Capacitor

Abstract

A capacitor according to the present disclosure includes: a body including a first internal electrode and a second internal electrode stacked with a dielectric layer therebetween; a first external electrode disposed on an upper surface of the main body and an outer side surface of the main body, and connected to the first internal electrode via the upper surface of the main body and / or the outer side surface of the main body; and a second external electrode disposed on an upper surface of the main body and the outer side surface of the main body, and connected to the second internal electrode via the upper surface of the main body and / or the outer side surface of the main body.

Description

Technical Field

[0001] The present disclosure relates to a capacitor. Background Art

[0002] Electronic components for electronic devices include capacitors, inductors, piezoelectric elements, varistors, or thermistors, etc. Stacked capacitors in ceramic electronic components can be used in various electronic devices due to their small size, high capacitance, and easy installation.

[0003] For example, stacked capacitors can be used in chip capacitors, which are mounted on substrates of various electronic products (such as imaging devices (e.g., liquid crystal displays (LCDs), plasma display panels (PDPs), organic light emitting diodes (OLEDs), etc.), computers, personal portable terminals, smart phones, etc.) to perform a charging or discharging function.

[0004] Recently, with the trend of reducing the size and thinning of electronic products, the demand for capacitors with higher capacitance and smaller equivalent series resistance (ESR) than conventional stacked capacitors is increasing. Summary of the Invention

[0005] According to at least one embodiment of the present disclosure, a capacitor having a small equivalent series resistance (ESR) without capacitance loss can be provided.

[0006] A capacitor according to an aspect of the present disclosure includes: a body including a first inner electrode and a second inner electrode, the first inner electrode and the second inner electrode being stacked with a dielectric layer therebetween; a first outer electrode disposed on an upper surface and an outer side surface of the body and connected to the first inner electrode via the upper surface and / or the outer side surface of the body; and a second outer electrode disposed on the upper surface and the outer side surface of the body and connected to the second inner electrode via the upper surface and / or the outer side surface of the body.

[0007] The capacitor may further include: a first connection via disposed inside the body to connect the first inner electrode and the first outer electrode; and a second connection via disposed inside the body to connect the second inner electrode and the second outer electrode.

[0008] The capacitor may further include a first via separation layer disposed between the first connection via and the second inner electrode.

[0009] The capacitor may further include a second via separation layer disposed between the second connection via and the first inner electrode.

[0010] The first external electrode may be in contact with the first connection via, and the second external electrode may be in contact with the second connection via.

[0011] The capacitor may further include: a first connection layer connecting the first external electrode and the first connection via; and a second connection layer connecting the second external electrode and the second connection via.

[0012] The first connection layer and the second connection layer may be disposed on the uppermost dielectric layer in the dielectric layer.

[0013] The number of the first connection vias including the first connection via may be greater than or equal to the number of the first external electrodes including the first external electrode.

[0014] The number of the second connection vias including the second connection via may be greater than or equal to the number of the second external electrodes including the second external electrode.

[0015] Each of the first external electrode and the second external electrode may be disposed adjacent to a corner where an end of the main body in the length direction and an end of the main body in the width direction intersect with the upper surface.

[0016] Each of the first external electrode and the second external electrode may be provided in two.

[0017] The first external electrode may be connected to a portion of the first internal electrode exposed on the outer surface of the main body, and the second external electrode may be connected to a portion of the second internal electrode exposed on the outer surface of the main body.

[0018] The capacitor may further include: a first electrode separation layer disposed between the first external electrode and the second internal electrode; and a second electrode separation layer disposed between the second external electrode and the first internal electrode.

[0019] A capacitor according to another aspect of the present disclosure includes: a substrate; a main body including a first internal electrode and a second internal electrode and disposed on the substrate, the first internal electrode and the second internal electrode being stacked with a dielectric layer therebetween; a first external electrode disposed on an upper surface and an outer surface of the main body and connected to the first internal electrode; and a second external electrode disposed on the upper surface and the outer surface of the main body and connected to the second internal electrode.

[0020] The first external electrode may be connected to a portion of the first internal electrode exposed on the outer surface of the main body, and the second external electrode may be connected to a portion of the second internal electrode exposed on the outer surface of the main body.

[0021] Each of the first outer electrode and the second outer electrode may be arranged to cover a corner where an end portion of the main body in the length direction and an end portion of the main body in the width direction intersect.

[0022] Each of the first outer electrode and the second outer electrode may be provided in two.

[0023] A capacitor according to another aspect of the present disclosure includes: a substrate; a main body including a first inner electrode and a second inner electrode and disposed on an upper surface of the substrate, the first inner electrode and the second inner electrode being stacked with a dielectric layer interposed therebetween; two first outer electrodes disposed to be spaced apart from each other on the upper surface of the main body and connected to the first inner electrode; and two second outer electrodes disposed to be spaced apart from each other on the upper surface of the main body and connected to the second inner electrode.

[0024] The capacitor may further include: a first connection via disposed inside the main body and connected to the first inner electrode; and a second connection via disposed inside the main body and connected to the second inner electrode.

[0025] A part of the first outer electrode may cover an outer surface of the main body and may be connected to a part of the first inner electrode exposed on the outer surface of the main body, and a part of the second outer electrode may cover the outer surface of the main body and may be connected to a part of the second inner electrode exposed on the outer surface of the main body.

[0026] A capacitor according to another aspect of the present disclosure includes: a main body including a first inner electrode and a second inner electrode, the first inner electrode and the second inner electrode being stacked with a dielectric layer interposed therebetween; a first outer electrode disposed on an upper surface of the main body; a second outer electrode disposed on the upper surface of the main body and separated from the first outer electrode; a first connection via disposed inside the main body to connect the first inner electrode and the first outer electrode; a second connection via disposed inside the main body to connect the second inner electrode and the second outer electrode; a first via separation layer disposed between the first connection via and the second inner electrode; and a second via separation layer disposed between the second connection via and the first inner electrode.

[0027] A capacitor according to another aspect of the present disclosure includes: a body including a first internal electrode and a second internal electrode, the first internal electrode and the second internal electrode being stacked with a dielectric layer therebetween; a first external electrode disposed on an upper surface and an outer side surface of the body and contacting the first internal electrode on the outer side surface; a second external electrode disposed on the upper surface and the outer side surface of the body, separated from the first external electrode and contacting the second internal electrode on the outer side surface; a first electrode separation layer disposed between the first external electrode and the second internal electrode; and a second electrode separation layer disposed between the second external electrode and the first internal electrode.

[0028] According to at least one embodiment among the embodiments, a capacitor having a small equivalent series resistance (ESR) without capacitance loss can be provided. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 is a view showing a capacitor according to an embodiment of the present disclosure.

[0030] Figure 2 is along Figure 1 longitudinal sectional view taken along line A-A′.

[0031] Figure 3 is a view showing a state in which a capacitor according to an embodiment of the present disclosure is mounted on a mounting substrate.

[0032] Figure 4 , Figure 5 , Figure 6 , Figure 7 , Figure 8 , Figure 9 , Figure 10 and Figure 11 is a view showing a method for manufacturing a capacitor according to an embodiment of the present disclosure.

[0033] Figure 12 is a plan view of a capacitor according to a second embodiment.

[0034] Figure 13 is a sectional view of a capacitor according to a third embodiment.

