Electronic equipment rear cover and electronic equipment

Abstract

The invention provides an electronic equipment rear cover and electronic equipment, and relates to the technical field of electronic equipment accessories. The electronic equipment rear cover comprises a rear cover body, the rear cover body is provided with a conductive circuit extending in the rear cover body, the conductive circuit comprises a first conductive connecting part and a second conductive connecting part which are separated from each other, and the first conductive connecting part and the second conductive connecting part are both exposed from the surface of one side of the rear cover body. The first conductive connection part is suitable for being electrically connected with a first device of the electronic equipment where the electronic equipment rear cover is located, and the second conductive connection part is suitable for being electrically connected with a second device of the electronic equipment. Through the arrangement, the first device and the second device of the electronic equipment are electrically connected through the conductive circuit, so that the stacking space occupied by a connecting element and a connector is saved while the transmission of an electric signal and a communication signal between the first device and the second device is ensured, the stacking thickness of the electronic equipment is effectively reduced, and the cost of the electronic equipment is reduced. And the weight of the electronic equipment is reduced.

Description

Technical Field

[0001] This application relates to the technical field of electronic device accessories, and particularly relates to an electronic device back cover and an electronic device. Background Art

[0002] With the development of science and technology, the speed of electronic device replacement is getting faster and faster, and people's demand for beautiful and thin electronic devices is increasing. Taking mobile phones as an example, there are various accessories with different functions stacked inside the mobile phone. Usually, a main board and a secondary board are installed at both ends in the length direction inside the mobile phone. Both have antenna signals of different frequency bands. The main board and the secondary board use connection components such as coaxial cables, LCP (Liquid Crystal Polymer) antennas, and flexible circuit boards to achieve the transmission of electrical signals and antenna signals.

[0003] In the prior art, connectors are usually arranged on the surfaces of devices such as the main board and the secondary board. Both ends of connection components such as coaxial cables, LCP antennas, and flexible circuit boards are respectively connected to the connectors, and then connected to the circuits of the main board and the secondary board to achieve the transmission of electrical signals and antenna signals between the main board and the secondary board. In the stacking space of the mobile phone, positions for the connectors and connection components need to be reserved, which occupies a large space, increases the stacking thickness of the mobile phone, reduces the space utilization rate inside the mobile phone, is not conducive to reducing the weight and thickness of the mobile phone, and affects the user experience. Summary of the Invention

[0004] In view of this, this application provides an electronic device back cover and an electronic device to save the stacking space of the electronic device and reduce the thickness of the electronic device.

[0005] Specifically, the following technical solutions are included:

[0006] In a first aspect, an embodiment of this application provides an electronic device back cover, including a back cover body. The back cover body has a conductive circuit extending therein. The conductive circuit includes a first conductive connection portion and a second conductive connection portion that are spaced apart. Both the first conductive connection portion and the second conductive connection portion are exposed from one surface of the back cover body. The first conductive connection portion is adapted to be electrically connected to a first device of the electronic device where the electronic device back cover is located, and the second conductive connection portion is adapted to be electrically connected to a second device of the electronic device.

[0007] In this embodiment, by providing that the rear cover body includes a conductive circuit, the first device and the second device of the electronic device are electrically connected through the first conductive connection part and the second conductive connection part. While ensuring the transmission of electrical signals and antenna signals between the first device and the second device, the stacking space occupied by arranging connection components and connectors is saved, effectively reducing the stacking thickness of the electronic device, facilitating the reduction of the weight of the electronic device, realizing the thin and light design of the electronic device, and improving the user experience.

[0008] In an alternative embodiment, the rear cover body includes at least two insulating layers and at least one conductive layer, the insulating layers and the conductive layer are alternately stacked, the two outermost layers of the rear cover body are both insulating layers, and the conductive layer forms at least a part of the conductive circuit. Through this arrangement, the safety performance of the rear cover of the electronic device can be ensured, preventing the occurrence of short - circuit or leakage phenomena and avoiding affecting the normal use of the electronic device.

[0009] In an alternative embodiment, when the conductive layer is multi - layer, through - holes are formed in the insulating layer between two adjacent conductive layers, the through - holes penetrate the insulating layer along the thickness direction of the insulating layer, and the two adjacent conductive layers are electrically connected at the through - holes so that the multi - layer conductive layers are electrically connected to each other.

