Light emitting device and light emitting unit

Abstract

The invention provides a light-emitting device which can be miniaturized. The light-emitting device includes: a support body on which a first conductive portion, a second conductive portion, and a third conductive portion are disposed separately from each other; a first light emitting element disposed on the first conductive portion; and an integrated circuit electrically connected to the first light emitting element, at least a portion of the first conductive portion being located between the second conductive portion and the third conductive portion in a first direction, the integrated circuit and the first light emitting element being arranged in a second direction orthogonal to the first direction, a maximum length of the integrated circuit in the second direction is shorter than a maximum length of the integrated circuit in the first direction.

Description

Technical Field

[0001] The present invention relates to a light-emitting device and a light-emitting unit. Background Art

[0002] For example, Patent Document 1 discloses a light-emitting device having a support, a light-emitting element disposed on the support, and an integrated circuit disposed on the support.

[0003] Prior Art Documents

[0004] Patent Documents

[0005] Patent Document 1: Japanese Unexamined Patent Application Publication No. 2016-206382. Summary of the Invention

[0006] Technical Problem to be Solved by the Invention

[0007] An object of an embodiment of the present invention is to provide a light-emitting device capable of being miniaturized.

[0008] Technical Solution for Solving the Technical Problem

[0009] A light-emitting device according to an embodiment of the present invention includes: a support, a first conductive portion, a second conductive portion, and a third conductive portion disposed on the support separately from each other; a first light-emitting element disposed on the first conductive portion; and an integrated circuit electrically connected to the first light-emitting element, at least a part of the first conductive portion being located between the second conductive portion and the third conductive portion in a first direction, the integrated circuit and the first light-emitting element being arranged in a second direction orthogonal to the first direction, and a maximum length of the integrated circuit in the second direction being shorter than a maximum length of the integrated circuit in the first direction.

[0010] Effects of the Invention

[0011] According to an embodiment of the present invention, it is possible to provide a light-emitting device capable of being miniaturized. Brief Description of the Drawings

[0012] Figure 1 is a first schematic top view of the light-emitting device according to the first embodiment.

[0013] Figure 2 is a second schematic top view of the light-emitting device according to the first embodiment.

[0014] Figure 3 is a third schematic top view of the light-emitting device according to the first embodiment.

[0015] Figure 4 is a schematic top view of the light-emitting device according to the second embodiment.

[0016] Figure 5 is a schematic top view of the light-emitting device according to the third embodiment.

[0017] Figure 6 is along Figure 5 is a schematic perspective view of the light-emitting device taken along line VI-VI in

[0018] Figure 7 is Figure 5 is a schematic cross-sectional view taken along line VII-VII in

[0019] Figure 8 is a schematic diagram showing the system structure of the light-emitting unit according to the fourth embodiment.

[0020] Figure 9 is a schematic top view of the light-emitting device according to the fifth embodiment.

[0021] Figure 10 is a schematic top view of the light-emitting unit showing the first example according to the sixth embodiment.

[0022] Figure 11 is Figure 10 is a schematic cross-sectional view taken along line XI-XI in

[0023] Figure 12 is a schematic top view of the light-emitting unit showing the second example according to the sixth embodiment.

[0024] Figure 13 is Figure 12 is a schematic cross-sectional view taken along line XIII-XIII in

[0025] Explanation of reference numerals

[0026] 1 Support body; 101 First surface; 11 First conductive part; 111 First part; 112 Second part; 113 Third part; 12 Second conductive part; 13 Third conductive part; 2 Light-emitting element; 21 First light-emitting element; 210 Geometric center of the first light-emitting element; 22 Second light-emitting element; 220 Geometric center of the second light-emitting element; 23 Third light-emitting element; 3 Integrated circuit; 30 Outer surface of the integrated circuit; 31 First outer edge; 32 Second outer edge; 33 Third outer edge; 34 Fourth outer edge; 35, 36 Corner parts; 4 First wire; 5 Second wire; 6 Through hole; 6c1 First through hole; 6c2 Second through hole; 6c3 Third through hole; 7 First reflection member; 70 Outer surface of the first reflection member; 71 Opening; 8 Second reflection member; 9 Covering member; 10 Second covering member; 51-60 Conductive parts; 100, 100a, 100b Light-emitting device; 100-1 First light-emitting device; 100-2 Second light-emitting device; 100-3 Third light-emitting device; 100-4 Fourth light-emitting device; 100-5 Fifth light-emitting device; 200, 200a, 200b Light-emitting unit; 211 Substrate; 212 Upper surface; 220a, 220b Light guide member; 220a-1 First light guide part; 220a-2 Second light guide part; 220a-3 Third light guide part; 220a-4 Fourth light guide part; 220a-5 Fifth light guide part; 220b-1 First light guide member; 220b-2 Second light guide member; 220b-3 Third light guide member; 220b-4 Fourth light guide member; 220b-5 Fifth light guide member; 221a, 221b Light incident part; 222a First reflection part; 222b First light exit part; 223a Second reflection part; 223b Second light exit part; 224 Light exit part; a Connection part; a51 Connection part for connecting the second wire to the first conductive part; CH1 First element height; CH2 Second element height; D1 First direction; D2 Second direction; D3 Third direction; e1 Minimum interval between integrated circuits in the second direction; e2 Minimum interval between the connection part and the integrated circuit in the second direction; e3 Minimum interval between the second light-emitting element and the integrated circuit in the second direction; e4 Minimum interval between the first light-emitting element and the integrated circuit in the second direction; L1 Maximum length of the integrated circuit in the first direction; L2 Maximum length of the integrated circuit in the second direction; L3 Maximum length of the first part in the first direction; L4 Maximum length of the second part in the first direction; L5 Maximum length of the opening in the first direction; TH11 First height; TH12 Second height; TH13 Third height. Detailed implementation mode

[0027] Hereinafter, embodiments will be described with reference to the drawings. Since each drawing schematically shows an embodiment, the proportions, intervals, positional relationships, etc. of each component may sometimes be exaggerated, or sometimes a part of a component may be omitted from the illustration.

[0028] In the following description, constituent elements having substantially the same function are denoted by common reference numerals, and the description may sometimes be omitted. In addition, terms indicating a specific direction or position (for example, "upper", "lower", and other terms including these terms) may be used. However, these terms are merely used for ease of understanding of the relative direction or position in the drawings referred to. As long as the relative direction or position relationship indicated by terms such as "upper" and "lower" in the drawings referred to is the same, in drawings other than those referred to in the present disclosure, actual products, etc., the configuration may not be the same as that in the drawings referred to. "Parallel" in this specification not only refers to the case where two straight lines, sides, surfaces, etc. do not intersect even when extended, but also includes the case where the angle formed by two straight lines, sides, surfaces, etc. intersects within a range of 10° or less. The positional relationship described as "upper" in this specification includes the case of contact and the case of being located above without contact.

[0029] In this specification, as a direction representation, an orthogonal coordinate system having a D1 axis, a D2 axis, and a D3 axis is used. The D1 axis, the D2 axis, and the D3 axis are orthogonal to each other. The direction along the D1 axis is set as the first direction D1, the direction along the D2 axis is set as the second direction D2, and the direction along the D3 axis is set as the third direction D3. In addition, the direction in which the arrow of the D1 axis faces is set as the right side, and the direction opposite to the right side is set as the left side. The direction in which the arrow of the D2 axis faces is set as the front, and the direction opposite to the front is set as the rear. The direction in which the arrow of the D3 axis faces is set as the upper side, and the direction opposite to the upper side is set as the lower side. Looking at an object from above is called a top view. A top view is synonymous with a plane view.

[0030] [First Embodiment]

[0031] Refer to Figures 1 to 3 , and the light-emitting device of the first embodiment will be described. Figures 1 to 3 is a schematic top view showing an example of the light-emitting device 100 of the first embodiment.

[0032] As Figures 1 to 3 shown, the light-emitting device 100 has: a support 1, on which a first conductive portion 11, a second conductive portion 12, and a third conductive portion 13 are separately arranged; a first light-emitting element 21, which is arranged on the first conductive portion 11; and an integrated circuit 3, which is electrically connected to the first light-emitting element 21. In Figures 1 to 3In the example shown, the light-emitting device 100 has a plurality of first wires 4 connected to the integrated circuit 3, a second light-emitting element 22, and a third light-emitting element 23. In addition, the plurality of first wires 4 includes a second wire 5 that connects the integrated circuit 3 and the first conductive portion 11. Further, the support 1 has a through hole 6 that is electrically connected to the first conductive portion 11. Note that the light-emitting device 100 may include a plurality of wires other than the first wires 4, may include conductive portions other than the first conductive portion 11, the second conductive portion 12, and the third conductive portion 13, and may also include through holes other than the through hole 6. The connecting portion a is a portion that connects wires such as the plurality of first wires 4 to conductive portions such as the first conductive portion 11, the second conductive portion 12, or the third conductive portion.

