Working head

Abstract

The work head performs work on a substrate in a substrate work machine, the work head has an LED package used in an imaging device, and the LED package is selectively turned on in a first mode in which the LED package is turned on when imaging is performed by the imaging device and a second mode in which the LED package is turned on when imaging is not performed by the imaging device.

Description

Technical Field

[0001] The present invention relates to a working head for working on a substrate in a substrate working machine. Background Art

[0002] In the following patent document, the following is described: When the brightness of an LED package decreases due to gas that has penetrated into the sealing resin of the LED package, the LED package is lit in a predetermined environment to restore the brightness of the LED package.

[0003] Prior Art Documents

[0004] Patent Documents

[0005] Patent Document 1: Japanese Unexamined Patent Application Publication No. 2017-117993 Summary of the Invention

[0006] Problems to be Solved by the Invention

[0007] The problem of the present specification is to restore the brightness of an LED package in a working head having the LED package.

[0008] Means for Solving the Problems

[0009] To solve the above problems, the present specification discloses a working head that works on a substrate in a substrate working machine, wherein the working head has an LED package used in an imaging device, and the LED package is selectively lit in a first mode in which the LED package is lit when the imaging device performs imaging and a second mode in which the LED package is lit when the imaging device does not perform imaging.

[0010] Advantages of the Invention

[0011] In the present disclosure, the working head has an LED package used in an imaging device, and the LED package is selectively lit in a first mode in which the LED package is lit when the imaging device performs imaging and a second mode in which the LED package is lit when the imaging device does not perform imaging. Thus, imaging can be performed by lighting the LED package in the first mode, and the brightness of the LED package can be restored by lighting the LED package in the second mode. Brief Description of the Drawings

[0012] Figure 1 It is a perspective view showing a substrate working system.

[0013] Figure 2 It is a perspective view showing a mounting device.

[0014] Figure 3 It is a schematic view showing a mounting head.

[0015] Figure 4 This is a perspective view showing an LED package.

[0016] Figure 5 This is a block diagram showing a control device.

[0017] Figure 6 This is a schematic view showing a mounting head of a second embodiment. Detailed implementation mode

[0018] Hereinafter, as a mode for implementing the present invention, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0019] Figure 1 It represents a substrate processing system 10. Figure 1 The shown substrate processing system 10 is a system for manufacturing a circuit board on which electronic components are mounted. The substrate processing system 10 is composed of three electronic component mounting devices (hereinafter, sometimes simply referred to as "mounting devices") 12 and a reflow oven 16 that are arranged adjacent to each other.

[0020] The mounting device 12 is configured to include a single system base 20 and two electronic component mounters (hereinafter, sometimes simply referred to as "mounters") 22 that are arranged adjacent to each other on the system base 20. That is, six mounters 22 are arranged in a row. In addition, when differentiating the six mounters 22, they are sometimes described as the first to sixth mounters 22 from the mounter 22 arranged at the most upstream to the mounter 22 arranged at the most downstream.

[0021] In addition, a reflow oven 16 is arranged on the downstream side of the mounter 22 arranged at the most downstream among the six mounters 22, that is, the sixth mounter 22. Incidentally, in the following description, the arrangement direction of the mounter 22 and the reflow oven 16 is referred to as the X-axis direction, and the horizontal direction perpendicular to this direction is referred to as the Y-axis direction.

[0022] First, the mounting device 12 will be described. Since the three mounting devices 12 have substantially the same structure, one of the three mounting devices 12 will be described as a representative. As Figure 2 shown, the mounting device 12 has a single system base 20 and two adjacent mounters 22 on the system base 20. Each mounter 22 mainly includes a mounter body 24, a transfer device 26, a mounting head moving device (hereinafter, sometimes simply referred to as "moving device") 28, a mounting head 30, and a supply device 32.

[0023] The mounter body 24 is composed of a frame 36 and a beam 38 mounted on the frame 36.

