A vibration suppression device for a hybrid bonding apparatus and a hybrid bonding method

Abstract

The present invention relates to the field of semiconductor technology, and more specifically, to a vibration suppression device for hybrid bonding equipment and a hybrid bonding method. The vibration suppression device is installed between the front end of the placement mechanism and the end of the placement mechanism of the hybrid bonding device; the vibration suppression device includes a first vibration component, a second vibration component, and a piezoelectric vibration drive device; the first vibration component and the second vibration component are stacked; the piezoelectric vibration drive device includes a first piezoelectric motor and a second piezoelectric motor; the first vibration component and the second vibration component can drive the end of the placement mechanism to vibrate in a first direction and a second direction, respectively. This method can actively offset the vibration generated during the movement of the placement mechanism without waiting for the vibration to decay to within the target accuracy requirement, thereby shortening the time it takes for the hybrid bonding device to place the chip at the target position and improving the production efficiency of the hybrid bonding device.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a vibration suppression device for hybrid bonding equipment and a hybrid bonding method. Background Art

[0002] Emerging fields such as artificial intelligence, 5G communications, and the Internet of Things (IoT) are placing higher demands on chip performance, power consumption, and size. However, as semiconductor process dimensions continue to shrink, improving chip performance using traditional planar integration methods is becoming increasingly difficult, and costs are also increasing dramatically. To further enhance chip performance, integration, and functional diversity, new integration approaches are needed. This has led to the emergence of 3D integration technology, and hybrid bonding is one of the key technologies enabling 3D integration.

[0003] Hybrid bonding is a technology that combines two or more different bonding mechanisms to achieve high-precision, high-performance connections between materials. A common approach is to combine metal bonding with dielectric bonding, using metal-to-metal bonding to achieve a good electrical connection and dielectric-to-dielectric bonding to provide mechanical stability and insulation. To achieve high-precision, high-quality bonding, hybrid bonding equipment typically includes wafer pre-processing, bonding material coating, alignment and bonding, inspection and quality control, and post-processing.

[0004] During the alignment and bonding process, the chip must be placed in a precise position to ensure bonding quality, with positioning accuracy requirements reaching the micron or even nanometer level. However, when the placement mechanism moves the chip at high speed, it is affected by factors such as vibration, impact, and inertia, causing slight vibrations to persist even after the placement mechanism reaches the placement position. This necessitates waiting for a period of time or reducing the placement speed to stabilize the vibration within the process requirements before proceeding to the next step. This impacts the production efficiency of the hybrid bonding equipment.

[0005] How to increase the placement speed and shorten the waiting time while ensuring placement accuracy, thereby improving production efficiency, is a major problem. The existing technology uses the method of adding active or passive vibration isolation pads to the equipment to reduce the vibration and impact of the machine, but this method can only reduce the vibration and impact of the entire equipment, and cannot eliminate the vibration caused by the inertia of the movement at the end of the placement mechanism. The existing technology also uses the method of reducing the weight of the placement mechanism to reduce the impact of inertia, but reducing the weight may affect the structural strength and rigidity of the placement mechanism, exacerbating vibration. How to balance weight and structural strength and rigidity is also a major problem.

[0006] Furthermore, existing technologies use sensors to measure vibration at the placement mechanism's end and then optimize the mechanism's motion parameters through specific motion control algorithms to reduce motion shock and, in turn, vibration at the end. However, ensuring the accuracy and stability of sensor detection data is a major challenge. Summary of the Invention

[0007] The technical problem to be solved by the present invention is to provide a vibration suppression device for hybrid bonding equipment and a hybrid bonding method.

[0008] The technical solution of the present invention to solve the above technical problems is as follows:

[0009] The present invention provides a vibration suppression device for a hybrid bonding device, wherein the vibration suppression device is installed between the front end and the rear end of a placement mechanism of the hybrid bonding device; the vibration suppression device comprises a first vibration component, a second vibration component and a piezoelectric vibration driving device;

[0010] The first vibration component and the second vibration component are stacked; the piezoelectric vibration driving device includes a first piezoelectric motor and a second piezoelectric motor;

[0011] The first vibration component and the second vibration component can drive the end of the placement mechanism to vibrate along a first direction and a second direction respectively.

