Micro-electro-mechanical system device and sensor package

Abstract

The invention relates to a micro-electro-mechanical system device and a sensor package. In one embodiment, a microelectromechanical system device includes a solid dielectric including a plurality of apertures, the solid dielectric having a first side and a second side; a first plurality of electrodes extending completely through a first subset of the plurality of apertures; a second plurality of electrodes extending partially through a second subset of the plurality of apertures; a third plurality of electrodes extending partially into a third subset of the plurality of apertures; a first diaphragm coupled to the first plurality of electrodes and the third plurality of electrodes, the first diaphragm facing the first side of the solid dielectric; and a second diaphragm coupled to the first plurality of electrodes and the second plurality of electrodes, the second diaphragm facing the second side of the solid dielectric.

Description

[0001] This application is a divisional application of the invention patent application with the original application number 202111454000.5 (filing date: December 1, 2021, invention title: MEMS device with electrodes and dielectrics). Technical Field

[0002] The present disclosure relates to a microelectromechanical system (MEMS) device having electrodes and a dielectric. Background Art

[0003] Currently, consumer electronic devices such as mobile phones, personal computers, smart speakers, hearing aids, and true wireless stereo (TWS) earphones, as well as other host devices, typically include one or more small microphones, sensors, and / or actuators. Advancements in micro-nano manufacturing technologies have led to the development of MEMS devices (such as microphones, sensors, and actuators) with increasingly smaller sizes and different form factors. Increasing the bias voltage of capacitive microphones, sensors, actuators, and other capacitive elements in MEMS devices results in higher outputs and other operations, but also increases the tendency for collapse and increases the mechanical stiffness of the system. Summary of the Invention

[0004] One aspect of the present invention relates to a microelectromechanical system (MEMS) device, the MEMS device including: a first electrode longitudinally oriented along and parallel to an axis, the first electrode having a first end and a second end; a second electrode longitudinally oriented along and parallel to the axis, the second electrode having a first end and a second end; a third electrode longitudinally oriented along and parallel to the axis, the third electrode having a first end and a second end; and a solid dielectric including a plurality of holes, wherein the first electrode, the second electrode, and the third electrode are each at least partially located within one of the plurality of holes, wherein the solid dielectric surrounds the second end of the second electrode and the first end of the third electrode, and wherein the first end of the second electrode and the second end of the third electrode are located outside the solid dielectric.

[0005] Another aspect of the present invention relates to a microelectromechanical system (MEMS) device, the MEMS device comprising: a solid dielectric having a first outer surface and a second outer surface opposite the first outer surface, the solid dielectric having a plurality of through-holes, each of the plurality of through-holes having an opening on the first outer surface and an opening on the second outer surface; and an electrode set comprising: a first electrode partially disposed within a first through-hole of the plurality of through-holes such that a first end of the first electrode extends beyond the first outer surface and a second end of the first electrode extends beyond the second outer surface; a second electrode partially disposed within a second through-hole of the plurality of through-holes such that a first end of the second electrode extends beyond the first outer surface and a second end of the second electrode is within the second through-hole; and a third electrode partially disposed within a third through-hole of the plurality of through-holes such that a first end of the third electrode is within the third through-hole and a second end of the third electrode extends beyond the second outer surface, wherein the first electrode, the second electrode, and the third electrode are fixed relative to each other, and wherein the solid dielectric and the electrode set are movable relative to each other. BRIEF DESCRIPTION OF THE DRAWINGS

[0006] To describe the manner in which the advantages and features of the present disclosure can be obtained, a description of the present disclosure is presented by reference to specific embodiments illustrated in the accompanying drawings. These drawings only depict example embodiments of the present disclosure and are thus not considered to limit the scope of the present disclosure. For clarity, the drawings may have been simplified and are not necessarily drawn to scale.

[0007] Figure 1 is an example cross-sectional view of a MEMS device according to a possible embodiment;

[0008] Figure 2 is an example isometric view of a MEMS device according to a possible embodiment;

[0009] Figure 3 is an example cross-sectional view of a MEMS device according to a possible embodiment;

[0010] Figures 4 to 7 is an example isometric view of a MEMS device according to a possible embodiment;

[0011] Figures 8 to 11 is an example cross-sectional view of a MEMS device according to a possible embodiment;

[0012] Figure 12 is an example cross-sectional view of a sensor package according to a possible embodiment; and

[0013] Figure 13It is an exemplary illustration of the application of a MEMS device according to a possible embodiment. Detailed implementation

