Electroluminescent display device

Abstract

An electroluminescent display device according to an embodiment of the present invention may include: a substrate divided into a display area and a non-display area disposed outside the display area; the insulating layer is arranged above the substrate; a light emitting element disposed on the insulating layer; a bonding layer provided on the light emitting element; a package substrate disposed on the bonding layer; and a side sealing portion covering a side surface of the bonding layer and a side surface of the package substrate, thereby blocking or delaying introduction of moisture and improving reliability of the display panel.

Description

[0001] Cross - reference to related applications

[0002] This application claims priority to Korean Patent Application No. 10 - 2023 - 0189783, filed with the Korean Intellectual Property Office on December 22, 2023, the disclosure of which is incorporated herein by reference. Technical Field

[0003] The present invention relates to an electroluminescent display device, and more particularly, to an electroluminescent display device having a narrow bezel. Background Art

[0004] Recently, as the information age has fully arrived, display devices for visually displaying electrical information signals are rapidly developing. Various studies are continuously being conducted to develop various display devices that are thin, light - weight, low - power - consuming, and have improved performance.

[0005] As representative display devices, there are liquid crystal display devices (LCDs), electro - wetting display devices (EWDs), organic light - emitting display devices (OLEDs), etc.

[0006] Among these display devices, electroluminescent display devices including organic light - emitting display devices are display devices that emit light autonomously. Different from liquid crystal display devices, electroluminescent display devices do not require a separate light source, and thus can be manufactured as thin and light - weight display devices. In addition, electroluminescent display devices are advantageous in terms of power consumption because they operate at low voltages. In addition, electroluminescent display devices are expected to be adopted in various fields because they are also excellent in terms of color realization, response speed, viewing angle, and contrast ratio (CR).

[0007] An electroluminescent display device is configured such that a light - emitting layer made of an organic material is disposed between two electrodes called an anode and a cathode. In addition, when positive holes are injected from the anode into the light - emitting layer and electrons are injected from the cathode into the light - emitting layer, the injected electrons and positive holes recombine in the light - emitting layer and generate excitons. Summary of the Invention

[0008] An object of the present invention is to provide an electroluminescent display device capable of reducing the bezel width and blocking or delaying the introduction of moisture.

[0009] The object of the present invention is not limited to the above - mentioned object, and other objects not mentioned above can be clearly understood by those of ordinary skill in the art from the following description.

[0010] To achieve the above object, an aspect of the present invention provides an electroluminescent display device, including: a substrate which is divided into a display area and a non-display area disposed outside the display area; an insulating layer disposed above the substrate; a light-emitting element disposed on the insulating layer; a bonding layer disposed on the light-emitting element; a package substrate disposed on the bonding layer; and a side-sealing part which covers a side surface of the bonding layer and a side surface of the package substrate.

[0011] Other details of the exemplary embodiments are included in the detailed description and the drawings.

[0012] According to the present invention, a side-sealing part is added to the outside of the display panel, and an additional bonding layer and an additional package substrate are formed on the side surface and the upper part of the display panel, thereby blocking or delaying the introduction of moisture, and thus improving the reliability of the display panel.

[0013] According to the present invention, an additional side-sealing part can be formed on the outside of the upper part of the optical member to block light leakage, thereby improving the image quality of the display panel.

[0014] The effects according to the present invention are not limited to those exemplified above, and more various effects are included in the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The above and other aspects, features, and other advantages of the present invention will be more clearly understood from the following detailed description in conjunction with the accompanying drawings, in which:

[0016] Figure 1 is a block diagram of an electroluminescent display device according to a first embodiment of the present invention;

[0017] Figure 2 is a circuit diagram of a sub-pixel of an electroluminescent display device according to a first embodiment of the present invention;

[0018] Figure 3 is a top plan view of an electroluminescent display device according to a first embodiment of the present invention;

[0019] Figure 4 is a cross-sectional view of a sub-pixel;

[0020] Figure 5 is along Figure 3 a cross-sectional view taken along line I-I' in

[0021] Figure 6 is a top plan view of an electroluminescent display device according to a second embodiment of the present invention;

[0022] Figure 7 is along Figure 6 a cross-sectional view taken along line II-II' in

[0023] Figure 8 is a top - view plan view of an electroluminescent display device according to a third embodiment of the present invention;

[0024] Figure 9 is along Figure 8 a cross - sectional view taken along line III - III' in

[0025] Figures 10A to 10F is an exemplary cross - sectional view illustrating the manufacturing process of the electroluminescent display device in Figure 9 according to a third embodiment of the present invention;

[0026] Figure 11 is a top - view plan view of an electroluminescent display device according to a fourth embodiment of the present invention. Detailed Embodiments

[0027] The advantages and features of the present invention and the methods for achieving these advantages and features will be clear by referring to the exemplary embodiments described in detail below in conjunction with the accompanying Figure One However, the present invention is not limited to the exemplary embodiments disclosed herein, but will be implemented in various forms. The exemplary embodiments are provided only by way of example so that those skilled in the art can fully understand the disclosure of the present invention and the scope of the present invention.

[0028] The shapes, sizes, ratios, angles, quantities, etc. shown in the drawings for describing the exemplary embodiments of the present invention are merely examples, and the present invention is not limited thereto. Similar reference numerals generally denote similar elements throughout the application. In addition, in the following description of the present invention, detailed explanations of known related technologies may be omitted to avoid unnecessarily obscuring the subject matter of the present invention. Terms such as "comprising", "having", and "including" used herein generally intend to allow the addition of other components, unless these terms are used together with the term "only". Any singular reference may include the plural, unless otherwise explicitly stated.

[0029] Even if not explicitly stated, components are construed to include ordinary error ranges.

[0030] When describing the positional relationship between two parts using terms such as "on", "above", "below", and "after", one or more parts may be placed between the two parts, unless these terms are used together with the terms "immediately" or "directly".

[0031] When an element or layer is disposed "on" another element or layer, it may be directly on the other element or layer, or other layers or other elements may be interposed therebetween.

[0032] Although terms such as "first" and "second" are used to describe various components, these components are not limited by these terms. These terms are merely used to distinguish one component from other components. Therefore, within the technical concept of the present invention, the first component mentioned below may be the second component.

[0033] Throughout the application, the same reference numerals generally denote the same elements.

[0034] For ease of description, the dimensions and thicknesses of each component shown in the drawings are illustrated, and the present invention is not limited to the dimensions and thicknesses of the illustrated components.

[0035] The features of the embodiments of the present invention may be partially or wholly combined or combined with each other, and may be interlocked and operated in various ways technically. The embodiments may be implemented independently of each other or implemented in an interrelated manner.

[0036] Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the drawings.

[0037] Figure 1 is a block diagram of an electroluminescent display device according to a first embodiment of the present invention.

[0038] Referring to Figure 1 , the electroluminescent display device 100 according to the first embodiment of the present invention may include an image processor 151, a timing controller 152, a data driver 153, a gate driver 154, and a display panel 110.

[0039] The image processor 151 may output a data signal DATA, a data enable signal DE, etc. in response to a data signal DATA provided from the outside.

[0040] In addition to the data enable signal DE, the image processor 151 may also output one or more of a vertical synchronization signal, a horizontal synchronization signal, and a clock signal.

[0041] In addition to the data enable signal DE or a driving signal including a vertical synchronization signal, a horizontal synchronization signal, and a clock signal, the timing controller 152 also receives the data signal DATA from the image processor 151. Based on the driving signal, the timing controller 152 may output a gate timing control signal GDC for controlling the operation timing of the gate driver 154 and output a data timing control signal DDC for controlling the operation timing of the data driver 153.

[0042] In addition, in response to a data timing control signal DDC provided by the timing controller 152, the data driver 153 may sample and latch a data signal DATA provided by the timing controller 152, convert the data signal DATA into a gamma reference voltage, and output the gamma reference voltage. The data driver 153 may output the gamma reference voltage as a data signal via data lines DL1 to DLn, where n is an integer greater than 1.

[0043] In addition, the gate driver 154 may output a gate signal while shifting the level of the gate voltage in response to a gate timing control signal GDC provided by the timing controller 152. The gate driver 154 may output the gate signal via gate lines GL1 to GLm, where m is an integer greater than 1.

