Injection molding mold for chip tray

By setting up a dredging mechanism and buffering components in the injection molding mold for chip tray, the bridge formation phenomenon and accumulation problems during plastic particles are solved, and the smoothness of feeding and the protection of chip tray are achieved.

CN120206738APending Publication Date: 2025-06-27Z S TECH CO LTD
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Patent Information

Application Number
CN202510625918.3
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-05-15
Publication Date
2025-06-27

AI Technical Summary

Technical Problem

During the injection molding process of chip trays, plastic particles may form a bridge phenomenon during the loading process, hindering the smooth fall of the particles, and the accumulation of the loading barrel wall will affect the loading efficiency.

Method used

An injection molding mold for chip tray is designed, and a dredging mechanism and buffering components are provided. The dredging mechanism breaks the bridge structure through the stirring rotation of the dredging rod to ensure the smooth fall of the plastic particles; the buffering parts absorb impact force through the rubber-made buffering rod to prevent damage to the chip tray.

Benefits of technology

It effectively avoids blockage during plastic particles, ensures smoothness of feeding, and protects the integrity of the chip tray through buffering to prevent damage.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention relates to the technical field of chip tray production and processing, and particularly discloses an injection molding mold for a chip tray, the top of an injection molding machine is fixedly connected with a movable mold part, the other side of the top of the injection molding machine is fixedly connected with a fixed mold part, and the top of the injection molding machine is fixedly connected with a heating part. According to the injection molding mold for the chip tray, the dredging mechanism is arranged, when plastic particles move downwards under the action of gravity, the bridging phenomenon can be possibly formed at certain positions, smooth falling of the particles is hindered, the bridging structure can be broken through stirring rotation of a dredging rod, the particles can continuously flow downwards, the feeding smoothness is guaranteed, and the production efficiency is improved. Along with continuous conveying of the particles, some plastic particles may adhere to the wall of the feeding barrel, feeding can be affected when the plastic particles are accumulated to a certain degree, the dredging rod rotating in a stirring mode can scrape the barrel wall, the adhered particles are scraped down, formation of accumulated materials is prevented, and the normal working state of the feeding barrel is maintained.
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Description

Technical Field

[0001] The present invention relates to the technical field of chip tray production and processing, and specifically relates to an injection molding die for a chip tray. Background Art

[0002] A chip tray is an important tool in the semiconductor industry for carrying, protecting, and transporting chips. Chip trays, also known as IC trays, waffle boxes, die trays, etc., are precision carriers designed specifically for semiconductor chips. Their main functions include providing safety protection for chips during chip packaging, testing, transportation, and storage, preventing chips from being physically damaged, electrostatically damaged, dust contaminated, etc. They are internally provided with high-precision grooves that can accurately match the chip size, keeping the chips in a fixed position in the tray and avoiding displacement and collision. Driven by environmental protection policies, more and more chip tray manufacturers are starting to use recyclable and degradable materials to reduce environmental impact.

[0003] When injecting and processing a chip tray, it is necessary to perform the feeding work on plastic particles. When the plastic particles enter the feeding cylinder and move downward under the action of gravity, a bridging phenomenon may occur at certain positions, hindering the smooth falling of the particles. Summary of the Invention

[0004] To achieve the above objectives, the present invention is realized through the following technical solutions: An injection molding die for a chip tray, the;

[0005] An injection molding machine, a moving die component is fixedly connected to the top of the injection molding machine, a fixed die component is fixedly connected to the other side of the top of the injection molding machine, a heating component is fixedly connected to the top of the injection molding machine, a conveying component is rotatably connected to the inside of the injection molding machine, a buffering component is fixedly connected to the inside of the injection molding machine, and the conveying component is arranged below the buffering component;

[0006] An extrusion component, which is used for performing the feeding work on plastic particles, the side of the extrusion component is fixedly connected to the inside of the heating component, and the discharging end of the extrusion component is fixedly connected to the fixed die component;

[0007] The extrusion component includes an extrusion housing, the discharging end of the extrusion housing is fixedly connected to the fixed die component, the side of the extrusion housing is fixedly connected to the inside of the heating component, a pouring mechanism is fixedly connected to the side of the extrusion housing, the side of the pouring mechanism away from the extrusion housing is fixedly connected to the fixed die component, a spiral blade is rotatably connected to the inside of the extrusion housing, a motor is fixedly connected to the side of the extrusion housing away from the fixed die component, the output end of the motor is fixedly connected to one end of the spiral blade, a feeding cylinder is fixedly connected to the side of the extrusion housing, and a dredging mechanism is rotatably connected to the inside of the feeding cylinder.

