Dynamic adjustment system and method for uniform distribution of test points of flying probe machine

Abstract

The invention belongs to the technical field of PCB (printed circuit board) detection equipment, and particularly relates to a dynamic adjustment system and method for uniform distribution of test points of a flying probe machine, and the system comprises a flying probe test machine, a camera alignment system, a data processing unit and a movement mechanism. The flying probe testing machine is provided with at least two guide rails, and flying probes are arranged on the guide rails and used for testing test points on the PCB. And the camera alignment system carries out at least two times of alignment with the PCB, and outputs alignment information. And the data processing unit receives the alignment information, loads PCB data, and determines the offset of the PCB according to the distribution of the test points and the alignment information. And the movement mechanism is connected with the PCB and responds to the offset to control the PCB to translate, so that the test points are uniformly distributed on the flying probe test machine. According to the invention, by dynamically adjusting the position of the PCB, the test efficiency of the flying probe tester is improved, the distribution uniformity of test points is ensured, and the test flow of the PCB is optimized.

Description

Technical Field

[0001] The present invention belongs to the technical field of PCB testing equipment, and particularly relates to a dynamic adjustment system and method for uniform distribution of test points of a flying probe machine. Background Art

[0002] In the prior art, flying probe testers are widely used in the testing of PCB boards. During the testing process of traditional flying probe testers, the PCB board is fixedly installed, and the flying probe tester performs tests according to the preset positions of the test points. However, since the distribution of the test points on the PCB board is often uneven, during the testing process, some flying probes may be idle, while some other flying probes may work excessively, resulting in low testing efficiency.

[0003] Existing flying probe testers have obvious defects when testing PCB boards with unevenly distributed test points. Specifically, since the PCB board is fixed and immovable, the tester cannot dynamically adjust the working state of the test probes according to the actual distribution of the test points, resulting in uneven testing. In areas with dense test points, the flying probes may overheat or wear due to frequent work, while in areas with sparse test points, the flying probes may remain idle for a long time, causing waste of resources. In addition, due to uneven testing, there may be a situation of empty probe waiting, further reducing the testing efficiency. This fixed testing method not only affects the use efficiency of the tester, but also increases the testing cost and time, and is not conducive to improving production efficiency and product quality. Summary of the Invention

[0004] The purpose of the present invention is to provide a dynamic adjustment system and method for uniform distribution of test points of a flying probe machine, so as to solve the problems of low testing efficiency and resource waste caused by uneven distribution of test points in the testing of existing flying probe testers.

[0005] The present invention achieves the above purpose through the following technical solutions:

[0006] In a first aspect, the present invention provides a dynamic adjustment system for uniform distribution of test points of a flying probe machine, the system comprising:

[0007] A flying probe tester having at least two guide rails, with flying probes distributed on both the front and back sides of the guide rails facing the PCB board, and the flying probes contact the test points on the PCB board for testing;

[0008] A camera alignment system for aligning with the PCB board at least twice and outputting alignment information of the alignment points;

[0009] A data processing unit for receiving the alignment information and loading PCB board data, and determining the PCB board offset according to the distribution information of the test points on the PCB board and the alignment information;

[0010] The motion mechanism is connected to the PCB board and is used to respond to the offset to control the PCB board to translate in a preset direction, so as to adjust the position of the PCB board and make the test points evenly distributed on the flying probe tester.

[0011] Among them, the two alignments are respectively used to determine whether the initial position and the adjusted position of the PCB board meet the preset alignment standard.

[0012] Further preferably, on each of the guide rails, and on both sides symmetrically located along the extension direction of the guide rail of the PCB board, there are horizontal movers. The horizontal movers are connected to the flying probes on the front and back sides of the PCB board through swing arms; the camera alignment system is arranged at the end of the swing arm and is used to obtain the alignment coordinates of the flying probe tip relative to the PCB board and use them as the alignment points.

