Multilayer electronic component

Abstract

The present disclosure provides a multilayer electronic component. The multilayer electronic component includes a main body including first and second surfaces opposed in a first direction, third and fourth surfaces opposed in a second direction, and fifth and sixth surfaces opposed in a third direction, and the main body includes a capacitance forming portion, a cover portion, and a side edge portion, the capacitance forming portion includes a dielectric layer and an inner electrode arranged in a first direction, the cover portion is located on the capacitance forming portion in the first direction, and the side edge portion is located on the capacitance forming portion and the cover portion in a third direction; and an external electrode on the third surface and the fourth surface. In the first and third direction cross-sections of the main body, one or more IPs (IPs being points at which the inclination of a tangent to the outer surface of the main body is inverted) are provided in the one or more corner regions. Wlt; tlt; t, L and W are the thickness, length and width of the body, respectively.

Description

[0001] This application claims the benefit of priority to Korean Patent Application No. 10-2023-0193108, filed with the Korean Intellectual Property Office on December 27, 2023, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0002] The present disclosure relates to a multilayer electronic component. Background Art

[0003] A multilayer ceramic capacitor (MLCC), a type of multilayer electronic component, is a chip capacitor mounted on printed circuit boards of various types of electronic products such as image display devices including liquid crystal displays (LCDs) and plasma display panels (PDPs), computers, smartphones, and mobile phones, and is used for charging or discharging.

[0004] Due to its small size, high capacitance, and ease of installation, the multilayer ceramic capacitor can be used as a component in various electronic devices. With the miniaturization of various electronic devices such as computers and mobile devices and the achievement of high output power, the demand for miniaturization and high capacitance of multilayer ceramic capacitors is also increasing.

[0005] Generally, an MLCC has a structure with the same width and thickness. To achieve high capacitance, it is necessary to increase the number of layers by thinning the dielectric layer and internal electrodes. However, due to technical limitations in thinning the dielectric layer and internal electrodes, it may not be easy to achieve a high stacking number with a structure having the same width and thickness in a chip. Therefore, a high-profile ceramic capacitor (HPCC) product that achieves a high number of layers by increasing the thickness of the chip has been developed.

[0006] Since the HPCC has a structure in which its thickness T is greater than its width W, the HPCC can increase the number of layers and can easily achieve high capacitance compared to a general MLCC having the same width and thickness.

[0007] Since the number of layers in the HPCC is increased compared to a general MLCC, the contact characteristics between the internal electrodes and the external electrodes are one of the factors significantly affecting reliability. Summary of the Invention

[0008] One aspect of the present disclosure is to provide a multilayer electronic component having excellent reliability.

[0009] One aspect of the present disclosure is to provide a multilayer electronic component having improved contact characteristics between internal electrodes and external electrodes.

[0010] One aspect of the present disclosure is to provide a multilayer electronic component having a low equivalent series resistance (ESR).

[0011] One aspect of the present disclosure is to provide a multilayer electronic component that is compact and has excellent capacitance.

[0012] However, the aspects of the present disclosure are not limited to the above, and can be more easily understood during the description of specific embodiments of the present disclosure.

[0013] The multilayer electronic component according to an exemplary embodiment of the present disclosure may include: a main body including a first surface and a second surface opposite to each other in a first direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in a second direction, and a fifth surface and a sixth surface connected to the first surface to the fourth surface and opposite to each other in a third direction, and the main body includes a capacitance forming portion, a cover portion, and a side edge portion, the capacitance forming portion includes a dielectric layer and inner electrodes alternately arranged with the dielectric layer in the first direction, the cover portion is provided on two surfaces of the capacitance forming portion in the first direction, and the side edge portion is provided on two surfaces of the capacitance forming portion and the cover portion in the third direction; and an outer electrode provided on the third surface and the fourth surface. In a cross-section of the main body in the first direction and the third direction, one or more IPs are provided on the outer surface of one or more corner regions of the main body, and the IP is a point where the inclination of the tangent to the outer surface of the main body is reversed. W < T < L is satisfied, where T is the thickness of the main body in the first direction, L is the length of the main body in the second direction, and W is the width of the main body in the third direction.

[0014] One of the various effects of the present disclosure is to improve the reliability of the multilayer electronic component.

[0015] One of the various effects of the present disclosure is to improve the contact characteristics between the inner electrode and the outer electrode.

[0016] One of the various effects of the present disclosure is to provide a multilayer electronic component having a low equivalent series resistance (ESR).

[0017] One of the various effects of the present disclosure is to provide a multilayer electronic component that is compact and has excellent capacitance.