[0010] In this embodiment, by providing through - holes, connection positions and spaces are provided for adjacent conductive layers, which helps to save the stacking space inside the electronic device and improve the space utilization rate inside the electronic device.

[0011] In an alternative embodiment, through - holes are formed in one of the insulating layers located on the outermost side of the rear cover body, the through - holes penetrate the insulating layer along the thickness direction of the insulating layer, and the first conductive connection part and the second conductive connection part are electrically connected to the first device and the second device at the through - holes.

[0012] In this embodiment, by forming through - holes in one of the insulating layers located on the outermost side of the rear cover body, positions and spaces for the conductive circuit to be electrically connected to the first device and the second device are provided, which is not only convenient for positioning but also helps to save the stacking space inside the electronic device and improve the space utilization rate inside the electronic device.

[0013] In an alternative embodiment, the conductive layer is provided with connection bumps, and the positions of the connection bumps are adapted to the positions of the through - holes or the through - holes;

[0014] The connection bumps are used to realize the electrical connection between two adjacent conductive layers, and / or the connection bumps are used to realize the electrical connection between the conductive layer and the first device and the second device.

[0015] In an alternative embodiment, the rear cover of the electronic device further includes an elastic connecting member. One end of the elastic connecting member is connected to the first device or the second device, and the other end is connected to the conductive layer at the connection hole. The elastic connecting member has electrical conductivity and elastic deformation ability.

[0016] In an alternative embodiment, the adjacent conductive layers are magnetically connected to each other, and / or the conductive layer is magnetically connected to the first device and the second device.

[0017] In an alternative embodiment, the conductive layer includes one or more of a metal printed circuit board, an induction coil, and a metal wire. With this arrangement, while ensuring the normal use of functions such as wireless charging and NFC, the electrical connection between the first device and the second device is also achieved, effectively reducing the stacking space inside the electronic device and greatly improving the space utilization rate inside the electronic device.

[0018] In an alternative embodiment, a receiving space is provided inside the rear cover body, and the conductive circuit is installed in the receiving space.

[0019] In a second aspect, an embodiment of the present application provides an electronic device, which includes the rear cover of the electronic device provided in any embodiment of the first aspect, and further includes a first device and a second device. The first conductive connection portion of the rear cover of the electronic device is electrically connected to the first device, and the second conductive connection portion of the rear cover of the electronic device is electrically connected to the second device.

[0020] The beneficial effects of the technical solution provided by the embodiment of the present application at least include: By providing that the rear cover body has a conductive circuit, the first device and the second device of the electronic device are electrically connected through the first conductive connection portion and the second conductive connection portion. While ensuring the transmission of electrical signals and communication signals between the first device and the second device, the stacking space occupied by setting connection elements and connectors is saved, effectively reducing the stacking thickness of the electronic device, which is beneficial to reducing the weight of the electronic device, realizing the thin and light design of the electronic device, and improving the user experience. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0022] Figure 1 It is an exploded view of the rear cover body of the rear cover of the electronic device provided by the embodiment of the present application;

[0023] Figure 2 Schematic diagram of the back cover body of the electronic device back cover provided by the embodiment of the present application;

[0024] Figure 3 Schematic diagram of the cooperation between the electronic device back cover and the first device and the second device provided by an embodiment of the present application;

[0025] Figure 4 Schematic diagram of the cooperation between the electronic device back cover and the first device and the second device provided by another embodiment of the present application;

[0026] Figure 5 Schematic diagram of the cooperation between the electronic device back cover and the first device and the second device provided by yet another embodiment of the present application.

[0027] The reference numerals in the figure are respectively represented as:

[0028] 1 - back cover body; 10 - conductive circuit; 101 - conductive layer; 102 - first conductive connection part; 103 - second conductive connection part; 20 - insulating layer; 201 - through hole; 202 - connection hole; 30 - connection bump; 40 - elastic connection member; 50 - accommodation space;

[0029] 100 - first device; 200 - second device.

[0030] Through the above - mentioned drawings, the clear embodiments of the present application have been shown, and there will be more detailed descriptions hereinafter. These drawings and textual descriptions are not intended to limit the scope of the concept of the present application in any way, but to illustrate the concept of the present application to those skilled in the art by referring to specific embodiments. Detailed implementation manners

[0031] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all of the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present application without creative efforts shall fall within the protection scope of the present application.