[0044] The display panel 110 may display an image when the sub-pixel P emits light in response to the data signal DATA and the gate signal provided by the data driver 153 and the gate driver 154. The specific structure of the sub-pixel P will be described with reference to Figure 2 and 4 describe the specific structure of the sub-pixel P.

[0045] Figure 2 is a circuit diagram of a sub-pixel of an electroluminescent display device according to the first embodiment of the present invention.

[0046] Referring to Figure 2 According to the first embodiment of the present invention, the sub-pixel of the electroluminescent display device may substantially include a switching transistor ST, a driving transistor DT, a compensation circuit 135, and a light-emitting element 130.

[0047] The light-emitting element 130 may operate to emit light based on a driving current generated by the driving transistor DT.

[0048] The switching transistor ST may perform a switching operation in response to a gate signal provided via the gate line 116, so that the data signal provided via the data line 117 is stored as a data voltage in a capacitor.

[0049] In addition, the driving transistor DT may operate such that a predetermined driving current flows between the high-potential power supply line VDD and the low-potential power supply line GND corresponding to the data voltage stored in the capacitor.

[0050] The compensation circuit 135 is a circuit for compensating the threshold voltage of the driving transistor DT and the like. The compensation circuit 135 may include one or more thin-film transistors and one or more capacitors. The compensation circuit 135 may have various configurations according to the compensation method.

[0051] Describe Figure 2The sub-pixel shown has an example of a 2T (transistor) 1C (capacitor) structure including a switching transistor ST, a driving transistor DT, a capacitor, and a light-emitting element 130. However, when a compensation circuit 135 is added, the sub-pixel can have various configurations such as 3T1C, 4T2C, 5T2C, 6T1C, 6T2C, 7T1C, 7T2C, and the like.

[0052] Figure 3 is a top view plan view of an electroluminescent display device according to a first embodiment of the present invention.

[0053] Figure 4 is a cross-sectional view of a sub-pixel.

[0054] Figure 5 is along Figure 3 a cross-sectional view taken along line I-I' in

[0055] Figure 5 shows a part of a cross-section of a display panel 110 including an optical member 190 according to a first embodiment of the present invention. For ease of description, Figure 5 schematically shows a pixel portion 145 in a display area AA. The pixel portion 145 can have various components including a light-emitting element 130.

[0056] Referring to Figure 3 , an electroluminescent display device 100 according to a first embodiment of the present invention may include a display panel 110, a flexible film 170, and a printed circuit board 180.

[0057] The display panel 110 is a panel configured to display an image to a user.

[0058] The display panel 110 may include: a display element configured to display an image; a driving element configured to operate the display element; and lines configured to transmit various signals to the display element and the driving element. Different display elements can be defined according to the type of the display panel 110. For example, in the case where the display panel 110 is an organic light-emitting display panel, the display element may be an organic light-emitting element including an anode, an organic light-emitting layer, and a cathode.

[0059] Hereinafter, it is assumed that the display panel 110 is an organic light-emitting display panel. However, the display panel 110 is not limited to an organic light-emitting display panel.

[0060] The display panel 110 may include a display area AA and a non-display area NA.

[0061] The display area AA is an area of the display panel 110 where an image is displayed.

[0062] The display area AA may include a plurality of sub-pixels configured to form a plurality of pixels and a circuit configured to operate the plurality of sub-pixels. The plurality of sub-pixels are the smallest units that make up the display area AA. A display element may be provided in each of the plurality of sub-pixels. The plurality of sub-pixels may form a pixel. For example, each of the plurality of sub-pixels may include: a light-emitting element including an anode, a light-emitting layer, and a cathode. However, the present invention is not limited thereto. In addition, the circuit configured to operate the plurality of sub-pixels may include driving elements, lines, etc. For example, the circuit may include thin-film transistors, storage capacitors, gate lines, data lines, etc. However, the present invention is not limited thereto.

[0063] The non-display area NA is an area where no image is displayed.

[0064] Figure 3 It is shown that the non-display area NA surrounds the display area AA having a quadrilateral shape. However, the shapes and arrangements of the display area AA and the non-display area NA are not limited to Figure 3 the example shown.

[0065] The display area AA and the non-display area NA can be applied to the design of an electronic device equipped with the electroluminescent display device 100. For example, example shapes of the display area AA can be a pentagon, a hexagon, a circle, an ellipse, etc.

[0066] Various lines and circuits for operating the organic light-emitting elements in the display area AA may be provided in the non-display area NA. For example, the non-display area NA may include connection lines (linklines) for transmitting signals to the plurality of sub-pixels and circuits in the display area AA. The non-display area NA may include driving ICs such as a gate driver IC and a data driver IC. However, the present invention is not limited thereto.

[0067] Meanwhile, Figure 3 the left and right sides in may be defined as gate pad portions where the gate driver IC is provided above. Figure 3 the lower side in may be defined as a data pad portion connected to the flexible film. However, the present invention is not limited thereto.

[0068] The gate driver IC may be formed independently of the display panel 110 and electrically connected to the display panel 110 in various ways. However, the gate driver IC may be configured in a gate-in-panel (GIP) manner so as to be mounted in the display panel 110.

[0069] The electroluminescent display device 100 may include various additional elements configured to generate various signals or operate pixels in the display area AA. The additional elements for operating the pixels may include an inverter circuit, a multiplexer, an electrostatic discharge (ESD) circuit, etc. The electroluminescent display device 100 may also include additional elements related to functions other than the function of operating the pixels. For example, the electroluminescent display device 100 may include additional elements providing a touch detection function, a user authentication function (e.g., fingerprint recognition), a multi-level pressure detection function, a haptic feedback function, etc. The additional elements may be located in the non-display area NA and / or in an external circuit connected to the connection interface.

[0070] In addition, the flexible film 170 may be a film configured to provide signals to a plurality of sub-pixels and circuits in the display area AA. The flexible film 170 may be electrically connected to the display panel 110. The flexible film is disposed at one end of the non-display area NA of the display panel 110. The flexible film may provide a power supply voltage, a data voltage, etc. to a plurality of sub-pixels and circuits in the display area AA. For example, a driving IC such as a data driver IC may be disposed on the flexible film 170.

[0071] The printed circuit board 180 may be disposed at one end of the flexible film 170 and connected to the flexible film 170. The printed circuit board 180 is a component for providing signals to the driving IC. The printed circuit board 180 may provide various signals such as driving signals and data signals to the driving IC.

[0072] Meanwhile, in order to ensure the reliability of suppressing moisture penetration, the electroluminescent display device 100 requires a minimized bezel distance. In addition, the non-display area NA of the electroluminescent display device 100 other than the display area AA for displaying an image needs to have a thin size to meet the requirements of the thin electroluminescent display device 100. However, in the case where the bezel distance is reduced, the delaying effect of moisture penetration may deteriorate. In particular, in a bottom-emission type display device, an adhesive layer configured as a polymer adhesive film and a packaging substrate 160 configured as a metal sheet may be used to protect the light-emitting element from external moisture, oxygen, etc. For example, a pressure-sensitive adhesive (PSA) in which calcium oxide (CaO) is dispersed in an olefin resin may be used as the adhesive layer. Since the suppressing effect of moisture penetration significantly depends on calcium oxide, in the case where the bezel distance is reduced, the delaying effect of moisture penetration may deteriorate. In addition, in the case where the content of calcium oxide is increased to suppress moisture penetration, the bonding characteristics of the adhesive layer may degenerate, and the display area AA may be physically damaged by the dented calcium oxide.

[0073] Thus, in the first embodiment of the present invention, a side seal 191 can be added to the outer side of the display panel 110 to delay the introduction of moisture, thereby improving the reliability of the display panel 110. In addition, an additional side seal 195 can be formed on the upper outer side of the optical member 190 to block light leakage, thereby improving the image quality of the display panel 110.

[0074] The side seal 191 can be referred to as the first side seal, and the additional side seal 195 can be referred to as the second side seal.

[0075] For example, the side seal 191 and the additional side seal 195 of the first embodiment of the present invention can be disposed on the non-display area NA of three surfaces surrounding the display area AA except for the lower end to which the flexible film 170 is attached. However, the present invention is not limited thereto.