[0013] Further preferably, the data processing unit includes:

[0014] The data acquisition sub-unit is used to acquire the coordinates of at least two of the alignment points on the PCB board, and is also used to load the PCB board data, including the position coordinates of all test points on the PCB board.

[0015] The first calculation sub-unit is used to calculate the position information of the center line of the PCB board by using the relationship between the length of the swing arm and the angle between the swing arm and the guide rail.

[0016] The second calculation sub-unit is used to sort the position coordinates of all test points in the preset direction, select the middle position point of the PCB board as the average position point, calculate the height difference between the average position point and the center line position point, and use the height difference as the offset of the PCB board.

[0017] The alignment standard judgment sub-unit is used to judge whether the current position of the PCB board meets the preset alignment standard, and when it does not meet the standard, output the offset to the motion mechanism for adjustment.

[0018] Further preferably, the data processing unit further includes a parameter setting sub-unit, which is used to define the extension direction of the guide rail as the first coordinate axis and the direction perpendicular to the guide rail as the second coordinate axis; the preset direction is specifically the extension direction of the second coordinate axis.

[0019] Further preferably, the motion mechanism includes a clamping plate for installing the PCB board, a motor for providing the translation power of the PCB board, and a lead screw arranged at the output end of the motor. The movable end of the lead screw is rotationally connected to the clamping plate and is used to drive the PCB board on the clamping plate to translate in the preset direction when the motor drives the lead screw to rotate.

[0020] Further preferably, judging whether it meets the preset alignment standard includes the following steps:

[0021] The camera moves to near the alignment point, so that the camera's field of view captures the alignment point;

[0022] Obtain the pixel differences (px, py) between the center of the alignment point and the center of the camera's field of view, where px and py respectively represent the pixel differences in the horizontal and vertical directions;

[0023] According to the known physical distance pix corresponding to each pixel of the camera, calculate the actual physical distance between the center of the alignment point and the center of the camera's field of view as (pxpix, pypix);

[0024] Control the movement of the motor according to the actual physical distance, and gradually move the center of the camera's field of view towards the center of the alignment point through multiple iterations;

[0025] When the pixel difference between the center of the camera's field of view and the center of the alignment point is less than 1 pixel, the alignment is completed, otherwise the alignment is not completed.

[0026] In a second aspect, the present invention proposes a dynamic adjustment method for the uniform distribution of test points of a flying probe machine, which is implemented based on the system described in any one of the above. The method includes:

[0027] S1. Use the camera alignment system to perform an initial alignment with the PCB board, and obtain the coordinates of at least two alignment points on the PCB board. When the initial position of the PCB board does not meet the preset alignment standard, execute step S2;

[0028] S2. Use the camera alignment system to obtain the position coordinates of all test points on the PCB board. In the data processing unit, calculate the PCB board offset according to the position coordinates of the test points on the PCB board and the coordinates of the alignment points;

[0029] S3. Use the motion mechanism to respond to the offset, and control the PCB board to perform a translational motion along a preset direction to adjust the position of the PCB board so that the test points are evenly distributed;

[0030] S4. Use the camera alignment system to perform a secondary alignment with the PCB board until the position of the adjusted PCB board meets the preset alignment standard;

[0031] S5. The flying probe tester performs tests according to the position of the adjusted PCB board to ensure that the test points are evenly distributed.

[0032] Further preferably, the initial position of the PCB board and the position of the adjusted PCB board are specifically the alignment coordinates with the tip of the flying probe as the alignment point.

[0033] Further preferably, step S2 includes:

[0034] S2.1. Obtain the coordinates (x1, y1), (x2, y2) of at least two of the alignment points on the PCB board, and load the PCB board data, including the position coordinates of all test points on the PCB board;

[0035] S2.2. Use the swing arm length L, and the angles θ1 and θ2 between the swing arm and the two guide rails to calculate the position information of the center line of the PCB board, specifically:

[0036] The vertical coordinates of the two guide rails are: lower guide rail: y3 = y1 - L * sin(θ1), upper guide rail: y4 = y2 + L * sin(θ2), and the coordinate of the center line along the preset direction: y = (y3 + y4) / 2;

[0037] S2.3. Sort the position coordinates of all test points in the preset direction, select the middle position point of the PCB board as the average position point ym, calculate the height difference between the average position point and the center line position point, and output the height difference dy as the PCB board offset, dy = y - ym.

