High-flatness circuit board and manufacturing method
By introducing glass structures into the structure of organic materials and designing high-flatness circuit boards, the problems of environmental pollution and large heat energy consumption of existing circuit board processes are solved, and higher flatness and lower environmental impact are achieved.
Patent Information
- Application Number
- CN202510381929.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-28
- Publication Date
- 2025-06-20
AI Technical Summary
The existing circuit board production process requires multiple chemical copper deposition and electroplating processes, which leads to a long time and severe environmental pollution, and the compressing process takes a long time and consumes a lot of heat energy.
By introducing a glass structure into the structure of the organic material, a high-flatness circuit board is designed, including a first line support layer, a second line support layer and a line layer, and the circuit layer is connected by conducting holes and conductive paste to reduce the use of chemical copper deposition and electroplating processes.
It has achieved the improvement of the flatness of the circuit board, reduced the CTE (thermal expansion coefficient) of the circuit board, reduced warping, and reduced the use of chemical processes, reducing environmental pollution and thermal energy consumption.
Smart Images
Figure CN120186873A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to a high flatness circuit board and a manufacturing method thereof, belonging to the technical field of circuit board manufacturing. Background Art
[0002] At present, for high multi-layer circuits, any interconnection or HDI technology requires a lamination process, multiple electroless copper plating and electroplating processes. This process takes a long time and inevitably pollutes the environment. If lamination is required, heat energy can be saved. If chemical PTH and electroplating are not carried out, the discharge of chemical solutions can be reduced to lower water pollution. Summary of the Invention
[0003] The purpose of the present invention is to provide a high flatness circuit board and a manufacturing method thereof. By introducing a glass structure into the structure of the organic material, the flatness of the circuit board is enhanced and the warping of the circuit board is reduced.
[0004] To achieve the above object / to solve the above technical problem, the present invention is implemented by the following technical solutions.
[0005] On the one hand, the present invention provides a high flatness circuit board, including: a first circuit support layer, a second circuit support layer and a circuit layer; Circuit layers are provided on the upper and lower surfaces of the first circuit support layer. The first circuit support layer is provided with through holes penetrating the upper and lower surfaces, and the through holes are filled with a conductive paste connecting the circuit layers on the upper and lower surfaces; At least one layer of the second circuit support layer is connected to the upper and lower surfaces of the first circuit support layer. On the surface of each second circuit support layer away from the first circuit support layer, a circuit layer is provided. The second circuit support layer is provided with through holes penetrating the upper and lower surfaces, and the through holes are filled with a conductive paste connecting the upper and lower circuit layers.
[0006] Further, the first circuit support layer is made of a glass layer or ceramics, and the second circuit support layer is made of an organic colloid layer.
[0007] Further, a plurality of alignment identification holes are provided in the first circuit support layer, and the alignment identification holes are arranged around the first circuit support layer.
[0008] Further, the conductive paste and the circuit layer are made of gold, silver, or copper; the circuit layer includes: a signal circuit and a ground circuit.
[0009] Further, the diameters of the through holes in the first circuit support layer and the second circuit support layer on its upper surface gradually increase from bottom to top, and the diameters of the through holes in the second circuit support layer on the lower surface of the first circuit support layer gradually decrease from bottom to top. Making the inner layer smaller can increase the wiring space, so the outer layer is large and the inner layer is small.
[0010] Second aspect, the present invention provides a method for manufacturing the high flatness circuit board, including: Step 1: Coat photoresist on both sides of the first circuit support layer, remove the photoresist of the set circuit on the circuit layer through the development method, and etch circuit grooves on the upper and lower surfaces of the first circuit support layer; Step 2: Prepare the circuit layer on the first circuit support layer in the circuit grooves by physical deposition or ion sputtering; Step 3: Open via holes and alignment identification holes on the first circuit support layer by laser ablation method, fill conductive paste in the via holes, and connect the circuit layers on the upper and lower surfaces of the first circuit support layer; Step 4: Remove the photoresist on the surface of the first circuit support layer; Step 5: On the surface of the first circuit support layer, sequentially complete the production of the filling circuit layers of several via holes of the second circuit support layer according to the designed number of layers of the second circuit support layer until the production of the circuit board is completed.
[0011] Further, the sequentially completing the production of the filling circuit layers of several via holes of the second circuit support layer on the surface of the first circuit support layer specifically includes the following steps: Taking the first circuit support layer as the substrate, form a new substrate on one side connecting the second circuit support layer on the surface of the first circuit support layer, and perform circuit production on the new substrate. Subsequently, the second circuit layers are repeatedly stacked on the new substrate and circuit production is carried out until the entire circuit board is completed; The specific method of circuit production is: stick a photosensitive dry film on the outer side of the second circuit support layer, display the positions of the via holes and circuit layers thereon through the development method, and produce the via holes and circuit layers thereon. The circuit layer will form a conduction layer during electroplating of the via holes. After filling and electroplating the via holes, etch the circuit on the conduction layer on the surface of the second circuit support layer.