[0024] The transfer device 26 includes two conveyor devices 40 and 42. These two conveyor devices 40 and 42 are arranged on the frame 36 in a manner parallel to each other and extending in the X-axis direction. The two conveyor devices 40 and 42 respectively convey the circuit boards supported on each conveyor device 40 and 42 in the X-axis direction by electromagnetic motors (refer to Figure 5 ). And, the circuit boards conveyed by each conveyor device 40 and 42 are held at a predetermined position by a board holding device (refer to Figure 5 ).

[0025] The moving device 28 is an XY robot type moving device. The moving device 28 includes an electromagnetic motor (refer to Figure 5 ) 52 that slides the slider 50 in the X-axis direction and an electromagnetic motor (refer to Figure 5 ) 54 that slides the slider 50 in the Y-axis direction. An attachment head 30 is mounted on the slider 50, and the attachment head 30 moves to any position on the frame 36 through the operation of the two electromagnetic motors 52 and 54. In addition, the attachment head 30 can be attached and detached from the slider 50 with a single operation without the operator using tools or the like.

[0026] The attachment head 30 mounts electronic components on the circuit board. As Figure 3 shown, the attachment head 30 has a suction nozzle 60 provided at the central portion of the lower end face. The suction nozzle 60 is communicated with a positive and negative pressure supply device (refer to Figure 5 ) 62 via a negative pressure air and positive pressure air passage. The suction nozzle 60 adsorbs and holds the electronic components by negative pressure and releases the held electronic components by positive pressure. In addition, the attachment head 30 has a nozzle lifting device (refer to Figure 5 ) 64 that lifts and lowers the suction nozzle 60. Through this nozzle lifting device 64, the attachment head 30 changes the position of the held electronic components in the up and down direction. Moreover, the attachment head 30 has a lighting device 66 and a photographing device 68 arranged on the lower end face so as to sandwich the suction nozzle 60. An LED package 70 is built in the lighting device 66, and the LED package 70 is arranged on the lower end face of the attachment head 30 in a posture facing the front end of the suction nozzle 60. In addition, the photographing device 68 is arranged at a position facing the lighting device 66 with the suction nozzle 60 as the center. Thus, the electronic components held by the suction nozzle 60 are photographed by the photographing device 68 in a state irradiated by the LED package 70 of the lighting device 66. In addition, the attachment head 30 has a control device (refer to Figure 5 ) 72, and the operation of the nozzle lifting device 64, the lighting device 66, and the photographing device 68 is controlled by the control device 72.

[0027] By the way, as Figure 4As shown, the LED package 70 is composed of a package substrate 74, a pair of lead frames 76, 78, an LED element 80, and a sealing resin 82. The package substrate 74 is generally in a long strip shape, and a pair of lead frames 76, 78 are disposed at both ends in the length direction of the package substrate 74. An LED element 80 is fixed on one of the pair of lead frames 76, 78, and the other lead frame 78 is connected to the LED element 80 by a wire 84. Moreover, the LED element 80 fixed to the lead frame 76 and the wire 84 connecting the lead frame 78 and the LED element 80 are covered by the sealing resin 82.

[0028] In addition, as Figure 2 shown, the supply device 32 is a feeder type supply device and is disposed at the end of the frame 36. The supply device 32 has a plurality of tape feeders 86. The tape feeder 86 accommodates the tape-form elements in a wound state. The tape-form elements are elements formed by taping electronic components on a carrier tape. And the tape feeder 86 sends out the tape-form elements through a feeding device (refer to Figure 5 ) 88. Thus, the feeder type supply device 32 supplies electronic components at the supply position by sending out the tape-form elements.