[0076] For example, various insulating layers including a first planarization layer 115c and a second planarization layer 115d can be disposed on the substrate 111 and at the lower end of the display area AA where the side seal 191 and the additional side seal 195 are not provided.

[0077] Reference will be made to Figure 4 and 5 for a detailed description of various components including the side seal 191 and the additional side seal 195 and constituting the electroluminescent display device 100 according to the first embodiment of the present invention.

[0078] Referring to Figure 4 and 5 , the substrate 111 can be divided into a display area AA and a non-display area NA provided outside the display area AA.

[0079] The thin film transistor 120 and the light emitting element 130 can be disposed in the display area AA of the substrate 111.

[0080] The non-display area NA of the substrate 111 can include a GIP area (not shown).

[0081] A GIP circuit portion can be disposed in the GIP area of the substrate 111.

[0082] The substrate 111 is used to support and protect the components of the electroluminescent display device disposed above the substrate 111.

[0083] Recently, the flexible substrate 111 can be made of a flexible material such as a flexible plastic.

[0084] The flexible substrate 111 can be provided in the form of a film made of one selected from the group consisting of polyester-based polymers, silicon-based polymers, acrylic polymers, polyolefin-based polymers, and copolymers thereof.

[0085] A light blocking layer (not shown) may be provided on the substrate 111.

[0086] The light blocking layer may be made of a metal material having a light blocking function to suppress external light from entering the semiconductor layer 124.

[0087] For example, the light blocking layer may be configured as a single-layer or multi-layer structure made of any one of opaque metal materials such as aluminum (Al), chromium (Cr), tungsten (W), titanium (Ti), nickel (Ni), neodymium (Nd), molybdenum (Mo), copper (Cu), and their alloys.

[0088] The buffer layer 112 may be provided on the substrate 111 on which the light blocking layer is provided.

[0089] For example, the buffer layer 112 is a functional layer for protecting various electrodes and wires from impurities such as moisture, oxygen, or alkaline ions introduced from the substrate 111 or the lower side. The buffer layer 112 may have a multi-layer structure including a first buffer layer 112a and a second buffer layer 112b. However, the present invention is not limited thereto.

[0090] For example, the buffer layer 112 may be made of silicon oxide (SiOx) or silicon nitride (SiNx), or configured as a multi-layer structure made of silicon oxide (SiOx) and silicon nitride (SiNx). However, the present invention is not limited thereto. Depending on the type of the thin film transistor 120, the buffer layer 112 may not be included.

[0091] The buffer layer 112 may include contact holes for exposing a part of the light blocking layer.

[0092] The thin film transistor 120 may be provided above the buffer layer 112.

[0093] The thin film transistor 120 in the display area AA may be a driving transistor. For convenience, Figure 4 only the driving transistor 120 is shown. The electroluminescent display device may further include a switching transistor, a sensing transistor, a compensation circuit, etc.

[0094] In this case, in response to a signal received from the switching transistor, the driving transistor 120 may transmit a current transmitted via the power line to the anode 131. The driving transistor 120 may control light emission based on the current transmitted to the anode 131.

[0095] To this end, the driving transistor 120 may include a gate 121, a semiconductor layer 124, a source 122, and a drain 123.

[0096] The switching transistor is turned on by a gate pulse provided via a gate line and transmits a data voltage provided via a data line to the gate 121 of the driving transistor 120.

[0097] The semiconductor layer 124 may be disposed on the second buffer layer 112b.

[0098] The semiconductor layer 124 may be made of polycrystalline silicon (p-Si). In this case, a predetermined region of the semiconductor layer 124 may be doped with impurities. In addition, the semiconductor layer 124 may be made of amorphous silicon (a-Si) or various organic semiconductor materials such as pentacene. In addition, the semiconductor layer 124 may be made of an oxide semiconductor.

[0099] The oxide semiconductor is excellent in terms of mobility and uniformity characteristics. The oxide semiconductor may be made of a material based on indium tin gallium zinc oxide (InSnGaZnO) which is a quaternary metal oxide; materials based on indium gallium zinc oxide (InGaZnO), indium tin zinc oxide (InSnZnO), indium aluminum zinc oxide (InAlZnO), tin gallium zinc oxide (SnGaZnO), aluminum gallium zinc oxide (AlGaZnO), and tin aluminum zinc oxide (SnAlZnO) which are ternary metal oxides; materials based on indium zinc oxide (InZnO), tin zinc oxide (SnZnO), aluminum zinc oxide (AlZnO), zinc magnesium oxide (ZnMgO), tin magnesium oxide (SnMgO), indium magnesium oxide (InMgO), and indium gallium oxide (InGaO) which are binary metal oxides; and materials based on indium oxide (InO), tin oxide (SnO), and zinc oxide (ZnO). The present invention is not limited to the composition ratios of the corresponding elements.

[0100] The semiconductor layer 124 may include: a source region and a drain region which include p-type or n-type impurities; and a channel region located between the source region and the drain region. The semiconductor layer 124 may further include a low-concentration doped region located between the source region and the drain region and adjacent to the channel region. However, the present invention is not limited thereto.

[0101] The source region and the drain region are regions in which impurities are doped at a high concentration. The source 122 and the drain 123 of the thin film transistor 120 may be connected to the source region and the drain region, respectively.

[0102] P-type or n-type impurities may be used as impurity ions. The p-type impurity may be one of boron (B), aluminum (Al), gallium (Ga), and indium (In). The n-type impurity may be one of phosphorus (P), arsenic (As), and antimony (Sb).

[0103] According to the structure of the thin film transistor of NMOS or PMOS, the channel region may be doped with n-type or p-type impurities.

[0104] The gate insulating layer 115a may be disposed on the semiconductor layer 124. For example, the gate insulating layer 115a may be made of an insulating inorganic material such as silicon oxide (SiOx) or silicon nitride (SiNx). In addition, the gate insulating layer 115a may be made of an insulating organic material or the like.

[0105] The gate 121 may be disposed on the gate insulating layer 115a. The gate 121 may be made of various conductive materials, such as magnesium (Mg), aluminum (Al), nickel (Ni), chromium (Cr), molybdenum (Mo), tungsten (W), gold (Au), or alloys thereof.

[0106] The interlayer insulating layer 115b may be disposed on the gate electrode 121. For example, the interlayer insulating layer 115b may be made of silicon oxide (SiOx) or silicon nitride (SiNx), or be configured as a multi-layer structure made of silicon oxide (SiOx) and silicon nitride (SiNx).

[0107] The source electrode 122 and the drain electrode 123 may be disposed on the interlayer insulating layer 115 b .

[0108] In this case, each of the source 122 and the drain 123 can be configured as a single layer or a multilayer made of a conductive metal material such as aluminum (Al), molybdenum (Mo), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu) or an alloy thereof.

[0109] The insulating layer 115 may be disposed over the thin film transistor 120 configured as described above. The insulating layer 115 may be a planarization layer or a coating layer.

[0110] The insulating layer 115 as a planarization layer may have a multilayer structure including at least two layers. For example, the insulating layer 115 may include a first planarization layer 115c and a second planarization layer 115d. In this case, for example, the first planarization layer 115c may be provided to cover the thin film transistor 120 and to partially expose the source 122 or the drain 123 of the thin film transistor 120.

[0111] The insulating layer 115 may extend to the non-display area NA to cover the GIP area.

[0112] The insulating layer 115 may have a thickness of about 2 μm. However, the present invention is not limited thereto.

[0113] The structure of the thin film transistor 120 can be classified into an inverted staggered structure and a coplanar structure according to the positions of the constituent elements constituting the thin film transistor 120. For example, in the case of a thin film transistor having an inverted staggered structure, the gate electrode can be located on the opposite side of the source electrode and the drain electrode based on the semiconductor layer. Figure 4As shown, in the case of the thin film transistor 120 having a coplanar structure, the gate electrode 121 may be located on the same side as the source electrode 122 and the drain electrode 123 based on the semiconductor layer 124 .

[0114] Figure 4 The thin film transistors 120 having a coplanar structure are shown. However, the present invention is not limited thereto. The electroluminescent display device of the present invention may also include a thin film transistor having an inverse staggered structure. In addition, some of the thin film transistors 120 may have a coplanar structure, and some of the remaining thin film transistors 120 may have an inverse staggered structure.

