Temperature calibration system and method

Abstract

The invention relates to a temperature calibration system and method.The temperature calibration system comprises an isothermal block and a temperature control block, a hole groove is formed in the temperature control block, the isothermal block is embedded in the hole groove, and a heat preservation layer is arranged on the outer side of the temperature control block; a temperature control piece is arranged in the heat preservation layer; two sections of temperature control in the axial direction are symmetrically arranged at the same time, the temperature uniformity in the axial direction and the radial direction is guaranteed at the same time, large-range temperature control is achieved through application of the TEC (semiconductor cooler), and heating or cooling of the TEC is controlled by changing the current direction of the TEC.

Description

Technical Field

[0001] The present invention belongs to the technical field of precision temperature control and calibration, and specifically relates to a temperature calibration system and method. Background Art

[0002] High-quality temperature primary standards are the key factors for achieving high-precision metrology in calibration work. For the calibration methods of contact temperature measuring instruments, there are mainly two types: constant temperature baths and dry-well metrology furnaces. Constant temperature baths usually use liquid media for temperature control, which have high temperature stability and uniformity, but their operation is complex and the maintenance cost is high. In contrast, dry-well metrology furnaces do not require expensive liquid media and are easy to carry, making them suitable for on-site calibration. However, dry-well metrology furnaces have some deficiencies in terms of temperature uniformity and stability.

[0003] Firstly, since dry-well metrology furnaces rely on resistance heating elements for temperature control, their temperature distribution uniformity is inferior to that of constant temperature baths, especially with large fluctuations in axial temperature uniformity. Secondly, existing dry-well metrology furnaces mostly adopt a single heating method and lack a flexible temperature control mechanism, resulting in difficulty in maintaining temperature stability during high-temperature and low-temperature calibration processes. In addition, due to the need for frequent switching of current and adjustment of heating power during the temperature control process of dry-well metrology furnaces, they have large thermal inertia and slow response speed, making it difficult to achieve rapid and precise temperature regulation.

[0004] These factors all restrict the calibration accuracy and application scope of dry-well metrology furnaces, and there is an urgent need for an improved method that can provide higher temperature uniformity and stability. Summary of the Invention

[0005] The purpose of this part is to outline some aspects of the embodiments of the present invention and briefly introduce some preferred embodiments. Some simplifications or omissions may be made in this part, as well as in the abstract and title of the present application, to avoid obscuring the purpose of this part, the abstract, and the title. However, such simplifications or omissions shall not be used to limit the scope of the present invention.

[0006] In view of the following technical problems in the prior art: during high-temperature and low-temperature calibration processes, the temperature control accuracy and temperature uniformity are poor; it is difficult to maintain temperature stability during temperature high-low conversion.

[0007] To solve the above technical problems, the present invention provides the following technical solution: a temperature calibration system, comprising an isothermal block and a temperature control block. A hole groove is provided on the temperature control block, and the isothermal block is embedded in the hole groove. A heat insulation layer is provided on the outer side of the temperature control block;

[0008] A temperature control component is provided in the heat insulation layer.

[0009] As a preferred technical solution of a temperature calibration system, the temperature control member includes a semiconductor refrigeration device, and a first heat exchange filler is arranged on one side of the semiconductor refrigeration device and contacts the temperature control block.

[0010] As a preferred technical solution of a temperature calibration system, a radiator is arranged in the heat insulation layer, and a second heat exchange filler is arranged on the other side of the semiconductor refrigeration device and contacts the radiator.

[0011] As a preferred technical solution of a temperature calibration system, the isothermal block is a cylinder, the outer surface of the temperature control block is a cuboid, the hole groove is a cylinder, and the temperature control members are symmetrically arranged on the opposite surfaces of the temperature control block.

[0012] As a preferred technical solution of a temperature calibration system, a plurality of temperature control members are arranged along the axial direction of the isothermal block.

[0013] As a preferred technical solution of a temperature calibration system, the heat transfer coefficient of the first heat exchange filler is between 500 and 1500 w / (m 2 .k), and the heat transfer coefficient of the second heat exchange filler is greater than 5000 w / (m 2 .k).

[0014] As a preferred technical solution of a temperature calibration system, the temperature control member further includes a resistance heating element, and the resistance heating element contacts the other two opposite surfaces of the temperature control block through a high-temperature heat-conducting adhesive.