[0029] In addition, the reflow oven 16 is a device that heats the circuit board on which electronic components are mounted to melt the paste solder and then fixes the electronic components on the circuit board. The reflow oven 16 is connected to the installation machine 22 disposed at the most downstream among the above six installation machines 22, that is, the sixth installation machine 22. The reflow oven 16 has conveyor devices 90, 92 having the same structure as the conveyor devices 40, 42 of the above installation machine 22. Moreover, the conveyor device 90 of the reflow oven 16 is connected to the conveyor device 40 of the sixth installation machine 22, and the conveyor device 92 of the reflow oven 16 is connected to the conveyor device 42 of the sixth installation machine 22. In addition, the reflow oven 16 has a heater (refer to Figure 5 ) 96 for heating the circuit boards conveyed by the respective conveyor devices 90, 92.

[0030] In addition, as Figure 5 shown, the substrate processing system 10 has a control device 100. The control device 100 has a controller 102, and the controller 102 is connected to the transfer device 26, the moving device 28, the mounting head 30, the tape feeder 86, and the reflow oven 16 of the installation machine 22. The controller 102 has a CPU, a ROM, a RAM, etc., and is mainly a computer. Thus, the operations of the transfer device 26, the moving device 28, the mounting head 30, the tape feeder 86, and the reflow oven 16 of the installation machine 22 are controlled by the controller 102. In addition, a production program 110 is stored in the controller 102, and the controller 102 controls the operations of the installation machine 22 and the reflow oven 16 according to the production program 110, thereby producing a circuit board.

[0031] Specifically, first, when the circuit board is carried into the first mounter 22, the controller 102 outputs an instruction according to the production program 110. As a result, the transfer device 26 of the first mounter 22 transfers the circuit board to the working position and fixedly holds it at this position. In addition, the tape feeder 86 sends out the tape-form components according to the instruction of the controller 102 in accordance with the production program 110, and supplies the electronic components at the supply position. And, the mounting head 30 moves above the supply position of the electronic components according to the instruction of the controller 102 in accordance with the production program 110, and adsorbs and holds the electronic components through the suction nozzle 60. Next, the mounting head 30 lights up the LED package 70 according to the instruction of the controller 102 in accordance with the production program 110, and takes a picture of the electronic components held by the suction nozzle 60. Then, in the controller 102, calculations are performed on the holding position, holding posture, etc. of the electronic components based on the captured data. Next, the mounting head 30 moves above the circuit board according to the instruction of the controller 102 in accordance with the production program 110, and mounts the held electronic components on the circuit board. At this time, based on the calculated holding position, holding posture, etc. of the electronic components, the orientation, posture, etc. of the electronic components held by the suction nozzle 60 are corrected, and the electronic components are mounted on the circuit board. Then, when the operation of mounting the electronic components on the circuit board in the first mounter 22 is completed, according to the instruction of the controller 102 in accordance with the production program 110, the transfer device 26 transfers the circuit board to the downstream side. Thus, the circuit board is carried into the second mounter 22.

[0032] Hereinafter, in the second mounter to the sixth mounter, by sequentially performing the same operations as those of the above-mentioned first mounter, the operation of mounting the electronic components on the circuit board is completed. Then, when the circuit board on which the mounting operation has been completed is carried into the reflow oven 16, according to the instruction of the controller 102 in accordance with the production program 110, the transfer devices 90, 92 of the reflow oven 16 transfer the circuit board to the working position and fixedly hold it at this working position. Next, according to the instruction of the controller 102 in accordance with the production program 110, the heater 96 heats the circuit board to melt the paste solder, thereby fixing the electronic components on the circuit board. Then, according to the instruction of the controller 102 in accordance with the production program 110, the transfer devices 90, 92 transfer the circuit board to the downstream side. Thus, the circuit board is taken out from the reflow oven 16, and the circuit board is produced.