[0035] Figure 14 is a view showing a capacitor according to a fourth embodiment.

[0036] Figure 15 is along Figure 14 sectional view taken along line B-B′.

[0037] Figure 16 , Figure 17 , Figure 18 , Figure 19 andFigure 20 It is a view showing a method for manufacturing a capacitor according to a fourth embodiment in accordance with an embodiment of the present disclosure.

[0038] Figure 21 It is a view showing a capacitor according to a fifth embodiment.

[0039] Figure 22 It is along Figure 21 A cross-sectional view taken along line C-C'.

[0040] Figure 23 It is along Figure 22 A cross-sectional view taken along line D-D'.

[0041] Figure 24 It is a plan view of a capacitor according to a sixth embodiment.

[0042] Figure 25 It is a plan view of a capacitor according to a seventh embodiment.

[0043] <Explanation of Reference Numerals> 10: Substrate 20: Body 30: External electrode 31: First external electrode 32: Second external electrode 200: Internal electrode 201: First internal electrode 202: Second internal electrode 210: Dielectric layer 221: First connection via hole 222: Second connection via hole 231: First via hole separation layer 232: Second via hole separation layer. Detailed Description of the Embodiments

[0044] Hereinafter, the present disclosure will be described more fully with reference to the accompanying drawings, in which embodiments of the present disclosure are shown. As those skilled in the art will recognize, the described embodiments can be modified in various different ways, all of which do not depart from the spirit or scope of the present disclosure.

[0045] To clearly describe the present disclosure, components or parts irrelevant to the description are omitted, and throughout the specification, the same or similar components are denoted by the same reference numerals.

[0046] In addition, in the drawings, for ease of description, the dimensions (e.g., thickness) of each element are arbitrarily shown, and the present disclosure is not limited to the dimensions (e.g., thickness) shown in the drawings. In the drawings, for clarity, the thicknesses of layers, films, panels, regions, zones, etc. are exaggerated. In the drawings, for ease of description, the thicknesses of some layers and zones are exaggerated.

[0047] It will be understood that when an element such as a layer, film, region, zone, or substrate is referred to as being "on" or "above" another element, it can be directly on the other element or there can also be an intervening element. In contrast, when an element is referred to as being "directly on" another element, there is no intervening element. Further, in the specification, the words "on" or "above" mean being disposed on or below an object portion and do not necessarily refer to being disposed on the upper side of the object portion based on the direction of gravity.

[0048] In addition, unless explicitly described to the contrary, the word "comprising" and variants such as "comprises" or "containing" will be understood to imply including the stated elements but not excluding any other elements.

[0049] Furthermore, throughout the specification, the phrase "in a plan view" or "on a plane" means observing a target portion from the top, and the phrase "in a cross-sectional view" or "in a cross-section" means observing a cross-section formed by vertically cutting the target portion from the side.

[0050] Figure 1 is a view showing a capacitor 1 according to an embodiment of the present disclosure, and Figure 2 is Figure 1 longitudinal cross-sectional view taken along line A - A' of

[0051] Referring to Figure 1 and Figure 2 , the capacitor 1 according to the embodiment may include a substrate 10, a body 20, and an external electrode 30.

[0052] The substrate 10 has a predetermined area. The substrate 10 may be provided as an insulating material. As an example, the substrate 10 may be a silicon substrate or the like. The substrate 10 may have an upper surface and a lower surface that face each other. The substrate 10 has a predetermined thickness in a vertical direction (or top direction and bottom direction) T in which the upper surface and the lower surface are spaced apart.

[0053] The substrate 10 may have a predetermined width in a width direction W that intersects the vertical direction T. The width direction W may be orthogonal to the vertical direction T. The substrate 10 may have a predetermined length along a length direction L that intersects the vertical direction T and the width direction W. The length direction L may be orthogonal to the vertical direction T and the width direction W. The length of the substrate 10 may be greater than the width of the substrate 10.

[0054] The main body 20 may be disposed on the upper surface of the substrate 10. The main body 20 includes an internal electrode 200 and a dielectric layer 210. The main body 20 may have a predetermined length along the length direction L of the substrate 10. The main body 20 may have a predetermined width along the width direction W of the substrate 10. The main body 20 may have a predetermined thickness along the vertical direction T.

[0055] The internal electrode 200 is stacked and disposed on the upper surface of the substrate 10. The internal electrode 200 is made of a conductive material. The internal electrode 200 may be made of a metal material. The internal electrodes 200 may be stacked in the vertical direction T.

[0056] The dielectric layer 210 may be disposed between the internal electrodes 200 adjacent to each other along the vertical direction T. Additionally, the dielectric layer 210 may be disposed on the uppermost internal electrode 200. The dielectric layer 210 may be formed of any one of metal oxides such as Al2O3, ZrO2, HfO2, AlN, etc. In addition, the dielectric layer 210 may be formed of a combination of metal oxides such as Al2O3, ZrO2, HfO2, AlN, etc. In addition, the dielectric layer 210 may be formed of ZAZ (i.e., a ZrO2 - Al2O3 - ZrO2 composite layer).

[0057] The internal electrode 200 may include a first internal electrode 201 and a second internal electrode 202.

[0058] The first internal electrode 201 and the second internal electrode 202 may be stacked and disposed on the upper surface of the substrate 10. The first internal electrode 201 and the second internal electrode 202 may be stacked alternately. The dielectric layer 210 may be disposed between the first internal electrode 201 and the second internal electrode 202. The first internal electrode 201 and the second internal electrode 202 are made of a conductive material. The first internal electrode 201 and the second internal electrode 202 are made of a non - magnetic material. The first internal electrode 201 may be made of a metal material. The second internal electrode 202 may be made of a metal material. The first internal electrode 201 and the second internal electrode 202 may be made of different materials. Thus, the first internal electrode 201 and the second internal electrode 202 may be selectively etched. For example, the first internal electrode 201 may include molybdenum and the second internal electrode 202 may include titanium.

[0059] The external electrode 30 may be connected to the internal electrode 200 of the main body 20. The external electrode 30 may be disposed to cover a part of the outer surface of the main body 20. The external electrode 30 may be disposed on the upper surface of the main body 20. The external electrode 30 may be connected to the internal electrode 200 through connection vias 221 and 222.

[0060] The connection vias 221 and 222 may be disposed inside the main body 20. The connection vias 221 and 222 may be electrically connected to the inner electrodes 200. The connection vias 221 and 222 may extend in a direction in which the inner electrodes 200 are spaced apart from each other. As an example, the connection vias 221 and 222 may extend in the vertical direction T. The connection vias 221 and 222 may penetrate the region of the main body 20 where the inner electrodes 200 are provided. The lower portions of the connection vias 221 and 222 may be disposed adjacent to the bottom surface of the main body 20. As an example, the lower portions of the connection vias 221 and 222 may contact the upper surface of the substrate 10. The upper portions of the connection vias 221 and 222 may be disposed adjacent to the upper surface of the main body 20. As an example, the upper portions of the connection vias 221 and 222 may be exposed from the upper surface of the main body 20. In this case, the upper portions of the connection vias 221 and 222 may be coplanar with the upper surface of the main body 20. Additionally, the upper portions of the connection vias 221 and 222 may protrude upward from the upper surface of the main body 20. The upper portions of the connection vias 221 and 222 may be directly connected to the outer electrodes 30.