[0032] It should be noted that when a component is referred to as being "fixed to" another component, it can be directly on the other component or there may also be an intermediate component. When a component is considered to be "connected" to another component, it can be directly connected to the other component or there may be an intermediate component at the same time.

[0033] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection, an electrical connection, or communication with each other; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0034] Unless otherwise defined, all technical and scientific terms used in the present invention have the same meaning as those commonly understood by those skilled in the art to which the present invention belongs. The terms used in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used in the present invention includes any and all combinations of one or more of the related listed items.

[0035] In the description of the embodiments of the present invention, it should be noted that the orientation or positional relationship of terms such as "upper", "lower", "vertical", "horizontal", "inside" and "outside" are based on the orientation or positional relationship described in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0036] In order to make the technical solutions and advantages of the present application more clear, the implementation methods of the present application will be further described in detail below with reference to the accompanying drawings.

[0037] like Figures 1 to 5 The embodiment of the present application provides an electronic device back cover, which is applied to electronic devices. The electronic devices may be mobile phones, tablet computers, walkie-talkies, game consoles, video players, music players, camera equipment, etc.

[0038] The electronic device includes a first device 100 and a second device 200. The first device 100 may be a main board, and the second device 200 may be a sub-board. Both the main board and the sub-board are used to carry electronic components. Exemplarily, the first device 100 and the second device 200 are distributed at both ends of the length direction of the electronic device.

[0039] The rear cover of the electronic device includes a rear cover body 1, and the rear cover body 1 has a conductive circuit 10 extending therein. The conductive circuit 10 includes a spaced-apart first conductive connection portion 102 and a second conductive connection portion 103. Both the first conductive connection portion 102 and the second conductive connection portion 103 are exposed from one side surface of the rear cover body 1. The first conductive connection portion 102 is adapted to be electrically connected to a first device 100 of the electronic device where the rear cover of the electronic device is located, and the second conductive connection portion 103 is adapted to be electrically connected to a second device 200 of the electronic device.

[0040] The conductive circuit 10 has conductivity. The first conductive connection portion 102 and the second conductive connection portion 103 are located at both ends on the conductive circuit 10. The first device 100 and the second device 200 are electrically connected through the first conductive connection portion 102 and the second conductive connection portion 103, thereby realizing the transmission of electrical signals and communication signals.

[0041] It should be understood that there is generally more than one conductive circuit 10. The first conductive connection portion 102 and the second conductive connection portion 103 on the same conductive circuit 10 are generally electrically connected to each other, so as to form a conductive path between the first device 100 and the second device 200.

[0042] In the prior art, connectors are usually provided on the surfaces of the first device 100 and the second device 200. The connectors protrude outward in the thickness direction of the first device 100 and the second device 200. One end of connection elements such as coaxial cables, LCP antennas, and flexible circuit boards is connected to the connector on the first device 100, and the other end is connected to the connector on the second device 200, thereby electrically connecting the first device 100 and the second device 200.

[0043] In the embodiment of the present application, the rear cover body 1 includes the conductive circuit 10, which is equivalent to integrating the connectors and connection elements into the rear cover of the electronic device, saving the space occupied in the thickness direction of the rear cover body 1, enabling the internal stacking space of the electronic device to be more compact, improving the space utilization rate inside the electronic device, helping to reduce the thickness and weight of the electronic device, and making the electronic device thinner and lighter.

[0044] Exemplarily, the conductive circuit 10 is disposed inside or on the surface of the rear cover body 1. The conductive circuit 10 can not only transmit electric energy between the first device 100 and the second device 200, but also transmit communication signals such as digital signals and analog signals between the first device 100 and the second device 200. Both the first conductive connection portion 102 and the second conductive connection portion 103 are exposed from one side surface of the rear cover body 1, facilitating connection to the first device 100 and the second device 200.

