Magnetic core bonding device

Abstract

The present invention relates to a magnetic core bonding process and a device thereof. The magnetic core bonding process comprises S1, fixing a first carrier on a first movable component; placing a second carrier horizontally on the second movable component with a first bonding surface facing upward; placing a plurality of magnetic cores on a third movable component; S2, horizontally moving the second movable component, moving a glue-applying component, and applying a first glue on the first bonding surface; S3, moving the first movable component and the first carrier from top to bottom, and bonding the first carrier to the first glue; S4, moving the first movable component, the first carrier, and the second carrier from bottom to top, with the second bonding surface facing downward, moving the glue-applying component, and applying a second glue on the second bonding surface, wherein the temperature at which the first glue loses its viscosity is lower than the temperature at which the second glue loses its viscosity; S5, horizontally moving the third movable component so that the magnetic core is located below the second carrier, and moving the first movable component, the first carrier, and the second carrier from top to bottom, and bonding the second glue to the magnetic core to avoid damage to the magnetic core caused by detachment.

Description

Technical Field

[0001] The present invention relates to the field of magnetic core equipment, in particular to a magnetic core bonding device. Background Art

[0002] During the manufacturing process of magnetic cores, after forming, they need to be bonded to a bonding plate before silver dipping. In existing processes, the core bonding plate is typically provided with a placement groove filled with adhesive, and the core is directly bonded into the placement groove. This can damage the core when it is directly removed from the bonding plate after silver dipping, and the core becomes disorganized, hindering subsequent processing. Summary of the Invention

[0003] The object of the present invention is to provide a magnetic core bonding process, which has the characteristics of preventing the magnetic core from being damaged and having good applicability.

[0004] To achieve the above object, the present invention adopts the following technical solutions:

[0005] A magnetic core bonding process includes: S1, fixing a first carrier to a first movable component; placing a second carrier horizontally on a second movable component with a first bonding surface of the second carrier facing upward; placing a plurality of magnetic cores on a third movable component;

[0006] S2, horizontally moving the second moving component so that the second carrier is located below the first carrier, and moving the glue applying component to apply the first glue on the first adhesive surface;

[0007] S3, moving the first moving component and the first carrier from top to bottom, and bonding the first carrier and the first adhesive;

[0008] S4, moving the first moving component, the first carrier, and the second carrier from bottom to top, with the second adhesive surface of the second carrier facing downward, moving the glue applying component, and applying a second adhesive on the second adhesive surface, wherein the temperature at which the first adhesive loses its adhesiveness is lower than the temperature at which the second adhesive loses its adhesiveness;

[0009] S5, horizontally moving the third movable component so that the magnetic core is located under the second carrier, moving the first movable component, the first carrier and the second carrier from top to bottom, and bonding the second adhesive to the magnetic core.

[0010] Preferably, in step S2, the gluing assembly moves at a constant speed; and in step S4, the gluing assembly moves at a variable speed.

[0011] Preferably, in step S4, when the gluing component is located at the lower side of the limiting groove of the second bonding surface, the moving speed of the gluing component is reduced by 40%-60%.

[0012] Preferably, in step S5, the magnetic core is an H-shaped magnetic core, and part of the magnetic core is inserted into the limiting groove of the second bonding surface.

[0013] Preferably, the first viscose and the second viscose are pyrolytic viscose, the first viscose loses viscosity at a temperature greater than 100°C, and the second viscose loses viscosity at a temperature greater than 600°C; the first carrier is a glass fiber board, and the second carrier is a glass fiber cloth.

[0014] A magnetic core bonding device for bonding a magnetic core, wherein the magnetic core has a silver-wetting groove, comprising:

[0015] Workbench;

[0016] A first moving assembly is fixed with a first carrier;

[0017] a second moving assembly, on which a second carrier is placed;

[0018] A glue coating assembly is movably arranged on the workbench and located between the first movable assembly and the second movable assembly. The glue coating assembly includes a glue coating cylinder, and the glue coating cylinder has a first accommodating chamber and a second accommodating chamber separated from each other. The first accommodating chamber is located below the second accommodating chamber. The first accommodating chamber is used to place a first adhesive, and the second accommodating chamber is used to place a second adhesive. The glue coating cylinder is further provided with a first channel and a second channel. The inlet of the first channel is connected to the first accommodating chamber, and the outlet of the first channel is arranged toward the second carrier. In the vertical direction, the inlet of the first channel can be higher than the liquid level of the first adhesive. The inlet of the second channel is connected to the second accommodating chamber, and the outlet of the second channel is arranged toward the first carrier.