[0012] The beneficial effects of the present invention are as follows: by cooperating with the piezoelectric vibration driving device and the vibration component, the vibration component can vibrate in a specified direction; by separately arranging vibration components that can vibrate in two directions, the vibration characteristic information of the placement mechanism obtained can be decomposed, so that the vibration suppression device can better actively offset the vibration without waiting for the vibration to decay to the target accuracy requirement, effectively shortening the time for the hybrid bonding equipment to place the chip to the target position, and improving the production efficiency of the hybrid bonding equipment.

[0013] On the basis of the above technical solution, the present invention can also be improved as follows.

[0014] Furthermore, the first vibration assembly includes a first fixing base and a first slider, wherein the first slider is slidably connected to the first fixing base and can move relative to the first fixing base along the first direction;

[0015] The second vibration assembly includes a second fixed base and a second slider, the second slider is slidably connected to the second fixed base and can move relative to the second fixed base along the second direction;

[0016] The first fixing seat is fixedly connected to the front end of the placement mechanism, the first sliding block is fixedly connected to the second fixing seat, and the second sliding block is fixedly connected to the end of the placement mechanism.

[0017] The beneficial effect of adopting the above further solution is that, by providing the structure of the fixing seat and the slider, the vibration process of the vibration component can be kept stable and controllable.

[0018] Furthermore, the upper wall of the first fixing seat is fixedly connected to the lower side of the front end of the placement mechanism; the lower wall and two side walls of the first fixing seat are open, and the open two side walls are the two side walls in the first direction, and a first hollow sliding groove is provided in the first fixing seat;

[0019] The first sliding block is slidably connected to the first hollow sliding groove, and the lower side of the first sliding block is fixedly connected to the second fixing seat;

[0020] The first piezoelectric motor includes a first stator and a first mover. The first mover can vibrate back and forth along the first direction relative to the first stator. The first stator is fixed on the first fixing seat, and the first mover is fixed on the first slider.

[0021] The beneficial effect of adopting the above further solution is that the stability of the sliding process can be further guaranteed by the first hollow slide groove, and the first mover of the first piezoelectric motor is fixed on the first slider, which can directly drive the vibration of the first slider, thereby improving the driving effect.

[0022] Furthermore, the lower wall and two side walls of the second fixing seat are open, the open side walls are the two side walls in the second direction, and a second hollow sliding groove is provided in the second fixing seat;

[0023] The second slider is slidably connected to the second hollow slide groove, and the lower side of the second slider is fixedly connected to the end of the placement mechanism;

[0024] The second piezoelectric motor includes a second stator and a second mover. The second mover can vibrate back and forth along the second direction relative to the second stator. The second stator is fixed on the second fixing seat, and the second mover is fixed on the second slider.

[0025] The beneficial effect of adopting the above further solution is that the stability of the sliding process can be further guaranteed by the second hollow slide groove, and the second mover of the second piezoelectric motor is fixed on the second slider, which can directly drive the vibration of the second slider, so that the driving effect is better.

[0026] Furthermore, the longitudinal sections of the first hollow chute and the second hollow chute are both T-shaped.

[0027] The beneficial effect of adopting the above further solution is that it can achieve more stable sliding, and both sides of the slider are included in the upper part of the T-shape. At the same time, the slider can be well fixedly connected to the second fixed seat or the end of the placement mechanism through the lower part of the T-shape.

[0028] Furthermore, on a horizontal plane, the straight line where the first direction is located and the straight line where the second direction is located are perpendicular to each other.

[0029] The beneficial effect of adopting the above further solution is that setting the first direction and the second direction to be orthogonal can simplify the calculation process and make the decomposed vibration information more accurate and scientific.

