Brilliant wire clamp for positioning semiconductor chip

Abstract

The invention relates to the technical field of chip positioning and welding, and discloses a brilliant wire clamp for positioning a semiconductor chip, the brilliant wire clamp comprises a base, the top end of the base is fixedly provided with a first electric push rod, and the top end of the first electric push rod is fixedly provided with a pedestal. The rotatable outer shell is arranged, the multiple clamping assemblies used for clamping the chips are evenly arranged on the outer shell, the chips are stored through the feeding and storing structure, then the clamping assemblies are driven to rotate one by one through rotation of the outer shell, and the stored chips are clamped and rotated to the lower portion through the clamping assemblies; and then the lower chip welding plate moves in a two-dimensional plane, so that the position needing to be welded is moved to the position under the outer shell, then the angle and direction of the chip are adjusted through rotation of the clamping assembly, rapid and effective positioning and subsequent welding are achieved, and the chip welding production efficiency is greatly improved.

Description

Technical Field

[0001] The present invention relates to the technical field of chip positioning and soldering, and specifically relates to a wire bonding fixture for semiconductor chip positioning. Background Art

[0002] A semiconductor chip is etched and wired on a semiconductor wafer to form a semiconductor device that can achieve a certain function. Existing semiconductor chips need to be encapsulated during the production process. The main purpose is to solder various chips to a chip socket correspondingly to achieve more functions of the chips in the future. However, there are still some problems with the soldering and chip clamping and adjusting devices used in the existing chip soldering process, which are as follows: Existing chip positioning and clamping adjustment need to be achieved by a manipulator. The structure and operation control system of the manipulator are complex, and the cost of the entire device is very high. Moreover, the manipulator needs to move back and forth when clamping the chip, which will inevitably lead to a decrease in production efficiency. And each time it needs to be repositioned, the efficiency will be further reduced, and it is impossible to achieve fast and efficient chip positioning and soldering. For this reason, we propose a wire bonding fixture for semiconductor chip positioning. Summary of the Invention

[0003] The present invention provides a wire bonding fixture for semiconductor chip positioning, which has the advantages of good positioning effect and high production efficiency, and solves the problems raised in the above background art.

[0004] The present invention provides the following technical solution: A wire bonding fixture for semiconductor chip positioning, including a base, a first electric push rod is fixedly installed at the top of the base, a base is fixedly installed at the top of the first electric push rod, a column is fixedly installed at the top of the base, a feeding and storage structure is installed at the top of the column, a base plate seat is fixedly installed on one side of the base, a first motor is fixedly installed at one end of the base plate seat, an outer housing is rotatably installed at the other end of the base plate seat, a driving transmission component is embedded and movably installed on the outer housing, a clamping component is movably installed at the top of the driving transmission component, a limiting component is fixedly installed on the driving transmission component, a central gear disk is movably installed inside the outer housing, a conduction component is movably installed inside the outer housing, a seat body is fixedly installed at one end of the conduction component, a second motor is fixedly installed on one side outside the outer housing, a supporting component is fixedly installed inside the outer housing, a clamping component is movably installed in the outer housing, a conduction gear is movably installed inside the outer housing, and a first electromagnet is fixedly installed inside the outer housing; The driving and transmission component includes an outer sleeve, a central rod is movably installed inside the outer sleeve, a first gear is fixedly installed at one end of the central rod, a first magnetic ring is fixedly installed on one side of the first gear, a second gear is fixedly installed outside the outer sleeve, a top plate is fixedly installed at one end of the outer sleeve, and a third gear is fixedly installed at one end of the central rod; The clamping component includes a positioning collar, a driving rack is embedded and movably installed inside the positioning collar, a clamping end is fixedly installed at the end of the driving rack, and a pressure sensor is installed on the clamping end; The limiting component includes a base block, a plurality of inner grooves are formed in the base block, and limiting clamping members are movably installed inside the inner grooves; The conduction component includes a base ring, a ring gear is rotatably installed on one side of the base ring, and a second electric push rod is fixedly installed on the other side of the base ring; The supporting component includes a supporting bracket, and a third electric push rod is fixedly installed at one end of the supporting bracket; The clamping and fixing component includes a clamping ring, extension rods are arranged on both sides of the clamping ring, a top block is arranged at the end of the extension rod, a vertical plate is fixedly installed at the top of the extension rod, and a second spring is fixedly installed on one side of the vertical plate.

