Chip welding device with automatic positioning function

Abstract

The invention discloses a chip welding device with an automatic positioning function, and relates to the technical field of chip welding, the chip welding device comprises a machine table, a positioning plate, an adsorption unit and a welding unit, the positioning plate, the adsorption unit and the welding unit are all mounted on the machine table, the positioning plate is provided with an adjusting mechanism and two positioning pins, and the positioning pins are arranged on the positioning plate. The adjusting mechanism and the two positioning pins are used for clamping a substrate, the adsorption unit is in circuit connection with the control system and comprises a moving mechanism and an adsorption mechanism, the adsorption mechanism is installed on the moving mechanism, the adsorption mechanism adsorbs a chip, the moving mechanism is used for automatically positioning the chip, and the control system is connected with the control system. The welding unit is used for welding a chip onto a substrate, and the substrates of different specifications are fixed through the adjustable movable fixture, so that the welding requirements under different conditions are met.

Description

Technical Field

[0001] The present invention relates to the technical field of chip soldering, and specifically to a chip soldering device with an automatic positioning function. Background Art

[0002] With the development of electronic devices towards miniaturization and high density, the chip soldering process has put forward higher requirements for positioning accuracy and compatibility. Traditional chip soldering devices mostly use vacuum adsorption claws or mechanical claws to fix the chips. However, the existing adsorption claw structures generally have the following defects: the nozzle size is fixed, it is difficult to adapt to different specifications of chips, and the nozzles need to be frequently replaced, resulting in reduced production efficiency and increased operation and maintenance costs; rigid clamping is likely to cause damage to the edges of the chips, especially for ultra-thin chips or brittle materials with high mechanical stress sensitivity. The traditional adsorption claws lack the ability of adaptive adjustment, and pad offset is caused by size deviation during the automatic positioning process, affecting the soldering yield.

[0003] Although some improvement schemes attempt to alleviate the compatibility problem through multi-nozzle arrays or elastic materials, their adjustment range is limited and relies on manual intervention, making it difficult to meet the real-time requirements of adaptive positioning for high-speed production lines. In the prior art, the contact area between the nozzle and the chip is uncontrollable, which is likely to cause unstable adsorption of small-sized chips or uneven local stress on large-sized chips. Summary of the Invention

[0004] The purpose of the present invention is to provide a chip soldering device with an automatic positioning function to solve the problems raised in the prior art.

[0005] To achieve the above purpose, the present invention provides the following technical solution: A chip soldering device with an automatic positioning function, including a machine table, a positioning plate, an adsorption unit, and a soldering unit. The positioning plate, the adsorption unit, and the soldering unit are all installed on the machine table. The positioning plate is provided with an adjustment mechanism and two positioning pins. The adjustment mechanism and the two positioning pins clamp the substrate. The adsorption unit is electrically connected to the control system. The adsorption unit includes a moving mechanism and an adsorption mechanism. The adsorption mechanism is installed on the moving mechanism. The adsorption mechanism adsorbs the chip, and the moving mechanism automatically positions the chip. The soldering unit solders the chip to the substrate.

[0006] Further, the positioning plate is rectangular. Bolts and a pair of chute plates are provided at the central positions of two adjacent edges of the positioning plate. The bolts are located at the centers of the pairs of chute plates. A pressing plate is slidably installed between each pair of chute plates. A through hole is opened at the center of the pressing plate. The bolts pass through the through holes, and hexagonal nuts are screwed on the bolts. The hexagonal nuts are located above the pressing plates. The operator places the substrate on the positioning plate, first makes one corner of the substrate close to the two positioning pins for preliminary positioning, and then uses the adjustment mechanism to clamp the substrate to prevent movement during the soldering process.