[0014] An embodiment may provide a MEMS device having electrodes and a dielectric. According to a possible embodiment, the MEMS device may include a first electrode longitudinally oriented along and parallel to an axis. The first electrode may have a first end and a second end. The MEMS device may include a second electrode longitudinally oriented along and parallel to the axis. The second electrode may have a first end and a second end. The MEMS device may include a third electrode longitudinally oriented along and parallel to the axis. The third electrode may have a first end and a second end. The MEMS device may include a solid dielectric having a plurality of holes. The first electrode, the second electrode, and the third electrode may each be at least partially located within one of the plurality of holes. The dielectric may surround the second end of the second electrode and the first end of the third electrode. The first end of the second electrode and the second end of the third electrode may be located outside the solid dielectric.

[0015] At least some embodiments may be based on a dielectric actuator, wherein the dielectric is disposed between electrodes at different electric potentials. The resulting electrostatic force is used to pull the dielectric and the electrodes such that the dielectric covers the electrodes as much as possible, thereby maximizing the capacitance between them. This force is proportional to the change in capacitance with displacement and the square of the voltage.

[0016] Specifically, when a voltage is applied between adjacent electrodes, an electrostatic force is generated, which pulls the dielectric and the electrodes in a manner that more fully engages them. The energy in the capacitor is E = 1 / 2CV 2 . Moving the dielectric into the gap between the electrodes increases the capacitance. The electrostatic force F = δE / δz = 1 / 2δC / δz V 2 , where z is the direction of engagement between the dielectric and the electrodes. As long as the ends of the dielectric do not get too close to the ends of the conductive electrodes and as long as the electrode shape is ideal, the capacitance between the electrodes varies linearly as a function of the dielectric displacement. Thus, the resulting electrostatic force is constant regardless of the position of the dielectric between the electrodes.

[0017] In a traditional parallel plate sensor, the electrostatic force varies inversely with the square of the gap between the plates. In a MEMS device such as a microphone, the electrostatic force causes the diaphragm to deflect as a function of displacement and thus become stiffer. When a dielectric motor is used as a sensor in a MEMS device such as a microphone, the electrostatic force generated by the motor causes the diaphragm to bend and thus increases the stiffness of the diaphragm. This additional stiffness is proportional to the square of the applied voltage. The sensitivity of the sensor is also proportional to the applied voltage, so there is a conflict between increasing the applied voltage to increase sensitivity and reducing the mechanical compliance of the diaphragm (i.e., increasing the stiffness). At least some embodiments may provide a dual dielectric motor that can make the overall compliance independent of the voltage applied to at least the first order.

[0018] One problem in traditional parallel plate MEMS microphones is that the diaphragm tends to collapse onto the backplate under high shock or acoustic loads. Since the gap between the diaphragm and the backplate becomes unequal, a dual diaphragm single backplate microphone can become very unstable. Using a dual dielectric motor for sensing can avoid electrostatic collapse and electrostatic stiffening of the diaphragm. Some embodiments may use two opposing dielectric motors to balance the electrostatic forces between them. In some embodiments, this may allow a large bias voltage where there is little or no net electrostatic force or electrostatic force gradient and the position is applied between the electrodes and the dielectric of the MEMS device.

[0019] Figure 1 is an example cross-sectional view of a MEMS device 100 according to a possible embodiment. Figure 2 is an example isometric view of a MEMS device 200 according to a possible embodiment. Figure 3 is an example cross-sectional view of a MEMS device 300 according to a possible embodiment. Figures 4 to 7 is an example isometric view of MEMS devices 400, 500, 600, and 700 according to a possible embodiment. Figures 8 to 11 is an example cross-sectional view of MEMS devices 800, 900, 1000, and 1100 according to a possible embodiment. Figure 12 is an example cross-sectional view of a sensor package 1200 according to a possible embodiment. Figure 13 is an example illustrative view 1300 of an application of a MEMS device 400 or any other disclosed MEMS device according to a possible embodiment.