[0018] However, the advantages and effects of the present disclosure are not limited to the foregoing, and can be more easily understood during the description of specific exemplary embodiments of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Through the following specific embodiments in conjunction with the drawings, the above and other aspects, features, and advantages of the present disclosure will be more clearly understood. In the drawings: Figure 1 is a schematic perspective view of a multilayer electronic component according to an exemplary embodiment of the present disclosure; Figure 2 Is a schematic perspective view of a body of a multi-layer electronic component according to an exemplary embodiment of the present disclosure; Figure 3 Is Figure 2 A schematic view of the body excluding the side edge portion; Figure 4 Is a schematic cross-sectional view taken along line I-I' of Figure 1 ; Figure 5 Is a schematic cross-sectional view taken along line II-II' of Figure 1 ; Figure 6 Is Figure 5 An enlarged view of the K1 region of; Figure 7 Is a view corresponding to Figure 6 according to another exemplary embodiment; Figure 8 Is a view corresponding to Figure 6 according to another exemplary embodiment; Figure 9 Is a view of a substrate of a multi-layer electronic component on which Figure 1 is mounted. DETAILED DESCRIPTION

[0020] Hereinafter, exemplary embodiments of the present disclosure will be described with reference to specific exemplary embodiments and the drawings. However, the exemplary embodiments of the present disclosure can be illustrated in many different forms and should not be construed as being limited to the specific embodiments set forth herein. The exemplary embodiments disclosed herein are provided to better explain the present disclosure to those skilled in the art. Therefore, in the drawings, for clarity, the shapes and sizes of the elements may be exaggerated, and the same reference numerals will always be used to indicate the same elements.

[0021] In addition, in order to clearly describe the present disclosure in the drawings, content unrelated to the description is omitted, and the dimensions (such as thickness) of each component shown in the drawings are arbitrarily shown for ease of description. The present disclosure is not limited thereto. In addition, components having the same function within the same concept range are described using the same reference numerals. Throughout the specification, unless otherwise stated, when a specific part "includes" or "comprises" a specific component, this means that other components are not excluded and other components may be further included.

[0022] In the drawings, the first direction may be defined as the thickness direction, the second direction may be defined as the length direction, and the third direction may be defined as the width direction.

[0023] Multi-layer electronic component Figure 1 Is a schematic perspective view of a multi-layer electronic component according to an exemplary embodiment of the present disclosure.

[0024] Figure 2 is a schematic perspective view of a main body of a multi-layer electronic component according to an exemplary embodiment of the present disclosure.

[0025] Figure 3 is Figure 2 a schematic view of the main body excluding a side edge portion.

[0026] Figure 4 is along Figure 1 a schematic cross-sectional view taken along line I-I' of

[0027] Figure 5 is a schematic cross-sectional view taken along line II-II' along Figure 1 of

[0028] Figure 6 is Figure 5 an enlarged view of region K1 of

[0029] Hereinafter, the multi-layer electronic component 100 according to an exemplary embodiment of the present disclosure will be described in detail with reference to Figures 1 to 6 In addition, a multi-layer ceramic capacitor (hereinafter referred to as "MLCC") is described as an example of the multi-layer electronic component, but the present disclosure is not limited thereto, and the multi-layer electronic component of the present disclosure can also be applied to various multi-layer electronic components using ceramic materials, such as inductors, piezoelectric elements, varistors, or thermistors.

[0030] According to an exemplary embodiment of the present disclosure, the multilayer electronic component 100 may include: a main body 110 and external electrodes 131 and 132. The main body 110 includes a first surface 1 and a second surface 2 that face each other in a first direction, a third surface 3 and a fourth surface 4 that are connected to the first surface 1 and the second surface 2 and face each other in a second direction, and a fifth surface 5 and a sixth surface 6 that are connected to the first surface 1 to the fourth surface 4 and face each other in a third direction. The main body 110 includes a capacitance forming portion Ac, cover portions 112 and 113, and side edge portions 114 and 115. The capacitance forming portion Ac includes a dielectric layer 111 and internal electrodes 121 and 122 that are alternately arranged with the dielectric layer in the first direction. The cover portions 112 and 113 are provided on two surfaces of the capacitance forming portion in the first direction. The side edge portions 114 and 115 are provided on two surfaces of the capacitance forming portion Ac and the cover portions in the third direction. The external electrodes 131 and 132 are provided on the third surface 3 and the fourth surface 4. And in a cross-section of the main body in the first direction and the third direction, one or more IPs (IPs are points where the inclination of the tangent to the outer surface of the main body is reversed) may be provided in one or more corner regions. And when the thickness of the main body in the first direction (e.g., the maximum thickness or the average thickness) is referred to as T, the length of the main body in the second direction (e.g., the maximum length or the average length) is referred to as L, and the width of the main body in the third direction (e.g., the maximum width or the average width) is referred to as W, W < T < L may be satisfied. The dimensions of the main body 110 (i.e., the thickness in the first direction, the length in the second direction, and / or the width in the third direction) may be measured with a microscope based on a cross-section of the main body 110 cut through the central portion of the main body 110 (e.g., Figure 4 or Figure 5 the cross-section shown in). In one example, the dimensions of the main body 110 (i.e., the thickness in the first direction, the length in the second direction, and / or the width in the third direction) may be measured along the center line in the corresponding direction among the first direction to the third direction of the main body 110. The average dimensions of the main body 110 (i.e., the average thickness in the first direction, the average length in the second direction, and / or the average width in the third direction) may be obtained by measuring the corresponding dimensions at a plurality of points (e.g., 30 points spaced equidistantly from each other) and measuring their average values. The maximum dimensions of the main body 110 (i.e., the maximum thickness in the first direction, the maximum length in the second direction, and / or the maximum width in the third direction) may be obtained by selecting the maximum value from the corresponding dimensions obtained at a plurality of points (e.g., 30 points spaced equidistantly from each other).