[0033] In the present embodiment, at least a part of the first conductive portion 11 is located between the second conductive portion 12 and the third conductive portion 13 in the first direction D1. The integrated circuit 3 and the first light-emitting element 21 are arranged in a second direction D2 orthogonal to the first direction D1. The maximum length L2 of the integrated circuit 3 in the second direction D2 is shorter than the maximum length L1 of the integrated circuit 3 in the first direction D1. With this structure, in the present embodiment, it is possible to miniaturize the light-emitting device 100 in the second direction D2, and thus it is possible to provide a light-emitting device 100 that can be miniaturized. From the viewpoint of miniaturizing the light-emitting device 100, the maximum length L2 of the integrated circuit 3 in the second direction D2 is preferably shorter than half of the maximum length L1 of the integrated circuit 3 in the first direction D1. Further, preferably, the first light-emitting element 21 is located between the second conductive portion 12 and the third conductive portion 13 in the first direction D1. With this structure, the first light-emitting element 21, the second conductive portion 12, and the third conductive portion 13 can be easily arranged at a high density, and thus the light-emitting device 100 can be easily miniaturized. In addition, preferably, the second conductive portion 12 and the third conductive portion 13 do not overlap the first light-emitting element 21 in the second direction D2. In this way, it is easy to miniaturize the light-emitting device 100 in the second direction D2.

[0034] In Figures 1 to 3 In the light-emitting device 100 shown, the integrated circuit 3 is located on the first conductive portion 11. Thus, compared with the case where the integrated circuit 3 is far from the first conductive portion 11, the gap between the integrated circuit 3 and the first conductive portion 11 can be eliminated. Since there is no such gap, in Figures 1 to 3 In the light-emitting device 100 shown, the light-emitting device 100 can be miniaturized accordingly.

[0035] In Figure 1In the light-emitting device 100 shown, the maximum length L3 in the first direction D1 of the first portion 111 of the first conductive portion 11, which includes the region overlapping with the first light-emitting element 21, is shorter than the maximum length L4 in the first direction D1 of the second portion 112 of the first conductive portion 11, which includes the region overlapping with the integrated circuit 3. According to this structure, in Figure 1 In the light-emitting device 100 shown, in the first direction D1, the first portion 111 of the first conductive portion 11, which includes the region overlapping with the first light-emitting element 21, can be accommodated within the second portion 112 of the first conductive portion 11, which includes the region overlapping with the integrated circuit 3. Therefore, the light-emitting device 100 can be miniaturized in the first direction D1. Note that in Figure 1 For ease of explanation, in [reference numeral], the dotted-line frame representing the first portion 111 and the dotted-line frame representing the second portion 112 are illustrated.

[0036] In Figure 2 In the light-emitting device 100 shown, the integrated circuit 3 includes: a first outer edge 31 that faces the first light-emitting element 21 in a top view; and a second outer edge 32 that is located on the side opposite to the first outer edge 31 in a top view. In addition, the integrated circuit 3 includes: a third outer edge 33 that is connected to the first outer edge 31 and the second outer edge 32 respectively in a top view; and a fourth outer edge 34 that is located on the side opposite to the third outer edge 33 in a top view. In Figure 2 In the light-emitting device 100 shown, in a top view, the plurality of first wires 4 are located at positions separated from the second outer edge 32. According to this structure, in Figure 2 In the light-emitting device 100 shown, since the first wires 4 are not located across the second outer edge 32, the light-emitting device 100 can be easily miniaturized in the second direction D2.

[0037] In Figure 2 In the light-emitting device 100 shown, the number of first wires 4 that overlap with the first outer edge 31 in a top view is greater than the sum of the number of first wires 4 that overlap with the third outer edge 33 and the number of first wires 4 that overlap with the fourth outer edge 34 in a top view. Thus, in Figures 1 to 3 In the light-emitting device 100 shown, it is easy to shorten the maximum length L2 of the integrated circuit 3 in the second direction D2. Therefore, the light-emitting device 100 can be easily miniaturized in the second direction D2.

[0038] In Figure 2In the light-emitting device 100 shown, the second wire 5 is connected to the third portion 113 of the first conductive portion 11 that is located between the first light-emitting element 21 and the integrated circuit 3 in the second direction D2. The longer the second wire 5 is, the more likely it is to break. By connecting the second wire 5 to the third portion 113, compared with the case where the second wire 5 is connected to a portion of the first conductive portion 11 on the side opposite to the side where the integrated circuit 3 is located with respect to the first light-emitting element 21, the second wire can be shortened. Thus, in Figure 2 the light-emitting device 100 shown, the breakage of the second wire 5 can be reduced. Note that Figure 2 the dotted-line frame indicating the third portion 113 is illustrated for ease of explanation.

[0039] In Figures 1 to 3 the light-emitting device 100 shown, the through-hole 6 is located between the first light-emitting element 21 and the integrated circuit 3 in the second direction D2. With this structure, the heat emitted from the first light-emitting element 21 and the integrated circuit 3 can escape to an external substrate or the like on which the support 1 is disposed through the through-hole 6. As a result, in Figures 1 to 3 the light-emitting device 100 shown, the heat dissipation performance of the light-emitting device 100 can be improved.

[0040] In Figure 2 the light-emitting device 100 shown, the minimum interval e1 between the integrated circuit 3 and the through-hole 6 in the second direction D2 is shorter than the minimum interval e2 between the connection portion a51, which is the portion connecting the second wire 5 to the first conductive portion 11, and the integrated circuit 3 in the second direction D2. With this structure, the integrated circuit 3 and the through-hole 6 are located nearby in a top view, so that the heat emitted from the integrated circuit 3 can escape to an external substrate or the like on which the support 1 is disposed through the through-hole 6.

[0041] In Figures 1 to 3 the light-emitting device 100 shown, the emission peak wavelength of the first light-emitting element 21 is 430 nm or more and 480 nm or less. In addition, the emission peak wavelength of the second light-emitting element 22 is 500 nm or more and 580 nm or less. In addition, the emission peak wavelength of the third light-emitting element 23 is 600 nm or more and 780 nm or less. Since the light-emitting device 100 includes the first light-emitting element 21, the second light-emitting element 22, and the third light-emitting element 23, it is easy to emit white light.

[0042] In Figure 3In the light-emitting device 100 shown, the minimum distance e3 between the second light-emitting element 22 and the integrated circuit 3 in the second direction D2 is longer than the minimum distance e4 between the first light-emitting element 21 and the integrated circuit 3 in the second direction D2. Generally, when white light is emitted from a blue-light-emitting element, a green-light-emitting element, and a red-light-emitting element, the green-light-emitting element requires a higher brightness than the blue-light-emitting element. Therefore, the current value when driving the green-light-emitting element is higher than the current value when driving the blue-light-emitting element. Thus, compared with the blue-light-emitting element, the temperature is likely to rise due to heat generation. On the other hand, since the integrated circuit also generates heat, as the heat of the integrated circuit is transferred, the light-emitting element disposed near the integrated circuit is more likely to have its temperature rise. When the junction temperature is reached due to the temperature rise, the light-emitting element may be damaged. In Figure 3 In the light-emitting device 100 shown, the minimum distance e3 between the second light-emitting element 22 and the integrated circuit 3 in the second direction D2 is longer than the minimum distance e4 between the first light-emitting element 21 and the integrated circuit 3 in the second direction D2. Thus, the situation where the heat of the integrated circuit 3 is transferred to the second light-emitting element 22 can be reduced. Thereby, in Figure 3 In the light-emitting device 100 shown, the temperature rise of the second light-emitting element 22 can be suppressed, and thus the damage of the second light-emitting element 22 can be reduced.

[0043] Each element constituting the light-emitting device 100 will be described in detail below.

[0044] (Support 1)

[0045] The support 1 is a member on which the light-emitting element 2 is mounted. The light-emitting element 2 is mounted on the upper surface. The light-emitting element 2 is joined to the upper surface of the support 1 by a joining member such as resin, solder, or conductive paste. In Figure 3In the example shown, in addition to the first conductive portion 11, the second conductive portion 12, and the third conductive portion 13, the light-emitting device 100 further includes conductive portions 51 to 60. The conductive portion 51 is a conductive portion having a substantially rectangular shape with a long side along the second direction D2 and located on the left side of the integrated circuit 3 in a plan view. The conductive portion 52 is a conductive portion having a substantially rectangular shape with a long side along the second direction D2 and located in front of the conductive portion 51 in a plan view. The conductive portion 53 is a conductive portion having a substantially rectangular shape with a long side along the second direction D2 and located in front of the conductive portion 52 in a plan view. The conductive portion 54 is a conductive portion having a shape that extends forward from the left side of the first conductive portion 11 and extends to the right side from the front end of the support 1 in a plan view. The conductive portion 55 is a conductive portion located inside the conductive portion 54 and having a shape that extends forward from the left side of the first conductive portion 11 and extends to the right side from the front end of the support 1. The conductive portion 56 is a conductive portion that extends to the right side from the front of the first conductive portion 11 and has a shape that branches to the right side and the rear side. The conductive portion 57 is a conductive portion having a shape that extends forward from the right side of the first conductive portion 11 in a plan view. The conductive portion 58 is a conductive portion having a substantially rectangular shape with a long side along the second direction D2 and located on the right side of the first conductive portion 11 in a plan view. The conductive portion 59 is a conductive portion having a substantially rectangular shape with a long side along the second direction D2 and located behind the conductive portion 58 in a plan view. The conductive portion 60 is a conductive portion having a substantially rectangular shape with a long side along the second direction D2 and located behind the conductive portion 59 in a plan view.