[0033] Thus, in the substrate processing system 10, the mounting operation of electronic components is performed in the mounter 22, and the paste solder is heated in the reflow oven 16, thereby producing a circuit board. However, when the paste solder is heated in the reflow oven 16, VOC (Volatile Organic Compounds) is generated, and the brightness of the LED package 70 of the mounting head 30 in the mounter 22 may be reduced due to the VOC. Specifically, silicone resin or the like is used as the sealing resin 82 of the LED package 70, and silicone resin easily allows gas to pass through, so the VOC penetrates into the inside of the sealing resin 82 of the LED package 70. Moreover, if the LED package 70 is lit in a state where the VOC has penetrated into the inside of the sealing resin 82, the VOC changes color inside the sealing resin 82. Therefore, the transmittance of the sealing resin 82 decreases, and the brightness of the LED package 70 decreases.

[0034] In view of such a situation, a brightness recovery program 120 is stored in the controller 102 of the control device 100, and the controller 102 restores the brightness of the LED package 70 according to the brightness recovery program 120. Specifically, the sealing resin 82 discolored due to the VOC emits the components that are the cause of the discoloration of the sealing resin 82 by lighting the LED package 70 in an environment with less VOC, and the brightness of the LED package 70 is restored. In addition, during the mounting operation in the substrate processing system 10, it is considered that the reflow oven 16 is operating and the concentration of VOC in the substrate processing system 10 is high. Therefore, during the non-mounting operation in the substrate processing system 10, that is, when no operation is performed on the circuit board, the brightness recovery operation of the LED package 70 is performed according to the brightness recovery program 120.

[0035] Specifically, the brightness recovery program 120 outputs a lighting instruction for the LED package 70 to the mounting head 30 when no operation is performed on the circuit board. In addition, in the fifth mounter and the sixth mounter among the six mounters 22 arranged close to the reflow oven 16, the concentration of VOC is high and the brightness of the LED package 70 is significantly reduced. Therefore, the brightness recovery program 120 outputs a lighting instruction for the LED package 70 to the mounting heads 30 of the fifth mounter and the sixth mounter. Then, in the mounting head 30 that has received the lighting instruction, the control device 72 of the mounting head 30 controls the operation of the LED package 70 to light the LED package 70. In this way, when no operation is performed on the circuit board, by lighting the LED package 70 of the mounting head 30 in the fifth mounter and the sixth mounter adjacent to the reflow oven 16, it is possible to restore the decrease in the brightness of the LED package 70 caused by the VOC generated from the reflow oven 16.

[0036] In addition, when the LED package 70 is lit without performing an operation on the circuit board, the nozzle 60 does not hold the electronic component, of course. Therefore, when no operation is performed on the circuit board, even if the LED package 70 is lit, the imaging device 68 does not perform imaging. That is, when the LED package 70 is lit to restore the brightness of the LED package 70, the LED package 70 is lit in a mode where the LED package 70 is lit when not imaged by the imaging device 68. On the other hand, when the LED package 70 is lit while an operation is being performed on the circuit board, the nozzle 60 holds the electronic component and imaging is performed by the imaging device 68. That is, when the LED package 70 is lit to image the electronic component, the LED package 70 is lit in a mode where the LED package 70 is lit when imaged by the imaging device 68. Thus, the LED package 70 is selectively lit in a first mode where the LED package 70 is lit during imaging and a second mode where the LED package 70 is lit when not imaging. In addition, in other words, the LED package 70 is selectively lit in the first mode and the second mode, where the first mode is a mode in which the LED package 70 is lit when the component is held by the nozzle 60, and the second mode is a mode in which the LED package 70 is lit when the electronic component is not held by the nozzle 60. In other words, the LED package 70 is selectively lit in a first mode in which the LED package 70 is lit to image the electronic component and a second mode in which the LED package 70 is lit to restore the brightness of the LED package 70. In this way, by selectively lighting the LED package 70 in the first mode and the second mode, it is possible to restore the brightness of the LED package 70 for imaging.