[0020] Generally, reference Figures 1 to 3, the MEMS device may include a first electrode 110 longitudinally oriented along and parallel to axis 160. The first electrode 110 may have a first end 111 and a second end 112. The MEMS device may include a second electrode 120 longitudinally oriented along and parallel to axis 160. The second electrode 120 may have a first end 121 and a second end 122. The MEMS device may include a third electrode 130 longitudinally oriented along and parallel to axis 160. The third electrode 130 may have a first end 131 and a second end 132. Electrodes 110, 120, and 130 may be cylindrical, plate-shaped, cuboid, prismatic, polyhedral, or electrodes of other shapes. The length of the first electrode 110 may be longer than the length of the second electrode 120 and longer than the length of the third electrode 130. The MEMS device includes a dielectric 150 dispersed between the electrodes. The dielectric 150 has a plurality of holes 156 extending through the dielectric 150 in a direction parallel to axis 160 ( Figure 1 not shown in). The first electrode, the second electrode, and the third electrode may each be at least partially located within one of the plurality of holes 156. Being at least partially located within the hole may imply that a portion of the electrode is within the hole and / or the electrode is located within a portion of the hole. According to a possible implementation, at least the second electrode and the third electrode may be only partially located within the hole 156, with the ends being located outside the solid dielectric 150. The electrodes may be substantially fixed relative to each other. For example, the electrodes may be substantially fixed while allowing some relative movement due to bending and other forces. The dielectric 150 and the electrodes are free to move relative to each other.

[0021] A voltage from a first voltage source V l is applied between the first electrode 110 and the second electrode 120, thereby generating a relatively constant force F l . A voltage from a second voltage source V2 is applied between the first electrode 110 and the third electrode 130 to generate a relatively constant force F2. Forces F1 and F2 are opposite. If the structure is relatively symmetric and the magnitudes of the voltage sources V1 and V2 are equal, then forces F1 and F2 are equal, thus applying a net zero force between the dielectric and the electrodes. The magnitudes of the voltages from the voltage sources V1 and V2 may not be equal to compensate for the asymmetry of the structure or to intentionally generate a non-zero net force between the dielectric and the electrodes.

[0022] The MEMS device may be a MEMS transducer. For example, the MEMS device may be a sensor or an actuator. The MEMS device may be mechanically driven, such as being used as a differential sensor, a microphone, a vibration sensor, or other sensors. The MEMS device may also be electrically driven, such as generating mechanical motion as an actuator or a speaker.

[0023] The MEMS device includes at least one dielectric 150. Refer to Figure 2, according to a possible implementation, the dielectric 150 can be a solid dielectric that may include a plurality of holes 156. For convenience purposes, the holes 156 are illustrated as cylindrical, but any useful shape can be adopted. The dielectric 150 can surround the second end 122 of the second electrode 120 and the first end 131 of the third electrode 130. The first end 121 of the second electrode 120 and the second end 132 of the third electrode 130 can be located outside the solid dielectric 150. According to a possible implementation, the dielectric 150 can fill at least 50% of the distance between the first electrode and the second electrode 120. This distance can be perpendicular to the first length of the first electrode 110. For example, the dielectric 150 can fill at least 75% of the distance, at least 80% of the distance, or a distance between at least 80% and 90% of the distance. However, the dielectric 150 can fill any amount from 1% to 99% of the distance. The more the dielectric fills the gap between the electrodes, the greater the change in capacitance per unit displacement, and thus the greater the force generated for a given bias voltage between the electrodes. Some minimum gap should be retained between the dielectric and the electrodes, which is subject to manufacturing constraints so that the dielectric and the electrodes remain movable relative to each other. Although some implementations show a solid dielectric 150 with holes 156 (such as channels or passages), the solid dielectric 150 can also take other forms, such as one or more segments or components, as shown in other implementations.

[0024] The dielectric 150 can move relative to the first electrode, the second electrode, and the third electrode. For example, due to accidental buckling, bending, collision, and other minor movements of the dielectric 150, the dielectric 150 can move substantially and intentionally beyond minor movements. In addition, when the dielectric 150 can move relative to the first electrode, the second electrode, and the third electrode parallel to the axis 160, the first electrode, the second electrode, and the third electrode can also move relative to the dielectric 150. Therefore, by being able to move relative to each other, the electrodes and / or the dielectric 150 can or may not be fixed or movable relative to other elements of the MEMS device, relative to the earth, and / or relative to any other reference point.

[0025] There is a first capacitance between the first electrode 110 and the second electrode 120. There is a second capacitance between the first electrode 110 and the third electrode 130. The capacitance between the electrodes can be a function of the dielectric 150. For example, when the dielectric 150 moves relative to the electrodes in a direction parallel to the axis 160, the values of the first capacitance and the second capacitance can change in opposite directions. For example, when the dielectric 150 moves and causes the first capacitance to increase, the second capacitance can decrease. The electrostatic force on the dielectric 150 relative to the electrodes 110, 120, and 130 can be substantially invariant with respect to displacement.

