Temperature-regulated voltage regulator

Abstract

Some embodiments include an apparatus having: a voltage regulator; a register circuit to store information associated with a relationship between an ambient temperature range and a phase crossing of a phase efficiency curve associated with the voltage regulator; and control circuitry to calculate a target phase crossing value based on the information and an ambient temperature at the voltage regulator.

Description

BACKGROUND OF THE INVENTION

[0001] Voltage regulators are widely used in electronic systems such as computers, cellular phones, and many other electronic systems or devices. A voltage regulator can operate to control (or regulate) the power supplied to the circuit components of a system. Some conventional voltage regulators have multiple power stage circuits (also referred to as phases) that can be individually activated to collectively supply power to the system in an efficient manner. The efficiency of a voltage regulator is based on its design. In a multi-phase voltage regulator, each phase has its own efficiency, which is typically represented by an efficiency curve on a graph. During operation, a multi-phase voltage regulator can perform a phase transition (switch) from one phase to another based on an efficiency phase crossover setting to efficiently regulate power. In some conventional multi-phase voltage regulators, the efficiency phase crossover setting is set (e.g., designed) based on a fixed ambient temperature (e.g., an ambient temperature of 25°C). However, in practice, the ambient temperature at the voltage regulator can change during its operation. The change in ambient temperature may be attributed to factors such as heat generated from the voltage regulator (and from other components of the system) and the system design (e.g., cooling fans and air flow). In a voltage regulator with an efficiency phase crossover fixed at a specific ambient temperature, the change in ambient temperature may affect the efficiency of the voltage regulator, which may result in inefficient operation and power loss. BRIEF DESCRIPTION OF THE DRAWINGS

[0002] Figure 1 FIG. shows an apparatus including a voltage regulator (VR) according to some embodiments described herein.

[0003] Figure 2 is a graph showing an example of efficiency curves of some phases of a VR and associated phase crossovers (crossover points) of the efficiency curves according to some embodiments described herein.

[0004] Figure 3 is a graph showing an example of the relationship between efficiency (in percentage) and current (in amperes) at different ambient temperatures associated with a Figure 1 VR according to some embodiments described herein.

[0005] Figure 4 is a flowchart showing an example method of configuring and operating a Figure 1 VR using a temperature phase adjustment setting according to some embodiments described herein.

[0006] Figure 5 is a graph showing an example of efficiency curves and phase crossovers of three phases of a Figure 1 VR according to some embodiments described herein.

[0007] Figure 6A is a graph showing an exemplary relationship between an ambient temperature range and a phase crossover of efficiency curves of phase 1 and phase 2 of a VR according to some embodiments described herein. Figure 1

[0008] Figure 6B is a graph showing an exemplary relationship between an ambient temperature range and a phase crossover of efficiency curves of phase 2 and phase 3 of a VR according to some embodiments described herein. Figure 1

[0009] Figure 7 is a flowchart of an example of a method that can be part of an example method of configuring and operating a VR according to some embodiments described herein. Figure 1 Figure 4

[0010] Figure 8 shows an apparatus in the form of a system (e.g., an electronic system) according to some embodiments described herein. DETAILED DESCRIPTION

[0011] The techniques described herein relate to a multi-phase voltage regulator (VR) that can dynamically adjust its phase crossover threshold at different ambient temperatures. The described VR can apply (e.g., automatically apply) temperature phase scaling based on changes in the ambient temperature to improve the phase operation of the VR, thereby improving efficiency. In an example, the techniques described herein relate to thermal sensing and temperature-based slope compensation at the VR to adjust (e.g., automatically adjust) the phase crossover threshold at different ambient temperatures. The described techniques can reduce the impact on the efficiency of the VR and reduce power losses of the system due to changes in the ambient temperature. Other improvements and benefits of the described techniques are discussed below with reference to Figures 1 to 8

[0012] Figure 1 shows an apparatus 100 including a VR 101 according to some embodiments described herein. The apparatus 100 can include, or be included in, an electronic device or system, such as a computer (e.g., a desktop computer, a laptop computer, or a notebook computer), a tablet computer, a cellular phone, a system-on-chip (SoC), a system-in-package (SiP), or other electronic device or system.

[0013] As Figure 1 shown, the VR 101 can include control circuitry 110, power circuitry 120, a thermal sensor 130, a current sensor 140, and a functional unit 150.

[0014] ​​​​​The functional unit 150 may include components (e.g., circuitry) that may receive power (e.g., in the form of voltage V OUT and current I OUT ) at a node (e.g., an output node) 122 of the VR 101. Examples of components included in the functional unit 150 include circuitry of a central processing unit (CPU), a graphics processing unit (GPU), a memory device, or other electronic components. During operation of the device 100, the functional unit 150 may consume different amounts of power depending on its operation (e.g., workload). The VR 101 may operate to control (e.g., regulate) the power (e.g., voltage V OUT , current I OUT , or both) at the node 122 based on the demands (e.g., operations) of the functional unit 150.

[0015] As Figure 1 shown, the control circuit 110 may include a register circuit 160, and the register circuit 160 may include registers (e.g., non-volatile memory circuits) 161, 162, 163, and 164 for storing information m1, b1, m2, and b2, respectively. The information m1, b1, m2, and b2 includes temperature regulation information, where each of the information m1, b1, m2, and b2 is a component of the temperature regulation information. As described in more detail below, the VR 101 may use the information m1, b1, m2, and b2 to calculate a target phase crossover value as part of configuring the VR 101 to reduce the impact of ambient temperature variations on the efficiency of the VR 101.

[0016] As Figure 1 shown, the register circuit 160 may include a register 165 for storing a phase count. As described in more detail below, the VR 101 may set the value of the phase count at least in part based on the target phase crossover value. The value of the phase count sets the phase operation of the VR 101. The VR 101 may operate in single-phase operation or multi-phase operation based on the value of the phase count. Further description of the phase count is provided below (e.g., with reference to Figure 4 and Figure 7 ).

[0017] As Figure 1 shown, the power circuitry 120 may have phases (e.g., circuits or phase circuits) 1201 to 120 N , which may also be referred to as power stages (or power circuits) 1201 to 120 N of the VR 101. Thus, the VR 101 is a multi-phase VR including N phases (phase 1 to phase N, where N is at least two).

[0018] As Figure 1 shown, phases 1201 to 120N Each of them may have its own circuit elements (e.g., transistors M1 and M2 and inductor L). Phases 1201 to 120 N may be coupled in parallel with each other between a node (e.g., an input node) 121 and a node (e.g., an output node) 122. Nodes 121 and 122 may be coupled to capacitors C1 and C2, respectively. Node 121 may be coupled to a voltage source (e.g., a battery, not shown) to receive a voltage (e.g., an input voltage) V IN .

[0019] VR 101 may operate in single-phase operation (one-phase (1-ph) operation) or multi-phase operation (e.g., two-phase (2-ph) or three-phase (3-ph) operation). Single-phase operation may also be referred to as single-phase mode. Multi-phase operation may also be referred to as multi-phase mode.

[0020] In an example, when the functional unit 150 consumes a lower amount of power (e.g., a lower amount of current I OUT ) at node 122, VR 101 may operate in single-phase operation. In another example, when the functional unit 150 consumes a higher amount of power (e.g., a higher amount of current I OUT ) at node 122, VR 101 may operate in multi-phase operation. VR 101 may operate in discontinuous conduction mode (DCM) or continuous conduction mode (CCM) according to the power (e.g., current) consumption of the functional unit 150.

[0021] In single-phase operation, one of phases 1201 to 120 N (e.g., phase 1201) may be activated, and other phases (e.g., phases 1202 to 120 N ) may be deactivated. The control circuit system 110 may operate to control (e.g., turn on or off) transistors M1 and M2 in a specific phase (among phases 1201 to 120 N ) to activate or deactivate the specific phase.

