Processing and detection equipment

Abstract

The invention provides processing and detecting equipment which comprises a carrying table, a processing unit, a processing scanner and at least one detecting scanner. The carrying table is used for placing a processing sample, the surface of the processing sample is provided with a plurality of processing positions, the processing unit is arranged relative to the carrying table and is used for processing the processing sample, the processing scanner is used for scanning the processing sample, and the processing scanner is used for controlling the processing unit to sequentially process the plurality of processing positions at a scanning frequency. The detection scanner comprises an information acquisition unit and a scanning output unit, the information acquisition unit synchronously receives the detection information of each processing position through the processing scanner, and the scanning output unit is in signal connection with the information acquisition unit and outputs the detection information at a scanning frequency.

Description

Technical Field

[0001] The present invention relates to a processing and detection device. Background Art

[0002] Currently, with pulsed lasers combined with galvo scanners, rapid mass transfer of micro light emitting diodes (micro-LEDs) can be achieved, with an efficiency of tens of thousands per second.

[0003] Under the requirements of brightness and resolution for micro-LED detection, the exposure frame rate of charge-coupled devices (CCDs) can only be limited to less than dozens per second, far lower than the transfer process speed. Therefore, the mainstream approach in the production line is to perform the transfer process and detection in a separate station manner.

[0004] The general detection method is to quickly move the wafer on a three-dimensional platform so that the charge-coupled device can capture different positions frame by frame. However, it is difficult to control the rapid stop at the micron level, and there are also problems with alignment accuracy, resulting in slower efficiency.

[0005] In recent years, a method to improve efficiency has been proposed, which is to use a galvanometer combined with a prism to generate multiple detection spots. The field of view (FOV) of each spot covers multiple chips, and then the chips are imaged to different positions of the charge-coupled device. That is, the galvanometer is used to scan different positions of the wafer with the detection spots to replace the movement of the three-dimensional platform.

[0006] However, the above method uses a galvanometer to overcome the problem of platform movement. However, since the detection spots capture multiple chips in one shot, which is different from the laser process spot, it is still a separate station method and cannot be synchronized with the transfer process. Summary of the Invention

[0007] The present invention is directed to a processing and detection device that can perform detection synchronously when processing a processing sample, so as to replace the existing separate station process and improve production efficiency.

[0008] The present invention provides a processing and detection device, including a stage, a processing unit, a processing scanner, and at least one detection scanner. The stage is for placing a processing sample, and the surface of the processing sample has a plurality of processing positions. The processing unit is disposed relative to the stage to process the processing sample, and the processing scanner is used to scan the processing sample. The processing scanner controls the processing unit to process the plurality of processing positions in sequence at a scanning frequency. At least one detection scanner includes an information acquisition unit and a scanning output unit. The information acquisition unit synchronously receives the detection information of each processing position via the processing scanner, and the scanning output unit is signal-connected to the information acquisition unit and outputs each detection information at the scanning frequency.

[0009] Based on the above, in the processing and detection equipment according to the embodiments of the present invention, the surface of the processed sample has a plurality of processing positions. The processing scanner controls the processing unit to process the plurality of processing positions in sequence at a scanning frequency. The information acquisition unit synchronously receives the detection information of each of the plurality of processing positions via the processing scanner. The scanning output unit is connected to the information acquisition unit and outputs each detection information at the scanning frequency. Therefore, during the processing of the processed sample, detection can be carried out synchronously. For example, in the process of mass transfer, mass detection can be carried out synchronously, replacing the existing sub-station process and improving production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 is a schematic optical path diagram of a processing and detection device according to an embodiment of the present invention;

[0011] Figure 2A is Figure 1 a front view schematic diagram of the pixel array and the imaging area of the receiving unit of the processing and detection device;

[0012] Figure 2B is according to Figure 2A a partial enlarged schematic diagram of the imaging area and the image formed thereon;

[0013] Figure 3 is a schematic optical path diagram of a processing and detection device according to another embodiment of the present invention;

[0014] Figure 4 is a schematic optical path diagram of a processing and detection device according to still another embodiment of the present invention. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0015] Reference will now be made in detail to the exemplary embodiments of the present invention. The examples of the exemplary embodiments are illustrated in the accompanying drawings. Whenever possible, the same reference numerals are used in the drawings and the description to refer to the same or like parts.