[0045] The back cover of the electronic device provided by the embodiment of the present application enables the first device 100 and the second device 200 of the electronic device to be electrically connected through the first conductive connection portion 102 and the second conductive connection portion 103 by providing that the back cover body 1 has a conductive circuit 10. While ensuring the transmission of electrical signals and antenna signals between the first device 100 and the second device 200, the stacking space occupied by setting connection elements and connectors is saved, the stacking thickness of the electronic device is effectively reduced, which is beneficial to reducing the weight of the electronic device, realizing the thin and light design of the electronic device, and improving the user experience.

[0046] In a specific embodiment, the back cover body 1 includes at least two insulating layers 20 and at least one conductive layer 101, and the insulating layers 20 and the conductive layer 101 are alternately stacked. The two outermost layers of the back cover body 1 are both insulating layers 20, and the conductive layer 101 forms at least a part of the conductive circuit 10. The first conductive connection portion 102 and the second conductive connection portion 103 can be separated from the conductive layer 101 or integrated into the conductive layer 101. It can be understood that the two outermost layers of the back cover body 1 are the two layers at the top layer and the bottom layer in the thickness direction of the back cover body 1. For example Figure 1 the insulating layer 20 at the uppermost position and the insulating layer 20 at the lowermost position in [example] are the two outermost layers of the back cover body 1.

[0047] Exemplarily, the insulating layer 20 is made of fiberglass material, having good insulation, corrosion resistance and heat resistance, and at the same time having the advantages of high toughness, drop resistance and light weight. Exemplarily, the conductive layer 101 is made of materials such as metal or alloy, composite metal, etc., having good electrical conductivity.

[0048] In this embodiment, the insulating layers 20 and the conductive layer 101 are alternately stacked along the thickness direction of the back cover body 1. There is one conductive layer 101 between every two adjacent insulating layers 20. The insulating layers 20 and the conductive layer 101 are laminated and pressed at least three layers to form the back cover body 1, and the conductive layer 101 is electrically connected to the first device 100 and the second device 200 respectively. Among them, since the insulating layers 20 and the conductive layer 101 are alternately stacked at least three layers, and the two outermost layers of the back cover body 1 are both insulating layers 20, the safety performance of the back cover of the electronic device can be ensured, preventing the occurrence of short circuit or leakage, and avoiding affecting the normal use of the electronic device.

[0049] The shape of the conductive layer 101 can be the same as that of the insulating layer 20 or different from that of the insulating layer 20; the size of the conductive layer 101 can be the same as that of the insulating layer 20 or smaller than that of the insulating layer 20.

[0050] Exemplarily, such as Figure 1As shown, the insulating layer 20 and the conductive layer 101 are both rectangular sheets, and the insulating layer 20 and the conductive layer 101 are press-fitted up and down to form a rectangular sheet-shaped rear cover body 1. Among them, both the insulating layer 20 and the conductive layer 101 have a length direction, a width direction, and a thickness direction. For example Figure 1 As shown, the X direction is the width direction of the rear cover body 1, the insulating layer 20, and the conductive layer 101, the Y direction is the length direction of the rear cover body 1, the insulating layer 20, and the conductive layer 101, and the Z direction is the thickness direction of the rear cover body 1, the insulating layer 20, and the conductive layer 101.

[0051] Optionally, the thickness of each insulating layer 20 is 0.03 mm to 0.2 mm. For example, the thickness of each insulating layer 20 can be 0.03 mm, 0.05 mm, 0.1 mm, 0.2 mm, etc. The thickness of the rear cover body 1 is 0.3 mm to 2 mm. For example, the thickness of the rear cover body 1 can be 0.3 mm, 0.5 mm, 1 mm, 2 mm, etc. Specifically, it can be set according to the type of the electronic device and the strength requirement of the rear cover of the electronic device, etc.

[0052] The number of the insulating layer 20 and the conductive layer 101 can be set according to actual needs. For example Figure 1 As shown, there are three insulating layers 20 and two conductive layers 101; or, there are two insulating layers 20 and one conductive layer 101; or, there are four insulating layers 20 and three conductive layers 101, etc. As long as the insulating layer 20 and the conductive layer 101 are alternately laminated, and the two outermost layers of the rear cover body 1 are both insulating layers 20, they are all within the protection scope of the embodiments of the present application.

[0053] It can be understood that in the case where the conductive layer 101 is multi-layered, the multiple conductive layers 101 are electrically connected to each other to jointly form at least a part of the conductive circuit 10.

