Hardware cooling fin based on server or computer

Abstract

The invention relates to the technical field of heat conduction and heat dissipation of electronic products, in particular to a hardware cooling fin based on a server or a computer, a substrate and a sealing shell welded to the surface of the substrate, a hollow cavity is formed between the sealing shell and the substrate, a capillary microstructure layer is designed in the hollow cavity, and the hollow cavity is filled with a phase change working medium; a plurality of expanded graphite flakes are placed in the hollow cavity in a limited mode, the expanded graphite flakes are wrapped with sealing films in a sealed mode, and the expanded graphite flakes can expand to fill the hollow cavity after making contact with the phase change working medium; a reaction structure for damaging the sealing film is installed in the hollow cavity, an assembling cavity is integrally formed in the hollow cavity towards the outer wall of the sealing shell in a punching mode, a plunger is installed on the inner wall of the assembling cavity in an up-down sliding mode, and an air guide channel communicating with the interior of the hollow cavity is formed in the bottom in the assembling cavity; water absorption expansion of the expanded graphite sheets can be triggered when the hollow cavity is pressed and leaks, so that sealing is repaired, and the heat-conducting property is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of heat conduction and dissipation of electronic products, specifically a hardware heat sink based on a server or a computer. Background Art

[0002] Currently, the main function of hardware heat sinks is to conduct heat and dissipate heat from the heat-generating hardware of electronic products, especially hardware such as chips. If the heat generated during their operation cannot be transferred in time, it is likely to reduce the working efficiency of the hardware. Among them, hardware heat sinks mainly include heat pipe types and vapor chamber types. The vapor chamber conducts heat in two dimensions and has excellent heat dissipation and heat conduction capabilities. When combined with a cold source, it can quickly form a heat conduction and dissipation chain and is more suitable for compact spaces, such as mobile phones, laptops, and graphics cards. It can also be applied to servers, base stations, or aerospace fields.

[0003] In the prior art, due to the relatively thin thickness of the shell of the vapor chamber and the need to evacuate the formed internal cavity after welding, once the shell of the vapor chamber is compressed, it is extremely easy to cause related problems such as shell indentation and seal failure, resulting in the loss of heat conduction ability. At this time, because the vacuum chamber of the vapor chamber becomes an atmospheric pressure chamber, its heat conduction ability is even much weaker than that of a solid metal plate. Summary of the Invention

[0004] The present invention provides a hardware heat sink based on a server or a computer, which can trigger the water absorption and expansion of expanded graphite sheets when the hollow cavity is pressured and leaks, thereby repairing the seal and improving the heat conduction performance.

[0005] To achieve the above object, the present invention provides the following technical solutions: A hardware heat sink based on a server or a computer, comprising: A substrate and a housing welded to its surface. A hollow cavity is formed between the housing and the substrate. A capillary microstructure layer is designed inside the hollow cavity, and a phase change working fluid is filled inside the hollow cavity. A plurality of expanded graphite sheets are placed in the hollow cavity in a limited manner. The outside of the expanded graphite sheet is hermetically wrapped with a sealing film. The expanded graphite sheet will expand after contacting the phase change working fluid to fill the hollow cavity. A reaction structure for destroying the sealing film is installed inside the hollow cavity.

[0006] Optionally, an assembly cavity is integrally stamped and formed on the outer wall of the housing inside the hollow cavity. A plunger is slidably installed up and down on the inner wall of the assembly cavity. An air guide channel communicating with the inside of the hollow cavity is opened at the bottom of the inner part of the assembly cavity. A cover is designed at the opening of the assembly cavity. A pressure sensor is installed on the cover. A elastic rope is fixedly connected between the top of the plunger and the pressure surface of the pressure sensor. After the hollow cavity is evacuated, the plunger moves downward to the lowest position, and the elastic rope remains in a taut state.