[0005] In a preferred embodiment, the outer housing is fixedly connected to the output shaft of the first motor, the outer housing is rotatably arranged relative to the base disk seat, the central gear disk is fixedly connected to the output shaft of the second motor, and the conduction gear is meshed with the central gear disk and the conduction component.

[0006] In a preferred embodiment, the driving and transmission components are uniformly arranged in a ring on the outer housing, the driving and transmission components penetrate through the inner and outer sides of the outer housing and are movably arranged, and the clamping and fixing component is embedded and movably installed at the position where the driving and transmission component is located inside the outer housing.

[0007] In a preferred embodiment, the outer sleeve is rotatably and movably connected in the outer housing, the central rod is rotatably installed inside the outer sleeve, and a limiting rib is arranged at the telescopic end of the central rod. Both the first gear and the second gear are made of non-metallic materials. The first electromagnet is arranged between the first magnetic ring and the clamping and fixing component. The third gear is located on the upper surface of the top plate and is meshed with the clamping component.

[0008] In a preferred embodiment, the positioning collar is fixedly installed on the upper surface of the top plate, the driving rack is L-shaped, and a tooth groove is arranged at one end, and the tooth groove is meshed with the third gear. A clamping buffer sponge is arranged on the clamping end.

[0009] In a preferred embodiment, the central height of the inner groove is the same as the height of the upper surface of the driving rack, and it is symmetrically opened in the upper and lower directions. The limiting clamping member is slidably arranged up and down in the inner groove. An electromagnetic strip is arranged at the bottom end inside the base block, and a magnetic strip is arranged at the bottom of the limiting clamping member.

[0010] In a preferred embodiment, the limiting clamping member includes an outer sleeve. A telescopic rod is fixedly installed inside the outer sleeve. One end of the telescopic rod is fixedly installed with a clamping block. One end of the clamping block is fixedly installed with a first spring. One end of the outer sleeve is provided with a convex block which is slidably arranged in the inner groove. A permanent magnetic strip is fixedly connected to the bottom ends of a plurality of the outer sleeves integrally. The other end of the clamping block is fixedly connected inside the outer sleeve. The end of the clamping block is provided with an inclined surface structure, and a plurality of clamping grooves are opened on one side of the driving rack in contact with the clamping block, and the clamping block is clamped with the clamping grooves.

[0011] In a preferred embodiment, tooth grooves are annularly opened on the side surface of the ring gear. One end of the second electric push rod is fixedly installed on the seat body, and the ring gear can be disengaged and engaged with the second gear.

[0012] In a preferred embodiment, the supporting bracket is fixedly installed inside the outer shell. The third electric push rod is electrically connected to the pressure sensor on the clamping end. When the pressure sensor detects that the pressure exceeds the set threshold value, it will start to extend.

[0013] In a preferred embodiment, the clamping ring is a semi-circular ring structure. A clamping ring groove is opened on the outside of the outer sleeve at the position where the clamping ring is located. The top block is slidably arranged inside the outer shell. A permanent magnet is arranged at one end of the top block facing the second gear, and the magnetic pole of the permanent magnet is the same as that of the opposite surface of the first gear. One end of the second spring is fixedly installed inside the outer shell.

[0014] The present invention has the following beneficial effects: 1. For the wire bonding fixture for semiconductor chip positioning, by providing a rotatable outer shell, a plurality of clamping components for clamping chips are uniformly arranged on the outer shell. In this way, the chips are stored by using the feeding and storage structure, and then the rotation of the outer shell drives the clamping components to rotate one by one, and the chips stored therein are clamped by the clamping components and rotated to the lower part. Then, the chip welding plate below performs two-dimensional plane movement, so that the position to be welded is moved to directly below the outer shell. Then, the angle and direction of the chip are adjusted by the rotation of the clamping components, realizing rapid and effective positioning and subsequent welding, and greatly improving the efficiency of chip welding production.