[0026] The first electrode 110 may be at least partially disposed within a first one of the plurality of holes 156. The second end 122 of the second electrode 120 may be disposed within a second one of the plurality of holes 156. The first end 131 of the third electrode 130 may be disposed within a third one of the plurality of holes 156. The first hole, the second hole, and the third hole may be different holes.

[0027] The dielectric 150 may include a first surface 151 and a second surface 152. The first surface 151 and the second surface 152 may be parallel to a plane perpendicular to the axis 160. The first end 111 and the second end 112 of the first electrode 110 may be located outside the dielectric 150. The second end 112 of the first electrode 110 and the second end 132 of the third electrode 130 may extend beyond the second surface 152 of the dielectric 150. The first end 121 of the second electrode 120 may extend beyond the first surface 151 of the dielectric 150. The first end 111 of the first electrode 110 may also extend beyond the first surface 151 of the dielectric 150.

[0028] In an embodiment, the first electrode 110 may be one of a plurality of first conductive pins electrically connected to each other. The second electrode 120 may be one of a plurality of second conductive pins electrically connected to each other. The third electrode 130 may be one of a plurality of third conductive pins electrically connected to each other.

[0029] Reference Figure 3 , according to a possible embodiment, the first electrode may be a plurality of first electrodes 110-x, the second electrode may be a plurality of second electrodes 120-x, and the third electrode may be a plurality of third electrodes 130-x. The plurality of second electrodes 120-x and the plurality of third electrodes 130-x may be staggered on either side of the plurality of first electrodes 110-x. This may allow for more capacitance and an increase in the change of capacitance with displacement. Other configurations of conductive and dielectric elements, such as bars or rings, may also be used. The plurality of first electrodes 110-x may be collectively referred to as the first plurality of electrodes. Similarly, the plurality of second electrodes 120-x may be collectively referred to as the second plurality of electrodes, and the plurality of third electrodes 130-x may be collectively referred to as the third plurality of electrodes.

[0030] Referring to Figures 4 to 7 , the first hole 156, the second hole 156, and the third hole 156 may be the first plurality of holes 156, the second plurality of holes 156, and the third plurality of holes 156, respectively. The first plurality of conductive pins may be arranged in a two-dimensional array in a plane perpendicular to the axis 160. The second plurality of conductive pins and the third plurality of conductive pins may be arranged in corresponding two-dimensional arrays in a plane perpendicular to the axis 160 and interspersed among the first plurality of conductive pins. According to a possible embodiment, depending on the implementation, the dielectric 150 may be considered a non-conductive electric field modulating member.

[0031] Reference Figure 4 , the MEMS device may include a diaphragm 170 coupled to at least a first electrode 110-x. The diaphragm 170 may have a substantially flat surface 172 perpendicular to the axis 160. The surface 172 may be substantially flat because there may be defects on the surface 172, or the surface 172 may be slightly curved or uneven while still allowing the surface 172 to operate in a manner useful for the diaphragm. The diaphragm 170 may also have a sandwich structure.

[0032] According to a possible implementation, the diaphragm 170 may be a first diaphragm coupled to the first electrode 110-x and the third electrode 130-x. The MEMS device may include a second diaphragm 174 coupled to the first electrode 110-x and the second electrode 120-x. The second diaphragm 174 may be located on the opposite side of the dielectric 150 from the first diaphragm 170. The second diaphragm 174 may have a substantially flat surface 176 perpendicular to the axis 160. The first diaphragm 170 and the second diaphragm 174 are spaced apart from the dielectric 150 to allow relative movement between the electrodes connected to the first and second diaphragms and the dielectric 150. A low-pressure region may be established and sealed between the diaphragms 170 and 174 to reduce the noise and damping of the structure. The first electrode 110-x is connected to the first diaphragm 170 and the second diaphragm 174 and prevents the diaphragms from collapsing onto the dielectric 150. The low-pressure region may be substantially a vacuum such as a pressure less than 1 torr, less than 300 mTorr, or less than 100 mTorr.

[0033] The diaphragms 170 and 174 may be made of a dielectric material such as silicon nitride. The dielectric 150 may be silicon nitride. The electrodes 110-x, 120-x, and 130-x may be polysilicon. However, other materials may be used. For example, one or more of the diaphragm 170, the diaphragm 174, and the dielectric 150 may be polyimide. As another example, the conductor for the electrodes may be electroplated metal.