[0030] The present invention also provides a hybrid bonding device, comprising the vibration suppression device as described above, and further comprising a control element, wherein the control element is connected to the piezoelectric vibration driving device circuit.

[0031] The present invention also provides a hybrid bonding method, which uses the above-mentioned device to perform hybrid bonding on media of at least two materials.

[0032] The hybrid bonding method of the present invention can actively offset the vibration generated during the movement of the placement mechanism without waiting for the vibration to decay to within the target accuracy requirement, thereby shortening the time it takes for the hybrid bonding device to place the chip at the target position and improving the production efficiency of the hybrid bonding device.

[0033] Furthermore, the method includes aligning and bonding the two materials of the medium, wherein the aligning and bonding step is:

[0034] The control element acquires and processes the motion signal of the placement mechanism to obtain vibration signals along the first direction and the second direction;

[0035] The control element controls the vibration of the first piezoelectric motor and the second piezoelectric motor respectively according to the vibration signal, drives the first vibration component and the second vibration component to slide, drives the end of the placement mechanism to vibrate and offset the vibration along the first direction and the second direction.

[0036] Furthermore, the vibration signal includes vibration frequency, amplitude and attenuation law. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 It is a schematic structural diagram of a vibration suppression device for hybrid bonding equipment of the present invention;

[0038] Figure 2 This is a schematic diagram of the structure of the second piezoelectric motor of the vibration suppression device for hybrid bonding equipment of the present invention.

[0039] In the accompanying drawings, the components represented by the reference numerals are as follows:

[0040] 1. Place the front end of the mechanism;

[0041] 2. First vibration assembly; 21. First fixing seat; 22. First slider;

[0042] 3. Second vibration assembly; 31. Second fixing seat; 32. Second slider;

[0043] 4. Place the end of the mechanism;

[0044] 5. First piezoelectric motor; 51. First stator; 52. First mover;

[0045] 6. Second piezoelectric motor; 61. Second stator; 62. Second mover;

[0046] 7. Piezoelectric displacement device controller; 8. Motion control system. DETAILED DESCRIPTION

[0047] The principles and features of the present invention are described below with reference to the accompanying drawings. The examples given are only used to explain the present invention and are not used to limit the scope of the present invention.

[0048] like Figure 1 、 Figure 2 As shown, the vibration suppression device for a hybrid bonding device of the present invention is installed between the front end 1 of the placement mechanism and the end 4 of the placement mechanism of the hybrid bonding device; the vibration suppression device includes a first vibration component 2, a second vibration component 3 and a piezoelectric vibration driving device; the first vibration component 2 and the second vibration component 3 are arranged in a stacked manner; the piezoelectric vibration driving device includes a first piezoelectric motor 5 and a second piezoelectric motor 6; the first vibration component 2 and the second vibration component 3 can drive the end 4 of the placement mechanism to vibrate along the first direction and the second direction respectively.

[0049] The vibration suppression device for hybrid bonding equipment of the present invention is arranged between the front end 1 and the end 4 of the placement mechanism of the existing hybrid bonding equipment. The piezoelectric vibration driving device and the vibration component cooperate to enable the vibration component to vibrate in a specified direction; by respectively arranging vibration components that can vibrate in two directions, the vibration characteristic information of the placement mechanism obtained can be decomposed, so that the vibration suppression device can better actively offset the vibration without waiting for the vibration to decay to the target accuracy requirement. This effectively shortens the time for the hybrid bonding equipment to place the chip to the target position, and improves the production efficiency of the hybrid bonding equipment.

[0050] The piezoelectric vibration driving device of the present invention can obtain the motion information of the placement device through the control element, and the control element can be set independently or integrated into the motion control system of the hybrid bonding equipment. In this way, there is no need to install additional external sensors to check the vibration of the end mechanism, and the stability is better.