[0022] In multi-phase operation, at least two (two or more) phases among phases 1201 to 120 N may be activated, and other phases (among phases 1201 to 120 N ) may be deactivated. For example, in 2-phase operation (which is multi-phase operation), phase 1201 and phase 1202 (phase 1 and phase 2) may be activated, and phases 1203 to 120 N(Phase 3 to Phase N). In another example, in a 3-phase operation (which is a multi-phase operation), Phase 1201, Phase 1202, and Phase 1203 (Phase 1, Phase 2, and Phase 3) can be activated, and the phases after Phase 3 up to 120 N (e.g., Phase 4 to Phase N) can be deactivated. VR 101 can operate in continuous conduction mode (CCM) in a multi-phase operation to improve efficiency (compared to DCM).

[0023] Figure 2 FIG. 201 is a graph showing an example of the efficiency curves (phase efficiency curves) of some of the phases 1 to N of VR 101 (e.g., Phase 1, Phase 2, and Phase 3) according to some embodiments described herein and the associated phase crossings (crossing points) of the efficiency curves. In the description herein, an "efficiency curve" refers to a "phase efficiency curve"; and a "plurality of efficiency curves" refers to a "plurality of phase efficiency curves". This means that an "efficiency curve" and a "phase efficiency curve" refer to the same thing; and a "plurality of efficiency curves" and a "plurality of phase efficiency curves" refer to the same thing. In the description and drawings herein (e.g., Figure 2 , Figure 3 and Figure 5 ), "1-ph" refers to single-phase operation (one-phase operation), "2-ph" refers to two-phase operation (multi-phase operation), and "3-ph" refers to three-phase operation (multi-phase operation). The techniques described herein use examples of 1-ph, 2-ph, and 3-ph operations. However, the techniques described herein are also applicable to other multi-phase operations (e.g., 4-ph operation, etc., up to N-phase operation).

[0024] Figure 1 Each of the phases 1 to Phase N of VR 101 in Figure 2 can have a different efficiency curve (phase efficiency curve). Figure 2 FIG. shows the efficiency curve P1 of Phase 1 ( Figure 1 Phase 1201 of DCM ), P1, the efficiency curve P2 of Phase 2 ( Figure 1 Phase 1202 in Figure 1 ), and the efficiency curve P3 of Phase 3 ( Figure 1 Phase 1203 in

[0025] In Figure 2 , the value in amperes (A) on the X-axis of graph 201 can correspond to the current I of VR 101 OUT at the value of node 122. The current I OUT can also be referred to as the output current of VR 101. In Figure 2 , the percentage value on the Y-axis of graph 201 can correspond to the efficiency (in percentage) of a phase of VR 101 (e.g., Phase 1, Phase 2, or Phase 3).

[0026] In graph 201 (and in other graphs described herein), the label 1-ph_DCM indicates that VR 101 operates in DCM (discontinuous conduction mode) in single-phase operation. The label 1-ph_CCM indicates that VR 101 operates in single-phase CCM (continuous conduction mode). The labels 2-ph_CCM and 3-ph_CCM indicate that VR 101 operates in CCM (continuous conduction mode) in multi-phase operation.

[0027] In the description herein, specific values (e.g., current values, ambient temperature values, percentage values, number of active phases) are used as examples to improve the understanding of the techniques described herein. However, the techniques described herein are applicable to systems or voltage regulators that may have values different from those described herein.

[0028] As Figure 2 shown, when the current (e.g., Figure 1 the current I at node 122 in OUT ) is low (e.g., less than 13 A), VR 101 can operate in 1-ph DCM (single-phase operation in DCM). When the current increases and reaches a specific value (e.g., reaches 13 A), VR 101 can switch to operate in 1-ph CCM (single-phase operation in CCM). As the current increases (e.g., when the current reaches 22.5 A), VR 101 can perform a phase transition and operate in 2-ph CCM, which is multi-phase (two-phase) operation in CCM. In 2-ph operation, VR 101 can activate phase 1 and phase 2 one at a time in a sequentially repeating pattern (e.g., phase 1, phase 2, phase 1, phase 2, etc.) ( Figure 1 ). In Figure 2 , VR 101 can perform another phase transition (e.g., when the current reaches 31.5 A) and operate in 3-ph CCM, which is also multi-phase (three-phase) operation in CCM. In 3-ph operation, VR 101 can activate phase 1, phase 2, and phase 3 one at a time in a sequentially repeating pattern (e.g., phase 1, phase 2, phase 3, phase 1, phase 2, and phase 3, etc.) ( Figure 1 ).

[0029] Figure 2 Shows phase crossings P1-P1, P1-P2, and P2-P3 at the corresponding intersections of the efficiency curves P1 DCM , P1, P2, and P3. In this specification, a phase crossing (e.g., P1-P1, P1-P2, or P2-P3) is also referred to as a phase crossing point or a phase intersection.

[0030] In Figure 2 , the phase crossings P1 - P1, P1 - P2, and P2 - P3 can correspond to set points (e.g., optimal points) at which the VR 101 activates (or deactivates) phases (e.g., adds or subtracts phases) to maintain the efficiency of the VR 101 at a selected efficiency value (e.g., the highest or near - highest efficiency value).

[0031] During operation of the VR 101, the ambient temperature at the VR 101 can change. The change in ambient temperature may cause the phase crossings of the VR101 (e.g., Figure 2 the phase crossings P1 - P1, P1 - P2, and P2 - P3 in

[0032] Figure 3 to move. Such a movement may affect (e.g., reduce) the efficiency of the VR 101 and may result in power loss. However, as described below, the VR 101 can be configured to operate under settings (e.g., temperature - phase adjustment settings) that can reduce the impact on the efficiency of the VR 101 due to changes in ambient temperature. Figure 3 is a graph 301 showing an example relationship between efficiency (in percentage) and current (in amperes) at different ambient temperatures (ambient temperature ranges) associated with the VR 101 according to some embodiments described herein. For simplicity, Figure 1 shows example efficiency curves for only two phases (

[0033] Figure 3 shows the efficiency curve P1 DCM _25 and P1_25 of phase 1 at 25 °C and the efficiency curve P2_25 of phase 2 at 25 °C. The efficiency curves P1 DCM _25, P1_25, and P2_25 can respectively correspond to Figure 2 the efficiency curves P1 DCM , P1, and P2 of Figure 3 also shows the efficiency curve P1 DCM _45 and P1_45 of phase 1 at 45 °C and the efficiency curve P2_45 of phase 2 at 45 °C.

[0034] Figure 3 also shows the phase crossings P1 - P1_25 and P1 - P2_25 of the corresponding efficiency curves P1 DCM _25, P1_25, and P2_25. The phase crossings P1 - P1_25 and P1 - P2_25 can correspond to Figure 2 the phase crossings P1 - P1 and P1 - P2 of

[0035] AsFigure 3 As shown, when the ambient temperature changes, the phase crossover can move (change). For example, as Figure 3 shown, when the ambient temperature changes from 25°C to 45°C, the phase crossover P1 - P1_25 moves (changes) to the phase crossover P1 - P1_45. In another example, as Figure 3 shown, when the ambient temperature changes from 25°C to 45°C, the phase crossover P1 - P2_25 moves (changes) to the phase crossover P1 - P2_45.

[0036] In Figure 3 , each of the phase crossovers (P1 - P1_25, P1 - P2_25, P1 - P1_45, and P1 - P2_45) can be referred to as a phase crossover threshold. Each phase crossover threshold has a value measured in amperes on the X - axis (phase crossover threshold (or phase crossover value)). For example, the phase crossover P1 - P1_25 (phase crossover threshold P1 - P1_25) can have an example value of 13A (e.g., similar to the value of the phase crossover P1 - P1 Figure 2 ). In another example, the phase crossover P1 - P2_25 (phase crossover threshold P1 - P2_25) can have an example value of 22.5A (e.g., similar to the value of the phase crossover P1 - P2 Figure 2 ).