[0015] As a preferred technical solution of a temperature calibration system, a plurality of placement holes are arranged at the end of the isothermal block.

[0016] The present invention also discloses a method based on the foregoing temperature calibration system, which is characterized in that: it includes arranging a plurality of temperature sensors in the isothermal block and the temperature control block, the temperature sensors transmit the collected data to the control module, and the control module controls the operating state of the semiconductor refrigeration device;

[0017] When the calibration temperature is higher than the ambient temperature, the resistance heating element is the main heater, and the semiconductor refrigeration device is in the heating state for auxiliary heating by current switching, so that the isothermal block is at a stable calibration temperature value;

[0018] When the calibration temperature is lower than the ambient temperature, the semiconductor refrigeration device is in the refrigeration state by current switching, the isothermal block transfers heat to the temperature control block, and then the temperature control block transfers the heat to the semiconductor refrigeration device through the first heat exchange filler, so that the isothermal block is at a stable calibration temperature value. When the semiconductor refrigeration device is in the refrigeration state, the heat generated on the reverse side of the semiconductor refrigeration device is transferred to the environment by the radiator.

[0019] As a preferred technical solution of a temperature calibration method, the implementation process of the temperature control by the control module can be represented by the following mathematical expression formula:

[0020] ΔT = T max - T min

[0021]

[0022] where ΔT is the temperature difference, T max and T m i n are respectively the highest and lowest temperatures at different positions of the isothermal block. Among them, σ T is the standard deviation of temperature stability, N is the number of temperature sensors, Ti is the reading of the i-th temperature sensor, and T ca l is the calibration temperature.

[0023] Advantages of the present invention:

[0024] 1. The present invention performs temperature control in two sections axially, with symmetric arrangement, ensuring temperature uniformity in both axial and radial directions. The application of TEC (thermoelectric cooler) enables temperature control over a wide range, and the heating or cooling of TEC is controlled by changing the current direction of TEC;

[0025] 2. The present invention has significant advantages over the prior art in terms of temperature uniformity, stability, and control accuracy. Especially during the process of temperature conversion between high and low, it can maintain temperature stability and uniformity, and is suitable for high-precision temperature calibration and calibration work. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the description of the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts. Among them:

[0027] Figure 1 is a schematic diagram of the placement structure of TEC in the temperature calibration system of the present invention;

[0028] Figure 2 is a schematic diagram of the structure of the resistance heating element in the temperature calibration system of the present invention;

[0029] Figure 3 is a schematic diagram of the structure of the placement hole in the present invention.

[0030] Reference numerals: isothermal block 100, temperature control block 200, empty slot 201, thermal insulation layer 300, temperature control component 400, semiconductor refrigerator 401, first heat exchange filler 402, second heat exchange filler 403, placement hole 101, resistance heating element 500, heat sink 301. Detailed implementation manners

[0031] To make the above objects, features, and advantages of the present invention more obvious and understandable, the following will give a detailed description of the specific implementation manners of the present invention with reference to the accompanying drawings of the specification.

[0032] In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention can also be implemented in other ways different from those described herein. Those skilled in the art can make similar generalizations without departing from the connotation of the present invention. Therefore, the present invention is not limited by the specific embodiments disclosed below.

[0033] Secondly, the so-called "one embodiment" or "embodiment" herein refers to a specific feature, structure, or characteristic that can be included in at least one implementation manner of the present invention. The phrase "in one embodiment" appearing in different places in this specification does not necessarily refer to the same embodiment, nor is it an individual or alternative embodiment that is mutually exclusive with other embodiments.

[0034] Thirdly, the present invention is described in detail with reference to schematic diagrams. When detailing the embodiments of the present invention, for ease of explanation, the cross-sectional views showing the device structure will be enlarged locally out of the general proportion, and the schematic diagrams are only examples and should not limit the scope of protection of the present invention herein. In addition, in actual production, three-dimensional spatial dimensions including length, width, and depth should be included.

[0035] Embodiment 1

[0036] Referring to Figure 1 , this embodiment provides a temperature calibration system, including

[0037] an isothermal block 100 and a temperature control block 200. A hole slot 201 is provided on the temperature control block 200, the isothermal block 100 is embedded in the hole slot 201, and a thermal insulation layer 300 is provided outside the temperature control block 200;

[0038] A temperature control component 400 is provided in the thermal insulation layer 300.