[0037] In addition, the lighting of the LED package 70 can be continuous lighting or intermittent lighting. Incidentally, intermittent lighting is repeated lighting and extinguishing, which is so-called flashing. In addition, by intermittently lighting the LED package 70, damage caused by the high temperature of the LED package 70 can be reduced. In addition, the timing for outputting the lighting instruction of the LED package 70 when no operation is performed on the circuit board is the timing for changing the circuit board to be produced, for example, during the changeover adjustment operation, or the timing when the factory equipped with the substrate operation system 10 is not operating, such as at night. In addition, the lighting instruction can be output at a predetermined cycle, for example, every day, or can be output when it is confirmed that the brightness of the LED package 70 has decreased. As a method for confirming the decrease in the brightness of the LED package 70, when no operation is performed on the circuit board, the LED package 70 is lit and photographed by the photographing device 68. At this time, since the nozzle 60 does not hold the electronic component, the light irradiated by the LED package 70 is photographed by the photographing device 68. Next, the brightness, saturation, etc. are calculated based on the photographed data obtained by this photographing, and the brightness of the LED package 70 is estimated. Then, when the estimated brightness is below the threshold value, it is determined that the brightness of the LED package 70 has decreased, and the lighting instruction of the LED package 70 is output. In addition, when performing the brightness recovery operation of the LED package 70 after the brightness of the LED package 70 has decreased below the threshold value, the time required for the brightness recovery operation may become quite long. Therefore, by outputting the lighting instruction at a predetermined cycle, the decrease in the brightness of the LED package 70 can be prophylactically suppressed.

[0038] In addition, the brightness recovery program 120 can also output the lighting instruction of the LED package 70 at a pre-reserved time. That is, the operator sets the time when it is assumed that no operation is performed on the circuit board in the brightness recovery program 120. Then, the brightness recovery program 120 outputs the lighting instruction of the LED package 70 at the set time. Thereby, the brightness recovery operation of the LED package 70 can be performed at the time desired by the operator.

[0039] In addition, the paste solder and silver paste used in the production of the circuit board can also be cited as the factors for generating VOC. That is, the solvents contained in the paste solder, silver paste, etc. volatilize to become VOC. Therefore, when a large amount of paste solder, silver paste, etc. are used in the circuit board to be produced, as described above, the lighting instruction of the LED package 70 is output not only to the fifth mounter and the sixth mounter, but also to all of the first to sixth mounters.

[0040] Specifically, the brightness recovery program 120 determines the type of the circuit board of the production object based on the production program 110. In addition, the circuit board of the production object is a circuit board produced by the substrate operating system 10 when the LED package 70 is lit in the mode in which the LED package 70 is lit when photographed by the photographing device 68, that is, the first mode. As described above, since the production program 110 is a program for producing a circuit board, the brightness recovery program 120 can determine the type of the circuit board of the production object based on the production program 110. Then, the brightness recovery program 120 determines whether pastes such as solder paste and silver paste are used in large quantities among the determined types of circuit boards. At this time, for example, information indicating the types of circuit boards that use a large amount of solder paste, silver paste, etc. can be programmed into the brightness recovery program 120, and the brightness recovery program 120 determines whether the type of the circuit board of the production object is a circuit board that uses a large amount of solder paste, silver paste, etc. based on this information. In addition, when it is possible to estimate the usage amount of solder paste, silver paste, etc. used in the circuit board determined based on the production program 110, if the estimated usage amount is equal to or greater than the threshold value, it can also be determined that the type of the circuit board of the production object is a circuit board that uses a large amount of solder paste, silver paste, etc. Then, when it is determined that the type of the circuit board of the production object is a circuit board that uses a large amount of solder paste, silver paste, etc., the brightness recovery program 120 outputs a lighting instruction for the LED package 70 to all of the first to sixth mounting machines. Thereby, after performing an operation on a circuit board that uses a large amount of solder paste, silver paste, etc., a brightness recovery operation is performed, so that it is possible to recover the brightness reduction of the LED package 70 caused by VOC generated by the solder paste, silver paste, etc. In particular, the lighting device 66 including the LED package 70 is disposed on the lower end surface of the mounting head 30, and the LED package 70 approaches a position near the upper surface of the circuit board during the mounting operation, so the influence of VOC generated by the solder paste, silver paste, etc. on the LED package 70 is relatively large. Considering this point, by performing a brightness recovery operation after performing an operation on a circuit board that uses a large amount of solder paste, silver paste, etc., it is possible to recover the brightness reduction of the LED package 70 at an appropriate timing.