[0008] Preferably, the dredging mechanism includes a rotating shaft, the upper and lower ends of the rotating shaft are rotatably connected to a fixed frame, the side of the fixed frame is fixedly connected to the inner side of the loading barrel, the side of the rotating shaft is fixedly connected to an inclined leaf, and connecting plates are sleeved on both sides of the rotating shaft close to the fixed frame, and a dredging rod is fixedly connected to the side of the connecting plate close to the inclined leaf.

[0009] Preferably, the buffer component includes a feed opening, a give way groove and a fixed shell, the feed opening is opened in the middle of the top of the injection molding machine, the give way groove is opened at the top of the injection molding machine, the inner wall of the give way groove is fixedly connected with a guide rod, the side of the guide rod is slidably connected with a sliding block, the top of the sliding block is fixedly connected to the bottom of the movable mold component, the inner wall of the give way groove is fixedly connected with a sliding rod, the side of the sliding rod is slidably connected with the inner side of the sliding block, the sliding rod is arranged below the guide rod, a first spring is sleeved on the sliding rod, one end of the first spring is fixedly connected to the side of the sliding block, the other end of the first spring is fixedly connected to the inner wall of the give way groove, the bottom of the sliding block is fixedly connected with a movable shell, the top of the movable shell is slidably connected to the inner side of the injection molding machine, the top of the fixed shell is fixedly connected to the inner side of the injection molding machine, the inner side of the fixed shell and the inner side of the movable shell are both fixedly connected with a contact mechanism, and the contact mechanism on the inner side of the fixed shell and the contact mechanism on the inner side of the movable shell are cross-arranged.

[0010] Preferably, the contact mechanism comprises a contact rod and a limit block, wherein one end of the contact rod is fixedly connected to a rotating rod near the limit block, and the side of the contact rod is rotatably connected to a connecting rod near the limit block, and the side surface of the limit block is fixedly connected to the inner wall of the movable shell, and the side of the limit block near the contact rod is rotatably connected to the side surface of the rotating rod, the inner side of the limit block is fixedly connected to a sliding shaft, the side surface of the sliding shaft is slidably connected to a sliding block, the side surface of the sliding block is slidably connected to the inner side of the limit block, the side surface of the sliding block is rotatably connected to an end of the connecting rod away from the contact rod, and the sliding shaft is sleeved with a second spring, one end of the second spring is fixedly connected to the side surface of the sliding block, and the other end of the second spring is fixedly connected to the inner wall of the limit block, the end of the contact rod away from the rotating rod is fixedly connected to a contact plate, and the side of the contact plate away from the limit block is rotatably connected to a roller, the side of the contact plate close to the roller is fixedly connected to a wiping plate, the side of the wiping plate away from the contact plate contacts the side surface of the roller, and the side of the contact plate away from the roller is fixedly connected to a buffer assembly.

[0011] Preferably, the buffer assembly includes a square plate and a buffer plate. The inner side of the square plate is slidably connected to the side surface of the buffer plate. The side of the buffer plate away from the square plate is fixedly connected to the side of the contact plate away from the wiping plate. The other side of the buffer plate is fixedly connected to a round rod. The end of the round rod away from the buffer plate is slidably connected to the inner side of the square plate. A third spring is sleeved on the round rod. One end of the third spring is fixedly connected to the side of the buffer plate close to the round rod, and the other end of the third spring is fixedly connected to the side of the square plate close to the round rod. A buffer rod is rotatably connected to the side of the square plate away from the round rod, and annular grooves are formed on both sides of the buffer rod.

[0012] The present invention provides an injection molding mold for a chip tray. It has the following beneficial effects:

[0013] 1. For this injection molding mold for a chip tray, a dredging mechanism is provided. When plastic particles move downward under the action of gravity, a bridging phenomenon may occur at certain positions, hindering the smooth falling of the particles. The stirring rotation of the dredging rod can break this bridging structure, enabling the particles to continue to flow downward and ensuring the smoothness of feeding. As the particles are continuously conveyed, some plastic particles may adhere to the wall of the feeding cylinder, and when accumulated to a certain extent, it will also affect feeding. The stirring and rotating dredging rod can scrape the cylinder wall to scrape off the adhered particles, prevent the formation of accumulated materials, and maintain the normal working state of the feeding cylinder.