[0007] Furthermore, the adjusting mechanism includes a first connecting rod, a second connecting rod and a movable fixture. The first connecting rod and the second connecting rod have the same structure. A chute is formed on the first connecting rod, and the chute slides along the bolt. A right-angle groove is formed on the movable fixture, and the movable fixture is respectively rotatably connected to the first connecting rod and the second connecting rod. Both the first connecting rod and the second connecting rod are located between the positioning plate and the pressing plate. The operator moves the movable fixture so that the right-angle groove aligns with another corner of the substrate, and then tightens the hexagon nut. The pressing plate presses the first connecting rod and the second connecting rod, and the movable fixture is fixed, and the substrate is fixed accordingly. The fixed first connecting rod and the second connecting rod form a stable triangular connection, ensuring that the movable fixture will not move randomly. By means of the adjustable movable fixture, substrates of different specifications can be fixed to meet the welding requirements in different situations.

[0008] Furthermore, the moving mechanism includes a pair of side brackets, a pair of upper guide rails, a pair of sliding supports, a pair of synchronous sprocket assemblies, a pair of chains, a support shaft and a lead screw. The pair of upper guide rails are symmetrically installed between the pair of side brackets. The pair of sliding supports are respectively slidably installed on the pair of upper guide rails. The pair of synchronous sprocket assemblies are rotatably installed at both ends of the pair of upper guide rails. A second servo motor is installed on one of the side brackets, and the second servo motor is connected to one of the synchronous sprocket assemblies. The second servo motor drives the synchronous sprocket assembly to rotate, and the synchronous sprocket assembly drives the two chains to move. The chains drive the two sliding supports to move simultaneously, driving the adsorption mechanism to move along the direction of the upper guide rail.

[0009] Furthermore, each synchronous sprocket assembly consists of two sprockets and a rotating shaft. The two sprockets are coaxially installed at both ends of the rotating shaft. The pair of chains are symmetrically connected between the two synchronous sprocket assemblies. The two sliding supports are respectively connected to the middle parts of the two chains. The support shaft and the lead screw are rotatably installed between the pair of sliding supports. A first servo motor is arranged on one of the sliding supports, and the motor shaft of the first servo motor is coaxially connected to the lead screw.

[0010] Furthermore, the adsorption mechanism includes a chassis, a sleeve, a hollow screw, a baffle, a hollow cup motor and a nut. The sleeve is connected to the bottom of the chassis. A hollow sliding sleeve and an internally threaded rotating sleeve are arranged at the bottom of the chassis. The hollow sliding sleeve is slidably connected to the support shaft, and the internally threaded rotating sleeve is threadedly connected to the lead screw. The first servo motor drives the lead screw to rotate, and the lead screw drives the chassis to slide along the direction of the support shaft. Under the control of the first servo motor and the second servo motor, the chassis moves along the directions of two coordinate axes, facilitating the adsorption mechanism to fix the chip to any position on the substrate.

[0011] Furthermore, the coreless motor is installed at the bottom of the sleeve, the nut is installed on the inner ring of the coreless motor, the hollow screw is screwed with the nut, a chute is formed on the hollow screw, a limiting block is arranged at the bottom of the sleeve, the limiting block is slidably connected with the chute of the hollow screw, and the baffle is connected to the top of the hollow screw.

[0012] Furthermore, an air pump is arranged in the chassis. The air suction end of the air pump is connected with the hollow screw through an air suction pipe. The bottom of the hollow screw is connected with a cross-shaped adsorption claw. A cross-shaped groove is formed at the bottom of the cross-shaped adsorption claw. The cross-shaped groove is communicated with the hollow part of the hollow screw. The coreless motor drives the nut to rotate, controls the up-and-down sliding of the hollow screw in the sleeve. The hollow screw drives the cross-shaped adsorption claw to descend. When the cross-shaped adsorption claw contacts the chip, it stops moving. The air pump sucks air through the air suction pipe. The air pressure in the cross-shaped groove decreases to generate negative pressure to adsorb the chip. The coreless motor drives the nut to rotate, controls the hollow screw to rise, lifts the chip, and moves it to the position where welding is required. The welding machine uses laser welding to weld the chip to the substrate. The air pump stops sucking air, and the negative pressure in the air suction pipe disappears, and the cross-shaped adsorption claw releases the chip.

