Temperature-sensitive parameter detection method and device, computer equipment and storage medium

Abstract

The invention relates to a thermosensitive parameter detection method and device, computer equipment and a storage medium, and is applied to the technical field of parameter detection. The method comprises the following steps: electrically connecting a to-be-detected device with a detector; wherein the detector is used for collecting test data of a to-be-tested device; sequentially placing the to-be-tested device in the detection cavities at different set temperatures for testing; wherein when the test is carried out, the temperature of other detection cavities is adjusted to another set temperature; and under the condition that the to-be-tested device is tested at all the set temperatures, completing the detection of the thermosensitive parameters of the to-be-tested device. When the to-be-tested device is tested in one detection cavity, other detection cavities can synchronously adjust the temperature, and the to-be-tested device can be directly transferred to different to-be-tested cavities to be tested during testing, so that the temperature rising and stabilizing time is saved, and the overall detection efficiency is improved.

Description

Technical Field

[0001] This application relates to the technical field of parameter detection, and particularly to a method, device, computer device, and storage medium for detecting thermal parameters. Background Art

[0002] With the development of electronic technology, various types of electronic devices have emerged. The working performance of electronic devices is affected by the ambient temperature. Therefore, it is necessary to detect the thermal parameters of electronic devices. In traditional technologies, an electronic device is placed in a single-chamber incubator, and the temperature of the electronic device rises step by step with the temperature of the incubator. After the temperature of the incubator stabilizes at the temperature point to be tested, the thermal parameters of the electronic device are then tested. However, in this detection method, the time consumed for the incubator to heat up and stabilize the temperature is relatively long, and the overall detection efficiency is low. Summary of the Invention

[0003] Based on this, it is necessary to provide a method, device, computer device, and storage medium for detecting thermal parameters that can improve the detection efficiency in view of the above technical problems.

[0004] In a first aspect, this application provides a method for detecting thermal parameters, which is applied to a detection device. The detection device includes: a plurality of detection chambers and a detector. The method includes: electrically connecting a device under test to the detector; wherein the detector is used to collect test data of the device under test; sequentially placing the device under test in one of the detection chambers at different set temperatures for testing; wherein, during the testing, adjusting the temperature of the other detection chambers to another set temperature; and when the device under test has completed testing at all set temperatures, completing the detection of the thermal parameters of the device under test.

[0005] In one embodiment, the plurality of detection chambers include: a first chamber and a second chamber. The step of sequentially placing the device under test in one of the detection chambers at different set temperatures for testing includes: sequentially and alternately placing the device under test in the first chamber and the second chamber for testing; wherein, when the device under test is being tested in the first chamber, adjusting the temperature of the second chamber; and when the device under test is being tested in the second chamber, adjusting the temperature of the first chamber.

[0006] In one embodiment, the lowest temperature of the first chamber is greater than the highest temperature of the second chamber.

[0007] In one embodiment, the step of adjusting the temperature of the second chamber includes: adjusting the temperature of the second chamber to increase sequentially from the set lowest temperature to the highest temperature of the second chamber.

[0008] In one embodiment, the highest temperature of the second cavity is the freezing point temperature.

[0009] In one embodiment, the step of adjusting the temperature of the first cavity includes: adjusting the temperature of the first cavity to gradually decrease from the set highest temperature to the lowest temperature of the first cavity.

[0010] In one embodiment, the lowest temperature of the first cavity is room temperature.

[0011] In a second aspect, the present application also provides a detection device for thermal parameters, which is applied to a detection device. The detection device includes: a plurality of detection cavities and a detector. The device includes: a connection module for electrically connecting the device under test to the detector; wherein the detector is used to collect test data of the device under test; a test module for sequentially placing the device under test in one of the detection cavities at different set temperatures for testing; wherein, during the test, the temperatures of the other detection cavities are adjusted to another set temperature; a detection module for completing the detection of the thermal parameters of the device under test when the device under test has completed the test at all set temperatures.

[0012] In a third aspect, the present application also provides a computer device. The computer device includes a memory and a processor. The memory stores a computer program, and when the processor executes the computer program, the steps of the above method are implemented.

[0013] In a fourth aspect, the present application also provides a computer-readable storage medium. The computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the steps of the above method are implemented.