[0115] The connection electrode 125 may be disposed on the first planarization layer 115c and electrically connected to the thin film transistor 120 and the light emitting element 130. In addition, various metal layers may be disposed on the first planarization layer 115c and function as electrodes and wires such as data lines or signal lines.

[0116] In addition, a color filter CF may be disposed on the first planarization layer 115 c . However, the present invention is not limited thereto. Depending on the type of the light emitting element 130 , the color filter CF may not be included.

[0117] The color filter CF of each sub-pixel may have any one of red, green and blue. In addition, in the case of realizing a white sub-pixel, the color filter CF may not be provided. Red, green and blue may be arranged in various ways, and a black matrix capable of absorbing external light may be provided between the color filters CF.

[0118] In the case of a bottom emission type display device, the color filter CF may be located under the anode 131 .

[0119] In addition, the second planarization layer 115d may be disposed on the first planarization layer 115c and the connection electrode 125. In the display device according to the first embodiment of the present invention, the configuration in which the insulating layer 115 is disposed as two layers is based on the fact that the number of various signal lines increases as the display panel 110 has a high resolution. Because it is difficult to arrange all the lines on a single layer while ensuring a minimum spacing, an additional layer is provided. The addition of an additional layer (second planarization layer 115d) can provide a setting margin for the line, which further contributes to the deployment design of the line / electrode. In addition, in the case where a dielectric material is used for the insulating layer 115 having multiple layers, the insulating layer 115 can be used to generate capacitance between metal layers.

[0120] The second planarization layer 115 d may be formed such that a portion of the connection electrode 125 is exposed. The drain electrode 123 of the thin film transistor 120 and the anode electrode 131 of the light emitting element 130 may be electrically connected through the connection electrode 125 .

[0121] The light emitting element 130 including an anode 131 , an organic layer 132 , and a cathode 133 may be disposed over the second planarization layer 115 d .

[0122] The anode 131 may be disposed on the second planarization layer 115 d .

[0123] The anode 131 is an electrode for supplying positive holes to the organic layer 132. The anode 131 may be connected to the thin film transistor 120 via a contact hole formed in the insulating layer 115.

[0124] The electroluminescent display device may be implemented as a top emission type or a bottom emission type. In the case of the top emission type, a reflective layer made of an opaque conductive material with high reflectivity (e.g., silver (Ag), aluminum (Al), gold (Au), molybdenum (Mo), tungsten (W), chromium (Cr) or an alloy thereof) may be additionally provided at the lower portion of the anode 131, so that the light emitted from the organic layer 131 is reflected by the anode 131 and propagates upward on the upper side, that is, in the direction toward the cathode 133. In contrast, in the case of the bottom emission type, the anode 131 may be made only of a transparent conductive material such as indium tin oxide (ITO), indium zinc oxide (IZO) or indium gallium zinc oxide (IGZO). Hereinafter, the display panel 110 of the present invention will be described assuming that it is a bottom emission type.

[0125] The bank 115 e may be disposed on the anode 131 and the second planarization layer 115 d .

[0126] The bank 115 e disposed over the anode 131 and the second planarization layer 115 d may define sub-pixels by dividing a region that actually emits light, that is, a light emitting region.

[0127] For example, the bank 115 e may be formed by performing photolithography after forming a photoresist on the upper portion of the anode 131 .

[0128] A fine metal mask (FMM) as a deposition mask may be used to form the organic layer 132 of the light emitting element 130 .

[0129] In addition, a spacer (not shown) may be disposed above the bank 115e and made of one of polyimide, photo acrylic, and benzocyclobutene as a transparent organic material. The spacer is used to suppress damage caused by contact with a deposition mask disposed on the bank 115e. The spacer is used to maintain a predetermined distance between the bank 115e and the deposition mask.

[0130] In this case, a portion of the anode 131 may be exposed by removing the bank 115e in the light emitting region.

[0131] The bank 115e may be disposed to extend to a portion of the non-display area NA. However, the present invention is not limited thereto.

[0132] The organic layer 132 may be disposed between the anode 131 and the cathode 133 .

[0133] The organic layer 132 is used to emit light. The organic layer 132 may include at least one of a hole injection layer (HIL), a hole transport layer (HTL), a light emitting layer, an electron transport layer (ETL), and an electron injection layer (EIL). Depending on the structure or characteristics of the electroluminescent display device, some components may not be included. In this case, the electroluminescent layer and the inorganic light emitting layer may be used as a light emitting layer.

[0134] The hole injection layer is provided on the anode 131 and is used to facilitate injection of positive holes.

[0135] The hole transport layer is provided on the hole injection layer, and serves to smoothly transport positive holes to the light emitting layer.

[0136] The light emitting layer is disposed on the hole transport layer. The light emitting layer may be made of a material capable of emitting light in a specific color, thereby emitting light in a specific color. In addition, a phosphorescent material or a fluorescent material may be used as the light emitting material.

[0137] An electron injection layer may be further disposed on the electron transport layer. The electron injection layer is an organic layer that facilitates the injection of electrons from the cathode 133. Depending on the structure and characteristics of the electroluminescent display device, the electron injection layer may not be included.

[0138] At the same time, an electron blocking layer for blocking the flow of electrons and / or a hole blocking layer for blocking the flow of positive holes is further provided at a position adjacent to the light-emitting layer. Therefore, when electrons are injected into the light-emitting layer, electrons are inhibited from moving from the light-emitting layer and passing through the adjacent hole transport layer, or when positive holes are injected into the light-emitting layer, positive holes are inhibited from moving from the light-emitting layer and passing through the adjacent electron transport layer, thereby improving the luminous efficiency.

[0139] The organic layer 132 may be disposed to extend to a portion of the non-display area NA. However, the present invention is not limited thereto.

[0140] The cathode 133 may be disposed on the organic layer 132 .

[0141] The cathode 133 is used to provide electrons to the organic layer 132. The cathode 133 needs to provide electrons. Therefore, the cathode 133 may be made of a metal material such as magnesium, silver-magnesium alloy, etc., which is a conductive material with a low work function. However, the present invention is not limited thereto.

[0142] The cathode 133 may extend to a portion of the non-display area NA. For example, the cathode 133 may be disposed to extend to a portion of the non-display area NA to cover an end portion of the organic layer 132. However, the present invention is not limited thereto.

[0143] A capping layer 140 may be disposed on the cathode 133 .

[0144] The capping layer 140 may be used to assist in protecting the light emitting element 130 and to effectively release light generated by the organic layer 132 to the outside.

[0145] For example, the cover layer 140 may be made of various organic compounds having a refractive index of 1.7 or more to suppress light propagating to the outside from being totally reflected and lost. However, the present invention is not limited thereto.

[0146] The capping layer 140 may extend to a portion of the non-display area NA. For example, the capping layer 140 may be disposed to extend to a portion of the non-display area NA so as to coincide with an end portion of the cathode 133. However, the present invention is not limited thereto.

[0147] A bonding layer 165 and a packaging substrate 160 may be disposed over the cathode 133 .

[0148] The bonding layer 165 may be referred to as a first bonding layer, and the packaging substrate 160 may be referred to as a first packaging substrate.

[0149] For example, bonding layer 165 may be used to retard lateral moisture penetration.

[0150] For example, the bonding layer 165 may further include a moisture absorbent such as a getter in addition to the isobutyl rubber resin. The moisture absorbent may include calcium oxide.

[0151] The moisture absorbent may include particles having hygroscopicity. The moisture absorbent may absorb moisture, oxygen, etc. from the outside, thereby minimizing the degree of penetration of moisture and oxygen into the display area AA.

[0152] For example, the bonding layer 165 may have a thickness of 40 to 60 μm.

[0153] The package substrate 160 may be disposed on the bonding layer 165 .

[0154] The encapsulation substrate 160 together with the bonding layer 165 can protect the light emitting element 130 from external moisture, oxygen, impact, and the like.

[0155] For example, the encapsulation substrate 160 may be used to inhibit front moisture penetration.

[0156] For example, the package substrate 160 may be made of stainless steel (SUS) or Invar. However, the present invention is not limited thereto. In this case, Invar is an alloy of nickel and iron and has a very low coefficient of thermal expansion, so that Invar is relatively stable against temperature changes.

