Electronic device

Abstract

The electronic equipment comprises a shell, a fan and a heat dissipation device, the shell comprises a middle frame and a rear cover, the middle frame comprises a middle plate and a frame, the frame is arranged on the middle plate in a surrounding mode, the rear cover is assembled on the frame, the rear cover is provided with a decoration part, the decoration part is provided with one or more camera mounting holes and an air inlet hole, the shell is further provided with an air outlet hole, and the air outlet hole is communicated with the fan. The air inlet hole and the air outlet hole are communicated to form an air channel, the fan is arranged in the shell and located in the air channel, and at least part of the heat dissipation device is exposed in the air channel. The fan is used for driving the airflow to perform convection heat dissipation with the heat dissipation device exposed in the air duct, so that the heat dissipation capability of the electronic equipment can be effectively improved. Meanwhile, due to the fact that the air inlet holes are formed in the decorating part, other space of the electronic equipment cannot be additionally occupied, and due to the fact that the decorating part protrudes out of the rear cover of the electronic equipment, the draught fan has a larger arrangement space in the thickness direction, and the size of the whole electronic equipment in the thickness direction is reduced.

Description

Technical Field

[0001] The present application relates to the field of consumer electronic products, and in particular to an electronic device. Background Art

[0002] At present, the size of electronic devices such as mobile phones is getting smaller and smaller, the performance is getting higher and higher, the heat generation is getting higher and higher, and the demand for heat dissipation is also getting higher and higher. Generally speaking, electronic devices mostly use passive heat dissipation. The passive heat dissipation method is to transfer the heat from the parts with high heat generation to various parts of the body through thermal conductive materials to achieve heat dissipation. Two heat dissipation methods are often used: longitudinal and transverse. Longitudinal heat dissipation refers to transferring the heat of the chip to the heat dissipation device above the chip through thermal conductive materials to accelerate the heat transfer between the chip and the heat dissipation device: transverse heat dissipation refers to dispersing the heat through thermal conductive materials to increase the heat dissipation area and accelerate the heat transfer between the heat dissipation device and the outside world.

[0003] These heat dissipation methods can maintain good heat dissipation effects when electronic devices are used at low power consumption. However, when electronic devices are used at high power consumption, the heat dissipation requirements are higher. The heat dissipation effect of this heat dissipation method is insufficient, which may cause the operation of the electronic devices to be stuck or even overheated. Summary of the invention

[0004] The present application provides an electronic device that can improve the above technical problems and enhance the heat dissipation effect.

[0005] An embodiment of the present application provides an electronic device, including a shell, a fan and a heat dissipation device, the shell including a middle frame and a back cover, the middle frame including a middle plate and a frame, the frame is arranged around the middle plate, the back cover is assembled on the frame, the back cover is provided with a decorative piece, the decorative piece is provided with one or more camera mounting holes and an air inlet hole, the shell is also provided with an air outlet hole, the air inlet hole and the air outlet hole are connected to form an air duct, the fan is arranged in the shell, the fan is located in the air duct, and the heat dissipation device is at least partially exposed in the air duct.

[0006] The electronic device provided in the embodiment of the present application can effectively improve the heat dissipation capacity of the electronic device by setting an air inlet hole on the decorative part, forming an air duct in the housing, setting a fan in the air duct, and using the fan to drive the airflow and the heat dissipation device exposed in the air duct for convection heat dissipation. At the same time, since the air inlet hole is set on the decorative part, it will not occupy other space of the electronic device, and since the decorative part itself protrudes from the back cover of the electronic device, the fan has a larger setting space in the thickness direction, so that the thickness of the entire electronic device can be reduced.

[0007] These and other aspects of the present application will become more clearly understood in the description of the following embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] To more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present application. For those skilled in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0009] Figure 1 It is a schematic structural diagram of an electronic device provided by an embodiment of the present application.

[0010] Figure 2 It is a schematic structural diagram of an electronic device provided by an embodiment of the present application from another perspective.