[0014] 2. For this injection molding mold for a chip tray, a buffer component is provided. Before the mold closing and injection molding work, when the moving mold component drives the moving template to move towards the fixed mold component, the moving mold component drives the moving outer shell to move towards the fixed outer shell through the sliding block, so that the moving outer shell drives the contact rod to move towards the fixed outer shell through the limit block, and then the roller contacts the inner wall of the fixed outer shell.

[0015] 3. For this injection molding mold for a chip tray, a buffer assembly is provided. The buffer rod made of rubber has good elasticity and flexibility. When the chip tray drops and contacts it, it can effectively absorb and disperse part of the impact force, reduce the instantaneous impact force received by the chip tray, and avoid cracks, breakage or deformation of the chip tray due to excessive impact force, thus ensuring the integrity and quality of the chip tray.

[0016] 4. For this injection molding mold for a chip tray, a contact mechanism is provided. By cleaning the inner walls of the fixed outer shell and the moving outer shell during the mold closing operation, it is avoided that when the injection molded chip tray passes through the feeding for a long time, impurities and debris on the chip tray will splash and adhere to the inner walls of the fixed outer shell and the moving outer shell, and then adhere to the chip tray during the subsequent discharging of the injection molded chip tray, thus ensuring the cleanliness of the surface of the chip tray during discharging. Description of the Drawings

[0017] Figure 1 This is a schematic structural view of an injection molding die for a chip tray of the present invention;

[0018] Figure 2 This is an axonometric view of the present invention;

[0019] Figure 3 This is a schematic structural view of an extrusion component of the present invention;

[0020] Figure 4 This is a schematic structural view of a dredging mechanism of the present invention;

[0021] Figure 5 This is a schematic structural view of a moving die component of the present invention;

[0022] Figure 6 This is a schematic structural view of a buffer component of the present invention;

[0023] Figure 7 This is a schematic structural view of a moving housing of the present invention;

[0024] Figure 8 This is a schematic structural view of a contact mechanism of the present invention;

[0025] Figure 9 This is a schematic structural view of a buffer assembly of the present invention.

[0026] In the figure: 1, injection molding machine; 2, moving die component; 3, fixed die component; 4, heating component; 5, conveying component; 6, buffer component; 61, blanking port; 62, relief groove; 63, guide rod; 64, sliding block; 65, slide bar; 66, first spring; 67, moving housing; 68, contact mechanism; 681, contact rod; 682, rotating rod; 683, limit block; 684, connecting rod; 685, slider; 686, sliding shaft; 687, second spring; 688, contact plate; 689, buffer assembly; 6891, square plate; 6892, buffer rod; 6893, annular groove; 6894, buffer plate; 6895, round rod; 6896, third spring; 6810, roller; 6811, wiping plate; 69, fixed housing; 7, extrusion component; 71, extrusion housing; 72, pouring mechanism; 73, spiral blade; 74, motor; 75, dredging mechanism; 751, fixing frame; 752, rotating shaft; 753, inclined blade; 754, connecting plate; 755, dredging rod; 76, feeding cylinder. Detailed implementation manners

[0027] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0028] Please refer to Figures 1-4 , the present invention provides a technical solution: an injection molding mold for a chip tray.

[0029] Please refer to Figures 1-4 , the present invention provides a technical solution: including:

[0030] An injection molding machine 1, a moving die component 2 is fixedly connected to the top of the injection molding machine 1, a fixed die component 3 is fixedly connected to the other side of the top of the injection molding machine 1, a heating component 4 is fixedly connected to the top of the injection molding machine 1, a conveying component 5 is rotatably connected to the inside of the injection molding machine 1, a buffering component 6 is fixedly connected to the inside of the injection molding machine 1, and the conveying component 5 is arranged below the buffering component 6;

[0031] An extrusion component 7, which is used for feeding plastic particles, the side of the extrusion component 7 is fixedly connected to the inside of the heating component 4, and the discharging end of the extrusion component 7 is fixedly connected to the fixed die component 3;

[0032] The extrusion component 7 includes an extrusion housing 71, the discharging end of the extrusion housing 71 is fixedly connected to the fixed die component 3, the side of the extrusion housing 71 is fixedly connected to the inside of the heating component 4, a pouring mechanism 72 is fixedly connected to the side of the extrusion housing 71, the side of the pouring mechanism 72 away from the extrusion housing 71 is fixedly connected to the fixed die component 3, a spiral blade 73 is rotatably connected to the inside of the extrusion housing 71, a motor 74 is fixedly connected to the side of the extrusion housing 71 away from the fixed die component 3, the output end of the motor 74 is fixedly connected to one end of the spiral blade 73, a feeding cylinder 76 is fixedly connected to the side of the extrusion housing 71, and a dredging mechanism 75 is rotatably connected to the inside of the feeding cylinder 76;