[0037] The distance between the phase crossover P1 - P1_25 and the phase crossover P1 - P1_45 can be referred to as the phase crossover threshold gap (the gap between two corresponding phase crossover thresholds). The distance between the phase crossover P1 - P2_25 and the phase crossover P1 - P2_45 can also be referred to as the phase crossover threshold gap. As Figure 3 shown, the change in the phase crossover threshold (due to ambient temperature change) may result in power loss associated with the operation of VR 101. When the phase crossover threshold gap becomes larger, the power loss may increase. This increase in power loss may lead to higher power consumption, which may affect system performance and battery life.

[0038] Some conventional voltage regulators are configured to operate using the phase crossover threshold at a fixed ambient temperature (e.g., 25°C). However, as Figure 3 shown, the phase crossover threshold may move due to changes in ambient temperature. In such conventional voltage regulators, using the same set of phase crossover thresholds at a fixed ambient temperature for phase conversion during the operation of the voltage regulator may be inefficient (e.g., due to increased power loss).

[0039] The following description describes techniques for configuring a VR 101 to reduce (e.g., minimize) power losses due to ambient temperature variations. In the example described below, the VR 101 can be configured to address gaps in the phase crossover threshold due to ambient temperature variations by applying (e.g., dynamically applying) temperature phase adjustment in the VR 101. In this way, the phase crossover threshold accuracy of the VR 101 can be improved at different ambient temperatures to improve the overall VR phase operation, thereby improving efficiency.

[0040] Figure 4 is a flowchart of an example method 400 for configuring and operating a VR101( Figure 1 ) using temperature phase adjustment settings in accordance with some embodiments described herein. As Figure 4 shown, method 400 can include activities 410, 420, and 430. Activity 410 can include calculating temperature adjustment information (which can be referred to as a temperature adjustment factor). The temperature adjustment information includes information m1, b1, m2, and b2 that can subsequently be stored in Figure 1 the register circuit 160. The VR 101 can use the temperature adjustment information (which includes information m1, b1, m2, and b2) to configure and operate the VR 101 in a temperature phase adjustment mode (e.g., to reduce the impact on the efficiency of the VR 101 due to ambient temperature variations). Reference Figure 5 , Figure 6A and Figure 6B 's description (described below) provides detailed techniques for calculating the temperature adjustment information (e.g., information m1, b1, m2, and b2) in activity 410.

[0041] Figure 4 Activity 420 of method 400 can include providing the temperature adjustment information (e.g., information m1, b1, m2, and b2 calculated in activity 410) to the VR 101. Providing the temperature adjustment information can include inputting (e.g., programming) the temperature adjustment information into the VR 101. For example, the interface 170 of the VR 101 can operate to allow the temperature adjustment information (calculated in activity 410) to be input (e.g., programmed) into the VR 101. The register circuit 160 of the VR 101( Figure 1) can be operated to store temperature adjustment information (e.g., information m1, b1, m2, and b2). In an example, a user or designer of VR 101 can provide temperature adjustment information to VR 101. Thus, interface 170 can include a user interface (or can be part of a user interface) to allow a user or designer of VR 101 to provide temperature adjustment information to VR 101. As an example, interface 170 can include hardware, firmware, software, or any combination of hardware, firmware, and software to allow the input (e.g., programming) of temperature adjustment information into VR 101.

[0042] Activity 430 can include performing a phase operation at VR 101. In Activity 430, VR 101 can operate in a temperature phase adjustment mode at least in part based on temperature adjustment information (e.g., information m1, b1, m2, and b2 provided to VR 101 in Activity 420). Activity 430 can be performed by components of VR 101 (e.g., control circuitry 110) and other components associated with VR 101 (e.g., components of a system (e.g., system 800) that includes VR 101). Activity 430 can include setting (e.g., allocating) a phase count (e.g., a value from 1 to N) for a phase operation (e.g., single-phase or multi-phase) of VR 101 at least in part based on temperature adjustment information. Refer to Figure 7 the description for more details of Activity 430 of method 400.

[0043] Figure 5 FIG. 501 is a graph showing an example of efficiency curves (phase efficiency curves) and phase crossings of Phase 1, Phase 2, and Phase 3 of VR 101 according to some embodiments described herein. Information from FIG. 501 can be used to calculate the above temperature adjustment information (e.g., information m1, b1, m2, and b2) in Figure 4 Activity 410. FIG. 501 can be created (e.g., generated) by a user or designer of VR 101. The data used to create FIG. 501 can be based on data collected from measurements of the efficiency of each of Phase 1, Phase 2, and Phase 3 during operation (e.g., simulation) of VR 101 at different ambient temperatures (e.g., 25 °C, 35 °C, and 45 °C, as Figure 5 shown) within an ambient temperature range.

[0044] Figure 5Shows the efficiency curves P1_25, P1_35, and P1_45 of Phase 1 at ambient temperatures of 25°C, 35°C, and 45°C respectively; the efficiency curves P2_25, P2_35, and P2_45 of Phase 2 at ambient temperatures of 25°C, 35°C, and 45°C respectively; and the efficiency curves P3_25, P3_35, and P3_45 of Phase 3 at ambient temperatures of 25°C, 35°C, and 45°C respectively.

[0045] Graph 501 shows, as an example, three efficiency curves for each of Phase 1, Phase 2, and Phase 3 at ambient temperatures of 25°C, 35°C, and 45°C. However, a different number of phases (e.g., 1 to N) or a different number (or values) of ambient temperatures or both can be used. Figure 5 Shows an example of the three-phase operation (1-ph, 2-ph, and 3-ph operation) of VR 101. However, a different number of phase operations of VR 101 can be performed to collect data for creating Graph 501.

[0046] As Figure 5 shown, the efficiency curves of Phase 1 and Phase 2 can have phase crossings P1-P2_25 (at 25°C), P1-P2_35 (at 35°C), and P1-P2_45 (at 45°C) associated with current values (in amperes) A, B, and C. The values A, B, C can also be referred to as phase crossing thresholds (or phase crossing values).

[0047] As Figure 5 shown, the efficiency curves of Phase 2 and Phase 3 can have phase crossings P2-P3_25 (25°C), P2-P3_35 (35°C), and P2-P3_45 (45°C) associated with current values (in amperes) D, E, and F. The values D, E, and F can also be referred to as phase crossing thresholds (or phase crossing values).

[0048] Based on the information from Graph 501, the relationship between the ambient temperature range (e.g., in degrees Celsius) and the phase crossings (including values A, B, C, D, E, and F) can be determined (e.g., calculated), as Figure 6A and Figure 6B shown. This relationship can be used to calculate temperature regulation information (e.g., information m1, b1, m2, and b2), and VR 101 can use the temperature regulation information to reduce the impact of temperature changes on the efficiency of VR 101.

[0049] Figure 6A Graph 601A is a graph showing an example relationship between the ambient temperature range and the phase crossings of the efficiency curves of Phase 1 and Phase 2 of VR 101 according to some embodiments described herein. It can be based on information from Figure 5The data of graph 501 is used to create (e.g., plot) graph 601A. For example, the values (phase crossover values) A, B, and C (on the Figure 6A Y-axis) can respectively correspond to the values A, B, and C (on the Figure 5 X-axis).

[0050] Temperature adjustment information (e.g., information m1 and information b1) can be calculated based on graph 601A. In Figure 6A , using linear extrapolation, the data in graph 601A can be represented by the simple formula y1 = m1 * x + b1 associated with line 610A. In the example, the linear extrapolation has a negligible error. In Figure 6A , the term y1 (in the formula y1 = m1 * x1 + b1) represents the target phase crossover threshold (in amperes on the Y-axis) between phase 1 and phase 2 of VR101. The term x1 in the formula y1 = m1 * x1 + b1 represents the ambient temperature at VR101. The term m1 (which is information m1) in the formula y1 = m1 * x + b1 represents the slope of line 610A. The term b1 (which is information b1) in the formula y1 = m1 * x1 + b1 represents the Y-intercept of line 610A.