[0051] Specifically, based on the motion parameter characteristics of the hybrid bonding device's motion control system when controlling the placement mechanism to move toward the target position, the control element can calculate information such as the amplitude and frequency of the vibration caused by the current actual motion, and send it to the piezoelectric vibration drive device in the form of a voltage signal, causing it to generate a vibration mode opposite to the vibration displacement of the placement mechanism, thereby offsetting the vibration of the placement mechanism. For different motion direction and motion speed parameters, the control element will adaptively generate different voltage signals and act on the piezoelectric vibration drive device to offset the vibration. This can greatly improve the placement accuracy of the placement mechanism end 4 in the hybrid bonding device and can shorten the placement time, thereby improving the production efficiency of the hybrid bonding device.

[0052] Preferably, the first vibration component 2 includes a first fixed seat 21 and a first slider 22, the first slider 22 is slidably connected to the first fixed seat 21, and can move in a first direction relative to the first fixed seat 21; the second vibration component 3 includes a second fixed seat 31 and a second slider 32, the second slider 32 is slidably connected to the second fixed seat 31, and can move in a second direction relative to the second fixed seat 31; the first fixed seat 21 is fixedly connected to the front end 1 of the placement mechanism, the first slider 22 is fixedly connected to the second fixed seat 31, and the second slider 32 is fixedly connected to the end 4 of the placement mechanism; in the above structure, the slider and the fixed seat are slidably connected, which can achieve stable vibration, and the first slider 22 moves in the first direction, which can drive the second fixed seat 31, the second slider 32 and the end 4 of the placement mechanism to move in the first direction at the same time, and the second slider 32 moves in the second direction, which can drive the end 4 of the placement mechanism to move in the second direction. In this way, the end 4 of the placement mechanism can achieve movement in the first direction and the second direction, making it more accurate and flexible in suppressing vibration.

[0053] The sliding connection between the slider and the fixed seat can be achieved through various structures, such as slide rails, slide grooves, etc.

[0054] In one embodiment of the present invention, the upper wall of the first fixed seat 21 is fixedly connected to the lower side of the front end 1 of the placement mechanism; the lower wall and two side walls of the first fixed seat 21 are open, and the open two side walls are two side walls in the first direction. A first hollow slide groove is provided in the first fixed seat 21, and the first slider 22 is slidably connected to the first hollow slide groove, and the lower side of the first slider 22 is fixedly connected to the second fixed seat 31; the first slider 22 is slidably connected to the first hollow slide groove, which can enable the first slider 22 to have good stability when sliding, and the lower wall of the first fixed seat 21 is open, allowing the first slider 22 to be fixedly connected to the second fixed seat 31, and the two side walls of the first fixed seat 21 are open, allowing the first slider 22 to extend and retract during vibration.

[0055] Preferably, the first piezoelectric motor 5 includes a first stator 51 and a first mover 52, and the first mover 52 can vibrate back and forth along the first direction relative to the first stator 51; the first stator 51 is fixed on the first fixed seat 21, and the first mover 52 is fixed on the first slider 22; in this way, when the first mover 52 vibrates back and forth along the first direction, it can drive the first slider 22 to vibrate back and forth synchronously.

[0056] It should be noted that, in theory, a limiting device can be provided on the first slider 22 and / or the first fixed seat 21 to prevent the first slider 22 from vibrating excessively and thereby detaching from the first fixed seat 21. Such a limiting device can employ various conventional structures depending on the actual situation. However, in actual use, because the vibration amplitude of the placement mechanism is often very small and the dimensions of the first slider 22 and the first fixed seat 21 are sufficiently large, even without a limiting device, the problem of sliding or detaching will not occur. To simplify the structure, the limiting device can be omitted.

[0057] The specific structure of the second fixing seat 31 and the second sliding block 32 can be the same as or different from the specific structure of the sliding fit between the first fixing seat 21 and the first sliding block 22. In one embodiment of the present invention, the two are the same, and the specific structure is as follows:

[0058] Preferably, the lower wall and two side walls of the second fixed seat 31 are open, the open two side walls are the two side walls in the second direction, and a second hollow slide groove is provided in the second fixed seat 31; the second slider 32 is slidingly connected to the second hollow slide groove, and the lower side of the second slider 32 is fixedly connected to the end 4 of the placement mechanism.