[0033] When feeding plastic particles, a large number of plastic particles are continuously fed into the extrusion housing 71 through the feeding cylinder 76. The plastic particles entering the feeding cylinder 76 impact with the dredging mechanism 75, thereby avoiding the phenomenon of blockage of the plastic particles in the feeding cylinder 76. At the same time, when the plastic particles enter the extrusion housing 71, the motor 74 is turned on, and the output end of the motor 74 drives the spiral blade 73 to rotate in the extrusion housing 71;

[0034] Please refer to Figure 4The dredging mechanism 75 includes a rotating shaft 752, and the upper and lower ends of the rotating shaft 752 are rotatably connected to the fixing frame 751, the side of the fixing frame 751 is fixedly connected to the inner side of the loading barrel 76, and the side of the rotating shaft 752 is fixedly connected to the inclined leaf 753, and the two sides of the rotating shaft 752 close to the fixing frame 751 are sleeved with connecting plates 754, and the side of the connecting plate 754 close to the inclined leaf 753 is fixedly connected to the dredging rod 755;

[0035] When the plastic particles are continuously fed into the upper barrel 76, the plastic particles continuously fed into the upper barrel 76 will continuously impact the tilting blade 753. This continuous impact force can provide continuous power for the rotation of the tilting blade 753, so that the tilting blade 753 drives the rotating shaft 752 to rotate in the upper barrel 76, so that the rotating shaft 752 drives the dredging rod 755 to stir and rotate the plastic particles through the connecting plates 754 on the upper and lower sides;

[0036] See also Figures 5-9 , the present invention provides a technical solution:

[0037] See also Figures 5-7 The buffer component 6 includes a feed opening 61, a clearance groove 62 and a fixed shell 69. The feed opening 61 is opened in the middle of the top of the injection molding machine 1, and the clearance groove 62 is opened at the top of the injection molding machine 1. The inner wall of the clearance groove 62 is fixedly connected with a guide rod 63, and the side of the guide rod 63 is slidably connected with a sliding block 64. The top of the sliding block 64 is fixedly connected to the bottom of the movable mold component 2, and the inner wall of the clearance groove 62 is fixedly connected with a sliding rod 65. The side of the sliding rod 65 is slidably connected with the inner side of the sliding block 64. The sliding rod 65 is arranged below the guide rod 63, and the sliding rod 65 is sleeved with a first A spring 66, one end of the first spring 66 is fixedly connected to the side of the sliding block 64, the other end of the first spring 66 is fixedly connected to the inner wall of the give way groove 62, the bottom of the sliding block 64 is fixedly connected to a movable housing 67, the top of the movable housing 67 is slidably connected to the inner side of the injection molding machine 1, the top of the fixed housing 69 is fixedly connected to the inner side of the injection molding machine 1, the inner side of the fixed housing 69 and the inner side of the movable housing 67 are both fixedly connected to a contact mechanism 68, and the contact mechanism 68 on the inner side of the fixed housing 69 and the contact mechanism 68 on the inner side of the movable housing 67 are cross-arranged;

[0038] When the movable mold part 2 is moving to open the mold, the movable mold part 2 is moved on the guide rod 63 and the slide rod 65 through the sliding block 64, and the first spring 66 is squeezed at the same time, driving the movable shell 67 to separate from the fixed shell 69, so that the movable shell 67 drives the contact mechanism 68 to separate from the inner wall of the fixed shell 69, so that when the molded chip tray is unloaded, the contact mechanism 68 can buffer the chip tray that falls off the mold, thereby preventing the chip tray from being collided and damaged when it falls;