[0039] Part 1 is a long cylindrical copper block, on which a plurality of holes of different sizes for placing temperature sensors to be calibrated can be arranged, that is, placement holes 101. The placement holes 101 can be provided with multiple sizes to adapt to temperature sensors of different sizes.

[0040] The temperature control block 200 is a rectangular copper block with a circular hole slot 201 in the middle for placing the isothermal block 100.

[0041] The temperature control component 400 includes a semiconductor refrigeration device 401. One side of the semiconductor refrigeration device 401 is provided with a first heat exchange filler 402 in contact with the temperature control block 200.

[0042] The semiconductor refrigeration device 401 transfers heat to the temperature control block 200 through the first heat exchange filler 402.

[0043] A radiator 301 is arranged in the heat insulation layer 300. The other side of the semiconductor refrigeration device 401 is provided with a second heat exchange filler 403 in contact with the radiator 301.

[0044] When the semiconductor refrigeration device 401 refrigerates, the generated heat is exported through the radiator 301.

[0045] The heat insulation layer 300 covers the whole product except the radiator 301, isolates the part 2 from the external environment, and reduces heat exchange.

[0046] The isothermal block 100 is a cylinder, the temperature control block 200 is a cuboid, and the temperature control component 400 is arranged on the opposite surface of the temperature control block 200.

[0047] The heat transfer coefficient of the first heat exchange filler 402 is between 500 and 1500 w / (m 2 .k), which is a low heat transfer coefficient filler. The heat transfer coefficient of the second heat exchange filler 403 is greater than 5000 w / (m 2 .k), which is a high heat transfer coefficient filler.

[0048] Resistance heating elements 500 are arranged on the other two opposite surfaces of the temperature control block 200.

[0049] In this embodiment, four resistance heating elements 500 are also arranged.

[0050] A number of placement holes 101 are arranged at the end of the isothermal block 100.

[0051] A number of temperature control components 400 are arranged along the axial direction of the isothermal block 100.

[0052] The temperature control component 400 and the radiator 301 form a temperature control part. In this embodiment, 4 groups are arranged, symmetrically arranged on two planes of the temperature control block 200. Two groups are arranged along the axial direction on each plane. The temperature uniformity of the product in the axial direction can be adjusted by adjusting the distance between the upper and lower two groups.

[0053] This product adopts 4 groups of temperature control parts, realizes the constant temperature control of the isothermal block 100 through multi-stage temperature control, and ensures the temperature uniformity of the isothermal block 100 in the axial and radial directions.

[0054] This product uses a semiconductor cooler 401 and a resistance heating element 500 to control the temperature. By controlling the magnitude and direction of the current, the refrigeration or heating power of the semiconductor cooler 401 is controlled, and by controlling the magnitude of the current, the heating power of the resistance heating element 500 is controlled, enabling this product to have both high-temperature and low-temperature temperature calibration capabilities.

[0055] It adopts a structural form in which an isothermal block 100 and a temperature control block 200 are embedded and combined. Through the gap between the isothermal block 100 and the temperature control block 200, a thermal resistance is generated, which can better ensure the temperature uniformity of the isothermal block 100.

[0056] Specifically, when the calibrated temperature is higher than the ambient temperature, the resistance heating element 500 is responsible for the main heating, and the semiconductor cooler 401 assists in heating or does not work.

[0057] If the semiconductor cooler 401 does not work when the resistance heating element 500 is heating, the cold end uses a low heat transfer coefficient, and the hot end uses a high heat transfer coefficient. The reason for using different heat transfer coefficients at both ends is that the heat generation at the hot end of the TEC is greater than the refrigeration capacity at the cold end. The heat generation at the hot end = the refrigeration capacity at the cold end + the power supply. In addition, using a low heat transfer coefficient at the cold end is beneficial to reducing the heat dissipation of the resistance heating element when heating and the TEC is not working.

[0058] When refrigeration is required, the resistance heating element does not work, and the TEC is responsible for refrigeration.

