Wax loss manufacturing method of earphone frame

Abstract

The lost wax manufacturing method of the earphone frame comprises the following steps: platemaking to form a wax mold in the shape of the earphone frame; copying the wax mold to obtain a silica gel mold; metal slurry is cast to obtain the earphone frame, the earphone frame comprises a sound production component containing part, a functional component containing part and a connecting component, and the two ends of the connecting component are connected to the sound production component containing part and the functional component containing part respectively. Compared with a traditional sand casting process, the sand casting manufacturing process of the earphone frame can be suitable for precise mass production, certain manpower and material resource cost is reduced, and accessories can be embedded in the casting process.

Description

Technical Field

[0001] The present invention relates to the field of manufacturing processes, and particularly to a lost-wax manufacturing method for a headphone frame. Background Art

[0002] Existing headphone housings are generally made by injection molding or casting processes. However, for an inventor to develop a headphone combined with ornaments, how to integrate ornaments on the headphone frame made of metal products and mass-produce them is an urgent problem to be solved. Summary of the Invention

[0003] One advantage of the present invention is to provide a lost-wax manufacturing process for a headphone frame. The lost-wax manufacturing process for the headphone frame can mass-produce headphone frames, improve production efficiency, and is conducive to promotion.

[0004] One advantage of the present invention is to provide a lost-wax manufacturing process for a headphone frame. The material of the headphone frame can be materials such as aluminum, titanium, copper, silver, gold, zinc alloy, and stainless steel. Especially when the material is aluminum, it has low cost, easy processing, easy diamond setting, easy polishing, can be mass-produced, and is light in weight.

[0005] Another advantage of the present invention is to provide a lost-wax manufacturing process for a headphone frame. The lost-wax manufacturing process for the headphone frame solves the design freedom, greatly shortens the casting cycle, and reduces the equipment and labor costs at the same time.

[0006] Another advantage of the present invention is to provide a lost-wax manufacturing process for a headphone frame. In the lost-wax manufacturing process for the headphone frame, the wax paste mold can be used multiple times, reducing certain manufacturing costs and simplifying the manufacturing process.

[0007] Another advantage of the present invention is to provide a lost-wax manufacturing process for a headphone frame. The lost-wax manufacturing process for the headphone frame directly manufactures the initial wax film through 3D printing, reducing the error generated by the mold closing of the traditional lost-wax process.

[0008] Another advantage of the present invention is to provide a lost-wax manufacturing process for a headphone frame. The lost-wax manufacturing process for the headphone frame can design the surface texture on the initial wax mold through the initial 3D printing. When the lost-wax process is completed, the designed surface texture can be presented.

[0009] Another advantage of the present invention is to provide a lost-wax manufacturing process for a headphone frame. The lost-wax manufacturing process for the headphone frame has a relatively high level of mechanization, requires ordinary professional skills for operators, is easy for operators to control, and has a low manufacturing threshold.

[0010] Another advantage of the present invention is to provide a lost-wax manufacturing process for a headphone frame. The lost-wax manufacturing process of the headphone frame emits less harmful substances during the casting process, has an environmentally friendly production environment, and meets the requirements of green production.

[0011] Another advantage of the present invention is to provide a lost-wax manufacturing process for a headphone frame. The lost-wax manufacturing process of the headphone frame has no cumbersome processes during the pouring process, saving labor costs.

[0012] Another advantage of the present invention is to provide a lost-wax manufacturing process for a headphone frame. The lost-wax manufacturing process of the headphone frame can be applied to the manufacture of headphone frames made of high-end materials, and the manufacturing process has a certain degree of precision.

[0013] According to one aspect of the present invention, there is provided a lost-wax manufacturing method for a headphone frame, which includes:

[0014] Making a wax mold in the shape of the headphone frame by plate making;

[0015] Obtaining a silicone mold by replicating through the wax film; and

[0016] Casting metal slurry to obtain the headphone frame, wherein the headphone frame includes a sound generating member accommodating portion, a functional member accommodating portion, and a connecting member, and both ends of the connecting member are respectively connected to the sound generating member accommodating portion and the functional member accommodating portion.

[0017] In some embodiments, in the plate-making process, a wax mold of the outer shape of the headphone shell with an enlarged ratio is printed out by 3D printing, and it is placed in a plaster cup and heated to let the wax paste flow away. Then, copper liquid is cast in the plaster cup to replace the original wax headphone model to obtain a copper model master plate with an enlarged ratio.

[0018] In some embodiments, the copper model master plate in the plaster is placed in a silicone mold to achieve silicone mold replication. Then, a plurality of replicated silicone molds are installed on an injection molding machine to injection mold a batch of wax paste headphone models with a certain enlarged ratio.