[0014] For the above detection method, device, computer device and storage medium of thermal parameters, by using a detection device with a plurality of detection cavities, during the detection, the device under test is sequentially placed in one of the detection cavities at different set temperatures for testing, and during the test, the temperatures of the other detection cavities are adjusted to another set temperature. Since the temperatures of the other detection cavities will be synchronously adjusted when the device under test is being tested in one detection cavity, the device under test can be directly transferred to different detection cavities for testing during the test, saving the time for heating and stabilizing the temperature and improving the overall detection efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] To more clearly illustrate the technical solutions in the embodiments of the present application or in the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0016] Figure 1 Schematic diagram of a detection device in an embodiment;

[0017] Figure 2 Schematic flowchart of a detection method in an embodiment;

[0018] Figure 3 Schematic diagram of a detection device in another embodiment;

[0019] Figure 4 Schematic diagram of alternating detection in an embodiment;

[0020] Figure 5 Module diagram of a detection device in an embodiment;

[0021] Figure 6 Internal structure diagram of a computer device in an embodiment. Detailed implementation manners

[0022] To facilitate the understanding of the present application, the following will describe the present application more comprehensively with reference to the relevant drawings. Embodiments of the present application are given in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present application more thorough and comprehensive.

[0023] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the technical field to which the present application belongs. The terms used in the description of the present application herein are only for the purpose of describing specific embodiments and are not intended to limit the present application.

[0024] It can be understood that the terms "first", "second", etc. used in the present application can be used herein to describe various elements, but these elements are not limited by these terms. These terms are only used to distinguish one element from another. In the description of the present application, the meaning of "a plurality" is at least two, such as two, three, etc., unless otherwise specifically defined.

[0025] It should be noted that when an element is considered to be "connected" to another element, it can be directly connected to the other element or connected to the other element through an intermediate element. In addition, for the "connection" in the following embodiments, if there is a transmission of electrical signals or data between the connected objects, it should be understood as "electrically connected", "communicatively connected", etc.

[0026] As described in the background art, there is a technical problem of relatively low overall detection efficiency in detecting thermosensitive parameters of electronic devices in the prior art. Taking the detection of the thermosensitive parameter Vf of a semiconductor MOS device (Metal-Oxide-Semiconductor Field-Effect Transistor, MOSFET) as an example, the Vf value of the MOS device is the voltage between the source and the drain in the forward conduction state of the main junction of the MOS device, and it is affected by the ambient temperature. There is a linear relationship between the thermosensitive parameter Vf and the ambient temperature T. When detecting, the slope and intercept between Vf and T need to be obtained. The traditional method is to place the MOS device in an oven or an oil bath, connect the current test wire and the voltage test wire, and then control the oven or the oil bath to start heating. After reaching the first temperature point, start stabilizing the temperature of the device. After Vf is stable, it can be considered that the temperature stabilization is completed, and the values of Vf and T at this time are recorded. Subsequently, the oven or the oil bath starts heating to the second temperature point, and the overall test is completed through the repeated heating detection process. After the test is completed, the oven or the oil bath starts cooling to room temperature, and the sample is taken out after the cooling is completed. However, due to the remaining heat of the sample and the temperature gradient from the surface to the center of the sample, the sample still needs to continue releasing heat throughout the body to room temperature before it can be used. However, in this detection method, the time for heating and stabilizing the temperature at each temperature point is long; the sample needs to take a long time to cool to room temperature after the measurement; it is difficult to measure the linear relationship of the large-span thermosensitive parameters from extremely low temperatures below the freezing point to extremely high temperatures at one time.

[0027] For the above reasons, the embodiments of the present application provide a method, device, computer device, and storage medium for detecting thermosensitive parameters to solve the above technical problems.

[0028] The thermosensitive parameter detection method of the embodiments of the present application is applied to, for example Figure 1In the detection device shown, the detection device includes: a plurality of detection cavities and a detector. Each detection cavity can be independently temperature-controlled to ensure that the device under test can be tested at a specific temperature without being affected by the temperatures of other detection cavities. Two adjacent detection cavities can be connected or disconnected. When two adjacent detection cavities are connected, the device under test can move through the connected through holes. When two adjacent detection cavities are disconnected, the device under test can move through the entrances and exits on the detection cavity. The detector is used to be electrically connected to the device under test to apply corresponding test signals to the device under test and collect corresponding test data, so as to obtain the test data of the device under test at different temperatures. It can be understood that the detector can be connected to the device under test through a wire. When the device under test is placed in the detection cavity, the wire can be accommodated in the wire hole on the detection cavity.

[0029] In one embodiment, as Figure 2 shown, a method for detecting thermal parameters is provided. Taking this method applied to the Figure 1 detection device in the above as an example, it includes the following steps:

[0030] Step S110, electrically connect the device under test to the detector.