[0061] The connection vias 221 and 222 may include a first connection via 221 and a second connection via 222.

[0062] The first connection via 221 may be electrically connected to the first inner electrode 201. The first connection via 221 may penetrate the region of the main body 20 where the inner electrodes 200 are provided, and the first connection via 221 may be connected to the first inner electrode 201 by contacting the first inner electrode 201. The first connection via 221 may be electrically separated from the second inner electrode 202. That is, a first via separation layer 231 may be disposed between the first connection via 221 and the second inner electrode 202. The first via separation layer 231 may have an annular structure to surround the first connection via 221. That is, the second inner electrode 202 may be spaced apart from the first connection via 221 in a region adjacent to the first connection via 221. In addition, the first via separation layer 231 may be disposed to fill the space between the first connection via 221 and the second inner electrode 202. The first via separation layer 231 may be disposed as an insulating material. As an example, the first via separation layer 231 may be disposed as alumina (Al2O3), silicon oxide, or the like. The dielectric layer 210 may be disposed on both sides of the first via separation layer 231 in the vertical direction T.

[0063] The second connection via 222 can be electrically connected to the second internal electrode 202. The second connection via 222 can penetrate the region of the main body 20 where the internal electrode 200 is provided, and the second connection via 222 can be connected to the second internal electrode 202 by contacting the second internal electrode 202. The second connection via 222 can be electrically separated from the first internal electrode 201. That is to say, the second via isolation layer 232 can be provided between the second connection via 222 and the first internal electrode 201. The second via isolation layer 232 can have an annular structure to surround the second connection via 222. That is to say, the first internal electrode 201 can be spaced apart from the second connection via 222 at the region adjacent to the second connection via 222. In addition, the second via isolation layer 232 can be provided to fill the space between the second connection via 222 and the first internal electrode 201. The second via isolation layer 232 can be provided as an insulating material. As an example, the second via isolation layer 232 can be provided as alumina (Al2O3), silicon oxide, etc. The dielectric layer 210 can be provided on both sides of the second via isolation layer 232 in the vertical direction T. There can be an interface between the dielectric layer 210 and the via isolation layers 231 and 232. The dielectric layer 210 and the via isolation layers 231 and 232 can include different constituent components.

[0064] The insulating layer 240 can be provided on the outer surface of the main body 20. That is to say, the insulating layer 240 can be provided outside the ends of the first internal electrode 201 in the length direction L and the width direction W of the main body 20 and the ends of the second internal electrode 202 in the length direction L and the width direction W of the main body 20, so that the first internal electrode 201 and the second internal electrode 202 are insulated from the outside. In addition, the insulating layer 240 can be provided on the upper surface of the main body 20. In this case, the connection vias 221 and 222 can penetrate the insulating layer 240 to be connected to the external electrode 30. The insulating layer 240 can be provided as alumina (Al2O3), silicon oxide, etc.

[0065] The external electrode 30 can include a first external electrode 31 and a second external electrode 32.

[0066] The first external electrode 31 may be disposed on the upper surface of the main body 20. The first external electrode 31 may be disposed at an end of the upper surface of the main body 20 in the length direction L. The first external electrode 31 is connected to the first internal electrode 201. The first external electrode 31 may be connected to the first internal electrode 201 through the first connection via 221. The first connection via 221 may be disposed in a lower region of the first external electrode 31 in the vertical direction T such that an upper portion of the first connection via 221 is connected to and in contact with the first external electrode 31. The first external electrode 31 may be provided in plurality. As an example, two first external electrodes 31 may be provided. In addition, two first connection vias 221 may be provided, and each first connection via 221 may be disposed in a lower region of the first external electrode 31 in the vertical direction T. The two first external electrodes 31 may be respectively disposed at both ends of the upper surface of the main body 20 in the length direction L. Therefore, the two first external electrodes 31 may be provided to be spaced apart from each other in the length direction L of the main body 20. In addition, the two first external electrodes 31 may be provided to be spaced apart from each other along the width direction W of the main body 20. Therefore, the two first external electrodes 31 may be provided to be spaced apart from each other in a diagonal direction intersecting the length direction L and the width direction W of the main body 20. The first external electrode 31 may be provided adjacent to a corner portion where an end of the main body 20 in the length direction L and an end of the main body 20 in the width direction W intersect. As an example, the first external electrode 31 may be provided to cover a corner portion where an end of the main body 20 in the length direction L and an end of the main body 20 in the width direction W intersect. The second external electrode 32 is disposed on the upper surface of the main body 20. The second external electrode 32 may be disposed at an end of the upper surface of the main body 20 in the length direction L. The second external electrode 32 is connected to the second internal electrode 202. The second external electrode 32 may be connected to the second internal electrode 202 through the second connection via 222. The second connection via 222 may be disposed in a lower region of the second external electrode 32 in the vertical direction T such that an upper portion of the second connection via 222 is connected to and in contact with the second external electrode 32. The second external electrode 32 may be provided in plurality. As an example, two second external electrodes 32 may be provided. In addition, two second connection vias 222 may be provided, and each second connection via 222 may be disposed in a lower region of the second external electrode 32 in the vertical direction T. The two second external electrodes 32 may be respectively disposed at both ends of the upper surface of the main body 20 in the length direction L. Therefore, the two second external electrodes 32 may be provided to be spaced apart from each other in the length direction L of the main body 20. In addition, the two second external electrodes 32 may be provided to be spaced apart from each other along the width direction W of the main body 20. Therefore, the two second external electrodes 32 may be provided to be spaced apart from each other in a diagonal direction intersecting the length direction L and the width direction W of the main body 20. The two second external electrodes 32 may be provided to be respectively spaced apart from the two first external electrodes 31 in the width direction W of the main body 20.The second external electrode 32 may be disposed adjacent to a corner portion where an end portion of the main body 20 in the length direction L and an end portion of the main body 20 in the width direction W intersect.

[0067] In one embodiment, the first connection via 221 and the second connection via 222 may be stacked with the first external electrode 31 and the second external electrode 32 in the vertical direction T, respectively.

[0068] Figure 3 FIG. is a view showing a state in which a capacitor 1 according to an embodiment of the present disclosure is mounted on a mounting substrate MS.

[0069] Referring to Figure 3 If the capacitor 1 according to the embodiment of the present disclosure is used in a state where the capacitor 1 is mounted on the mounting substrate MS, a current path is formed between the mounting substrate MS and the capacitor 1. In this case, the current path appears in a form connecting the first external electrode 31 and the second external electrode 32. The insulating layer 240 provided in the region on the upper surface of the main body 20 may be provided in the form of a thin film. For example, the thickness of the insulating layer 240 provided in the region on the upper surface of the main body 20 may be 2 μm or less. Therefore, in the vertical direction T, the current path can be shortened, so that the equivalent series resistance (ESR) is reduced. In addition, the current path is formed between the first connection via 221 and the second connection via 222 inside the main body 20. Therefore, compared with the entire length of the main body 20, the current path is shortened, so that the equivalent series resistance (ESR) is reduced. In addition, since the first external electrode 31 and the second external electrode 32 are provided in plurality, the region where the current path is formed inside the main body 20 can be adjusted to reduce the equivalent series resistance (ESR).

[0070] Figures 4 to 11 FIG. is a view showing a method for manufacturing a capacitor according to an embodiment of the present disclosure.

