A PCB circuit board wet etching machine

Abstract

The present invention discloses a wet etching machine for PCB circuit boards, and relates to the technical field of etching equipment. The present invention comprises a base plate, a liquid tank box is fixed on the top of the base plate, a telescopic column is fixed on one side of the top of the base plate, an electric push rod is fixed on the other side of the top of the base plate, a fixing frame is fixed between the electric push rod and the top of the telescopic end of the telescopic column, a placement basket is fixed on the bottom of the fixing frame, and the placement basket comprises a Y-shaped frame. The present invention sets an anti-impurity device so that the rotating rod and the belt cooperate to drive the spiral blade to attract the etching liquid in the liquid tank box to the inside of the fixed cylinder, and the fixed cylinder will transfer the attracted etching liquid to the inside of the filter box, and the filter box will filter impurities such as resin residues in the etching liquid, thereby preventing impurities such as resin residues from accumulating in the etching liquid, so that the quality of the etching liquid can be maintained, and the stability and consistency of the PCB circuit board etching process are ensured.

Description

Technical Field

[0001] The present invention relates to the technical field of etching equipment, in particular to a PCB circuit board wet etcher. Background Art

[0002] A wet etcher is a device used in microelectronics manufacturing that primarily etches semiconductor materials using chemical solutions. This process uses a corrosive solution to remove material from specific areas, creating a fine pattern. Wet etching is suitable for processing thin film materials and is widely used in integrated circuits, MEMS devices, and optoelectronics. This equipment offers high precision and efficiency, enabling it to complete complex etching tasks in a short period of time.

[0003] Chinese patent publication number CN207612475U discloses a PCB wet etching machine, comprising: a hydraulic rod, a hydraulic cylinder, and a device body; a hot air duct disposed in the middle of the upper portion of the device body, and connected to the device body via a through-hole; a hydraulic cylinder and a second hydraulic cylinder mounted at both ends of the upper portion of the device body, and connected to the device body via an embedded mechanism; a hydraulic rod and a second hydraulic rod disposed in the middle of the bottom of the hydraulic cylinder and the second hydraulic cylinder, and connected to the hydraulic rod and the second hydraulic rod via an embedded mechanism. This utility model, through structural improvements and in combination with existing technologies, has advantages such as a sophisticated structure, strong practicality, and the ability to lift and lower during etching, resolving problems and shortcomings of existing device technologies and making it more practical.

[0004] However, the current wet etcher has the following problems: when the wet etcher etches the PCB circuit board, metal ions, resin residues or other organic matter will be released into the etching solution. These impurities accumulate over a long period of time, and the chemical composition and etching efficiency of the etching solution will change. The impurities in the etching solution will cause the etching uniformity to decrease, making the etching process no longer accurate, which may affect the quality of the circuit board. Therefore, we have proposed a wet etcher for PCB circuit boards. Summary of the Invention

[0005] In view of the deficiencies in the prior art, the present invention provides a PCB circuit board wet etching machine, which solves the problems raised in the above background technology.

[0006] To achieve the above objectives, the present invention is implemented through the following technical solutions: a PCB circuit board wet etching machine, comprising a base plate, a liquid tank box is fixed on the top of the base plate, a telescopic column is fixed on one side of the top of the base plate, an electric push rod is fixed on the other side of the top of the base plate, a fixing frame is fixed between the electric push rod and the top of the telescopic end of the telescopic column, a placement basket is fixed on the bottom of the fixing frame, the placement basket comprises a Y-shaped frame, the Y-shaped frame is fixed to the bottom of the fixing frame, a placement box is fixed on the bottom of the Y-shaped frame, a plurality of notch plates are evenly and equidistantly fixed on both sides of the inner wall of the placement box, a plurality of through holes are evenly and equidistantly opened on the bottom of the inner wall of the placement box, an impurity prevention device is provided inside the liquid tank box, and the impurity prevention device comprises a filter box, two fixed cylinders, Two rotating rods, the filter box is fixed on the inner wall of the liquid tank box, and the two fixed cylinders are respectively embedded in the two sides of the filter box away from the inner wall of the liquid tank box. The two rotating rods are respectively rotatably installed on both sides of the inner wall of the liquid tank box, and the two rotating rods are respectively located inside the two fixed cylinders. Spiral blades are fixed on the outside of the two rotating rods. The two rotating rods are connected by belt transmission, and a single rotating rod is driven by a motor. The motor drives the rotating rod on one side to rotate. Under the action of the belt transmission, the rotating rod on one side will drive the rotating rod on the other side to rotate, and the rotating rod will drive the spiral blade to rotate when it rotates. During the rotation of the spiral blade, the etching liquid in the liquid tank box will be attracted to the inside of the fixed cylinder, and the fixed cylinder will transmit the attracted etching liquid to the inside of the filter box. The filter box will filter impurities such as resin residues in the etching liquid.