[0031] Specifically, before detecting the thermal parameters of the device under test, first electrically connect the device under test to the detector so that the detector can collect the test data of the device under test. When electrically connecting the device under test to the detector, the detection device can grab the device under test through a robotic arm and electrically connect it to the detector. In some other embodiments, a manual connection method can also be used to electrically connect the device under test to the detector.

[0032] Step S120, place the device under test in one detection cavity with different set temperatures in sequence for testing.

[0033] Specifically, when detecting the thermal parameters of the device under test, place the device under test in one detection cavity with different set temperatures in sequence for testing. And when testing, adjust the temperatures of other detection cavities to another set temperature. The number of detection cavities can be determined according to the temperature adjustment rate of the detection cavity and the test time of the device under test, as long as it satisfies that when the device under test conducts the next temperature test, the temperatures of other detection cavities are adjusted.

[0034] For example, when the number of detection cavities is set to three, first place the device under test in one detection cavity at a certain set temperature and perform a test using a detector. During the test by the detector, the detection device controls the temperatures of the other two detection cavities to be other set temperatures respectively to prepare for the test of the device under test at other set temperatures. After the test of the device under test is completed, the temperatures of the other detection cavities have been adjusted and stabilized. At this time, directly move the device under test to the corresponding detection cavity to perform the test at the next temperature. It can be understood that during the next test, the temperature of the previous detection cavity can also be adjusted to other set temperatures to prepare for the test of other set temperatures. By this method, it is possible to complete the tests at multiple set temperatures with only three detection cavities, save the time for heating and stabilizing the temperature, and improve the overall detection efficiency.

[0035] Step S130, when the device under test has completed the tests at all set temperatures, complete the detection of the thermal parameters of the device under test.

[0036] Specifically, the detection device will record the temperature of the detection cavity when the device under test is being tested. By combining the test data collected by the detector, the test data of the device under test at different temperatures can be obtained. By performing data processing on the test data at different temperatures, the detection of the thermal parameters of the device under test can be completed.

[0037] In one embodiment, as Figure 3 shown, according to the specific detection requirements, the number of detection cavities of the detection device in this embodiment is set to two, and the multiple detection cavities include: a first cavity and a second cavity.

[0038] In one embodiment, in step S120, the step of sequentially placing the device under test in one detection cavity at different set temperatures for testing includes: sequentially and alternately placing the device under test in the first cavity and the second cavity for testing.

[0039] Specifically, in this embodiment where there are two detection cavities, the device under test will be sequentially and alternately placed in the first cavity and the second cavity for testing until the device under test has completed the tests at all set temperatures. For example, first place the device under test in the first cavity for testing. When the device under test is being tested in the first cavity, adjust the temperature of the second cavity to a certain set temperature. After the test of the device under test in the first cavity is completed, the temperature of the second cavity has also been adjusted. At this time, move the device under test to the second cavity for testing. When the device under test is being tested in the second cavity, adjust the temperature of the first cavity to a certain set temperature. By the above-mentioned alternating test method, the device under test can complete the tests at different set temperatures, thereby completing the detection of the thermal parameters of the device under test.

[0040] In one embodiment, the lowest temperature of the first cavity is greater than the highest temperature of the second cavity. Specifically, in this embodiment, the first cavity and the second cavity are set to have different temperature adjustment ranges, and the lowest temperature of the first cavity during temperature adjustment is greater than the highest temperature of the second cavity during temperature adjustment, so that the temperatures of the two detection cavities after temperature adjustment do not repeat, making full use of the temperature adjustment capabilities of different detection cavities, enabling the device under test to complete tests within a large temperature range. In some other embodiments, when large-range temperature tests are not required, the temperature adjustment ranges of the first cavity and the second cavity can also be set to be the same.

[0041] In one embodiment, when the lowest temperature of the first cavity is greater than the highest temperature of the second cavity, the steps of adjusting the temperature of the second cavity include: adjusting the temperature of the second cavity from the set lowest temperature to increase to the highest temperature of the second cavity in sequence.

