Wire fixing structure and method adopting wave soldering

Abstract

A lead fixing structure and method adopting wave soldering relates to the field of electronic installation and comprises a printed board, one surface of the printed board is a lead preparation soldering surface, the other surface of the printed board is a back surface, the back surface of the printed board is connected with at least two combined layers through a connecting structure, and preset distances are reserved between the combined layers and the printed board and between the adjacent combined layers; the combined layer comprises a soft pad and a hard plate which are in contact, and the hard plate is located on the side, away from the printed board, of the soft pad; the printed board is provided with wire bonding pad holes, the soft pad is provided with soft pad wire holes, the positions and the number of the soft pad wire holes correspond to the positions and the number of the wire bonding pad holes, the diameter d2 of the soft pad wire holes is smaller than the outer diameter d1 of the wire containing the wire insulating layer, and the hard board is provided with hard board wire holes. The positions and the number of the hard board wire holes correspond to the positions and the number of the printed board wire bonding pad holes, and the diameter d3 of the hard board wire holes is larger than the outer diameter d1 of the wires containing the wire insulating layers. The problem that a wire is difficult to fix before being welded by wave soldering equipment is solved.

Description

Technical Field

[0001] The present invention belongs to the field of electronic assembly, and relates to a method for fixing wires using wave soldering. Background Art

[0002] Generally, electric soldering irons are used for wire soldering. However, when the wire pads are connected to a large area of copper cladding, the power of the electric soldering iron cannot ensure that the solder on the wire pads can penetrate from the soldering surface to the component surface. Wave soldering can solve the problem of difficult solder penetration for large-area copper-clad pads. Before wave soldering, the pins or leads to be soldered need to be inserted into the solder holes and fixed to prevent the pins or leads from moving during the soldering process, which affects the soldering quality of the pins or leads. Currently, through-hole components can be fixed by using adhesive liquids such as red glue to stick the component body. The difficulty in wire fixing lies in that wires are softer and longer compared to component pins. After the wire cores are inserted into the solder holes, the center of gravity is higher than that of components, and they are prone to intertwine with each other. When subjected to external force shaking or touching the wires, the insertion depth of the wires into the solder holes will be affected. Since there are many wires and they are crossed together, pulling one will affect the whole, so it is difficult to ensure the insertion depth of the wires at the same time.

[0003] Currently, patents similar to this patent mainly focus on the design of wave soldering fixtures and tooling, such as "A wave soldering fixture in a wave soldering furnace (application number: CN201220637845.8)", "A wave soldering fixture applicable to PCB boards of different sizes (application number: CN202411105592.3)", etc. The above wave soldering fixture and tooling can only fix the printed circuit board (PCB) and cannot fix the wires on the printed circuit board. "A wave soldering fixture and tooling for a wave soldering furnace (application number: CN202320273901.2)" designs a fixture and tooling for fixing components, using springs and clamps to fix the components. This fixture can only fix the components and cannot fix the wires on the printed circuit board. Summary of the Invention

[0004] The technical problem solved by this application is: overcoming the deficiencies of the prior art, providing a method for fixing wires using wave soldering, and solving the problem of difficult wire fixing before soldering with wave soldering equipment.

[0005] This patent mainly focuses on the method for fixing wires, which are specific objects of wave soldering, and emphasizes the method of fixing wires on the printed circuit board to prevent the wires from moving during the soldering process. This patent uses multiple layers of rubber pads for tightening and fixing.

[0006] A fixing structure for a conductor using wave soldering comprises a printed board, wherein one surface of the printed board is a conductor preparation soldering surface and the other surface is a back surface, the back surface of the printed board is connected with at least two composite layers through a connecting structure, a preset distance is set between the composite layer and the printed board, and a preset distance is set between adjacent composite layers; the composite layer comprises a contacting soft pad and a hard board, the hard board is located on the side of the soft pad away from the printed board; the printed board is provided with a wire pad hole for allowing the wire to be soldered to pass through the wire preparation soldering surface, the soft pad is provided with a soft pad wire hole, the position and number of the soft pad wire hole correspond to the position and number of the wire pad hole, the diameter d2 of the soft pad wire hole is smaller than the outer diameter d1 of the wire containing the wire insulation layer, the hard board is provided with a hard board wire hole, the position and number of the hard board wire hole correspond to the position and number of the printed board wire pad hole, and the diameter d3 of the hard board wire hole is larger than the outer diameter d1 of the wire containing the wire insulation layer.