[0038] The beneficial effects of the present invention are as follows:

[0039] 1. The present invention realizes the precise dynamic adjustment of the position of the PCB board by integrating a camera alignment system, a data processing unit, and a motion mechanism. This system can automatically determine whether the initial position of the PCB board meets the preset alignment standard, and when it does not meet the standard, it can automatically calculate the offset and adjust the position of the PCB board to ensure that the test points are evenly distributed on the flying probe tester. This innovation not only improves the test efficiency but also significantly reduces the resource waste caused by uneven distribution of test points, enhancing the overall production efficiency and product quality.

[0040] 2. The present invention shows significant superiority in calculating the deviation amount. Through the collaborative work of multiple sub-units in the data processing unit, it can accurately obtain the coordinate information of the alignment points and test points on the PCB board, and calculate the position of the center line of the PCB board using the relationship between the swing arm length and the angle. Further, by comparing the height difference between the average position of the test points and the center line position to determine the offset, this process is highly automated and has high precision. The application of this deviation amount calculation method makes the adjustment of the PCB board position more accurate and efficient, providing strong support for the efficient operation of the flying probe tester. Description of the Drawings

[0041] Figure 1 It is a schematic layout diagram of the flying probe tester provided by the embodiment of the present application;

[0042] Figure 2 It is a schematic diagram of the distribution of test points on the PCB board in the present application;

[0043] Figure 3Schematic diagram of the layout after the position adjustment of the PCB board on the flying probe tester in the embodiment of the present application;

[0044] Figure 4 Schematic diagram of a structure of the motion mechanism provided by the embodiment of the present application;

[0045] Figure 5 Schematic diagram of a process of the dynamic adjustment method provided by the embodiment of the present application;

[0046] Figure 6 Schematic diagram of a process of calculating the offset of the PCB board in the embodiment of the present application.

[0047] Figure 1-4 In the figure: 1. PCB board; 2. Horizontal mover; 3. Swing arm; 4. Flying probe; 5. Clamping plate; 6. Motor; 7. Lead screw; 8. Mounting seat. Detailed implementation manners

[0048] The present application will be further described in detail below with reference to the accompanying drawings. It is necessary to point out here that the following detailed implementation manners are only used to further illustrate the present application and should not be construed as limiting the protection scope of the present application. Those skilled in the art can make some non-essential improvements and adjustments to the present application according to the above application content.

[0049] Embodiment 1

[0050] As Figure 1-4 shown, this embodiment proposes a dynamic adjustment system for uniform distribution of test points on a flying probe machine. The system includes a flying probe tester, a camera alignment system, a data processing unit, and a motion mechanism; the flying probe tester has at least two guide rails, and flying probes 4 are distributed on both the front and back sides of the guide rails facing the PCB board 1. The flying probes 4 are in contact with the test points on the PCB board 1 for testing; the camera alignment system is used to perform at least two alignments with the PCB board 1 and output the alignment information of the alignment points; the data processing unit is used to receive the alignment information and load the PCB board data, and determine the offset of the PCB board 1 according to the distribution information and alignment information of the test points on the PCB board 1; the motion mechanism is connected to the PCB board 1 and is used to respond to the offset to control the PCB board 1 to perform a translational motion along a preset direction to adjust the position of the PCB board 1 so that the test points are evenly distributed on the flying probe tester; among them, the two alignments are respectively used to determine whether the initial position and the adjusted position of the PCB board 1 meet the preset alignment standard.