[0054] In an optional embodiment, in the case where the conductive layer 101 is multi-layered, conductive pins are provided at both opposite edges of each conductive layer 101, and the conductive pins extend outwards from the conductive layer 101. One conductive pin is in contact electrical connection with the conductive pin of an adjacent conductive layer 101, and the other conductive pin is in contact electrical connection with the conductive pin of another adjacent conductive layer 101 to realize the electrical connection between the multiple conductive layers 101 and reduce the space occupied in the thickness direction of the rear cover body 1.

[0055] In another optional embodiment, as Figure 1As shown, when the conductive layer 101 is multilayered, a through hole 201 is provided in the insulating layer 20 between two adjacent conductive layers 101. The through hole 201 penetrates the insulating layer 20 along the thickness direction of the insulating layer 20, and the two adjacent conductive layers 101 are electrically connected at the through hole 201, so that the multilayer conductive layers 101 are electrically connected to each other. Exemplarily, a metal contact protrudes from the surface of the conductive layer 101, and the position of the metal contact is adapted to the position of the through hole 201. When the conductive layer 101 is aligned with the insulating layer 20, the metal contact passes through the through hole 201 and contacts the surface of the adjacent conductive layer 101, realizing the electrical connection between two adjacent conductive layers 101. Exemplarily, after the insulating layer 20 and the conductive layer 101 are pressed together, any two adjacent conductive layers 101 make surface contact at the through hole 201 under the action of the pressing force, thereby realizing electrical connection.

[0056] In this embodiment, by providing the through hole 201, a connection position and space are provided for adjacent conductive layers 101, which helps to save the stacking space inside the electronic device and improve the space utilization rate inside the electronic device.

[0057] In this embodiment, the number of through holes 201 on the insulating layer 20 can be one or more. For example, twelve through holes 201 are provided on the insulating layer 20. Optionally, the multiple through holes 201 are arranged in an array on the insulating layer 20. For example, the twelve through holes 201 are distributed on both sides in the width direction of the insulating layer 20, and each side has six through holes 201 arranged side by side in a rectangular array. Optionally, the shape of the through hole 201 can be rectangular, circular, triangular or other polygons, and the size of the through hole 201 can be set according to actual needs, and no specific limitation is made in this application.

[0058] In a further embodiment, a connection hole 202 is provided in one of the insulating layers 20 on the outermost side of the rear cover body 1. The connection hole 202 penetrates the insulating layer 20 along the thickness direction of the insulating layer 20, and the first conductive connection portion 102 and the second conductive connection portion 103 are electrically connected to the first device 100 and the second device 200 at the connection hole 202. When the electronic device is assembled, the insulating layer 20 provided with the connection hole 202 is located on the side facing the first device 100 and the second device 200, and the conductive layer 101 adjacent to the insulating layer 20 is used to be directly electrically connected to the first device 100 and the second device 200.

[0059] Among them, the number of connection holes 202 can be one or more. For example Figure 1 As shown, six connection holes 202 are provided in the insulating layer 20 at the uppermost part of the rear cover body 1. Optionally, the multiple connection holes 202 are arranged in an array on the insulating layer 20. For example Figure 1 and Figure 2As shown, six connection holes 202 are distributed on the insulating layer 20 and are arranged in a rectangular array of two rows and three columns. The first conductive connection part 102 and the second conductive connection part 103 respectively correspond to the positions of two connection holes 202 in the same column, so that the first conductive connection part 102 and the second conductive connection part 103 are respectively exposed relative to one side surface of the rear cover body 1, and then are connected to the first device 100 or the second device 200. Optionally, the shape of the connection hole 202 can be rectangular, circular, triangular or other polygons, and the size, shape, quantity and arrangement of the connection holes 202 can be set according to actual needs, and the present application does not make specific limitations.

[0060] In this embodiment, by opening connection holes 202 in one of the insulating layers 20 located on the outermost side of the rear cover body 1, positions and spaces for electrically connecting the conductive lines 10 to the first device 100 and the second device 200 are provided, which is not only convenient for positioning, but also helps to save the stacking space inside the electronic device and improve the space utilization rate inside the electronic device.