[0031] According to an exemplary embodiment, one or more IPs (points where the inclination of the tangent to the outer surface of the main body is reversed) may be provided in one or more corner regions of the main body 110, and when the maximum thickness of the main body in the first direction is referred to as T, the maximum length of the main body in the second direction is referred to as L, and the maximum width of the main body in the third direction is referred to as W, W < T < L may be satisfied. Thus, the contact characteristics between the inner electrode and the outer electrode may be improved, and a high capacitance may be ensured. The reversal of the inclination of the tangent to the outer surface of the main body may represent a step change in the slope of the outer surface of the main body, and the outer surface of the main body has a concavo-convex change at the IP.

[0032] Hereinafter, each component included in the multilayer electronic component 100 according to an exemplary embodiment of the present disclosure will be described.

[0033] The main body 110 may have dielectric layers 111 stacked alternately, and inner electrodes 121 and 122.

[0034] There is no particular limitation on the specific shape of the main body 110, but as shown in the figure, the main body 110 may have a hexahedral shape or a shape similar thereto. Due to the shrinkage of the ceramic powder particles included in the main body 110 during the sintering process, the main body 110 may not have a hexahedral shape with completely straight lines.

[0035] The main body 110 may have a first surface 1 and a second surface 2 opposite to each other in the first direction, a third surface 3 and a fourth surface 4 connected to the first surface 1 and the second surface 2 and opposite to each other in the second direction, and a fifth surface 5 and a sixth surface 6 connected to the first surface 1 and the second surface 2 and connected to the third surface 3 and the fourth surface 4 and opposite to each other in the third direction.

[0036] In a state where the plurality of dielectric layers 111 included in the main body 110 are sintered, adjacent dielectric layers 111 may be integrated such that it is difficult to identify the boundary between them without using a scanning electron microscope (SEM). The number of dielectric layers is not particularly limited and may be determined by considering the size of the multilayer electronic component. For example, the main body may be formed by stacking 400 or more dielectric layers.

[0037] The dielectric layer 111 may be formed by the following method: preparing a ceramic slurry containing ceramic powder particles, an organic solvent, and a binder, coating the ceramic slurry on a carrier film and drying the ceramic slurry on the carrier film to prepare a green sheet, and then sintering the green sheet. There is no particular limitation on the ceramic powder particles as long as sufficient electrostatic capacitance can be obtained therefrom, and for example, barium titanate (BaTiO3)-based powder particles, CaZrO3-based paraelectric powder particles, etc. may be used as the ceramic powder particles. For a more specific example, the barium titanate (BaTiO3)-based powder particles may be BaTiO3, (Ba 1-x Cax )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1) and Ba(Ti 1-y Zr y )O3 (0 < y < 1), and the CaZrO3 - based paraelectric powder particles can be (Ca 1-x Sr x )(Zr 1-y Ti y )O3 (0 < x < 1, 0 < y < 1).

[0038] Therefore, the dielectric layer 111 may include BaTiO3, (Ba 1-x Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1), Ba(Ti 1-y Zr y )O3 (0 < y < 1), and (Ca 1-x Sr x )(Zr 1-y Ti y )O3 (0 < x < 1, 0 < y < 1), one or more of them.

[0039] The main body 110 may include a capacitance - forming portion Ac, and cover portions 112 and 113. The capacitance - forming portion Ac is disposed in the main body 110 and includes a first internal electrode 121 and a second internal electrode 122. The first internal electrode 121 and the second internal electrode 122 are disposed opposite to each other and the dielectric layer 111 is interposed therebetween to form a capacitance. The cover portions 112 and 113 are formed on the upper and lower portions of the capacitance - forming portion Ac in a first direction.