[0013] Furthermore, four electromagnetic springs are evenly arranged inside the cross-shaped adsorption claw. The four electromagnetic springs are connected to the control system circuit. The cross-shaped adsorption claw is made of flexible material. The electromagnetic springs control the length of the cross-shaped adsorption claw extending outward by controlling the magnitude of the current passing through. In the case of non-electrification, the cross-shaped adsorption claw extends outward to the longest. In the case of electrification, the higher the current intensity, the shorter the electromagnetic spring contracts, and the smaller the cross-shaped adsorption claw contracts. By adjusting the magnitude of the current passing through the electromagnetic spring, the contour of the cross-shaped adsorption claw is adjusted to adapt to the adsorption of chips of different sizes. Since the cross-shaped adsorption claw is made of flexible material, even if the cross-shaped adsorption claw deforms after the electromagnetic spring extends, after contacting the chip, the cross-shaped adsorption claw can still be flexibly attached to the chip, and the cross-shaped groove forms a sealed state. The extended cross-shaped adsorption claw is used to adsorb large chips, and the contracted cross-shaped adsorption claw is used to adsorb small chips. By adjusting the corresponding contact area, the adsorption is made more firm, and the shaking during the handling process is reduced.

[0014] Compared with the prior art, the beneficial effects of the present invention are as follows: The fixed first connecting rod and the second connecting rod form a stable triangular connection, ensuring that the movable fixture will not move randomly. Through the adjustable movable fixture, the fixing of substrates of different specifications is realized, meeting the welding requirements in different situations; by adjusting the magnitude of the current passing through the electromagnetic spring, the contour of the cross-shaped adsorption claw is adjusted to adapt to the adsorption of chips of different sizes. By adjusting the corresponding contact area, the adsorption is made more firm, and the shaking during the handling process is reduced. Description of the Drawings

[0015] Figure 1 Schematic diagram of the overall structure of the present invention Figure 1 ; Figure 2 Schematic diagram of the overall structure of the present invention Figure 2 ; Figure 3 Schematic diagram of the structure of the adsorption unit part of the present invention; Figure 4 Schematic diagram of the structure of the adsorption mechanism of the present invention; Figure 5 Schematic diagram of the connection structure of the hollow screw of the present invention; Figure 6 Schematic diagram of the structure of the positioning plate part of the present invention.

[0016] In the figure: 1, machine platform; 2, positioning plate; 3, side bracket; 4, upper guide rail; 5, sliding support; 6, synchronous sprocket assembly; 7, chain; 8, support shaft; 9, lead screw; 10, first servo motor; 11, chassis; 12, sleeve; 13, hollow screw; 14, baffle; 15, cup-shaped hollow motor; 16, nut; 17, air extraction pipe; 18, air pump; 19, cross adsorption claw; 20, electromagnetic spring; 21, chip; 22, substrate; 23, positioning pin; 24, movable fixture; 25, first connecting rod; 26, second connecting rod; 27, bolt; 28, chute plate; 29, pressing plate; 30, hexagon nut. Specific embodiments

[0017] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0018] Embodiment: As Figures 1 - 6As shown in the figure, the present invention provides a technical solution, a chip welding device with an automatic positioning function, including a machine table 1, a positioning plate 2, an adsorption unit and a welding unit (not shown in the figure). The positioning plate 2, the adsorption unit and the welding unit are all installed on the machine table 1. The positioning plate 2 is provided with an adjustment mechanism and two positioning pins 23. The adjustment mechanism and the two positioning pins 23 clamp the substrate 22. The adsorption unit is electrically connected to the control system. The adsorption unit includes a moving mechanism and an adsorption mechanism. The adsorption mechanism is installed on the moving mechanism. The adsorption mechanism adsorbs the chip 21, and the moving mechanism automatically positions the chip 21. The welding unit welds the chip 21 to the substrate 22. The positioning plate 2 is rectangular. Bolts 27 and a pair of chute plates 28 are provided at the central positions of two adjacent edges of the positioning plate 2. The bolts 27 are located at the center of a pair of chute plates 28. A pressing plate 29 is slidably installed between each pair of chute plates 28. A through hole is opened in the center of the pressing plate 29. The bolt 27 passes through the through hole, and a hexagonal nut 30 is screwed on the bolt 27. The hexagonal nut 30 is located above the pressing plate 29. The operator places the substrate 22 on the positioning plate 2. First, one corner of the substrate 22 is pressed against the two positioning pins 23 to make a preliminary positioning. After positioning, the adjustment mechanism is used to clamp the substrate 22 to prevent it from moving during the welding process.