[0019] The third movable assembly is located at the lower side of the second movable assembly. The third movable assembly has a plurality of spaced limiting convex strips, and the limiting convex strips are clamped in the silver dipping groove.

[0020] Preferably, along the length direction of the glue coating cylinder, the length of the first channel inlet is smaller than the length of the first channel outlet, and the length of the second channel inlet is smaller than the length of the second channel outlet.

[0021] Preferably, the glue coating assembly further comprises a first power member and a first extrusion plate located in the first accommodating chamber, wherein the first power member drives the first extrusion plate to move along the length direction of the glue coating cylinder, and the first extrusion plate pushes the first adhesive into the entrance of the first channel;

[0022] The glue coating assembly also includes a second power member and a second extrusion plate located in the second accommodating chamber. The second power member drives the second extrusion plate to move along the length direction of the glue coating cylinder, and the second extrusion plate pushes the second adhesive into the entrance of the second channel.

[0023] Preferably, the second carrier has a first bonding surface and a second bonding surface, the first bonding surface is bonded to the first carrier through the first adhesive; the second bonding surface has a plurality of spaced-apart limiting grooves, part of the magnetic core is inserted into the limiting grooves, and the limiting grooves limit the movement of the magnetic core.

[0024] Preferably, a scraper is further provided on the outer side of the glue coating cylinder. Along the moving direction of the glue coating assembly, the scraper is located at the rear side of the second channel outlet. The scraper contacts the second adhesive to control the thickness of the second adhesive.

[0025] Compared with the prior art, the present invention has the following beneficial effects:

[0026] The above technical solution provides a magnetic core bonding process, which first applies a first adhesive to the first bonding surface of the second carrier and bonds the second carrier to the first carrier, then applies a second adhesive to the second bonding surface of the second carrier and bonds the magnetic core to the second carrier. Since the temperature at which the first adhesive loses its adhesiveness is lower than the temperature at which the second adhesive loses its adhesiveness, in the subsequent silver dipping and sintering process, the first carrier and the second carrier can be separated first by increasing the temperature. At this time, the magnetic core is still located on the second carrier, thereby avoiding damage to the magnetic core caused by direct separation, and the magnetic core can also be kept neat, which is beneficial to subsequent process processing. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 A schematic diagram of a magnetic core bonding device provided in an embodiment of the present invention;

[0028] Figure 2 A schematic diagram of a glue coating cylinder provided in an embodiment of the present invention;

[0029] Figure 3 A schematic cross-sectional view of a glue coating cylinder provided in an embodiment of the present invention;

[0030] Figure 4 A schematic diagram of a gluing assembly provided in an embodiment of the present invention;

[0031] Figure 5 A schematic diagram of a second carrier provided in an embodiment of the present invention;

[0032] Figure 6 A schematic diagram of a second carrier provided by an embodiment of the present invention from another perspective;

[0033] Figure 7 A schematic diagram of a magnetic core provided in an embodiment of the present invention.

[0034] 1. Magnetic core; 11. Silver dipping groove; 2. Workbench; 3. First moving component; 4. First carrier; 5. Second moving component; 6. Second carrier; 61. First bonding surface; 62. Second bonding surface; 63. Limiting groove; 7. Glue coating component; 71. Glue coating cylinder; 711. First accommodating chamber; 712. Second accommodating chamber; 713. First channel; 714. Second channel; 72. First power member; 73. First extrusion plate; 74. Second power member; 75. Second extrusion plate; 76. Scraper; 8. Third moving component; 81. Limiting ridge. DETAILED DESCRIPTION

[0035] The present invention will be described in more detail below with reference to the accompanying drawings. It should be noted that the description of the present invention with reference to the accompanying drawings is merely illustrative and non-limiting. Various embodiments can be combined with each other to form other embodiments not shown in the following description.