[0046] The support 1 may be a wiring substrate including a substrate and wirings. The substrate may be made of resin, ceramic, glass, etc. As the resin, known materials such as the above-mentioned thermosetting resin and thermoplastic resin may be used. The ceramic includes alumina, aluminum nitride, zirconia, zirconium nitride, titanium oxide, titanium nitride, or a mixture thereof. The wirings may be formed of copper, iron, nickel, tungsten, chromium, aluminum, silver, gold, titanium, palladium, rhodium, or an alloy thereof. These metals or alloys may be single-layer or multi-layer.

[0047] The first conductive portion 11, the second conductive portion 12, and the third conductive portion 13 can use wires that have conductivity and serve as electrodes for supplying power to the light-emitting element 2. The base material of the wire can be metals such as copper, aluminum, gold, silver, iron, nickel, or their alloys, phosphor bronze, or copper containing iron. They can be single-layer or laminated structures (e.g., cladding materials). In particular, it is preferable to use copper, which is inexpensive and has high heat dissipation, as the base material. In addition, the wire can have a metal layer on the surface of the base material. The metal layer includes gold, silver, aluminum, nickel, palladium, rhodium, copper, or their alloys, etc. Note that the metal layer can be provided on the entire surface of the wire or partially. In addition, in the region formed on the upper surface of the wire and the region formed on the lower surface of the wire, the metal layer can be a different layer. For example, the metal layer formed on the upper surface of the wire is a metal layer composed of multiple layers of a metal layer containing nickel and silver, and the metal layer formed on the lower surface of the wire is a metal layer that does not contain a nickel-containing metal layer. In addition, the metal layer such as gold formed on the upper surface of the wire can be thicker than the metal layer such as gold formed on the lower surface of the wire. When a silver-containing metal layer is formed on the outermost surface of the wire, it is preferable to provide a protective layer such as silicon oxide on the surface of the silver-containing metal layer. Thereby, it is possible to suppress the discoloration of the silver-containing metal layer due to sulfur components in the atmosphere, etc. The film-forming method of the protective layer can be film-formed by a vacuum process, such as sputtering, etc.

[0048] Note that the first conductive portion 11 only needs to be a component that can conduct current, and it does not have to conduct the current for causing the light-emitting element 2 to emit light. The first conductive portion 11 can also be used as a heat dissipation portion in the light-emitting device 100. The first conductive portion 11 can be composed of a metal material having conductivity and good heat dissipation, etc.

[0049] (Light-emitting element 2)

[0050] The light-emitting device 100 has at least one light-emitting element 2. In Figures 1 to 3 the example shown, the light-emitting device 100 includes a first light-emitting element 21, a second light-emitting element 22, and a third light-emitting element 23. The number of light-emitting elements 2 included in the light-emitting device 100 can be one, two, three, or more than four. Note that in Figures 1 to 3 in order to indicate that multiple light-emitting elements 2 include the first light-emitting element 21, the second light-emitting element 22, and the third light-emitting element 23, the reference numeral of the light-emitting element 2 is simultaneously marked in the reference numerals of the first light-emitting element 21, the second light-emitting element 22, and the third light-emitting element 23. In the figures shown later, the reference numerals can also be simultaneously marked for the same purpose.

[0051] In Figures 1 to 3In the example shown, the first light-emitting element 21, the second light-emitting element 22, and the third light-emitting element 23 are arranged at the center of the support 1. By arranging a plurality of light-emitting elements 2 at the center of the support 1, a plurality of light-emitting elements 2 can be arranged at a high density and the positions of the plurality of light-emitting elements 2 are not easily changed even when the plurality of light-emitting elements 2 are mounted at a position where the light-emitting device 100 rotates.

[0052] The light-emitting element 2 includes a semiconductor laminate. The semiconductor laminate includes, for example, a substrate such as sapphire or gallium nitride, an n-type semiconductor layer disposed on the substrate, a p-type semiconductor layer, and a light-emitting layer sandwiched between the n-type semiconductor layer and the p-type semiconductor layer. The light-emitting element 2 further includes an n-side electrode electrically connected to the n-type semiconductor layer and a p-side electrode electrically connected to the p-type semiconductor layer. The n-side electrode and the p-side electrode constitute a part of the upper surface of the light-emitting element 2. Note that the light-emitting element 2 may not include a substrate such as sapphire or gallium nitride. By configuring in this way, it is easy to miniaturize the light-emitting element 2.

[0053] The structure of the light-emitting layer may be a structure having a single active layer such as a double heterostructure or a single quantum well structure (SQW), or may be a structure having a set of active layer groups such as a multi-quantum well structure (MQW). The light-emitting layer can emit visible light or ultraviolet light. The light-emitting layer can emit visible light from blue to red. For example, as the semiconductor laminate including such a light-emitting layer, InxAlyGa1-x-yN (0≤x, 0≤y, x + y≤1) may be included. The semiconductor laminate may include at least one of the above-described light-emitting layers capable of emitting light. For example, the semiconductor laminate may be a structure including one or more light-emitting layers between the n-type semiconductor layer and the p-type semiconductor layer, or may be a structure repeatedly including an n-type semiconductor layer, a light-emitting layer, and a p-type semiconductor layer multiple times. When the semiconductor laminate includes a plurality of light-emitting layers, it may include light-emitting layers having different peak wavelengths or may include light-emitting layers having the same peak wavelength. Note that the so-called same peak wavelength may also be a deviation of about several nm, for example. For example, when the semiconductor laminate includes two light-emitting layers, the light-emitting layers can be selected by combinations such as blue light and blue light, green light and green light, red light and red light, ultraviolet light and ultraviolet light, blue light and green light, blue light and red light, or green light and red light. In addition, the light-emitting layer may include a plurality of active layers having different peak wavelengths or may include a plurality of active layers having the same peak wavelength.

[0054] The first light-emitting element 21 emits light including a first peak wavelength. The wavelength at which the output value of the spectrum emitted from the first light-emitting element 21 is the highest is set as the first peak wavelength. In Figures 1 to 3 In the example shown, the first light-emitting element 21 emits blue light. Note that the first light-emitting element 21 may also emit green light, red light, or the like.

[0055] The second light-emitting element 22 emits light including a second peak wavelength different from the first peak wavelength. The wavelength with the highest output value in the spectrum emitted from the second light-emitting element 22 is taken as the second peak wavelength. In Figures 1 to 3 the example shown, the second light-emitting element 22 emits green light. Note that the second light-emitting element 22 may also emit blue light, red light, etc.

[0056] The third light-emitting element 23 emits light including a third peak wavelength different from the first peak wavelength and the second peak wavelength. The wavelength with the highest output value in the spectrum emitted from the third light-emitting element 23 is taken as the third peak wavelength. In Figures 1 to 3 the example shown, the third light-emitting element 23 emits red light. Note that the third light-emitting element 23 may emit blue light, green light, etc.

[0057] (Integrated circuit 3)

[0058] In Figures 1 to 3 the example shown, the integrated circuit 3 is an electronic circuit such as a large-scale integration (LSI) that drives the light-emitting element 2 to emit light. The drive signal of the integrated circuit 3 is supplied to the integrated circuit 3 via the second conductive portion 12. The integrated circuit 3 may use, for example, an integrated circuit having the following specifications and functions. However, the specifications and functions of the integrated circuit 3 are not limited to the following specifications.

[0059] · 488 Hz, 12-bit PWM (Pulse Width Modulation) control

[0060] · Temperature correction function

[0061] · 8-bit brightness resolution (red, green, blue)

[0062] · Dimming function

[0063] · In the daisy chain method, up to 4079 light-emitting devices such as LEDs (Light Emitting Diodes) can be connected

[0064] · Supports bidirectional communication and half-duplex communication

[0065] · Supports 16 multicast address groups

[0066] · Built-in OSC (Oscillator)

[0067] · Maximum length in the first direction D1: 2.29 mm

[0068] · Maximum length in the second direction D2: 0.73 mm

[0069] Figures 1 to 3 The numbers attached to the inside of the integrated circuit 3 represent the pin numbers of the multiple pins of the integrated circuit 3. The names, types, and descriptions of the pins corresponding to the pin numbers are shown in Table 1 below. Note that the chip select signal in Table 1 represents a signal for selecting any one of the first light-emitting element 21, the second light-emitting element 22, or the third light-emitting element 23 provided in the light-emitting device 100.