[0011] Figure 3 It is a schematic cross-sectional structure diagram of an electronic device provided by an embodiment of the present application.

[0012] Figure 4 is Figure 3 an enlarged view of part A in

[0013] Figure 5 It is a schematic partial cross-sectional structure diagram of another electronic device provided by an embodiment of the present application. Detailed implementation manners

[0014] The following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some embodiments of the present application, rather than all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present application.

[0015] Currently, the volume of electronic devices such as mobile phones is getting smaller, the performance is getting higher, the heat generation is getting larger, and the demand for heat dissipation is also getting higher. Generally speaking, electronic devices mostly adopt passive heat dissipation methods. The passive heat dissipation method conducts the heat of the parts with large heat generation to all parts of the fuselage through heat-conducting materials, and usually adopts two heat dissipation methods: longitudinal and transverse. Longitudinal heat dissipation means that the heat of the chip is conducted to the heat dissipation device above the chip through heat-conducting materials to accelerate the heat transfer between the chip and the heat dissipation device; transverse heat dissipation means that the heat is dispersed through heat-conducting materials to increase the heat dissipation area and accelerate the heat transfer between the heat dissipation device and the outside.

[0016] These heat dissipation methods can maintain good heat dissipation effects when the electronic device is used with low power consumption. However, when the electronic device is used with high power consumption and the heat dissipation demand is high, the heat dissipation effect of this heat dissipation method is insufficient, which may cause the operation of the electronic device to be stuck or even overheat. Based on this, the inventors of the present application have proposed an electronic device to at least partially overcome the above technical defects.

[0017] The following will specifically describe the embodiments of the present application in conjunction with the accompanying drawings.

[0018] Please refer to Figure 1 and Figure 2 , this embodiment provides an electronic device 10, which includes a housing 200, a main board 600, a decorative member 100, a camera 300, a blower 400 ( Figure 3 shown in Figure 3 ) and a heat dissipation device 500 ( Figure 3 shown in

[0019] ). Among them, the main board 600, the camera 300, the blower 400 and the heat dissipation device 500 are all arranged in the housing 200, and the decorative member 100 is arranged on the housing 200 and can be used as part of the decoration of the camera 300 and is exposed as part of the appearance surface of the electronic device 10.

[0019] It can be understood that the electronic device 10 in the present application can be a mobile phone or a smart phone (for example, a phone based on iPhone TM, an Android TM-based phone), a portable game device (for example, Nintendo DS TM, PlayStation Portable TM, Gameboy Advance TM, iPhone TM), a laptop computer, a PDA, a portable Internet device, a music player and a data storage device, other handheld devices and such as watches, earphones, pendants, earbuds, etc. The electronic device 10 can also be other wearable devices (for example, head-mounted devices (HMD) such as electronic glasses, electronic clothes, electronic bracelets, electronic necklaces, electronic tattoos, the electronic device 10 or smart watches). In this embodiment, the electronic device 10 is taken as a mobile phone as an example for introduction.

[0020] Refer to Figure 3 , the housing 200 may include a middle frame 220 and a rear cover 210, where the middle frame 220 has two opposite sides. The rear cover 210 is assembled on one side of the middle frame 220, and the rear cover 210 can be used to set the camera 300 components. In some embodiments, the rear cover 210 can also be provided with a display screen, which is not limited herein. After the middle frame 220 and the rear cover 210 are assembled, a receiving space 230 can be formed, and the receiving space 230 is used to accommodate various components of the electronic device 10.

[0021] Please refer to Figure 1 and Figure 3 , the rear cover 210 is provided with a mounting hole 203, and the mounting hole 203 penetrates through the rear cover 210. The mounting hole 203 is adapted to cooperate with the decorative member 100, and the decorative member 100 can be assembled in the mounting hole 203. It can be understood that the mounting hole 203 can be opened at any position of the rear cover 210, which is not limited herein.