[0040] In addition, the capacitance - forming portion Ac is a part that contributes to the formation of the capacitance of the capacitor, and can be formed by repeatedly stacking a plurality of first internal electrodes 121 and second internal electrodes 122 with the dielectric layer 111 interposed therebetween.

[0041] The cover parts 112 and 113 may include a first cover part 112 disposed above the capacitor forming part Ac in a first direction and a second cover part 113 disposed below the capacitor forming part Ac in the first direction. The first cover part 112 may be referred to as an upper cover part, and the second cover part 113 may be referred to as a lower cover part.

[0042] The first cover part 112 and the second cover part 113 may be formed by stacking a single dielectric layer or two or more dielectric layers on the upper surface and the lower surface of the capacitor forming part Ac in a thickness direction, respectively, and may be mainly used to prevent damage to the internal electrodes due to physical stress or chemical stress.

[0043] The first cover part 112 and the second cover part 113 do not include internal electrodes and may include the same material as the dielectric layer 111.

[0044] That is to say, the first cover part 112 and the second cover part 113 may include a ceramic material and may include, for example, a barium titanate (BaTiO3)-based ceramic material.

[0045] In addition, the thicknesses of the cover parts 112 and 113 are not particularly limited. However, in order to more easily achieve miniaturization and high capacitance of the multilayer electronic component, the thickness tc of the cover parts 112 and 113 may be less than or equal to 20 μm. In addition, when the size of the multilayer electronic component 100 is 0402 (length: 0.4 mm, width: 0.2 mm), the thickness tc of the cover parts 112 and 113 may be less than or equal to 18 μm.

[0046] The average thickness tc of the cover parts 112 and 113 may refer to the dimension in the first direction and may be the average value of the dimensions in the first direction of the cover parts 112 and 113 measured at five points equidistantly spaced from each other in the upper part or the lower part of the capacitor forming part Ac.

[0047] The side edge parts 114 and 115 may be disposed on two surfaces of the capacitor forming part Ac and the cover parts 112 and 113 in a third direction.

[0048] The side edge parts 114 and 115 may include a first side edge part 114 disposed on one surface of the capacitor forming part Ac and the cover parts 112 and 113 in the third direction and a second side edge part 115 disposed on the other surface of the capacitor forming part Ac and the cover parts 112 and 113 in the third direction.

[0049] The side edge parts 114 and 115 may be formed by stacking a ceramic green sheet and a ceramic green sheet printed with an internal electrode pattern thereon, performing a sintering process on the stacked ceramic green sheets, then forming a stack including the capacitor forming part Ac and the cover parts 112 and 113, and stacking one or more ceramic green sheets on two surfaces of the stack in the third direction.

[0050] The side edge portions 114 and 115 can be mainly used to prevent damage to the inner electrodes due to physical stress or chemical stress.

[0051] In addition, the widths of the side edge portions 114 and 115 do not need to be particularly limited. However, in order to more easily achieve miniaturization and high capacitance of the multilayer electronic component, the average width Wm of the side edge portions 114 and 115 can be less than or equal to 17 μm.

[0052] The average width Wm of the side edge portions 114 and 115 can refer to the average dimension in the third direction of the regions where the inner electrodes 121 and 122 are spaced apart from the fifth surface and the average dimension in the third direction of the regions where the inner electrodes 121 and 122 are spaced apart from the sixth surface, and the average width Wm can be the average value of the third direction dimensions of the side edge portions 114 and 115 measured at five points spaced apart from each other at equal intervals in the first direction on the side surfaces in the second direction of the capacitance forming portion Ac.

[0053] Therefore, in the exemplary embodiment, the average dimension in the third direction of the region where the inner electrodes 121 and 122 are spaced apart from the fifth surface and the average dimension in the third direction of the region where the inner electrodes 121 and 122 are spaced apart from the sixth surface can be less than or equal to 17 μm, respectively.

[0054] The inner electrodes 121 and 122 can include a first inner electrode 121 and a second inner electrode 122. The first inner electrode 121 and the second inner electrode 122 can be alternately arranged opposite to each other, and the dielectric layer 111 included in the main body 110 is interposed between the first inner electrode 121 and the second inner electrode 122, and the first inner electrode 121 and the second inner electrode 122 can be respectively exposed to the third surface 3 and the fourth surface 4 of the main body 110.