[0019] The adjustment mechanism includes a first connecting rod 25, a second connecting rod 26 and a movable fixture 24. The structures of the first connecting rod 25 and the second connecting rod 26 are the same. A chute is opened on the first connecting rod 25, and the chute slides along the bolt 27. A right-angle groove is opened on the movable fixture 24. The movable fixture 24 is respectively rotatably connected to the first connecting rod 25 and the second connecting rod 26. The first connecting rod 25 and the second connecting rod 26 are both located between the positioning plate 2 and the pressing plate 29. The operator moves the movable fixture 24 so that the right-angle groove is aligned with another corner of the substrate 22. Then, the hexagonal nut 30 is tightened, and the pressing plate 29 is used to press the first connecting rod 25 and the second connecting rod 26. The movable fixture 24 is fixed, and the substrate 22 is fixed accordingly. The fixed first connecting rod 25 and second connecting rod 26 form a stable triangular connection to ensure that the movable fixture 24 will not move randomly. By the adjustable movable fixture 24, the fixation of substrates 22 with different specifications can be realized to meet the welding requirements in different situations.

[0020] The moving mechanism includes a pair of side brackets 3, a pair of upper guide rails 4, a pair of sliding supports 5, a pair of synchronous sprocket assemblies 6, a pair of chains 7, a support shaft 8 and a lead screw 9. The pair of upper guide rails 4 are symmetrically installed between the pair of side brackets 3. The pair of sliding supports 5 are respectively slidably installed on the pair of upper guide rails 4. The pair of synchronous sprocket assemblies 6 are rotatably installed at both ends of the pair of upper guide rails 4. A second servo motor (not shown in the figure) is installed on one side bracket 3, and the second servo motor is connected to one synchronous sprocket assembly 6. Each synchronous sprocket assembly 6 consists of two sprockets and a rotating shaft. The two sprockets are coaxially installed at both ends of the rotating shaft. The pair of chains 7 are symmetrically connected between the two synchronous sprocket assemblies 6. The two sliding supports 5 are respectively connected to the middle parts of the two chains 7. The support shaft 8 and the lead screw 9 are rotatably installed between the pair of sliding supports 5. A first servo motor 10 is arranged on one sliding support 5, and the motor shaft of the first servo motor 10 is coaxially connected to the lead screw 9. The adsorption mechanism includes a chassis 11, a sleeve 12, a hollow screw 13, a baffle 14, a hollow cup motor 15 and a nut 16. The sleeve 12 is connected to the bottom of the chassis 11. A hollow sliding sleeve and an internal thread sleeve are arranged at the bottom of the chassis 11. The hollow sliding sleeve is slidably connected to the support shaft 8, and the internal thread sleeve is threadedly connected to the lead screw 9.

[0021] The second servo motor drives the synchronous sprocket assembly 6 to rotate. The synchronous sprocket assembly 6 drives the two chains 7 to move. The chains 7 drive the two sliding supports 5 to move simultaneously, driving the adsorption mechanism to move along the direction of the upper guide rail 4. The first servo motor 10 drives the lead screw 9 to rotate. The lead screw 9 drives the chassis 11 to slide along the direction of the support shaft 8. Under the control of the first servo motor 10 and the second servo motor, the chassis 11 moves along the directions of two coordinate axes, facilitating the adsorption mechanism to fix the chip 21 to any position on the substrate 22.