[0022] In this embodiment, the rear cover 210 includes opposite first and second edges 211 and 212 and opposite third and fourth edges 213 and 214. The third edge 213 and the fourth edge 214 are connected between the first edge 211 and the second edge 212. The first edge 211 and the second edge 212 are disposed substantially along the length direction of the electronic device 10, and the third edge 213 and the fourth edge 214 are disposed substantially along the width direction of the electronic device 10. As a more specific implementation manner, in this embodiment, the mounting hole 203 may be disposed adjacent to the first edge 211. It can be understood that, in some other embodiments, the mounting hole 203 may also be disposed in other areas of the rear cover 210.

[0023] The mounting hole 203 may be a slotted hole, or may be holes with various cross-sections such as circular holes and square holes. In this embodiment, only as an example, the mounting hole 203 is a slotted hole and extends along the length direction of the rear cover 210, where the length direction of the rear cover 210 is the length direction of the electronic device 10, and the mounting hole 203 is disposed near the end of the rear cover 210 along the length direction to reserve sufficient space for arranging other components such as the battery. Of course, the above setting manner is not necessary. According to specific design requirements, the mounting hole 203 may be opened in any position of the rear cover 210 in any direction, and is not limited herein. The portion of the rear cover 210 where the mounting hole 203 is not provided can be used to cover components such as the battery and the main board 600 disposed in the accommodation space.

[0024] Please refer to again Figure 2 , the middle frame 220 includes a middle plate 221 and a frame 222. The frame 222 surrounds the middle plate 221, and the frame 222 protrudes from the middle plate 221. The rear cover 210 is assembled to the frame 222 of the middle frame 220. The rear cover 210, the frame 222, and the middle plate 221 enclose an accommodation space. The main board 600 is installed on the middle frame 220 of the housing 200 and is specifically located on the surface of the middle frame 220 facing the rear cover 210. Components such as the main board (not shown) may be disposed in the accommodation space 230. One or more processors, memories, and circuit structures may be integrated or disposed on the main board.

[0025] Among them, the processor may include one or more processing cores. The processor uses various interfaces and circuits to connect various parts within the entire electronic device 10, and by running or executing instructions, programs, code sets, or instruction sets stored in the memory, as well as calling data stored in the memory, it executes various functions of the electronic device 10 and processes data. Optionally, the processor may be implemented in at least one hardware form of digital signal processing (DSP), field-programmable gate array (FPGA), or programmable logic array (PLA). The processor may integrate a combination of one or several of a central processing unit (CPU), a graphics processing unit (GPU), and a modem, etc. Among them, the CPU mainly processes the operating system, user interface, application programs, etc.; the GPU is responsible for rendering and drawing display content; the modem is used to process wireless communication. It can be understood that the above-mentioned modem may not be integrated into the processor and may be implemented separately through a communication chip.

[0026] The memory may include random access memory (RAM) and may also include read-only memory (ROM). The memory can be used to store instructions, programs, code, code sets, or instruction sets. The memory may include a program storage area and a data storage area. Among them, the program storage area may store instructions for implementing the operating system, instructions for implementing at least one function (such as touch function, sound playback function, image playback function, etc.), instructions for implementing the following various method embodiments, etc. The data storage area may also store data created during the use of the electronic device 10 (such as phone book, audio and video data, chat record data, etc.).

[0027] Please refer to Figure 3 and Figure 4 , the housing 200 is also provided with an air outlet hole 223. The air inlet hole 102 and the air outlet hole 223 are communicated to form an air duct 30. The air duct 30 refers to the path for the airflow to flow. In this embodiment, the air outlet hole 223 is communicated with the accommodation space 230, and the air inlet hole 102 is communicated with the accommodation space 230. When the airflow enters from the air inlet hole 102, it can flow out from the air outlet hole 223.