[0071] Hereinafter, a method for manufacturing the capacitor 1 according to the embodiment will be described with reference to Figures 4 to 11 FIG..

[0072] Referring to Figure 4 FIG., an internal electrode layer IE1 and IE2 and a dielectric layer DL for forming the main body 20 are formed on a substrate S. The substrate S may be a silicon substrate or the like. The substrate S may be provided with an area larger than the area of two main bodies 20. In addition, the area of the region where the internal electrode layer IE1 and IE2 and the dielectric layer DL are formed may be larger than the area occupied by one main body 20. For the sake of easy illustration, Figure 4 FIG. shows a region where one main body 20 is formed on the substrate S.

[0073] The inner electrode layers IE1 and IE2 and the dielectric layer DL may be alternately formed. Among the inner electrode layers IE1 and IE2 and the dielectric layer DL for forming the main body 20, the dielectric layer DL may be formed last. Accordingly, the dielectric layer DL may be disposed on the inner electrode layers IE1 and IE2 located at the uppermost side.

[0074] The inner electrode layers IE1 and IE2 and the dielectric layer DL may be formed by a deposition process. Methods such as chemical vapor deposition (CVD), atomic layer deposition (ALD), sputtering, etc. may be used to form the inner electrode layers IE1 and IE2. Methods such as chemical vapor deposition (CVD), atomic layer deposition (ALD), sputtering, etc. may be used to form the dielectric layer DL.

[0075] The inner electrode layers IE1 and IE2 may include a first inner electrode layer IE1 and a second inner electrode layer IE2. The first inner electrode layer IE1 and the second inner electrode layer IE2 may be alternately formed. Different materials may be used to form the first inner electrode layer IE1 and the second inner electrode layer IE2. For example, the first inner electrode layer IE1 may be formed of molybdenum, and the second inner electrode layer IE2 may be formed of titanium.

[0076] In addition, an insulating layer IL may be formed at the uppermost portion. The insulating layer IL may be formed by a deposition process. Methods such as chemical vapor deposition (CVD), atomic layer deposition (ALD), sputtering, etc. may be used to form the insulating layer IL.

[0077] Refer to Figure 5 , via holes VH1 and VH2 are formed by penetrating the inner electrode layers IE1 and IE2, the dielectric layer DL, and the insulating layer IL. As an example, the via holes VH1 and VH2 may be formed by an etching process. The etching process may be performed by dry etching using plasma. In addition, the via holes VH1 and VH2 may be formed by hole machining using a laser. The via holes VH1 and VH2 may include a first via hole VH1 and a second via hole VH2. The first via hole VH1 may be formed in plurality and the plurality of first via holes VH1 may be spaced apart from each other. As an example, two first via holes VH1 may be formed. The second via hole VH2 may be formed in plurality and the plurality of second via holes VH2 may be spaced apart from each other. As an example, two second via holes VH2 may be formed.

[0078] Refer to Figure 6 , a first trench G1 may be formed in the inner region of the first via hole VH1. The first trench G1 may be formed by etching the second electrode layer IE2 exposed toward the first via hole VH1. The first trench G1 may be formed by dry etching using chemicals or dry etching using plasma.

[0079] When etching is performed in the inner region of the first vias VH1, a mask can be used to shield the second vias VH2. The mask can be formed by a photolithography process such that the region provided with the first vias VH1 is open and the region provided with the second vias VH2 is shielded.

[0080] Referring Figure 7 , a first via isolation layer 231 can be formed in the first trench G1. As an example, the first via isolation layer 231 can be formed by the following method: filling an insulating material inside the first vias VH1 and etching the insulating material again in regions other than the first trench G1.

[0081] Referring Figure 8 , a second trench G2 can be formed in the inner region of the second vias VH2. The second trench G2 can be formed by etching the first electrode layer IE1 exposed toward the second vias VH2.

[0082] The second trench G2 can be formed by dry etching using chemicals or dry etching using plasma.

[0083] When etching is performed in the inner region of the second vias VH2, a mask can be used to shield the first vias VH1. The mask can be formed by a photolithography process such that the region provided with the second vias VH2 is open and the region provided with the first vias VH1 is shielded.

[0084] Referring Figure 9 , a second via isolation layer 232 can be formed in the second trench G2. As an example, the second via isolation layer 232 can be formed by the following method: filling an insulating material inside the second vias VH2 and etching the insulating material again in regions other than the second trench G2.

[0085] Figures 6 to 9 Illustrated is the case where the second via isolation layer 232 is formed after the first via isolation layer 231 is formed, but the first via isolation layer 231 can be formed after the second via isolation layer 232 is formed.

[0086] Referring Figure 10 , a first connection via 221 can be formed in the first vias VH1, and a second connection via 222 can be formed in the second vias VH2. The first connection via 221 and the second connection via 222 can be formed by a deposition process. Methods such as chemical vapor deposition (CVD), atomic layer deposition (ALD), sputtering, etc. can be used to form the first connection via 221 and the second connection via 222. Additionally, the first connection via 221 and the second connection via 222 can be formed by a plating process.

[0087] Thereafter, a first external electrode 31 may be formed on the first connection via 221, and a second external electrode 32 may be formed on the second connection via 222. The first external electrode 31 and the second external electrode 32 may be formed by a deposition process. Methods such as chemical vapor deposition (CVD), atomic layer deposition (ALD), sputtering, etc. may be used to form the external electrode 30. Additionally, the external electrode 30 may be formed by a plating process.

[0088] Referring to Figure 11 , the inner electrode layers IE1 and IE2, the dielectric layer DL, the insulating layer IL, and the substrate S may be cut into dimensions corresponding to one capacitor 1. The cutting process may be performed by a slicing process. A blade, a laser, etc. may be used for the slicing process. Additionally, an insulating layer 240 may be formed on the outer ends of the first inner electrode 201 and the second inner electrode 202. The insulating layer 240 may be formed by a deposition process. Accordingly, the insulating layer 240 may be provided on the outer surface of the main body 20.

[0089] Figure 12 is a plan view of the capacitor 1a according to the second embodiment.

[0090] Referring to Figure 12 , in the capacitor 1a according to the second embodiment, a plurality of first connection vias 221a and a plurality of second connection vias 222a may be provided inside the main body 20a.

[0091] The first connection via 221a may be provided as a plurality. Three or more first connection vias 221a may be provided. Figure 12 Illustrates a case where four first connection vias 221a are provided. The four first connection vias 221a may be provided to be spaced apart from each other. Two first connection vias 221a may be provided to be spaced apart from each other in the length direction L of the main body 20a. Two first connection vias 221a may be provided to be spaced apart from each other in the width direction W of the main body 20a.

[0092] The second connection via 222a may be provided as a plurality. Three or more second connection vias 222a may be provided. The number of the second connection vias 222a may be the same as or different from the number of the first connection vias 221a. Figure 12 Illustrates a case where four second connection vias 222a are provided. The four second connection vias 222a may be provided to be spaced apart from each other. Two second connection vias 222a may be provided to be spaced apart from each other in the length direction L of the main body 20a. Two second connection vias 222a may be provided to be spaced apart from each other in the width direction W of the main body 20a.

[0093] The external electrodes 31a and 32a include a first external electrode 31a and a second external electrode 32a.