[0007] According to the above technical solution, several L-shaped plates are evenly and equidistantly fixed on the outer walls of the two rotating rods, and the several L-shaped plates are all located outside the fixed cylinder. At the same time, the rotating rod drives the L-shaped plates to rotate, and the L-shaped plates will stir the etching liquid in the liquid tank box. The rotation of the L-shaped plates will cause the etching liquid in the liquid tank box to flow and stir.

[0008] The gear ring is fixed on the outer wall of the single rotating rod away from the liquid tank box, and the gear is meshed with the gear ring. One end of the U-shaped shovel plate is threadedly connected to the outside of the reciprocating screw rod, and the other end of the U-shaped shovel plate is slidably mounted on the outside of the slide rod, and the U-shaped shovel plate contacts the bottom of the inner wall of the liquid tank box when the rotating rod rotates, driving the gear ring to rotate, the gear ring drives the gear to rotate, and the gear drives the reciprocating screw rod to rotate, and the reciprocating screw rod drives the U-shaped shovel plate to reciprocate along the outside of the slide rod, and the bottom of the inner wall of the liquid tank box is shoveled during the movement of the U-shaped shovel plate.

[0009] According to the above technical solution, push plates are hinged on both sides of the top of the U-shaped shovel plate, and a torsion spring is provided between the push plate and the U-shaped shovel plate. Limit rods are fixed on both sides of the top of the U-shaped shovel plate, and the limit rods are located on the side of the U-shaped shovel plate close to the filter box. The limit rods are used to limit the swinging direction of the push plate. At the same time, each time the U-shaped shovel plate drives the push plate to move toward the liquid tank box, under the thrust of the etching liquid, the etching liquid pushes the push plate to swing toward the liquid tank box. Each time the U-shaped shovel plate drives the push plate to move away from the liquid tank box, the swinging trajectory of the push plate is limited by the limit rod. Under the thrust of the etching liquid, the etching liquid will not push the push plate to swing. At this time, the push plate pushes the etching liquid in the liquid tank box to flow toward the liquid inlet of the fixed cylinder.

[0010] According to the above technical solution, the anti-precipitation device also includes two shafts, which are rotatably installed on both sides of the U-shaped shovel plate through brackets. Several blades are evenly fixed on the outside of the two shafts. Friction wheels are fixed on both sides of the two shafts. The outer wall of the friction wheel is a rough surface. The outer wall of the friction wheel is in contact with the bottom of the inner wall of the liquid tank box. At the same time, when the U-shaped shovel plate moves, the U-shaped shovel plate drives the friction wheel to move with it through the shaft. Under the action of the friction force between the friction wheel and the bottom of the liquid tank box, the friction wheel drives the blades to rotate through the shaft, and the blades will stir the etching liquid around the U-shaped shovel plate.

[0011] The two rails are connected by a plurality of L-shaped bars, each of which is fixed on the upper surface of the base, and the L-shaped bars are connected to the upper surface of the base to form a cam.

[0012] The present invention provides a PCB circuit board wet etching machine. It has the following beneficial effects:

[0013] (1) The present invention sets an anti-impurity device so that the rotating rod and the belt cooperate to drive the spiral blade to attract the etching liquid in the liquid tank to the inside of the fixed cylinder, and the fixed cylinder will transfer the attracted etching liquid to the inside of the filter box. The filter box will filter impurities such as resin residues in the etching liquid, thereby preventing impurities such as resin residues from accumulating in the etching liquid, so that the quality of the etching liquid can be maintained, ensuring the stability and consistency of the PCB circuit board etching process; at the same time, the rotating rod drives the L-shaped plate to stir the etching liquid in the liquid tank, and the rotation of the L-shaped plate will cause the etching liquid in the liquid tank to flow and stir, ensuring the uniform distribution of the etching liquid, so that the chemical components in the etching liquid can contact the PCB circuit board more evenly, avoiding inconsistent etching effects caused by uneven liquid. At the same time, the stirring action of the L-shaped plate can keep impurities in the etching liquid in a suspended state, so that the impurities can be more easily sucked into the fixed cylinder and transferred to the filter box for filtration.