[0022] The coreless motor 15 is installed at the bottom of the sleeve 12. The nut 16 is installed on the inner ring of the coreless motor 15. The hollow screw 13 is screwed with the nut 16. A chute is provided on the hollow screw 13. A limiting block is provided at the bottom of the sleeve 12. The limiting block is slidably connected to the chute of the hollow screw 13. The baffle 14 is connected to the top of the hollow screw 13. An air pump 18 is provided in the chassis 11. The air suction end of the air pump 18 is connected to the hollow screw 13 through a suction pipe 17. The bottom of the hollow screw 13 is connected with a cross-shaped adsorption claw 19. A cross-shaped groove is provided at the bottom of the cross-shaped adsorption claw 19. The cross-shaped groove communicates with the hollow part of the hollow screw 13. The coreless motor 15 drives the nut 16 to rotate, controlling the up and down sliding of the hollow screw 13 in the sleeve 12. The hollow screw 13 drives the cross-shaped adsorption claw 19 to descend. When the cross-shaped adsorption claw 19 touches the chip 21, it stops moving. The air pump 18 sucks air through the suction pipe 17. The air pressure in the cross-shaped groove decreases to generate negative pressure to adsorb the chip 21. The coreless motor 15 drives the nut 16 to rotate, controlling the hollow screw 13 to rise, lifting the chip 21 and moving it to the position where welding is required. The welding machine group welds the chip 21 to the substrate 22 by laser welding. The air pump 18 stops sucking air, and the negative pressure in the suction pipe 17 disappears. The cross-shaped adsorption claw 19 releases the chip 21.

[0023] Four electromagnetic springs 20 are evenly arranged inside the cross-shaped adsorption claw 19. The four electromagnetic springs 20 are connected to the control system circuit. The cross-shaped adsorption claw 19 is made of a flexible material. The electromagnetic spring 20 controls the length of the cross-shaped adsorption claw 19 extending outward by controlling the magnitude of the current passed through. When there is no power supply, the cross-shaped adsorption claw 19 extends outward to the longest length. When powered on, the higher the current intensity, the shorter the electromagnetic spring 20 contracts, and the smaller the cross-shaped adsorption claw 19 contracts. By adjusting the magnitude of the current passed through the electromagnetic spring 20, the contour of the cross-shaped adsorption claw 19 is adjusted to adapt to the adsorption of chips 21 of different sizes. Since the cross-shaped adsorption claw 19 is made of a flexible material, even if the cross-shaped adsorption claw 19 deforms after the electromagnetic spring 20 elongates, after contacting the chip 21, the cross-shaped adsorption claw 19 can still be flexibly attached to the chip 21, and the cross-shaped groove forms a sealed state. The large chip 21 is adsorbed by the extended cross-shaped adsorption claw 19, and the small chip 21 is adsorbed by the contracted cross-shaped adsorption claw 19. By adjusting the corresponding contact area, the adsorption is made more firm, reducing the shaking during the handling process.

[0024] Working principle of the present invention: The operator places the substrate 22 on the positioning plate 2. First, one corner of the substrate 22 is pressed against the two positioning pins 23 for preliminary positioning. After positioning, the adjusting mechanism is used to clamp the substrate 22 to prevent it from moving during the welding process. The operator moves the movable fixture 24 so that the right-angle groove aligns with another corner of the substrate 22. Then, the hexagonal nut 30 is tightened, and the pressing plate 29 is used to press the first connecting rod 25 and the second connecting rod 26. The movable fixture 24 is fixed, and the substrate 22 is fixed accordingly. The fixed first connecting rod 25 and the second connecting rod 26 form a stable triangular connection to ensure that the movable fixture 24 will not move randomly. By using the adjustable movable fixture 24, substrates 22 of different specifications can be fixed to meet the welding requirements in different situations.