[0015] 2. The wire clamp for semiconductor chip positioning is provided with a central gear disk and a conduction component. Driven by the second motor, the central gear disk can be rotated. Through the conduction gear arranged between the central gear disk and the conduction component, the two can be driven to conduct reverse rotation. Furthermore, when the drive transmission component rotates to the upper and lower ends, the internal electromagnetic component is combined to adjust and control the position, so as to realize the control of the clamping force of the clamping component on the chip, and the adjustment and control of the direction angle when the chip is placed on the welding plate when rotating to the lower part, thereby ensuring the reliability and use efficiency of the structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 is a first three-dimensional structural schematic diagram of the present invention; Figure 2 is a second three-dimensional structural schematic diagram of the present invention; Figure 3 is a partial internal three-dimensional structural schematic diagram of the present invention; Figure 4 for the present invention Figure 3 front structural schematic diagram; Figure 5 for the present invention Figure 3 internal partial three-dimensional structural schematic diagram; Figure 6 is a partial three-dimensional structural schematic diagram of the present invention; Figure 7 is a three-dimensional structural schematic diagram of the conduction component of the present invention; Figure 8 is a three-dimensional structural schematic diagram of the limit component of the present invention; Figure 9 is a three-dimensional structural schematic diagram of the limit card part of the present invention.

[0017] In the figure: 1, base; 2, first electric push rod; 3, base; 4, column; 5, feeding and storage structure; 6, base plate seat; 7, first motor; 8, outer housing; 9, drive transmission assembly; 91, outer sleeve; 92, central rod; 93, first gear; 94, first magnetic ring; 95, second gear; 96, top plate; 97, third gear; 10, clamping assembly; 101, positioning collar; 102, drive rack; 103, clamping end; 11, limiting assembly; 111, base block; 112, inner groove; 113, limiting clamping part; 1131, outer sleeve part; 1132, telescopic rod; 1133, clamping block; 1134, first spring; 12, central gear disk; 13, conduction assembly; 131, base ring; 132, ring teeth; 133, second electric push rod; 14, seat body; 15, second motor; 16, supporting assembly; 161, supporting bracket; 162, third electric push rod; 17, clamping and fixing assembly; 171, clamping ring; 172, extension rod; 173, top block; 174, vertical plate; 175, second spring; 18, conduction gear; 19, first electromagnet. Detailed implementation manner

[0018] Next, the technical solutions in the present invention will be clearly and completely described in conjunction with the accompanying drawings in the present invention. In addition, the forms of each structure described in the following embodiments are only examples. The wire bonding fixture for semiconductor chip positioning involved in the present invention is not limited to the structures described in the following embodiments. All other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the scope of protection of the present invention.