[0055] The first inner electrode 121 can be spaced apart from the fourth surface 4 and can be exposed through the third surface 3, and the second inner electrode 122 can be spaced apart from the third surface 3 and can be exposed through the fourth surface 4. The first outer electrode 131 can be provided on the third surface 3 of the main body and can be connected to the first inner electrode 121, and the second outer electrode 132 can be provided on the fourth surface 4 of the main body and can be connected to the second inner electrode 122.

[0056] That is to say, the first inner electrode 121 can be connected to the first outer electrode 131 without being connected to the second outer electrode 132, and the second inner electrode 122 can be connected to the second outer electrode 132 without being connected to the first outer electrode 131. Therefore, the first inner electrode 121 can be formed to be spaced apart from the fourth surface 4 by a certain distance, and the second inner electrode 122 can be formed to be spaced apart from the third surface 3 by a certain distance.

[0057] In addition, the first inner electrode 121 and the second inner electrode 122 may be spaced apart from the fifth surface and the sixth surface of the main body 110. Both ends of the first inner electrode 121 and the second inner electrode 122 in the third direction may be in contact with the side edge portions 114 and 115.

[0058] The conductive metal included in the inner electrodes 121 and 122 may be one or more of Ni, Cu, Pd, Ag, Au, Pt, In, Sn, Al, Ti, and their alloys, and the present disclosure is not limited thereto.

[0059] The average thickness td of the dielectric layer 111 is not particularly limited and may be, for example, 0.1 μm to 10 μm. The average thickness te of the inner electrodes 121 and 122 is not particularly limited and may be, for example, 0.05 μm to 3.0 μm. In addition, the average thickness td of the dielectric layer 111 and the average thickness te of the inner electrodes 121 and 122 may be arbitrarily set according to desired characteristics or purposes. For example, in order to achieve miniaturization and high capacitance, the dielectric layer 111 may have an average thickness td of 0.45 μm or less, and the inner electrodes 121 and 122 may have an average thickness te of 0.45 μm or less.

[0060] The average thickness td of the dielectric layer 111 and the average thickness te of the inner electrodes 121 and 122 respectively refer to the first-direction dimensions of the dielectric layer 111 and the inner electrodes 121 and 122. The average thickness td of the dielectric layer 111 and the average thickness te of the inner electrodes 121 and 122 can be measured by scanning images of the cross-sections of the main body 110 in the first direction and the second direction with a scanning electron microscope (SEM) at a magnification of 10,000 times. More specifically, the average thickness td of the dielectric layer 111 can be obtained by measuring its thickness at multiple points (e.g., 30 points equally spaced from each other in the second direction) of one dielectric layer 111 and measuring the average value thereof. In addition, the average thickness te of the inner electrodes 121 and 122 can be obtained by measuring the thickness at multiple points (e.g., 30 points equally spaced from each other in the second direction) of one inner electrode 121 or 122 and measuring the average value thereof. Thirty points equally spaced from each other can be specified in the capacitance forming portion Ac. In addition, when the average value measurement is extended to each of 10 dielectric layers 111 and 10 inner electrodes 121 and 122 to measure the average value, the average thickness td of the dielectric layer 111 and the average thickness te of the inner electrodes 121 and 122 can be further generalized.

[0061] The outer electrodes 131 and 132 may be provided on the third surface 3 and the fourth surface 4 of the main body 110.

[0062] The outer electrodes 131 and 132 may include a first outer electrode 131 disposed on the third surface 3 of the main body 110 and connected to the first inner electrode 121, and a second outer electrode 132 disposed on the fourth surface 4 of the main body 110 and connected to the second inner electrode 122.

[0063] Referring Figure 1 , the outer electrodes 131 and 132 may be arranged to cover two surfaces of the side edge portions 114 and 115 in the second direction.

[0064] In an exemplary embodiment, a structure of the multi-layer electronic component 100 having two outer electrodes 131 and 132 is described, but the number or shape of the outer electrodes 131 and 132 may be changed according to the shape of the inner electrodes 121 and 122 or other purposes.

[0065] In addition, the outer electrodes 131 and 132 may be formed of any conductive material (such as a metal), and the specific material may be determined in consideration of electrical characteristics, structural stability, etc. In addition, the outer electrodes 131 and 132 may have a multi-layer structure.

[0066] For example, the outer electrodes 131 and 132 may include an electrode layer disposed on the main body 110 and a plating layer formed on the electrode layer.

[0067] For a more specific example of the electrode layer, the electrode layer may be a sintered electrode including a conductive metal and glass, or a resin-based electrode including a conductive metal and a resin.

[0068] In addition, the electrode layer may be in a form in which a sintered electrode and a resin-based electrode are sequentially formed on the main body. In addition, the electrode layer may be formed by transferring a sheet including a conductive metal to the main body, or may be formed by transferring a sheet including a conductive metal to the sintered electrode.