[0034] Reference Figure 4 , the dielectric 150 is fixed in place and its periphery is attached to the substrate 180 by means of spacer layers 182, 184, and 186. The peripheries of the diaphragms are also attached to the substrate 180 by means of spacer layers 182, 184, and 186. The dielectric 150 is relatively thick and rigid compared to the diaphragms 172 and 174 and remains relatively stationary when the diaphragms 172 and 174 deflect. The deflection of the diaphragms 172 and 174 causes the electrodes 110-x, 120-x, and 130-x to move relative to the dielectric 150.

[0035] Figure 5 Is shown Figure 4Perspective view of a MEMS device, which is partially constructed and only shows the second diaphragm 174, the first electrode 110-x, and the second electrode 120-x. Example interconnect 114 is shown electrically connecting the electrode 110-x (e.g., the pin of the first electrode), while example interconnect 124 is shown electrically connecting the electrode 120-x (e.g., the pin of the second electrode).

[0036] Figure 6 Continue Figure 4 Construction of a MEMS device, in which a dielectric 150 containing holes 156 is added, and the first electrode and the second electrode are disposed within the holes 156.

[0037] Figure 7 Continue Figure 4 Construction of a MEMS device, in which a third electrode 130-x and an example interconnect 134 electrically connecting the third electrode 130-x (e.g., the pin of the third electrode 130-x) are provided. The construction continues, in which a first diaphragm 170 is added, and the central regions of the spacer layers 182, 184, and 186 are removed by sacrificial etching to form Figure 4 a MEMS device.

[0038] Reference Figure 8 and Figure 9 , the MEMS device may include a fourth electrode 140. The fourth electrode 140 may have a first end 141 and a second end 142. The dielectric 150 may surround the first end 111 of the first electrode 110 and the second end 142 of the fourth electrode 140. The second end 112 of the first electrode 110 and the first end 141 of the fourth electrode may be located outside the dielectric 150. The fourth electrode 140 may or may not be electrically coupled to the first electrode 110. Reference Figure 9 , the fourth electrode 140 may be coaxial with the first electrode 110, such as by being located in the same hole.

[0039] Reference Figure 4 , the second electrode 120-x may be coaxial with the corresponding third electrode 130-x. Reference Figures 9 to 11 , the second electrode 120-x may be coaxial with the corresponding third electrode 130-x. For example, the second electrode and the third electrode may be located in the same hole. Reference Figure 10 and Figure 11 , an optional dielectric support layer D may be present between the second electrode 120 and the third electrode 130. The dielectric support layer D may or may not have the same cross-sectional area as the second electrode 120 and the third electrode 130. The dielectric support layer D may be used for structural purposes while considering any additional parasitic capacitance. For example, if the chamber between the diaphragms is under vacuum, the dielectric support layer D may be used to prevent collapse or contact between the second electrode 120 and the third electrode 130.

[0040] Reference Figure 10 As a MEMS device, such as a sensor used in a microphone, may include a first charge amplifier 194 coupled to a second electrode 120. The first charge amplifier 194 may bias the second electrode 120 relative to the first electrode 110 to a first electric potential. The MEMS device may include a second charge amplifier 196 coupled to a third electrode 130. The second charge amplifier 196 may bias the third electrode 130 relative to the first electrode 110 to a second electric potential. The first electric potential may be substantially equal to the second electric potential. The first electric potential may also be different from the second electric potential. When the dielectric 150 moves relative to the electrodes, the first charge amplifier 194 and the second charge amplifier 196 may produce complementary outputs. For example, Q = C * V. When using a charge amplifier, V remains constant. When C increases, Q may increase, and vice versa. This results in complementary outputs.

[0041] For example, according to a possible implementation, one electrode (such as electrode 110) may be full-length, while the other electrode may be segmented, such as segmented into electrodes 120 and 130. The first electrode 110 may be biased. Using charge amplifiers 194 and 196, the drive electrodes 120 and 130 may be biased to a fixed electric potential, i.e., ground, through a very high resistance value across the feedback capacitor. When the dielectric 150 moves along an axis substantially parallel to the lengths of the first electrode, the second electrode, and the third electrode, the charge amplifiers 194 and 196 may produce complementary outputs.

[0042] Reference Figure 11 As a MEMS device, such as a sensor used in a microphone, may include a high input impedance voltage amplifier 1000, which includes a first input terminal 1010 and a second input terminal 1020. The first input terminal 1010 may be coupled to the second electrode 120, and the second input terminal 1020 may be coupled to the third electrode 130. The input terminals 1010 and 1020 are biased to a fixed electric potential, i.e., ground, through a very high resistance value. As described above, Q = C * V. When using a high impedance amplifier, since there is no current, Q may remain constant. When C increases, V decreases, and vice versa. This results in complementary outputs.