[0036] See also Figures 1 to 7 , the present invention provides a magnetic core bonding process, comprising:

[0037] S1, fix the first carrier 4 to the first moving component 3; place the second carrier 6 horizontally on the second moving component 5, with the first adhesive surface 61 of the second carrier 6 facing upward; place multiple magnetic cores 1 on the third moving component 8;

[0038] S2, horizontally move the second moving component 5 so that the second carrier 6 is located below the first carrier 4, and move the glue applying component 7 to apply the first glue on the first adhesive surface 61;

[0039] S3, moving the first moving component 3 and the first carrier 4 from top to bottom, and bonding the first carrier 4 to the first adhesive;

[0040] S4, moving the first moving component 3, the first carrier 4, and the second carrier 6 from bottom to top, with the second adhesive surface 62 of the second carrier 6 facing downward, moving the glue applying component 7, and applying the second adhesive on the second adhesive surface 62, wherein the temperature at which the first adhesive loses its adhesiveness is lower than the temperature at which the second adhesive loses its adhesiveness;

[0041] S5 , horizontally move the third moving component 8 so that the magnetic core 1 is located below the second carrier 6 , move the first moving component 3 , the first carrier 4 and the second carrier 6 from top to bottom, and bond the second adhesive to the magnetic core 1 .

[0042] In the above-mentioned magnetic core bonding process, the first adhesive is first applied to the first bonding surface 61 of the second carrier 6, and the second carrier 6 is bonded to the first carrier 4. Then, the second adhesive is applied to the second bonding surface 62 of the second carrier 6, and the magnetic core 1 is bonded to the second carrier 6. Since the temperature at which the first adhesive loses its adhesiveness is lower than the temperature at which the second adhesive loses its adhesiveness, in the subsequent silver dipping and sintering process, the first carrier 4 and the second carrier 6 can be separated first by increasing the temperature. At this time, the magnetic core 1 is still located on the second carrier 6, thereby avoiding damage to the magnetic core 1 caused by direct separation, and the magnetic core 1 can also remain neat, which is beneficial to subsequent process processing.

[0043] In step S2, the glue-applying assembly 7 moves at a constant speed. It is conceivable that the bonding surfaces of the first carrier 4 and the second carrier 6 are both planar, so the constant speed movement of the glue-applying assembly 7 can apply the first glue of uniform thickness on the first bonding surface 61 of the second carrier 6, thereby improving the uniformity of the bonding between the first carrier 4 and the second carrier 6.

[0044] In step S4, the gluing assembly 7 moves at a variable speed. In step S4, when the gluing assembly 7 is located below the retaining groove 63 of the second adhesive surface 62, the gluing assembly 7's movement speed is reduced by 40%-60%. It is conceivable that, because the second adhesive surface 62 has the retaining groove 63, the gluing assembly 7 needs to move at a variable speed in order to apply the second adhesive within the retaining groove 63.

[0045] In step S5, the magnetic core 1 is an H-shaped magnetic core, and a portion of the magnetic core 1 is inserted into the limiting groove 63 of the second bonding surface 62. It is conceivable that when the second adhesive solidifies, its volume and other factors will change. To prevent the magnetic core 1 from shifting due to the volume change of the second adhesive, a portion of the magnetic core 1 is inserted into the limiting groove 63. The inner wall surface of the limiting groove 63 can limit the movement of the magnetic core 1, thereby enhancing the bonding stability of the magnetic core 1.

[0046] The first viscose and the second viscose are pyrolytic viscose. The first viscose loses its viscosity at a temperature greater than 100° C., and the second viscose loses its viscosity at a temperature greater than 600° C. The first carrier 4 is a glass fiber board, and the second carrier 6 is a glass fiber cloth.

[0047] See also Figures 1 to 7 The present invention also provides a magnetic core bonding device, including a workbench 2, a first moving component 3, a first carrier 4, a second moving component 5, a second carrier 6, a glue coating component 7, and a third moving component 8.