[0059] Embodiment 2

[0060] With the continuous progress of technology, temperature calibration methods are also constantly developing and improving. Traditional temperature calibration methods usually rely on high-precision thermometers and constant temperature equipment, and are calibrated by placing the temperature sensor to be measured in an environment with a known temperature; however, this method has many limitations, such as the large volume of the calibration equipment, the complex calibration process, and the large impact of ambient temperature fluctuations on the calibration results.

[0061] In recent years, with the development of semiconductor refrigeration technology (TEC), temperature control and calibration methods based on TEC have gradually attracted attention. TEC has the advantages of fast response, high temperature control accuracy, small volume, etc., making it perform excellently in the field of precision temperature control; in addition, the combination of multi-point temperature sensors and intelligent control systems enables the temperature calibration process to be monitored and adjusted in real time, further improving the calibration accuracy and efficiency.

[0062] Although significant progress has been made in existing temperature calibration technologies, there are still some deficiencies. First, in traditional calibration methods, the temperature control accuracy and uniformity are poor under high and low temperature conditions, especially when the ambient temperature changes greatly, it is difficult to ensure the accuracy of the calibration results. Second, most existing temperature calibration systems rely on a single heating or cooling method and cannot maintain temperature stability during the high and low temperature conversion process. In addition, the data processing and control strategies of multi-point temperature sensors have not been fully optimized, resulting in the response speed and accuracy of temperature adjustment during the calibration process still needing to be improved.

[0063] To address the above problems, this embodiment provides a method for the aforementioned temperature calibration system, including: arranging multiple temperature sensors in the isothermal block and the temperature control block, and the temperature sensors transmit the collected data to the control module, and the control module controls the operating state of the thermoelectric cooler 401; wherein:

[0064] When the calibration temperature is higher than the ambient temperature, the thermoelectric cooler 401 is in the heating state by current switching. The thermoelectric cooler 401 transfers heat to the temperature control block 200 through the first heat exchange filler 402, and then the temperature control block 200 transfers the heat to the isothermal block 100, so that the isothermal block 100 is at a stable calibration temperature value.

[0065] When the calibration temperature is lower than the ambient temperature, the TEC is in the cooling state and transfers heat to the environment through the radiator; when the calibration temperature is higher than the ambient temperature, the resistance heating element is responsible for the main heating, and the TEC is in the auxiliary heating state to avoid heat transfer from the resistance heating element to the environment through the temperature control block, TEC, and radiator.

[0066] When the calibration temperature is lower than the ambient temperature, the thermoelectric cooler 401 is in the cooling state by current switching. The isothermal block 100 transfers heat to the temperature control block 200, and then the temperature control block 200 transfers the heat to the thermoelectric cooler 401 through the first heat exchange filler 402, so that the isothermal block 100 is at a stable calibration temperature value. When the thermoelectric cooler 401 is in the cooling state, the heat generated on the reverse side of the thermoelectric cooler 401 is transferred to the environment by the radiator 301. In this condition, the resistance heating element 500 does not work all the time.

[0067] As an example, the required calibration temperature T cal is set by the control module and compared with the ambient temperature at the actual measurement point. Assume the required calibration temperature is T cal = 150 °C.

[0068] In an alternative embodiment, when Tcal > Tenv (ambient temperature), the resistance heating element 500 starts the main heating.

[0069] The control module heats the thermoelectric cooler 401 by adjusting the current.

[0070] As an example, the heating power calculation formula is:

[0071] P = I 2 R

[0072] Where P is the heating power, I is the current, and R is the resistance value of the resistive heating element.

[0073] The thermoelectric cooler 401 transfers heat to the temperature control block 200 through the first heat exchange filler 402, thereby heating the isothermal block 100.

[0074] In an alternative embodiment, when Tcal < Tenv, the control module switches the current direction to make the thermoelectric cooler 401 in a cooling state.

[0075] As an example, the refrigeration power calculation formula:

[0076]

[0077] Where Q is the refrigeration power, α is the Seebeck coefficient, Tc is the cold-end temperature, and R is the resistance of the thermoelectric cooler.

[0078] Heat is transferred to the temperature control block 200 through the first heat exchange filler 402, then to the thermoelectric cooler 401, and finally dissipated to the environment through the radiator 301.

[0079] Furthermore, the temperature uniformity of the isothermal block 100 is monitored by a multi-point temperature sensor, and the control module adjusts the working states of the resistive heating element 500 and the thermoelectric cooler 400 according to the real-time temperature data.