[0069] A material having excellent conductivity may be used as the conductive metal included in the electrode layer, and there is no particular limitation. For example, the conductive metal may be one or more of nickel (Ni), copper (Cu), and their alloys.

[0070] The plating layer is used to improve the mounting characteristics. The type of the plating layer is not particularly limited, and the plating layer may be a plating layer including at least one of Ni, Sn, Pd, and their alloys, and may be formed of multiple layers.

[0071] For a more specific example of the plating layer, the plating layer may be a Ni plating layer or a Sn plating layer, may have a form in which a Ni plating layer and a Sn plating layer are sequentially formed on the electrode layer, and may have a form in which a Sn plating layer, a Ni plating layer, and a Sn plating layer are sequentially formed. In addition, the plating layer may include multiple Ni plating layers and / or multiple Sn plating layers.

[0072] In the first and third direction cross-sections of the main body 110, one or more IPs (IPs are points where the inclination of the tangent to the outer surface of the main body is reversed) may be provided in one or more corner regions. Accordingly, the bonding characteristics between the outer electrodes 131 and 132 and the main body can be improved, and the contact characteristics between the inner electrodes 121 and 122 and the outer electrodes 131 and 132 can be improved. Since the contact characteristics between the inner electrodes 121 and 122 and the outer electrodes 131 and 132 are improved, the equivalent series resistance (ESR) can be reduced.

[0073] In addition, one of the four corner regions of the first and third direction cross-sections of the main body 110 will be described, but since the four corner regions are in a symmetric relationship, the case where an IP is provided in at least one of the four corner regions is included.

[0074] In an exemplary embodiment, the corner region may include a curved shape as Figure 5 shown.

[0075] Referring to Figure 6 ( Figure 6 is an enlarged view of the K1 region of Figure 5 ), in an exemplary embodiment, when a virtual line L1 is drawn upward along the first direction from one third direction end of the inner electrode disposed at the uppermost part in the first direction, the point where the virtual line L1 intersects the outer surface of the main body is called P1, and when a virtual line L2 is drawn along the third direction from the third direction end of the inner electrode disposed at the uppermost part in the first direction, the point where the virtual line L2 intersects the outer surface of the main body is called P2, and the IP may be provided between P1 and P2.

[0076] In an exemplary embodiment, as Figure 6 shown, only one IP may be provided between P1 and P2. However, the present disclosure is not limited thereto, and two or more IPs may be provided between P1 and P2.

[0077] In addition, two or more IPs may be provided in at least one of the corner regions.

[0078] Referring to Figure 7 ( Figure 7 is according to another exemplary embodiment and is related to Figure 6In the corresponding view), when a virtual line L1 is drawn upward along the first direction from the third-direction end of the inner electrode disposed at the uppermost part in the first direction, the point where the virtual line L1 intersects the outer surface of the main body is called P1, and when a virtual line L2 is drawn along the third direction from the third-direction end of the inner electrode disposed at the uppermost part in the first direction, the point where the virtual line L2 intersects the outer surface of the main body is called P2. When a region that is at a distance of half Wm / 2 of the average width Wm of the side edge part from P1 in the third direction is called R1 and a region that is at a distance of half tc / 2 of the average thickness tc of the cover part from P2 in the first direction is called R2, IP1 and IP2 can be included. IP1 is an IP disposed in R1, and IP2 is an IP disposed in R2. That is, R1 can refer to the region between a point or line spaced apart from P1 by Wm / 2 to one side in the third direction and a point or line spaced apart from P1 by Wm / 2 to the other side in the third direction, and the third-direction dimension of R1 can be the same as the third-direction dimension (average width Wm) of the side edge part. Similarly, R2 can refer to the region between a point or line spaced apart from P2 by tc / 2 to one side in the first direction and a point or line spaced apart from P2 by tc / 2 to the other side in the first direction, and the first-direction dimension of R2 can be the same as the first-direction dimension (average thickness tc) of the cover part.

[0079] Since one or more IPs are respectively disposed in R1 and R2, the bonding characteristics between the outer electrodes 131 and 132 and the main body can be further improved, and the contact characteristics between the inner electrodes 121 and 122 and the outer electrodes 131 and 132 can be further improved.

[0080] As Figure 7 shown, IP1 can be disposed to overlap with the capacitor forming part Ac in the first direction, and IP2 can be disposed to overlap with the capacitor forming part Ac in the third direction. IP1 can be disposed to overlap with one of the cover parts in the first direction, and IP2 can be disposed to overlap with one of the side edge parts in the third direction.