[0007] Furthermore, the diameter d2 of the wire hole of the soft pad is 0.2 mm to 0.5 mm smaller than the outer diameter d1 of the wire including the wire insulation layer.

[0008] Furthermore, the diameter d3 of the wire hole of the hard plate is 0.2 mm to 0.5 mm larger than the outer diameter d1 of the wire including the wire insulation layer.

[0009] Furthermore, the combined layer is detachably connected to the printed circuit board via a connecting structure.

[0010] Further, the connection structure includes a support column, a screw and a nut; a threaded hole is opened at one end of the support column, and a stud is provided at the other end; the thread specification of the threaded hole is consistent with that of the stud, and the thread specification of the threaded hole is consistent with that of the screw; the printed circuit board is provided with at least 3 non-collinear printed circuit board mounting holes, the soft pad is provided with a soft pad mounting hole, and the hard board is provided with a hard board mounting hole, and the position, size and number of the soft pad mounting holes and the hard board mounting holes are consistent with those of the printed circuit board mounting holes; the screw passes through the printed circuit board through the printed circuit board mounting hole, the screw is threadedly connected to the threaded hole of the support column of the first layer, the stud of the support column of the first layer passes through the first combined layer and is threadedly connected to the threaded hole of the support column of the second layer, the support column of the second layer passes through the second combined layer and is threadedly connected to the threaded hole of the support column of the next layer or is threadedly connected to the nut.

[0011] Furthermore, the soft pad is made of soft material and has elasticity, and the thickness of the soft pad is 1 to 2 mm; the hard plate is made of hard material, and the thickness of the hard plate is 1 to 3 mm.

[0012] A method for fixing a wire using wave soldering, using any of the above-mentioned fixing structures for a wire using wave soldering for fixing, comprising:

[0013] S1. Install the printed circuit board and the assembly layer through the connection structure;

[0014] S2. Take a wire to be welded, remove the outer insulation layer at one end of the wire, and tin the wire core of the wire with the outer insulation layer removed; pass one end of the tinned wire through the composite layer in sequence, and finally insert the wire core into the printed circuit board wire pad hole, adjust the depth of the wire inserted into the printed circuit board wire pad hole, and trim the wire core exposed on the printed circuit board until the height h1 of the wire insulation layer from the printed circuit board surface and the height h2 of the wire core exposed on the printed circuit board surface meet the requirements to obtain the trimmed wire;

[0015] S3. Withdraw the trimmed wire in S2, remove the outer insulation layer from all the other wires and tin the wire cores to obtain the wires to be trimmed; trim the wires to be trimmed according to the trimmed wire to obtain the target wires;

[0016] S4. Pass the target wires through the composite layer in sequence, and finally insert the wire cores into the printed circuit board wire pad holes, adjust the depth of the wires inserted into the printed circuit board wire pad holes to obtain the printed circuit board wire assembly;

[0017] S5. Use a wave soldering device to solder the printed circuit board wire assembly to obtain the post-soldering assembly;

[0018] S6. Remove the composite layers of the post-soldering assembly in sequence.

[0019] Further, in S1, the printed circuit board and the composite layer are installed through a connection structure, including:

[0020] S11. Pass the screw through the printed circuit board mounting hole from the wire pre-welding surface to the back, thread the threaded hole of the support post with the screw, and the support post is located on the back side of the printed circuit board;

[0021] S12. Sleeve the soft pad mounting holes of the soft pad on the studs of the support posts at the corresponding positions respectively, and then sleeve the hard board mounting holes of the hard board on the studs of the support posts at the corresponding positions respectively;

[0022] S13. Then tighten the support post with the stud of the upper-layer support post passing through the hard board until the soft pad and the hard board are pressed tightly;

[0023] S14. Repeat S12 and S13 to install the composite layers of the preset number of layers in sequence;

[0024] S15. Tighten the nut outside the stud of the support post passing through the last layer of the composite layer.