[0014] (2) The present invention sets up the anti-precipitation device, so that the rotating rod, gear ring, gear, reciprocating screw rod and sliding rod cooperate to drive the U-shaped shovel plate to effectively shovel the sediment from the bottom of the liquid tank box and bring it into the flowing etching liquid, so as to avoid the long-term accumulation of impurities at the bottom of the liquid tank box and reduce the influence of the sediment at the bottom of the liquid tank box on the quality of the etching liquid; at the same time, the U-shaped shovel plate, push plate, liquid tank box and limit rod cooperate to drive the push plate to push the etching liquid in the liquid tank box to flow toward the liquid inlet of the fixed cylinder, thereby promoting the circulation of the etching liquid inside the liquid tank box, which helps to maintain the freshness and activity of the etching liquid, avoid the accumulation of sediment in the etching liquid, and also help to ensure the uniformity and stability of the etching liquid; at the same time, the U-shaped shovel plate, shaft rod, friction wheel and liquid tank box cooperate to drive the blades to stir the etching liquid around the U-shaped shovel plate, and this stirring action can help to bring the sediment at the bottom of the liquid tank box from the bottom of the tank, reduce the retention and concentration of sediment, and prevent these substances from gathering around the U-shaped shovel plate.

[0015] (3) The present invention sets a surging device so that the U-shaped shovel plate, L-shaped column rod and wavy groove plate cooperate to drive the surging plate to move up and down. Each time the surging plate moves upward, the surging plate pushes the etching liquid to surge upward from the middle position below the PCB circuit board, thereby helping to increase the contact area between the etching liquid and the surface of the PCB circuit board. The continuous surging of the etching liquid can effectively ensure that the liquid is in full contact with the surface of the circuit board, thereby improving the etching efficiency and etching uniformity; each time the surging plate moves downward, the arc surface of the surging plate pushes the etching liquid to surge toward the fixed cylinders on both sides, thereby facilitating the circulation of the etching liquid and the redistribution after filtration. This distribution can ensure that the liquid is evenly updated in the groove, reducing the situation of local excessive or insufficient etching caused by uneven liquid distribution. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic diagram of the present invention as a whole Figure 1 ;

[0017] Figure 2 This is a schematic diagram of the present invention as a whole Figure 2 ;

[0018] Figure 3 A schematic diagram of a basket placement method according to the present invention;

[0019] Figure 4 It is a schematic diagram of a partial structural section of the present invention;

[0020] Figure 5 It is a partial cross-sectional schematic diagram of the impurity prevention device of the present invention;

[0021] Figure 6 is a schematic diagram of the anti-sedimentation device of the present invention;

[0022] Figure 7 It is a partial structural schematic diagram of the anti-sedimentation device of the present invention;

[0023] Figure 8 Schematic diagram of the tumbling device of the present invention Figure 1 ;

[0024] Figure 9 Schematic diagram of the tumbling device of the present invention Figure 2 .

[0025] In the figure: 1. bottom plate; 2. liquid tank box; 3. telescopic column; 4. electric push rod; 5. fixed frame; 6. placement basket; 61. Y-shaped frame; 62. placement box; 63. notched plate; 64. through-port; 7. impurity prevention device; 71. filter box; 72. fixed cylinder; 73. rotating rod; 74. belt; 75. spiral blade; 76. L-shaped plate; 8. anti-sedimentation device; 81. reciprocating screw; 82. gear; 83. gear ring; 84. sliding rod; 85. U-shaped shovel plate; 86. push plate; 87. limit rod; 88. shaft; 89. blade; 810. friction wheel; 9. tumbling device; 91. tumbling plate; 92. wavy trough plate; 93. L-shaped column. DETAILED DESCRIPTION