[0016] Figure 1 is a schematic optical path diagram of a processing and detection device according to an embodiment of the present invention. Please refer to Figure 1, the processing and detection device 100a of this embodiment includes a stage 110, a processing unit 130, a processing scanner 140, and a detection scanner 150a. The stage 110 is for placing a processing sample 120, and the surface S1 of the processing sample 120 has a plurality of processing positions. The processing unit 130 is disposed relative to the stage 110 to process the processing sample 120. The processing scanner 140 is used to scan the processing sample 120 and controls the processing unit 120 to process the plurality of processing positions in sequence at a scanning frequency. In this embodiment, the processing unit 130 can be a laser source, such as a pulsed laser source. The processing unit 130 provides a processing laser L1, and the position where the processing laser L1 is projected onto the processing sample 120 is controlled by the processing scanner 140.

[0017] The detection scanner 150a includes an information acquisition unit 151 and a scanning output unit 156. The information acquisition unit 151 synchronously (synchronization can mean simultaneously, or it can mean not simultaneously, but both after a specific instant in the processing time) receives the detection information L3 of each processing position via the processing scanner 140. The scanning output unit 156 is signal-connected to the information acquisition unit 151 and outputs each detection information L3 at a scanning frequency. In this embodiment, the detection information L3 is a laser source reflected from the surface S1 of the processing sample 120.

[0018] In this embodiment, the detection scanner 150a may further include a beam splitter 152 and a mirror 154, and the scanning output unit 156 can be a scanning galvanometer. The beam splitter 152, the mirror 154, and the galvanometer 156 are respectively located on the optical path from the processing scanner 140, that is, on the transmission path of the detection information L3.

[0019] The laser spot of the processing unit 130 processes the processing sample 120 (when the processing sample 120 is a wafer, for example, processes each chip in the wafer), and the reflected detection information L3 is scanned by the processing scanner 140.

[0020] In this embodiment, the detection scanner 150a further includes a light source module 155 for providing a detection light L2. In this embodiment, the detection light L2 can be a detection light L2 of a single wavelength. In another embodiment, the detection light L2 is, for example, a detection light L2 formed by mixing multiple different wavelengths of light. In addition, the light source module 155 can be a continuous light source or a pulsed light source. In this embodiment, the beam splitter 152 can reflect the detection light L2 to the processing scanner 140 and allow the detection information L3 to pass through and be transmitted to the mirror 154. In another embodiment, a polarizing beamsplitter (PBS) plus a quarter-wave plate can also be used to replace the beam splitter 152. The mirror 154 then reflects the detection information L3 to the information acquisition unit 151. The information acquisition unit 151 includes, for example, a lens that can project the detection information L3 onto the scan output unit 156, or includes an incident light surface that allows the detection information L3 to pass through and be transmitted to the scan output unit 156, where the incident light surface is, for example, the incident light surface of the information acquisition unit 151, which can allow the detection information L3 to penetrate.

[0021] The light source module 155 connects (e.g., couples on the optical path) the processing scanner 140 and the information acquisition unit 151. The light source module 155 has an optical path, and the optical path is controlled by the processing scanner 140 to be coaxial with the vector of each processing position on the processed sample 120, where each detection information is an optical signal reflected from the surface S1 of the processed sample 120.

[0022] A dichroic mirror 131 is disposed on the optical paths of the detection light L2 and the processing laser L1, and can be used to reflect the processing laser L1 while allowing the detection light L2 to pass through and be transmitted to the processed sample 120, and allowing the returned detection information L3 to pass through and be transmitted to the information acquisition unit 151. The movement of the processing laser L1 incident on the surface S1 of the processed sample 120 and the detection information L3 reflected from the processed sample 120 at the position and during each processing point is controlled by the processing scanner 140. Therefore, the processing laser L1 and the detection information L3 are always coaxial. In one embodiment, the detection light L2 can also be made coaxial with the processing laser L1 through the processing scanner 140.

[0023] In this embodiment, the processing and detection device 100a further includes a receiving unit 161 that connects (e.g., couples on the optical path) to the scan output unit 156 of the detection scanner 150a to receive the detection information L3. The signal source positions received by the detection scanner 150a are all determined by the processing scanner 140.

[0024] Figure 2A is Figure 1Front view schematic diagram of the pixel array and imaging area of the receiving unit of the processing and detection equipment. Figure 2B is based on Figure 2A Partial enlarged schematic diagram of the imaging area and the image formed thereon. Please refer to Figure 2A and Figure 2B , in this embodiment, the receiving unit 161 is an image sensor, and the pixel array PA of the image sensor has a plurality of pixels PX arranged in an array. The receiving unit 161 has a plurality of imaging areas R1, each imaging area R1 covers a plurality of pixels PX, each detection information includes an image IM of one of the processing positions, and each detection information is respectively imaged on different ones of the plurality of imaging areas R1 via the scanning output unit 156 (for example Figure 2A one of the imaging areas R1 shown, and the plurality of different imaging areas R1 can be arranged in an array to respectively cover different pixels PX of the pixel array PA).