[0051] In Figure 6A , the value of information m1 (the slope of line 610A) can be calculated (e.g., manually calculated (e.g., determined) by the user or designer of VR101) based on two values on the Y-axis of line 610A (e.g., current values I1 and I2) and two values on the X-axis (e.g., ambient temperature values T1 and T2). For example, as Figure 6A shown, m1 = (I1 - I2) / (T1 - T2).

[0052] In Figure 6A , the value of information b1 (the Y-intercept of line 610A) can be calculated (e.g., manually calculated (e.g., determined) by the user or designer of VR101) based on the same values (e.g., values I1, I2, T1, and T2) used to calculate information m1 (the slope of line 610A). For example, the value of information b1 can be calculated by the formula b1 = I1 - m1 * T1 (or alternatively b1 = I2 - m1 * T2).

[0053] Subsequently, information m1 and information b1 (calculated through graph 601A) can be provided to (e.g., programmed into) the register circuit 160 of VR101. The control circuitry 110 of VR101 ( Figure 1 ) can be configured to receive information m1 and information b1 (e.g., through the Figure 1 interface 170) and store them in the register circuit 160.

[0054] Other components of the temperature regulation information (e.g., information m2 and information b2) can be calculated in a manner similar to that of information m1 and information b1, as described below with reference to Figure 6B as described.

[0055] Figure 6B FIG. 601B is a graph showing an example relationship between the ambient temperature range and the phase crossover of the efficiency curves of phases 2 and 3 of VR 101 according to some embodiments described herein. Graph 601B can be created (e.g., plotted) based on the data of graph 501 from Figure 5 . For example, the values (phase crossover values) D, E, and F (on the Y-axis of Figure 6B ) can correspond to the values D, E, and F (on the X-axis of Figure 5 ), respectively.

[0056] The temperature regulation information (e.g., information m2 and information b2) can be calculated based on graph 601B. In Figure 6B , using linear extrapolation, the data in graph 601B can be represented by the simple formula y2 = m2 * x + b2 associated with line 610B. In the example, the linear extrapolation has a negligible error. In Figure 6B , the term y2 (in the formula y2 = m2 * x2 + b2) represents the target phase crossover threshold (in amperes on the Y-axis) between phases 2 and 3 of VR 101. The term x2 in the formula y2 = m2 * x2 + b2 represents the ambient temperature at VR 101. The term m2 (which is information m2) in the formula y2 = m2 * x + b2 represents the slope of line 610B. The term b2 (which is information b2) in the formula y2 = m2 * x2 + b2 represents the Y-intercept of line 610B.

[0057] In Figure 6B , the value of information m2 (the slope of line 610B) can be calculated (e.g., manually calculated (e.g., determined) by the user or designer of VR 101) based on two values on the Y-axis of line 610B (e.g., current values I3 and I4) and two values on the X-axis (e.g., ambient temperature values T3 and T4). For example, as Figure 6B shown, m2 = (I3 - I4) / (T3 - T4).

[0058] In Figure 6B , the value of information b2 (the Y-intercept of line 610B) can be calculated (e.g., manually calculated (e.g., determined) by the user or designer of VR 101) based on the same values used to calculate information m2 (the slope of line 610B) (e.g., values I3, I4, T3, and T4). For example, the value of information b2 can be calculated by the formula b2 = I3 - m2 * T3 (or alternatively b2 = I4 - m2 * T4).

[0059] Subsequently, the information m2 and the information b2 (calculated through the curve graph 601B) can be provided to (e.g., programmed into) the register circuit 160 in the control circuitry 110 of VR101 Figure 1 ).

[0060] The control circuitry 110 of VR 101 Figure 1 can be configured to receive the information m2 and the information b2 (e.g., through the interface 170 in Figure 1 ) and store them in the register circuit 160.

[0061] Figure 6A and Figure 6B show an example relationship between the efficiency phase cross - over values (current, in amperes) and the ambient temperature for three phases (e.g., phase 1, phase 2, and phase 3) of VR 101 for calculating the temperature - regulation information m1, b1, m2, and b2. However, similar techniques can be used for more than three phases of VR 101 at different ambient temperatures or different input voltages (e.g., V in Figure 1 ). IN )

[0062] As described in more detail with reference to Figure 7 , VR 101 can use the temperature - regulation information (which includes the information m1, b1, m2, and b2 calculated through the curve graphs 601A and 601B( Figure 6A and Figure 6B )) to calculate the target phase cross - over value as part of configuring VR 101 to reduce the impact of ambient - temperature variations on the efficiency of VR 101.

[0063] Figure 7 is a flowchart of an example method 700 that can be part of an example method of configuring and operating a VR according to some embodiments described herein. As Figure 1 shown, method 700 can include activities 710 and 720. The activities (activities 710 and 720) of method 700 can be performed (e.g., executed) by components of VR 101 (e.g., the control circuitry 110) and other components associated with VR 101 (e.g., components of a system (e.g., system 800) that includes VR 101). For simplicity, method 700 also includes Figure 4 other activities (described below) not shown in Figure 7 . Figure 7 As

[0064] shown, activity 710 can include receiving information related to the efficiency curve of a phase of a voltage regulator (which can include VR 101) within an ambient - temperature range and Figure 7 ),Figure 5 information associated with the relationship between the phase crossings of the efficiency curve shown). The information in activity 710 may include temperature regulation information (e.g., information m1, b1, m2, and b2) calculated based on the techniques described above with reference to Figure 5 , Figure 6A and Figure 6B . The information in activity 710 may be received at (or via) interface 170 of VR 101. The control circuitry 110 of VR 101 ( Figure 1 ) may be configured to receive the information (in activity 710) via Figure 1 's interface 170 and store the information in register circuitry 160.

[0065] In Figure 7 , activity 720 may include setting a phase count for the phase operation of a voltage regulator including VR 101 based on the information received in activity 710, the ambient temperature at the voltage regulator (e.g., VR 101), and the output current of the voltage regulator (e.g., Figure 1 's current I OUT ). As described above, the phase count may have a value from 1 to N (where N is the number of phases of the voltage regulator (e.g., VR 101)).

[0066] As part of setting the phase count in activity 720, method 700 may include sensing, during operation of VR 101 (e.g., performed by Figure 1 's thermal sensor 130), the ambient temperature at VR 101. The thermal sensor 130 may operate to sense the ambient temperature at VR 101 during operation of VR 101 (e.g., after receiving the information in activity 710) and provide information corresponding to the value of the ambient temperature during operation of VR 101. Method 700 may also include sensing, during operation, the current (output current) I at node 122 (e.g., performed by Figure 1 's current sensor 140) OUT . The current sensor 140 may operate to sense current I OUT (e.g., after receiving the information in activity 710) and provide information corresponding to the value of current I OUT during operation of VR 101.

[0067] As part of setting the phase count in activity 720, method 700 may include calculating a target phase crossing value (target phase crossing threshold) Target_Ph_Crossover_1 and a target phase crossing value (target phase crossing threshold) Target_Ph_Crossover_2 based on formulas (1) and (2) respectively, as shown below.

[0068] Target_Ph_Crossover_1 = m1 * (ambient_temperature) + b1 (1)

[0069] Target_Ph_Crossover_2 = m2 * (ambient_temperature) + b2 (2)

[0070] For simplicity, the target phase crossover values Target_Ph_Crossover_1 and Target_Ph_Crossover_2 are sometimes referred to as Target_Ph_Crossover_1 and Target_Ph_Crossover_2, respectively. Target_Ph_Crossover_1 and

[0071] each of Target_Ph_Crossover_2 has a value measured in amperes.