[0043] Reference Figure 12, the MEMS device 100 or any other disclosed MEMS device can be part of a sensor package 1200. The sensor package 1200 can include a housing 1111, which can include a base 1110 and a lid 1105 (such as a can or any other lid) coupled to the base 1110. The first electrode 110-x, the second electrode 120-x, and the third electrode 130-x, as well as the solid dielectric 150, can be located within the housing 1111. For example, the housing 1111 can enclose the MEMS device between the lid 1105 and the base 1110. The sensor package 1200 can include an external device interface 1520 disposed on the base 1110. The external device interface 1520 can be implemented as a surface mount interface or can include leads configured for through-hole mounting on a host device.

[0044] The sensor package 1200 can include an integrated circuit 1530, such as an application specific integrated circuit (ASIC) electrically coupled to the first electrode 110, the second electrode 120, and the third electrode 130. The integrated circuit 1530 can also be coupled to the contacts of the external device interface 1520, such as via electrical leads 1534 and / or leads extending through the base 1110. The integrated circuit 1530 can receive electrical signals from the MEMS device 100 (such as via electrical lead 1532), and can communicate with a host device by using the contacts of the external device interface 1520, such as via electrical leads 1534 and / or leads in the base 1110. According to possible implementations, the integrated circuit 1530 can be covered with a protective coating 1526.

[0045] According to possible embodiments, the base 1110 can include a sound port 1150. The MEMS device 100 can be acoustically coupled to the sound port 1150. For example, the sound port 1150 can be a hole in the base 1110 that allows sound to reach the MEMS device 100 through the base. The illustrated embodiment can be considered a bottom port embodiment, but the sound port 1150 can be located at other positions on the transducer assembly. For example, the sound port 1150 can also be located on the lid 1105 for a top port transducer assembly. The sound port 1150 can also be located on one side of the sensor package 1200, the sound port 1150 can be located anywhere on the sensor package 1200, or there can be no sound port 1150, such as for a MEMS die vibration sensor or other sensors. According to possible embodiments, when the MEMS device 100 includes at least one diaphragm 170 and / or 174, the diaphragm 170 and / or 174 can be acoustically coupled to the sound port 1150. According to other embodiments, the MEMS device 100 can be not used in the sensor package, such as when the MEMS device 100 is an actuator, as described above.

[0046] Reference Figure 13, a MEMS device (such as MEMS device 400 or any other disclosed MEMS device) that serves as an actuator, such as for use in a speaker, is connected to amplifier 1310. The output terminal of amplifier 1310 is connected to the first electrode 110-x of the MEMS device. The second electrode 120-x and the third electrode 130-x are connected to power rails V1 and V2, respectively. The output of amplifier 1310 varies between the power rail values of V1 and V2 in response to the input signal. When the amplifier output is at the mid-rail (V1 + V2) / 2, the electrostatic forces applied to the electrodes and thus to diaphragms 170 and 172 are balanced. When the amplifier output approaches one of the power rails, the electrostatic force applied to the electrodes and thus to the diaphragms reaches a maximum in one direction. When the amplifier output approaches the opposite power rail, the electrostatic force applied to the electrodes and thus to the diaphragms reaches a maximum in the other direction. Since the electrostatic force is proportional to the square of the voltage, this embodiment produces a non-linear movement.

[0047] Amplifier 1310 can be a pulse width modulation (PWM) or pulse density modulation (PDM) amplifier, where its output is digital and swings between two power rails. The average value of the PWM amplifier output and the average value of the PDM amplifier output are functions of their inputs. The output of the digital amplifier is applied to the first electrode 110-x. The electrostatic force applied to the electrodes and thus to the diaphragms is proportional to the square of the average value. A square root function can be included in the digital amplifier so that the movement of the diaphragms can be linear with the input. The diaphragms can couple their movement directly to the air to produce sound, or they can couple their movement through auxiliary diaphragms to move the air and thus produce sound.

[0048] According to a possible embodiment, the MEMS device can include a solid dielectric, which can have a first outer surface and a second outer surface opposite the first outer surface. The dielectric can have a plurality of passages (such as holes), each of the plurality of passages can have an opening on the first outer surface and an opening on the second outer surface. The MEMS device can be a MEMS transducer. The MEMS device can include an electrode set. The dielectric and the electrode set can move relative to each other.

[0049] The electrode set can include a first electrode that is partially disposed within a first passage of the plurality of passages such that a first end of the first electrode extends beyond the first outer surface and a second end of the first electrode extends beyond the second outer surface. The first electrode can be one of a plurality of first electrodes that are electrically connected to each other.

