away from the ground, the transistor is welded and fixed, including: Dust removal is performed on the gasket installation groove on the heat sink, and thermal conductive silicone grease is applied to the bottom of the gasket installation groove; Installing an insulating thermally conductive gasket in the gasket installation groove; Turn the side of the circuit board with the solder pad over and away from the ground, fix the mounting assembly on the heat sink by fasteners, and make the transistor stick to the insulating thermal pad; The pins of the transistor are welded and fixed on the pads of the circuit board.

18. The circuit board assembly processing method according to claim 17, characterized in that: The distance between the edge of the area on the bottom of the gasket installation groove where the thermal conductive silicone grease is applied and the groove wall of the gasket installation groove is a, the thickness of the thermal conductive silicone grease is b, and 70b≥a≥5b.

Images