[0072] In equations (1) and (2), the information m1, b1, m2, and b2 have known values (e.g., as referenced Figure 6A and Figure 6B calculated) and are stored in the register circuit 160 of the VR 101.

[0073] In equations (1) and (2), the term ambient_temperature represents the ambient temperature (e.g., the sensed ambient temperature) that can be provided by the thermal sensor 130 ( Figure 1 ) during operation of the VR 101.

[0074] Thus, based on equation (1), the value of Target_Ph_Crossover_1 can be calculated by substituting the values of m1 and b1 (stored in the register circuit 160) and the value of ambient_temperature (the sensed ambient temperature) into equation (1).

[0075] Similarly, based on equation (2), the value of Target_Ph_Crossover_2 can be calculated by substituting the values of m2 and b2 (stored in the register circuit 160) and the value of ambient_temperature (the sensed ambient temperature) into equation (2). The value of ambient_temperature (the sensed ambient temperature) used for equations (1) and (2) can be the same.

[0076] The values of Target_Ph_Crossover_1 and Target_Ph_Crossover_2 can be stored in VR 101. For example, the control circuitry 110 can be configured to store the values of Target_Ph_Crossover_1 and Target_Ph_Crossover_2 in the register circuitry 160.

[0077] As part of setting the phase count in activity 720, method 700 can include the current I of VR 101 during operation OUT value (the sensed value) with Target_Ph_Crossover_1 (calculated according to Formula 1) and (calculated according to Formula 2)

[0078] each value of Target_Ph_Crossover_2 is compared to provide a comparison result. Based on this comparison result, activity 720 can set the phase count to one of values 1 to N. The value of the phase count sets the phase operation of VR 101 to one of 1-ph, 2-ph, 3-ph operation or other phase operations, as described below. A summary of the values of the phase count based on the comparison result is shown below.

[0079] If I OUT < Target_Ph_Crossover_1, then phase count = 1

[0080] If Target_Ph_Crossover_1 ≤ I OUT < Target_Ph_Crossover_2, then phase count = 2

[0081] If I OUT ≥ Target_Ph_Crossover_2, then phase count = 3

[0082] Therefore, activity 720 can include based on (e.g., if) the current I OUT (sensed by the current sensor 140) value is less than the value of Target_Ph_Crossover_1 (e.g., I OUT < Target_Ph_Crossover_1), setting the phase count to a value (e.g., phase count = 1) for setting (enabling) VR 101 to operate in single-phase (1-ph) operation.

[0083] Activity 720 can include based on (e.g., if) the current I OUT(Sensed by current sensor 140), the value is not less than the value of Target_Ph_Crossover_1 and less than the value of Target_Ph_Crossover_2 (e.g., Target_Ph_Crossover_1 ≤ I OUT <Target_Ph_Crossover_2), set the phase count to the value for setting (enabling) VR 101 to operate in two-phase (2-ph) operation (e.g., phase count = 2).

[0084] Activity 720 may include based on (e.g., if) current I OUT (Sensed by current sensor 140), the value is not less than the value of Target_Ph_Crossover_2 (e.g., I OUT ≥Target_Ph_Crossover_2), set the phase count to the value for setting (enabling) VR 101 to operate in three-phase (3-ph) operation (e.g., phase count = 3).

[0085] The values of Target_Ph_Crossover_1 and Target_Ph_Crossover_2 can be adjusted (e.g., dynamically adjusted) in response to changes in the ambient temperature during the operation of VR 101. For example, the control circuitry 110 of VR 101 can be configured to adjust (e.g., increase or decrease) the values of Target_Ph_Crossover_1 and Target_Ph_Crossover_2 in response to changes in the ambient temperature during the operation of VR 101 (and Figure 1 the power consumption of functional unit 150). As an example, the control circuitry 110 can receive the ambient temperature sensed at VR101 (e.g., from Figure 1 the thermal sensor 130 in) in a periodic or aperiodic manner during the operation of VR 101. Based on the sensed ambient temperature, the control circuitry 110 can calculate new values (e.g., adjusted values) of each of Target_Ph_Crossover_1 and Target_Ph_Crossover_2 based on Equation (1) and Equation (2). Then, the control circuitry 110 can sense the current I OUT new value (e.g., by Figure 1The current sensor 140 provided) is compared with the new values of Target_Ph_Crossover_1 and Target_Ph_Crossover_2 to generate a new comparison result. Based on the new comparison result, the control circuitry system 110 can adjust (e.g., update) the phase count based on the adjusted (e.g., updated) phase count to set the phase operation of the VR 101. Thus, as described herein, the control circuitry 110 can periodically or aperiodically adjust Target_Ph_Crossover_1 and

[0086] the values of Target_Ph_Crossover_2.

[0087] Relative to Figure 7 the activities 710 and 720 shown, the method 700 may include fewer or more activities. For example, the method 700 may include additional activities (e.g., operations) associated with a device (e.g., device 100 including the VR 101) and / or a system (e.g., system 800). In some embodiments, the method 700 may also include the activities (e.g., operations) in the examples listed below.

[0088] Figure 8 FIG. shows a device in the form of a system (e.g., an electronic system) 800 according to some embodiments described herein. The system 800 may be regarded as a machine. The system (e.g., machine) 800 may include a computer, a cellular phone, or other electronic systems, or be included in a computer, a cellular phone, or other electronic systems. As Figure 8 shown, the system 800 may include components (e.g., devices) located on a circuit board (e.g., a PCB) 802. The components may include a processor (e.g., a hardware processor) 815, a memory device 820, a memory controller 830, a graphics controller 840, an I / O controller 850, a display 852, a keyboard 854, a pointing device 856, at least one antenna 858, a storage device 860, and a bus 870. The bus 870 may include wires (e.g., metal-based traces on the circuit board 802 where the components of the system 800 are located).

[0089] The system 800 may also include a power management module (e.g., a power unit) 805 to manage power and supply power to other components of the system 800 (e.g., from a battery, not shown). The power management module 805 may include a voltage regulator (VR) 801. The VR 801 may include the VR 101 described above with reference to Figures 1 to 7 the description. Figure 8Shows as an example the VR 801 included in the power management module 805. However, some or all of the VR 801 may be located outside the power management module 805 and in other components of the system 800. Some or all of the VR 810 may also be located on the circuit board 802.

[0090] The system 800 may be configured to perform one or more of the methods and / or operations described herein. At least one of the components of the system 800 (e.g., at least one of the processor 815, the memory device 820, the memory controller 830, the graphics controller 840, and the I / O controller 850) may include the devices or functional units described herein (e.g., the functional unit 150), where the devices or functional units may include circuitry and operations as described above with reference to Figures 1 to 7 those described.

[0091] In Figure 8 this regard, the processor 815 may include a general-purpose processor or an application-specific integrated circuit (ASIC). The processor 815 may include a central processing unit (CPU) and processing circuitry. The graphics controller 840 may include a graphics processing unit (GPU) and processing circuitry. The memory device 820 may include a dynamic random access memory (DRAM) device, a static random access memory (SRAM) device, a flash memory device, a phase change memory, or a combination of these memory devices, or other types of memory. Figure 8 Shows an example where the memory device 820 is a separate memory device from the processor 815. In an alternative configuration, the memory device 820 and the processor 815 may be located on the same IC chip (e.g., a semiconductor die or an IC die). In such an alternative configuration, the memory device 820 is an embedded memory in the processor 815, such as embedded DRAM (eDRAM), embedded SRAM (eSRAM), embedded flash memory, or another type of embedded memory.

[0092] The storage device 860 may include a drive unit (e.g., a hard disk drive (HHD), a solid-state drive (SSD), or another mass storage device). The storage device 860 may include a machine-readable medium 862 and processing circuitry. The machine-readable medium 862 may store a set or sets of data structures or instructions 864 (e.g., software) embodying any one or more of the techniques or functions described herein, or used by any one or more of the techniques or functions described herein. The instructions 864 may also reside, in whole or at least in part, within the memory device 820, the memory controller 830, the processor 815, or the graphics controller 840 during execution thereof by the system (e.g., machine) 800.