[0050] The electrode set may include a second electrode that is partially disposed within a second one of the plurality of channels such that a first end of the second electrode extends beyond a first outer surface and a second end of the second electrode is within the second channel. The second electrode may be one of a plurality of second electrodes that are electrically connected to each other.

[0051] The electrode set may include a third electrode that is partially disposed within a third one of the plurality of channels such that a first end of the third electrode is within the third channel and a second end of the third electrode extends beyond a second outer surface. The third electrode may be one of a plurality of third electrodes that are electrically connected to each other. The first electrode, the second electrode, and the third electrode may be fixed relative to each other.

[0052] According to another possible implementation, the device may include an electrode set and a dielectric member. The electrode set may at least include a first electrode, a second electrode, and a third electrode. The electrodes in the electrode set may each have a separate height, with upper and lower surfaces at the ends of each height. There may be capacitance at least between the first electrode and the second electrode and between the first electrode and the third electrode in the electrode set.

[0053] The dielectric member may have a height, with upper and lower surfaces at the ends of the height. The dielectric member may have a hole through the member such that the dielectric member surrounds the electrode set and is spaced apart from each of the electrodes in the electrode set. The dielectric member may not be in mechanical contact with any of the electrodes in the electrode set.

[0054] The upper surface of the first electrode in the electrode set may be above the upper surface of the dielectric member, and the lower surface of the first electrode in the electrode set may be below the lower surface of the dielectric member. The upper surface of the second electrode in the electrode set may be above the upper surface of the dielectric member, and the lower surface of the second electrode may be between the upper and lower surfaces of the dielectric member. The upper surface of the third electrode in the electrode set may be between the upper and lower surfaces of the dielectric member, and the lower surface of the third electrode in the electrode set may be below the lower surface of the dielectric member.

[0055] The physical positions of the electrodes in the electrode set may be substantially fixed relative to each other. Physical position movement of the electrode set relative to the position of the dielectric member may be permitted.

[0056] The relative positions of each electrode with respect to the other electrodes may be substantially fixed. Some electrodes may be fixed while allowing other electrodes to move. For example, the first electrode and the dielectric member may be fixed together, and the second electrode and the third electrode may be allowed to move relative to the dielectric member. Other configurations are possible.

[0057] The first electrode with concentrated electrodes can be divided into two electrically independent components. The first component can have an upper surface and a second lower surface. The second component can have a second upper surface and a lower surface. The upper surface of the first component of the first electrode can be above the upper surface of the dielectric component. The second lower surface of the first component of the first electrode can be between the upper surface and the lower surface of the dielectric component. The second upper surface of the second component of the first electrode can be between the upper surface and the lower surface of the dielectric component, and the lower surface of the second component of the first electrode can be below the lower surface of the dielectric component.

[0058] According to a possible implementation, the MEMS device can include a solid dielectric having a plurality of holes. The MEMS device can include a first plurality of electrodes that extend completely through a first subset of the plurality of holes. The MEMS device can include a second plurality of electrodes that partially extend into a second subset of the plurality of holes. The second subset can be different from the first subset. The MEMS device can include a third plurality of electrodes that partially extend into a third subset of the plurality of holes. The third subset can be different from the first subset.

[0059] According to a possible implementation of the above embodiment, the solid dielectric can include a first side and a second side opposite the first side. The plurality of holes can extend from the first side to the second side. The second plurality of electrodes can partially extend from the first side into the second subset. The third plurality of electrodes can partially extend from the second side into the third subset. The second subset can be the same as or different from the third subset.

[0060] Although the present disclosure has been described using specific embodiments of the present disclosure, it is obvious that many alternatives, modifications, and variations will be apparent to those skilled in the art. For example, in other embodiments, various components of the embodiments can be interchanged, added, or replaced. In addition, all elements in the various figures are not necessary for the operation of the disclosed embodiments. For example, by simply adopting the elements of the independent claims, those of ordinary skill in the art in the field of the disclosed embodiments will be able to make and use the teachings of the present disclosure. Therefore, the embodiments of the present disclosure set forth herein are intended to be illustrative rather than restrictive. Various changes can be made without departing from the spirit and scope of the present disclosure.