[0007] Optionally, the reaction structure includes a plurality of micro support sheets installed between the housing and the substrate. The micro support sheets are in the form of sheets, and the plurality of micro support sheets are distributed in a rectangular array. The expanded graphite sheets are located on both sides of the micro support sheets. Barbs are installed on both sides of the micro support sheets. When the micro support sheets are compressed and bent, the barbs will pierce the sealing film.

[0008] Optionally, when wrapping the expanded graphite sheets, the sealing film is designed to be in a stretched and taut state, and the sealing film is configured as a silicon oxide coating film, which has high tensile strength but poor puncture resistance.

[0009] Optionally, the reaction structure includes a film inner cavity formed between the sealing film and the expanded graphite sheets. The internal pressure of the film inner cavity is close to vacuum. The sealing film is a flexible film with relatively low film strength. The edge of the expanded graphite sheet is designed with a sharp part, and a hollowed-out part is designed on the outer wall of the expanded graphite sheet. When the internal pressure in the cavity changes from vacuum to normal pressure, the sharp part can assist in the rupture of the sealing film.

[0010] Optionally, micro cracks are laser engraved on the sealing film, and the tensile strength at the bonding seam of the sealing film is lower than that of the sealing film body.

[0011] Optionally, a limiting sleeve is installed on the inner top of the housing. A reactive metal needle is designed inside the limiting sleeve. One end of the reactive metal needle is fixed in the limiting sleeve, and the tip of the reactive metal needle faces the expanded graphite sheet. After being heated, the reactive metal needle will expand unidirectionally towards the expanded graphite sheet. The reactive metal needle is of a hollow structure, and the expansion deformation temperature threshold of the reactive metal needle is 150 degrees Celsius.

[0012] Optionally, a wax seal layer is designed on the inner wall of the assembly cavity at the top of the plunger. The wax seal layer is made of microcrystalline wax or modified paraffin, and the melting point temperature of the wax seal layer is configured to be 150 degrees Celsius.

[0013] Optionally, fins are installed at the bottom of the substrate. The substrate, the housing, the fins, and the capillary microstructure layer are all made of copper material with a copper content of greater than or equal to 99.97%, an oxygen content of less than or equal to 0.002%, and a hardness range of 45 to 60 HV.

[0014] The present invention provides a hardware heat sink based on a server or a computer. Compared with the prior art, it has the following beneficial effects: when the vacuum heat pipe has a problem, the reaction structure can break the sealing film, so that the expanded graphite sheet can be exposed inside the hollow cavity. The expansion change of the expanded graphite sheet can prevent excessive leakage of pure water and absorb it. At the same time, the expansion of the expanded graphite sheet will fill the hollow cavity, enabling the vacuum heat pipe to still maintain a certain heat conduction capacity. Moreover, the expansion of the expanded graphite sheet is compressible and can adapt to irregular cavities, and its heat conduction capacity is better than that of a solid heat-conducting metal plate. Therefore, the present invention can make timely repair compensation to avoid heat conduction failure and affect the entire heat dissipation process. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 is a schematic perspective view of the exterior of the present invention; Figure 2 For the present invention Figure 1 is a schematic right view structure diagram; Figure 3 For the present invention along Figure 2 is a schematic sectional view taken along line A-A in; Figure 4 is a schematic perspective view of the interior of the present invention; Figure 5 For the present invention Figure 1 is a top view; Figure 6 For the present invention along Figure 5 is a schematic sectional view taken along line B-B in; Figure 7 For the present invention Figure 6 is an enlarged view of the structure at C in Figure 8 is a schematic perspective view of the exterior of the vacuum heat pipe in the present invention; Figure 9 is a schematic perspective view of the interior of the vacuum heat pipe in the present invention; Figure 10 is a schematic view of the structure of the limit sleeve and the reaction metal needle in the present invention; Figure 11 For the present invention Figure 10 is an enlarged view of the structure at D in.