[0093] In an example, one (or any combination) of the processor 815, the memory device 820, the memory controller 830, the graphics controller 840, and the storage device 860 can constitute a machine-readable medium. Non-limiting examples of machine-readable media can include solid-state memory and optical and magnetic media. Specific examples of machine-readable media can include non-volatile memory such as semiconductor memory devices (e.g., EPROM or EEPROM) and flash memory devices; magnetic disks such as internal hard disks and removable disks; magneto-optical disks; RAM; and CD-ROM and DVD-ROM disks.

[0094] Figure 8 Illustrated as an example is a machine-readable medium 862 as a single medium. However, the term "machine-readable medium" can include a single medium or multiple media (e.g., a centralized or distributed database and / or associated cache and servers) configured to store instructions 864. Additionally, the term "machine-readable medium" can include any medium that is capable of storing, encoding, or carrying instructions for execution by the system 800 and that causes the system 800 to perform any one or more of the techniques of the present disclosure, or any medium that is capable of storing, encoding, or carrying a data structure used by or associated with such instructions. In some examples, the machine-readable medium can include a non-transitory machine-readable medium. In some examples, the machine-readable medium can include a machine-readable medium that is not a transitory propagated signal.

[0095] The display 852 can include a liquid crystal display (LCD), a touch screen (e.g., a capacitive or resistive touch screen), or another type of display. The pointing device 856 can include a mouse, a stylus, or another type of pointing device. In some configurations, the system 800 need not include a display. Thus, in such a configuration, the display 852 can be omitted from the system 800.

[0096] The antenna 858 can include one or more directional or omnidirectional antennas, including, for example, dipole antennas, monopole antennas, patch antennas, loop antennas, microstrip antennas, or other types of antennas suitable for transmitting radio frequency (RF) signals. In some configurations, the system 800 need not include an antenna. Thus, in such a configuration, the antenna 858 can be omitted from the system 800.

[0097] The I / O controller 850 can include a communication module for wired or wireless communication (e.g., communication via one or more antennas 858). Such wireless communication can include communication according to WiFi communication technology, advanced long term evolution (LTE-A) communication technology, fifth generation (5G) wireless systems or variants or derivatives, 5G mobile network systems or variants or derivatives, 5G new radio (NR) systems or variants or derivatives, or other cellular service standards, or other communication technologies.

[0098] The I / O controller 850 may also include modules that allow the system 800 to communicate with other devices or systems according to one or more of the following standards or specifications (e.g., I / O standards or specifications), including Universal Serial Bus (USB), DisplayPort (DP), High-Definition Multimedia Interface (HDMI), Thunderbolt interface, Peripheral Component Interconnect Express (PCIe), Ethernet, and other specifications.

[0099] The connector 855 may include terminals (e.g., pins) to allow the system 800 to receive a connection (e.g., an electrical connection) from an external device (or system). This may allow the system 800 to communicate (e.g., exchange information) with such a device (or system) via the connector 855. At least a portion of the connector 855 and the bus 870 may include wires that conform to at least one of the USB, DP, HDMI, Thunderbolt interface, PCIe, Ethernet, and other specifications.

[0100] Figure 8 The components (e.g., devices) of the system 800 shown as being arranged separately from each other are presented as examples. For example, each of the processor 815, the memory device 820, the memory controller 830, the graphics controller 840, and the I / O controller 850 may be included in a separate IC chip (e.g., a separate semiconductor die or a separate IC die) (e.g., formed in a separate IC chip or formed on a separate IC chip). In some configurations of the system 800, two or more components of the system 800 (e.g., the processor 815, the memory device 820, the graphics controller 840, and the I / O controller 850) may be included in the same IC chip (e.g., the same semiconductor die) (e.g., formed in the same IC chip or formed on the same IC chip), thereby forming a SoC. Alternatively, two or more components of the system 800 (e.g., the processor 815, the memory device 820, the graphics controller 840, and the I / O controller 850) may be included in the same package (e.g., the same SiP).

[0101] The descriptions of the above devices (e.g., the device 100 including the VR 101 and the system 800) and methods (e.g., the methods 400 and 700) are intended to provide a general understanding of the structures of different embodiments and are not intended to provide a complete description of all elements and features of the devices that may utilize the structures described herein.

[0102] The foregoing reference Figures 1 to 8Any of the components described can be implemented in a variety of ways, including simulation via software. Thus, multiple devices (e.g., device 100 including VR 101 and system 800) can all be characterized herein as "multiple modules" (or "modules"). Such modules can include hardware circuitry, single-processor circuitry, and / or multi-processor circuitry, memory circuitry, software program modules and objects, and / or firmware and combinations thereof, depending on the need and / or the particular implementation of various embodiments. For example, such modules can be included in a system operation simulation package, such as a software electrical signal simulation package, a power usage and range simulation package, a capacitance inductance simulation package, a power / heat dissipation simulation package, a signal transmission-reception simulation package, and / or a combination of software and hardware for operating or simulating the operation of various potential embodiments.

[0103] The above-described devices and methods can include or be included in the following: high-speed computers, communication and signal processing circuitry, single-processor or multi-processor modules, single or multiple embedded processors, multi-core processors, message information switches, and dedicated modules including multi-layer multi-chip modules. Such devices can also be included as sub-components within a variety of other devices (e.g., electronic systems), such as televisions, cellular phones, personal computers (e.g., laptop computers, desktop computers, handheld computers, tablet computers, etc.), workstations, radio devices, video players, audio players (e.g., MP3 (Moving Picture Experts Group, Audio Layer 3) players), vehicles, medical devices (e.g., heart monitors, blood pressure monitors, etc.), set-top boxes, etc.

[0104] In the detailed description and claims, the terms "first," "second," "third," etc. are used only as labels and are not intended to impose numerical requirements on their objects.

[0105] In the detailed description and claims, the term "on" (one "on" another) used with respect to two or more elements (e.g., materials) means at least some contact between the elements (e.g., materials). The term "above" means that the elements (e.g., materials) are in close proximity, but may have one or more additional intermediate elements (e.g., materials) such that contact is possible but not required. Neither "on" nor "above" implies any directionality as used herein, unless so stated.

[0106] In the detailed description and claims, the term "adjacent" generally refers to the position of an object being close to another object (e.g., adjacent, or close in the case of having one or more objects between them) or adjoining another object (e.g., abutting it or touching it (e.g., directly coupled to it)).

[0107] In the detailed description and claims, an item list that includes the term "at least one of" can mean any combination of the listed items. For example, if items A and B are listed, the phrase "at least one of A and B" means only A; only B; or A and B. In another example, if items A, B, and C are listed, the phrase "at least one of A, B, and C" means only A; only B; only C; A and B (excluding C); A and C (excluding B); B and C (excluding A); or all of A, B, and C. Item A can include a single element or multiple elements. Item B can include a single element or multiple elements. Item C can include a single element or multiple elements.

[0108] In the detailed description and claims, an item list that includes the term "one of" can mean only one of the listed items. For example, if items A and B are listed, the phrase "one of A and B" means only A (excluding B) or only B (excluding A). In another example, if items A, B, and C are listed, the phrase "one of A, B, and C" means only A; only B; or only C. Item A can include a single element or multiple elements. Item B can include a single element or multiple elements. Item C can include a single element or multiple elements.

[0109] Embodiments of the described subject matter can include one or more features, either alone or in combination, as shown by way of example below.

[0110] Example 1 is an apparatus that includes: a voltage regulator; a register circuit for storing information associated with a relationship between an ambient temperature range and a phase crossover of a phase efficiency curve, the phase efficiency curve being associated with the voltage regulator; and a control circuitry for calculating a target phase crossover value based on the information and the ambient temperature at the voltage regulator.