[0157] For example, the encapsulation substrate 160 may have a thickness of 70 to 80 μm.

[0158] Meanwhile, in the first embodiment of the present invention, the side sealant 191 is added to the outer side of the display panel 110 , thereby delaying the introduction of moisture. Therefore, the reliability of the display panel 110 can be improved.

[0159] For example, the side seal portion 191 may serve to suppress (block) moisture penetration toward the bonding layer 165 .

[0160] For example, the side sealant 191 may be made of an organic or inorganic material having a low water vapor transmission rate (WVTR). For example, the outer side of the display panel 110 may be coated with an organic material using a dispenser or an inorganic material using a spray coating.

[0161] For example, the side sealing portion 191 may be formed on the non-display area NA of three faces surrounding the periphery of the display area AA except for the lower end to which the flexible film is attached.

[0162] For example, the side sealing part 191 may be formed to cover the bonding layer 165 and the side surface of the package substrate 160 .

[0163] The optical member 190 according to the first embodiment of the present invention may be disposed on the rear surface of the display panel 110 configured as described above (ie, the rear surface of the substrate 111 ).

[0164] In this case, a transparent adhesive layer (not shown) having bonding properties may be interposed between the substrate 111 and the optical member 190 .

[0165] The optical member 190 serves to improve the visibility of the electroluminescent display device by suppressing reflection of external light, and minimize the loss of light released from the light emitting element 130 to the outside.

[0166] The optical member 190 may include a phase difference layer and a linear polarization plate.

[0167] For example, the phase difference layer may be configured as a quarter wave plate (QWP) that generates a phase delay of λ / 4.

[0168] For example, a protective layer may be provided on the linear polarizing plate.

[0169] In addition, for example, a surface treatment layer including an anti-reflection film (AR film) may be located on the protective layer. The anti-reflection film may be formed by wet etching (anti-reflection coating) or dry sputtering (anti-reflection sputtering).

[0170] Furthermore, an additional side sealing portion 195 may be disposed on an upper outer side of the optical member 190. As a result, the image quality of the display panel 110 may be improved by blocking light leakage at the outer side of the display panel 110.

[0171] For example, the additional side sealing portion 195 may be formed on the non-display area NA of three faces surrounding the periphery of the display area AA except for the lower end to which the flexible film is attached.

[0172] In addition, for example, the additional side sealant 195 may be formed to cover the side surfaces of the substrate 111 and the insulating layer 115 . However, the present invention is not limited thereto. The additional side sealant 195 may extend to cover a portion of the side sealant 191 .

[0173] For example, the additional side sealing portion 195 may be made of acrylic resin. However, the present invention is not limited thereto.

[0174] Figure 6 is a top plan view of an electroluminescent display device according to a second embodiment of the present invention.

[0175] Figure 7 is along Figure 6 A cross-sectional view taken along line II-II'.

[0176] In addition to the addition of the additional bonding layer 296, Figure 6 and 7 The electroluminescent display device 200 of the second embodiment of the present invention and Figures 3 to 5 The above-mentioned electroluminescent display device of the first embodiment in the embodiment is substantially the same in configuration. Therefore, repeated description of the same components will be omitted. In addition, the same reference numerals are used for the same components. Figures 1 to 5 Components referred to by the same reference numerals are described.

[0177] Figure 7 A portion of a cross section of a display panel 210 including an optical member 190 according to a second embodiment of the present invention is shown.

[0178] Reference Figure 6 and 7 In the electroluminescent display device 200 according to the second embodiment of the present invention, a thin film transistor and a light emitting element may be provided in each sub-pixel and disposed above the substrate 111 .

[0179] The bonding layer 165 and the encapsulation substrate 160 may be disposed above the light emitting element.

[0180] For example, bonding layer 165 may be used to retard lateral moisture penetration.

[0181] For example, the bonding layer 165 may further include a moisture absorbent such as a getter in addition to the isobutyl rubber resin. The moisture absorbent may include calcium oxide.

[0182] For example, the bonding layer 165 may have a thickness of 40 to 60 μm.

[0183] The package substrate 160 may be disposed on the bonding layer 165 .

[0184] The encapsulation substrate 160 together with the bonding layer 165 can protect the light emitting element 130 from external moisture, oxygen, impact, and the like.

[0185] For example, the encapsulation substrate 160 may be used to inhibit front moisture penetration.

[0186] For example, the package substrate 160 may be made of stainless steel (steel stainless steel (SUS)) or Invar. However, the present invention is not limited thereto.

[0187] For example, the encapsulation substrate 160 may have a thickness of 70 to 80 μm.

[0188] Meanwhile, in the second embodiment of the present invention, the side sealant 191 is added to the outer side of the display panel 210, thereby delaying the introduction of moisture. Therefore, the reliability of the display panel 210 can be improved.

[0189] For example, the side seal portion 191 may serve to suppress (block) moisture penetration toward the bonding layer 165 .

[0190] For example, the side seal portion 191 may be made of an organic or inorganic material having a relatively low water vapor transmission rate (WVTR).

[0191] For example, the side sealing portion 191 may be formed on the non-display area NA of three faces surrounding the periphery of the display area AA except for the lower end to which the flexible film 170 is attached.

[0192] For example, the side sealing part 191 may be formed to cover the bonding layer 165 and the side surface of the package substrate 160 .

[0193] Furthermore, the second embodiment of the present invention is characterized in that an additional bonding layer 296 is added to the outer side of the side seal portion 191 and the top surface of the encapsulation substrate 160 to delay the introduction of moisture toward the side surface and change or guide the moisture permeation route from the direction toward the side surface of the display panel 210 to the direction toward the upper side of the encapsulation substrate 160 along the additional bonding layer 296. Therefore, the reliability of the display panel 210 can be further improved.

[0194] The additional bonding layer 296 may be referred to as a second bonding layer.

[0195] For example, the additional bonding layer 296 may be provided to cover the side surfaces of the substrate 111 and the insulating layer 115 , the outer side of the side sealing portion 191 , and the top surface of the encapsulation substrate 160 .

[0196] For example, the additional bonding layer 296 may be formed on the non-display area NA of three faces surrounding the periphery of the display area AA except for the lower end to which the flexible film 170 is attached.

[0197] For example, in addition to the isobutyl rubber resin, the additional bonding layer 296 may further include a moisture absorbent such as a getter. The moisture absorbent may include calcium oxide.

[0198] For example, the additional bonding layer 296 may have a thickness of 30 to 50 μm.

[0199] The optical member 190 according to the second embodiment of the present invention may be disposed on the rear surface of the display panel 210 configured as described above (ie, the rear surface of the substrate 111 ).

[0200] Furthermore, an additional side sealing portion 295 may be provided on the upper outer side of the optical member 190. As a result, the image quality of the display panel 210 may be improved by blocking light leakage at the outer side of the display panel 210.

[0201] For example, the additional side sealing part 295 may be formed on the non-display area NA of three faces surrounding the periphery of the display area AA except for the lower end to which the flexible film 170 is attached.

[0202] For example, the additional side sealing part 295 may be formed to cover a portion of the side surface of the additional bonding layer 296. However, the present invention is not limited thereto.

[0203] For example, the additional side sealing portion 295 may be made of acrylic resin. However, the present invention is not limited thereto.

[0204] Figure 8 is a top plan view of an electroluminescent display device according to a third embodiment of the present invention.

[0205] Figure 9 is along Figure 8 A cross-sectional view taken along line III-III'.

[0206] In addition to the addition of an additional bonding layer 296 and an additional packaging substrate 397, Figure 8 and 9 The electroluminescent display device 300 of the third embodiment of the present invention is Figures 3 to 5The above-mentioned electroluminescent display device of the first embodiment in the embodiment is substantially the same in configuration. Therefore, repeated description of the same components will be omitted. In addition, the same reference numerals are used for the same components. Figures 1 to 7 Components referred to by the same reference numerals are described.

[0207] Figure 9 A portion of a cross section of a display panel 310 including an optical member 190 according to a third embodiment of the present invention is shown.

[0208] Reference Figure 8 and 9 In the electroluminescent display device 300 according to the third embodiment of the present invention, a thin film transistor and a light emitting element may be provided in each sub-pixel and disposed above the substrate 111 .