[0070] [Table 1]

[0071]

[0072] The pin with the pin number 1 of the integrated circuit 3 is connected to Figure 3 the conductive portion 51 in Figure 3 The pin with the pin number 2 of the integrated circuit 3 is connected to Figure 3 the conductive portion 52 in Figure 3 The pin with the pin number 3 of the integrated circuit 3 is connected to Figure 3 the conductive portion 53 in Figure 3 The pin with the pin number 4 of the integrated circuit 3 is connected to Figure 3 the second conductive portion 12 in Figure 3 The pin with the pin number 5 of the integrated circuit 3 is connected to Figure 3 the conductive portion 54 in Figure 3 The pin with the pin number 6 of the integrated circuit 3 is connected to Figure 3 the first conductive portion 11 in Figure 3 The pin with the pin number 7 of the integrated circuit 3 is connected to Figure 3 the conductive portion 55 in Figure 3 The pin with the pin number 8 of the integrated circuit 3 is connected to Figure 3 the first conductive portion 11 in Figure 3 The pin with the pin number 9 of the integrated circuit 3 is connected to Figure 3 the first light-emitting element 21 in Figure 3 The pin with the pin number 10 of the integrated circuit 3 is connected to Figure 3The conductive portion 60 in it. Note that the positions of the pins are not particularly limited. For example, instead of the pin numbered 8 connected to the first conductive portion 11, a pin located between the pin numbered 8 and the pin numbered 9 can be connected to the first conductive portion 11.

[0073] [Second Embodiment]

[0074] Next, refer to Figure 4 to describe the light-emitting device of the second embodiment. Figure 4 is a schematic top view showing an example of the light-emitting device 100a of the second embodiment. Note that for the same names and reference numerals as those in the already described embodiments, the same or homogeneous components or structures are denoted, and detailed descriptions are appropriately omitted. This also applies to the descriptions of the embodiments shown later.

[0075] As Figure 4 shown, the main difference between the light-emitting device 100a of the present embodiment and the light-emitting device 100 of the first embodiment is that, when viewed from above, it has a first reflecting member 7 surrounding the first light-emitting element 21. The first reflecting member 7 covers at least a part of each of the first outer edge 31, the third outer edge 33, and the fourth outer edge 34 of the integrated circuit 3. With this structure, it is easy to reduce the peeling of the integrated circuit 3 from the support 1. The first reflecting member 7 may cover the second outer edge 32 of the integrated circuit 3, or as Figure 4 shown, may not cover the second outer edge 32 of the integrated circuit 3. For example, if the first reflecting member 7 covers the second outer edge 32 of the integrated circuit 3, the area of the support 1 disposed outside the second outer edge 32 needs to be increased to a certain extent, so the light-emitting device may be enlarged. In the present embodiment, since the first reflecting member 7 exposes the second outer edge 32, it is easy to reduce the area of the support 1 disposed outside the second outer edge 32. Thereby, the light-emitting device 100a can be miniaturized in the second direction D2.

[0076] In Figure 4 the shown light-emitting device 100a, the maximum length L5 of the opening 71 defined by the lower end of the inner surface of the first reflecting member 7 in the first direction D1 is shorter than the maximum length L1 of the integrated circuit 3 in the first direction D1. With this structure, the length of the first reflecting member 7 in the first direction D1 can be shortened, so in Figure 4 the shown light-emitting device 100a, the light-emitting device 100a can be miniaturized in the first direction D1.

[0077] In Figure 4In the light-emitting device 100a shown, in a plan view, the outer edge of the integrated circuit 3 has a rectangular shape. The first reflection member 7 covers two corner portions 35 of the integrated circuit 3 on the side of the first light-emitting element 21. Two corner portions 36 of the integrated circuit 3 on the side opposite to the first light-emitting element 21 are exposed from the first reflection member 7. By covering two corner portions 35 of the integrated circuit 3 on the side of the first light-emitting element 21 with the first reflection member 7, peeling of the integrated circuit 3 from the support 1 can be reduced. In addition, by exposing two corner portions 36 of the integrated circuit 3 on the side opposite to the first light-emitting element 21 from the first reflection member 7, the volume of the first reflection member 7 can be reduced. Corresponding to the reduction in the volume of the first reflection member 7, the shape deviation of the first reflection member 7 can be reduced. Thereby, the deviation in the appearance of each of the plurality of light-emitting devices 100a can be reduced.

[0078] (First reflection member 7)

[0079] The first reflection member 7 is a member having reflectivity for the light emitted by the light-emitting element 2. By providing the light-emitting device 100a with the first reflection member 7, the situation where the light emitted from the light-emitting element 2 is absorbed by the support can be reduced. Thereby, the light extraction efficiency of the light-emitting device 100a can be improved. Note that "having reflectivity" in this specification means that the reflectivity of the light-emitting element 2 for the peak wavelength is 50% or more. When the light-emitting device 100a includes a plurality of light-emitting elements 2, it is sufficient that at least one light-emitting element 2 has a reflectivity for the peak wavelength of 50% or more.

[0080] The first reflection member 7 includes, for example, a resin material as a base material and a light-reflective substance. Thermosetting resins, thermoplastic resins, etc. can be used as the resin material of the first reflection member 7. The thermoplastic resin can be a polyphthalamide resin, polybutylene terephthalate (PBT), unsaturated polyester, etc. The thermosetting resin can be an epoxy resin, a modified epoxy resin, a silicone resin, a modified silicone resin, etc. In particular, it is preferable to use thermosetting resins such as epoxy resins and silicone resins having excellent heat resistance and light resistance as the resin material.

[0081] Preferably, the first reflection member 7 contains a light-reflective substance in the resin material as a base material. As the light-reflective substance, it is preferable to use a member that hardly absorbs the light from the light-emitting element 2 and has a refractive index difference larger than that of the resin material as a base material. For example, titanium oxide, zinc oxide, silicon oxide, zirconium oxide, aluminum oxide, and aluminum nitride can be used as the light-reflective substance. The first reflection member 7 may contain a light-absorbing substance in the resin material as the above base material. As the light-absorbing substance, a dark-colored pigment such as carbon black can be used. The first reflection member 7 can be made of, for example, an inorganic material containing boron nitride and alkali metal silicate. In addition, titanium oxide or zirconium oxide may also be included.

[0082] The first reflecting member 7 can be in contact with or away from the light-emitting element 2. By bringing the first reflecting member 7 into contact with the light-emitting element 2, it is easy to increase the area of the upper surface of the support 1 covered by the first reflecting member 7. Thereby, it is easy to reduce the situation where the light from the light-emitting element 2 is absorbed by the support 1. In addition, by separating the first reflecting member 7 from the light-emitting element 2, it is easy to extract light from the side of the light-emitting element 2.

[0083] As Figure 4 illustrated, it can be that one first reflecting member 7 surrounds the entire circumference of the light-emitting element 2. However, it can also be that a plurality of first reflecting members 7 are arranged to surround the light-emitting element 2. When one first reflecting member 7 surrounds the entire circumference of the light-emitting element 2, the first reflecting member 7 is easy to increase the area of the upper surface of the support 1 covered. Thereby, it is easy to reduce the situation where the light from the light-emitting element 2 is absorbed by the support 1. In addition, when a plurality of first reflecting members 7 surround the light-emitting element, it is easy to reduce the volume of each of the plurality of first reflecting members 7. Therefore, it is easy to reduce the deviation of the shapes of the plurality of first reflecting members 7, and thus it is easy to improve the yield rate of the light-emitting device 100a.

[0084] [Third Embodiment]

[0085] Next, refer to Figures 5 to 7 to describe the light-emitting device of the third embodiment. Figure 5 is a schematic top view showing an example of the light-emitting device 100b of the third embodiment. Figure 6 is showing along Figure 5 a schematic perspective view of an example of the light-emitting device 100b taken along the line VI-VI in Figure 7 is Figure 5 a schematic cross-sectional view of the line VII-VII in

[0086] As Figure 5 and Figure 6 shown, the main difference between the light-emitting device b of the present embodiment and the light-emitting device 100a of the second embodiment is that, in a top view, the light-emitting device 100b has a covering member 9 covering the outer surfaces of the first reflecting member 7 and the integrated circuit 3 respectively. In the example shown in Figure 5 , the outer surface 30 represents the outer surface of the integrated circuit 3, and the outer surface 70 represents the outer surface of the first reflecting member 7. In addition, in the examples shown in Figure 5 and Figure 6 , the light-emitting device 100b has a second reflecting member 8 covering the side surface of the first light-emitting element 21 and the upper surface of the support 1. In the present embodiment, by covering the outer surfaces of the first reflecting member 7 and the integrated circuit 3 with the covering member 9, the external force applied to the first reflecting member 7 and the integrated circuit 3 can be reduced, thereby protecting the first reflecting member 7 and the integrated circuit 3 from the external force.