[0081] However, the present disclosure is not limited thereto, and as Figure 8 shown in Figure 8 the view corresponding to another exemplary embodiment Figure 6 one or more IPs can include IP1' and IP2'. IP1' is disposed in R1, and IP2' is disposed in R2. IP1' can be disposed not to overlap with the capacitor forming part Ac in the first direction, and IP2' can be disposed not to overlap with the capacitor forming part Ac in the third direction. IP1' can be disposed to overlap with one of the side edge parts in the first direction, and IP2' can be disposed to overlap with one of the cover parts in the third direction.

[0082] Optionally, in an exemplary embodiment, IP1 may be set to overlap with the capacitor forming portion Ac in a first direction, and IP2 may be set not to overlap with the capacitor forming portion Ac in a third direction.

[0083] Optionally, in an exemplary embodiment, IP1 may be set not to overlap with the capacitor forming portion Ac in a first direction, and IP2 may be set to overlap with the capacitor forming portion Ac in a third direction.

[0084] In an exemplary embodiment, only one IP may be provided in each of R1 and R2.

[0085] In addition, there is no need to particularly limit the method of forming the IP in the corner region. As a preferred example, the shrinkage rates of the cover portion and the side edge portion may be controlled to control the position and number of the IPs formed in the corner region. In the method of controlling the shrinkage rates of the cover portion and the side edge portion, the sintering temperature, sintering time, etc. of the sintering process may be controlled, and the components of the green ceramic sheet for forming the cover portion and the green ceramic sheet for forming the side edge portion may be controlled.

[0086] Referring to Figure 2 , when the maximum thickness of the main body 110 in the first direction is referred to as T, the maximum length of the main body 110 in the second direction is referred to as L, and the maximum width of the main body 110 in the third direction is referred to as W, W < T < L may be satisfied. When W < T is satisfied, the number of layers may be increased to easily ensure a high capacitance.

[0087] Referring to Figure 9 ( Figure 9 shows a substrate on which a Figure 1 multilayer electronic component is mounted), the multilayer electronic component may be mounted on the substrate by joining the external electrodes 131 and 132 to a pair of electrode pads 210 and 220 provided on the substrate 201 through solder 230. Since the limitation on T is less than the limitations on W and L, even if the number of layers is increased to increase T, a high capacitance can be easily ensured without significant limitations.

[0088] In an exemplary embodiment, T and W may satisfy 1.1 < T / W < 1.8. When 1.1 < T / W is satisfied, a high capacitance can be more easily ensured, and when T / W < 1.8 is satisfied, the mounting reliability on the substrate can be stably ensured.

[0089] When T / W is less than or equal to 1.1, the effect of ensuring a high capacitance according to the HPCC form may be insufficient, and when T / W is greater than or equal to 1.8, the thickness of the main body becomes significantly thick compared to its width, which may cause problems such as tilting when the multilayer electronic component is mounted on the substrate.

[0090] There is no need to particularly limit the size of the multilayer electronic component 100.

[0091] However, the effects of improving the bonding characteristics between the outer electrodes 131 and 132 and the body, and improving the contact characteristics between the inner electrodes 121 and 122 and the outer electrodes 131 and 132 according to the present disclosure can become more significant as the size of the multilayer electronic component 100 decreases.

[0092] Specifically, when the size of the multilayer electronic component 100 is 0603 (length: 0.6 mm, width: 0.3 mm) or smaller, the effects according to the present disclosure can be significant. Considering manufacturing errors and the like, when the maximum length L of the body 110 in the second direction is less than or equal to 0.69 mm, and the maximum width W of the body 110 in the third direction is less than or equal to 0.39 mm, the effects according to the present disclosure can be more significant. In this case, the maximum thickness T of the body 110 in the first direction can be less than or equal to 0.55 mm.

[0093] For a more specific example, in the case where the size of the multilayer electronic component 100 is 0603, when the maximum length L of the body 110 in the second direction is 0.51 mm to 0.69 mm, and the maximum width W of the body 110 in the third direction is 0.21 mm to 0.39 mm, the effects according to the present disclosure can be more significant. In this case, the maximum thickness T of the body 110 in the first direction can be 0.45 mm to 0.55 mm.

[0094] Here, the maximum length L of the body 110 in the second direction may refer to the maximum size of the body 110 in the second direction, the maximum width W of the body 110 in the third direction may refer to the maximum size of the body 110 in the third direction, and the maximum thickness T of the body 110 in the first direction may refer to the maximum size of the body 110 in the first direction.

[0095] Although the exemplary embodiments of the present disclosure have been described in detail above, the present disclosure is not limited to the above embodiments and drawings, but is defined by the appended claims. Therefore, those of ordinary skill in the art can make various substitutions, variations or modifications without departing from the scope of the present disclosure defined by the appended claims, and these substitutions, variations or modifications should be construed as being included within the scope of the present disclosure.