[0209] The bonding layer 165 and the encapsulation substrate 160 may be disposed above the light emitting element.

[0210] For example, bonding layer 165 may be used to retard lateral moisture penetration.

[0211] For example, the bonding layer 165 may further include a moisture absorbent such as a getter in addition to the isobutyl rubber resin. The moisture absorbent may include calcium oxide.

[0212] For example, the bonding layer 165 may have a thickness of 40 to 60 μm.

[0213] The package substrate 160 may be disposed on the bonding layer 165 .

[0214] The encapsulation substrate 160 together with the bonding layer 165 can protect the light emitting element 130 from external moisture, oxygen, impact, and the like.

[0215] For example, the encapsulation substrate 160 may be used to inhibit front moisture penetration.

[0216] For example, the package substrate 160 may be made of stainless steel (steel stainless steel (SUS)) or Invar. However, the present invention is not limited thereto.

[0217] For example, the encapsulation substrate 160 may have a thickness of 70 to 80 μm.

[0218] Meanwhile, in the third embodiment of the present invention, the side sealant 191 is added to the outer side of the display panel 310, thereby delaying the introduction of moisture. Therefore, the reliability of the display panel 310 can be improved.

[0219] For example, the side seal portion 191 may serve to suppress (block) moisture penetration toward the bonding layer 165 .

[0220] For example, the side seal portion 191 may be made of an organic or inorganic material having a relatively low water vapor transmission rate (WVTR).

[0221] For example, the side sealing portion 191 may be formed on the non-display area NA of three faces surrounding the periphery of the display area AA except for the lower end to which the flexible film 170 is attached.

[0222] For example, the side sealing part 191 may be formed to cover the bonding layer 165 and the side surface of the package substrate 160 .

[0223] Furthermore, the third embodiment of the present invention is characterized in that an additional bonding layer 296 is added to the outer side of the side sealing portion 191 and the top surface of the encapsulation substrate 160 to delay the introduction of moisture toward the side surface and change or guide the moisture permeation route from the direction toward the side surface of the display panel 310 to the direction toward the upper side of the encapsulation substrate 160 along the additional bonding layer 296. In particular, the third embodiment of the present invention is characterized in that an additional encapsulation substrate 397 is added to the outer side of the additional bonding layer 296, thereby suppressing moisture permeation toward the front surface of the display panel 310. Therefore, the reliability of the display panel 310 can be further improved. Figure 9 Moisture penetration and a moisture penetration route of the introduced moisture are shown as examples. The additional bonding layer 296 and the additional encapsulation substrate 397 can guide the introduced moisture to the additional bonding layer 296 at the upper side and significantly reduce the introduction of moisture to the bonding layer 165 at the lower side, thereby suppressing the occurrence of defects caused by moisture.

[0224] The additional bonding layer 296 and the additional encapsulation substrate 397 of the third embodiment of the present invention are disposed on the display panel 310 , ie, on the side surfaces of the substrate 111 and the insulating layer 115 , which can effectively block or delay the introduction of moisture into the pixel portion 145 in the display area AA.

[0225] The additional packaging substrate 397 may be referred to as a second packaging substrate.

[0226] For example, the additional bonding layer 296 may be provided to cover the outer sides of the substrate 111 , the insulating layer 115 , and the side sealing part 191 , and the top surface of the encapsulation substrate 160 .

[0227] For example, the additional bonding layer 296 may be formed on the non-display area NA of three faces surrounding the periphery of the display area AA except for the lower end to which the flexible film 170 is attached.

[0228] For example, in addition to the isobutyl rubber resin, the additional bonding layer 296 may further include a moisture absorbent such as a getter. The moisture absorbent may include calcium oxide.

[0229] For example, the additional bonding layer 296 may have a thickness of 30 to 50 μm.

[0230] Furthermore, an additional packaging substrate 397 may be used to inhibit front moisture penetration.

[0231] For example, the additional package substrate 397 may be made of aluminum foil. However, the present invention is not limited thereto.

[0232] For example, the additional package substrate 397 may have a thickness of 10 to 30 μm.

[0233] For example, an aluminum foil having a thickness of 10 to 30 μm and having high flexibility is used as the additional package substrate 397 , so that the additional package substrate 397 is easily bent and deformed toward the side surface of the lower substrate 111 .

[0234] The optical member 190 according to the third embodiment of the present invention may be disposed on the rear surface of the display panel 310 configured as described above (ie, the rear surface of the substrate 111 ).

[0235] Furthermore, the additional side sealing part 395 may be disposed on the upper outer side of the optical member 190. As a result, the image quality of the display panel 310 may be improved by blocking light leakage at the outer side of the display panel 310.

[0236] For example, the additional side sealing part 395 may be formed on the non-display area NA of three faces surrounding the periphery of the display area AA except for the lower end to which the flexible film 170 is attached.

[0237] In addition, for example, the additional side sealing part 395 may be formed to cover a portion of the side surface of the additional encapsulation substrate 397. However, the present invention is not limited thereto.

[0238] For example, the additional side sealing portion 395 may be made of acrylic resin. However, the present invention is not limited thereto.

[0239] For example, the additional side sealing portion 395 may have a thickness of 80 to 140 μm after laser cutting. However, the present invention is not limited thereto.

[0240] As described above, the width of the additional side seal portion 395 may be reduced by laser cutting so that the final bezel size may be constantly maintained even if the additional bonding layer 296 and the additional encapsulation substrate 397 are added.

[0241] Hereinafter, a manufacturing process of an electroluminescent display device according to a third embodiment of the present invention will be described in detail with reference to the accompanying drawings.

[0242] Figures 10A to 10F is an exemplary diagram of a third embodiment according to the present invention Figure 9 A cross-sectional view of the manufacturing process of the electroluminescent display device in FIG.

[0243] ReferenceFigure 10A , an insulating layer 115 may be formed over the substrate 111 where the thin film transistor is formed for each sub-pixel.

[0244] The insulating layer 115 may have a multi-layer structure including at least two layers. For example, the insulating layer 115 may include a first planarization layer and a second planarization layer.

[0245] Thereafter, an anode (not shown) may be formed over the insulating layer 115 for each sub-pixel, and then the organic layer 132 may be formed over the anode.

[0246] Thereafter, the cathode 133 and the capping layer 140 may be formed on the organic layer 132 .

[0247] A light emitting element including an anode, an organic layer 132 , and a cathode 133 may be formed over the insulating layer 115 .

[0248] The organic layer 132 is used to emit light. The organic layer 132 may include at least one of a hole injection layer (HIL), a hole transport layer (HTL), a light emitting layer, an electron transport layer (ETL), and an electron injection layer (EIL). Depending on the structure or characteristics of the electroluminescent display device, some components may not be included. In this case, the electroluminescent layer and the inorganic light emitting layer may be used as a light emitting layer.

[0249] The organic layer 132 may be disposed to extend to a portion of the non-display area. However, the present invention is not limited thereto.

[0250] The cathode 133 may be formed on the organic layer 132. The cathode 133 may extend to a portion of the non-display region. For example, the cathode 133 may be disposed to extend to a portion of the non-display region to cover an end of the organic layer 132. However, the present invention is not limited thereto.

[0251] The capping layer 140 may be formed on the cathode 133. The capping layer 140 may extend to a portion of the non-display region. For example, the capping layer 140 may be disposed to extend to a portion of the non-display region so as to coincide with an end of the cathode 133. However, the present invention is not limited thereto.

[0252] Reference Figure 10A and 10B , the bonding layer 165 and the package substrate 160 may be attached to an upper portion of the substrate 111 on which the cover layer 140 is formed.

[0253] For example, the bonding layer 165 may further include a moisture absorbent such as a getter in addition to the isobutyl rubber resin. The moisture absorbent may include calcium oxide.

[0254] For example, the bonding layer 165 may have a thickness of 40 to 60 μm.

[0255] The package substrate 160 may be disposed on the bonding layer 165 .

[0256] For example, the package substrate 160 may be made of stainless steel (steel stainless steel (SUS)) or Invar. However, the present invention is not limited thereto.

[0257] For example, the encapsulation substrate 160 may have a thickness of 70 to 80 μm.

[0258] Thereafter, the edge of the substrate 111 and the edge of the insulating layer 115 may be ground.