[0087] A cross-section in a direction perpendicular to the first surface 101 passing through the first light-emitting element 21 and the second light-emitting element 22 is defined as the first cross-section. As Figure 7 shown, in the second reflection member 8, in the first cross-section, the minimum height (i.e., the first height TH11) of the second reflection member 8 between the first light-emitting element 21 and the second light-emitting element 22 is higher than the minimum height (i.e., the second height TH12) of the second reflection member 8 outside the first light-emitting element 21. Further, the first height TH11 is higher than the minimum height (i.e., the third height TH13) of the second reflection member 8 outside the second light-emitting element 22. Thereby, the situation where the light emitted from the first light-emitting element 21 is absorbed by the second light-emitting element 22 can be reduced, and the situation where the light emitted from the second light-emitting element 22 is absorbed by the first light-emitting element 21 can be reduced. Note that in this specification, "outside the light-emitting element" means that the distance from the outer edge on the side of the light-emitting device close to the light-emitting element in the lateral direction is shorter than that of the light-emitting element.

[0088] As Figure 7 shown, the maximum height (i.e., the first element height CH1) of the first light-emitting element 21 is preferably 0.9 times or more and 1.1 times or less the maximum height (i.e., the second element height CH2) of the second light-emitting element 22. In this way, it is easy to reduce the non-overlapping portion between the first light-emitting element 21 and the second light-emitting element 22 in the third direction D3. Thereby, it is easy to improve the color mixing property of the light-emitting device 100. The difference between the first element height CH1 and the second element height CH2 is preferably 30 μm or less.

[0089] (Second reflection member 8)

[0090] As described above, the second reflection member 8 is a member that covers the side surface of the first light-emitting element 21 and the upper surface of the support 1. The second reflection member 8 exposes at least a part of the upper surface of the first light-emitting element. The second reflection member 8 may include a plurality of reflection particles and a base material made of a light-transmissive material. As the reflection particles, for example, the same light-reflective substance as the first reflection member 7 can be used. As the base material of the second reflection member 8, for example, the same resin material as the first reflection member 7 can be used. The second reflection member 8 may or may not sediment the reflection particles. In order to sediment the reflection particles, natural sedimentation or centrifugal sedimentation etc. can be utilized. For example, a centrifuge can be used for centrifugal sedimentation. The second reflection member 8 may be made of an inorganic material containing, for example, boron nitride or alkali metal silicate. Further, titanium oxide or zirconium oxide may also be included.

[0091] (Covering member 9)

[0092] As described above, the covering member 9 is a member that covers the outer surfaces of the first reflecting member 7 and the integrated circuit 3 in a top view. The covering member 9 is configured to include, for example, a light-reflective material that blocks light by reflecting it. The covering member 9 is used to return the light emitted from the light-emitting element 2 and reaching the covering member 9 through the first reflecting member 7 back into the first reflecting member 7. Thereby, the efficiency of extracting light from the light-emitting device 100b can be improved.

[0093] For example, a thermoplastic resin or a thermosetting resin can be used as the base material of the covering member 9. For example, in the case of using a thermoplastic resin, a polyamide resin, a polyphthalamide resin, a liquid crystal polymer, polybutylene terephthalate (PBT), or an unsaturated polyester can be used. For example, in the case of using a thermosetting resin, an epoxy resin, a modified epoxy resin, a silicone resin, a modified silicone resin, etc. can be used.

[0094] The covering member 9 can be formed of a resin material that is given light reflectivity by containing particles of a light-reflective substance as a filler in the base material. As the light-reflective substance, for example, titanium oxide, aluminum oxide, zirconium oxide, magnesium oxide, etc. can be used. The content of the filler as the light-reflective substance in the covering member 9 only needs to be 5% by mass or more and 60% by mass or less, preferably 10% by mass or more and 50% by mass or less. The average particle diameter of the filler is preferably about 0.5 μm or more and 15 μm or less. By setting the average particle diameter of the filler within this range, the covering member 9 can obtain at least one of good strength and light reflectivity. The covering member 9 can also be constituted by a light-absorbing member. The covering member 9 can also contain a light-absorbing substance in the resin material as the above-mentioned base material. As the light-absorbing substance, a dark-colored pigment such as carbon black can be used.

[0095] The covering member 9 can be formed using a resin material that is given at least one of light reflectivity and strength by containing a filler in the base material, by a molding method such as a transfer molding method, an injection molding method, a compression molding method, etc. using a mold, a coating method such as a screen printing method, etc.

[0096] (Second covering member 10)

[0097] Figure 7 The second covering member 10 in < > is a member that covers at least a part of the upper surface of the first light-emitting element 21 and at least a part of the upper surface of the second light-emitting element 22. Thereby, the upper surfaces of the first light-emitting element 21 and the second light-emitting element 22 can be protected from external forces and the like. In the present embodiment, the upper surface of the second covering member 10 is the light-emitting surface of the light-emitting device 100.

[0098] As the base material of the second cover member 10, the same material as the base material of the cover member 9 can be used. The second cover member 10 may include a plurality of reflective particles. By including a plurality of reflective particles in the second cover member 10, the light emitted from the upper surface of the first light-emitting element 21 and the light emitted from the upper surface of the second light-emitting element 22 are liable to diffuse within the second cover member 10, and thus it is easy to improve the color mixing property of the light-emitting device 100. Note that the second cover member 10 may also include a wavelength conversion member.

[0099] [Fourth Embodiment]

[0100] Next, refer to Figure 8 to describe the light-emitting unit of the fourth embodiment. Figure 8 is a schematic diagram showing an example of the system configuration of the light-emitting unit 200 of the fourth embodiment.

[0101] Figure 8 The shown light-emitting unit 200 includes a plurality of the above-described light-emitting devices 100. The plurality of light-emitting devices 100 are arranged and disposed along the first direction D1. In Figure 8 the shown example, the light-emitting unit 200 includes a plurality of light-emitting devices 100, including a first light-emitting device 100-1, a second light-emitting device 100-2, and a third light-emitting device 100-3. In the present embodiment, by arranging and disposing a plurality of light-emitting devices 100 along the first direction D1, the light-emitting unit 200 including the plurality of light-emitting devices 100 can be miniaturized in the second direction D2. Note that the light-emitting unit 200 may include a plurality of light-emitting devices 100a or a plurality of light-emitting devices 100b, or may include a combination of one or more light-emitting devices 100, one or more light-emitting devices 100a, or one or more light-emitting devices 100b.

[0102] Figure 8Each of the plurality of light-emitting devices 100 shown is built with an SPI (Serial Peripheral Interface), and can communicate with a host control via the SPI. The SPI is composed of signal lines of four systems including chip select, clock, and data lines (SDI and SDO). In the SPI, a clock signal is sent from a master device, which is the host control, to the light-emitting device 100, which is a replica device, as a slave device, and the slave device sends or receives data synchronously with the clock signal from the master device. The master device can control the plurality of light-emitting devices 100. The light-emitting units 200 connect the plurality of light-emitting devices 100 in a daisy chain. In the daisy chain, one light-emitting device 100 is connected to the master device, and the light-emitting device 100 connected to the master device and the other plurality of light-emitting devices 100 are connected by a bead chain. The light-emitting device 100 sends data to the next light-emitting device 100 while receiving the data sent from the master device. Each of the plurality of light-emitting devices 100 can transfer data between the previous light-emitting device 100 and the next light-emitting device 100. In the light-emitting unit 200, by connecting in a daisy chain, a plurality of light-emitting devices 100 can be controlled by a single master device such as a microcontroller.

[0103] In Figure 8 In the light-emitting unit 200 shown, the second conductive portion 12 is connected to an input terminal that inputs an electrical signal from an adjacent light-emitting device 100, and the third conductive portion 13 is connected to an output terminal that outputs an electrical signal to an adjacent light-emitting device 100. In other words, in Figure 8 the light-emitting unit 200 shown, the plurality of light-emitting devices 100 are connected in a daisy chain.

[0104] A more specific description will be given. In Figure 8 In the first light-emitting device 100-1 shown, the conductive portion 60 inputs the data SDO_IN from the second light-emitting device 100-2. In addition, in the first light-emitting device 100-1, the third conductive portion 13 outputs a chip select signal CSX_OUT to the adjacent second light-emitting device 100-2, the conductive portion 58 outputs a clock signal SCLK_OUT to the adjacent second light-emitting device 100-2, and the conductive portion 59 outputs a data signal SDI_OUT to the adjacent second light-emitting device 100-2.

[0105] In Figure 8In the second light-emitting device 100-2 shown, the second conductive portion 12 inputs the chip select signal CSX_IN from the adjacent first light-emitting device 100-1, the conductive portion 53 inputs the clock signal SCLK_IN from the adjacent first light-emitting device 100-1, and the conductive portion 52 inputs the data signal SDI_IN from the adjacent first light-emitting device 100-1. Further, in the second light-emitting device 100-2, the conductive portion 51 outputs the data SDO_OUT to the adjacent first light-emitting device 100-1. Further, in the second light-emitting device 100-2, the third conductive portion 13 outputs the chip select signal CSX_OUT to the adjacent third light-emitting device 100-3, the conductive portion 58 outputs the clock signal SCLK_OUT to the adjacent third light-emitting device 100-3, and the conductive portion 59 outputs the data signal SDI_OUT to the adjacent third light-emitting device 100-3.