[0025] In this embodiment, when the processing laser L1 of the processing unit 130 and the detection information L3 of the detection scanner 150a are coaxial, the surface S1 of each processed sample 120 processed by the processing laser L1 is imaged onto the receiving unit 161. When the processing scanner 140 rapidly scans the surface S1 processed by the processing laser L1, the scanning output unit 156 (i.e., the galvanometer) of the detection scanner 150a also rapidly scans accordingly, and the position images of the detection information L3 on the imaging space of the receiving unit 161 are respectively imaged at different positions on the receiving unit 161. In one embodiment, the processed sample 120 is, for example, a micro light-emitting diode array, and the lens of the receiving unit 161 or other lenses in combination with the scanning of the scanning output unit 156 can image the image IM onto the pixel PX, and the image IM is, for example, an image of a micro light-emitting diode (micro LED chip).

[0026] As Figure 2B shown, taking the receiving unit 161 as an image sensor as an example, the detection information L3 received by the receiving unit 161 is an image IM of a micro light-emitting diode chip at each processing position (for example, the image IM in the local area Z1 shown in the imaging area R1). Since the required detection information L3 is the state of the micro light-emitting diode chip after the laser processing process, an additional illumination light source can be provided by the light source module 155.

[0027] Here, it is assumed that each chip requires 50x50 pixels to resolve the image. When the resolution of the receiving unit 161 is 2000x2000, then each frame of the receiving unit 161 can accommodate 40x40 = 1600 chip images.

[0028] That is, Figure 2BEach of the micro light-emitting diode chips shown occupies a pixel of 50x50, and each frame of the receiving unit 161 can capture the processed images of 1600 micro light-emitting diode chips. Within each frame of the receiving unit 161, the processing scanner 140 scans synchronously with the galvanometer 156. While the processing scanner 140 scans the processing sample 120 (such as a wafer), the scanning output unit 156 (i.e., the galvanometer) scans the processed images of 1600 chips to 1600 positions of the receiving unit 161, forming an in-situ and on-target fast analyzer technology.

[0029] For a wafer with 16 million chips, the conventional technology uses the method of detecting by the high-speed movement of the platform, and it takes about 20 minutes for each wafer. By adopting the synchronous scanning method of the above-mentioned processing technology and detection technology, taking the current common hardware conditions as an example, a commercially available charge-coupled device only needs an exposure speed of 30 frames / sec (frame / sec), and 48000 chip images can be captured per second. Therefore, the receiving unit 161 only needs 333 seconds to complete the storage of detection information, and the efficiency can be increased by 3 to 4 times. In addition, compared with the existing technology that only uses the galvanometer to detect multiple processed images at the same time, in this embodiment, the processing and detection of the processing sample 120 are performed synchronously, and the mass transfer and mass detection can be completed simultaneously at one station, saving the load time / unload time consumed by the transfer process and detection process due to different stations.

[0030] In one embodiment, the scanning and moving cycle for the processing scanner 140 to complete one processing and move the light spot to the next processing position is, for example, within several microseconds, which is determined in accordance with the writing speed limits of the detection scanner 150a and the receiving unit 161.

[0031] In another embodiment, for the detection requirements of non-direct images, the processing and detection device 100a may not include a detection light source (that is, does not include the light source module 155). For example, when the processing laser L1 processes the surface S1, the processing sample 120 may reflect or scatter the detection information L3. And the detection information L3 may include more than one kind of information, and at this time, the dichroic mirror 131 can be replaced by an element such as a beam splitter that can screen specific information, so that the detection information L3 can be transmitted to the information acquisition unit 151, and then scanned by the scanning output unit 156 to the receiving unit 161. In this way, the processing and detection device 100a can detect the state of the processing sample 120 during processing.

[0032] That is to say, there can be various different examples of the detection information L3 that the receiving unit 161 can receive. In addition to externally applying different detection light sources to generate the detection information L3 as described above, it is also possible that the processing laser L1 itself has corresponding characteristics, or the detection information L3 is formed after the processing laser L1 is applied to the processing sample 120 and reflected or scattered by it, and then captured by the receiving unit 161. These detection information L3 can be used to interpret various properties of the processed sample 120 (such as a micro light-emitting diode chip), including but not limited to wavelength, spectrum, luminance, etc. In addition, the light source of the detection information L3 may be realized by one or more different detection light sources. Or, when the detection information L3 can be observed without the need for visible light, the detection information L3 can be captured by using the specific information reflected or scattered back when the processing sample 120 is processed, without externally applying a detection light source.