[0019] Please refer to Figures 1-5 , a wire bonding fixture for semiconductor chip positioning, including a base 1, a first electric push rod 2 is fixedly installed at the top end of the base 1, a base 3 is fixedly installed at the top end of the first electric push rod 2, a column 4 is fixedly installed at the top end of the base 3, a feeding and storage structure 5 is installed at the top end of the column 4, a base plate seat 6 is fixedly installed on one side of the base 3, a first motor 7 is fixedly installed at one end of the base plate seat 6, an outer housing 8 is rotatably installed at the other end of the base plate seat 6, a drive transmission assembly 9 is embedded and movably installed on the outer housing 8, a clamping assembly 10 is movably installed at the top end of the drive transmission assembly 9, a limiting assembly 11 is fixedly installed on the drive transmission assembly 9, a central gear disk 12 is movably installed inside the outer housing 8, a conduction assembly 13 is movably installed inside the outer housing 8, a seat body 14 is fixedly installed at one end of the conduction assembly 13, a second motor 15 is fixedly installed on one side of the outside of the outer housing 8, a supporting assembly 16 is fixedly installed inside the outer housing 8, a clamping and fixing assembly 17 is movably installed in the outer housing 8, a conduction gear 18 is movably installed inside the outer housing 8, and a first electromagnet 19 is fixedly installed inside the outer housing 8; Compared with the prior art, in the present application, a rotatable outer housing 8 is provided, and a plurality of clamping components 10 for clamping chips are uniformly arranged on the outer housing 8. In this way, the chip storage structure 5 is used to store the chips, and then the rotation of the outer housing 8 drives the clamping components 10 to rotate one by one, and the chips stored therein are clamped and rotated to the lower part by the clamping components 10. Then, the chip welding plate below moves in a two-dimensional plane, so that the position to be welded moves to directly below the outer housing 8. Then, the angle and direction of the chip are adjusted by the rotation of the clamping component 10, realizing rapid and effective positioning and subsequent welding, greatly improving the efficiency of chip welding production. At the same time, by providing a central gear disk 12 and a transmission component 13, the rotation of the central gear disk 12 can be driven by the drive of the second motor 15, and the transmission gear 18 provided between the central gear disk 12 and the transmission component 13 can drive the two to conduct reverse rotation, so that the drive transmission component 9 combines the internal electromagnetic component to adjust and control the position when rotating to the upper and lower ends, realizing the control of the clamping force of the clamping component 10 on the chip, and the adjustment and control of the direction and angle of placing the chip on the welding plate when rotating to the lower part, thereby ensuring the reliability and use efficiency of the structure.

[0020] Please refer to Figures 1-3 , a wire bonding fixture for semiconductor chip positioning, comprising an outer housing 8, the outer housing 8 is fixedly connected to the output shaft of the first motor 7, the outer housing 8 is rotatably arranged relative to the base plate seat 6, the central gear disk 12 is fixedly connected to the output shaft of the second motor 15, and the transmission gear 18 is meshed with the central gear disk 12 and the transmission component 13; In this embodiment, it should be noted that the drive of the first motor 7 can drive the outer housing 8 and all the internal structures to rotate as a whole, so as to realize the rotation of the plurality of clamping components 10 arranged thereon one by one for chip clamping and placing, improving production efficiency. And the second motor 15 can drive the central gear disk 12 to rotate, and then the transmission component 13 can be driven to rotate by the transmission gear 18, and the central gear disk 12 and the transmission component 13 rotate in opposite directions, so as to realize the driving effects in different directions on the drive transmission component 9 and the structures thereon, so as to realize chip clamping and placing.

[0021] Please refer to Figures 1-4 , a wire bonding fixture for semiconductor chip positioning, comprising a drive transmission component 9, the drive transmission component 9 is annularly and uniformly arranged on the outer housing 8, the drive transmission component 9 is movably arranged through the inner and outer sides of the outer housing 8, and the clamping component 17 is embedded and movably installed at the position where the drive transmission component 9 is located inside the outer housing 8; In this embodiment, it should be noted that when the entire driving transmission component 9 needs to be rotated, the magnetic pole direction of the first electromagnet 19 can be changed by controlling the energization direction, so that the clamping component 17 is opened to release the clamping restriction on the driving transmission component 9, thereby ensuring the normal rotation adjustment of the driving transmission component 9. After the adjustment is completed, the magnetic pole can be switched by changing the current direction in the first electromagnet 19, thereby ensuring the stability of the driving transmission component 9 after the adjustment is completed. In this way, it can be ensured that the chip clamped by the clamping component 10 can be accurately placed on the welding pad and the adjustment flexibility when picking up a new chip.