[0106] In Figure 8 In the third light-emitting device 100-3 shown, the second conductive portion 12 inputs the chip select signal CSX_IN from the adjacent second light-emitting device 100-2, the conductive portion 53 inputs the clock signal SCLK_IN from the adjacent second light-emitting device 100-2, and the conductive portion 52 inputs the data signal SDI_IN from the adjacent second light-emitting device 100-2. Further, in the third light-emitting device 100-3, the conductive portion 51 outputs the data SDO_OUT to the adjacent second light-emitting device 100-2.

[0107] By daisy-chain connecting a plurality of light-emitting devices 100, in Figure 8 the light-emitting unit 200 shown, the light-emitting unit 200 including a plurality of light-emitting devices 100 can be miniaturized in the second direction D2, and wiring or connection management of the plurality of light-emitting devices 100 can be efficiently performed.

[0108] In Figure 8 the light-emitting unit 200 shown, each of the support bodies 1 included in each of the plurality of light-emitting devices 100 includes a fourth conductive portion on one side in the first direction D1 of the integrated circuit 3 and a fifth conductive portion on the other side in the first direction D1 of the integrated circuit 3. In Figure 8 the example shown, "one side" is the left side when viewed from above, and "the other side" is the right side when viewed from above. Figure 3 Each of the conductive portion 51, the conductive portion 52, the conductive portion 53, and the second conductive portion 12 shown corresponds to the fourth conductive portion. Further, Figure 3 each of the conductive portion 60, the conductive portion 59, the conductive portion 58, and the third conductive portion 13 shown corresponds to the fifth conductive portion.

[0109] Each of the fourth conductive portion and the fifth conductive portion can perform either input or output of an electrical signal. In Figure 8In the light-emitting unit 200 shown, by including the fourth conductive portion and the fifth conductive portion, the number of input / outputs of electrical signals for each of the plurality of light-emitting devices 100 can be increased, and the degree of freedom of control for each of the plurality of light-emitting devices 100 can be improved without increasing the size of the light-emitting unit 200 in the second direction D2.

[0110] [Fifth Embodiment]

[0111] Next, the light-emitting device of the fifth embodiment will be described. Figure 9 is a schematic plan view of the light-emitting device 100c of the fifth embodiment.

[0112] The light-emitting device 100c of the present embodiment is different from the light-emitting device 100 of the first embodiment in that it has an integrated circuit 3c, a first through hole 6c1, a second through hole 6c2, and a third through hole 6c3. The first through hole 6c1, the second through hole 6c2, and the third through hole 6c3 are through holes provided on the support 1 and electrically connected to the first conductive portion 11, respectively.

[0113] The first through hole 6c1, the second through hole 6c2, and the third through hole 6c3 are located between the first light-emitting element 21 and the integrated circuit 3c in the second direction D2. According to this structure, the heat generated from each of the first light-emitting element 21 and the integrated circuit 3 can be dissipated to the external substrate or the like on which the support 1 is disposed through each of the first through hole 6c1, the second through hole 6c2, and the third through hole 6c3. As a result, in the light-emitting device 100c, the heat dissipation performance of the light-emitting device 100c is improved.

[0114] In the integrated circuit 3c, the arrangement of a part of the pins is different from that of the integrated circuit 3 of the light-emitting device 100 of the first embodiment. In Figure 9 The numbers attached inside the integrated circuit 3c represent the pin numbers of the plurality of pins included in the integrated circuit 3c. Table 2 below shows the names, types, and descriptions of the pins corresponding to the pin numbers.

[0115] [Table 2]

[0116]

[0117] As shown in Table 2, the pin with the pin number 10 is the power ground of the first light-emitting element 21. The pin with the pin number 12 is the power ground of the third light-emitting element 23. The pin with the pin number 14 is the power ground of the second light-emitting element 22. In the integrated circuit 3c, these pins are different from the integrated circuit 3 of the light-emitting device 100 of the first embodiment.

[0118] In the integrated circuit 3c, other pins are arranged between the output pin leading to the first light-emitting element 21 (i.e., the pin with pin number 9) and the output pin leading to the third light-emitting element 23 (i.e., the pin with pin number 11). For example, near the output pin that controls the current flowing to the light-emitting element, the temperature tends to rise. By arranging other pins between the output pin leading to the first light-emitting element 21 and the output pin leading to the third light-emitting element 23, the distance between these output pins becomes longer compared to the case where they are adjacent to the output pin leading to the first light-emitting element 21 and the output pin leading to the third light-emitting element 23. As a result, the temperature rise of the integrated circuit 3c is likely to be reduced.

[0119] In the integrated circuit 3c, the power ground pin of the first light-emitting element 21 (i.e., the pin with pin number 10) is arranged beside the output pin leading to the first light-emitting element 21 (i.e., the pin with pin number 9). Thereby, in the light-emitting device 100c, the external noise applied to the output pin leading to the first light-emitting element 21 and the power ground pin of the first light-emitting element 21 becomes of the same level. As a result, the external noise is eliminated, making it easier to reduce the influence of the external noise and making it easier to reduce the internal noise applied to the output pin leading to the first light-emitting element 21.

[0120] In the light-emitting device 100c, the minimum interval Lg between the geometric center 220 of the second light-emitting element 22 in the first direction D1 and the output pin leading to the second light-emitting element 22 (i.e., the pin with pin number 13) is longer than the minimum interval Lb between the geometric center 210 of the first light-emitting element 21 in the first direction D1 and the output pin leading to the first light-emitting element 21 (i.e., the pin with pin number 9). Thereby, the distance between the second light-emitting element 22, which has a higher current value and is more likely to have its temperature rise compared to the first light-emitting element 21, and the output pin leading to the second light-emitting element 22 is longer than the distance between the first light-emitting element 21 and the output pin leading to the first light-emitting element 21. As a result, the temperature rise of the light-emitting device 100c is likely to be reduced. Note that the light-emitting device 100c of this embodiment, the light-emitting device 100a of the second embodiment, or the light-emitting device 100b of the third embodiment can also be combined.

[0121] [Sixth Embodiment]

[0122] Next, the light-emitting unit of the sixth embodiment will be described. The light-emitting unit of the sixth embodiment is different from the light-emitting unit 200 of the fourth embodiment in that it includes a plurality of light-emitting devices 100 and a light guide member that is arranged above the plurality of light-emitting devices 100 and guides the light emitted from the plurality of light-emitting devices 100.

[0123] [First Example]

[0124] Figure 10It is a schematic plan view of the light-emitting unit 200a showing the first example of the sixth embodiment. Figure 11 is Figure 10 a schematic cross-sectional view taken along line XI-XI in

[0125] The light-emitting unit 200a includes a substrate 211, a first light-emitting device 100-1, a second light-emitting device 100-2, a third light-emitting device 100-3, a fourth light-emitting device 100-4, a fifth light-emitting device 100-5, and a light guide member 220a. The light-emitting unit 200a is, for example, a light-emitting unit used for ambient lighting.

[0126] In Figure 10 the first example shown, the first light-emitting device 100-1, the second light-emitting device 100-2, the third light-emitting device 100-3, the fourth light-emitting device 100-4, and the fifth light-emitting device 100-5 are arranged along a first direction D1 on the upper surface 212 of the substrate 211. Any one of the light-emitting devices 100, 100a, 100b, or 100c can be used for the first light-emitting device 100-1, the second light-emitting device 100-2, the third light-emitting device 100-3, the fourth light-emitting device 100-4, and the fifth light-emitting device 100-5. Note that, for ease of explanation, hereinafter, without distinguishing between the first light-emitting device 100-1, the second light-emitting device 100-2, the third light-emitting device 100-3, the fourth light-emitting device 100-4, and the fifth light-emitting device 100-5, they are sometimes collectively referred to as the light-emitting device 100.

[0127] The light guide member 220a is a member that allows light emitted from a plurality of light-emitting devices 100 to enter the inside of the light guide member 220a, guides the light inside the light guide member 220a, and then exits from the inside of the light guide member 220a to the outside. The light guide member 220a has a substantially rectangular outer shape with a long side along the first direction D1 in a plan view, where the first direction D1 is the direction in which the first light-emitting device 100-1, the second light-emitting device 100-2, the third light-emitting device 100-3, and the fourth light-emitting device 100-4 are arranged. The light guide member 220a has a transmittance of 60% or more for light emitted from the light-emitting device 100.

[0128] The light guide member 220a includes a first light guide portion 220a-1, a second light guide portion 220a-2, a third light guide portion 220a-3, a fourth light guide portion 220a-4, a fifth light guide portion 220a-5, and a light exit portion 224. The first light guide portion 220a-1 is disposed above the first light emitting device 100-1 and guides the light from the first light emitting device 100-1. The second light guide portion 220a-2 is disposed above the second light emitting device 100-2 and guides the light from the second light emitting device 100-2. The third light guide portion 220a-3 is disposed above the third light emitting device 100-3 and guides the light from the third light emitting device 100-3. The fourth light guide portion 220a-4 is disposed above the fourth light emitting device 100-4 and guides the light from the fourth light emitting device 100-4. The fifth light guide portion 220a-5 is disposed above the fifth light emitting device 100-5 and guides the light from the fifth light emitting device 100-5.