[0080] As an example, the temperature uniformity adjustment formula:

[0081] ΔT = T max -T min

[0082] Where ΔT is the temperature difference, T max and T min are the highest and lowest temperatures at different positions of the isothermal block, respectively.

[0083] When it is detected that the temperature of the isothermal block 100 is stable at the calibrated temperature T cal the control module maintains the current working state.

[0084] As an example, the temperature stability calculation formula:

[0085]

[0086] Where σT is the standard deviation of temperature stability, N is the number of temperature sensors, Ti is the reading of the i-th temperature sensor, and T ca l is the calibration temperature.

[0087] Through the above steps, the method of the present invention ensures temperature uniformity in both the axial and radial directions, and realizes large-range temperature control through the application of TEC, solving the problem of low precision in temperature uniformity control in the prior art.

[0088] In order to better verify and illustrate the technical effects adopted in this method, in this embodiment, the traditional method and this method are selected for comparative testing, and the test results are compared by means of scientific demonstration to verify the real effects of this method.

[0089] Traditional technical solution: In the traditional temperature calibration system, the temperature control device used has great deficiencies in terms of temperature control uniformity and accuracy, mainly manifested as problems of non-uniform axial and radial temperatures, slow response speed, and poor temperature stability. These defects make it difficult to obtain an ideal temperature calibration effect in actual applications.

[0090] To verify that this method has higher temperature control accuracy and uniformity compared to the traditional method, in this embodiment, the traditional resistance heating control method and the method of the present invention are respectively used to conduct comparative tests on the temperature uniformity and stability of the temperature calibration system.

[0091] Test environment:

[0092] Place the temperature calibration system in a laboratory environment. The laboratory environment temperature is set at 25°C. Multiple temperature sensors are arranged in the isothermal block and the temperature control block to monitor the temperature in real time. The traditional method uses a single resistance heating element for temperature control, while the method of the present invention combines a resistance heating element and a semiconductor cooler for temperature control.

[0093] Implementation process:

[0094] Initialize the system, including the installation and calibration of the isothermal block, temperature control block, thermal insulation layer, temperature control component, resistance heating element, control system, and radiator, ensuring that all components are correctly connected and working properly.

[0095] Arrange temperature sensors in the isothermal block and the temperature control block to ensure that the temperature at each position can be monitored in real time. These temperature sensors are connected to the data acquisition system through the control module.

[0096] Set the calibration temperature to 150°C and input this temperature into the control module. The control module compares the calibration temperature with the actual ambient temperature and activates the resistance heating element or the semiconductor cooler as needed.

[0097] When the calibration temperature is higher than the ambient temperature, the resistance heating element starts the main heating. The control module adjusts the current to make the semiconductor cooler in the heating state. The semiconductor cooler transfers heat to the temperature control block through the first heat exchange filler, and then the temperature control block transfers the heat to the isothermal block, so that the isothermal block is at a stable calibration temperature value.

[0098] When the calibration temperature is lower than the ambient temperature, the control module switches the current direction to make the semiconductor cooler in the cooling state. Heat is transferred to the temperature control block through the first heat exchange filler, then to the semiconductor cooler, and finally dissipated to the environment through the radiator. In this working condition, the resistance heating element never works.

[0099] The temperature uniformity of the isothermal block is monitored by a multi-point temperature sensor. The control module adjusts the working states of the resistance heating element and the semiconductor cooler according to the real-time temperature data to ensure temperature uniformity and stability.

[0100] As an example, Table 1 is the data table of uniformity test for the case of using four groups of semiconductor coolers 401 in the present invention. It can be seen that the present invention has an excellent control effect on temperature uniformity. Among them:

[0101] Table 1. Data table of uniformity test for the case of four groups of semiconductor coolers

[0102]

[0103] Table 2 is the comparison table of test data of the present invention and the benchmark product in terms of main performance. It can be seen from it that the present invention has higher test accuracy compared with the existing benchmark product. Among them:

[0104] Table 2. Comparison table of test data of the present invention and the benchmark product in terms of main performance

[0105]

[0106]

[0107] Referring to Table 1 and Table 2, it can be intuitively seen that the method of the present invention has significant advantages in terms of temperature control uniformity and stability.