[0016] In the figure: 1, substrate; 2, housing; 3, fin; 4, hollow cavity; 5, micro support sheet; 6, expanded graphite sheet; 7, sealing film; 8, capillary microstructure layer; 9, assembly cavity; 11, wax seal layer; 12, plunger; 13, air guide channel; 14, pressure sensor; 15, limit sleeve; 16, reaction metal needle. DETAILED DESCRIPTION OF THE INVENTION

[0017] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0018] Please refer to Figures 1 to 11 , the present invention provides a technical solution: a hardware heat sink based on a server or a computer, comprising: a substrate 1 and a housing 2 welded to its surface, a hollow cavity 4 is formed between the housing 2 and the substrate 1, a capillary microstructure layer 8 is designed inside the hollow cavity 4, and a phase change working fluid is filled inside the hollow cavity 4; a plurality of expanded graphite sheets 6 are placed in the hollow cavity 4 in a limited manner, and a sealing film 7 is wrapped around the outside of the expanded graphite sheet 6. The expanded graphite sheet 6 will expand after contacting the phase change working fluid to fill the hollow cavity 4; a reaction structure for breaking the sealing film 7 is installed inside the hollow cavity 4.

[0019] In the prior art, the extrusion of the heat pipe is difficult to recover. The sealing failure of the vacuum chamber will cause the phase change working fluid to be unable to work or even leak. Moreover, after the vacuum chamber fails, the heat pipe becomes a heat conducting plate with a cavity, and its heat conducting ability is extremely low. Once the heating hardware overheats, the hardware will also be damaged. Therefore, it is necessary to repair and make up for it in the case of sealing failure caused by extrusion to reduce losses. In the present invention, a vacuum heat pipe is formed by the substrate 1, the housing 2, the hollow cavity 4, the capillary microstructure layer 8 and the phase change working fluid. By designing the expanded graphite sheet 6, the expanded graphite sheet 6 has an expansion characteristic, and the sealing film 7 is used as an isolation layer to ensure that the expanded graphite sheet 6 can always remain dry inside the hollow cavity 4. When the vacuum heat pipe works, the expanded graphite sheet 6 is independent of the phase change working fluid, and the expanded graphite sheet 6 and the sealing film 7 will not overly interfere with the working efficiency of the vacuum heat pipe. When there is a problem with the vacuum heat pipe, the reaction structure can damage the sealing film 7, so that the expanded graphite sheet 6 can be exposed inside the hollow cavity 4. The expanded graphite sheet 6 is a porous material made of natural graphite by chemical or high-temperature treatment. Its core characteristic is that it expands rapidly when it comes into contact with water or other polar solvents, and its volume can increase several times to dozens of times, and its high heat conducting ability will not drop significantly. Especially for a phase change working fluid such as pure water, when the expanded graphite sheet 6 comes into contact with pure water, due to the deionized plasma characteristic of pure water, its permeability is the best, which will accelerate the expansion of the expanded graphite sheet 6. In this process, the expansion change of the expanded graphite sheet 6 can prevent excessive leakage of pure water and absorb it. At the same time, the expansion of the expanded graphite sheet 6 will fill the hollow cavity 4, so that the vacuum heat pipe can still maintain a certain heat conducting ability. Moreover, the expansion of the expanded graphite sheet 6 is compressible and can adapt to irregular cavities, and its heat conducting ability is better than that of a solid heat conducting metal plate. Therefore, when there is a problem with the hollow cavity 4, the present invention can make timely repair and compensation to avoid heat conduction failure and affect the entire heat dissipation process.

[0020] In a more preferred embodiment, an assembly cavity 9 is integrally stamped and formed on the outer wall of the housing 2 inside the hollow cavity 4. A plunger 12 is slidably installed on the inner wall of the assembly cavity 9 up and down. A gas guiding channel 13 communicating with the inside of the hollow cavity 4 is opened at the bottom of the inner part of the assembly cavity 9. A cover is designed at the opening of the assembly cavity 9, and a pressure sensor 14 is installed on the cover. A elastic cord is fixedly connected between the top of the plunger 12 and the pressure surface of the pressure sensor 14. After the hollow cavity 4 is evacuated, the plunger 12 moves downward to the lowest position, and the elastic cord remains in a taut state.