[0025] Further, in S6, removing the composite layers of the post-soldering assembly in sequence includes:

[0026] Remove the nut, and then withdraw and remove the outer hard board and soft pad from the welded wires;

[0027] Then remove the outer support columns, and then remove the hard boards and soft pads of the next layer; repeat this step until all the hard boards and soft pads are removed, and finally loosen and remove the support columns and screws closest to the printed circuit board.

[0028] Further, when removing the soft pads, use a hot air gun to heat the part of the soft pad where the wire is inserted, so that the soft pad softens and is convenient for the soft pad to be pulled out from the wire.

[0029] The advantages of a method for fixing wires using wave soldering according to the present invention are as follows:

[0030] 1) By customizing soft pads and hard boards according to the printed circuit board, wires with any number and position can be fixed;

[0031] 2) The wires can be fixed horizontally through two layers of hard boards to prevent the wires from falling or skewing during the soldering process;

[0032] 3) By the elastic contraction of two layers of soft pads to press the wires tightly, the insertion depth of the wires can be flexibly controlled, and the expansion and contraction of the wires inserted into the solder holes caused by the shaking of the other free end of the wires can be restricted to a certain extent;

[0033] 4) A detachable and flexible fixing method, and after the wires are soldered, the remaining auxiliary parts can be conveniently removed. Description of the Drawings

[0034] Figure 1 is a front schematic diagram assembled according to the method of the present invention.

[0035] Figure 2 is a back schematic diagram assembled according to the method of the present invention.

[0036] Figure 2 In the figure: 6 - screw.

[0037] Figure 3 is an illustration of the customization of soft pads and hard boards.

[0038] Figure 4 is a schematic diagram of the support column. The left figure is a three-dimensional view of the support column, and the right figure is a cross-sectional view of the support column.

[0039] Figure 4 In the figure: 41 - threaded hole; 42 - stud.

[0040] Figure 5 is a cross-sectional view assembled according to the method of the present invention.

[0041] Figure 6 is a schematic diagram of the opening dimensions of the printed circuit board, soft pads, and hard boards.

[0042] Figure 7It is the dimension diagram of the support column.

[0043] Figure 8 It is the schematic diagram of the position for installing the support column.

[0044] Explanation of the reference numerals: 1 - Printed circuit board; 2 - Soft pad; 3 - Rigid board; 4 - Support column; 5 - Nut; 6 - Screw; 7 - Wire;

[0045] 11. Printed circuit board mounting hole; 12. Wire pad hole; 21. Soft pad mounting hole; 22. Soft pad wire hole; 31. Rigid board mounting hole; 32. Rigid board wire hole;

[0046] d1 - Outer diameter of the wire (including the wire insulation layer); d2 - Diameter of the soft pad wire hole; d3 - Diameter of the rigid board wire hole; h1 - Height of the wire insulation layer from the printed circuit board surface; h2 - Height of the wire core exposed from the printed circuit board surface; h3 - Length of the wire core. Detailed implementation manners

[0047] To make the objectives, technical solutions and advantages of the present application clearer, the following will further describe in detail the disclosed implementation manners of the present application with reference to the accompanying drawings.

[0048] The embodiment of the present application discloses a fixing structure for wires using wave soldering, as Figure 1 、 2 shown. The following parts are required for this method: 2 soft pads 2, 2 rigid boards 3, several support columns 4, several screws 6, and several nuts 5.