[0051] It should be noted that, in this solution, determining whether it meets the preset alignment standard includes the following steps:

[0052] The camera moves to near the alignment point so that the camera field of view captures the alignment point;

[0053] Obtain the pixel differences (px, py) between the center of the alignment point and the center of the camera's field of view, where px and py represent the pixel differences in the horizontal and vertical directions respectively;

[0054] According to the known physical distance pix corresponding to each pixel of the camera, calculate the actual physical distance between the center of the alignment point and the center of the camera's field of view as (px * pix, py * pix);

[0055] Control the movement of the motor according to the actual physical distance, and gradually move the center of the camera's field of view towards the center of the alignment point through multiple iterations;

[0056] When the pixel difference between the center of the camera's field of view and the center of the alignment point is less than 1 pixel, the alignment is completed; otherwise, the alignment is not completed.

[0057] In some preferred embodiments, horizontal movers are provided on each guide rail and on both sides of the PCB board 1 symmetrically along the extension direction of the guide rail. The horizontal movers are connected to the flying probes through swing arms on both the front and back sides of the PCB board 1. The main function of the horizontal movers is to connect the flying probes through the swing arms, so that the flying probes can accurately contact the test points on the PCB board 1 for testing; the camera alignment system is arranged at the end of the swing arm and is used to obtain the alignment coordinates of the tip of the flying probe relative to the PCB board and serve as the alignment point.

[0058] During specific implementation, specifically in combination with Figure 1 , the 8 needles of the flying probe tester are distributed on both the front and back sides of the PCB board 1, with 4 needles on one side. Every two needles are arranged at the same horizontal height. They are arranged symmetrically up and down, and the two needles on each guide rail are responsible for half of the PCB area.

[0059] Specifically in combination with Figure 2 , when the measurement points on the PCB are unevenly distributed, some needles will be in an idle state during testing. Figure 2 In

[0060] Further preferably, the data processing unit includes a data acquisition subunit, a first calculation subunit, a second calculation subunit, and an alignment standard judgment subunit; the data acquisition subunit is used to acquire the coordinates of at least two alignment points on the PCB board 1, and is used to load the PCB board data, including the position coordinates of all test points on the PCB board 1; the first calculation subunit is used to calculate the position information of the center line of the PCB board 1 by using the arm length and the angular relationship between the arm and the guide rail; the second calculation subunit is used to sort the position coordinates of all test points in a preset direction, select the middle position point of the PCB board 1 as the average position point, calculate the height difference between the average position point and the center line position point, and use the height difference as the offset of the PCB board 1; the alignment standard judgment subunit is used to judge whether the current position of the PCB board 1 meets the preset alignment standard, and output the offset to the motion mechanism when it does not meet the standard.

[0061] Further preferably, the data processing unit further includes a parameter setting subunit, which is used to define the extension direction of the guide rail as the first coordinate axis and the direction perpendicular to the guide rail as the second coordinate axis; the preset direction is specifically the extension direction of the second coordinate axis.

[0062] In specific implementation, the main function of the parameter setting subunit is to define the key coordinate axes and directions in the system. Specifically, it defines the extension direction of the guide rail as the first coordinate axis, and the direction perpendicular to the guide rail is set as the second coordinate axis. This setting helps the system to have a unified reference benchmark when performing position calculation and offset adjustment.

[0063] More importantly, the parameter setting subunit also clarifies the preset direction, that is, the extension direction of the second coordinate axis. This means that when the system needs to adjust the position of the PCB board 1 to evenly distribute the test points, it will control the translational movement of the PCB board 1 according to this preset direction. Such a design not only improves the operability and flexibility of the system, but also ensures that the test points can be distributed in an optimal way on the flying probe tester, thereby improving the test efficiency and accuracy.