[0021] Please refer to Figure 6 and Figure 7In this embodiment, a detection component is formed between the pressure sensor 14, the assembly cavity 9 and the elastic rope, which is used to detect the vacuum environment of the hollow cavity 4. If a seal failure occurs, the interior of the hollow cavity 4 changes from a vacuum state to a normal pressure state. At this time, the elastic rope will release its force, causing the plunger 12 to move upward, and the tension caused by the elastic rope on the pressure sensor 14 will be reduced, thereby obtaining a detection result. Under normal conditions, the vacuum environment inside the hollow cavity 4 will always keep the plunger 12 at the lowest point, and the tension on the pressure sensor 14 remains unchanged. When the tension digital display of the pressure sensor 14 changes significantly, it can be determined that the seal has failed.

[0022] The pressure sensor 14 can be associated with an external early warning mechanism to provide real-time monitoring and timely alarm.

[0023] Based on the detection component embodiment, two implementation schemes of reaction structures are provided.

[0024] Embodiment 1: The reaction structure includes a plurality of micro-support sheets 5 installed between the capsule 2 and the substrate 1. The micro-support sheets 5 are sheet-type structures. The plurality of micro-support sheets 5 are arranged in a rectangular array, and the expanded graphite sheets 6 are located on both sides of the micro-support sheets 5. Barbs are installed on both sides of the micro-support sheets 5. When the micro-support sheets 5 are compressed and bent, the barbs will pierce the sealing film 7. Please refer to Figure 3 and Figure 4 The top area of ​​the capsule 2 is always large, and the thickness of the heat spreader is much smaller than the top surface size. Therefore, the top surface of the capsule 2 is the main surface under pressure. Therefore, when the top of the capsule 2 receives pressure, the micro-support sheet 5 will also bend under pressure, so that the barbs on it will approach the sealing film 7 to complete the puncture. The expanded graphite sheet 6 is designed in a strip shape, so a single-point puncture can also cause the entire sealing film 7 to separate from the expanded graphite sheet 6.

[0025] On the basis of the first embodiment, the sealing film 7 is designed to be in a stretched and taut state when wrapping the expanded graphite sheet 6, and the sealing film 7 is configured as a silicon oxide coating film, which has high tensile strength but poor puncture resistance. When the sealing film 7 is in a stretched and taut state and is scratched or punctured, the sealing film 7 will shrink and deform, quickly releasing the wrapping of the expanded graphite sheet 6, so that the expanded graphite sheet 6 is quickly exposed inside the hollow cavity 4.

[0026] Embodiment 2: The reaction structure includes a membrane inner cavity formed between the sealing membrane 7 and the expanded graphite sheet 6. The internal pressure of the membrane inner cavity is close to vacuum. The sealing membrane 7 is a flexible thin film with relatively low membrane strength, and sharp parts are designed at the edges of the expanded graphite sheet 6. Hollow parts are designed on the outer wall of the expanded graphite sheet 6. When the internal pressure in the middle cavity 4 changes from vacuum to normal pressure, the sharp parts can assist the sealing membrane 7 to rupture. The pressure difference between the membrane inner cavity and the middle cavity 4 is very small under normal conditions, and the sealing membrane 7 can work normally to protect and isolate the expanded graphite sheet 6. However, when the seal of the middle cavity 4 fails, the inside of the middle cavity 4 will tend to normal pressure, resulting in a large pressure difference between the middle cavity 4 and the membrane inner cavity. The pressure difference will cause an inward pressure difference on the sealing membrane 7. Since in this embodiment, the sealing membrane 7 is a flexible thin film and not in the stretched state of Embodiment 1, the flexible thin film will spontaneously rupture after being compressed and stretched. Among them, the sharp parts on the expanded graphite sheet 6 can assist the self-rupture of the sealing membrane 7.