[0042] Specifically, in this embodiment, the lowest temperature of the first cavity is greater than the highest temperature of the second cavity. When the device under test is placed in the first cavity for testing in an alternating manner, from the multiple adjustment processes of adjusting the temperature of the second cavity, the temperature of the second cavity increases from the set lowest temperature to the highest temperature of the second cavity in sequence. By adjusting the temperature of the second cavity in such a gradually increasing temperature manner, the rate of completion of each temperature adjustment of the second cavity can be improved. In some embodiments, the highest temperature of the second cavity is the freezing point temperature. At this time, the set lowest temperature is also lower than the freezing point temperature. During the process of adjusting the temperature of the second cavity, the temperature of the second cavity increases from the set lowest temperature to the freezing point temperature in sequence. By this setting method, the device under test can complete tests at extremely low temperatures below the freezing point.

[0043] In one embodiment, when the lowest temperature of the first cavity is greater than the highest temperature of the second cavity, the steps of adjusting the temperature of the first cavity include: adjusting the temperature of the first cavity from the set highest temperature to decrease to the lowest temperature of the first cavity in sequence.

[0044] Specifically, in this embodiment, the lowest temperature of the first cavity is greater than the highest temperature of the second cavity. When the device under test is placed in the first cavity for testing in an alternating manner, from the multiple adjustment processes of adjusting the temperature of the first cavity, the temperature of the first cavity decreases from the set highest temperature to the lowest temperature of the first cavity in sequence. By adjusting the temperature of the first cavity in such a gradually decreasing temperature manner, the rate of completion of each temperature adjustment of the first cavity can be improved. In some embodiments, the lowest temperature of the first cavity is room temperature (such as 25 degrees Celsius). At this time, the set highest temperature is also higher than room temperature. During the process of adjusting the temperature of the first cavity, the temperature of the first cavity decreases from the set highest temperature to room temperature in sequence.

[0045] In one embodiment, the last test is completed in a first cavity at room temperature. By this setting method, when the device under test completes the test at all set temperatures, the temperature of the device under test can be maintained at room temperature, and it can be used immediately without heating or cooling the device under test after the measurement is completed.

[0046] The following describes in detail the detection method of the thermal parameters of the present application with a specific embodiment. As Figure 4As shown, the detection device of this embodiment is set with two detection cavities. The first cavity is a high-temperature cavity, and the second cavity is a low-temperature cavity. The lowest temperature of the high-temperature cavity is room temperature (25 °C), and the highest temperature of the low-temperature cavity is the freezing point temperature (0 °C). The device under test is a MOS device, and the thermal parameter is the voltage Vf between the drain and the source. When the detection device starts to initiate detection, it first controls the low-temperature cavity to start pre-cooling to make the temperature of the low-temperature cavity reach the set lowest temperature T1. At the same time, the device under test is placed on the sample rack in the high-temperature cavity and electrically connected to the detector. Since the high-temperature cavity has not been started at this time, the temperature of the high-temperature cavity is room temperature (25 °C). After the low-temperature cavity is pre-cooled to the set lowest temperature T1, the device under test is first moved from the high-temperature cavity to the low-temperature cavity for testing. At the same time, the detection device controls the high-temperature cavity to start pre-heating to make the temperature of the high-temperature cavity rise to the set highest temperature T2. When the device under test completes the test at the set lowest temperature T1, the high-temperature cavity also completes pre-heating and maintains at the set highest temperature T2. At this time, the device under test is first moved to the high-temperature cavity for testing. At the same time, the detection device controls the low-temperature cavity to rise to a slightly higher temperature T3. When the device under test completes the test at the set highest temperature T2, the temperature of the low-temperature cavity is also adjusted to T3. At this time, the device under test is secondarily moved to the low-temperature cavity for testing. At the same time, the detection device controls the high-temperature cavity to cool down to a slightly lower temperature T4. When the device under test completes the test at the temperature T3, the temperature of the high-temperature cavity is also adjusted to T4. At this time, the device under test is secondarily moved to the high-temperature cavity for testing. At the same time, the detection device controls the low-temperature cavity to rise to a slightly higher temperature T5. When the device under test completes the test at the temperature T4, the temperature of the low-temperature cavity is also adjusted to T5. At this time, the device under test is thirdly moved to the low-temperature cavity for testing. At the same time, the detection device controls the high-temperature cavity to cool down to the lowest temperature, that is, room temperature (25 °C). When the device under test completes the test at the temperature T5, the temperature of the high-temperature cavity is also adjusted to room temperature (25 °C). At this time, the device under test is thirdly moved to the high-temperature cavity for testing. When the device under test completes the test at room temperature (25 °C), all data acquisition work can be completed. When performing data acquisition, after the detector obtains that Vf remains unchanged for a period of time, it can be considered that the detection cavity and the device under test have reached thermal equilibrium, and the current detection can be ended. At the same time, the detection device will also record the temperature T of the detection cavity. By fitting the Vf-T curve, the thermal parameter of the MOS device can be determined. Since the last test is in the high-temperature cavity at room temperature (25 °C), after the test is completed, the device under test can be directly taken out for subsequent use.