[0039] Please refer to Figure 8 , the contact mechanism 68 includes a contact rod 681 and a limit block 683. One end of the contact rod 681 close to the limit block 683 is fixedly connected with a rotating rod 682. One side of the contact rod 681 close to the limit block 683 is rotatably connected with a connecting rod 684. The side surface of the limit block 683 is fixedly connected with the inner wall of the moving housing 67. One side of the limit block 683 close to the contact rod 681 is rotatably connected with the side surface of the rotating rod 682. The inner side of the limit block 683 is fixedly connected with a sliding shaft 686. The side surface of the sliding shaft 686 is slidably connected with a slider 685. The side surface of the slider 685 is slidably connected with the inner side of the limit block 683. The side surface of the slider 685 is rotatably connected with one end of the connecting rod 684 far from the contact rod 681. A second spring 687 is sleeved on the sliding shaft 686. One end of the second spring 687 is fixedly connected with the side surface of the slider 685. The other end of the second spring 687 is fixedly connected with the inner wall of the limit block 683. One end of the contact rod 681 far from the rotating rod 682 is fixedly connected with a contact plate 688. One side of the contact plate 688 far from the limit block 683 is rotatably connected with a roller 6810. One side of the contact plate 688 close to the roller 6810 is fixedly connected with a wiping plate 6811. One side of the wiping plate 6811 far from the contact plate 688 is in contact with the side surface of the roller 6810. One side of the contact plate 688 far from the roller 6810 is fixedly connected with a buffer assembly 689;

[0040] Before the mold closing and injection molding work is carried out, when the moving mold part 2 drives the moving template to move towards the fixed mold part 3, the moving mold part 2 drives the moving housing 67 to move towards the fixed housing 69 through the sliding block 64, so that the moving housing 67 drives the contact rod 681 to move towards the fixed housing 69 through the limit block 683, so that the roller 6810 is in contact with the inner wall of the fixed housing 69;

[0041] When the moving mold part 2 continues to carry out the mold closing work, the roller 6810 moves on the inner wall of the fixed housing 69, so that the roller 6810 moves in contact on the inner wall of the fixed housing 69. At the same time, the contact rod 681 is subjected to a squeezing force, so that the contact rod 681 deflects on the limit block 683 through the rotating rod 682. At the same time, the connecting rod 684 pulls the slider 685 and the second spring 687 to move on the sliding shaft 686. Furthermore, when the fixed mold part 3 and the moving mold part 2 are closed, the roller 6810 can be driven by the contact rod 681 to move and clean on the inner wall of the fixed housing 69;

[0042] Meanwhile, when the roller 6810 moves in contact with the inner wall of the fixed housing 69 and rotates, it comes into contact with the wiping plate 6811 at the same time. As a result, the wiping plate 6811 can clean the side surface of the roller 6810, thus preventing a large amount of impurities from adhering to the roller 6810 during the cleaning of the fixed housing 69 by the roller 6810, which may interfere with the normal rotation and cleaning work of the roller 6810.

[0043] Please refer to Figure 9 , the buffer assembly 689 includes a square plate 6891 and a buffer plate 6894. The inner side of the square plate 6891 is slidably connected to the side surface of the buffer plate 6894. The side of the buffer plate 6894 away from the square plate 6891 is fixedly connected to the side of the contact plate 688 away from the wiping plate 6811. The other side of the buffer plate 6894 is fixedly connected to a round rod 6895. The end of the round rod 6895 away from the buffer plate 6894 is slidably connected to the inner side of the square plate 6891. A third spring 6896 is sleeved on the round rod 6895. One end of the third spring 6896 is fixedly connected to the side of the buffer plate 6894 close to the round rod 6895, and the other end of the third spring 6896 is fixedly connected to the side of the square plate 6891 close to the round rod 6895. A buffer rod 6892 is rotatably connected to the side of the square plate 6891 away from the round rod 6895, and annular grooves 6893 are formed on both sides of the buffer rod 6892.

[0044] When the chip tray after injection molding falls through the blanking port 61, it comes into contact with and impacts the buffer rods 6892 on both sides. At the same time, the buffer rods 6892 are made of rubber. When the impact force between the chip tray and the buffer rods 6892 is too large during the fall of the chip tray, the square plate 6891 drives the buffer rod 6892 to move towards the buffer plate 6894 through the round rod 6895, and at the same time, the third spring 6896 is compressed by the square plate 6891, thus preventing the extrusion force between the buffer rod 6892 and the chip tray from being too large.

[0045] Specific working process:

[0046] The oil cylinder in the moving die part 2 drives the moving template to move towards the fixed die part 3. When the moving die and the fixed die are completely closed, a closed cavity is formed, and its shape and size are exactly the same as those of the chip tray.

[0047] The plastic particles are heated and melted in the extrusion part 7 to form a plastic melt with a certain fluidity. The extrusion part 7 enters the cavity, and under the action of the injection pressure, the plastic melt fills the entire cavity and starts to form the chip tray.