[0061] In this document, relative terms such as "first", "second", etc. may be used solely to distinguish one entity or action from another entity or action, without necessarily requiring or implying any actual such relationship or order between such entities or actions. Subsequently, phrases such as "at least one", "at least one selected from the group of", or "at least one selected from" are defined to mean one, some, or all of the elements in the list, but not necessarily all. The terms "comprises", "comprising", "including", or any other variation thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. An element that begins with "a", "an", etc. does not, without further limitation, preclude the presence of additional identical elements in the process, method, article, or apparatus that includes that element. Additionally, the term "another" is defined as at least second or more. As used herein, the terms "include", "have", etc. are defined as "comprise". Further, the background section is not admitted as prior art and is written as the inventor's own understanding of the context of some embodiments at the time of filing the application and includes the inventor's recognition of any problems in the prior art and / or problems encountered in the inventor's own work.

Claims

1. A microelectromechanical system (MEMS) device, the MEMS device comprising: A solid dielectric, the solid dielectric including a plurality of pores, the solid dielectric having a first side and a second side; A first plurality of electrodes, the first plurality of electrodes extending completely through a first subset of the plurality of pores; A second plurality of electrodes, the second plurality of electrodes extending partially through a second subset of the plurality of pores; A third plurality of electrodes, the third plurality of electrodes extending partially into a third subset of the plurality of pores; A first diaphragm, the first diaphragm being coupled to the first plurality of electrodes and the third plurality of electrodes, the first diaphragm facing the first side of the solid dielectric; And A second diaphragm, the second diaphragm being coupled to the first plurality of electrodes and the second plurality of electrodes, the second diaphragm facing the second side of the solid dielectric.

2. The MEMS device according to claim 1, wherein A low-pressure region is established between the first diaphragm and the second diaphragm.

3. The MEMS device according to claim 1, the MEMS device further comprising: A first interconnect, the first interconnect electrically connecting the first plurality of electrodes; A second interconnect, the second interconnect electrically connecting the second plurality of electrodes; And A third interconnect, the third interconnect electrically connecting the third plurality of electrodes.

4. The MEMS device according to claim 1, wherein, The electrodes in the first plurality of electrodes, the second plurality of electrodes, and the third plurality of electrodes are pins.

5. The MEMS device according to claim 1, wherein Among them, A first capacitance exists between the first plurality of electrodes and the second plurality of electrodes, and Wherein, a second capacitance exists between the first plurality of electrodes and the third plurality of electrodes.

6. The MEMS device according to claim 1, wherein the MEMS device further comprises: A fourth plurality of electrodes, the fourth plurality of electrodes having a first end and a second end, Wherein, the solid dielectric surrounds the first end of the first plurality of electrodes and the second end of the fourth plurality of electrodes, and Wherein, the second end of the first plurality of electrodes and the first end of the fourth plurality of electrodes are located outside the solid dielectric.

7. The MEMS device according to claim 1, wherein Among them, The solid dielectric includes a first surface on the first side and a second surface on the second side, Wherein, the second ends of the first plurality of electrodes and the third plurality of electrodes extend beyond the second surface, and Wherein, the first ends of the second plurality of electrodes extend beyond the first surface.

8. The MEMS device according to claim 1, wherein, The solid dielectric is movable relative to the first plurality of electrodes, the second plurality of electrodes, and the third plurality of electrodes.

9. The MEMS device according to claim 1, wherein, The positions of the first plurality of electrodes are fixed relative to the positions of the second plurality of electrodes and the third plurality of electrodes, and the positions of the second plurality of electrodes are fixed relative to the positions of the third plurality of electrodes.

10. A sensor package, the sensor package comprising: A microelectromechanical system (MEMS) transducer, the MEMS transducer comprising: A solid dielectric, the solid dielectric including a plurality of pores, the solid dielectric having a first side and a second side; A first plurality of electrodes, the first plurality of electrodes extending completely through a first subset of the plurality of pores; A second plurality of electrodes, the second plurality of electrodes extending partially through a second subset of the plurality of holes; A third plurality of electrodes, the third plurality of electrodes extending partially into a third subset of the plurality of holes; A first diaphragm, the first diaphragm coupled to the first plurality of electrodes and the third plurality of electrodes, the first diaphragm facing the first side of the solid dielectric; and A second diaphragm, the second diaphragm coupled to the first plurality of electrodes and the second plurality of electrodes, the second diaphragm facing the second side of the solid dielectric; and A housing, the housing including a cover and a base, wherein the cover is attached to the base, the housing has a sound port, and wherein the MEMS transducer is disposed within the housing and acoustically coupled to the sound port.

11. The sensor package according to claim 10, wherein, The sound port is a hole in the base.

12. The sensor package according to claim 10, wherein, The sound port is on the cover.

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