[0026] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0027] See also Figure 1 - Figure 9One embodiment of the present invention is: a PCB circuit board wet etching machine, comprising a base plate 1, a liquid tank box 2 is fixed on the top of the base plate 1, a telescopic column 3 is fixed to one side of the top of the base plate 1, an electric push rod 4 is fixed to the other side of the top of the base plate 1, a fixing frame 5 is fixed between the electric push rod 4 and the top of the telescopic end of the telescopic column 3, a placement basket 6 is fixed to the bottom of the fixing frame 5, the placement basket 6 comprises a Y-shaped frame 61, the Y-shaped frame 61 is fixed to the bottom of the fixing frame 5, a placement box 62 is fixed to the bottom of the Y-shaped frame 61, a plurality of notch plates 63 are evenly fixed on both sides of the inner wall of the placement box 62, a plurality of through holes 64 are evenly and evenly opened on the bottom of the inner wall of the placement box 62, an impurity prevention device 7 is provided inside the liquid tank box 2, the impurity prevention device 7 comprises a filter box 71, two fixed cylinders 72, and two rotating rods 73, the filter box 71 is fixed to the inside of the liquid tank box 2 The two fixing cylinders 72 are respectively embedded in the two sides of the filter box 71 away from the inner wall of the liquid tank box 2, and the two rotating rods 73 are respectively rotatably installed on both sides of the inner wall of the liquid tank box 2, and the two rotating rods 73 are respectively located inside the two fixing cylinders 72, and the outside of the two rotating rods 73 is fixed with spiral leaves 75, and the two rotating rods 73 are connected by a belt 74, and a single rotating rod 73 is driven by a motor. Through the arrangement of the above structure, the spiral leaves 75 will attract the etching liquid in the liquid tank box 2 to the inside of the fixed cylinder 72 during the rotation, and the fixed cylinder 72 will transfer the attracted etching liquid to the inside of the filter box 71, and the filter box 71 will filter impurities such as resin residues in the etching liquid, thereby preventing impurities such as resin residues from accumulating in the etching liquid, so that the quality of the etching liquid can be maintained, ensuring the stability and consistency of the PCB circuit board etching process.

[0028] Several L-shaped plates 76 are evenly and equidistantly fixed on the outer walls of the two rotating rods 73, and the several L-shaped plates 76 are all located outside the fixed cylinder 72. Through the arrangement of the above structure, the rotation of the L-shaped plates 76 will cause the etching liquid in the liquid tank box 2 to flow and stir, ensuring the uniform distribution of the etching liquid, so that the chemical components in the etching liquid can contact the PCB circuit board more evenly, avoiding inconsistent etching effects due to uneven liquid. At the same time, the stirring action of the L-shaped plates 76 can keep impurities in the etching liquid in a suspended state, so that the impurities can be more easily sucked into the fixed cylinder 72 and transmitted to the filter box 71 for filtration.

[0029] An anti-sedimentation device 8 is provided between the two fixed cylinders 72. The anti-sedimentation device 8 includes a reciprocating screw rod 81, a gear 82, a gear ring 83, a slide rod 84, and a U-shaped shovel plate 85. The reciprocating screw rod 81 is rotatably mounted on one side of the inner wall of the liquid tank box 2, the slide rod 84 is fixed on the other side of the inner wall of the liquid tank box 2, the gear 82 is fixed to the end of the reciprocating screw rod 81 away from the liquid tank box 2, the gear ring 83 is fixed to the outer wall of the end of the single rotating rod 73 away from the liquid tank box 2, and the gear 82 is meshed with the gear ring 83. One end of the U-shaped shovel plate 85 is threadedly connected to the reciprocating screw rod 81. The other end of the U-shaped shovel plate 85 is slidably mounted on the outside of the slide rod 84, and the U-shaped shovel plate 85 contacts the bottom of the inner wall of the liquid tank box 2. Through the arrangement of the above structure, the U-shaped shovel plate 85 will shovel the bottom of the inner wall of the liquid tank box 2 during movement. The reciprocating shoveling of the U-shaped shovel plate 85 can effectively shovel up the sediment from the bottom of the liquid tank box 2 and bring it into the flowing etching liquid. This can avoid the long-term accumulation of impurities at the bottom of the liquid tank box 2 and reduce the impact of the sediment at the bottom of the liquid tank box 2 on the quality of the etching liquid.