[0041] In addition, the brightness recovery operation starts based on the lighting instruction of the LED package 70 and ends when the brightness of the LED package 70 is recovered. Specifically, when the LED package 70 is lit while the nozzle 60 is not holding an electronic component, the light of the LED package 70 is captured by the imaging device 68 at this time, whereby the brightness of the LED package 70 can be estimated based on the captured data. Therefore, when performing the brightness recovery operation, the imaging device 68 captures images at a predetermined cycle. In addition, the imaging by the imaging device 68 during the brightness recovery operation is for estimating the brightness, not for imaging the electronic component. Then, each time the imaging device 68 captures an image, the brightness is estimated based on the captured data, and it is determined whether the estimated brightness exceeds a threshold value. At this time, if it is determined that the estimated brightness exceeds the threshold value, the brightness recovery operation ends. In addition, the brightness recovery operation may end after the brightness recovery operation has been continuously performed for a predetermined time regardless of whether the brightness of the LED package 70 has been recovered.

[0042] In addition, in the above-described first embodiment, the brightness recovery operation is performed when the mounting head 30 is installed inside the mounter 22, but in the second embodiment, the brightness recovery operation is performed when the mounting head 30 is taken out to the outside of the mounter 22. Specifically, as described above, the mounting head 30 can be attached to and detached from the slider 50 of the moving device 28. Therefore, the mounting head 30 can be detached from the slider 50 and taken out to the outside of the mounter 22. In addition, if the outside of the mounter 22 is not near the substrate processing system 10, the concentration of VOC is generally low. Therefore, the brightness recovery operation is performed when the mounting head 30 is taken out to the outside of the mounter 22. In addition, in the mounting head 30 in which the brightness recovery operation is performed when taken out to the outside of the mounter 22, as Figure 6 shown, a brightness recovery program 150 is stored in the control device 72 of the mounting head 30. In addition, since there is no built-in battery in the mounting head 30, the mounting head 30 taken out to the outside of the mounter 22 is connected to the power supply 160.

[0043] In this way, the mounting head 30 is taken out to the outside of the mounter 22, and the brightness recovery operation is performed according to the brightness recovery program 150 while being connected to the power supply 160. That is, when the brightness recovery program 150 detects that the mounting head 30 is detached from the slider 50 and power is supplied to the mounting head 30 through the connection of the mounting head 30 to the power supply 160, the brightness recovery program 150 outputs a lighting instruction to the LED package 70. In addition, outside the mounter 22, of course, the nozzle 60 does not hold components, and when the LED package 70 is lit, the imaging device 68 does not image the components. Therefore, the LED package 70 is lit in the second mode, and the imaging device 68 does not perform imaging. In this way, in the state where the mounting head 30 is taken out to the outside of the mounter 22, the LED package 70 is lit in the second mode, so that the brightness of the LED package 70 can be appropriately recovered. In addition, since the brightness recovery operation is performed outside the mounter 22, the brightness of the LED package 70 can be recovered without stopping the mounting operation and the like in the substrate operating system 10.

[0044] In addition, the mounter 22 is an example of a substrate processing machine. The mounting head 30 is an example of a processing head. The imaging device 68 is an example of an imaging device. The LED package 70 is an example of an LED package. The production program 110 is an example of a program.