[0096] In addition, the expression "exemplary embodiment" used in the present disclosure does not mean the same embodiment, and is provided to emphasize and explain different unique features. However, the embodiments presented above do not exclude the combination of features with another embodiment. For example, although the content described in a specific embodiment is not described in another embodiment, unless there is a description contrary to or contradictory to that content in another embodiment, that content can be understood as a description related to another embodiment.

[0097] In this disclosure, the terms are used only for describing particular embodiments and are not intended to limit this disclosure. Unless the context clearly dictates otherwise, the singular forms may also include the plural forms.

Claims

1. A multi-layer electronic component, comprising: A main body, including a first surface and a second surface opposite to each other in a first direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in a second direction, and a fifth surface and a sixth surface connected to the first surface to the fourth surface and opposite to each other in a third direction, and the main body includes a capacitance forming portion, a cover portion, and a side edge portion. The capacitance forming portion includes a dielectric layer and internal electrodes alternately arranged with the dielectric layer in the first direction. The cover portion is disposed on two surfaces of the capacitance forming portion in the first direction. The side edge portion is disposed on two surfaces of the capacitance forming portion and the cover portion in the third direction; And External electrodes, disposed on the third surface and the fourth surface, Wherein, in a cross-section of the main body in the first direction and the third direction, one or more IPs are provided on the outer surface of one or more corner regions of the main body. The IP is a point where the inclination of the tangent to the outer surface of the main body is reversed, and Satisfies W < T < L, where T is the thickness of the main body in the first direction, L is the length of the main body in the second direction, and W is the width of the main body in the third direction.

2. The multilayer electronic component according to claim 1, wherein The corner region includes a curved shape.

3. The multilayer electronic component according to claim 1, wherein: When a first virtual line is drawn upward along the first direction from the third direction end of the internal electrode disposed in the uppermost part in the first direction, the point where the first virtual line intersects the outer surface of the main body is called P1, and when a second virtual line is drawn along the third direction from the third direction end of the internal electrode disposed in the uppermost part in the first direction, the point where the second virtual line intersects the outer surface of the main body is called P2, The IP is provided between P1 and P2.

4. The multilayer electronic component according to claim 3, wherein: Only one IP is provided between P1 and P2.

5. The multilayer electronic component according to claim 3, wherein: Two or more IPs are provided between P1 and P2.

6. The multilayer electronic component according to claim 1, wherein: Two or more IPs are provided in at least one corner region of the corner region.

7. The multilayer electronic component according to claim 1, wherein: When a first virtual line is drawn upward along the first direction from the third direction end of the internal electrode disposed in the uppermost part in the first direction, the point where the first virtual line intersects the outer surface of the main body is called P1, and when a second virtual line is drawn along the third direction from the third direction end of the internal electrode disposed in the uppermost part in the first direction, the point where the second virtual line intersects the outer surface of the main body is called P2, and When a region at a distance of half of the average width of the side edge portion from P1 in the third direction is called R1, and a region at a distance of half of the average thickness of the cover portion from P2 in the first direction is called R2, The one or more IPs include IP1 and IP2. IP1 is provided in R1, and IP2 is provided in R2.

8. The multilayer electronic component according to claim 7, wherein: IP1 is arranged to overlap with the capacitance forming portion in the first direction, and IP2 is arranged to overlap with the capacitance forming portion in the third direction.

9. The multilayer electronic component according to claim 7, wherein: IP1 is arranged to overlap one of the cover parts in the first direction, and IP2 is arranged to overlap one of the side edge portions in the third direction.

10. The multilayer electronic component according to claim 7, wherein Only one IP is set in each of R1 and R2.

11. The multilayer electronic component according to claim 1, wherein T and W meet 1.1 <T / W<1.8。 12. The multilayer electronic component according to claim 1, wherein L is less than or equal to 0.69 mm, and W is less than or equal to 0.39 mm.

13. The multilayer electronic component according to claim 12, wherein: T is less than or equal to 0.55mm.

14. The multilayer electronic component according to claim 1, wherein The thickness of the body refers to the maximum thickness of the body in the first direction, the length of the body refers to the maximum length of the body in the second direction, and the width of the body refers to the maximum width of the body in the third direction.

15. The multilayer electronic component according to claim 1, wherein The thickness of the body refers to an average thickness of the body in the first direction, the length of the body refers to an average length of the body in the second direction, and the width of the body refers to an average width of the body in the third direction.

16. The multilayer electronic component according to claim 7, wherein: IP1 is arranged to overlap one of the side edge portions in the first direction, and IP2 is arranged to overlap one of the cover parts in the third direction.

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