[0025] The second servo motor drives the synchronous sprocket assembly 6 to rotate. The synchronous sprocket assembly 6 drives the two chains 7 to move. The chains 7 drive the two sliding supports 5 to move simultaneously, driving the adsorption mechanism to move along the direction of the upper guide rail 4. The first servo motor 10 drives the lead screw 9 to rotate. The lead screw 9 drives the chassis 11 to slide along the direction of the support shaft 8. Under the control of the first servo motor 10 and the second servo motor, the chassis 11 moves along the directions of two coordinate axes, facilitating the adsorption mechanism to fix the chip 21 at any position on the substrate 22.

[0026] The coreless motor 15 drives the nut 16 to rotate, controlling the up and down sliding of the hollow screw 13 in the sleeve 12. The hollow screw 13 drives the cross adsorption claw 19 to descend. When the cross adsorption claw 19 touches the chip 21, it stops moving. The air pump 18 evacuates air through the suction pipe 17. The air pressure in the cross groove decreases to generate negative pressure to adsorb the chip 21. The coreless motor 15 drives the nut 16 to rotate, controlling the hollow screw 13 to rise, lifting the chip 21 and moving it to the position where welding is required. The welding unit welds the chip 21 to the substrate 22 by means of laser welding. The air pump 18 stops evacuating air, and the negative pressure in the suction pipe 17 disappears, and the cross adsorption claw 19 releases the chip 21.

[0027] The electromagnetic spring 20 controls the length of the cross-shaped adsorption claw 19 extending towards the outer circle by controlling the magnitude of the current passed through. When there is no power supply, the cross-shaped adsorption claw 19 extends to the longest length towards the outer circle. When powered on, the higher the current intensity, the shorter the electromagnetic spring 20 contracts, and the smaller the cross-shaped adsorption claw 19 contracts. By adjusting the magnitude of the current passed through the electromagnetic spring 20, the contour of the cross-shaped adsorption claw 19 is adjusted to adapt to the adsorption of chips 21 of different sizes. Since the cross-shaped adsorption claw 19 is made of a flexible material, even if the cross-shaped adsorption claw 19 deforms after the electromagnetic spring 20 elongates, after contacting the chip 21, the cross-shaped adsorption claw 19 can still be flexibly attached to the chip 21, and the cross groove forms a sealed state. The large chip 21 is adsorbed using the extended cross-shaped adsorption claw 19, and the small chip 21 is adsorbed using the contracted cross-shaped adsorption claw 19. By adjusting the corresponding contact area, the adsorption is made more firm, reducing the shaking during the handling process.

[0028] For those skilled in the art, it is obvious that the present invention is not limited to the details of the above-described exemplary embodiments, and without departing from the spirit or basic characteristics of the present invention, the present invention can be implemented in other specific forms. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-limiting. The scope of the present invention is defined by the appended claims rather than the above description. Therefore, all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be embraced within the present invention. Any reference signs in the claims should not be regarded as limiting the claimed rights.

Claims

1. A chip soldering device with an automatic positioning function, characterized in that: It includes a machine table (1), a positioning plate (2), an adsorption unit and a welding unit. The positioning plate (2), the adsorption unit and the welding unit are all installed on the machine table (1). An adjusting mechanism and two positioning pins (23) are arranged on the positioning plate (2). The adjusting mechanism and the two positioning pins (23) clamp the substrate (22). The adsorption unit is electrically connected to the control system. The adsorption unit includes a moving mechanism and an adsorption mechanism. The adsorption mechanism is installed on the moving mechanism. The adsorption mechanism adsorbs the chip (21). The moving mechanism automatically positions the chip (21). The welding unit welds the chip (21) to the substrate (22).

2. The chip soldering device with an automatic positioning function according to claim 1, wherein: The positioning plate (2) is rectangular. Bolts (27) and a pair of chute plates (28) are arranged at the central positions of two adjacent edges of the positioning plate (2). The bolts (27) are located at the centers of the pair of chute plates (28). A pressing plate (29) is slidably installed between each pair of the chute plates (28). A through hole is formed in the center of the pressing plate (29). The bolts (27) pass through the through holes. Hexagonal nuts (30) are screwed on the bolts (27). The hexagonal nuts (30) are located above the pressing plate (29).