[0059] Preferably, the second piezoelectric motor 6 includes a second stator 61 and a second mover 62 , and the second mover 62 can vibrate back and forth along the second direction relative to the second stator 61 ; the second stator 61 is fixed on the second fixing seat 31 , and the second mover 62 is fixed on the second slider 32 .

[0060] The effect of the above structure is the same as the effect of the specific structure of the first fixing seat 21 and the first sliding block 22 .

[0061] Preferably, the longitudinal sections of the first hollow chute and the second hollow chute of the present invention are both T-shaped; the hollow chute using this structure can enable more stable sliding, and the two sides of the slider are included in the upper part of the T-shape. At the same time, the slider can be well fixedly connected to the second fixed seat 31 or the end 4 of the placement mechanism through the lower part of the T-shape.

[0062] Preferably, in the present invention, on the horizontal plane, the straight line where the first direction is located and the straight line where the second direction is located are perpendicular to each other; setting the first direction and the second direction to be orthogonal can simplify the calculation process and make the decomposed vibration information more accurate and scientific.

[0063] The hybrid bonding equipment of the present invention includes the vibration suppression device as described above.

[0064] The hybrid bonding method of the present invention uses the above-mentioned device to perform hybrid bonding on media of at least two materials; the method includes the step of aligning and bonding the media of the two materials, and the aligning and bonding step is as follows:

[0065] The control element acquires and processes the motion signal of the placement mechanism to obtain vibration signals along the first direction and the second direction;

[0066] The control element controls the first piezoelectric motor 5 and the second piezoelectric motor 6 to vibrate according to the vibration signal, drives the first vibration component 2 and the second vibration component 3 to slide, drives the placement mechanism end 4 to vibrate and offset the vibration along the first direction and the second direction.

[0067] Preferably, the vibration signal includes vibration frequency, amplitude and attenuation law.

[0068] The placement mechanism end 4, located at the end of the vertical direction (Z direction), generates a vibration after moving into position in the first direction (X direction) and the second direction (Y direction). The frequency, initial phase angle, and amplitude of this vibration can be predicted by the hybrid bonding device's motion control system 8, which collects the feedback position of the hybrid bonding device's grating scale in the X and Y directions when adjusting the X and Y-direction vibrations. Simultaneously, the piezoelectric displacement device controller 7 drives the first piezoelectric motor 5 and the second piezoelectric motor 6, installed between the placement mechanism front end 1 in the Z direction and the placement mechanism end 4, to generate a vibration waveform in the X and Y directions, respectively, with a certain phase angle difference from the aforementioned vibration. This vibration offsets the vibration of the placement mechanism end 4 (i.e., the chip placement head), thereby improving the efficiency and accuracy of hybrid bonding.

[0069] Among them, "tuning" is a professional term or idiom in motion control. It refers to the final stage of the motion control system controlling the motion device to move to the theoretically specified position. The motion device will not immediately reach the position and stop accurately at the theoretically specified position. There will be a certain error between the actual position of the motion device and the theoretically specified position (i.e., the in-position error). At this time, the motion control system will enter the error correction stage (i.e., the tuning stage), and use control principles such as PID control to adjust the in-position error to within the target range.

[0070] Typically, a position feedback device, such as a grating ruler, detects the actual position of the motion device. Adjustments are made when the feedback position differs from the theoretically specified position. Specifically, if the feedback position is further than the theoretically specified position, the motion control system 8 controls the motion device to adjust back. If the feedback position does not reach the theoretically specified position, the motion control system 8 controls the motion device to continue moving. If continued movement exceeds the theoretically specified position, the adjustment is continued. Through repeated adjustments, the error is eventually brought within the required range.