[0048] The first movable assembly 3 is fixed with the first carrier 4; the second movable assembly 5 is placed with the second carrier 6; the glue coating assembly 7 is movably arranged on the workbench 2 and is located between the first movable assembly 3 and the second movable assembly 5. The glue coating assembly 7 includes a glue coating cylinder 71, and the glue coating cylinder 71 has a first accommodating chamber 711 and a second accommodating chamber 712 separated from each other. The first accommodating chamber 711 is located below the second accommodating chamber 712. The first accommodating chamber 711 is placed in the first accommodating chamber 711, and the second accommodating chamber 712 is placed in the second accommodating chamber 712. The glue coating cylinder 71 is also provided with a first channel 713 and the second channel 714, the inlet of the first channel 713 is connected to the first accommodating chamber 711, the outlet of the first channel 713 is set toward the second carrier 6, and along the vertical direction, the inlet of the first channel 713 can be higher than the liquid level of the first viscose; the inlet of the second channel 714 is connected to the second accommodating chamber 712, and the outlet of the second channel 714 is set toward the first carrier 4; the third movable component 8 is located on the lower side of the second movable component 5, and the third movable component 8 has a plurality of spaced limiting ridges 81, which are clamped in the silver dipping groove 11.

[0049] In the above-mentioned magnetic core bonding device, the first movable component 3 can move the first carrier 4 in the vertical direction, and the second movable component 5 can drive the second carrier 6 to move in the horizontal direction, and the second carrier 6 and the second movable component 5 are not fixed. The glue coating component 7 can move in the horizontal direction to apply glue to the second carrier 6. Specifically, the glue coating cylinder 71 includes a first accommodating chamber 711 and a second accommodating chamber 712 separated from each other. The first adhesive can be placed in the first accommodating chamber 711, and the second adhesive can be placed in the second accommodating chamber 712. The first adhesive can be moved from the first accommodating chamber 711 to the second carrier 6 through the first channel 713, and the second adhesive can be moved to the second carrier 6 through the second channel 714. Therefore, two different adhesives can be applied to the second carrier 6 through a single glue coating component 7, which greatly simplifies the complexity of the device.

[0050] It is very important that when the first adhesive needs to be applied to the first bonding surface 61 of the second carrier 6, the second carrier 6 is located on the lower side of the glue coating component 7. In order to prevent the first glue from dripping directly due to the influence of gravity, the entrance of the first channel 713 is set on the side wall of the first accommodating cavity 711, and along the vertical direction, the height of the first channel 713 can be higher than the liquid level of the first glue.

[0051] The glue coating assembly 7 further includes a first power member 72 and a first extrusion plate 73 located in the first accommodating chamber 711. The first power member 72 drives the first extrusion plate 73 to move along the length direction of the glue coating cylinder 71. The first extrusion plate 73 pushes the first adhesive into the entrance of the first channel 713.

[0052] The glue coating assembly 7 also includes a second power member 74 and a second extrusion plate 75 located in the second accommodating chamber 712. The second power member 74 drives the second extrusion plate 75 to move along the length direction of the glue coating cylinder 71, and the second extrusion plate 75 pushes the second adhesive into the entrance of the second channel 714.

[0053] It is conceivable that the first power member 72 and the second power member 74 can be an air cylinder, an oil cylinder, etc., which can drive the first extrusion plate 73 and the second extrusion plate 75 to move along the length direction of the glue coating cylinder 71. Taking the first power member 72 and the first extrusion plate 73 as an example, the first power member 72 and the first extrusion plate 73 are located on one side of the length direction of the first accommodating chamber 711, and the first adhesive is located in the middle part of the first accommodating chamber 711. When the first power member 72 drives the first extrusion plate 73 to move, the first extrusion plate 73 will squeeze the first adhesive, thereby causing the liquid level of the first adhesive to rise. When the liquid level of the first adhesive is higher than the inlet height of the first channel 713, the first adhesive will enter the first channel 713, thereby moving along the first channel 713 and finally being coated on the second carrier 6.

[0054] In addition, since the second carrier 6 is located at the lower side of the glue coating component 7 at this time, the outlet of the first channel 713 can be located on the lower side of the glue coating cylinder 71.