[0047] It should be understood that although the steps in the flowcharts involved in the above-described embodiments are shown in sequence according to the arrows, these steps are not necessarily executed in the order indicated by the arrows. Unless there is a clear description in this article, there is no strict order restriction for the execution of these steps, and these steps can be executed in other orders. Moreover, at least a part of the steps in the flowcharts involved in the above-described embodiments may include multiple steps or multiple stages. These steps or stages are not necessarily executed at the same time, but can be executed at different times. The execution order of these steps or stages is not necessarily sequential, but can be executed alternately or in turn with at least a part of other steps or steps or stages in other steps.

[0048] Based on the same inventive concept, an embodiment of the present application further provides a detection device for implementing the detection method of the thermal parameters involved above. The implementation solution provided by this device to solve the problem is similar to the implementation solution described in the above method. Therefore, the specific limitations in one or more of the following detection device embodiments can refer to the limitations on the detection method in the above text, and will not be repeated here.

[0049] In one embodiment, as Figure 5 shown, a detection device for thermal parameters is provided, including: a connection module, a test module, and a detection module, where:

[0050] The connection module is used to electrically connect the device under test to the detector; wherein, the detector is used to collect the test data of the device under test;

[0051] The test module is used to sequentially place the device under test in a detection cavity at different set temperatures for testing; wherein, when testing, the temperature of other detection cavities is adjusted to another set temperature;

[0052] The detection module is used to complete the detection of the thermal parameters of the device under test when the device under test has completed the test at all set temperatures.

[0053] In one embodiment, the multiple detection cavities include: a first cavity and a second cavity. The test module is further used to alternately place the device under test in the first cavity and the second cavity for testing; wherein, when the device under test is tested in the first cavity, the temperature of the second cavity is adjusted; when the device under test is tested in the second cavity, the temperature of the first cavity is adjusted.

[0054] In one embodiment, the lowest temperature of the first cavity is greater than the highest temperature of the second cavity.

[0055] In one embodiment, the test module is further used to adjust the temperature of the second cavity to increase sequentially from the set lowest temperature to the highest temperature of the second cavity.

[0056] In one embodiment, the highest temperature of the second cavity is the freezing point temperature.

[0057] In one embodiment, the test module is further configured to adjust the temperature of the first cavity to gradually decrease from the set highest temperature to the lowest temperature of the first cavity.

[0058] In one embodiment, the lowest temperature of the first cavity is room temperature.

[0059] Each module in the above detection device can be implemented in whole or in part by software, hardware, and their combination. Each of the above modules can be embedded in the processor of the computer device in hardware form or be independent of it, or can be stored in the memory of the computer device in software form, so that the processor can call and execute the operations corresponding to each of the above modules.

[0060] In one embodiment, a computer device is provided. The computer device can be a terminal, and its internal structure diagram can be as Figure 6 shown. The computer device includes a processor, a memory, an input / output interface, a communication interface, a display unit, and an input device. Among them, the processor, the memory, and the input / output interface are connected through a system bus, and the communication interface, the display unit, and the input device are connected to the system bus through the input / output interface. Among them, the processor of the computer device is used to provide computing and control capabilities. The memory of the computer device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system and a computer program. The internal memory provides an environment for the operation of the operating system and the computer program in the non-volatile storage medium. The input / output interface of the computer device is used for exchanging information between the processor and external devices. The communication interface of the computer device is used for communicating with external terminals in a wired or wireless manner. The wireless manner can be implemented through WIFI, a mobile cellular network, NFC (Near Field Communication), or other technologies. The computer program, when executed by the processor, implements a method for detecting thermal parameters. The display unit of the computer device is used to form a visually visible picture, which can be a display screen, a projection device, or a virtual reality imaging device. The display screen can be a liquid crystal display screen or an electronic ink display screen. The input device of the computer device can be a touch layer covering the display screen, or a button, a trackball, or a touchpad provided on the housing of the computer device, or an external keyboard, touchpad, or mouse, etc.

[0061] Those skilled in the art can understand that Figure 6 the structure shown in is only a block diagram of some structures related to the solution of the present application, and does not constitute a limitation on the computer device to which the solution of the present application is applied. The specific computer device may include more or fewer components than those shown in the figure, or combine some components, or have different component arrangements.