[0108] Specifically, in the traditional method, the temperature control uniformity is usually limited by a single resistance heating element, resulting in a large difference in temperature between different positions. However, the method of the present invention combines a resistance heating element and a semiconductor cooler to achieve precise temperature control and uniform distribution.

[0109] Preferably, the method provided by the embodiments of the present invention can quickly respond to temperature changes through real-time adjustment of the control module, and can achieve rapid heating or cooling by adjusting the current direction, ensuring that the temperature is stable near the set value. The temperature calibration method is superior to the traditional method in terms of temperature uniformity, stability and response speed.

[0110] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and not to limit them. Although the present invention has been described in detail with reference to the preferred embodiments, those of ordinary skill in the art should understand that the technical solutions of the present invention can be modified or equivalently replaced without departing from the spirit and scope of the technical solutions of the present invention, and they should all be covered by the scope of the claims of the present invention.

Claims

1. A temperature calibration system, characterized in that: include, An isothermal block (100) and a temperature control block (200), wherein the temperature control block (200) is provided with a hole groove (201), the isothermal block (100) is embedded in the hole groove (201), and a heat preservation layer (300) is provided on the outer side of the temperature control block (200); A temperature control component (400) is provided in the thermal insulation layer (300).

2. The temperature calibration system according to claim 1, characterized in that: The temperature control component (400) comprises a semiconductor refrigerator (401), and a first heat exchange filler (402) is provided on one side of the semiconductor refrigerator (401) and is in contact with the temperature control block (200).

3. The temperature calibration system according to claim 2, characterized in that: A radiator (301) is arranged in the thermal insulation layer (300), and a second heat exchange filler (403) is arranged on the other side of the semiconductor refrigerator (401) and is in contact with the radiator (301).

4. The temperature calibration system according to claim 3, characterized in that: The isothermal block (100) is a cylinder, the outer surface of the temperature control block (200) is a rectangular parallelepiped, the hole groove (201) is a cylinder, and the temperature control element (400) is symmetrically arranged on the opposite surface of the temperature control block (200).

5. The temperature calibration system according to claim 4, characterized in that: A plurality of the temperature control components (400) are arranged along the axial direction of the isothermal block (100).

6. The temperature calibration system according to claim 5, characterized in that: The heat transfer coefficient of the first heat exchange filler (402) is 500 to 1500 w / (m 2 .k), the heat transfer coefficient of the second heat exchange filler (403) is greater than 5000w / (m 2 .k).

7. The temperature calibration system according to any one of claims 1 to 6, characterized in that: The temperature control component (400) further comprises a resistance heating element (500), and the resistance heating element (500) is in contact with the other two opposite surfaces of the temperature control block (200) via high temperature resistant heat conductive adhesive.

8. The temperature calibration system according to claim 7, characterized in that: A plurality of placement holes (101) are provided at the end of the isothermal block (100).

9. A method based on the temperature calibration system according to any one of claims 1 to 8, characterized in that: include: A plurality of temperature sensors are arranged in the isothermal block (100) and the temperature control block (200), wherein the temperature sensors transmit collected data to a control module, and the control module controls the operating state of the semiconductor refrigerator (401); When the calibration temperature is higher than the ambient temperature, the resistance heating element (500) is used for main heating, and the semiconductor refrigerator (401) is placed in a heating state for auxiliary heating by current switching, so that the isothermal block (100) is at a stable calibration temperature value; When the calibration temperature is lower than the ambient temperature, the semiconductor refrigerator (401) is in a cooling state through current switching, the isothermal block (100) transfers heat to the temperature control block (200), and the temperature control block (200) transfers the heat to the semiconductor refrigerator (401) through the first heat exchange filler (402), so that the isothermal block (100) is at a stable calibration temperature value. When the semiconductor refrigerator (401) is in a cooling state, the heat generated on the back side of the semiconductor refrigerator (401) is transferred to the environment by the heat sink (301).

10. The temperature calibration method according to claim 9, characterized in that: The implementation process of the temperature control by the control module can be expressed by the following mathematical expression formula: ΔT=T max -T min Where ΔT is the temperature difference, T max and T m i n are the highest and lowest temperatures at different positions of the isothermal block, respectively, where σ T is the standard deviation of temperature stability, N is the number of temperature sensors, Ti is the reading of the i-th temperature sensor, T ca l is the calibration temperature.

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