[0030] Push plates 86 are hinged on both sides of the top of the U-shaped shovel plate 85, and a torsion spring is provided between the push plate 86 and the U-shaped shovel plate 85. Limit rods 87 are fixed on both sides of the top of the U-shaped shovel plate 85, and the limit rods 87 are located on the side of the U-shaped shovel plate 85 close to the filter box 71. The limit rods 87 are used to limit the swinging direction of the push plate 86. Through the arrangement of the above structure, the push plate 86 pushes the etching liquid in the liquid tank box 2 to flow toward the liquid inlet of the fixed cylinder 72, thereby promoting the circulation of the etching liquid inside the liquid tank box 2, which helps to maintain the freshness and activity of the etching liquid, avoids the accumulation of sediment in the etching liquid, and is also conducive to ensuring the uniformity and stability of the etching liquid.

[0031] The anti-precipitation device 8 also includes two shafts 88, which are rotatably mounted on both sides of the U-shaped shovel plate 85 through brackets. Several blades 89 are evenly fixed on the outside of the two shafts 88. Friction wheels 810 are fixed on both sides of the two shafts 88. The outer wall of the friction wheel 810 is set as a rough surface. The outer wall of the friction wheel 810 contacts the bottom of the inner wall of the liquid tank box 2. Through the setting of the above structure, the friction wheel 810 drives the blades 89 to rotate through the shaft 88. The blades 89 will stir the etching liquid around the U-shaped shovel plate 85. This stirring action can help to bring up the sediment at the bottom of the liquid tank box 2 from the bottom of the tank, reduce the retention and concentration of the sediment, and prevent these substances from gathering around the U-shaped shovel plate 85.

[0032] When in use, the PCB circuit board to be etched is placed in the placement basket 6, and the electric push rod 4 is started. The telescopic end of the electric push rod 4 drives the placement basket 6 to move downward through the fixed frame 5, and the placement basket 6 carries the PCB circuit board into the etching liquid of the liquid tank box 2. At this time, the PCB circuit board shell is etching. At the same time, the rotating rod 73 on one side is driven by the motor to rotate. Under the transmission action of the belt 74, the rotating rod 73 on one side will drive the rotating rod 73 on the other side to rotate. When the rotating rod 73 rotates, it will drive the spiral blade 75 to rotate. During the rotation of the spiral blade 75, the etching liquid in the liquid tank box 2 will be attracted to the inside of the fixed cylinder 72, and the fixed cylinder 72 will transmit the attracted etching liquid to the inside of the filter box 71. The filter box 71 will remove impurities such as resin residues in the etching liquid. The L-shaped plate 76 is rotated to agitate the etching liquid in the liquid tank 2. The rotation of the L-shaped plate 76 causes the etching liquid in the liquid tank 2 to flow and stir, ensuring uniform distribution of the etching liquid. This allows the chemical components in the etching liquid to contact the PCB circuit board more evenly, avoiding inconsistent etching effects due to uneven liquid. At the same time, the stirring action of the L-shaped plate 76 can keep impurities in the etching liquid in a suspended state, allowing the impurities to be more easily sucked into the fixed cylinder 72 and transferred to the filter box 71 for filtration.

[0033] When the rotating rod 73 rotates, the gear ring 83 is driven to rotate, and the gear ring 83 drives the gear 82 to rotate, and the gear 82 drives the reciprocating screw rod 81 to rotate, and the reciprocating screw rod 81 drives the U-shaped shovel plate 85 to move back and forth along the outer side of the slide rod 84. During the movement of the U-shaped shovel plate 85, the bottom of the inner wall of the liquid tank box 2 is shoveled. The reciprocating shovel plate 85 can effectively shovel the sediment from the bottom of the liquid tank box 2 and bring it into the flowing etching liquid, thereby preventing impurities from accumulating at the bottom of the liquid tank box 2 for a long time and reducing the impact of the sediment at the bottom of the liquid tank box 2 on the quality of the etching liquid; at the same time, each time the U-shaped shovel plate 85 drives the push plate 86 to move in the direction of the liquid tank box 2, under the thrust of the etching liquid, the etching liquid pushes the push plate 86 to swing in the direction of the liquid tank box 2, and each time the U-shaped shovel plate 85 drives the push plate 86 to move away from the liquid tank box 2, the swing trajectory of the push plate 86 is limited by the limit rod 8 7 limitation, under the thrust of the etching liquid, the etching liquid will not push the push plate 86 to swing. At this time, the push plate 86 pushes the etching liquid in the liquid tank box 2 to flow toward the liquid inlet of the fixed cylinder 72, thereby promoting the circulation of the etching liquid inside the liquid tank box 2, which helps to maintain the freshness and activity of the etching liquid, avoids the accumulation of sediment in the etching liquid, and is also conducive to ensuring the uniformity and stability of the etching liquid; at the same time, when the U-shaped shovel plate 85 moves, the U-shaped shovel plate 85 drives the friction wheel 810 to move along with it through the shaft 88. Under the action of the friction between the friction wheel 810 and the bottom of the liquid tank box 2, the friction wheel 810 drives the blade 89 to rotate through the shaft 88. The blade 89 stirs the etching liquid around the U-shaped shovel plate 85. This stirring action can help to remove the sediment at the bottom of the liquid tank box 2 from the bottom of the tank, reduce the retention and concentration of sediment, and prevent these substances from gathering around the U-shaped shovel plate 85.