[0111] In Example 2, the subject matter of Example 1 includes the following subject matter, where the control circuitry is configured to adjust the target phase crossover value in response to a change in the value of the ambient temperature at the voltage regulator.

[0112] In Example 3, the subject matter of any one of Examples 1 - 2 includes the following subject matter, where the control circuitry is configured to set a phase count for a phase operation of the voltage regulator based on the target phase crossover value and the output current of the voltage regulator.

[0113] In Example 4, the subject matter of any one of Examples 1 - 3 includes the following subject matter, where the control circuitry is configured to activate one of a single phase circuit and a multiple phase circuit of the voltage regulator based on the phase count during the phase operation of the voltage regulator.

[0114] In Example 5, the subject matter of any one of Examples 1-4 includes the following subject matter, where the information includes at least one slope value of at least one line representing the relationship between the ambient temperature and the phase crossover of the phase efficiency curve, and at least one y-intercept value of the at least one line.

[0115] In Example 6, the subject matter of any one of Examples 1-5 includes the following subject matter, where the device includes a system-on-chip (SoC), the SoC includes an integrated circuit (IC) die, and at least a portion of the voltage regulator is included in the IC die.

[0116] In Example 7, the subject matter of any one of Examples 1-6 includes the following subject matter, where the device includes a circuit board, and at least a portion of the voltage regulator is located on the circuit board.

[0117] In Example 8, the subject matter of any one of Examples 1-7 includes the following subject matter, where the control circuitry is configured to periodically adjust a target phase crossover value during operation of the voltage regulator.

[0118] In Example 9, the subject matter of any one of Examples 1-7 includes the following subject matter, where the control circuitry is configured to adjust a target phase crossover value aperiodically during operation of the voltage regulator.

[0119] In Example 10, the subject matter of any one of Examples 1-3 and 5-9 includes the following subject matter, where the control circuitry is configured to activate a single phase among the phases of the voltage regulator based on a phase count during phase operation.

[0120] In Example 11, the subject matter of any one of Examples 1-3 and 5-9 includes the following subject matter, where the control circuitry is configured to sequentially activate two phases among the phases of the voltage regulator based on a phase count during phase operation.

[0121] In Example 12, the subject matter of any one of Examples 1-3 and 5-9 includes the following subject matter, where the control circuitry is configured to sequentially activate three phases among the phases of the voltage regulator based on a phase count during phase operation.

[0122] In Example 13, the subject matter of any one of Examples 1-4 and 6-12 includes the following subject matter, where the information includes the slope value of a first line representing the relationship between the ambient temperature and the phase crossover of the efficiency curves of the first and second phases among the phases of the voltage regulator, the y-intercept value of the first line, the slope value of a second line representing the relationship between the ambient temperature and the phase crossover of the efficiency curves of the second and third phases among the phases of the voltage regulator, and the y-intercept value of the second line.

[0123] Example 14 is an apparatus that includes: a voltage regulator; an interface for receiving information associated with a relationship between an ambient temperature range and a phase crossover of a phase efficiency curve, the phase efficiency curve being associated with the voltage regulator; and a control circuitry for calculating a target phase crossover value based on the information and an ambient temperature at the voltage regulator, and setting a phase count for a phase operation of the voltage regulator based on an output current of the voltage regulator and the target phase crossover value.

[0124] In Example 15, the subject matter of Example 14 includes the following subject matter, where the control circuitry is for setting the phase count to one of a first phase count associated with a single-phase operation of the voltage regulator and a second phase count associated with a multi-phase operation of the voltage regulator.

[0125] In Example 16, the subject matter of Example 14 includes the following subject matter, where the control circuitry is for setting the phase count to a phase count associated with a single-phase operation of the voltage regulator when a value of the output current is less than the target phase crossover value.

[0126] In Example 17, the subject matter of Example 14 includes the following subject matter, where the control circuitry is for setting the phase count to a phase count associated with a multi-phase operation of the voltage regulator when the value of the current is not less than the target phase crossover value.

[0127] In Example 18, the subject matter of any one of Examples 14 - 17 includes the following subject matter, where the target phase crossover value is a first target phase crossover value, and the control circuitry is for calculating a second target phase crossover value based on the information and the ambient temperature during an operation of the voltage regulator, and setting a phase count for a phase operation of the voltage regulator based on an output current of the voltage regulator, the first target phase crossover value, and the second target phase crossover value.

[0128] In Example 19, the subject matter of any one of Examples 14 to 18 includes the following subject matter, where the apparatus includes a system-in-package (SiP) that includes an integrated circuit (IC) die, and the voltage regulator is included in the SiP.

[0129] In Example 20, the subject matter of any one of Examples 14 to 19 includes a connector and an integrated circuit (IC) die coupled to the connector, the IC die including a voltage regulator, where the connector complies with at least one of a Universal Serial Bus (USB), a High-Definition Multimedia Interface (HDMI), a Thunderbolt interface, a Peripheral Component Interconnect Express (PCIe), and an Ethernet specification.

[0130] In Example 21, the subject matter of any one of Examples 14 to 20 includes a register circuit for storing the information.

[0131] In Example 22, the subject matter of any one of Examples 14 to 20 includes a non-volatile memory circuit for storing the information.

[0132] In Example 23, the subject matter of Example 14 includes the following subject matter, where the phase count includes one of a first phase count associated with single-phase operation of the voltage regulator and a second phase count associated with multi-phase operation of the voltage regulator.

[0133] In Example 24, the subject matter of any one of Examples 14 to 23 includes a thermal sensor for sensing the ambient temperature during operation and providing information corresponding to the value of the ambient temperature during operation of the voltage regulator.

[0134] In Example 25, the subject matter of any one of Examples 14 to 24 includes a current sensor for sensing the output current during operation of the voltage regulator and providing information corresponding to the value of the output current.

[0135] In Example 26, the subject matter of any one of Examples 14 to 25 includes the following subject matter: where the control circuitry is configured to compare the value of the output current with the value of a target phase crossover value to provide a comparison result, and to set the phase count based on the comparison result.

[0136] In Example 27, the subject matter of any one of Examples 14 to 26 includes the following subject matter, where the information includes the value of the slope of a line representing the relationship between the ambient temperature range and the phase crossover, and the value of the y-intercept of the line.

[0137] In Example 28, the subject matter of any one of Examples 14 to 26 includes the following subject matter, where the information includes the value of the slope of a first line representing the relationship between the ambient temperature and the phase crossover of the efficiency curves of the first and second phases in the phases of the voltage regulator, the value of the y-intercept of the first line, the value of the slope of a second line representing the relationship between the ambient temperature and the phase crossover of the efficiency curves of the second and third phases in the phases of the voltage regulator, and the value of the y-intercept of the second line.

[0138] Example 29 is a method that includes: receiving information associated with the relationship between an ambient temperature range and a phase crossover of a phase efficiency curve associated with a voltage regulator; and setting a phase count for operation of the voltage regulator based on the information, the ambient temperature at the voltage regulator, and the output current of the voltage regulator.

[0139] In Example 30, the subject matter of Example 29 includes the following subject matter, where setting the phase count includes: calculating a target phase crossover value based on the information and the ambient temperature at the voltage regulator; and setting a phase count for one of single-phase operation and multi-phase operation of the voltage regulator based on the target phase crossover value and the value of the output current of the voltage regulator.

[0140] In Example 31, the subject matter of any one of Examples 29 to 30 includes the following subject matter, where the setting includes setting a phase count associated with single-phase operation of the voltage regulator based on the value of the output current being less than the target phase crossover value.

[0141] In Example 32, the subject matter of any one of Examples 29 to 31 includes the following subject matter, where the setting includes setting a phase count associated with multi-phase operation of the voltage regulator based on the value of the output current being not less than the target phase crossover value.