[0019] In some embodiments, ornaments are inlaid on the surface of the wax paste headphone model, and then it is placed in a plaster cup and heated to evaporate. When the metal material slurry is cast into the interior and cooled, the headphone frame is obtained.

[0020] In some embodiments, the ornaments of the headphone frame are disposed on the surface of at least one of the sound generating member accommodating portion, the functional member accommodating portion, and the connecting member.

[0021] In some embodiments, after obtaining the headphone frame, it further includes any one or a combination of filling with oil, inlaying diamonds, milling patterns, polishing, and water transfer printing.

[0022] In some embodiments, the material of the earphone frame is selected from any one of aluminum, titanium, copper, silver, gold, zinc alloy, and stainless steel.

[0023] The present invention also provides an earphone frame, which includes a sound generating member accommodating portion, a functional member accommodating portion, and a connecting member. The two ends of the connecting member are respectively connected to the sound generating member accommodating portion and the functional member accommodating portion, and the earphone frame is manufactured by the lost-wax manufacturing method of the earphone frame described above. Description of the Drawings

[0024] Figure 1 is an overall schematic diagram of an earphone with an earphone frame 100 manufactured by a lost-wax manufacturing process according to a preferred embodiment of the present invention.

[0025] Figure 2 is an overall schematic diagram of an earphone with an earphone frame 100 manufactured by a lost-wax manufacturing process according to another preferred embodiment of the present invention.

[0026] Figure 3 is an overall schematic diagram of an earphone with an earphone frame 100 manufactured by a lost-wax manufacturing process according to another preferred embodiment of the present invention

[0027] Figure 4 is a schematic diagram of the steps of the lost-wax manufacturing process of the earphone frame 100 according to the preferred embodiment of the present invention. Detailed Embodiments

[0028] The following description is used to disclose the present invention so that those skilled in the art can implement the present invention. The preferred embodiments described below are only examples, and those skilled in the art can think of other obvious variations. The basic principles defined in the following description of the present invention can be applied to other embodiments, variations, improvements, equivalent solutions, and other technical solutions that do not depart from the spirit and scope of the present invention.

[0029] Those skilled in the art should understand that in the disclosure of the present invention, the orientation or positional relationship indicated by terms such as "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, the above terms should not be construed as limiting the present invention.

[0030] It will be understood that the term "a" should be construed as "at least one" or "one or more". That is, in one embodiment, the number of an element may be one, while in other embodiments, the number of the element may be multiple. The term "a" should not be construed as a limitation on the quantity.

[0031] As Figures 1 to 3 shown, a headset 1000 and a headset frame 100 according to a preferred embodiment of the present invention are schematically illustrated. The headset frame 100 is fabricated by a lost-wax manufacturing process. The manufacturing material of the headset frame 100 is made of materials such as aluminum, titanium, copper, silver, gold, zinc alloy, and stainless steel. That is, different shapes of the headset frame 100 made of the same metal material can be manufactured through the lost-wax manufacturing process of the headset frame 100.

[0032] An exemplary introduction of the headset frame 100 is as follows. The headset frame 100 includes a sound generating member accommodating portion 10, a functional member accommodating portion 20, and a connecting member 30. The sound generating member accommodating portion 10, the functional member accommodating portion 20, and the connecting member 30 are integrally connected to each other. Both ends of the connecting member 30 are respectively connected to the sound generating member accommodating portion 10 and the functional member accommodating portion 20. The headset frame 100 must be equipped with electronic components and a cover body to form a complete headset 1000. The electronic components are adapted to be installed in the cavity formed by the sound generating member accommodating portion 10 and the connecting member 30, and the electronic components are hidden by the cover body 50. That is, the cover body 50 respectively encloses the sound generating member accommodating portion 10 and the functional member accommodating portion 20. In this embodiment, the electronic components are implemented as a power source, a circuit board, and a speaker. The power source and the circuit board are optionally disposed in the functional member accommodating portion 20. The speaker is disposed in the sound generating member accommodating portion 10.

[0033] The headset 1000 formed by the headset frame 100 in combination with the corresponding cover body 50 and accommodating the corresponding electronic components is suitable for being worn on the user's ear by means of ear clamping. More specifically, after the sound generating member accommodating portion 10 is assembled with its cover body and accommodates the speaker, it can be placed in the concha of the user's ear. After the functional member accommodating portion 20 is assembled with its cover body 50 and accommodates components such as the power source and the circuit board, it is located on the back side of the user's ear. The connecting member 30 straddles the auricle of the user's ear.

[0034] In this embodiment, the headset frame 100 is implemented as a metal material, so that the headset frame 100 is suitable for delicate and precious objects. The precision requirements for the manufacturing process are relatively high. Therefore, the lost-wax manufacturing process of using the headset frame 100 can ensure the delicacy of the headset frame 100 formed.