[0034] See also Figure 1 - Figure 9On the basis of the above embodiment, in another embodiment of the present invention, a surging device 9 is provided above the U-shaped shovel plate 85, and the surging device 9 includes a surging plate 91, two wavy groove plates 92, and two L-shaped pillars 93. The surging plate 91 is vertically slidably installed on the inner wall of the liquid tank box 2, and the bottom of the telescopic surging plate 91 is arranged with an arc surface. The two wavy groove plates 92 are respectively fixed on both sides of the surging plate 91, and the outer wall of the wavy groove plate 92 is provided with a wavy groove. The two L-shaped pillars 93 are respectively fixed on both sides of the top of the U-shaped shovel plate 85, and the end of the L-shaped pillar 93 away from the U-shaped shovel plate 85 is slidably installed in the wavy groove of the wavy groove plate 92. Through the arrangement of the above structure, the surging device 91 can be easily installed. The surge plate 91 moves back and forth up and down. Each time the surge plate 91 moves upward, the surge plate 91 pushes the etching liquid to surge upward from the middle position below the PCB circuit board, thereby helping to increase the contact area between the etching liquid and the surface of the PCB circuit board. The continuous surge of the etching liquid can effectively ensure that the liquid is in full contact with the circuit board surface, thereby improving the etching efficiency and etching uniformity. Each time the surge plate 91 moves downward, the curved surface of the surge plate 91 pushes the etching liquid to surge toward the fixed cylinders 72 on both sides, thereby facilitating the circulation of the etching liquid and the redistribution of the filtered liquid. This distribution can ensure that the liquid is evenly updated in the tank, reducing the situation of local excessive or insufficient etching caused by uneven liquid distribution.

[0035] During use, when the U-shaped shovel plate 85 moves, it will drive the L-shaped column rod 93 to move along, and the L-shaped column rod 93 will slide along the wavy groove of the wavy groove plate 92, and the L-shaped column rod 93 will push the wavy groove plate 92 to drive the tumbling plate 91 to move up and down. Each time the tumbling plate 91 moves upward, the tumbling plate 91 pushes the etching liquid to surge upward from the middle position below the PCB circuit board, thereby helping to increase the contact area between the etching liquid and the surface of the PCB circuit board. The continuous tumbling of the etching liquid can effectively ensure that the liquid is in full contact with the surface of the circuit board, thereby improving the etching efficiency and etching uniformity; each time the tumbling plate 91 moves downward, the curved surface of the tumbling plate 91 pushes the etching liquid to surge toward the fixed cylinders 72 on both sides, thereby facilitating the circulation of the etching liquid and the redistribution after filtration. This distribution can ensure that the liquid is evenly updated in the groove, reducing the situation of local excessive or insufficient etching caused by uneven liquid distribution.

[0036] The above description is only a preferred specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any technician familiar with the technical field, within the technical scope disclosed by the present invention, who makes equivalent replacements or changes based on the technical solution and inventive concept of the present invention, should be covered by the scope of protection of the present invention.

