Circuit ceramic substrate with high heat dissipation capability

Abstract

The invention discloses a circuit ceramic substrate with high heat dissipation capability, and particularly relates to the technical field of ceramic substrates, the circuit ceramic substrate comprises a ceramic substrate body, and heat dissipation assemblies are arranged on the two sides of the ceramic substrate body; the heat dissipation assembly comprises a heat dissipation core, a heat conduction door frame is welded to the top of the heat dissipation core, the heat conduction door frame is made of a copper metal material, a heat dissipation silver sheet is welded to the bottom of the heat conduction door frame, and three fixed door frames are arranged on the side, away from the heat conduction door frame, of the top of the heat dissipation silver sheet; lower heat absorption cambered surface grooves are formed in the two sides of the bottom of the heat dissipation core. According to the invention, the heat dissipation assembly is arranged, so that the heat dissipation capability is strong, the heat can be quickly dissipated in the use process, the problem of overheating of the ceramic substrate is avoided, the situation of overheating damage of the ceramic substrate is avoided, the actual use effect of the ceramic substrate is good, and the economic loss is effectively avoided.

Description

Technical Field

[0001] The present invention relates to the technical field of ceramic substrates, and more specifically, the present invention relates to a circuit ceramic substrate with strong heat dissipation ability. Background Art

[0002] A ceramic substrate refers to a special process board in which copper foil is directly bonded to the surface of an alumina or aluminum nitride ceramic substrate at high temperature. The resulting ultra-thin composite substrate has excellent electrical insulation performance, high thermal conductivity, excellent soldering properties, and high adhesion strength, and can be etched into various patterns like a PCB board, with a large current-carrying capacity.

[0003] Although the ceramic substrates in the prior art can be used normally, there are still many disadvantages in actual use. For example, the heat dissipation ability of the ceramic substrates in the prior art is not strong enough. After long-term use, the ceramic substrates in the prior art may be damaged due to high temperature, resulting in abnormal use and economic losses. Summary of the Invention

[0004] In order to overcome the above-mentioned defects of the prior art, an embodiment of the present invention provides a circuit ceramic substrate with strong heat dissipation ability. By providing a heat dissipation component, the heat dissipation ability of the present invention is strong, and heat can be quickly dissipated during use, avoiding the problem of overheating of the ceramic substrate, thereby avoiding the situation of overheating and damage of the ceramic substrate, making the actual use effect of the present invention better, and effectively avoiding economic losses, so as to solve the problems raised in the above background art.

[0005] To achieve the above object, the present invention provides the following technical solution: A circuit ceramic substrate with strong heat dissipation ability, including a ceramic substrate body, and heat dissipation components are arranged on both sides of the ceramic substrate body; The heat dissipation component includes a heat dissipation core, a heat conduction door frame is welded on the top of the heat dissipation core, the heat conduction door frame is made of copper metal material, a heat dissipation silver sheet is welded on the bottom of the heat conduction door frame, three fixed door frames are arranged on the side of the heat dissipation silver sheet away from the heat conduction door frame at the top, lower heat absorption arc-shaped grooves are arranged on both sides of the bottom of the heat dissipation core, middle heat absorption arc-shaped grooves are arranged on both sides of the heat dissipation core, and upper heat absorption arc-shaped grooves are arranged on both sides of the top of the heat dissipation core.

[0006] In a preferred embodiment, the heat dissipation core is arranged inside the ceramic substrate body, and the heat dissipation core is made of copper metal material.

[0007] In a preferred embodiment, the three fixed door frames are all fixedly installed on the top of the ceramic substrate body, and the three fixed door frames are all made of copper metal material.

[0008] In a preferred embodiment, the thickness of the heat dissipation silver sheet is set to 0.5 millimeters.

[0009] Technical effects and advantages of the present invention: By providing a heat dissipation component, the present invention has strong heat dissipation ability, can quickly dissipate heat during use, avoid the problem of overheating of the ceramic substrate, and thus avoid the situation of overheating and damage of the ceramic substrate, making the actual use effect of the present invention better and effectively avoiding economic losses. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 It is a schematic diagram of the overall structure of the present invention.

[0011] Figure 2 It is a schematic diagram of the structure of the heat dissipation core of the present invention.

[0012] Figure 3 It is a schematic side view structure diagram of the heat dissipation silver thin sheet of the present invention.