[0049] The described soft pad 2 is used to restrict the movement of the wire. It can be processed and made of soft materials such as rubber pads. The material should have a certain elasticity, and the thickness is generally 1 - 2 mm, which can be adjusted according to the actual use situation. The soft pad is customized according to the printed circuit board and the wire to be soldered, as Figure 3 shown. The specific processing and manufacturing requirements are as follows: Cut and process the soft pad according to the contour of the printed circuit board. Open soft pad mounting holes 21 on the soft pad 2, and the opening positions, sizes and quantities are the same as those of the printed circuit board mounting holes 11. Open soft pad wire holes 22 on the soft pad 2, and the opening positions and quantities are the same as those of the wire pad holes 12 on the printed circuit board. The diameter d2 of the soft pad wire hole 22 is 0.2 mm - 0.5 mm smaller than the outer diameter of the wire (including the wire insulation layer) d1.

[0050] The described rigid board is used to stabilize the wire and prevent the wire from skewing. It can be processed and made of rigid materials such as epoxy boards and metal boards. The thickness is generally 1 - 3 mm, which can be adjusted according to the actual use situation. The rigid board is customized according to the printed circuit board and the wire to be soldered, as Figure 3As shown in the figure, the specific processing requirements are as follows: Cut the rigid board according to the outline of the printed circuit board. Open rigid board mounting holes 31 on the rigid board, and the opening positions, sizes, and quantities are the same as those of the printed circuit board mounting holes 11. Open rigid board wire holes 32 on the rigid board, and the opening positions and quantities are the same as those of the printed circuit board wire pad holes 12. The diameter d3 of the rigid board wire holes is 0.2 mm to 0.5 mm larger than the outer diameter of the wire (including the wire insulation layer) d1.

[0051] The described support column 4, as Figure 4 shown, is processed and manufactured using plastic or metal materials. One end of the support column 4 is provided with a threaded hole 41, and the other end is a stud 42. The thread specifications of the threaded hole 41 and the stud 42 are the same, and the thread specifications of the threaded hole 41 and the screw 6 are the same, so that the end of the screw 6 passing through the printed circuit board 1 can be threadedly connected into the threaded hole 41. The diameter of the stud 42 should be smaller than the diameter of the printed circuit board mounting hole 11, and the length of the stud 42 should be greater than the thickness of the printed circuit board 1, and at the same time, it should be greater than the sum of the thicknesses of the rigid board 3 and the soft pad 2.

[0052] The described screw 6 and nut 5 are used in cooperation with the support column 4. The thread specifications of the screw 6 and the nut 5 are the same as the thread specifications of the threaded hole 41 or the stud 42 of the support column 4, and the length of the screw 6 should be greater than the thickness of the printed circuit board 1.

[0053] A combination layer is composed of a layer of soft pad 2 and a layer of rigid board 3 in contact. The distance between adjacent two combination layers is determined according to the wire to ensure that the wire can maintain a straight state between the support points of the wire by the two combination layers. In order to make the distance between the two combination layers meet the requirements, one support column 4 or multiple sequentially connected support columns 4 can be arranged between adjacent two combination layers.

[0054] The fixing method of the present application is as follows:

[0055] Step 1: Take two soft pads with a thickness of 1 mm. The processing methods of the two soft pads are the same, and the processing method is as follows: Take the printed circuit board that needs to weld the wire, cut the soft pad according to the outline of the printed circuit board, open holes at the corresponding positions on the soft pad according to the positions of the printed circuit board mounting holes, and the opening size is the same as that of the printed circuit board mounting hole 11. Open round holes at the corresponding positions on the soft pad as soft pad wire holes 22 according to the positions of the printed circuit board wire pads. The opening diameter of the soft pad wire holes 22 is 0.2 mm to 0.5 mm smaller than the outer diameter of the wire.

[0056] Step 2: Take two hard boards with a thickness of 2 mm. The processing methods of the two hard boards are the same, and the processing method is as follows: Take the printed circuit board where the wires need to be welded, cut and process the hard board according to the contour of the printed circuit board, and open holes at the corresponding positions on the hard board 3 as the hard board mounting holes 31 according to the positions of the printed circuit board mounting holes 11. The size of the opened holes is the same as that of the printed circuit board mounting holes 11. Open round holes at the corresponding positions on the hard board 3 as the hard board wire holes 32 according to the positions of the printed circuit board wire pad holes 12. The opening diameter of the hard board wire holes 32 is 0.2 mm to 0.5 mm larger than the outer diameter of the wire.