Claims

1. A PCB circuit board wet etching machine, comprising a bottom plate (1), characterized in that: A liquid tank box (2) is fixed on the top of the base plate (1), a telescopic column (3) is fixed on one side of the top of the base plate (1), an electric push rod (4) is fixed on the other side of the top of the base plate (1), a fixing frame (5) is fixed between the electric push rod (4) and the top of the telescopic end of the telescopic column (3), a placement basket (6) is fixed on the bottom of the fixing frame (5), and an anti-impurity device (7) is provided inside the liquid tank box (2), and the anti-impurity device (7) includes a filter box (71), two fixing cylinders (72), and two rotating rods (73). The filter box (71) is fixed to the inner wall of the liquid tank box (2), the two fixed cylinders (72) are respectively embedded on both sides of the filter box (71) away from the inner wall of the liquid tank box (2), the two rotating rods (73) are respectively rotatably installed on both sides of the inner wall of the liquid tank box (2), and the two rotating rods (73) are respectively located inside the two fixed cylinders (72), and spiral leaves (75) are fixed on the outside of the two rotating rods (73). The two rotating rods (73) are connected by a belt (74) and a single rotating rod (73) is driven by a motor.

2. A PCB circuit board wet etching machine according to claim 1, characterized in that: A plurality of L-shaped plates (76) are evenly and equidistantly fixed on the outer walls of the two rotating rods (73), and the plurality of L-shaped plates (76) are all located outside the fixed cylinder (72).

3. The PCB wet etching machine according to claim 1, wherein: The placement basket (6) includes a Y-shaped frame (61), the Y-shaped frame (61) is fixed to the bottom of the fixed frame (5), a placement box (62) is fixed to the bottom of the Y-shaped frame (61), a plurality of notched plates (63) are fixed evenly and equidistantly on both sides of the inner wall of the placement box (62), and a plurality of through openings (64) are opened evenly and equidistantly on the bottom of the inner wall of the placement box (62).

4. The PCB wet etching machine according to claim 1, wherein: An anti-sedimentation device (8) is provided between the two fixed cylinders (72), and the anti-sedimentation device (8) comprises a reciprocating screw (81), a gear (82), a gear ring (83), a slide bar (84), and a U-shaped shovel plate (85). The reciprocating screw (81) is rotatably mounted on one side of the inner wall of the liquid tank box (2), and the slide bar (84) is fixed on the other side of the inner wall of the liquid tank box (2). The gear (82) is fixed to one end of the reciprocating screw (81) away from the liquid tank box (2), and the gear ring (83) is fixed to the outer wall of one end of the single rotating rod (73) away from the liquid tank box (2), and the gear (82) is meshed with the gear ring (83). One end of the U-shaped shovel plate (85) is threadedly connected to the outside of the reciprocating screw (81), and the other end of the U-shaped shovel plate (85) is slidably mounted on the outside of the slide bar (84). The U-shaped shovel plate (85) contacts the bottom of the inner wall of the liquid tank box (2).

5. The PCB wet etching machine according to claim 4, characterized in that: Push plates (86) are hinged on both sides of the top of the U-shaped shovel plate (85), and a torsion spring is provided between the push plate (86) and the U-shaped shovel plate (85). Limiting rods (87) are fixed on both sides of the top of the U-shaped shovel plate (85), and the limiting rods (87) are located on the side of the U-shaped shovel plate (85) close to the filter box (71). The limiting rods (87) are used to limit the swing direction of the push plate (86).

6. The PCB wet etching machine according to claim 4, characterized in that: The anti-sedimentation device (8) further comprises two shafts (88), the two shafts (88) being rotatably mounted on both sides of the U-shaped shovel plate (85) via brackets, a plurality of blades (89) being evenly fixed on the outside of the two shafts (88), and friction wheels (810) being fixed on both sides of the two shafts (88).

7. The PCB wet etching machine according to claim 6, characterized in that: The outer wall of the friction wheel (810) is provided with a rough surface, and the outer wall of the friction wheel (810) is in contact with the bottom of the inner wall of the liquid tank box (2).

8. The PCB wet etching machine according to claim 4, characterized in that: A surging device (9) is provided above the U-shaped shovel plate (85), and the surging device (9) includes a surging plate (91), two wavy groove plates (92), and two L-shaped columns (93). The surging plate (91) is vertically slidably mounted on the inner wall of the liquid tank box (2). The bottom of the telescopic surging plate (91) is provided with an arc surface. The two wavy groove plates (92) are respectively fixed on both sides of the surging plate (91), and the outer wall of the wavy groove plate (92) is provided with a wavy groove. The two L-shaped columns (93) are respectively fixed on both sides of the top of the U-shaped shovel plate (85), and the end of the L-shaped column (93) away from the U-shaped shovel plate (85) is slidably mounted inside the wavy groove of the wavy groove plate (92).

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