[0129] The first light guide portion 220a-1, the second light guide portion 220a-2, the third light guide portion 220a-3, the fourth light guide portion 220a-4, and the fifth light guide portion 220a-5 each include a light incident portion 221a, a first reflection portion 222a, and a second reflection portion 223a.

[0130] The light incident portion 221a is the portion through which the light from the light emitting device 100 enters the inside of the light guide member 220a. In addition, in the cross-sectional view along the first direction D1 and the third direction D3 shown, the light incident portion 221a is the portion that forms a concave portion recessed upward. In the top view shown, the light incident portion 221a has a substantially rectangular outer shape. Figure 11 In the cross-sectional view along the first direction D1 and the third direction D3 shown, the light incident portion 221a is the portion that forms a concave portion recessed upward. In the top view shown, the light incident portion 221a has a substantially rectangular outer shape. Figure 10 In the top view shown, the light incident portion 221a has a substantially rectangular outer shape.

[0131] The first reflection portion 222a and the second reflection portion 223a are members that reflect a part of the light that reaches the first reflection portion 222a and the second reflection portion 223a among the light incident from the light incident portion 221a upward. The first reflection portion 222a and the second reflection portion 223a are arranged with the light incident portion 221a interposed therebetween in the first direction D1.

[0132] A part of the light guided inside the light guide member 220a through the light incident portion 221a exits the light guide member 220a through the light exit portion 224. Another part of the light that passes through the light incident portion 221a and transmits through the light guide member 220a is reflected by the first reflection portion 222a or the second reflection portion 223a and then exits the light guide member 220a through the light exit portion 224. The light exit portion 224 is a light exit portion shared by the first light guide portion 220a-1, the second light guide portion 220a-2, the third light guide portion 220a-3, the fourth light guide portion 220a-4, and the fifth light guide portion 220a-5.

[0133] The light-emitting unit 200a guides the light emitted from the first light-emitting device 220-1, the second light-emitting device 100-2, the third light-emitting device 100-3, the fourth light-emitting device 100-4, and the fifth light-emitting device 100-5 through the light guide member 220a, so that the distribution of the light emitted from the light guide member 220a can be controlled.

[0134] (Second example)

[0135] Figure 12 FIG. is a schematic plan view of the light-emitting unit 200b showing a second example of the sixth embodiment. Figure 13 is Figure 12 a schematic sectional view taken along line XIII-XIII in. Note that in the plan view of Figure 12 in order to avoid making the view too complex, sometimes a part of the structure corresponding to the sectional view of Figure 13 is omitted from the illustration.

[0136] The light-emitting unit 200b includes a substrate 211, a first light-emitting device 100-1, a second light-emitting device 100-2, a third light-emitting device 100-3, a fourth light-emitting device 100-4, a fifth light-emitting device 100-5, and a light guide member 220b. The light-emitting unit 200b is a light-emitting unit used as a backlight for a liquid crystal display panel, an organic EL (Electro Luminescence) display panel, or the like.

[0137] In Figure 11 the second example shown, the first light-emitting device 100-1, the second light-emitting device 100-2, the third light-emitting device 100-3, the fourth light-emitting device 100-4, and the fifth light-emitting device 100-5 are arranged and disposed on the upper surface 212 of the substrate 211 along the first direction D1. Any one of the light-emitting device 100, the light-emitting device 100a, the light-emitting device 100b, or the light-emitting device 100c can be used for the first light-emitting device 100-1, the second light-emitting device 100-2, the third light-emitting device 100-3, the fourth light-emitting device 100-4, and the fifth light-emitting device 100-5.

[0138] The light guide member 220b includes a first light guide member 220b-1, a second light guide member 220b-2, a third light guide member 220b-3, a fourth light guide member 220b-4, and a fifth light guide member 220b-5.

[0139] The first light guide member 220b-1 is disposed above the first light-emitting device 100-1. The first light guide member 220b-1 is a member that allows the light emitted from the first light-emitting device 100-1 to enter the first light guide member 220b-1, guides the light inside the first light guide member 220b-1, and then emits the light to the outside from the first light guide member 220b-1.

[0140] The second light guide member 220b-2 is disposed above the second light emitting device 100-2. The second light guide member 220b-2 is a member that allows the light emitted from the second light emitting device 100-2 to enter the inside of the second light guide member 220b-2, guides the light inside the second light guide member 220b-2, and then exits from the inside of the second light guide member 220b-2 to the outside.

[0141] The third light guide member 220b-3 is disposed above the third light emitting device 100-3. The third light guide member 220b-3 is a member that allows the light emitted from the third light emitting device 100-3 to enter the inside of the third light guide member 220b-3, guides the light inside the third light guide member 220b-3, and then exits from the inside of the third light guide member 220b-3 to the outside.

[0142] The fourth light guide member 220b-4 is disposed above the fourth light emitting device 100-4. The fourth light guide member 220b-4 is a member that allows the light emitted from the fourth light emitting device 100-4 to enter the inside of the fourth light guide member 220b-4, guides the light inside the fourth light guide member 220b-4, and then exits from the inside of the fourth light guide member 220b-4 to the outside.

[0143] The fifth light guide member 220b-5 is disposed above the fifth light emitting device 100-5. The fifth light guide member 220b-5 is a member that allows the light emitted from the fifth light emitting device 100-5 to enter the inside of the fifth light guide member 220b-5, guides the light inside the fifth light guide member 220b-5, and then exits from the inside of the fifth light guide member 220b-5 to the outside.

[0144] In a plan view, the first light guide member 220b-1, the second light guide member 220b-2, the third light guide member 220b-3, the fourth light guide member 220b-4, and the fifth light guide member 220b-5 each have a substantially circular outer shape and have a light transmittance of 60% or more with respect to the light emitted from the light emitting device 100. In addition, the first light guide member 220b-1, the second light guide member 220b-2, the third light guide member 220b-3, the fourth light guide member 220b-4, and the fifth light guide member 220b-5 each include a light incident portion 221b, a first light exit portion 222b, and a second light exit portion 223b.

[0145] The light incident portion 221b is a substantially flat portion through which the light from the light emitting device 100 enters the inside of the light guide member 220b. The light incident portion 221b has a substantially circular outer shape in a plan view.

[0146] The first light-emitting portion 222b is a curved surface portion through which a part of the light emitted from the light-emitting device 100 and passing through the inside of the light guide member 220b exits from the light guide member 220b. The first light-emitting portion 222b has a substantially circular ring shape in a top view.

[0147] The second light-emitting portion 223b is a substantially flat portion through which a part of the light emitted from the light-emitting device 100 and passing through the inside of the light guide member 220b exits from the light guide member 220b. The second light-emitting portion 223b has a substantially circular outer shape in a top view.

[0148] In the light-emitting unit 200b, by guiding the light emitted from the first light-emitting device 100-1, the second light-emitting device 100-2, the third light-emitting device 100-3, the fourth light-emitting device 100-4, and the fifth light-emitting device 100-5 using the light guide member 220b, the distribution of the light emitted from the light guide member 220b can be controlled.

[0149] The light guide members of the light-emitting units of the sixth embodiment are not limited to the light guide member 220a shown in the first example and the light guide member 220b shown in the second example. The light guide members of the light-emitting units of the sixth embodiment may be, for example, one or more convex lenses, one or more concave lenses, one or more meniscus lenses, one or more Fresnel lenses, one or more diffractive lenses, one or more cylindrical lenses, or a combination thereof.

[0150] The preferred embodiments have been described in detail above, but are not limited to the above embodiments, and various modifications and substitutions can be made to the above embodiments without departing from the scope described in the claims.

[0151] To specifically illustrate the technology of the present invention, all the numbers such as ordinal numbers and numbers used in the description of the embodiments are illustrative, and the present invention is not limited to the illustrative numbers. In addition, to specifically illustrate the technology of the present invention, the connection relationships between the components are illustrative and are not limited to the connection relationships for realizing the functions of the present invention.

[0152] Since the light-emitting device and the light-emitting unit of the present invention can be miniaturized, they can be preferably used, for example, as light-emitting devices for vehicle interiors such as automobiles. However, the light-emitting devices and the light-emitting units of the present invention are not limited to vehicle interiors and can be used for various purposes.

[0153] The embodiments of the present invention are as follows, for example.

[0154] <Item 1>A light-emitting device, comprising: a support; a first conductive portion, a second conductive portion, and a third conductive portion disposed separately from each other on the support; a first light-emitting element disposed on the first conductive portion; and an integrated circuit electrically connected to the first light-emitting element, at least a part of the first conductive portion being located between the second conductive portion and the third conductive portion in a first direction, the integrated circuit and the first light-emitting element being arranged in a second direction orthogonal to the first direction, and a maximum length of the integrated circuit in the second direction being shorter than a maximum length of the integrated circuit in the first direction.

[0155] <Item 2>The light-emitting device according to the above <Item 1>, wherein the integrated circuit is located on the first conductive portion.