[0022] Please refer to Figures 1-6 , a wire bonding fixture for semiconductor chip positioning, including a driving transmission component 9. The driving transmission component 9 includes an outer sleeve 91. A central rod 92 is movably installed inside the outer sleeve 91. One end of the central rod 92 is fixedly installed with a first gear 93. One side of the first gear 93 is fixedly installed with a first magnetic ring 94. A second gear 95 is fixedly installed outside the outer sleeve 91. One end of the outer sleeve 91 is fixedly installed with a top plate 96. One end of the central rod 92 is fixedly installed with a third gear 97; In this embodiment, it should be noted that the outer sleeve 91 is rotatably connected in the outer housing 8, the central rod 92 is rotatably installed inside the outer sleeve 91, and a limiting rib is provided at the telescopic end of the central rod 92. Both the first gear 93 and the second gear 95 are made of non-metallic materials. The first electromagnet 19 is arranged between the first magnetic ring 94 and the clamping component 17. The third gear 97 is meshed with the clamping component 10 on the upper surface of the top plate 96. In this way, the first gear 93 rotated above the outer housing 8 will naturally fall to be meshed with the central gear disk 12, and then drive the first gear 93 to rotate by means of the rotation of the central gear disk 12, and then drive the third gear 97 to rotate inside the outer sleeve 91, so that the clamping component 10 can clamp the chip. With the presence of the limiting component 11, it can ensure the stable clamping of the chip even after the first gear 93 disengages from the central gear disk 12. When the second gear 95 rotated below the outer housing 8 needs to adjust the direction of the chip, the conduction component 13 can be meshed with the second gear 95, and then drive the outer sleeve 91 and its whole to rotate, thus realizing the adjustable applicability of the fixture.

[0023] Please refer to Figures 4-6 , a wire bonding fixture for semiconductor chip positioning, including a clamping component 10. The clamping component 10 includes a positioning collar 101. A driving rack 102 is embedded and movably installed inside the positioning collar 101. A clamping end 103 is fixedly installed at the end of the driving rack 102. A pressure sensor is installed on the clamping end 103; In this embodiment, it should be noted that the positioning collar 101 is fixedly installed on the upper surface of the top plate 96. The driving rack 102 is L-shaped, and a tooth groove is provided at one end. The tooth groove meshes with the third gear 97. A clamping buffer sponge is provided on the clamping end 103. In this way, the rotation of the third gear 97 can drive the lateral movement of the driving rack 102, and then drive the clamping ends 103 on both sides to move in the same or opposite directions, so as to clamp and release the chip.

[0024] Please refer to Figures 6-8 , a wire bonding fixture for semiconductor chip positioning, including a limiting component 11. The limiting component 11 includes a base block 111. A plurality of inner grooves 112 are formed in the base block 111, and limiting clamping members 113 are movably installed inside the inner grooves 112; In this embodiment, it should be noted that the central height of the inner groove 112 is the same as the height of the upper surface of the driving rack 102, and is symmetrically opened in the up and down direction. The limiting clamping member 113 is slidably arranged up and down in the inner groove 112. An electromagnetic strip is provided at the bottom end inside the base block 111, and a magnetic strip is provided at the bottom of the limiting clamping member 113. In this way, the limiting clamping member 113 above the outer shell 8 can fall by its own weight to limit the driving rack 102. During the subsequent rotation process and after rotating to the lowest position, the limiting clamping member 113 can be adsorbed and limited by the electromagnetic strip inside the base block 111 to ensure the limitation of the driving rack 102. When the limitation needs to be released, the current in the electromagnetic strip is changed to change the magnetic pole direction to realize the reverse movement of the limiting clamping member 113 and release the limitation on the driving rack 102, so as to realize the release of the chip clamped by the clamping component 10.