[0094] The first external electrode 31a may be disposed on the upper surface of the main body 20a. The first external electrodes 31a may be provided in a plurality and in a number equal to the number of the first connection vias 221a. Each of the first external electrodes 31a is disposed on the first connection via 221a and connected to the first connection via 221a.

[0095] The second external electrode 32a may be disposed on the upper surface of the main body 20a. The second external electrodes 32a may be provided in a plurality and in a number equal to the number of the second connection vias 222a. Each of the second external electrodes 32a may be disposed on the second connection via 222a and may be connected to the second connection via 222a.

[0096] In one embodiment, the first connection via 221a and the second connection via 222a may be respectively stacked with the first external electrode 31a and the second external electrode 32a in the vertical direction T.

[0097] Since the remaining structure of the capacitor 1a is the same as or similar to the structure of the capacitor 1 described above in Figure 1 and Figure 2 the repetitive description thereof is omitted.

[0098] Figure 13 is a cross-sectional view of a capacitor 1b according to a third embodiment.

[0099] Referring to Figure 13 in the capacitor 1b according to the third embodiment, the connection vias 221b and 222b and the external electrodes 31b and 32b may be connected to each other through a connection layer 225. The connection layer 225 may be disposed on the dielectric layer 210b disposed at the uppermost side. The connection layer 225 may be disposed between the insulating layer 240b and the dielectric layer 210b disposed at the uppermost side. The connection layer 225 may be provided as a conductive material. The connection layer 225 may be made of a metal material.

[0100] The connection layer 225 includes a first connection layer 226 and a second connection layer 227.

[0101] The first connection layer 226 may be disposed between the first connection via 221b and the first external electrode 31b such that the first connection via 221b and the first external electrode 31b are electrically connected to each other. One end of the first connection layer 226 may be connected to the upper portion of the first connection via 221b. The other end of the first connection layer 226 may be connected to the first external electrode 31b. The region where the first external electrode 31b and the first connection layer 226 are connected to each other may penetrate the insulating layer 240b.

[0102] The second connection layer 227 may be disposed between the second connection via 222b and the second external electrode 32b, such that the second connection via 222b and the second external electrode 32b are electrically connected to each other. One end of the second connection layer 227 may be connected to the upper portion of the second connection via 222b. The other end of the second connection layer 227 may be connected to the second external electrode 32b. The region where the second external electrode 32b and the second connection layer 227 are connected to each other may penetrate the insulating layer 240b. The first connection layer 226 and the second connection layer 227 may extend inwardly of the main body from the upper end portions of the first connection via 221b and the second connection via 222b, respectively.

[0103] Since the substrate 10b, the internal electrodes 200b including the first internal electrode 201b and the second internal electrode 202b, the first via separation layer 231b, and the second via separation layer 232b may be the same as or similar to the content of the capacitor 1 described in Figure 1 and Figure 2 their repeated descriptions are omitted.

[0104] In addition, since, except that the first connection via 221b and the second connection via 222b are connected to the external electrodes 31b and 32b through the connection layer 225, the first connection via 221b and the second connection via 222b are the same as or similar to the content of the capacitor 1 described in Figure 1 and Figure 2 or the capacitor 1a described in Figure 12 their repeated descriptions are omitted.

[0105] In the capacitor 1b according to the third embodiment, the positions of the external electrodes 31b and 32b may be adjusted to be spaced apart from the positions of the upper portions of the connection vias 221b and 222b. Therefore, the positions of the connection vias 221b and 222b and the external electrodes 31b and 32b can be freely adjusted to more effectively reduce the equivalent series resistance (ESR).

[0106] Figure 14 is a view showing a capacitor 1c according to a fourth embodiment, and Figure 15 is a cross-sectional view taken along line B - B′ of Figure 14 .

[0107] Referring to Figure 14 and Figure 15 , the capacitor 1c according to the fourth embodiment may include a substrate 10c, a main body 20c, and external electrodes 30c.

[0108] The substrate 10c may have a predetermined area. The substrate 10c may be provided as an insulating material.

[0109] The main body 20c may be disposed on the upper surface of the substrate 10c. The main body 20c may include an inner electrode 200c and a dielectric layer 210c. The main body 20c may have a predetermined length along the length direction L of the substrate 10c. The main body 20c may have a predetermined width along the width direction W of the substrate 10c. The main body 20c may have a predetermined thickness along the vertical direction T.

[0110] The inner electrode 200c may include a first inner electrode 201c and a second inner electrode 202c.

[0111] The first inner electrode 201c and the second inner electrode 202c may be stacked and disposed on the upper surface of the substrate 10c. The first inner electrode 201c and the second inner electrode 202c may be alternately stacked. The dielectric layer 210c may be disposed between the first inner electrode 201c and the second inner electrode 202c. The dielectric layer 210c may be disposed on the inner electrode 200c disposed at the uppermost side. In addition, an insulating layer 240c may be disposed on the dielectric layer 210c disposed at the uppermost side.

[0112] The outer electrode 30c may be connected to the inner electrode 200c at some regions of the end of the main body 20c in the length direction L or at some regions of the end of the main body 20c in the width direction W. That is, the outer electrode 30c may be disposed to cover the outer side surface of the main body 20c at some regions of the end of the main body 20c in the length direction L or at some regions of the end of the main body 20c in the width direction W. Therefore, the inner electrode 200c exposed to the outer side surface of the main body 20c may be connected to the outer electrode 30c. The outer electrode 30c may cover some regions of the upper surface of the main body 20c.

[0113] The outer electrode 30c may include a first outer electrode 31c and a second outer electrode 32c.

[0114] The first outer electrode 31c may be disposed to cover the outer side surface of the main body 20c such that it is connected to the portion of the first inner electrode 201c exposed to the outer side surface of the main body 20c. The first outer electrode 31c may be connected by directly contacting the portion of the first inner electrode 201c exposed to the outer side surface of the main body 20c.

[0115] The first electrode separation layer 231c may be disposed between the first outer electrode 31c and the second inner electrode 202c. That is, the second inner electrode 202c may have a structure that is recessed toward the inside of the main body 20c in the region opposite to the first outer electrode 31c. In addition, the first electrode separation layer 231c may be disposed between the ends of the first outer electrode 31c and the second inner electrode 202c. The first electrode separation layer 231c may be made of an insulating material.

[0116] The first external electrode 31c can be connected to a portion of the first internal electrode 201c exposed on the outer surface at some regions of the end portion of the main body 20c in the longitudinal direction L or at some regions of the end portion of the main body 20c in the width direction W. The first external electrode 31c can cover some regions of the upper surface of the main body 20c.

[0117] The first external electrode 31c can be disposed at a corner region where the end portion of the main body 20c in the longitudinal direction L intersects with the end portion of the main body 20c in the width direction W, such that it is connected to a portion of the first internal electrode 201c exposed on the outer surface at some regions of the end portion of the main body 20c in the longitudinal direction L and at some regions of the end portion of the main body 20c in the width direction W. The first external electrode 31c can cover some regions of the upper surface of the main body 20c at a corner region where the end portion of the main body 20c in the longitudinal direction L intersects with the end portion of the main body 20c in the width direction W.

[0118] A plurality of first external electrodes 31c can be provided. Two first external electrodes 31c can be provided. The two first external electrodes 31c can be provided to be spaced apart from each other along the longitudinal direction L of the main body 20c. Additionally, the two first external electrodes 31c can be provided to be spaced apart from each other along the width direction W of the main body 20c. Additionally, the two first external electrodes 31c can be provided to be spaced apart from each other in a diagonal direction intersecting with the longitudinal direction L and the width direction W of the main body 20c.