[0048] When feeding plastic particles, a large amount of plastic particles are continuously fed into the extrusion housing 71 through the feeding cylinder 76. The plastic particles entering the feeding cylinder 76 impact with the dredging mechanism 75, thus avoiding the blockage of plastic particles in the feeding cylinder 76. At the same time, when the plastic particles enter the extrusion housing 71, the motor 74 is turned on, and the output end of the motor 74 drives the spiral blade 73 to rotate in the extrusion housing 71;

[0049] The plastic particles in the extrusion housing 71 are gradually heated and melted by the heating of the heating component 4 and the rotational stirring action of the spiral blade 73 to form a plastic melt with good fluidity;

[0050] When the plastic melt reaches the specified quantity and temperature, the plastic melt is extruded from the discharge end of the extrusion housing 71, passes through the pouring mechanism 72 and enters the cavity of the mold, enabling the plastic melt to quickly and evenly fill the cavity;

[0051] When plastic particles are continuously fed into the feeding cylinder 76, the plastic particles continuously fed into the feeding cylinder 76 will continuously impact the inclined blade 753. This continuous impact force can provide continuous power for the rotation of the inclined blade 753, causing the inclined blade 753 to drive the rotating shaft 752 to rotate in the feeding cylinder 76. As a result, the rotating shaft 752 drives the dredging rod 755 to perform stirring and rotating work on the plastic particles through the connecting plates 754 on the upper and lower sides;

[0052] The rotation of the inclined blade 753 and the dredging rod 755 has a certain pushing effect on the plastic particles, which can provide additional power for the particles on the basis of gravity, accelerating the downward movement speed of the particles, thereby improving the feeding efficiency and meeting the requirements for the material supply speed in the production process;

[0053] After the plastic melt fills the cavity, a certain pressure is continuously maintained to enable the plastic melt to perform compensatory shrinkage under the action of the pressure to compensate for the volume change caused by the cooling shrinkage of the plastic and ensure the dimensional accuracy and surface quality of the chip tray;

[0054] After the pressure holding is completed, the cooling system starts to work, and the heat in the mold is removed by circulating cooling water, enabling the plastic melt to quickly cool and solidify in the cavity to form the final shape of the chip tray;

[0055] After cooling is completed, the oil cylinder in the moving die part 2 drives the moving template to move backward to open the mold. At this time, through the ejection device in the fixed die part 3, the formed chip tray is ejected from the core to complete the demolding process;

[0056] The demolded chip tray falls onto the conveying part 5 through the buffer part 6, and thus the conveying part 5 performs the feeding and conveying work on the formed chip tray;

[0057] When the moving die part 2 performs the opening die movement operation, the moving die part 2 moves through the sliding block 64 on the guide rod 63 and the slide rod 65, and at the same time squeezes the first spring 66, driving the moving housing 67 to disengage from the fixed housing 69, so that the moving housing 67 drives the contact mechanism 68 to disengage from the inner wall of the fixed housing 69. When the formed chip tray is unloaded, the contact mechanism 68 can buffer the dropped and demolded chip carriers, thus avoiding the phenomenon of collision and breakage of the chip carriers when they fall;

[0058] Before the mold closing and injection molding operation, when the moving die part 2 drives the moving template to move towards the fixed die part 3, the moving die part 2 drives the moving housing 67 to move towards the fixed housing 69 through the sliding block 64, so that the moving housing 67 drives the contact rod 681 to move towards the fixed housing 69 through the limit block 683, so that the roller 6810 contacts the inner wall of the fixed housing 69;

[0059] When the moving die part 2 continues to perform the moving and mold closing operation, the roller 6810 moves on the inner wall of the fixed housing 69, so that the roller 6810 moves in contact with the inner wall of the fixed housing 69. At the same time, the contact rod 681 is subjected to a squeezing force, so that the contact rod 681 deflects on the limit block 683 through the rotating rod 682. At the same time, the connecting rod 684 pulls the slider 685 and the second spring 687 to move on the sliding shaft 686. When the fixed die part 3 and the moving die part 2 are closed, the roller 6810 can be driven by the contact rod 681 to move and clean on the inner wall of the fixed housing 69;

[0060] At the same time, when the roller 6810 moves in contact with the inner wall of the fixed housing 69 and the roller 6810 rotates, it contacts the wiping plate 6811 at the same time, so that the wiping plate 6811 can clean the side surface of the roller 6810, thus avoiding a large amount of impurities adhering to the roller 6810 when the roller 6810 cleans the fixed housing 69, which interferes with the normal rotation and cleaning work of the roller 6810;