[0071] However, the error during the "setting" period is only reflected in the position of the grating scale. Even after the setting is completed, the placement mechanism end 4 may still experience jitter due to structural rigidity and other reasons. The error caused by this jitter is still large and will have a significant impact on the processing accuracy of the equipment. This jitter cannot be adjusted during the setting process. In the existing technology, it is necessary to wait for the placement mechanism end 4 to naturally stabilize. In addition, the initial jitter generated when the movement is in place will also affect the setting process and increase the setting time.

[0072] The hybrid bonding method of the present invention can drive two motors through the piezoelectric displacement device controller 7 to actively offset the jitter of the placement mechanism end 4 generated after it is in place, without waiting for the vibration to decay to the target accuracy requirement, thereby shortening the time it takes for the hybrid bonding equipment to place the chip to the target position and improving the production efficiency of the hybrid bonding equipment.

[0073] The device and method of the present invention are described in detail below through specific embodiments.

[0074] Example

[0075] In this embodiment, the straight line where the first direction is located and the straight line where the second direction is located are perpendicular to each other and are respectively defined as the X direction and the Y direction. The control element is a piezoelectric displacement device controller 7 .

[0076] The first piezoelectric motor 5 and the second piezoelectric motor 6 are connected to the piezoelectric displacement device controller 7 via wires. The piezoelectric displacement device controller 7 is integrated into the motion control system 8 of the hybrid bonding device via a network cable using EtherCAT industrial bus communication.

[0077] The specific working process of this embodiment is as follows:

[0078] When the motion control system of the hybrid bonding device controls the placement mechanism of the hybrid bonding device to perform chip placement movement, the piezoelectric displacement device controller 7 obtains motion parameters such as acceleration feedforward when the placement mechanism is in place from the motion control system and calculates the frequency, amplitude and attenuation law of the vibration generated after the placement mechanism moves into place in combination with empirical parameters.

[0079] Then, according to the direction of movement, the piezoelectric displacement device controller 7 decomposes the vibration into vibrations in the X and Y directions, thereby generating two voltage signals with the same frequency, opposite amplitude, and the same attenuation law as the vibration, and outputs them to the X-direction piezoelectric motor and the Y-direction piezoelectric motor respectively.

[0080] After the first piezoelectric motor 5 receives the voltage signal, the first mover 52 will generate a corresponding displacement in the X direction, thereby pushing the first slider 22 to generate a corresponding displacement. The first slider 22 drives the second fixed seat 31, the second slider 32 and the placement mechanism end 4 as a whole to generate a corresponding displacement in the X direction.

[0081] After the second piezoelectric motor 6 receives the voltage signal, the second mover 62 will generate a corresponding displacement in the Y direction, thereby pushing the second slider 32 to generate a corresponding displacement, and the second slider 32 drives the placement mechanism end 4 to generate a corresponding displacement in the Y direction.

[0082] In this way, after the displacements of the end 4 of the placement mechanism in the X and Y directions are superimposed, its displacement has exactly the same frequency and opposite amplitude as the vibration generated after the placement mechanism is in place, and the attenuation law is consistent, thereby achieving the effect of suppressing the vibration of the placement mechanism in place.

[0083] In the description of the present invention, it should be noted that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0084] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "plurality" means at least two, such as two, three, etc., unless otherwise specifically defined.

[0085] In the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Furthermore, a first feature being "above," "above," and "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is at a higher level than the second feature. A first feature being "below," "below," and "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0086] In the description of this specification, the reference terms "one embodiment," "some embodiments," "example," "specific example," or "some examples" mean that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in this specification and features of different embodiments or examples without contradiction.

[0087] In the description of the present invention, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed, detachable, or integral connections; mechanical or electrical connections; direct or indirect connections through an intermediate medium; and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on the specific circumstances.