[0119] The second external electrode 32c can be provided to cover the outer surface of the main body 20c such that it is connected to a portion of the second internal electrode 202c exposed on the outer surface of the main body 20c. The second external electrode 32c can be connected by directly contacting a portion of the second internal electrode 202c exposed on the outer surface of the main body 20c.

[0120] The second electrode separation layer 232c can be disposed between the second external electrode 32c and the first internal electrode 201c. That is, the first internal electrode 201c can have a structure that is recessed toward the inside of the main body 20c at a region opposite to the second external electrode 32c. Additionally, the second electrode separation layer 232c can be disposed between the second external electrode 32c and the end portion of the first internal electrode 201c. The second electrode separation layer 232c can be made of an insulating material.

[0121] The second external electrode 32c can be connected to a portion of the second internal electrode 202c exposed on the outer surface at some regions of the end portion of the main body 20c in the longitudinal direction L or at some regions of the end portion of the main body 20c in the width direction W. The second external electrode 32c can cover some regions of the upper surface of the main body 20c.

[0122] The second external electrode 32c may be disposed at a corner region where an end portion of the main body 20c in the length direction L and an end portion of the main body 20c in the width direction W intersect, such that it is connected to portions of the second internal electrode 202c exposed on the outer surface at some regions of the end portion of the main body 20c in the length direction L and at some regions of the end portion of the main body 20c in the width direction W. The second external electrode 32c may cover some regions of the upper surface of the main body 20c at a corner region where an end portion of the main body 20c in the length direction L and an end portion of the main body 20c in the width direction W intersect.

[0123] A plurality of second external electrodes 32c may be provided. Two second external electrodes 32c may be provided. The two second external electrodes 32c may be provided to be spaced apart from each other along the length direction L of the main body 20c. Additionally, the two second external electrodes 32c may be provided to be spaced apart from each other along the width direction W of the main body 20c. Additionally, the two second external electrodes 32c may be provided to be spaced apart from each other in a diagonal direction intersecting the length direction L and the width direction W of the main body 20c.

[0124] Additionally, an insulating layer 240c may also be provided on the outer surface of the main body 20c except for the regions covered by the external electrode 30c.

[0125] Figures 16 to 20 is a view showing a method for manufacturing a capacitor 1c according to a fourth embodiment of the present disclosure.

[0126] Hereinafter, with reference to Figures 16 to 20 a method for manufacturing the capacitor 1c will be described.

[0127] With reference to Figure 16 , an internal electrode layer IE1c and IE2c and a dielectric layer DLc for forming the main body 20c may be formed on a substrate Sc. Additionally, an insulating layer ILc may be formed at the uppermost portion. Since the methods for forming the internal electrode layer IE1c and IE2c, the dielectric layer DLc, and the insulating layer ILc are the same as or similar to the methods described above in Figure 4 , a repeated description thereof is omitted.

[0128] With reference to Figure 17 , the internal electrode layer IE1c and IE2c and the dielectric layer DLc may be cut into dimensions corresponding to one main body 20c. An etching process may be used for cutting. The etching process may be a dry etching process using plasma. Additionally, cutting may be performed using a laser.

[0129] With reference to Figure 18 and Figure 19, the first inner electrode 201c exposed to the outside can be selectively etched to form a first separation trench G1c. The first inner electrode 201c can be formed by dry etching using chemicals or dry etching using plasma. In addition, the first separation trench G1c can be filled with an insulating material to form a first electrode separation layer 231c.

[0130] In addition, the second inner electrode 202c exposed to the outside can be selectively etched to form a second separation trench G2c. The second inner electrode 202c can be formed by dry etching using chemicals or dry etching using plasma. In addition, the second separation trench G2c can be filled with an insulating material to form a second electrode separation layer 232c.

[0131] Although the case of first forming the first electrode separation layer 231c and then forming the second electrode separation layer 232c has been described, the second electrode separation layer 232c can be formed first and then the first electrode separation layer 231c can be formed.

[0132] Referring to Figure 20 , an outer electrode 30c can be formed to cover the outer surface of the main body 20c. Methods such as chemical vapor deposition (CVD), atomic layer deposition (ALD), sputtering, etc. can be used to form the outer electrode 30c. In addition, the outer electrode 30c can be formed by a plating process. Thereafter, the substrate Sc can be cut into a size corresponding to one capacitor 1c. The cutting process can be performed by a slicing process. The slicing process can be performed using a blade, a laser, etc.

[0133] Figure 21 is a view showing a capacitor 1d according to the fifth embodiment, Figure 22 is along Figure 21 the line C-C′ of the cross-sectional view taken, and Figure 23 is along Figure 22 the line D-D′ of the cross-sectional view taken.

[0134] Referring to Figures 21 to 23 , the outer electrode 30d can be connected to the inner electrode 200d at some regions of the end of the main body 20d in the length direction L or at some regions of the end of the main body 20d in the width direction W. In other words, the outer electrode 30d can be arranged to cover the outer surface of the main body 20d at some regions of the end of the main body 20d in the length direction L or at some regions of the end of the main body 20d in the width direction W. Therefore, the portion of the inner electrode 200d exposed to the outer surface of the main body 20d can be connected to the outer electrode 30d. In addition, the outer electrode 30d can cover some regions of the upper surface of the main body 20d.

[0135] The outer electrode 30d can include a first outer electrode 31d and a second outer electrode 32d.

[0136] The first external electrode 31d may be arranged to cover the outer surface of the main body 20d such that it is connected to the portion of the first internal electrode 201d that is exposed on the outer surface of the main body 20d. The first external electrode 31d may be connected by directly contacting the portion of the first internal electrode 201d that is exposed on the outer surface of the main body 20d. The first electrode separation layer 231d may be arranged between the first external electrode 31d and the second internal electrode 202d.

[0137] In addition, the portion of the first external electrode 31d that covers the upper surface of the main body 20d may be connected to the first connection via 221d. Accordingly, the first external electrode 31d is connected to the first internal electrode 201d via the first connection layer 226d and the first connection via 221d. The first via separation layer 233d may be arranged between the first connection via 221d and the second internal electrode 202d.

[0138] The second external electrode 32d may be arranged to cover the outer surface of the main body 20d such that it is connected to the portion of the second internal electrode 202d that is exposed on the outer surface of the main body 20d. The second external electrode 32d may be connected by directly contacting the portion of the second internal electrode 202d that is exposed on the outer surface of the main body 20d. The second electrode separation layer 232d may be arranged between the second external electrode 32d and the first internal electrode 201d.

[0139] In addition, the portion of the second external electrode 32d that covers the upper surface of the main body 20d may be connected to the second connection via 222d. Accordingly, the second external electrode 32d is connected to the second internal electrode 202d via the second connection layer 227d and the second connection via 222d. The second via separation layer 224d may be arranged between the second connection via 222d and the first internal electrode 201d. The external electrodes 31d and 32d may be connected to the internal electrodes 201d and 202d via a connection layer 225d including the first connection layer 226d and the second connection layer 227d, and the connection vias 221d and 222d. In addition, an insulating layer 240d may be arranged on the dielectric layer 210d disposed at the uppermost side. Optionally, the insulating layer 240d may also be arranged on the outer surface of the main body 20d except for the region covered by the external electrode 30d.