[0057] Step 3: Take the printed circuit board where the wires need to be welded, take 1 screw, pass it through the printed circuit board mounting hole 11 from the side where the wires are to be welded, and fasten it with the threaded hole at the bottom of 1 support post 4 on the other side. In the same way, select other printed circuit board mounting holes 11 and install several sets of screws 6 and support posts 4 (the first layer of support posts);

[0058] Step 4: Take a soft pad, align the positions of the mounting holes of the soft pad with the positions of the first layer of support posts of the printed circuit board, and then put the soft pad mounting holes 21 on the corresponding support posts (the first layer of support posts) respectively. Take a hard board 3, align the positions of the hard board mounting holes 31 with the positions of the support posts of the printed circuit board, and then put the hard board mounting holes 31 on the corresponding support posts (the first layer of support posts) respectively. Then take the same number of support posts (the second layer of support posts) as the number of the first layer of support posts, and screw the threaded holes at the bottom of the second layer of support posts onto the studs at the top of the first layer of support posts until the soft pad 2 and the hard board 3 are pressed tightly (the first layer of soft pad and hard board).

[0059] Step 5: Take a soft pad 2, align the positions of the soft pad mounting holes 11 with the positions of the second layer of support posts of the printed circuit board 1, and then put the soft pad mounting holes 11 on the corresponding support posts (the second layer of support posts) respectively. Take a hard board 3, align the positions of the hard board mounting holes 31 with the positions of the support posts of the printed circuit board, and then put the hard board mounting holes 31 on the corresponding support posts (the second layer of support posts) respectively. Then take the same number of nuts 5 as the number of the second layer of support posts, and screw the nuts 5 onto the studs at the top of the second layer of support posts until the soft pad 2 and the hard board 3 are pressed tightly (the second layer of soft pad and hard board).

[0060] Step 6: Take a wire that needs to be welded, thermally strip one end of the wire to remove the external insulation layer, and tin the wire core after removing the external insulation layer. Pass the tinned end of the wire through the second layer of hard board wire holes, the second layer of soft pad wire holes, the first layer of hard board wire holes, and the first layer of soft pad wire holes in sequence, and finally insert the wire core into the printed circuit board wire pad hole 12. Adjust the depth of the wire inserted into the printed circuit board wire pad hole 12, that is, the height of the wire insulation layer from the printed circuit board surface ( Figure 5For h1), h1 shall comply with the requirements of relevant documents, and then trim the wire cores exposed on the printed circuit board 1. The height of the wire cores exposed on the printed circuit board surface ( Figure 5 is h2), and h2 shall comply with the requirements of relevant documents.

[0061] Step 7: Perform heat stripping to remove the outer insulation layer of all the remaining wires and tin the wire cores. Pull out the wires subjected to the above operations from the wire holes of the entire two-layer soft pad and hard board, and trim all the remaining wire cores according to the length of the pulled-out wire cores ( Figure 5 is h3).

[0062] Step 8: Install all the wires according to the method in Step 6.

[0063] Step 9: Use wave soldering equipment to solder the wire pads on the printed circuit board.

[0064] Step 10: Remove all the nuts, and sequentially pull out and remove the second-layer hard board and the second-layer soft pad from the soldered wires. When removing the soft pad, a hot air gun can be used to assist in heating the part of the soft pad inserted into the wire, so that the soft pad is softened and it is convenient to pull out the soft pad from the wire.

[0065] Step 11: Remove all the second-layer support columns according to the same method, and sequentially remove the first-layer hard board and the first-layer soft pad. Finally, loosen and remove the first-layer support column and the screw.