[0013] The reference numerals are: 1, ceramic substrate body; 2, heat dissipation component; 201, heat dissipation core; 202, heat conduction door frame; 203, fixed door frame; 204, heat dissipation silver thin sheet; 205, lower heat absorption arc surface groove; 206, middle heat absorption arc surface groove; 207, upper heat absorption arc surface groove. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0014] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0015] As shown in Figure 1 、 Figure 2 and Figure 3 shown, the present invention provides a circuit ceramic substrate with strong heat dissipation ability, including a ceramic substrate body 1, and heat dissipation components 2 are arranged on both sides of the ceramic substrate body 1; The heat dissipation component 2 includes a heat dissipation core 201, a heat conduction door frame 202 is welded on the top of the heat dissipation core 201, the heat conduction door frame 202 is made of copper metal material, a heat dissipation silver thin sheet 204 is welded on the bottom of the heat conduction door frame 202, three fixed door frames 203 are arranged on the side of the heat dissipation silver thin sheet 204 away from the heat conduction door frame 202 at the top, lower heat absorption arc surface grooves 205 are arranged on both sides of the bottom of the heat dissipation core 201, middle heat absorption arc surface grooves 206 are arranged on both sides of the heat dissipation core 201, and upper heat absorption arc surface grooves 207 are arranged on both sides of the top of the heat dissipation core 201.

[0016] The heat dissipation core 201 is disposed inside the ceramic substrate body 1, and the heat dissipation core 201 is made of copper metal material.

[0017] The three fixing gantries 203 are all fixedly installed on the top of the ceramic substrate body 1, and the three fixing gantries 203 are all made of copper metal material.

[0018] The thickness of the heat dissipation silver thin sheet 204 is set to 0.5 mm.

[0019] The specific implementation manner is as follows: When using the present invention, since the ceramic substrate body 1 generates heat during operation, the heat dissipation core 201 made of copper metal material will conduct heat. Due to the settings of the lower heat absorption arc surface groove 205, the middle heat absorption arc surface groove 206, and the upper heat absorption arc surface groove 207, the heat conduction area can be significantly increased, thereby accelerating the heat conduction speed. Through the heat dissipation core 201, the heat is transferred to the heat conduction gantry 202, and then quickly dissipated through the heat dissipation silver thin sheet 204. The heat dissipation silver thin sheet 204 has a large contact area with the air, so it can quickly exchange heat with the air, thereby achieving the purpose of heat dissipation. Then, the three fixing gantries 203 made of copper metal material can also conduct heat, further improving the heat conduction speed, and thus accelerating the heat dissipation speed of the present ceramic substrate. This makes the heat dissipation ability of the present invention strong, and the heat can be quickly dissipated during use, avoiding the problem of overheating of the ceramic substrate, and thus avoiding the situation of overheating and damage of the ceramic substrate, making the actual use effect of the present invention better and effectively avoiding economic losses.

[0020] The working principle of the present invention: Refer to the attached drawings of the specification Figure 1 and attached drawings Figure 2 and attached drawings Figure 3 When using the present invention, by providing the heat dissipation component 2, the heat dissipation ability of the present invention is strong, and the heat can be quickly dissipated during use, avoiding the problem of overheating of the ceramic substrate, and thus avoiding the situation of overheating and damage of the ceramic substrate, making the actual use effect of the present invention better and effectively avoiding economic losses.

[0021] Finally, several points should be noted: First, in the description of the present application, it should be noted that unless otherwise specified and limited, the terms "installation", "connection", and "connection" should be understood in a broad sense, which can be mechanical connection or electrical connection, or the internal communication of two components, and can be directly connected. The terms "upper", "lower", "left", "right", etc. are only used to represent relative position relationships. When the absolute position of the object being described changes, the relative position relationship may change; Second: In the attached drawings of the disclosed embodiments of the present invention, only the structures related to the disclosed embodiments of the present invention are involved. Other structures can refer to the general design. Without conflict, the same embodiment and different embodiments of the present invention can be combined with each other; Finally, the above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention shall be included within the protection scope of the present invention.

Claims

1. A circuit ceramic substrate with strong heat dissipation capability, comprising a ceramic substrate body (1), characterized in that: Heat dissipation components (2) are provided on both sides of the ceramic substrate body (1); The heat dissipation component (2) comprises a heat dissipation core (201), a heat conducting heat frame (202) is welded to the top of the heat dissipation core (201), the heat conducting heat frame (202) is made of a copper metal material, a heat dissipation silver sheet (204) is welded to the bottom of the heat conducting heat frame (202), three fixed door frames (203) are arranged on the top of the heat dissipation silver sheet (204) away from the heat conducting heat frame (202), lower heat absorbing arc surface grooves (205) are arranged on both sides of the bottom of the heat dissipation core (201), middle heat absorbing arc surface grooves (206) are arranged on both sides of the heat dissipation core (201), and upper heat absorbing arc surface grooves (207) are arranged on both sides of the top of the heat dissipation core (201).

2. A circuit ceramic substrate with strong heat dissipation capability according to claim 1, characterized in that: The heat dissipation core (201) is arranged inside the ceramic substrate body (1), and the heat dissipation core (201) is made of copper metal material.

3. A circuit ceramic substrate with strong heat dissipation capability according to claim 1, characterized in that: The three fixed door frames (203) are all fixedly mounted on the top of the ceramic substrate body (1), and the three fixed door frames (203) are all made of copper metal material.

4. A circuit ceramic substrate with strong heat dissipation capability according to claim 1, characterized in that: The heat dissipation silver sheet (204) is set to have a thickness of 0.5 mm.

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