[0035] The earphone frame 100 further includes one or more ornaments 40, which may be arranged on the outer surfaces of the sound generating member accommodating portion 10 and the functional member accommodating portion 20 as shown in Figure 1 , or on the outer surface of the connecting member 30 as shown in Figure 2 , or, as shown in Figure 3 , arranged on the outer surfaces of the sound generating member accommodating portion 10, the functional member accommodating portion 20 and the connecting member 30.

[0036] Referring to Figure 4 , a lost-wax manufacturing process of the earphone frame 100 is briefly described by way of example:

[0037] Making a wax mold in the shape of the earphone frame 100 by plate making;

[0038] Obtaining a silica gel mold by replicating through the wax film; and

[0039] Embedding the ornament 40 and casting a metal slurry to obtain the earphone frame 100.

[0040] More specifically, before the step of making a wax mold in the shape of the earphone frame 100, taking an ear impression and structural design are further included. Specifically, for customized earphones or ergonomic earphones, in order to ensure the wearing comfort or to make one's own exclusive customized earphones. Generally, the materials for ear impressions include a matrix and a coagulant. In this embodiment, the selection of the materials for ear impressions is not limited by the present invention. The two are kneaded together in a ratio of 1:1 and put into a syringe, and then put into the ear of the ear impression taker to make and take out the model of the ear impression.

[0041] Secondly, the structure of the taken ear membrane is designed so that the finally formed earphone frame 100 can ensure certain comfort during wearing, good sound insulation effect, and whether it fits well with the user's ear canal, etc.

[0042] Furthermore, a forming model is made for the structure of the designed earphone frame 100. That is, a wax mold in the shape of the earphone frame 100 is formed. In this embodiment, the step of forming a wax mold in the shape of the earphone frame 100 is implemented by 3D printing. The appearance of the wax mold obtained by 3D printing is basically consistent with the shape of the earphone frame 100. By the way of obtaining a wax mold through 3D printing, the precision of the lost-wax manufacturing process of the earphone frame 100 is guaranteed, which is suitable for the production of high-end products. For example, the material of the earphone frame 100 is selected as precious materials such as gold and silver. Through the lost-wax manufacturing process of the earphone frame 100, no waste of materials can be achieved, and the precision of manufacturing is ensured.

[0043] It can be understood that in the plate-making process, a wax mold earphone shell outer shape enlarged by a certain proportion, such as 5%, is printed by 3D printing. Then, this earphone shell wax model is placed in a gypsum cup, and the wax paste flows away at high temperature. Next, copper liquid is poured into the gypsum cup to replace the original wax earphone model, and a copper model master plate enlarged by 5% is obtained.

[0044] The total model of the mother copper plate in the gypsum is placed in a silicone mold to achieve silicone mold replication. Then, multiple replicated silicone molds are installed on an injection molding machine to injection mold a batch of wax paste earphone models enlarged by a certain proportion, such as 5%.

[0045] Various ornaments, such as zircon or diamond, are inlaid on the surface of the wax paste model, and then it is placed in a gypsum cup and heated to evaporate. The diamond or zircon remains on the inner wall of the gypsum cup. When a metal material slurry, such as aluminum slurry, is poured into the inside and cooled, due to the factor of the shrinkage ratio, the earphone frame 100 with the desired size specification can be obtained.

[0046] In the lost-wax manufacturing process of the earphone frame 100, during the step of replicating the silicone mold with the total model of the mother copper plate in the silicone mold, the mold that was originally used only a few times is transformed into a mold that can be used multiple times, improving the production efficiency of mass-producing the earphone frame 100. While being used multiple times, it ensures a certain precision and will not cause defects in the earphone frame 100 due to the manufacturing process.

[0047] During the process of forming the wax mold of the earphone frame 100, the structural design of the final product, the earphone frame 100, is already reflected in the initial steps. Different-shaped wax molds can also be designed, and through the lost-wax manufacturing process of the earphone frame 100, the earphone frame 100 with the corresponding shape is finally obtained.

[0048] The earphone frame 100 obtained through the lost-wax manufacturing process of the earphone frame 100 is also suitable for fine operation through a surface treatment process.

[0049] An example describes the surface treatment process of the earphone frame 100: Before the step of forming the wax mold in the shape of the earphone frame 100, it also includes building a model to design the texture. Specifically, before the step of 3D printing the wax mold, by designing the texture of the outer surface of the predetermined earphone frame 100 and printing it out in a modeling way, the earphone frame 100 with the corresponding designed texture can be obtained through the lost-wax manufacturing process of the earphone frame 100.

[0050] In this embodiment, the texture implementation shape of the earphone frame 100 is optionally implemented as a water ripple pattern. In another embodiment, the texture implementation shape of the outer surface of the earphone frame 100 is optionally implemented as a meteorite pattern, a stone forest pattern, a honeycomb pattern, a line pattern, a heart pattern, a combined pattern, etc. Thus, the texture implementation shape of the outer surface of the earphone frame 100 is not limited by the present invention.