[0028] In this embodiment, the air outlet hole 223 is formed in the frame 222. Specifically, it is provided at a part of the frame 222 close to the rear cover, and the air outlet hole 223 penetrates through the frame 222. By arranging the air outlet hole 223 in the frame 222, when the air flow enters the air duct 30 from the air inlet hole 102 and flows out from the air outlet hole 223, during this process, the moving direction of the air flow is changed. Therefore, the air flow path can be extended, the contact time between the air flow and the heat dissipation device 500 and the heat exchange effect can be increased, and the heat dissipation effect is better. It can be understood that in some other embodiments, the air outlet hole 223 can be formed at any other position of the housing 200, as long as it can ensure that the air inlet hole 102 and the air outlet hole 223 are connected to form the air duct 30.

[0029] In this embodiment, the electronic device 10 further includes a display screen 50. The display screen 50 is assembled on the frame 222 and is located on the opposite sides of the middle plate 221 from the rear cover 210. The display screen 50 can adopt an LCD (Liquid Crystal Display) screen for displaying information. The LCD screen can be a TFT (Thin Film Transistor) screen, an IPS (In-Plane Switching) screen, or an SLCD (Splice Liquid Crystal Display) screen. In some other embodiments, the main screen 120 can adopt an OLED (Organic Light-Emitting Diode) screen for displaying information. The OLED screen can be an AMOLED (Active Matrix Organic Light Emitting Diode) screen, a Super AMOLED (Super Active Matrix Organic Light Emitting Diode) screen, or a Super AMOLED Plus (Super Active Matrix Organic Light Emitting Diode Plus) screen, which will not be elaborated here.

[0030] The camera 300 is disposed on the main board and can expose from the mounting hole 203 to obtain external light and then form an image. It can be understood that the number of cameras 300 can be one or more, and the camera 300 includes but is not limited to a telephoto camera, a wide-angle camera, a macro camera, etc., which are not limited here.

[0031] Please refer to again Figure 1, the decorative member 100 can be assembled into the mounting hole 203 and adapted to the structure of the mounting hole 203. For example, when the mounting hole 203 is a slotted hole, the decorative member 100 can be configured as a strip adapted to the structure of the mounting hole 203. When the mounting hole 203 is a square hole, the decorative member 100 can be configured as a square adapted to the structure of the mounting hole 203, etc. It can be understood that the structure of the decorative member 100 being adapted to the structure of the mounting hole 203 means that the decorative member 100 can be assembled into the mounting hole 203, and does not specifically mean that the structures of the two are exactly the same. For example, when the mounting hole 203 is a circular hole, at this time, the decorative member 100 can be circular or square. When the decorative member 100 is assembled into the mounting hole 203, it can close the mounting hole 203 to prevent external dust and moisture from entering the interior of the housing 200.

[0032] The decorative member 100 is provided with one or more camera mounting holes 101. It can be understood that, in some embodiments, the number of camera mounting holes 101 can be in one-to-one correspondence with the number of cameras 300, and each camera 300 can correspondingly expose from one camera mounting hole 101. In some embodiments, one camera mounting hole 101 can also be correspondingly provided with multiple cameras 300. When there are multiple camera mounting holes 101, the multiple camera mounting holes 101 can be arranged in any manner, such as linear arrangement, array arrangement, circular arrangement, etc. In this embodiment, the number of cameras 300 is two, and the decorative member 100 is provided with two camera mounting holes 101, and each camera mounting hole 101 is provided corresponding to one camera 300. Only as an example, in this embodiment, the decorative member 100 has a length direction, and the length direction of the decorative member 100 is substantially the same as the length direction of the housing 200, and the two camera mounting holes 101 are arranged side by side along the length direction of the decorative member 100. This setting method is beneficial to the layout of other components in the electronic device 10, such as the layout of the battery and the main board 600 in the electronic device 10. Of course, it can be understood that the decorative member 100 can also be set in any other form, and this embodiment does not make specific limitations.