[0066] Example 1

[0067] (1) The printed circuit board is as Figure 6 shown. The thickness of the printed circuit board is 3 mm, and 40 wires of C55 / 0812-20 specification are soldered on the printed circuit board. There are 7 printed circuit board mounting holes on the printed circuit board, and the diameter of the printed circuit board mounting holes is 3.3 mm, and M3 specification screws can be installed. There are 40 printed circuit board wire pad holes on the printed circuit board, with a diameter of 1.3 mm, and wires of C55 / 0812-20 specification with a wire core diameter of 1 mm can be soldered;

[0068] (2) Customize the soft pad and the hard board according to the printed circuit board and C55 / 0812-20 wire information. The soft pad is a 1-mm thick rubber pad, and the hard board is a 2-mm thick epoxy board. The outer diameter (including the wire insulation layer) of the C55 / 0812-20 wire is 1.5 mm. The diameters of the mounting holes of the soft pad and the hard board are both 3.3 mm, which are the same as the diameter of the printed circuit board mounting holes. The diameter of the wire hole of the soft pad is 1.15 mm, meeting the requirement that the opening diameter of the soft pad is 0.2 mm to 0.5 mm smaller than the outer diameter of the wire. The diameter of the wire hole of the hard board is 1.85 mm, meeting the requirement that the opening diameter of the hard board is 0.2 mm to 0.5 mm larger than the outer diameter of the wire. The relative positions of all the holes are the same as those of the corresponding holes on the printed circuit board.

[0069] (3) The dimensions of the support posts are as Figure 7 shown (unit: mm). The threaded holes and studs of the support posts are both M3. The depth of the threaded holes is 3.5 mm, and the length of the stud is 5 mm, which is greater than the thickness of the printed circuit board (3 mm), and also greater than the sum of the thicknesses of the soft pad (1 mm) and the hard board (2 mm). The nut is an I-shaped hexagon nut M3, and the screw is a cross-recessed pan head screw M3*6;

[0070] (4) Take one cross-recessed pan head screw M3*6, pass it through the mounting hole of the printed circuit board from the side where the wire is to be welded, and fasten it with the threaded hole at the bottom of one support post on the other side. The installation position is as Figure 8 shown. Install a total of 3 sets of screws and support posts (the first-layer support posts) in the same way;

[0071] (5) Take a soft pad, align the positions of the mounting holes of the soft pad with the positions of the first-layer support posts of the printed circuit board, and then put the mounting holes of the soft pad over the corresponding support posts (the first-layer support posts) respectively. Take a hard board, align the positions of the mounting holes of the hard board with the positions of the support posts of the printed circuit board, and then put the mounting holes of the hard board over the corresponding support posts (the first-layer support posts) respectively. Then take 3 support posts (the second-layer support posts), and screw the threaded holes at the bottom of the second-layer support posts onto the studs at the top of the first-layer support posts until the soft pad and the hard board are pressed tightly (the first-layer soft pad and hard board).

[0072] (6) Take a soft pad, align the positions of the mounting holes of the soft pad with the positions of the second-layer support posts of the printed circuit board, and then put the mounting holes of the soft pad over the corresponding support posts (the second-layer support posts) respectively. Take a hard board, align the positions of the mounting holes of the hard board with the positions of the support posts of the printed circuit board, and then put the mounting holes of the hard board over the corresponding support posts (the second-layer support posts) respectively. Then take 3 I-shaped hexagon nuts M3, and screw the nuts onto the studs at the top of the second-layer support posts until the soft pad and the hard board are pressed tightly (the second-layer soft pad and hard board).

[0073] (7) Take a wire with the specification of C55 / 0812-20, thermally strip one end of the wire to remove the external insulation layer, and tin the wire core of the wire after removing the external insulation layer. Pass the tinned end of the wire through the wire holes of the second-layer hard board, the wire holes of the second-layer soft pad, the wire holes of the first-layer hard board, and the wire holes of the first-layer soft pad in sequence, and finally insert the wire core into the wire pad holes of the printed circuit board. Adjust the depth of the wire inserted into the pad holes, that is, the height of the wire insulation layer from the surface of the printed circuit board, within the range of 0.5 mm to 1 mm, and then trim the wire core exposed on the surface of the printed circuit board. The height of the wire core exposed on the surface of the printed circuit board is within the range of 1.5 ± 0.8 mm.