[0045] In addition, the present invention is not limited to the above-described embodiments, and can be implemented in various ways in which various changes and improvements have been made based on the knowledge of those skilled in the art. Specifically, for example, in the above-described embodiments, the brightness recovery operation is performed according to the brightness recovery programs 120 and 150, but the brightness recovery operation can also be performed by a user operation. For example, operation buttons can be provided on the operation panel of the mounter 22, the mounting head 30, the control device 100, etc., and the brightness recovery operation can be performed by operating the operation buttons. In addition, not limited to operation buttons, the brightness recovery operation can also be performed by an operator inputting a lighting instruction for the LED package. In addition, when performing an operation on the circuit board, in the case where an operation button is operated or an operator's lighting instruction is input, it is preferable to cancel the operation, input, etc., and not perform the brightness recovery operation.

[0046] In addition, in the above-described embodiments, the LED package 70 irradiates light toward the front end of the nozzle 60 that is the imaging object, but the imaging object is not limited to the electronic component held by the nozzle 60, and various objects can be used as the imaging object. For example, when the circuit board is the imaging object, the LED package 70 irradiates light toward the circuit board.

[0047] In addition, in the above-described embodiments, the present invention is applicable to the mounting head 30, but the present invention can also be applicable to various processing heads such as an inspection head and a jet head.

[0048] In addition, in the above first embodiment, the brightness recovery program 120 determines the type of the circuit board to be produced based on the production program 110, but the type of the circuit board to be produced may also be obtained from a host computer, the cloud, or the like.

[0049] In addition, in the above first embodiment, when the type of the circuit board to be produced is a circuit board that extensively uses pasty solder, silver paste, or the like, the brightness recovery operation is performed. However, the brightness recovery operation may also be performed when the type of the circuit board to be produced is a circuit board of other specific types. As circuit boards of other specific types, for example, a circuit board that performs a process using a raw material containing VOC can be cited.

[0050] In addition, in the above first embodiment, the brightness recovery operation is performed by the mounter 22 provided near the reflow oven 16, but the brightness recovery operation may also be performed by the mounter 22 provided near a work machine other than the reflow oven 16, such as a solder printer.

[0051] In addition, in the above first embodiment, the brightness recovery program 120 is stored in the control device 100, but the brightness recovery program 120 may also be stored in the mounting head 30.

[0052] In addition, in the above second embodiment, the mounting head 30 removed from the mounter 22 is connected to the power supply 160 to perform the brightness recovery operation, but the brightness recovery operation may also be performed by connecting it to a maintenance unit, a cleaning unit, or the like. Thereby, the brightness recovery operation can be performed together with the maintenance or cleaning of the mounting head 30. In addition, when the brightness recovery operation is performed by connecting the mounting head 30 to a maintenance unit, a cleaning unit, or the like, the brightness recovery program 150 may not be stored in the mounting head 30 but in the maintenance unit or the like.

[0053] Description of Reference Numerals

[0054] 22: Mounter (circuit board work machine) 30: Mounting head (work head) 68: Imaging device 70: LED package 110: Production program (program).

Claims

1. A working head that works on a substrate in a substrate working machine, wherein, The operation head has an LED package used in the imaging device, and the LED package is selectively lit in a first mode in which the LED package is lit when the imaging device performs imaging and in a second mode in which the LED package is lit when the imaging device does not perform imaging.

2. The working head according to claim 1, wherein, When the operation head performs an operation on the substrate, the LED package is lit in the first mode; when the operation head does not perform an operation on the substrate, the LED package is lit in the second mode.

3. The working head according to claim 2, wherein, When the operation head does not perform an operation on the substrate, the LED package is lit in the second mode according to the type of operation performed when the LED package is lit in the first mode.

4. The working head according to claim 3, wherein, Based on the program for performing an operation on the substrate in the substrate processing machine, the type of the operation is determined, and the LED package is lit in the second mode according to the determined type of the operation.

5. The working head according to claim 2, wherein, When the operation head does not perform an operation on the substrate, the LED package is lit in the second mode at a pre-scheduled time.

6. The working head according to claim 1, wherein, When the operation head is assembled in the substrate processing machine, the LED package is lit in the first mode, and when the operation head is removed from the substrate processing machine, the LED package is lit in the second mode.

Images