3. The chip soldering device with an automatic positioning function according to claim 2, characterized in that: The adjusting mechanism includes a first connecting rod (25), a second connecting rod (26) and a movable fixture (24). The first connecting rod (25) and the second connecting rod (26) have the same structure. A chute is formed on the first connecting rod (25). The chute slides along the bolt (27). A right-angle groove is formed on the movable fixture (24). The movable fixture (24) is rotatably connected to the first connecting rod (25) and the second connecting rod (26) respectively. The first connecting rod (25) and the second connecting rod (26) are both located between the positioning plate (2) and the pressing plate (29).

4. A chip soldering device with an automatic positioning function according to claim 1, characterized in that: The moving mechanism includes a pair of side brackets (3), a pair of upper guide rails (4), a pair of sliding supports (5), a pair of synchronous sprocket assemblies (6), a pair of chains (7), a support shaft (8) and a lead screw (9). The pair of upper guide rails (4) are symmetrically installed between the pair of side brackets (3). The pair of sliding supports (5) are respectively slidably installed on the pair of upper guide rails (4). The pair of synchronous sprocket assemblies (6) are rotatably installed at both ends of the pair of upper guide rails (4). A second servo motor is installed on one of the side brackets (3). The second servo motor is connected to one of the synchronous sprocket assemblies (6).

5. The chip soldering device with an automatic positioning function according to claim 4, characterized in that: Each synchronous sprocket assembly (6) is composed of two sprockets and a rotating shaft. The two sprockets are coaxially installed at both ends of the rotating shaft. The pair of chains (7) are symmetrically connected between the two synchronous sprocket assemblies (6). The two sliding supports (5) are respectively connected to the middle parts of the two chains (7). The support shaft (8) and the lead screw (9) are rotatably installed between the pair of sliding supports (5). A first servo motor (10) is arranged on one of the sliding supports (5). The motor shaft of the first servo motor (10) is coaxially connected to the lead screw (9).

6. The chip soldering device with an automatic positioning function according to claim 5, characterized in that: The adsorption mechanism includes a chassis (11), a sleeve (12), a hollow screw (13), a baffle (14), a coreless motor (15) and a nut (16). The sleeve (12) is connected to the bottom of the chassis (11). A hollow sliding sleeve and an internally threaded rotating sleeve are provided at the bottom of the chassis (11). The hollow sliding sleeve is slidably connected to the support shaft (8), and the internally threaded rotating sleeve is threadedly connected to the lead screw (9).

7. A chip soldering device with an automatic positioning function according to claim 6, characterized in that: The coreless motor (15) is installed at the bottom of the sleeve (12). The nut (16) is installed inside the coreless motor (15). The hollow screw (13) is screwed to the nut (16). A chute is provided on the hollow screw (13). A limiting block is provided at the bottom of the sleeve (12), and the limiting block is slidably connected to the chute of the hollow screw (13). The baffle (14) is connected to the top of the hollow screw (13).

8. A chip soldering device with an automatic positioning function according to claim 7, characterized in that: An air pump (18) is provided inside the chassis (11). The air suction end of the air pump (18) is connected to the hollow screw (13) through a suction pipe (17). The bottom of the hollow screw (13) is connected to a cross-shaped adsorption claw (19). A cross-shaped groove is provided at the bottom of the cross-shaped adsorption claw (19), and the cross-shaped groove communicates with the hollow part of the hollow screw (13).

9. The chip soldering device with an automatic positioning function according to claim 8, characterized in that: Four electromagnetic springs (20) are evenly arranged inside the cross-shaped adsorption claw (19). The four electromagnetic springs (20) are electrically connected to the control system. The cross-shaped adsorption claw (19) is made of a flexible material.

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