[0074] (8) Perform thermal stripping to remove the outer insulation layer of the remaining 39 wires with the specification of C55 / 0812 - 20, and tin the wire cores. Extract the wires after the above operations from the wire holes of the entire two - layer soft pads and hard board, and trim the cores of all the remaining wires according to the length of the extracted wire cores.

[0075] (9) Install all the wires according to the method in (7).

[0076] (10) Use wave - soldering equipment to solder the wire pads on the printed circuit board.

[0077] (11) Remove all 3 type - I hex nuts M3. Sequentially extract and remove the second - layer hard board and the second - layer soft pad from the soldered wires. When removing the soft pad, assist by heating the part where the soft pad is inserted into the wire with a hot air gun to soften the soft pad, and then extract the soft pad from the wire.

[0078] (12) According to the same method, remove all the second - layer support columns, and sequentially remove the first - layer hard board and the first - layer soft pad. Finally, loosen and remove the first - layer support columns and screws.

[0079] The content not described in detail in this application specification belongs to the well - known technology of those skilled in the art.

[0080] The above has described this application in detail in combination with specific embodiments and exemplary examples. However, these descriptions should not be construed as limiting this application. Those skilled in the art understand that without departing from the spirit and scope of this application, various equivalent replacements, modifications, or improvements can be made to the technical solutions and their implementation manners of this application, and all of these fall within the scope of this application. The protection scope of this application is subject to the appended claims.

Claims

1. A wave soldering wire fixing structure, comprising a printed circuit board (1), characterized in that: One side surface of the printed board (1) is a wire preparation welding surface, and the other side is a back side, the back side of the printed board (1) is connected to at least two composite layers via a connection structure, there is a preset distance between the composite layer and the printed board (1), and there is a preset distance between adjacent composite layers; The combined layer comprises a contacting soft pad (2) and a hard board (3), wherein the hard board (3) is located on a side of the soft pad (2) away from the printed board (1); the printed board (1) is provided with a wire pad hole (12) for allowing the wire to be welded to pass through to the wire preparation welding surface; the soft pad wire hole (22) is provided on the soft pad (2), the position and number of the soft pad wire hole (22) correspond to the position and number of the wire pad hole (12), the diameter d2 of the soft pad wire hole (22) is smaller than the outer diameter d1 of the wire containing the wire insulation layer; the hard board wire hole (32) is provided on the hard board, the position and number of the hard board wire hole (32) correspond to the position and number of the printed board wire pad hole (12), and the diameter d3 of the hard board wire hole (32) is larger than the outer diameter d1 of the wire containing the wire insulation layer.

2. The fixing structure of a wire using wave soldering according to claim 1, characterized in that: The diameter d2 of the soft pad wire hole (22) is 0.2 mm to 0.5 mm smaller than the outer diameter d1 of the wire including the wire insulation layer.

3. The fixing structure of a wire using wave soldering according to claim 1, characterized in that: The diameter d3 of the hard plate wire hole (32) is 0.2 mm to 0.5 mm larger than the outer diameter d1 of the wire including the wire insulation layer.

4. The fixing structure of a wire using wave soldering according to claim 1, characterized in that: The combined layer is detachably connected to the printed circuit board (1) via a connecting structure.

5. The fixing structure of a wire using wave soldering according to claim 1, characterized in that: The connection structure comprises a support column (4), a screw (6) and a nut (5); a threaded hole (41) is formed at one end of the support column (4), and a stud (42) is formed at the other end; the thread specifications of the threaded hole (41) and the stud (42) are consistent, and the thread specifications of the threaded hole (41) and the screw (6) are consistent; The printed circuit board (1) is provided with at least three non-collinear printed circuit board mounting holes (11), the soft pad (2) is provided with a soft pad mounting hole (21), and the hard board (3) is provided with a hard board mounting hole (31), and the position, size and number of the soft pad mounting hole (21) and the hard board mounting hole (31) are consistent with those of the printed circuit board mounting hole (11); The screw (6) passes through the printed circuit board (1) through the printed circuit board mounting hole (11), and the screw (6) is threadedly connected to the threaded hole (41) of the first layer of the support column (4), the stud (42) of the first layer of the support column (4) passes through the first layer of the combined layer and is threadedly connected to the threaded hole (41) of the second layer of the support column (4), and the stud (42) of the second layer of the support column (4) passes through the second layer of the combined layer and is threadedly connected to the threaded hole (41) of the next layer of the support column (4) or is threadedly connected to the nut (5).