[0061] In an alternative embodiment, as Figure 3 shown, the conductive layer 101 is provided with connection bumps 30, and the positions of the connection bumps 30 are adapted to the positions of the through holes 201 or the connection holes 202. The connection bumps 30 are used to achieve electrical connection between adjacent two conductive layers 101, and / or the connection bumps 30 are used to achieve electrical connection between the conductive layer 101 and the first device 100 and the second device 200. It can be understood that the sizes of the connection bumps 30 between adjacent two conductive layers 101 and the connection bumps 30 between the conductive layer 101 and the first device 100 / second device 200 can be the same or different.

[0062] In this embodiment, the connection bumps 30 have conductivity. The connection bumps 30 protrude outward relative to the conductive layer 101 and pass through the through holes 201 or the connection holes 202, and are in contact with and electrically connected to the adjacent conductive layer 101, the first device 100 or the second device 200, so as to achieve electrical connection between adjacent two conductive layers 101, or electrical connection between the conductive layer 101 and the first device 100 and the second device 200, saving the stacking space inside the electronic device and reducing the thickness of the rear cover body 1, which is beneficial to realizing the thin and light design of the electronic device.

[0063] In another embodiment, as Figure 4 shown, the electronic device rear cover further includes an elastic connection member 40. One end of the elastic connection member 40 is connected to the first device 100 or the second device 200, and the other end is connected to the conductive layer 101 at the connection hole 202. The elastic connection member 40 has conductivity and elastic deformation ability.

[0064] In this embodiment, the elastic connecting member 40 can be an element with elastic deformation ability such as a spring or a spring piece. The length direction of the elastic connecting member 40 is parallel to the thickness direction of the rear cover body 1. The elastic connecting member 40 can generate elastic deformation in its own length direction. After the electronic device is assembled, the elastic connecting member 40 is compressed, and both ends of the elastic connecting member 40 generate thrust on the conductive layer 101 and the first device 100 / second device 200 respectively.

[0065] The elastic connecting member 40 can be fixed to the first device 100 or the second device 200, or can be fixed to the conductive layer 101 and pass through the connection hole 202, or can also be fixed to the bracket between the rear cover body 1 and the first device 100. By arranging the elastic connecting member 40 between the conductive layer 101 and the first device 100 and the second device 200, the electrical connection between the conductive layer 101 and the first device 100 and the second device 200 is realized. The elastic force of the elastic connecting member 40 is used to ensure the connection stability and prevent poor contact between the conductive layer 101 and the first device 100 and the second device 200, which affects the normal function of the electronic device.

[0066] In another embodiment, the adjacent conductive layers 101 are magnetically coupled, and / or the conductive layer 101 and the first device 100 and the second device 200 are magnetically coupled.

[0067] Optionally, the conductive layer 101, the first device 100 and the second device 200 can be provided with magnetic members, and the magnetic force between the magnetic members is used to realize the magnetic coupling. Optionally, the conductive layer 101, the first device 100 and the second device 200 themselves have magnetism. Optionally, the connecting elements of the conductive layer 101, the first device 100 and the second device 200 have magnetism. For example, the connecting bumps 30 provided on the conductive layer 101, the first device 100 and the second device 200 have magnetism, which further improves the connection stability between the conductive layers 101 and the connection stability between the conductive layer 101 and the first device 100 and the second device 200.

[0068] Based on any of the above embodiments, the conductive layer 101 includes one or more of a metal printed circuit board, an induction coil, and a metal wire. For example, the conductive layer 101 can be a printed circuit copper foil, a wireless charging coil, an NFC (Near Field Communication) coil, etc. By integrating functional elements into the rear cover body 1, while ensuring the normal use of functions such as wireless charging and NFC, the electrical connection between the first device 100 and the second device 200 is also realized, effectively reducing the stacking space inside the electronic device and greatly improving the space utilization rate inside the electronic device.

[0069] In one embodiment, as Figure 5As shown, the rear cover body 1 is provided with an accommodating space 50 , and the conductive circuit 10 is installed in the accommodating space 50 .

[0070] In this embodiment, the conductive circuit 10 may include a coaxial line, an LCP antenna, a flexible circuit board, etc. The back cover body 1 may be provided with a groove or an inner cavity, and the conductive circuit 10 is installed in the accommodating space 50 to reduce the stacking space occupied inside the electronic device.