[0140] Since the structure in which the external electrode 30d is connected to the internal electrode 200d at the outer surface of the main body 20d is the same as or similar to the structure of the capacitor 1c described in Figure 14 and Figure 15 its repeated description is omitted.

[0141] In addition, since the structure in which the external electrode 30d is connected to the internal electrode 200d via the connection vias 221d and 222d is the same as the capacitor 1 described in Figure 1 and Figure 2 the capacitor 1a described in Figure 12 or the capacitor 1a described inFigure 13 The structure of the capacitor 1b described therein is the same as or similar to that, and thus the repeated description thereof is omitted.

[0142] In the capacitor 1d according to the fifth embodiment, current paths can be formed in various paths between the outer electrode 30d and the inner electrode 225d. Therefore, the equivalent series resistance (ESR) can be effectively reduced by adjusting the current paths.

[0143] Figure 24 is a plan view of the capacitor 1e according to the sixth embodiment.

[0144] Referring to Figure 24 , in the capacitor 1e according to the sixth embodiment, a plurality of first connection vias 221e and a plurality of second connection vias 222e can be provided inside the main body 20e.

[0145] The first connection vias 221e and the second connection vias 222e can be provided in the central region in the length direction L or the width direction W of the main body 20e. In addition, the first connection vias 221e and the second connection vias 222e can be alternately provided along the width direction W or the length direction L of the main body 20e and spaced apart from each other. Two first connection vias 221e can be provided. Two second connection vias 222e can be provided.

[0146] The outer electrodes 31e and 32e can include a first outer electrode 31e and a second outer electrode 32e.

[0147] The first outer electrode 31e can be provided on the upper surface of the main body 20e. The same number of first outer electrodes 31e as the number of the first connection vias 221e can be provided. The two first outer electrodes 31e can be provided to be spaced apart from each other along the length direction L of the main body 20e. In addition, the two first outer electrodes 31e can be provided to be spaced apart from each other along the width direction W of the main body 20e. Therefore, the two first outer electrodes 31e can be provided to be spaced apart from each other in the diagonal direction intersecting the length direction L and the width direction W of the main body 20e. The first outer electrode 31e can be provided adjacent to the corner where the end of the main body 20e in the length direction L and the end of the main body 20e in the width direction W intersect.

[0148] The second external electrode 32e may be disposed on the upper surface of the main body 20e. Two second external electrodes 32e may be provided, the same number as that of the second connection vias 222e. The two second external electrodes 32e may be disposed to be spaced apart from each other along the length direction L of the main body 20e. Additionally, the two second external electrodes 32e may be disposed to be spaced apart from each other along the width direction W of the main body 20e. Accordingly, the two second external electrodes 32e may be disposed to be spaced apart from each other in a diagonal direction intersecting the length direction L and the width direction W of the main body 20e. The second external electrode 32e may be disposed adjacent to the corner where the end of the main body 20e in the length direction L and the end of the main body 20e in the width direction W intersect.

[0149] The connection vias 221e and 222e and the external electrodes 31e and 32e may be connected to each other through the connection layers 226e and 227e. The connection layers 226e and 227e may be disposed as conductive materials. The connection layers 226e and 227e may be made of a metal material. The connection layers 226e and 227e may include a first connection layer 226e and a second connection layer 227e.

[0150] The first connection layer 226e may be disposed between the first connection via 221e and the first external electrode 31e such that the first connection via 221e and the first external electrode 31e are electrically connected to each other.

[0151] The second connection layer 227e may be disposed between the second connection via 222e and the second external electrode 32e such that the second connection via 222e and the second external electrode 32e are electrically connected to each other.

[0152] Additionally, the first external electrode 31e may be disposed to cover the outer surface of the main body 20e such that it is connected to the first internal electrode exposed through the outer surface of the main body 20e.

[0153] Additionally, the second external electrode 32e may be disposed to cover the outer surface of the main body 20e such that it is connected to the second internal electrode exposed through the outer surface of the main body 20e.

[0154] Since the structure in which the external electrodes 31e and 32e and the connection vias 221e and 222e are connected through the connection layers 226e and 227e is the same as or similar to the structure of the capacitor 1b described above in Figure 13 its repetitive description is omitted.

[0155] Since the structure in which the external electrodes 31e and 32e and the internal electrodes are connected to the side surface of the main body 20e is the same as or similar to the structure of the capacitor 1c described above in Figure 14 and Figure 15 its repetitive description is omitted.

[0156] Figure 25It is a plan view of the capacitor 1f according to the seventh embodiment.

[0157] Referring to Figure 25 , the external electrodes 31f and 32f of the capacitor 1f according to the seventh embodiment may include a first external electrode 31f and a second external electrode 32f.

[0158] The first external electrode 31f may be provided on the upper surface of the main body 20f. Two first external electrodes 31f may be provided. The two first external electrodes 31f may be provided to be spaced apart from each other along the length direction L of the main body 20f. In addition, the two first external electrodes 31f may be provided to be spaced apart from each other along the width direction W of the main body 20f. Therefore, the two first external electrodes 31f may be provided to be spaced apart from each other in a diagonal direction intersecting the length direction L and the width direction W of the main body 20f. The first external electrode 31f may be provided adjacent to the corner portion where the end portion of the main body 20f in the length direction L and the end portion of the main body 20f in the width direction W intersect.

[0159] The second external electrode 32f may be provided on the upper surface of the main body 20f. Two second external electrodes 32f may be provided. The two second external electrodes 32f may be provided to be spaced apart from each other along the length direction L of the main body 20f. In addition, the two second external electrodes 32f may be provided to be spaced apart from each other along the width direction W of the main body 20f. Therefore, the two second external electrodes 32f may be provided to be spaced apart from each other in a diagonal direction intersecting the length direction L and the width direction W of the main body 20f. The second external electrode 32f may be provided adjacent to the corner portion where the end portion of the main body 20f in the length direction L and the end portion of the main body 20f in the width direction W intersect.

[0160] In the capacitor 1f, a plurality of first connection vias 221f and a plurality of second connection vias 222f may be provided inside the main body 20f. The number of the first connection vias 221f may be greater than the number of the first external electrodes 31f. The number of the second connection vias 222f may be greater than the number of the second external electrodes 32f.

[0161] As an example, a part of the first connection vias 221f and a part of the second connection vias 222f may be provided in the central region of the main body 20f in the length direction L or in the width direction W. In addition, the first connection vias 221f and the second connection vias 222f may be alternately provided and spaced apart from each other along the width direction W or the length direction L of the main body 20f. In addition, the remaining part of the first connection vias 221f may be provided in the region between the first external electrode 31f and the second external electrode 32f. In addition, the remaining part of the second connection vias 222f may be provided in the region between the first external electrode 31f and the second external electrode 32f.

[0162] The connection vias 221f and 222f and the external electrodes 31f and 32f can be connected to each other through the connection layers 226f and 227f. The connection layers 226f and 227f can be set as conductive materials. The connection layers 226f and 227f can be made of metal materials. The connection layers 226f and 227f include a first connection layer 226f and a second connection layer 227f.

[0163] The first connection layer 226f can be disposed between the first connection via 221f and the first external electrode 31f such that the first connection via 221f and the first external electrode 31f are electrically connected to each other. Accordingly, the first external electrode 31f can be connected to two or more first connection vias 221f.