[0012] Further, after removing the photoresist on the surface of the first circuit support layer, the circuit layer needs to be polished until the circuit layer is flush with the surface of the first circuit support layer.
[0013] Compared with the prior art, the beneficial effects achieved by the present invention: By introducing a glass structure (the first circuit support layer) into the structure of adding metal (circuit layer) to an organic material (the second circuit support layer), the present invention achieves the effects of enhancing the flatness of the circuit board, reducing the overall CTE of the circuit board, and reducing the warping of the circuit board. Description of the Drawings
[0014] Figure 1 It is a schematic structural diagram of the present invention; Figure 2 It is a top view schematic diagram of the present invention; Wherein: 1. The first circuit support layer, 2. The second circuit support layer, 3. The circuit layer, 4. The via hole, 5. The alignment identification hole, 6. The conductive paste. Detailed implementation manners
[0015] It should be noted that: The technical solution of the present invention will be described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the embodiments of the present invention and the specific features in the embodiments are detailed descriptions of the technical solution of the present invention, rather than limitations on the technical solution of the present invention. Without conflict, the technical features in the embodiments of the present invention and the embodiments can be combined with each other.
[0016] The term "and / or" is only a description of the association relationship of associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist simultaneously, and B exists alone. In addition, the character " / " generally represents an "or" relationship between the associated objects before and after. Embodiment
[0017] As Figures 1-2 Shown in an embodiment, this embodiment provides a high flatness circuit board, including: the first circuit support layer 1, the second circuit support layer 2 and the circuit layer 3; The circuit layer 3 is provided on the upper and lower surfaces of the first circuit support layer 1. The first circuit support layer 1 is provided with via holes 4 penetrating up and down, and the via holes 4 are filled with a conductive paste 6 connecting the circuit layers 3 on the upper and lower surfaces; At least one layer of the second circuit support layer 2 is connected to the upper and lower surfaces of the first circuit support layer 1. On the side surface of each second circuit support layer 2 away from the first circuit support layer 1, a circuit layer 3 is provided. The second circuit support layer 2 is provided with via holes 4 penetrating up and down, and the via holes 4 are filled with a conductive paste 6 connecting the upper and lower circuit layers 3.
[0018] The first circuit support layer 1 is made of a glass layer, and the second circuit support layer 2 is made of an organic colloid layer.
[0019] A plurality of alignment identification holes 5 are provided in the first circuit support layer 1, and the alignment identification holes 5 are arranged around the first circuit support layer 1.
[0020] The conductive paste 6 and the circuit layer 3 are made of gold, silver, and copper; the circuit layer 3 includes: a scheme circuit and a ground circuit.
[0021] The diameters of the via holes 4 in the first circuit support layer 1 and the second circuit support layer 2 on its upper side surface gradually increase from bottom to top, and the diameters of the via holes 4 in the second circuit support layer 2 on the lower side surface of the first circuit support layer 1 gradually decrease from bottom to top. Embodiment
[0022] This embodiment provides a method for manufacturing the high-flatness circuit board, including: Step 1: Coat photoresist on both sides of the first circuit support layer, remove the photoresist of the set circuit on the circuit layer through the development method, and etch circuit grooves on the upper and lower surfaces of the first circuit support layer; Step 2: Prepare the circuit layer on the first circuit support layer in the circuit grooves by physical deposition or ion sputtering; Step 3: Open vias and alignment identification holes on the first circuit support layer by laser ablation method, fill conductive paste in the vias, and connect the circuit layers on the upper and lower surfaces of the first circuit support layer; Step 4: Remove the photoresist on the surface of the first circuit support layer; Step 5: On the surface of the first circuit support layer, sequentially complete the fabrication of the filled circuit layers of several vias of the second circuit support layer according to the designed number of layers of the second circuit support layer until the fabrication of the circuit board is completed.
[0023] The fabrication of the filled circuit layers of several vias of the second circuit support layer sequentially on the surface of the first circuit support layer according to the designed number of layers of the second circuit support layer specifically includes the following steps: Taking the first circuit support layer as the substrate, form a new substrate on one side of the first circuit support layer connected to the second circuit support layer, and perform circuit fabrication on the new substrate. Subsequently, the subsequent second circuit layers are repeatedly stacked on the new substrate and circuit fabrication is carried out until the entire circuit board is completed; The specific method of circuit fabrication is: Stick a photosensitive dry film on the outer side of the second circuit support layer, display the positions of the vias and circuit layers thereon through the development method, and fabricate the vias and circuit layers thereon. After filling the vias with electroplating (conductive paste), etch the circuit and ground circuit on the surface of the second circuit support layer according to the required etching scheme.