[0025] Please refer to Figures 8-9 , a wire bonding fixture for semiconductor chip positioning, including a limiting clamping member 113. The limiting clamping member 113 includes an outer sleeve 1131. A telescopic rod 1132 is fixedly installed inside the outer sleeve 1131. One end of the telescopic rod 1132 is fixedly installed with a clamping block 1133, and one end of the clamping block 1133 is fixedly installed with a first spring 1134; In this embodiment, it should be noted that one end of the outer sleeve 1131 is provided with a convex block which is slidably arranged in the inner groove 112. The bottom ends of a plurality of outer sleeves 1131 are fixedly connected with a permanent magnet strip integrally. The other end of the clamping block 1133 is fixedly connected inside the outer sleeve 1131. The end of the clamping block 1133 is provided with an inclined surface structure, and a plurality of clamping grooves are formed on one side of the driving rack 102 in contact with the clamping block 1133. The clamping grooves are clamped with the clamping block 1133. In this way, when one side of the driving rack 102 is clamped to the clamping block 1133, its position can be limited, thereby realizing the effective clamping of the chip. After the chip is lowered, the overall movement of the limit clamping member 113 can be realized through the conversion of the magnetic pole, so as to ensure that the driving rack 102 can be opened to facilitate the next movement and clamping of the chip.

[0026] Please refer to Figures 4-7 , a wire bonding fixture for semiconductor chip positioning, including a conduction component 13. The conduction component 13 includes a base ring 131. A ring gear 132 is rotatably installed on one side of the base ring 131, and a second electric push rod 133 is fixedly installed on the other side of the base ring 131; In this embodiment, it should be noted that tooth grooves are annularly formed on the side surface of the ring gear 132. One end of the second electric push rod 133 is fixedly installed on the seat body 14. The ring gear 132 can be disengaged and engaged with the second gear 95. In this way, when the chip needs to be lowered, the ring gear 132 can be driven by the second electric push rod 133 to approach and engage with the second gear 95, and then the outer sleeve 91 can be driven to rotate for adjustment. After the adjustment is completed, the base ring 131 can be pulled by the second electric push rod 133 in the direction where the original second gear 95 is located to separate the two. However, the ring gear 132 can be engaged with the moved first gear 93 for rotational adjustment, thereby realizing the operation of loosening and lowering the chip.

[0027] Please refer to Figures 3-5 , a wire bonding fixture for semiconductor chip positioning, including a supporting component 16. The supporting component 16 includes a supporting bracket 161. A third electric push rod 162 is fixedly installed at one end of the supporting bracket 161; In this embodiment, it should be noted that the supporting bracket 161 is fixedly installed inside the outer housing 8. The third electric push rod 162 is electrically connected to the pressure sensor on the clamping end 103. When the pressure sensor detects that the pressure exceeds the set threshold, it will start to extend. In this way, it can be ensured that the clamping force of the clamping end 103 on the chip is not too large to ensure the integrity of the chip.

[0028] Please refer to Figures 5-6, A wire bonding fixture for semiconductor chip positioning, including a clamping component 17. The clamping component 17 includes a clamping ring 171. Extension rods 172 are arranged on both sides of the clamping ring 171. A top block 173 is arranged at the end of the extension rod 172. A vertical plate 174 is fixedly installed at the top of the extension rod 172. A second spring 175 is fixedly installed on one side of the vertical plate 174; In this embodiment, it should be noted that the clamping ring 171 is a semi-circular ring structure. A clamping ring groove is provided at the position where the outer clamping ring 171 is located on the outside of the outer sleeve 91. The top block 173 is slidably arranged inside the outer housing 8. A permanent magnet is arranged at one end of the top block 173 facing the second gear 95, and the magnetic pole of this permanent magnet is the same as that of the first gear 93 on its opposite side. One end of the second spring 175 is fixedly installed inside the outer housing 8. In this way, the magnetic attraction effect on the top block 173 or the first magnetic ring 94 can be realized through the magnetic pole conversion of the first electromagnet 19, and then the clamping and loosening of the outer sleeve 91 or the support of the first gear 93 can be realized to ensure that the two do not conflict.