[0164] The second connection layer 227f can be disposed between the second connection via 222f and the second external electrode 32f such that the second connection via 222f and the second external electrode 32f are electrically connected to each other. Accordingly, the second external electrode 32f can be connected to two or more second connection vias 222f.

[0165] In addition, the first external electrode 31f can be disposed to cover the outer surface of the main body 20f such that it is connected to the first internal electrode exposed through the outer surface of the main body 20f.

[0166] In addition, the second external electrode 32f can be disposed to cover the outer surface of the main body 20f such that it is connected to the second internal electrode exposed through the outer surface of the main body 20f.

[0167] Since the structure in which the external electrodes 31f and 32f and the connection vias 221f and 222f are connected through the connection layers 226f and 227f is the same as or similar to the structure of the capacitor 1b described above in Figure 13 the repeated description thereof is omitted.

[0168] Since the structure in which the external electrodes 31f and 32f and the internal electrodes are connected to the side surface of the main body 20f is the same as or similar to the structure of the capacitor 1c described above in Figure 14 and Figure 15 the repeated description thereof is omitted.

[0169] Although the embodiments of the present disclosure have been described in connection with what are presently considered to be practical embodiments, it is to be understood that the present disclosure is not limited to the disclosed embodiments, but on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims.

Claims

1. A capacitor, comprising: a body including a first internal electrode and a second internal electrode, wherein the first internal electrode and the second internal electrode are stacked with a dielectric layer interposed therebetween; a first outer electrode disposed on an upper surface of the body and an outer side surface of the body and connected to the first inner electrode via the upper surface of the body and / or the outer side surface of the body; as well as A second outer electrode is disposed on the upper surface of the body and the outer side surface of the body and is connected to the second inner electrode via the upper surface of the body and / or the outer side surface of the body.

2. The capacitor according to claim 1, further comprising: a first connecting via, disposed inside the body to connect the first inner electrode and the first outer electrode; as well as A second connecting via is disposed inside the body to connect the second inner electrode and the second outer electrode. 3 . The capacitor of claim 2 , further comprising a first via separation layer disposed between the first connection via and the second inner electrode. 4 . The capacitor of claim 2 , further comprising a second via separation layer disposed between the second connection via and the first inner electrode.

5. The capacitor according to claim 2, wherein: The first external electrode contacts the first connection via, and the second external electrode contacts the second connection via.

6. The capacitor according to claim 2, further comprising: a first connection layer, connecting the first external electrode and the first connection via; as well as The second connection layer connects the second external electrode and the second connection via.

7. The capacitor according to claim 6, wherein: The first connection layer and the second connection layer are disposed on an uppermost dielectric layer among the dielectric layers.

8. The capacitor according to claim 6, wherein The number of first connection vias including the first connection vias is greater than or equal to the number of first external electrodes including the first external electrodes.

9. The capacitor according to claim 6, wherein: The number of second connection vias including the second connection vias is greater than or equal to the number of second external electrodes including the second external electrodes.

10. The capacitor according to claim 1, wherein Each of the first external electrode and the second external electrode is disposed to cover a corner portion intersecting an end portion of the body in a length direction and an end portion of the body in a width direction.

11. The capacitor according to claim 1, wherein Each of the first external electrode and the second external electrode is provided in two.

12. The capacitor according to claim 1, wherein The first external electrode is connected to a portion of the first internal electrode exposed to the outer side surface of the body, and the second external electrode is connected to a portion of the second internal electrode exposed to the outer side surface of the body.

13. The capacitor of claim 12, further comprising: a first electrode separator layer disposed between the first outer electrode and the second inner electrode; as well as The second electrode separator layer is disposed between the second outer electrode and the first inner electrode.

14. A capacitor, comprising: substrate; a body including a first internal electrode and a second internal electrode and disposed on the substrate, the first internal electrode and the second internal electrode being stacked with a dielectric layer interposed therebetween; a first outer electrode disposed on an upper surface of the body and an outer side surface of the body and connected to the first inner electrode; as well as A second external electrode is disposed on the upper surface of the body and the outer side surface of the body and is connected to the second internal electrode.

15. The capacitor according to claim 14, wherein: The first external electrode is connected to a portion of the first internal electrode exposed to the outer side surface of the body, and the second external electrode is connected to a portion of the second internal electrode exposed to the outer side surface of the body.

16. The capacitor according to claim 14, wherein: Each of the first external electrode and the second external electrode is disposed to cover a corner where an end portion of the body in a length direction and an end portion of the body in a width direction meet.

17. The capacitor according to claim 16, wherein: Each of the first external electrode and the second external electrode is provided in two.

18. A capacitor, comprising: substrate; a body including a first internal electrode and a second internal electrode and disposed on an upper surface of the substrate, the first internal electrode and the second internal electrode being stacked with a dielectric layer interposed therebetween; two first outer electrodes disposed on an upper surface of the body and spaced apart from each other and connected to the first inner electrode; as well as Two second outer electrodes are disposed on the upper surface of the body and are spaced apart from each other and connected to the second inner electrode.

19. The capacitor of claim 18, further comprising: a first connecting via, disposed inside the body and connected to the first inner electrode; as well as A second connection via is disposed inside the body and connected to the second inner electrode.

20. The capacitor according to claim 18, wherein A portion of the first outer electrode covers the outer surface of the body and is connected to a portion of the first inner electrode exposed to the outer surface of the body, and a portion of the second outer electrode covers the outer surface of the body and is connected to a portion of the second inner electrode exposed to the outer surface of the body.

21. A capacitor, comprising: a body including a first internal electrode and a second internal electrode, wherein the first internal electrode and the second internal electrode are stacked with a dielectric layer interposed therebetween; A first external electrode is disposed on the upper surface of the body; a second external electrode disposed on the upper surface of the body and separated from the first external electrode; a first connecting via, disposed inside the body to connect the first inner electrode and the first outer electrode; a second connecting via, disposed inside the body to connect the second inner electrode and the second outer electrode; a first via separation layer, disposed between the first connection via and the second inner electrode; as well as A second via separation layer is disposed between the second connection via and the first internal electrode.

22. The capacitor according to claim 21, wherein The first via separation layer is disposed in the first groove of the second internal electrode, and the second via separation layer is disposed in the second groove of the first internal electrode.

23. The capacitor according to claim 22, wherein: The capacitor further includes an insulating layer covering the upper surface of the body, and a thickness of the insulating layer is less than or equal to 2 μm.

24. A capacitor comprising: a body including a first internal electrode and a second internal electrode, wherein the first internal electrode and the second internal electrode are stacked with a dielectric layer interposed therebetween; a first outer electrode disposed on an upper surface and an outer surface of the body and in contact with the first inner electrode on the outer surface; a second outer electrode disposed on the upper surface and the outer surface of the body, separated from the first outer electrode and in contact with the second inner electrode on the outer surface; a first electrode separator layer disposed between the first outer electrode and the second inner electrode; as well as The second electrode separator layer is disposed between the second outer electrode and the first inner electrode.

25. The capacitor of claim 24, further comprising: a first connecting via, disposed inside the body to connect the first inner electrode and the first outer electrode; as well as A second connecting via is disposed inside the body to connect the second inner electrode and the second outer electrode.

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