[0033] Therefore, in one embodiment, the receiving unit 161 can be a spectrometer, and each detection information includes the spectral signal of one of the processing positions. The receiving unit 161 receives a plurality of detection information to generate image data.

[0034] Or, in one embodiment, the receiving unit 161 is a luminance meter, and each detection information includes the luminance signal of one of the processing positions.

[0035] Figure 3 It is a schematic optical path diagram of a processing and detection device according to another embodiment of the present invention. Please refer to Figure 3 , Figure 3 and Figure 1 The difference from

[0036] is that there are multiple detection scanners in the processing and detection device 100b, for example, the detection scanners 150a and 150b, and the detection information received by each information acquisition unit is different. For example, the detection information received by the information acquisition unit 151 of the detection scanner 150a is different from that received by the information acquisition unit 151' of the detection scanner 150b.

[0037] Specifically, the detection scanner 150a may include a light source module 155, an information acquisition unit 151, and a scanning output unit 156, and the detection scanner 150b may include a light source module 155', an information acquisition unit 151', and a scanning output unit 156'. The detection light L4 emitted by the light source module 155' is reflected by the beam splitter 157 to the processing scanner 140. After being scanned by the processing scanner 140 on the processing sample 120, it is reflected by the processing sample 120 into detection information L5. After the detection information L5 and the detection information L3 are reflected by the reflecting mirror 154 via the beam splitters 157 and 152, the dichroic mirror 1582 can separate the detection information L3 and the detection information L5. Since the wavelength of the detection light L2 is different from the wavelength of the detection light L4, the wavelength of the detection information L3 is also different from the wavelength of the detection information L5. Therefore, the two can be separated by the dichroic mirror 1582.

[0038] After that, the detection information L3 is reflected by the reflecting mirror 1581 to the information acquisition unit 151, and the detection information L5 is transmitted to the information acquisition unit 151'. The scanning output unit 156 scans the detection information L3 to the receiving unit 161, and the scanning output unit 156' scans the detection information L5 to the receiving unit 163.

[0039] Therefore, there can be multiple groups of detection scanners in this embodiment, and the required light source module or the corresponding receiving unit can be added according to the detection sample. In this way, multiple detections can be completed at one time during the laser processing process.

[0040] In another embodiment, if the light source module 155 is a multi-wavelength light source, the light source module 155' may not be used, but only one light source module 155 may be used to provide detection lights L2 and L4 with two or more wavelengths. In this way, the detection information L3 and the detection information L5 can still be correspondingly generated.

[0041] Figure 4 It is a schematic optical path diagram of a processing and detection device according to another embodiment of the present invention. Please refer to Figure 4 , Figure 4 and Figure 3The difference lies in that the processing and detection device 100c in this embodiment adopts the combination of an optical modulator 158, an information acquisition unit 151, and a scanning output unit 156 to process and separate multiple detection information (such as detection information L3 and L5). In this embodiment, the optical modulator 158 is, for example, an acousto-optic modulator (AOM). When there are multiple detection scanners and receiving units, the optical modulator 158 receives multiple detection information (such as detection information L3 and L5) and distributes them to multiple receiving units (such as receiving units 161 and 163). Specifically, the acousto-optic modulator can modulate the frequencies or refractive indices of different detection information L3 and L5 through the internal acoustic wave field, and thereby interpret and separate the detection information L3 and L5 to determine that they should be transmitted to the receiving units 161 and 163 respectively.

[0042] On the other hand, the optical modulator 158 (i.e., the acousto-optic modulator) in this embodiment can also be applied to Figure 1 the embodiment and is configured between the scanning output unit 156 and the receiving unit 161. In Figure 1 the embodiment, the detection light source can be provided by the light source module 155 in the detection scanner 150a. The detection light source can also be continuous light. When in-situ and target tracking, the detection light source moves with the movement of the light spot, but during this period, the receiving unit 161 remains in the exposure state. In one embodiment, at this time, a ultra-high-speed complementary metal-oxide-semiconductor (CMOS) device can be used as the receiving unit 161 to expose at the same frequency as the pulse of the (pulse) laser source of the processing unit 130. Since the sensing speed of the ultra-high-speed complementary metal-oxide-semiconductor device is fast enough, the interference problem between multiple images IM during the above continuous exposure can be effectively reduced.