[0064] It can be understood that in this embodiment, the dynamic adjustment system mainly consists of four core parts: a flying probe tester, a camera alignment system, a data processing unit, and a motion mechanism. The flying probe tester is equipped with at least two guide rails, and the flying probes distributed on the guide rails can accurately contact the test points on the PCB board 1 for testing. The camera alignment system is responsible for aligning with the PCB board 1 at least twice to ensure that both the initial position and the adjusted position meet the preset alignment standard. In this process, the high precision and fast response ability of the camera system are crucial. It can not only accurately capture the coordinate information of the alignment points, but also provide the position coordinates of all test points in the subsequent steps, providing reliable data support for the data processing unit.

[0065] The data processing unit, acting as the "brain" of the system, contains multiple sub-units inside, such as a data acquisition sub-unit, a first calculation sub-unit, a second calculation sub-unit, and a registration standard judgment sub-unit, etc. These sub-units work together to quickly process the data transmitted by the camera alignment system, calculate the offset of PCB board 1, and instruct the motion mechanism to make corresponding adjustments. The data processing unit also has a parameter setting function, which can define the extending direction of the guide rail and the direction perpendicular to the guide rail as the coordinate axes, providing an accurate coordinate system reference for subsequent offset calculation.

[0066] Specifically combined with Figure 4 , the motion mechanism is responsible for responding to the instructions of the data processing unit. It drives the lead screw 7 to rotate through the motor 6, driving the PCB board 1 on the clamping plate 5 to translate in a preset direction. In this process, the stability and accuracy of the motion mechanism are also crucial, which directly relates to the accuracy of the position adjustment of the PCB board 1 and the uniformity of the test point distribution.

[0067] Further preferably, the motion mechanism includes a clamping plate 5 for mounting the PCB board 1, a motor 6 for providing the translation power of the PCB board 1, and a lead screw 7 provided at the output end of the motor 6. The movable end of the lead screw 7 is rotatably connected to the clamping plate 5, and is used to drive the PCB board 1 on the clamping plate 5 to translate in a preset direction when the motor 6 drives the lead screw 7 to rotate; more specifically, the motor 6 is arranged on the mounting base 8 (L-shaped), and when the PCB board 1 moves with the clamping plate 5, the clamping plate 5 also slides along the vertical section of the mounting base 8.

[0068] Combined with Figure 5 and Figure 6 , this embodiment also proposes a dynamic adjustment method for the uniform distribution of test points of a flying probe machine. Based on the above system implementation, the method includes:

[0069] S1. Use the camera alignment system to perform an initial alignment with the PCB board 1, obtain the coordinates of at least two alignment points on the PCB board 1, and when the initial position of the PCB board 1 does not meet the preset alignment standard, execute step S2;

[0070] S2. Use the camera alignment system to obtain the position coordinates of all test points on the PCB board 1. In the data processing unit, calculate the offset of the PCB board 1 according to the position coordinates of the test points and the alignment points on the PCB board 1;

[0071] S3. Use the motion mechanism to respond to the offset, control the PCB board 1 to translate in a preset direction, so as to adjust the position of the PCB board 1 to make the test point distribution uniform;

[0072] S4. Use the camera alignment system to perform a secondary alignment with the PCB board 1 until the position of the PCB board 1 after adjustment meets the preset alignment standard;

[0073] S5. The flying probe tester performs tests according to the adjusted position of PCB board 1 to ensure uniform distribution of test points.

[0074] Further preferably, the initial position and the adjusted position of PCB board 1 are specifically the alignment coordinates with the tip of the flying probe as the alignment point.

[0075] Specifically combined with Figure 5 , further preferably, step S2 includes:

[0076] S2.1. Obtain the coordinates (x1, y1), (x2, y2) of at least two alignment points on PCB board 1, and load the PCB board data, including the position coordinates of all test points on PCB board 1.

[0077] S2.2. Specifically combined with Figure 1 , use the swing arm length L, and the angles θ1 and θ2 between the swing arm and the two guide rails to calculate the position information of the center line of PCB board 1, specifically: the vertical direction coordinates of the two guide rails are: lower guide rail: y3 = y1 - L * sin(θ1), upper guide rail: y4 = y2 + L * sin(θ2), the coordinate of the center line along the preset direction: y = (y3 + y4) / 2.