[0259] After grinding, the substrate 111 and the insulating layer 115 may further protrude outward than ends of the bonding layer 165 and ends of the encapsulation substrate 160 .

[0260] Afterwards, refer to Figure 10C , the side seal portion 191 may be formed at the outer side of the display panel 110. For example, the top surface of the insulating layer 115 protruding outward, the side surface of the bonding layer 165, and the side surface of the encapsulation substrate 160 may be coated with an organic or inorganic material having a low water vapor transmittance (WVTR). For example, the outer side of the display panel may be coated with an organic material using a dispenser or an inorganic material using a spray coating.

[0261] For example, the side sealing portion 191 may be formed on the non-display area on three faces surrounding the periphery of the display area except for the lower end to which the flexible film is attached.

[0262] For example, the side sealing part 191 may be formed to cover the side surfaces of the bonding layer 165 and the encapsulation substrate 160 .

[0263] Next, refer to Figure 10D , an additional bonding layer 296 and an additional encapsulation substrate 397 may be attached to an upper portion of the encapsulation substrate 160 .

[0264] For example, the additional bonding layer 296 may be attached to cover the substrate 111 , the insulating layer 115 , the outer sides of the side sealing parts 191 , and the top surface of the package substrate 160 .

[0265] For example, the additional bonding layer 296 may be attached on the non-display area on three faces surrounding the periphery of the display area except for the lower end to which the flexible film is attached.

[0266] For example, in addition to the isobutyl rubber resin, the additional bonding layer 296 may further include a moisture absorbent such as a getter. The moisture absorbent may include calcium oxide.

[0267] For example, the additional bonding layer 296 may have a thickness of 30 to 50 μm.

[0268] In addition, for example, the additional package substrate 397 may be made of aluminum foil. However, the present invention is not limited thereto.

[0269] For example, the additional package substrate 397 may have a thickness of 10 to 30 μm.

[0270] Afterwards, refer to Figure 10E , the optical member 190 according to the third embodiment of the present invention may be attached to the rear surface of the display panel (ie, the rear surface of the substrate 111 ).

[0271] In this case, a transparent adhesive layer (not shown) having bonding properties may be interposed between the substrate 111 and the optical member 190 .

[0272] Thereafter, the upper outer side of the optical member 190 may be coated with a sealant 395'. For example, the sealant 395' may be made of acrylic resin. However, the present invention is not limited thereto.

[0273] In addition, for example, the sealant 395' may be applied to cover a portion of the side surface of the additional encapsulation substrate 397. However, the present invention is not limited thereto.

[0274] Afterwards, refer to Figure 10F , the additional side sealing portion 395 may be formed at the upper outer side of the optical member 190 by cutting the edge of the optical member 190 and the edge of the sealant 395 ′ using a laser.

[0275] For example, the additional side sealing part 395 may be formed on the non-display area on three faces surrounding the periphery of the display area except for the lower end to which the flexible film is attached.

[0276] In addition, for example, the additional side sealing part 395 may be formed to cover a portion of the side surface of the additional encapsulation substrate 397. However, the present invention is not limited thereto.

[0277] For example, the additional side sealing portion 395 may have a thickness of 80 to 140 μm after laser cutting. However, the present invention is not limited thereto.

[0278] Meanwhile, the additional bonding layer and the additional encapsulation substrate of the present invention may be disposed on the top surface of the display panel. This configuration will be described in detail below with reference to the fourth embodiment.

[0279] Figure 11 is a top plan view of an electroluminescent display device according to a fourth embodiment of the present invention.

[0280] In addition to the additional bonding layer 496 and the additional encapsulation substrate 497 disposed on the top surface of the display panel 410, Figure 11 The electroluminescent display device of the fourth embodiment of the present invention and Figure 8 and 9The above-described electroluminescent display device according to the third embodiment is basically the same in structure. Therefore, repeated descriptions of the same components will be omitted. In addition, the same reference numerals are used for the same components. Hereinafter, components referred to by the same reference numerals will be described with reference to Figures 1 to 9 the components referred to by the same reference numerals.

[0281] In addition, Figure 11 FIG. shows a part of a cross-section of a display panel 410 including an optical member 190 according to a fourth embodiment of the present invention.

[0282] Referring to Figure 11 , in the electroluminescent display device according to the fourth embodiment of the present invention, thin film transistors and light emitting elements may be provided in each sub-pixel and are provided above the substrate 111.

[0283] The bonding layer 165 and the encapsulation substrate 160 may be provided above the light emitting elements.

[0284] In addition, the side seal portion 191 may be provided at the outside of the display panel 410.

[0285] In addition, in the fourth embodiment of the present invention, an additional bonding layer 496 may be provided at the outside of the side seal portion 191 and on the top surface of the encapsulation substrate 160. In addition, in the fourth embodiment of the present invention, an additional encapsulation substrate 497 may be provided at the outside of the additional bonding layer 496.

[0286] For example, the additional bonding layer 496 may be provided on the top surface of the insulating layer 115 and cover the outside of the side seal portion 191 and the top surface of the encapsulation substrate 160.

[0287] For example, the additional bonding layer 496 may be formed on the non-display areas of the three surfaces surrounding the periphery of the display area except for the lower end to which the flexible film is attached.

[0288] For example, in addition to the isobutyl rubber resin, the additional bonding layer 496 may further include a moisture adsorbent such as an getter. The moisture adsorbent may include calcium oxide.

[0289] For example, the additional bonding layer 496 may have a thickness of 30 to 50 μm.

[0290] In addition, for example, the additional encapsulation substrate 497 may be provided on the top surface of the insulating layer 115 and cover the outside of the additional bonding layer 496.

[0291] In addition, for example, the additional encapsulation substrate 497 may be used to inhibit the penetration of moisture from the front.

[0292] For example, the additional encapsulation substrate 497 may be made of aluminum foil. However, the present invention is not limited thereto.

[0293] For example, the additional encapsulation substrate 497 may have a thickness of 10 to 30 μm.

[0294] The optical member 190 according to the fourth embodiment of the present invention may be disposed on the rear surface (i.e., the rear surface of the substrate 111) of the display panel 410 configured as described above.

[0295] In addition, an additional side seal portion 495 may be disposed on the outer upper portion of the optical member 190.

[0296] For example, the additional side seal portion 495 may be formed on the non-display regions of three surfaces surrounding the periphery of the display region except for the lower end to which the flexible film is attached.

[0297] For example, the additional side seal portion 495 may be formed to cover the side surfaces of the substrate 111 and the insulating layer 115. However, the present invention is not limited thereto. The additional side seal portion 495 may be formed to cover a part of the side surface of the additional encapsulation substrate 497.

[0298] For example, the additional side seal portion 495 may be made of an acrylic resin. However, the present invention is not limited thereto

[0299] For example, the additional side seal portion 495 may have a thickness of 80 to 140 μm after laser cutting. However, the present invention is not limited thereto.

[0300] Exemplary embodiments of the present invention may also be described as follows.

[0301] According to one or more embodiments of the present invention, an electroluminescent display device may be provided, including: a substrate divided into a display region and a non-display region disposed outside the display region; an insulating layer disposed on the substrate; a light-emitting element disposed on the insulating layer; a bonding layer disposed on the light-emitting element; an encapsulation substrate disposed on the bonding layer; and a side seal portion covering the side surfaces of the bonding layer and the encapsulation substrate.

[0302] According to one or more embodiments of the present invention, the electroluminescent display device may further include a flexible film disposed at one end of the non-display region, wherein the side seal portion may be disposed on the non-display regions of three surfaces surrounding the periphery of the display region except for the one end to which the flexible film is attached.

[0303] According to one or more embodiments of the present invention, the electroluminescent display device may further include: an optical member disposed on the rear surface of the substrate; and an additional side seal portion disposed at the outer upper portion of the optical member.

[0304] According to one or more embodiments of the present invention, the additional side sealing portion may be disposed on non-display regions of three surfaces surrounding the display region, except for one end to which the flexible film is attached.

[0305] According to one or more embodiments of the present invention, the additional side sealing portion may cover side surfaces of the substrate and the insulating layer.

[0306] According to one or more embodiments of the present invention, the additional side sealing portion may extend to cover a part of the side sealing portion.