[0043] In another embodiment, instead of using a very high-speed complementary metal-oxide semiconductor device as the receiving unit 161, an optical modulator 158 (such as an acousto-optic modulator) can be used to capture the changes in the reflected light (e.g., wavefront), thereby screening the light that meets specific conditions for passage. That is, the optical modulator 158 shields at least a part of the detection information L3 and transmits it to the receiving unit 161. That is to say, the optical modulator 158 can filter out unwanted noise and is not affected by continuous exposure. Specifically, the optical modulator 158 can first filter out the special frequency of the spot drag, or utilize the characteristic that the optical modulator 158 can adjust the light output direction at high speed to transmit the effective detection information L3 to the receiving unit 161 only at specific instants, for example, corresponding to transmit the effective detection information L3 to the corresponding pixels PX. The embodiment using the optical modulator 158 can make the brightness of the detection information L3 stronger and can also meet the requirements of multiple types of detection information L3 at the same time.

[0044] In summary, in the processing and detection equipment of the embodiments of the present invention, the surface of the processed sample has multiple processing positions. The processing scanner controls the processing unit to process the multiple processing positions in sequence at a scanning frequency. The information acquisition unit synchronously receives the detection information of each of the multiple processing positions via the processing scanner. The scanning output unit is connected to the information acquisition unit and outputs each detection information at the scanning frequency. Therefore, during the processing of the processed sample, detection can be performed synchronously. For example, in the process of mass transfer, mass detection can be performed synchronously, replacing the existing sub-station process and improving production efficiency.

[0045] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A processing and detection device, characterized in that, Comprising: A stage for placing a processing sample, the surface of the processing sample having a plurality of processing positions; A processing unit disposed relative to the stage for processing the processing sample; A processing scanner for scanning the processing sample, the processing scanner controlling the processing unit to process the plurality of processing positions in sequence at a scanning frequency; and At least one detection scanner, comprising: An information acquisition unit for synchronously receiving detection information of each of the plurality of processing positions via the processing scanner; and A scan output unit signal-connected to the information acquisition unit and outputting each of the detection information at the scanning frequency.

2. The processing and detection equipment according to claim 1, characterized in that, The at least one detection scanner further comprises a light source module connected to the processing scanner and the information acquisition unit, the light source module having an optical path, and the optical path being controlled by the processing scanner to be coaxial with the vector of the processing unit relative to each of the plurality of processing positions, wherein each of the detection information is an optical signal reflected from the surface of the processing sample.

3. The processing and detection equipment according to claim 2, characterized in that, The light source module is a continuous light source or a pulsed light source.

4. The processing and detection equipment according to claim 2, characterized in that The light source module emits detection light of a single wavelength.

5. The processing and detection equipment according to claim 2, characterized in that, The light source module emits detection light of multiple wavelengths.

6. The processing and detection equipment according to claim 1, characterized in that, There are a plurality of the detection scanners, and the detection information received by each information acquisition unit is different.

7. The processing and detection equipment according to claim 1, characterized in that, The processing unit is a laser source, and each of the detection information is the laser source reflected from the surface of the processing sample.

8. The processing and detection equipment according to claim 1, characterized in that, It further comprises at least one receiving unit connected to the scan output unit of the detection scanner to receive each of the detection information.

9. The processing and detection equipment according to claim 8, characterized in that, The receiving unit is an image sensor and has a plurality of imaging regions, wherein each detection information includes an image of one of the processing positions, and each of the detection information is respectively imaged on different ones of the plurality of imaging regions via the scan output unit.

10. The processing and detection equipment according to claim 8, characterized in that, The receiving unit is a spectrometer, each detection information includes a spectral signal of one of the processing positions, and the receiving unit receives the plurality of detection information to generate image data.

11. The processing and detection equipment according to claim 8, characterized in that, The receiving unit is a luminance meter, and each of the detection information includes a luminance signal of one of the processing positions.

12. The processing and testing equipment according to claim 8, characterized in that, It further comprises an optical modulator disposed between the detection scanner and the receiving unit, and the optical modulator shields at least a part of the detection information and transmits it to the receiving unit.

13. The processing and detection equipment according to claim 12, characterized in that, There are a plurality of the detection scanners and the receiving units, and the optical modulator receives the plurality of detection information and distributes it to the plurality of receiving units.

14. The processing and detection equipment according to claim 1, characterized in that, The scan output unit is a scanning galvanometer.

15. The processing and detection equipment according to claim 1, characterized in that The information acquisition unit includes a lens or a light incident surface.

Images