[0142] In Example 33, the subject matter of Example 29 includes the following subject matter, where setting the phase count includes: calculating a first target phase crossover value based on the values of a first component and a second component of the information and the ambient temperature at the voltage regulator; calculating a second target phase crossover value based on the values of a third component and a fourth component of the information and the ambient temperature at the voltage regulator; setting the phase count to a first value based on the value of the output current being less than the first target phase crossover value; setting the phase count to a second value based on the value of the output current being not less than the first target phase crossover value and less than the second target phase crossover value; and setting the phase count to a third value based on the value of the output current being not less than the second target phase crossover value.

[0143] In Example 34, the subject matter of any one of Examples 29 to 33 includes: creating a graph based on the relationship between the ambient temperature range and the phase crossover of the efficiency curve of the phase of the voltage regulator; calculating a value of the slope of a line on the graph, where the line represents the relationship between the ambient temperature range and the phase crossover of the efficiency curve of the phase of the voltage regulator; and calculating a value of the y-intercept of the line, where the value of the slope and the value of the y-intercept of the line are part of the information.

[0144] In Example 35, the subject matter of any one of Examples 29 to 34 includes adjusting the target phase crossover value during operation of the voltage regulator.

[0145] In Example 36, the subject matter of any one of Examples 29 to 35 includes periodically adjusting the target phase crossover value during operation of the voltage regulator.

[0146] In Example 37, the subject matter of any one of Examples 29 to 36 includes sensing the ambient temperature at a voltage regulator after receiving the information to provide information corresponding to the value of the ambient temperature at the voltage regulator.

[0147] In Example 38, the subject matter of any one of Examples 29 to 37 includes sensing an output current after receiving the information to provide information corresponding to the value of the output current.

[0148] Example 39 is at least one machine-readable medium including instructions that, when executed by a processing circuitry, cause the processing circuitry to perform operations to implement any one of Examples 1 - 38.

[0149] Example 40 is an apparatus including units for implementing any one of Examples 1 - 38.

[0150] Example 41 is a system for implementing any one of Examples 1 - 38.

[0151] Example 42 is a method for implementing any one of Examples 1 - 38.

[0152] The foregoing description and drawings illustrate some embodiments of the subject matter of the present invention to enable those skilled in the art to implement embodiments of the subject matter of the present invention. Other embodiments may incorporate structural, logical, electrical, process, and other changes. The examples represent possible variations. Parts and features of some embodiments may be included in or substituted for parts and features of other embodiments. Many other embodiments will be apparent to those skilled in the art after reading and understanding the foregoing description.

[0153] A summary is provided to allow the reader to determine the nature and gist of the technical disclosure. It should be understood that the summary will not be used to limit or interpret the scope or meaning of the claims. The appended claims are hereby incorporated into the detailed description, where each claim independently serves as a separate embodiment.

Claims

1. A device comprising: Voltage regulator; a register circuit for storing information associated with a relationship between an ambient temperature range and a phase crossing of a phase efficiency curve associated with the voltage regulator; as well as Control circuitry is configured to calculate a target phase crossing value based on the information and an ambient temperature at the voltage regulator.

2. The device according to claim 1, wherein: The control circuitry is for adjusting the target phase crossing value in response to a change in a value of the ambient temperature at the voltage regulator.

3. The device according to claim 1, wherein: The control circuitry is for setting a phase count for phase operation of the voltage regulator based on the target phase crossing value and an output current of the voltage regulator.

4. The device according to claim 3, wherein: The control circuitry is for activating a single phase circuit or one of a plurality of phase circuits of the voltage regulator based on the phase count during phase operation of the voltage regulator.

5. The device according to claim 1, wherein: The information includes: a value of at least one slope of at least one line representing a relationship between ambient temperature and said phase crossing of said phase efficiency curve; and The value of at least one y-intercept of the at least one line.

6. The device according to claim 1, wherein: The apparatus comprises a system on a chip (SoC) comprising an integrated circuit (IC) die, and wherein at least a portion of the voltage regulator is included in the IC die.

7. The device according to claim 1, wherein: The apparatus includes a circuit board, and at least a portion of the voltage regulator is located on the circuit board.

8. An apparatus comprising: Voltage regulator; an interface for receiving information associated with a relationship between an ambient temperature range and a phase crossing of a phase efficiency curve associated with the voltage regulator; as well as Control circuit system for: calculating a target phase crossing value based on the information and an ambient temperature at the voltage regulator; as well as A phase count for phase operation of the voltage regulator is set based on an output current of the voltage regulator and the target phase crossing value.

9. The device according to claim 8, wherein: The control circuitry is for setting the phase count to one of a first phase count associated with single-phase operation of the voltage regulator and a second phase count associated with multi-phase operation of the voltage regulator.

10. The device according to claim 8, wherein: The control circuitry is for setting the phase count to a phase count associated with single-phase operation of the voltage regulator if a value of the output current is less than the target phase crossing value.

11. The device according to claim 8, wherein: The control circuitry is for setting the phase count to a phase count associated with multi-phase operation of the voltage regulator if a value of the current is not less than the target phase crossing value.

12. The device according to claim 8, wherein: The target phase crossing value is a first target phase crossing value, and the control circuitry is to: calculating a second target phase crossing value based on the information and the ambient temperature during operation of the voltage regulator; as well as The phase count for the phase operation of the voltage regulator is set based on the output current of the voltage regulator, the first target phase crossing value, and the second target phase crossing value.

13. The device according to claim 8, wherein: The apparatus includes a system-in-package (SiP) including an integrated circuit (IC) die, wherein the voltage regulator is included in the SiP.

14. The apparatus of claim 8, further comprising a connector and an integrated circuit (IC) die coupled to the connector, the IC die comprising the voltage regulator, wherein The connector complies with at least one of Universal Serial Bus (USB), High-Definition Multimedia Interface (HDMI), Thunderbolt interface, Peripheral Component Interconnect Express (PCIe), and Ethernet specifications.

15. A method comprising: receiving information associated with a relationship between an ambient temperature range and a phase crossing of a phase efficiency curve associated with the voltage regulator; as well as A phase count for operation of the voltage regulator is set based on the information, an ambient temperature at the voltage regulator, and an output current of the voltage regulator.

16. The method according to claim 15, wherein: Setting the phase count includes: calculating a target phase crossing value based on the information and the ambient temperature at the voltage regulator; and A phase count for one of a single-phase operation and a multi-phase operation of the voltage regulator is set based on the target phase crossing value and a value of the output current of the voltage regulator.

17. The method according to claim 16, wherein: The setting includes setting a phase count associated with single-phase operation of the voltage regulator based on the value of the output current being less than the target phase crossing value.

18. The method according to claim 16, wherein: The setting includes setting a phase count associated with multi-phase operation of the voltage regulator based on the value of the output current being not less than the target phase crossing value.

19. The method according to claim 15, wherein: Setting the phase count includes: calculating a first target phase crossing value based on a value of the first component and a value of the second component of the information and the ambient temperature at the voltage regulator; calculating a second target phase crossing value based on a value of a third component and a value of a fourth component of the information and the ambient temperature at the voltage regulator; setting the phase count to a first value based on the value of the output current being less than the first target phase crossing value; setting the phase count to a second value based on the value of the output current being not less than the first target phase crossing value and being less than the second target phase crossing value; and Based on the value of the output current being not less than the second target phase crossing value, the phase count is set to a third value.

20. The method of claim 15, further comprising: creating a graph based on a relationship between the ambient temperature range and the phase intersections of the efficiency curves of the phases of the voltage regulator; calculating a value of a slope of a line on the graph, wherein the line represents the relationship between the ambient temperature range and the phase intersection of the efficiency curve of the phase of the voltage regulator; and A value of a y-intercept of the line is calculated, wherein the value of the slope of the line and the value of the y-intercept are part of the information.

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