[0024] After removing the photoresist on the surface of the first circuit support layer, it is necessary to polish the circuit layer until the circuit layer is flush with the surface of the first circuit support layer.
[0025] In the present invention, by introducing a glass structure (the first circuit support layer) into the structure of adding metal (circuit) to an organic material (the second circuit support layer), the flatness of the circuit board is enhanced, the overall CTE of the circuit board is reduced, and the warping of the circuit board is reduced.
[0026] The embodiments of the present invention have been described above in conjunction with the accompanying drawings. However, the present invention is not limited to the above specific embodiments. The above specific embodiments are merely illustrative and not restrictive. Under the inspiration of the present invention, those of ordinary skill in the art can also make many forms without departing from the spirit and scope protected by the claims of the present invention, and these all fall within the protection scope of the present invention.
Claims
1. A high flatness circuit board, characterized in that: include: A first circuit support layer, a second circuit support layer and a circuit layer; Circuit layers are arranged on the upper and lower surfaces of the first circuit support layer, and the first circuit support layer is provided with conductive holes penetrating from top to bottom, and the conductive holes are filled with a conductive paste connecting the circuit layers on the upper and lower surfaces; The upper and lower surfaces of the first circuit support layer are connected to at least one second circuit support layer, and a circuit layer is arranged on the surface of each second circuit support layer away from the first circuit support layer, and the second circuit support layer is provided with conductive holes running through the upper and lower parts, and the conductive holes are filled with a conductive paste connecting the upper and lower circuit layers.
2. The high flatness circuit board according to claim 1, characterized in that: The first circuit support layer is made of a glass layer, and the second circuit support layer is made of an organic colloid layer.
3. The high flatness circuit board according to claim 1, characterized in that: The first circuit support layer is provided with a plurality of alignment marking holes, and the alignment marking holes are arranged around the first circuit support layer.
4. The high flatness circuit board according to claim 1, characterized in that: The conductive paste and the circuit layer are made of gold, silver and copper; the circuit layer includes: a program circuit and a ground circuit.
5. The high flatness circuit board according to claim 1, characterized in that: The diameters of the via holes of the first circuit support layer and the second circuit support layer on its upper surface gradually increase from bottom to top, and the diameters of the via holes of the second circuit support layer on the lower surface of the first circuit support layer gradually decrease from bottom to top.
6. A method for manufacturing a high-flatness circuit board based on the high-flatness circuit board according to any one of claims 1 to 5, characterized in that: include: Step 1: coating photoresist on both sides of the first circuit support layer, removing the photoresist of the circuit layer for setting the circuit by a developing method, and etching circuit grooves on the upper and lower surfaces of the first circuit support layer; Step 2: preparing a circuit layer on the first circuit support layer in the circuit groove by physical deposition or ion sputtering; Step 3: Opening via holes and alignment marking holes on the first circuit support layer by laser burning, and filling the via holes with conductive paste to connect the circuit layers on the upper and lower surfaces of the first circuit support layer; Step 4: removing the photoresist on the surface of the first circuit support layer; Step 5: On the surface of the first circuit support layer, a plurality of filling circuit layers of the second circuit support layer conductive holes are sequentially manufactured according to the number of designed layers of the second circuit support layer until the manufacturing of the circuit board is completed.
7. The method for manufacturing a high-flatness circuit board according to claim 6, characterized in that: The method of sequentially completing the production of a plurality of filling circuit layers of the second circuit support layer via holes on the surface of the first circuit support layer according to the number of designed layers of the second circuit support layer specifically includes the following steps: The first circuit support layer is used as a substrate, and a side of the second circuit support layer is connected to the surface of the first circuit support layer to form a new substrate, and circuits are made on the new substrate. Subsequently, the second circuit layer is repeatedly stacked on the new substrate and circuits are made until the entire circuit board is completed; The specific method of circuit production is: a photosensitive dry film is attached to the outer side of the second circuit support layer, and the position of the via holes and circuit layers thereon are displayed by a developing method, and the via holes and circuit layers thereon are produced, and after the via holes are filled with electroplating, the circuits are etched on the surface of the second circuit support layer.
8. The method for manufacturing a high-flatness circuit board according to claim 6, characterized in that: After removing the photoresist on the surface of the first circuit support layer, the circuit layer needs to be polished until it is flush with the surface of the first circuit support layer.