6. The fixing structure of a wire using wave soldering according to claim 1, characterized in that: The soft pad (2) is made of a soft material and has elasticity, and the thickness of the soft pad (2) is 1 to 2 mm; the hard plate is made of a hard material and has a thickness of 1 to 3 mm.

7. A method for fixing a wire using wave soldering, characterized in that: The fixing is performed by using a fixing structure for a wire using wave soldering as described in any one of claims 1 to 6, comprising: S1, installing the printed circuit board (1) and the assembly layer via a connecting structure; S2, take a wire to be welded, remove the outer insulation layer of one end of the wire, and tin the wire core after the outer insulation layer is removed; pass the tinned end of the wire through the combination layer in sequence, and finally insert the wire core into the wire pad hole (12) of the printed board, adjust the depth of the wire inserted into the wire pad hole (12) of the printed board, and trim the wire core exposed from the printed board (1) until the height h1 of the wire insulation layer from the printed board surface and the height h2 of the wire core exposed from the printed board surface meet the requirements, thereby obtaining a trimmed wire; S3, extracting the trimmed wires in S2, removing the outer insulation layers of all the remaining wires and tinning the core wires of the wires to obtain the wires to be trimmed; trimming the wires to be trimmed according to the trimmed wires to obtain the target wires; S4, passing the target wire through the assembly layer in sequence, and finally inserting the wire core into the wire pad hole (12) of the printed board, adjusting the depth of the wire inserted into the wire pad hole (12) of the printed board, and obtaining a printed board wire assembly; S5. Use wave soldering equipment to solder the printed circuit board conductor assembly to obtain a soldered assembly; S6. Remove the combined layers of the welded components one by one.

8. A method for fixing a wire by wave soldering according to claim 7, characterized in that: The step S1, installing the printed board (1) and the assembly layer via a connection structure, comprises: S11, pass the screw (6) from the wire preparation welding surface through the printed circuit board mounting hole (11) to the back side, and thread the threaded hole (41) of the support column (4) to the screw (6), and the support column (4) is located on the back side of the printed circuit board (1); S12, respectively putting the soft pad mounting holes (21) of the soft pad (2) on the studs (42) of the support column at the corresponding positions, and then respectively putting the hard board mounting holes (31) of the hard board (3) on the studs (42) of the support column (4) at the corresponding positions; S13, then tighten the support column (4) and the stud (42) of the upper support column passing through the hard plate (3) until the soft pad (2) and the hard plate (3) are pressed tightly; S14, repeat S12 and S13 to sequentially install a preset number of combined layers; S15, tighten the nut (5) on the outside of the stud (42) of the support column that passes through the last combined layer.

9. A method for fixing a wire by wave soldering according to claim 7, characterized in that: In S6, the combined layers of the welded assembly are removed in sequence, including: Remove the nut (5), then pull out the outer hard plate (3) and the soft pad (2) from the welded wire and remove them; Then remove the outer support column (4), and then remove the next layer of hard board (3) and soft pad (2); repeat this step until all hard boards (3) and soft pads (2) are removed, and finally loosen and remove the support column (4) and screws (6) closest to the printed circuit board (1).

10. A method for fixing a wire by wave soldering according to claim 7, characterized in that: When the soft pad (2) is removed, a hot air gun is used to heat the portion of the soft pad (2) where the soft pad (2) is inserted into the wire, so that the soft pad (2) softens, making it easier to pull the soft pad (2) out of the wire.

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