[0307] According to one or more embodiments of the present invention, the electroluminescent display device may further include an additional bonding layer disposed outside the side sealing portion and on a top surface of the encapsulation substrate to change a moisture penetration route from a direction toward a side surface of the electroluminescent display device to a direction toward an upper side of the encapsulation substrate along the additional bonding layer.

[0308] According to one or more embodiments of the present invention, the additional bonding layer may cover outer sides of the substrate, the insulating layer, and the side sealing portion and the top surface of the encapsulation substrate.

[0309] According to one or more embodiments of the present invention, the electroluminescent display device may further include a flexible film disposed at one end of the non-display region, wherein the additional bonding layer may be disposed on non-display regions of three surfaces surrounding the display region, except for one end to which the flexible film is attached.

[0310] According to one or more embodiments of the present invention, each of the bonding layer and the additional bonding layer may include an isobutyl rubber resin and a moisture adsorbent.

[0311] According to one or more embodiments of the present invention, the additional side sealing portion may cover a part of a side surface of the additional bonding layer.

[0312] According to one or more embodiments of the present invention, the additional side sealing portion may include an acrylic resin.

[0313] According to one or more embodiments of the present invention, the additional side sealing portion may have a thickness of 80 μm to 140 μm.

[0314] According to one or more embodiments of the present invention, the additional bonding layer may have a thickness of 30 μm to 50 μm.

[0315] According to one or more embodiments of the present invention, the electroluminescent display device may further include an additional encapsulation substrate disposed outside the additional bonding layer.

[0316] According to one or more embodiments of the present invention, the additional encapsulation substrate may have a thickness of 10 μm to 30 μm.

[0317] According to one or more embodiments of the present invention, the additional encapsulation substrate may be made of aluminum foil.

[0318] According to one or more embodiments of the present invention, the additional side seal portion may cover a part of the side surface of the additional encapsulation substrate.

[0319] According to one or more embodiments of the present invention, the additional bonding layer may be disposed on the top surface of the insulating layer and cover the outside of the side seal portion and the top surface of the encapsulation substrate.

[0320] According to one or more embodiments of the present invention, the additional encapsulation substrate may be disposed on the top surface of the insulating layer and cover the outside of the additional bonding layer.

[0321] According to one or more embodiments of the present invention, the additional side seal portion may cover a part of the side surface of the additional encapsulation substrate.

[0322] According to one or more embodiments of the present invention, the side seal portion may be disposed on the top surface of the insulating layer, the side surface of the bonding layer, and the side surface of the encapsulation substrate.

[0323] According to one or more embodiments of the present invention, the electroluminescent display device may further include a connection electrode, wherein the insulating layer may include a first planarization layer and a second planarization layer, wherein the connection electrode may be disposed on the first planarization layer and electrically connected to the light-emitting element, wherein the second planarization layer may be disposed on the first planarization layer and the connection electrode, and the second planarization layer may be formed such that a part of the connection electrode is exposed.

[0324] According to one or more embodiments of the present invention, the electroluminescent display device may further include a cover layer between the light-emitting element and the bonding layer, wherein the cover layer may be made of an organic compound having a refractive index of 1.7 or higher.

[0325] According to one or more embodiments of the present invention, the cover layer may extend to a part of the non-display area and coincide with an end portion of the cathode of the light-emitting element.

[0326] Although the exemplary embodiments of the present invention have been described in detail with reference to the accompanying drawings, the present invention is not limited thereto, and the present invention can be implemented in many different forms without departing from the technical concept of the present invention. Therefore, the exemplary embodiments of the present invention are provided for illustrative purposes only, and are not intended to limit the technical concept of the present invention. The scope of the technical concept of the present invention is not limited thereto. Therefore, it should be understood that the above exemplary embodiments are exemplary in all respects and do not limit the present invention. All technical concepts within the equivalent scope of the present invention should be construed as falling within the scope of the present invention.

Claims

1. An electroluminescent display device, comprising: a substrate, the substrate being divided into a display area and a non-display area arranged outside the display area; an insulating layer disposed above the substrate; A light emitting element disposed on the insulating layer; a bonding layer disposed on the light emitting element; a packaging substrate disposed on the bonding layer; as well as A side sealing portion covers a side surface of the bonding layer and a side surface of the packaging substrate.

2. The electroluminescent display device according to claim 1, further comprising a flexible film disposed at one end of the non-display area, The side seal portion is provided on a non-display area on three surfaces surrounding the periphery of the display area except for one end to which the flexible film is attached.

3. The electroluminescent display device according to claim 2, further comprising: an optical member disposed on a rear surface of the substrate; as well as An additional side seal is provided at an outer side of an upper portion of the optical component. 4 . The electroluminescent display device according to claim 3 , wherein the additional side sealant is provided on a non-display area on three faces surrounding the periphery of the display area except for one end to which the flexible film is attached. 5 . The electroluminescent display device according to claim 3 , wherein the additional side sealant covers a side surface of the substrate and a side surface of the insulating layer. 6 . The electroluminescent display device according to claim 5 , wherein the additional side seal portion extends to cover a portion of the side seal portion.

7. The electroluminescent display device according to claim 3 further includes an additional bonding layer, which is arranged on the outer side of the side sealing portion and the top surface of the packaging substrate to guide the moisture penetration route along the additional bonding layer from the direction toward the side surface of the electroluminescent display device to the direction toward the upper side of the packaging substrate. 8 . The electroluminescent display device according to claim 7 , wherein the additional bonding layer covers the substrate, side surfaces of the insulating layer, outer sides of the side sealing parts, and a top surface of the encapsulation substrate.

9. The electroluminescent display device according to claim 7, further comprising a flexible film disposed at one end of the non-display area, The additional bonding layer is disposed on a non-display area on three surfaces surrounding the periphery of the display area except for one end to which the flexible film is attached. 10 . The electroluminescent display device according to claim 7 , wherein each of the bonding layer and the additional bonding layer comprises an isobutyl rubber resin and a moisture absorbent. 11 . The electroluminescent display device according to claim 7 , wherein the additional side sealant covers a portion of a side surface of the additional bonding layer.

12. The electroluminescent display device according to claim 3, wherein the additional side seal comprises acrylic resin. 13 . The electroluminescent display device according to claim 3 , wherein the additional side seal has a thickness of 80 μm to 140 μm. 14 . The electroluminescent display device according to claim 7 , wherein the additional bonding layer has a thickness of 30 μm to 50 μm. 15 . The electroluminescent display device according to claim 7 , further comprising an additional encapsulation substrate disposed on an outer side of the additional bonding layer. 16 . The electroluminescent display device according to claim 15 , wherein the additional encapsulation substrate has a thickness of 10 μm to 30 μm.

17. The electroluminescent display device according to claim 15, wherein the additional packaging substrate is made of aluminum foil. 18 . The electroluminescent display device according to claim 15 , wherein the additional side sealant covers a portion of a side surface of the additional encapsulation substrate. 19 . The electroluminescent display device according to claim 7 , wherein the additional bonding layer is disposed on a top surface of the insulating layer and covers an outer side of the side sealing portion and a top surface of the encapsulation substrate. 20 . The electroluminescent display device according to claim 15 , wherein the additional encapsulation substrate is disposed on a top surface of the insulating layer and covers an outer side of the additional bonding layer. 21 . The electroluminescent display device according to claim 15 , wherein the additional side sealant covers a portion of a side surface of the additional encapsulation substrate. 22 . The electroluminescent display device according to claim 1 , wherein the side sealant is provided on a top surface of the insulating layer, a side surface of the bonding layer, and a side surface of the encapsulation substrate.

23. The electroluminescent display device according to claim 1, further comprising a connecting electrode, The insulating layer includes a first planarization layer and a second planarization layer, wherein the connecting electrode is disposed on the first planarization layer and is electrically connected to the light emitting element, The second planarization layer is disposed on the first planarization layer and the connection electrode, and the second planarization layer is formed such that a portion of the connection electrode is exposed.

24. The electroluminescent display device according to claim 1, further comprising a covering layer located between the light emitting element and the bonding layer, The cover layer is made of an organic compound having a refractive index of 1.7 or higher.

25. The electroluminescent display device according to claim 24, wherein the cover layer extends to a portion of the non-display area and coincides with an end of a cathode of the light emitting element.

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