[0062] In one embodiment, a computer device is provided, including a memory and a processor. A computer program is stored in the memory, and when the processor executes the computer program, the steps in the above method embodiments are implemented.

[0063] In one embodiment, a computer-readable storage medium is provided, on which a computer program is stored, and when the processor executes the computer program, the steps in the above method embodiments are implemented.

[0064] Those of ordinary skill in the art can understand that all or part of the processes of implementing the above method embodiments can be completed by instructing relevant hardware through a computer program. The computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the above method embodiments. Among them, any reference to a memory, a database, or other media used in the embodiments provided in the present application can include at least one of non-volatile and volatile memories. Non-volatile memories can include read-only memory (ROM), magnetic tapes, floppy disks, flash memories, optical memories, high-density embedded non-volatile memories, resistive random access memories (ReRAM), magnetoresistive random access memories (MRAM), ferroelectric random access memories (FRAM), phase change memories (PCM), graphene memories, etc. Volatile memories can include random access memory (RAM) or external cache memories, etc. By way of illustration and not limitation, RAM can be in various forms, such as static random access memory (SRAM) or dynamic random access memory (DRAM), etc. The databases involved in the embodiments provided in the present application can include at least one of relational databases and non-relational databases. Non-relational databases can include distributed databases based on blockchain, etc., without limitation. The processors involved in the embodiments provided in the present application can be general-purpose processors, central processing units, graphics processing units, digital signal processors, programmable logic devices, data processing logics based on quantum computing, etc., without limitation.

[0065] The technical features of the above embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope described in this specification.

[0066] The above-described embodiments merely represent several implementation manners of the present application. The description thereof is relatively specific and detailed, but it should not be construed as a limitation on the patent scope of the present application. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present application, several modifications and improvements can still be made, and these all belong to the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the appended claims.

Claims

1. A method for detecting a thermal parameter, characterized in that: Applied in a detection device, the detection device comprises: a plurality of detection cavities and a detector, the method comprises: The device under test is electrically connected to the detector; wherein the detector is used to collect test data of the device under test; The device under test is sequentially placed in one of the detection cavities at different set temperatures for testing; wherein, during the test, the temperature of the other detection cavities is adjusted to another set temperature; When the device under test completes the test at all set temperatures, the detection of the thermal parameters of the device under test is completed.

2. The method for detecting a thermosensitive parameter according to claim 1, characterized in that: The plurality of detection chambers include: a first chamber and a second chamber, and the step of sequentially placing the device under test in one of the detection chambers at different set temperatures for testing includes: The device under test is alternately placed in the first cavity and the second cavity for testing; when the device under test is tested in the first cavity, the temperature of the second cavity is adjusted; when the device under test is tested in the second cavity, the temperature of the first cavity is adjusted.

3. The method for detecting a thermosensitive parameter according to claim 2, characterized in that: The lowest temperature of the first cavity is greater than the highest temperature of the second cavity.

4. The method for detecting a thermosensitive parameter according to claim 3, characterized in that: The step of adjusting the temperature of the second cavity comprises: The temperature of the second cavity is adjusted to increase from a set minimum temperature to a set maximum temperature of the second cavity.

5. The method for detecting a thermosensitive parameter according to claim 4, characterized in that: The highest temperature of the second cavity is the freezing point.

6. The method for detecting a thermosensitive parameter according to claim 3, characterized in that: The step of adjusting the temperature of the first cavity comprises: The temperature of the first cavity is adjusted to decrease from a set maximum temperature to a set minimum temperature of the first cavity.

7. The method for detecting a thermal parameter according to claim 6, characterized in that: The lowest temperature of the first cavity is room temperature.

8. A device for detecting a thermal parameter, characterized in that: Applied in a detection device, the detection device comprises: a plurality of detection cavities and a detector, the device comprises: A connection module, used to electrically connect the device under test to the detector; wherein the detector is used to collect test data of the device under test; A test module, used to place the device under test in one of the detection cavities at different set temperatures for testing; wherein, during the test, the temperature of the other detection cavities is adjusted to another set temperature; The detection module is used to complete the detection of the thermal parameters of the device under test when the device under test completes the test at all set temperatures.

9. A computer device comprising a memory and a processor, wherein the memory stores a computer program, wherein: When the processor executes the computer program, the steps of the method according to any one of claims 1 to 7 are implemented.

10. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the steps of the method according to any one of claims 1 to 7 are implemented.

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