[0027] Based on Embodiment 2, micro-cracks are laser-scored on the sealing membrane 7, and the tensile strength at the bonding seam of the sealing membrane 7 is lower than that of the sealing membrane 7 itself. The micro-cracks can reduce the local strength of the sealing membrane 7, so that it can accelerate fracture when being stretched. At the same time, the tensile strength at the joint is poor, so that the pressure difference between the middle cavity 4 and the inside of the sealing membrane 7 causes the sealing membrane 7 to spontaneously break and rupture.

[0028] Based on Embodiment 1 and Embodiment 2, a limiting sleeve 15 is installed at the inner top of the sealing shell 2. A reactive metal needle 16 is designed inside the limiting sleeve 15. One end of the reactive metal needle 16 is fixed in the limiting sleeve 15, and the tip of the reactive metal needle 16 faces the expanded graphite sheet 6. The reactive metal needle 16 will expand unidirectionally towards the expanded graphite sheet 6 when heated. The reactive metal needle 16 is a hollow structure, and the expansion deformation temperature threshold of the reactive metal needle 16 is one hundred and fifty degrees Celsius. This embodiment is a backup plan. When the reaction structure has a delay or the reaction fails, the failure of the heat conduction ability will cause the overall temperature of the heat sink plate to rise, so that the reactive metal needle 16 undergoes a thermal deformation reaction. Since one end of the reactive metal needle 16 is limited, the tip of the reactive metal needle 16 will protrude towards the sealing membrane 7, thereby puncturing the sealing membrane 7, so that the sealing membrane 7 releases the wrapping of the expanded graphite sheet 6, enabling the expanded graphite sheet 6 to perform self-repair work. Among them, the deformation threshold of the reactive metal needle 16 can be adjusted by adding alloys, so that the backup plan can be applied to different scenarios.

[0029] Based on the embodiment of the detection component, a wax seal layer 11 is designed on the inner wall of the assembly cavity 9 at the top of the plunger 12. The wax seal layer 11 is made of microcrystalline wax or modified paraffin. The melting point temperature of the wax seal layer 11 is configured to be one hundred and fifty degrees Celsius. By designing the wax seal layer 11, the sealing performance of the detection component can be improved, that is, the seal between the assembly cavity 9 and the plunger 12. At the same time, the plunger 12 is limited to a certain extent. And when the vacuum in the cavity 4 fails and the heat spreader shows a high temperature phenomenon, the wax seal layer 11 will soften, thus not hindering the upward movement of the plunger 12.

[0030] Fins 3 are installed at the bottom of the substrate 1. The fins 3 provide more heat dissipation convection area. Further, in order to improve the heat conduction efficiency and the overall compressive capacity, the substrate 1, the housing 2, the fins 3 and the capillary microstructure layer 8 are all made of copper material with a copper content of greater than or equal to 99.97% and an oxygen content of less than or equal to 0.002%, and the hardness range is between 45 and 60 HV.

[0031] With the cooperation of the above-mentioned structures, it is possible to trigger the water absorption and expansion of the expanded graphite sheet 6 when the hollow cavity 4 is pressured and leaks, thereby repairing the seal and improving the heat conduction performance.

[0032] The standard parts used in this embodiment can be directly purchased from the market. For the non-standard structural components described in the specification and drawings, they can also be directly processed without any doubt according to the existing technical knowledge. At the same time, the connection methods of each component adopt the mature conventional means in the existing technology, and the machines, parts and equipment all adopt the conventional models in the existing technology, so no specific description will be made here.

[0033] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirits of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A server or computer-based hardware heat sink, characterized in that: Including: A substrate (1) and a housing (2) welded to its surface. A hollow cavity (4) is formed between the housing (2) and the substrate (1). A capillary microstructure layer (8) is designed inside the hollow cavity (4), and the hollow cavity (4) is filled with a phase change working fluid. A plurality of expanded graphite sheets (6) are placed in the hollow cavity (4) in a limited manner. The outer part of the expanded graphite sheet (6) is sealed and wrapped with a sealing film (7). The expanded graphite sheet (6) will expand after contacting the phase change working fluid to fill the hollow cavity (4). A reaction structure for destroying the sealing film (7) is installed inside the hollow cavity (4).