[0061] Since the contact mechanism 68 is cross - arranged inside the fixed housing 69 and inside the moving housing 67, when the contact mechanism 68 on the moving housing 67 cleans the inside of the fixed housing 69, the contact mechanism 68 on the inside of the fixed housing 69 can simultaneously clean the inside of the moving housing 67;

[0062] By cleaning the inner walls of the fixed housing 69 and the moving housing 67 during the mold clamping operation, it is possible to prevent impurities and debris on the chip tray from splashing and adhering to the inner walls of the fixed housing 69 and the moving housing 67 during long-term feeding, and then adhering to the chip tray during the subsequent discharging of the injection-molded chip tray, thus ensuring the cleanliness of the surface of the chip tray during discharging;

[0063] At the same time, when the moving die component 2 performs the mold opening and moving operation, the moving die component 2 moves on the guide rod 63 and the slide rod 65 through the slider 64, driving the moving housing 67 away from the fixed housing 69, so that the moving housing 67 drives the contact rod 681 to move away from the fixed housing 69, thereby adjusting the distance between the contact rods 681 on the fixed housing 69 and the moving housing 67. When the injection-molded chip tray drops through the feeding port 61, the buffer assembly 689 on the fixed housing 69 and the moving housing 67 can buffer the dropped chip tray;

[0064] When the injection-molded chip tray drops through the feeding port 61, the chip tray contacts and impacts the buffer rods 6892 on both sides. At the same time, the buffer rods 6892 are made of rubber. When the impact force between the chip tray and the buffer rods 6892 is too large during the dropping of the chip tray, the square plate 6891 drives the buffer rod 6892 to move towards the buffer plate 6894 through the round rod 6895, and at the same time, the square plate 6891 squeezes the third spring 6896, thus preventing the excessive extrusion force between the buffer rod 6892 and the chip tray;

[0065] The buffering effect of the buffer rod 6892 on the chip tray can effectively control the movement state of the chip tray during dropping, preventing it from splashing or bouncing out of the conveying component 5 due to excessive impact force.

[0066] Obviously, the described embodiments are only a part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art and related fields without creative efforts shall fall within the protection scope of the present invention. The structures, devices, and operation methods not specifically described and explained in the present invention shall be implemented according to the conventional means in the art without special instructions and limitations.

Claims

1. An injection molding mold for a chip tray, comprising: as stated; An injection molding machine (1), wherein a movable mold component (2) is fixedly connected to the top of the injection molding machine (1), a fixed mold component (3) is fixedly connected to the other side of the top of the injection molding machine (1), a heating component (4) is fixedly connected to the top of the injection molding machine (1), a conveying component (5) is rotatably connected to the inside of the injection molding machine (1), a buffer component (6) is fixedly connected to the inside of the injection molding machine (1), and the conveying component (5) is arranged below the buffer component (6); An extrusion component (7), the extrusion component (7) being used to feed plastic particles, the side surface of the extrusion component (7) being fixedly connected to the inner side of the heating component (4), and the discharge end of the extrusion component (7) being fixedly connected to the fixed mold component (3); The extrusion component (7) comprises an extrusion shell (71), a side of the extrusion shell (71) is fixedly connected to a casting mechanism (72), the inner side of the extrusion shell (71) is rotatably connected to a spiral blade (73), a side of the extrusion shell (71) away from the fixed mold component (3) is fixedly connected to a motor (74), an output end of the motor (74) is fixedly connected to one end of the spiral blade (73), a side of the extrusion shell (71) is fixedly connected to a loading barrel (76), and the inner side of the loading barrel (76) is rotatably connected to a dredging mechanism (75).

2. The chip tray injection molding die according to claim 1, characterized in that: The dredging mechanism (75) comprises a rotating shaft (752), the upper and lower ends of the rotating shaft (752) are rotatably connected to a fixing frame (751), the side of the rotating shaft (752) is fixedly connected to an inclined leaf (753), both sides of the rotating shaft (752) close to the fixing frame (751) are sleeved with a connecting plate (754), and the side of the connecting plate (754) close to the inclined leaf (753) is fixedly connected to a dredging rod (755).

3. The chip tray injection molding die according to claim 2, characterized in that: The side of the fixing frame (751) is fixedly connected to the inner side of the loading barrel (76), the discharge end of the extrusion shell (71) is fixedly connected to the fixed mold component (3), the side of the extrusion shell (71) is fixedly connected to the inner side of the heating component (4), and the side of the casting mechanism (72) away from the extrusion shell (71) is fixedly connected to the fixed mold component (3).