[0029] Working principle: The chip is stored and placed in the feeding and storage structure 5. Start the device. The second motor 15 drives the central gear disk 12 to rotate. The central gear disk 12 drives the upper first gear 93 to rotate, and then drives the third gear 97 to rotate. The third gear 97 drives the driving rack 102 to move to realize the movement of the clamping end 103 to ensure the clamping of the chip. When the clamping force reaches the set threshold, the third electric push rod 162 will be triggered to quickly extend to lift the first gear 93 and separate it from the central gear disk 12. The clamping end 103 stably clamps the chip under the limiting action of the clamping block 1133. The first motor 7 drives the outer housing 8 to rotate. When it rotates to the bottom, the driving and transmission component 9 realizes the rotation of the whole driving and transmission component 9 by changing the internal current direction of the first electromagnet 19 when adjusting the chip orientation. When starting, the second electric push rod 133 drives the ring gear 132 to move and engage with the second gear 95, and then drives the driving and transmission component 9 as a whole to rotate. After adjustment, it is driven in the reverse direction to separate the two. At the same time, the first electromagnet 19 repels the first gear 93 during the adjustment process to avoid meshing with the ring gear 132. After the adjustment is completed, the two are meshed to realize the reverse rotation operation of the third gear 97 and lower the chip. Repeat the above actions.

[0030] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A wire clamp for positioning a semiconductor chip, comprising a base (1), characterized in that: A first electric push rod (2) is fixedly mounted on the top of the base (1), a pedestal (3) is fixedly mounted on the top of the first electric push rod (2), a column (4) is fixedly mounted on the top of the pedestal (3), a loading and storage structure (5) is mounted on the top of the column (4), a base plate seat (6) is fixedly mounted on one side of the base (3), a first motor (7) is fixedly mounted on one end of the base plate seat (6), an outer shell (8) is rotatably mounted on the other end of the base plate seat (6), a drive transmission component (9) is embedded and movably mounted on the outer shell (8), a clamping component (10) is movably mounted on the top of the drive transmission component (9), and the drive transmission component (9) is fixedly mounted on the top of the clamping component (10). A limit assembly (11) is fixedly mounted on the dynamic transmission assembly (9); a central toothed disc (12) is movably mounted inside the outer shell (8); a transmission assembly (13) is movably mounted inside the outer shell (8); a seat (14) is fixedly mounted on one end of the transmission assembly (13); a second motor (15) is fixedly mounted on one side of the outer shell (8); a supporting assembly (16) is fixedly mounted inside the outer shell (8); a clamping assembly (17) is movably mounted in the outer shell (8); a transmission gear (18) is movably mounted inside the outer shell (8); and a first electromagnet (19) is fixedly mounted inside the outer shell (8); The drive transmission component (9) comprises an outer sleeve (91), a center rod (92) is movably mounted inside the outer sleeve (91), a first gear (93) is fixedly mounted on one end of the center rod (92), a first magnetic ring (94) is fixedly mounted on one side of the first gear (93), a second gear (95) is fixedly mounted on the outside of the outer sleeve (91), a top plate (96) is fixedly mounted on one end of the outer sleeve (91), and a third gear (97) is fixedly mounted on one end of the center rod (92); The clamping assembly (10) comprises a positioning collar (101), a driving rack (102) being movably embedded inside the positioning collar (101), a clamping end (103) being fixedly mounted on the end of the driving rack (102), and a pressure sensor being mounted on the clamping end (103); The limiting assembly (11) comprises a base block (111), a plurality of inner grooves (112) are formed in the base block (111), and a limiting clamp (113) is movably installed inside the inner grooves (112); The conducting component (13) comprises a base ring (131), a ring tooth (132) being rotatably mounted on one side of the base ring (131), and a second electric push rod (133) being fixedly mounted on the other side of the base ring (131); The supporting assembly (16) comprises a supporting frame (161), and a third electric push rod (162) is fixedly mounted on one end of the supporting frame (161); The clamping assembly (17) comprises a clamping ring (171), extension rods (172) are arranged on both sides of the clamping ring (171), a top block (173) is arranged at the end of the extension rod (172), a vertical plate (174) is fixedly mounted on the top end of the extension rod (172), and a second spring (175) is fixedly mounted on one side of the vertical plate (174).