2. The server or computer-based hardware heat sink according to claim 1, wherein: An assembly cavity (9) is integrally stamped and formed on the outer wall of the housing (2) from the inside of the hollow cavity (4). A plunger (12) is slidably installed on the inner wall of the assembly cavity (9) up and down. An air guiding channel (13) communicating with the inside of the hollow cavity (4) is opened at the bottom of the assembly cavity (9). A cover is designed at the opening of the assembly cavity (9), and a pressure sensor (14) is installed on the cover. A elastic cord is fixedly connected between the top of the plunger (12) and the pressure surface of the pressure sensor (14). After the hollow cavity (4) is evacuated, the plunger (12) displaces downward to the lowest position, and the elastic cord remains in a taut state.

3. The server- or computer-based hardware heat sink according to claim 2, characterized in that: The reaction structure includes a plurality of micro support sheets (5) installed between the housing (2) and the substrate (1). The micro support sheet (5) is a sheet structure. A plurality of the micro support sheets (5) are distributed in a rectangular array, and the expanded graphite sheet (6) is located on both sides of the micro support sheet (5). Barbs are installed on both sides of the micro support sheet (5). When the micro support sheet (5) is pressed and bent, the barbs will pierce the sealing film (7).

4. The server or computer-based hardware heat sink according to claim 3, wherein: The sealing film (7) is designed to be in a stretched and taut state when wrapping the expanded graphite sheet (6), and the sealing film (7) is configured as a silicon oxide coating film, which has high tensile strength but poor puncture resistance.

5. The server- or computer-based hardware heat sink according to claim 2, characterized in that: The reaction structure includes a film inner cavity formed between the sealing film (7) and the expanded graphite sheet (6). The internal pressure of the film inner cavity is close to vacuum. The sealing film (7) is a flexible film with low film strength, and a sharp part is designed at the edge of the expanded graphite sheet (6). A hollow part is opened on the outer wall of the expanded graphite sheet (6). When the internal pressure in the hollow cavity (4) changes from vacuum to normal pressure, the sharp part can assist the sealing film (7) to rupture.

6. The server or computer-based hardware heat sink according to claim 5, characterized in that: Micro cracks are laser engraved on the sealing film (7), and the tensile strength at the bonding seam of the sealing film (7) is lower than the tensile strength of the sealing film (7) body.

7. The server - or computer - based hardware heat sink according to claim 4 or 6, characterized in that: A limit sleeve (15) is installed at the inner top of the housing (2). A reactive metal needle (16) is designed inside the limit sleeve (15). One end of the reactive metal needle (16) is fixed inside the limit sleeve (15). The tip of the reactive metal needle (16) faces the expanded graphite sheet (6). The reactive metal needle (16) will expand unidirectionally towards the expanded graphite sheet (6) after being heated, and the reactive metal needle (16) is a hollow structure. The expansion deformation temperature threshold of the reactive metal needle (16) is one hundred and fifty degrees Celsius.

8. The server or computer-based hardware heat sink according to claim 2, characterized in that: The inner wall of the assembly cavity (9) located at the top of the plunger (12) is designed with a wax seal layer (11), the wax seal layer (11) is made of microcrystalline wax or modified paraffin wax, and the melting point temperature of the wax seal layer (11) is configured to be one hundred and fifty degrees Celsius.

9. The server - or computer - based hardware heat sink according to any one of claims 1, 2, 3, 4, 5, 6, and 8, characterized in that: Fins (3) are installed at the bottom of the substrate (1), and the substrate (1), the encapsulation case (2), the fins (3) and the capillary microstructure layer (8) are all made of copper material with a copper content greater than or equal to 99.97% and an oxygen content less than or equal to 0.002%, and the hardness range is between 45 and 60 HV.

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