[0055] The working principles of the second power member 74 and the second extrusion plate 75 are the same as those described above and will not be further described here. It should be noted that when applying the second adhesive to the second adhesive surface 62 of the second carrier 6, the second carrier 6 is located on the upper side of the adhesive coating assembly 7. Therefore, the inlet of the second channel 714 can be directly positioned on the inner wall surface of the upper wall of the adhesive coating cylinder 71, and the outlet of the second channel 714 can be positioned on the outer wall surface of the upper wall of the adhesive coating cylinder 71.

[0056] Alternatively, two first power members 72 and two first extrusion plates 73 may be provided, each extruding the first adhesive from both sides toward the center, and in this case, the entrance of the first channel 713 may be located in the center of the adhesive coating cylinder 71. Two second power members 74 and two second extrusion plates 75 may also be provided, each extruding the second adhesive from both sides toward the center, and in this case, the entrance of the second channel 714 may be located in the center of the adhesive coating cylinder 71.

[0057] Along the length direction of the glue coating cylinder 71 , the length of the inlet of the first channel 713 is shorter than the length of the outlet of the first channel 713 , and the length of the inlet of the second channel 714 is shorter than the length of the outlet of the second channel 714 .

[0058] It is very important to take the first channel 713 as an example. If the entrance of the first channel 713 is too long, then during the gluing process, due to the continuous movement of the first extrusion plate 73, part of the entrance of the first channel 713 may be located on the rear side of the first extrusion plate 73. At this time, due to the squeezing of the first adhesive by the first extrusion plate 73, the first adhesive may overflow from the entrance of the first channel 713 located on the rear side of the first extrusion plate 73, thereby affecting the normal operation of the first power member 72. To avoid this situation, the present invention shortens the length of the entrance of the first channel 713 and can control the movement distance of the first extrusion plate 73 by providing a control panel. For example, when the first extrusion plate 73 moves a certain distance and approaches the entrance of the first channel 713, the control panel controls the first extrusion plate 73 to stop moving and can issue a warning to notify the staff to add the first adhesive. At the same time, the control panel can also control the first extrusion plate 73 to move back, making it easier for the staff to add the first adhesive.

[0059] The working principle of the second channel 714 is the same as above and will not be repeated here.

[0060] The second carrier 6 has a first bonding surface 61 and a second bonding surface 62. The first bonding surface 61 is bonded to the first carrier 4 through a first adhesive. The second bonding surface 62 has a plurality of spaced limiting grooves 63. Part of the magnetic core 1 is inserted into the limiting grooves 63. The limiting grooves 63 limit the movement of the magnetic core 1.

[0061] Specifically, the limiting grooves 63 are provided in a plurality and spaced apart. The magnetic core 1 of the present invention is an H-shaped magnetic core, and the two protruding edges of the magnetic core 1 can be inserted into the limiting grooves 63, so that during the bonding process, the limiting grooves 63 can prevent the magnetic core 1 from being offset.

[0062] Furthermore, the magnetic core 1 of the present invention has silver-coating grooves 11 during molding. During the subsequent silver-coating process, a silver layer can form within the silver-coating grooves 11. The present invention utilizes the silver-coating grooves 11 of the magnetic core 1 by providing a limiting ridge 81 on the third movable component 8. The limiting ridge 81 can be locked within the silver-coating grooves 11, thereby further restricting the movement of the magnetic core 1.

[0063] As can be seen from the above, the present invention utilizes the characteristic of the magnetic core 1 having the silver dipping groove 11. The movement of the magnetic core 1 is first limited by the limiting ridge 81, and then the movement of the magnetic core 1 after bonding is limited by the limiting groove 63, thereby ensuring that the magnetic core 1 is precisely positioned before and after bonding. In this way, in the silver dipping process, the precisely positioned magnetic core 1 contacts the silver paste, so that a silver layer with precise dimensions can be formed in the silver dipping groove 11.