[0088] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A vibration suppression device for hybrid bonding equipment, characterized in that: The vibration suppression device is installed between the front end (1) and the rear end (4) of the placement mechanism of the hybrid bonding device; the vibration suppression device comprises a first vibration component (2), a second vibration component (3) and a piezoelectric vibration driving device; The first vibration component (2) and the second vibration component (3) are arranged in a stacked manner; the piezoelectric vibration driving device comprises a first piezoelectric motor (5) and a second piezoelectric motor (6); The first vibration component (2) and the second vibration component (3) drive the placement mechanism end (4) to vibrate in a first direction and a second direction respectively.

2. A vibration suppression device for hybrid bonding equipment according to claim 1, characterized in that: The first vibration component (2) comprises a first fixed seat (21) and a first slider (22), wherein the first slider (22) is slidably connected to the first fixed seat (21) and moves relative to the first fixed seat (21) along the first direction; The second vibration component (3) comprises a second fixed seat (31) and a second slider (32), wherein the second slider (32) is slidably connected to the second fixed seat (31) and moves relative to the second fixed seat (31) along the second direction; The first fixing seat (21) is fixedly connected to the front end (1) of the placement mechanism, the first sliding block (22) is fixedly connected to the second fixing seat (31), and the second sliding block (32) is fixedly connected to the rear end (4) of the placement mechanism.

3. The vibration suppression device for hybrid bonding equipment according to claim 2, characterized in that: The upper wall of the first fixing seat (21) is fixedly connected to the lower side of the front end (1) of the placement mechanism; the lower wall and two side walls of the first fixing seat (21) are open, and the open two side walls are the two side walls in the first direction, and a first hollow sliding groove is provided in the first fixing seat (21); The first sliding block (22) is slidably connected to the first hollow sliding groove, and the lower side of the first sliding block (22) is fixedly connected to the second fixing seat (31); The first piezoelectric motor (5) comprises a first stator (51) and a first mover (52), wherein the first mover (52) reciprocates relative to the first stator (51) along the first direction; the first stator (51) is fixed on the first fixing seat (21), and the first mover (52) is fixed on the first slider (22).

4. The vibration suppression device for hybrid bonding equipment according to claim 3, characterized in that: The lower wall and two side walls of the second fixing seat (31) are open, and the open two side walls are two side walls in the second direction. A second hollow sliding groove is provided in the second fixing seat (31); The second slider (32) is slidably connected to the second hollow slide groove, and the lower side of the second slider (32) is fixedly connected to the end (4) of the placement mechanism; The second piezoelectric motor (6) includes a second stator (61) and a second mover (62), and the second mover (62) reciprocates along the second direction relative to the second stator (61); the second stator (61) is fixed on the second fixing seat (31), and the second mover (62) is fixed on the second slider (32).

5. The vibration suppression device for hybrid bonding equipment according to claim 4, characterized in that: The longitudinal sections of the first hollow chute and the second hollow chute are both T-shaped.

6. The vibration suppression device for hybrid bonding equipment according to any one of claims 1 to 5, characterized in that: On a horizontal plane, a straight line including the first direction and a straight line including the second direction are perpendicular to each other.

7. A hybrid bonding device, characterized in that: The vibration suppression device according to any one of claims 1 to 6 further comprises a control element, wherein the control element is connected to the piezoelectric vibration driving device circuit.

8. A hybrid bonding method, characterized in that The device according to claim 7 is used to perform mixed bonding on media of at least two materials.

9. A hybrid bonding method according to claim 8, characterized in that: The method includes aligning and bonding two dielectric materials, wherein the aligning and bonding steps are: The control element acquires and processes the motion signal of the placement mechanism to obtain vibration signals along the first direction and the second direction; The control element controls the vibration of the first piezoelectric motor (5) and the second piezoelectric motor (6) respectively according to the vibration signal, drives the first vibration component (2) and the second vibration component (3) to slide, drives the placement mechanism end (4) to vibrate and offsets the vibration along the first direction and the second direction.

10. A hybrid bonding method according to claim 9, characterized in that: The vibration signal includes vibration frequency, amplitude and attenuation law.

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