[0156] <Item 3>The light-emitting device according to the above <Item 2>, wherein a maximum length in the first direction of a first portion of the first conductive portion including a region overlapping with the first light-emitting element is shorter than a maximum length in the first direction of a second portion of the first conductive portion including a region overlapping with the integrated circuit.

[0157] <Item 4>The light-emitting device according to any one of the above <Item 1> to <Item 3>, wherein the light-emitting device includes a plurality of first wires connected to the integrated circuit, and the integrated circuit has: a first outer edge opposite to the first light-emitting element in a top view; a second outer edge located on a side opposite to the first outer edge in a top view; a third outer edge connected to the first outer edge and the second outer edge respectively in a top view; and a fourth outer edge located on a side opposite to the third outer edge, and in the top view, the plurality of first wires are located at positions separated from the second outer edge.

[0158] <Item 5>The light-emitting device according to the above <Item 4>, wherein a number of the first wires overlapping with the first outer edge in a top view is greater than a sum of a number of the first wires overlapping with the third outer edge and a number of the first wires overlapping with the fourth outer edge in a top view.

[0159] <Item 6>The light-emitting device according to the above <Item 4>, wherein the plurality of first wires include second wires connecting the integrated circuit and the first conductive portion, and the second wires are connected to a third portion of the first conductive portion, and the third portion of the first conductive portion is located between the first light-emitting element and the integrated circuit in the second direction.

[0160] <Item 7> The light-emitting device according to <Item 6> above, wherein the support has a through hole connected to the first conductive portion, and the through hole is located between the first light-emitting element and the integrated circuit in the second direction.

[0161] <Item 8> The light-emitting device according to <Item 7> above, wherein a minimum distance between the integrated circuit and the through hole in the second direction is shorter than a minimum distance between a connection portion, which is a portion connecting the second wire to the first conductive portion, and the integrated circuit in the second direction.

[0162] <Item 9> The light-emitting device according to any one of <Item 1> to <Item 8> above, wherein the light-emitting device further includes a second light-emitting element and a third light-emitting element, a peak emission wavelength of the first light-emitting element is 430 nm or more and 480 nm or less, a peak emission wavelength of the second light-emitting element is 500 nm or more and 580 nm or less, and a peak emission wavelength of the third light-emitting element is 600 nm or more and 780 nm or less.

[0163] <Item 10> The light-emitting device according to <Item 9> above, wherein a minimum distance between the second light-emitting element and the integrated circuit in the second direction is longer than a minimum distance between the first light-emitting element and the integrated circuit in the second direction.

[0164] <Item 11> The light-emitting device according to <Item 7> above, wherein the light-emitting device includes a first reflection member, and in a plan view, the first reflection member surrounds the first light-emitting element, and the first reflection member covers at least a part of each of the first outer edge, the third outer edge, and the fourth outer edge of the integrated circuit.

[0165] <Item 12> The light-emitting device according to <Item 11> above, wherein a maximum length in the first direction of an opening defined by a lower end of an inner surface of the first reflection member is shorter than a maximum length in the first direction of the integrated circuit.

[0166] <Item 13> The light-emitting device according to <Item 11> or <Item 12> above, wherein in a plan view, an outer edge of the integrated circuit has a rectangular shape, the first reflection member covers two corner portions of the integrated circuit on the first light-emitting element side, and two corner portions of the integrated circuit on a side opposite to the first light-emitting element are exposed from the first reflection member.

[0167] <Item 14> The light-emitting device according to any one of <Item 11> to <Item 13> above, wherein the light-emitting device further includes a covering member, and in a plan view, the covering member covers outer surfaces of the first reflection member and the integrated circuit respectively.

[0168] <Item 15> A light-emitting unit, comprising: a plurality of light-emitting devices according to any one of the above <Item 1> to the above <Item 14>, and the plurality of light-emitting devices are arranged and configured along the first direction.

[0169] <Item 16> The light-emitting unit according to the above <Item 15>, wherein the second conductive portion is connected to an input terminal for inputting an electrical signal from an adjacent light-emitting device, and the third conductive portion is connected to an output terminal for outputting an electrical signal to an adjacent light-emitting device.

[0170] <Item 17> The light-emitting unit according to the above <Item 15> or the above <Item 16>, wherein the support body included in each of the plurality of light-emitting devices further has: a fourth conductive portion located on one side in the first direction of the integrated circuit; and a fifth conductive portion located on the other side in the first direction of the integrated circuit.

Claims

1. A light emitting device, comprising: A support body, on which the first conductive part, the second conductive part and the third conductive part are separately arranged; A first light emitting element is disposed on the first conductive portion; as well as an integrated circuit, electrically connected to the first light emitting element, At least a portion of the first conductive portion is located between the second conductive portion and the third conductive portion in the first direction, The integrated circuit and the first light emitting element are arranged along a second direction, and the second direction is orthogonal to the first direction. A maximum length of the integrated circuit in the second direction is shorter than a maximum length of the integrated circuit in the first direction.

2. The light emitting device according to claim 1, wherein: The integrated circuit is located on the first conductive portion.

3. The light emitting device according to claim 2, wherein: A maximum length of a first portion of the first conductive portion including a region overlapping the first light emitting element in the first direction is shorter than a maximum length of a second portion of the first conductive portion including a region overlapping the integrated circuit in the first direction.

4. The light emitting device according to any one of claims 1 to 3, wherein: The light emitting device comprises a plurality of first conductive lines connected to the integrated circuit. The integrated circuit comprises: a first outer edge, which is opposite to the first light emitting element when viewed from above; a second outer edge, which is located on the side opposite to the first outer edge when viewed from above; a third outer edge, which is connected to the first outer edge and the second outer edge respectively when viewed from above; and a fourth outer edge, which is located on the side opposite to the third outer edge. In a plan view, the plurality of first conductive lines are located at positions separated from the second outer edge.

5. The light emitting device according to claim 4, wherein: The number of the first conductive lines overlapping the first outer edge in a plan view is greater than the sum of the number of the first conductive lines overlapping the third outer edge in a plan view and the number of the first conductive lines overlapping the fourth outer edge in a plan view.

6. The light emitting device according to claim 4, wherein: The plurality of first conductive lines include a second conductive line, wherein the second conductive line connects the integrated circuit to the first conductive portion. The second conductive line is connected to a third portion of the first conductive portion, and the third portion of the first conductive portion is located between the first light emitting element and the integrated circuit in the second direction.

7. The light emitting device according to claim 6, wherein: The support body has a through hole connected to the first conductive part, The through hole is located between the first light emitting element and the integrated circuit in the second direction.

8. The light emitting device according to claim 7, wherein: A minimum distance between the integrated circuit and the through hole in the second direction is shorter than a minimum distance between a connecting portion and the integrated circuit in the second direction, the connecting portion being a portion connecting the second conductive line to the first conductive portion.

9. The light emitting device according to any one of claims 1 to 8, wherein: The light emitting device further comprises a second light emitting element and a third light emitting element, The peak wavelength of light emission of the first light emitting element is greater than or equal to 430 nm and less than or equal to 480 nm. The second light emitting element has a peak emission wavelength of 500 nm to 580 nm. The third light emitting element has a peak emission wavelength of 600 nm to 780 nm.

10. The light emitting device according to claim 9, wherein: A minimum distance between the second light emitting element and the integrated circuit in the second direction is longer than a minimum distance between the first light emitting element and the integrated circuit in the second direction.

11. The light emitting device according to claim 7, wherein: The light emitting device comprises a first reflective component, wherein the first reflective component surrounds the first light emitting element when viewed from above. The first reflective component covers at least a portion of each of the first outer edge, the third outer edge, and the fourth outer edge of the integrated circuit.

12. The light emitting device according to claim 11, wherein: A maximum length of an opening portion defined by a lower end of an inner surface of the first reflective member in the first direction is shorter than a maximum length of the integrated circuit in the first direction.

13. The light emitting device according to claim 11 or 12, wherein: When viewed from above, the outer edge of the integrated circuit has a rectangular shape, The first reflective member covers two corners of the integrated circuit located on the first light emitting element side. Two corners of the integrated circuit located on the side opposite to the first light emitting element are exposed from the first reflecting member.

14. The light emitting device according to any one of claims 11 to 13, wherein: The light emitting device further includes a covering component, and in a plan view, the covering component covers outer surfaces of the first reflecting component and the integrated circuit respectively.

15. A light emitting unit, comprising: A plurality of light emitting devices according to any one of claims 1 to 14, The plurality of light emitting devices are arranged along the first direction.

16. The light emitting unit according to claim 15, wherein: The second conductive portion is connected to an input terminal for inputting an electrical signal from the adjacent light emitting device. The third conductive portion is connected to an output terminal for outputting an electrical signal to the adjacent light emitting device.

17. The light emitting unit according to claim 15 or 16, wherein: The support body included in each of the plurality of light emitting devices further comprises: a fourth conductive portion, located at one side of the integrated circuit in the first direction; and The fifth conductive portion is located at the other side of the integrated circuit in the first direction.

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