2. The wire clamp for semiconductor chip positioning according to claim 1, characterized in that: The outer shell (8) is fixedly connected to the output shaft of the first motor (7), the outer shell (8) is rotatably arranged relative to the base disc seat (6), the central toothed disc (12) is fixedly connected to the output shaft of the second motor (15), and the transmission gear (18) is meshed with the central toothed disc (12) and the transmission component (13).

3. The wire clamp for semiconductor chip positioning according to claim 1, characterized in that: The drive transmission component (9) is evenly arranged in a ring shape on the outer shell (8), and the drive transmission component (9) is movably arranged to penetrate the inner and outer sides of the outer shell (8). The fixing component (17) is located at the position where the drive transmission component (9) is located and is embedded in the outer shell (8) and movably installed.

4. The wire clamp for semiconductor chip positioning according to claim 1, characterized in that: The outer sleeve (91) is rotatably connected in the outer shell (8), the center rod (92) is rotatably installed inside the outer sleeve (91), and a limit convex strip is provided at the telescopic end of the center rod (92), the first gear (93) and the second gear (95) are both made of non-metallic material, the first electromagnet (19) is arranged between the first magnetic ring (94) and the clamping assembly (17), and the third gear (97) is located on the upper surface of the top plate (96) and meshes with the clamping assembly (10).

5. The wire clamp for semiconductor chip positioning according to claim 1, characterized in that: The positioning collar (101) is fixedly mounted on the upper surface of the top plate (96); the driving rack (102) is L-shaped and has a tooth groove at one end, the tooth groove meshing with the third gear (97); and a clamping buffer sponge is provided on the clamping end (103).

6. The wire clamp for semiconductor chip positioning according to claim 1, characterized in that: The center height of the inner groove (112) is the same as the height of the upper surface of the driving rack (102), and the inner groove (112) is symmetrically opened at upper and lower heights. The limit clamp (113) is slidably arranged in the inner groove (112) up and down. An electromagnetic strip is arranged at the bottom end of the base block (111), and a magnetic strip is arranged at the bottom of the limit clamp (113).

7. The wire clamp for semiconductor chip positioning according to claim 1, characterized in that: The limit clamp (113) comprises an outer set (1131), a telescopic rod (1132) is fixedly installed inside the outer set (1131), a clamping block (1133) is fixedly installed on one end of the telescopic rod (1132), a first spring (1134) is fixedly installed on one end of the clamping block (1133), a protrusion is provided at one end of the outer set (1131), and the protrusion is slidably arranged in the inner groove (112), a plurality of bottom ends of the outer sets (1131) are fixedly connected to an integral permanent magnetic strip, the other end of the clamping block (1133) is fixedly connected inside the outer set (1131), an inclined surface structure is provided at the end of the clamping block (1133), and a plurality of clamping grooves are provided on the side of the drive rack (102) that contacts the clamping block (1133), and the clamping grooves are clamped with the clamping block (1133).

8. The wire clamp for semiconductor chip positioning according to claim 1, characterized in that: A tooth groove is provided in the form of an annular ring on the side surface of the ring tooth (132); one end of the second electric push rod (133) is fixedly mounted on the seat body (14); and the ring tooth (132) can be separated and meshed with the second gear (95).

9. The wire clamp for semiconductor chip positioning according to claim 1, characterized in that: The support bracket (161) is fixedly installed inside the outer shell (8), and the third electric push rod (162) is electrically connected to the pressure sensor on the clamping end (103), and will start to extend when the pressure sensor detects that the pressure exceeds a set threshold.

10. The wire clamp for semiconductor chip positioning according to claim 1, characterized in that: The clamping ring (171) is a semicircular ring structure. The outer portion of the outer sleeve (91) is provided with a clamping ring groove at the position where the clamping ring (171) is located. The top block (173) is slidably arranged inside the outer shell (8). A permanent magnet is arranged at one end of the top block (173) facing the second gear (95). The permanent magnet has the same magnetic pole as the first gear (93) and its opposite surface. One end of the second spring (175) is fixedly installed inside the outer shell (8).

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