[0064] A scraper 76 is also provided on the outer side of the glue coating cylinder 71. Scraper 76 is located behind the outlet of the second channel 714 along the direction of movement of the glue coating assembly 7. Scraper 76 contacts the second adhesive to control the thickness of the second adhesive. It is conceivable that when the second adhesive is applied to the second adhesive surface 62, the second carrier 6 is located above the adhesive coating assembly 7. Furthermore, since the second adhesive surface 62 also has a limiting groove 63, the present invention uses scraper 76 to control the thickness of the second adhesive to prevent uneven thickness of the second adhesive and to prevent a lack of second adhesive in the limiting groove 63.

[0065] In addition, one end of the glue coating cylinder 71 along its length may be open to facilitate installation of the first power member 72, the second power member 74, the first extrusion plate 73, and the second extrusion plate 75. A cover plate may also be provided to seal the opening. The glue coating cylinder 71 may also be provided with two glue filling ports for adding the first adhesive to the first accommodating chamber 711 and the second accommodating chamber 712, respectively.

[0066] The above embodiments are only preferred embodiments of the present invention and cannot be used to limit the scope of protection of the present invention. Any non-substantial changes and replacements made by technicians in this field on the basis of the present invention fall within the scope of protection required by the present invention.

Claims

1. A magnetic core bonding device for bonding a magnetic core (1), wherein the magnetic core (1) has a silver dipping groove (11), characterized in that: include: Workbench (2); A first moving component (3) is fixed with a first carrier (4); A second movable assembly (5) is provided with a second carrier (6); A glue coating component (7) is movably arranged on the workbench (2) and is located between the first movable component (3) and the second movable component (5). The glue coating component (7) includes a glue coating cylinder (71). The glue coating cylinder (71) has a first accommodating chamber (711) and a second accommodating chamber (712) separated from each other. The first accommodating chamber (71 1) Located at the lower side of the second accommodating chamber (712), the first accommodating chamber (711) is used to place the first adhesive, and the second accommodating chamber (712) is used to place the second adhesive; the adhesive coating cylinder (71) is further provided with a first channel (713) and a second channel (714), the inlet of the first channel (713) is communicated with the first accommodating chamber (711), the outlet of the first channel (713) is arranged toward the second carrier (6), and in the vertical direction, the inlet of the first channel (713) can be higher than the liquid level of the first adhesive; the inlet of the second channel (714) is communicated with the second accommodating chamber (712), and the outlet of the second channel (714) is arranged toward the first carrier (4); The third movable assembly (8) is located at the lower side of the second movable assembly (5), and the third movable assembly (8) has a plurality of spaced limiting ridges (81), and the limiting ridges (81) are locked in the silver dipping groove (11).

2. The magnetic core bonding device according to claim 1, wherein Along the length direction of the glue coating cylinder (71), the length of the inlet of the first channel (713) is shorter than the length of the outlet of the first channel (713), and the length of the inlet of the second channel (714) is shorter than the length of the outlet of the second channel (714).

3. The magnetic core bonding device according to claim 1, wherein: The glue coating assembly (7) further comprises a first power member (72) and a first extrusion plate (73) located in the first accommodating chamber (711); the first power member (72) drives the first extrusion plate (73) to move along the length direction of the glue coating cylinder (71); and the first extrusion plate (73) pushes the first adhesive into the entrance of the first channel (713); The glue coating assembly (7) further comprises a second power member (74) and a second extrusion plate (75) located in the second accommodating chamber (712); the second power member (74) drives the second extrusion plate (75) to move along the length direction of the glue coating cylinder (71); and the second extrusion plate (75) pushes the second adhesive into the entrance of the second channel (714).

4. The magnetic core bonding device according to claim 1, wherein: The second carrier (6) has a first bonding surface (61) and a second bonding surface (62), and the first bonding surface (61) is bonded to the first carrier (4) via the first adhesive; The second bonding surface (62) has a plurality of spaced limiting grooves (63), and a portion of the magnetic core (1) is inserted into the limiting grooves (63). The limiting grooves (63) limit the movement of the magnetic core (1).

5. The magnetic core bonding device according to claim 1, wherein: The outer side surface of the glue coating cylinder (71) is further provided with a scraper (76). Along the moving direction of the glue coating assembly (7), the scraper (76) is located at the rear side of the outlet of the second channel (714). The scraper (76) contacts the second adhesive to control the thickness of the second adhesive.

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