4. The injection molding die for a chip tray according to claim 1, characterized in that: The buffer component (6) comprises a feed opening (61), a clearance groove (62) and a fixed shell (69), wherein the feed opening (61) is arranged at the middle of the top of the injection molding machine (1), the clearance groove (62) is arranged at the top of the injection molding machine (1), the inner wall of the clearance groove (62) is fixedly connected to a guide rod (63), the side of the guide rod (63) is slidably connected to a sliding block (64), the inner wall of the clearance groove (62) is fixedly connected to a sliding rod (65), and the sliding rod (65) is arranged on the guide rod (63). Below the rod (63), a first spring (66) is sleeved on the sliding rod (65), the bottom of the sliding block (64) is fixedly connected to a movable housing (67), the top of the fixed housing (69) is fixedly connected to the inner side of the injection molding machine (1), the inner side of the fixed housing (69) and the inner side of the movable housing (67) are both fixedly connected to a contact mechanism (68), and the contact mechanism (68) on the inner side of the fixed housing (69) and the contact mechanism (68) on the inner side of the movable housing (67) are cross-arranged.

5. The chip tray injection molding die according to claim 4, characterized in that: The side surface of the slide rod (65) is slidably connected to the inner side of the slide block (64), one end of the first spring (66) is fixedly connected to the side surface of the slide block (64), the other end of the first spring (66) is fixedly connected to the inner wall of the clearance groove (62), the top of the slide block (64) is fixedly connected to the bottom of the movable mold component (2), and the top of the movable housing (67) is slidably connected to the inner side of the injection molding machine (1).

6. The injection molding die for a chip tray according to claim 4, characterized in that: The contact mechanism (68) comprises a contact rod (681) and a limit block (683); one end of the contact rod (681) close to the limit block (683) is fixedly connected to a rotating rod (682); one side of the contact rod (681) close to the limit block (683) is rotatably connected to a connecting rod (684); a side of the limit block (683) is fixedly connected to an inner wall of the movable housing (67); a side of the limit block (683) close to the contact rod (681) is rotatably connected to a side of the rotating rod (682); an inner side of the limit block (683) is fixedly connected to a sliding shaft (686); and a side of the sliding shaft (686) is slidably connected to a sliding shaft (686). The sliding block (685) is rotatably connected to the side of the sliding block (685) and the end of the connecting rod (684) away from the contact rod (681); a second spring (687) is sleeved on the sliding shaft (686); the end of the contact rod (681) away from the rotating rod (682) is fixedly connected to a contact plate (688); the side of the contact plate (688) away from the limit block (683) is rotatably connected to a roller (6810); the side of the contact plate (688) close to the roller (6810) is fixedly connected to a wiping plate (6811); and the side of the contact plate (688) away from the roller (6810) is fixedly connected to a buffer assembly (689).

7. The injection molding die for a chip tray according to claim 6, characterized in that: The side surface of the slider (685) is slidably connected to the inner side of the limit block (683), one end of the second spring (687) is fixedly connected to the side surface of the slider (685), the other end of the second spring (687) is fixedly connected to the inner wall of the limit block (683), and the side of the wiping plate (6811) away from the contact plate (688) is in contact with the side surface of the roller (6810).

8. The injection molding die for a chip tray according to claim 6, characterized in that: The buffer assembly (689) comprises a square plate (6891) and a buffer plate (6894); a side of the buffer plate (6894) away from the square plate (6891) is fixedly connected to a side of the contact plate (688) away from the wiping plate (6811); a round rod (6895) is fixedly connected to the other side of the buffer plate (6894); an end of the round rod (6895) away from the buffer plate (6894) is slidably connected to the inner side of the square plate (6891); a third spring (6896) is sleeved on the round rod (6895); a side of the square plate (6891) away from the round rod (6895) is rotatably connected to a buffer rod (6892); and annular grooves (6893) are provided on both sides of the buffer rod (6892).

9. The injection molding die for a chip tray according to claim 8, characterized in that: One end of the third spring (6896) is fixedly connected to a side of the buffer plate (6894) close to the round rod (6895), the other end of the third spring (6896) is fixedly connected to a side of the square plate (6891) close to the round rod (6895), and the inner side of the square plate (6891) is slidably connected to the side surface of the buffer plate (6894).