[0051] In another embodiment of the present invention, the initial mold can also be carved. In other words, the outer surface of the initial mold is textured manually. Or a fine texture forging operation is performed on the earphone frame 100 formed after the lost wax manufacturing process of the earphone frame 100. That is, the outer surface texture of the earphone frame 100 can be obtained optionally by 3D printing or manual hammering.

[0052] In addition, the surface treatment process of the earphone frame 100 further includes filling oil into the earphone frame 100 after casting the metal liquid in gypsum to form the earphone frame 100. By filling oil into the grooves and gaps of the earphone frame 100, the outer surface of the cast earphone frame 100 presents a color, making the presentation effect of the earphone frame 100 different. It has the function of decoration and beautification.

[0053] The surface treatment process of the earphone frame 100 further includes process steps such as diamond inlaying, milling, polishing, water transfer printing, etc. Through the diamond inlaying step, zircon, diamond, etc. can be inlaid on the outer shape of the earphone frame 100. Through the milling step, beautiful and delicate patterns can be obtained on the outer surface of the earphone frame 100. Through the polishing step, the convex parts on the surface of the earphone frame 100 can be changed to form a smooth surface of the earphone frame 100. Through water transfer printing, a gradient color pattern shape can be obtained on the outer surface of the earphone frame 100.

[0054] Finally, the earphone frame 100 obtained through the lost wax manufacturing process of the earphone frame 100 is finally formed into an earphone by installing electronic components and sealing them with a cover body. The earphone of the present invention is worn on the ear by clamping on both sides of the ear.

[0055] The metal material for the lost wax process of the earphone frame 100 can be materials such as aluminum, titanium, copper, silver, gold, zinc alloy, and stainless steel. Especially when it is an aluminum material, it has low cost, easy processing, easy diamond inlaying, easy polishing, can be mass-produced, and is light in weight.

[0056] Those skilled in the art should understand that the embodiments of the present invention described above and shown in the accompanying drawings are only examples and do not limit the present invention. The object of the present invention has been fully and effectively achieved. The functions and structural principles of the present invention have been demonstrated and explained in the embodiments, and the embodiments of the present invention can have any variations or modifications without departing from the above-mentioned principles.

Claims

1. A lost wax manufacturing method for a headphone frame, characterized in that, Comprising: Making a wax mold in the shape of the earphone frame by plate making; Obtaining a silica gel mold by replicating through the wax film; And Casting metal slurry to obtain the earphone frame, wherein the earphone frame includes a sound generating component accommodating part, a functional component accommodating part and a connecting component, and both ends of the connecting component are respectively connected to the sound generating component accommodating part and the functional component accommodating part.

2. The lost wax manufacturing method of the earphone frame according to claim 1, wherein, In the plate making process, a wax mold earphone shell outer shape with a magnified ratio is printed out by 3D printing, and it is placed in a plaster cup and heated to let the wax paste flow away, and then copper liquid is cast in the plaster cup to replace the original wax earphone model to obtain a copper model master plate with a magnified ratio.

3. The lost wax manufacturing method of the earphone frame according to claim 2, wherein, The copper model master plate in the plaster is placed in a silica gel mold to achieve replication of the silica gel mold, and then a plurality of replicated silica gel molds are installed on an injection molding machine to injection mold a batch of wax paste earphone models with a certain magnification.

4. The lost-wax manufacturing method of the earphone frame according to claim 3, wherein, Inlay ornaments on the surface of the wax paste earphone model, and then put it into a plaster cup and heat it to evaporate. When the metal material slurry is cast into the interior and cooled, the earphone frame is obtained.

5. The lost wax manufacturing method of the earphone frame according to claim 4, wherein, Wherein the ornaments of the earphone frame are arranged on the surface of at least one of the sound generating component accommodating part, the functional component accommodating part and the connecting component.

6. The lost wax manufacturing method of the earphone frame according to any one of claims 1 to 5, wherein, After obtaining the earphone frame, it further includes any one or a combination of oil filling, diamond inlaying, milling, polishing, and water transfer printing.

7. The lost wax manufacturing method of the earphone frame according to any one of claims 1 to 5, wherein, The material of the earphone frame is selected from any one of aluminum, titanium, copper, silver, gold, zinc alloy and stainless steel.

8. An earphone frame, which includes a sound generating component accommodating part, a functional component accommodating part and a connecting component, and both ends of the connecting component are respectively connected to the sound generating component accommodating part and the functional component accommodating part, wherein the earphone frame is made by the lost wax manufacturing method of the earphone frame as described in any one of claims 1 to 7.

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