[0078] S2.3. Specifically combined with Figure 2 , sort the position coordinates of all test points in the preset direction, select the middle position point of PCB board 1 as the average position point ym, calculate the height difference between the average position point and the center line position point, and output the height difference dy as the offset of PCB board 1, dy = y - ym.

[0079] It can be understood that in terms of deviation calculation, the present invention proposes an efficient and accurate method. First, use the camera alignment system to obtain the position coordinates of all test points on PCB board 1, and calculate the offset of PCB board 1 according to these coordinates and the coordinates of the alignment points in the data processing unit. Specifically, sort the position coordinates of all test points in the preset direction, select the middle position point of PCB board 1 as the average position point, then calculate the height difference between the average position point and the center line position point, and output this height difference as the offset of PCB board 1.

[0080] The optimization of this deviation calculation method lies in that it considers the overall distribution of test points on PCB board 1, rather than just the position of a single alignment point. By comparing the height difference between the average position of the test points and the center line position, it can more accurately reflect the actual offset of PCB board 1. The application of this method makes the adjustment of the position of PCB board 1 more accurate, effectively avoiding the problem of uneven distribution of test points caused by inaccurate offset calculation.

[0081] Those of ordinary skill in the art can realize that the units and algorithm steps of each example described in combination with the embodiments disclosed herein can be implemented by electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are executed in a hardware or software manner depends on the specific application and design constraints of the technical solution. Professional technicians can use different methods to implement the described functions for each specific application, but such implementation should not be considered to exceed the scope of this application.

[0082] In addition, in each embodiment of this application, each functional module can be integrated into a processing unit, or each unit can exist physically alone, or two or more units can be integrated into one unit.

[0083] The above embodiments are only used to illustrate the technical solutions of this application, rather than to limit them; although this application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements for some of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of each embodiment of this application.

Claims

1. A dynamic adjustment system for uniform distribution of test points of a flying probe machine, characterized in that: The system comprises: A flying probe tester has at least two guide rails, and flying probes are distributed on both sides of the guide rails facing the front and back sides of the PCB board. The flying probes contact the test points on the PCB board for testing; The camera alignment system is used to align with the PCB board at least twice and output alignment information of the alignment points; A data processing unit, used for receiving the alignment information and loading PCB board data, and determining the PCB board offset according to the distribution information of the test points on the PCB board and the alignment information; A motion mechanism connected to the PCB board, and used to control the PCB board to move in a preset direction in response to the offset, so as to adjust the position of the PCB board so that the test points are evenly distributed on the flying probe tester; The two alignments are respectively used to determine whether the initial position and the adjusted position of the PCB board meet the preset alignment standards.

2. A dynamic adjustment system for uniform distribution of test points of a flying probe machine according to claim 1, characterized in that: A horizontal mover is provided on each of the guide rails and on both sides of the PCB board that are symmetrical along the extension direction of the guide rails. The horizontal mover is connected to the flying probe through a swing arm toward the front and back sides of the PCB board; the camera alignment system is arranged at the end of the swing arm, and is used to obtain the alignment coordinates of the flying probe tip relative to the PCB board, and serve as the alignment point.

3. A dynamic adjustment system for uniform distribution of test points of a flying probe machine according to claim 2, characterized in that: The data processing unit comprises: A data acquisition subunit, used to acquire the coordinates of at least two alignment points on the PCB board, and to load PCB board data, including the position coordinates of all test points on the PCB board; A first calculation subunit is used to calculate the position information of the center line of the PCB board by using the length of the swing arm and the angle relationship between the swing arm and the guide rail; A second calculation subunit is used to sort the position coordinates of all the test points according to the preset direction, select the middle position point of the PCB board as the average position point, calculate the height difference between the average position point and the center line position point, and use the height difference as the PCB board offset; The alignment standard judgment subunit is used to judge whether the current position of the PCB board meets the preset alignment standard, and output the offset to the motion mechanism when it does not meet the standard.