[0071] The embodiment of the present application also provides an electronic device, including the electronic device back cover provided by any of the above embodiments, and also including a first device 100 and a second device 200, wherein the electronic device back cover is used to be electrically connected to the first device 100 and the second device 200. The electronic device may be a mobile phone, a tablet computer, a walkie-talkie, a game console, a video player, a music player, a camera device, etc. The first device 100 may be a main board of the electronic device, and the second device 200 may be a sub-board of the electronic device.

[0072] Those skilled in the art will readily appreciate other embodiments of the present application after considering the specification and practicing the present application disclosed herein. The present application is intended to cover any variations, uses or adaptations of the present application, which follow the general principles of the present application and include common knowledge or customary techniques in the art that are not disclosed in the present application. The specification and examples are intended to be exemplary only.

[0073] It should be understood that the present application is not limited to the precise structures that have been described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present application is limited only by the appended claims.

Claims

1. An electronic device rear cover, characterized in that, It includes a rear cover body (1), the rear cover body (1) has a conductive circuit (10) extending therein, the conductive circuit (10) includes spaced-apart first conductive connection portions (102) and second conductive connection portions (103), both the first conductive connection portion (102) and the second conductive connection portion (103) are exposed from one side surface of the rear cover body, the first conductive connection portion (102) is adapted to be electrically connected to a first device (100) of the electronic device where the rear cover of the electronic device is located, and the second conductive connection portion (103) is adapted to be electrically connected to a second device (200) of the electronic device.

2. The electronic device rear cover according to claim 1, characterized in that, The rear cover body (1) includes at least two insulating layers (20) and at least one conductive layer (101), the insulating layers (20) and the conductive layer (101) are alternately laminated, the two outermost layers of the rear cover body (1) are both the insulating layers (20), and the conductive layer (101) forms at least a part of the conductive circuit (10).

3. The electronic device rear cover according to claim 2, characterized in that, When the conductive layer (101) is multi-layered, through holes (201) are provided in the insulating layer (20) between two adjacent conductive layers (101), the through holes (201) penetrate the insulating layer (20) along the thickness direction of the insulating layer (20), and the two adjacent conductive layers (101) are electrically connected at the through holes (201) so that the multi-layered conductive layers (101) are electrically connected to each other.

4. The electronic device rear cover according to claim 3, characterized in that, One of the insulating layers (20) located on the outermost side of the rear cover body (1) is provided with connection holes (202), the connection holes (202) penetrate the insulating layer (20) along the thickness direction of the insulating layer (20), and the first conductive connection portion (102) and the second conductive connection portion (103) are electrically connected to the first device (100) and the second device (200) at the connection holes (202).

5. The electronic device rear cover according to claim 4, characterized in that, The conductive layer (101) is provided with connection bumps (30), and the positions of the connection bumps (30) are adapted to the positions of the through holes (201) or the connection holes (202); The connection bumps (30) are used to achieve electrical connection between two adjacent conductive layers (101), and / or, the connection bumps (30) are used to achieve electrical connection between the conductive layer (101) and the first device (100) and the second device (200).

6. The electronic device rear cover according to claim 4, characterized in that, The rear cover of the electronic device further includes an elastic connector (40), one end of the elastic connector (40) is connected to the first device (100) or the second device (200), and the other end is connected to the conductive layer (101) at the connection holes (202), and the elastic connector (40) has conductivity and elastic deformation ability.

7. The electronic device rear cover according to claim 4, characterized in that, The connection between adjacent conductive layers (101) is a magnetic attraction connection, and / or, the connection between the conductive layer (101) and the first device (100) and the second device (200) is a magnetic attraction connection.

8. The electronic device rear cover according to any one of claims 2 to 7, characterized in that, The conductive layer (101) includes one or more of a metal printed circuit board, an induction coil, and a metal wire.

9. The electronic device rear cover according to claim 1, characterized in that, A receiving space (50) is provided in the rear cover body (1), and the conductive circuit (10) is installed in the receiving space (50).

10. An electronic device, characterized in that, An electronic device rear cover according to any one of claims 1 to 9, further comprising a first device (100) and a second device (200), wherein a first conductive connection portion (102) of the electronic device rear cover is electrically connected to the first device (100), and a second conductive connection portion (103) of the electronic device rear cover is electrically connected to the second device (200).

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