4. A dynamic adjustment system for uniform distribution of test points of a flying probe machine according to claim 3, characterized in that: The data processing unit also includes a parameter setting subunit, which is used to define the extension direction of the guide rail as the first coordinate axis and the direction perpendicular to the guide rail as the second coordinate axis; the preset direction is specifically the extension direction of the second coordinate axis.

5. The dynamic adjustment system for uniform distribution of test points of a flying probe machine according to claim 1, characterized in that: The motion mechanism includes a clamping plate for mounting the PCB board, a motor for providing translational force for the PCB board, and a screw rod arranged at the output end of the motor. The movable end of the screw rod is rotatably connected to the clamping plate, and is used to drive the PCB board on the clamping plate to translate along the preset direction when the motor drives the screw rod to rotate.

6. The dynamic adjustment system for uniform distribution of test points of a flying probe machine according to claim 1, characterized in that: Determining whether the preset alignment standard is met includes the following steps: The camera moves to the vicinity of the alignment point so that the camera field of view captures the alignment point; Get the pixel difference (px, py) between the center of the alignment point and the center of the camera field of view, where px and py represent the pixel difference in the horizontal and vertical directions respectively; According to the known physical distance pix corresponding to each pixel of the camera, the actual physical distance between the center of the alignment point and the center of the camera field of view is calculated as (pxpix, pypix); Control the movement of the motor according to the actual physical distance, and gradually move the center of the camera field of view toward the center of the alignment point through multiple iterations; When the pixel difference between the center of the camera field of view and the center of the alignment point is less than 1 pixel, the alignment is completed, otherwise it is not completed.

7. A dynamic adjustment method for uniform distribution of test points of a flying probe machine, implemented based on the system according to any one of claims 1 to 6, characterized in that: The method comprises: S1, using the camera alignment system to perform initial alignment with the PCB board, obtaining the coordinates of at least two alignment points on the PCB board, and when the initial position of the PCB board does not meet the preset alignment standard, executing step S2; S2, using the camera alignment system to obtain the position coordinates of all test points on the PCB board, and in the data processing unit, calculating the PCB board offset according to the position coordinates of the test points on the PCB board and the coordinates of the alignment points; S3, using the motion mechanism to respond to the offset and control the PCB to translate along a preset direction, so as to adjust the position of the PCB so that the test points are evenly distributed; S4, performing secondary alignment with the PCB board using the camera alignment system, until the adjusted position of the PCB board meets the preset alignment standard; S5. The flying probe tester performs tests according to the adjusted PCB board position to ensure that the test points are evenly distributed.

8. A dynamic adjustment method for uniform distribution of test points of a flying probe machine according to claim 7, characterized in that: The initial position of the PCB board and the adjusted position of the PCB board are specifically alignment coordinates with the flying probe tip as the alignment point.

9. A dynamic adjustment method for uniform distribution of test points of a flying probe machine according to claim 8, characterized in that: The step S2 comprises: S2.1, obtaining the coordinates (x1, y1), (x2, y2) of at least two alignment points on the PCB board, and loading the PCB board data, including the position coordinates of all test points on the PCB board; S2.

2. Calculate the position information of the center line of the PCB board using the length L of the swing arm and the angles θ1 and θ2 between the swing arm and the two guide rails. Specifically, the vertical coordinates of the two guide rails are: lower guide rail: y3 = y1-L*sin(θ1), upper guide rail: y4 = y2+L*sin(θ2), and the coordinate of the center line along the preset direction: y = (y3+y4) / 2; S2.

3. Sort the position coordinates of all test points according to the preset direction, select the middle position point of the PCB board as the average position point ym, calculate the height difference between the average position point and the center line position point, and output the height difference dy as the PCB board offset, dy=y-ym.

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