[0033] The decorative member 100 can be made of plastic material and can form a camera mounting hole 101 by an integral molding method. In some embodiments, the decorative member 100 can also be decorated with patterns, colors, etc., which are not limited herein. In this embodiment, the decorative member 100 includes a decorative portion 103 and an insertion portion 104. The decorative portion 103 is generally in a plate-like structure. The insertion portion 104 is connected to the surface of the decorative portion 103. The decorative portion 103 is disposed on the outer surface of the rear cover 210 and fits with the outer surface of the rear cover 210. The insertion portion 104 is inserted into the mounting hole 203, and the insertion portion 104 is generally disposed along the wall of the mounting hole 203. The insertion portion 104 can form an annular structure to improve the sealing performance after the decorative member 100 is installed. The camera mounting hole 101 is opened in the decorative portion 103. Since the decorative portion 103 protrudes outward from the rear cover 210 of the electronic device 10, when the camera 300 is disposed, there is a larger setting space in the thickness direction of the electronic device 10, which is conducive to setting a larger camera 300 and improving the image acquisition effect.

[0034] During assembly, the decorative member 100 can close the mounting hole 203 on the rear cover and only expose the position of the camera mounting hole 101, playing a role in decorating and protecting the camera 300. In some embodiments, the decorative member 100 can further include one or more transparent covers. The transparent covers can be disposed on the decorative portion 110 and cover the camera mounting hole 101, thereby playing a protective role for the camera 300 disposed in the camera mounting hole 101. The transparent covers can transmit light, so they will not affect the light collection of the camera 300.

[0035] The decorative member 100 is also provided with an air inlet hole 102 for air intake. Specifically, the air inlet hole 102 can be disposed on the decorative portion 103. In some embodiments, the air inlet hole 102 can have the same size as the camera mounting hole 101. This setting method can make the appearance of the entire decorative member 100 more consistent and will not look obtrusive due to the setting of the air inlet hole 102. To prevent dust or moisture from entering through the air inlet hole 102, a filter net 105 can be disposed at the air inlet hole 102, and the filter net 105 can be fixed on the decorative portion 103. It can be understood that the filter net 105 can be configured in various forms, which is not limited in this embodiment.

[0036] It can be understood that the number of the air inlet holes 102 can be one or more, which is not limited in this embodiment.

[0037] The blower 400 is disposed in the housing 200, and the blower 400 is located in the air duct 30. It can be understood that the blower 400 is located in the air duct 30, which does not specifically mean that the whole blower 400 is located in the air duct 30, but means that when the blower 400 works, a flowing air current can be formed in the air duct 30.

[0038] The blower 400 can be various types of blowers 400. For example, the blower 400 can be a centrifugal blower 400, and this embodiment does not limit this. In this embodiment, the blower 400 is generally arranged corresponding to the air inlet hole 102 and is used to drive air flow to flow into the air duct 30 from the air inlet hole. After the air flow flows into the air duct 30, it flows out from the air outlet hole. As a more specific implementation manner, the rotation axis of the blower 400 can be coaxially arranged with the axis direction of the air inlet hole 102. This implementation manner has the following advantages: Since the air inlet hole 102 is opened on the decorative member 100 and protrudes from the outer surface of the rear cover 210 in the thickness direction, when the blower 400 is arranged corresponding to the air inlet hole 102, the blower 400 can partially extend into the air inlet hole 102 during installation. In this way, without changing the thickness parameter of the electronic device 10, a blower 400 with a larger thickness dimension can be accommodated, a blower 400 with a larger power can be set, the air flow convection rate can be increased, and thus the heat dissipation effect can be enhanced.

[0039] In this embodiment, the blower 400 includes a base 410 and a fan blade 420. The base 410 is arranged on the middle plate 221 of the middle frame 220, that is, fixedly connected to the middle plate 221 of the middle frame 220. The fan blade 420 is rotatably arranged on the base 410 and corresponds to the air inlet hole 102. When the fan blade 420 rotates, an air flow is formed in the air duct 30.

[0040] The heat dissipation device 500 is used to dissipate heat from the heat generating components inside the electronic device 10. The heat generating components include but are not limited to the main board, battery, chip 60, display screen 50, and so on. The heat dissipation device 500 can be a heat sink, such as a graphene heat sink, a metal heat sink, and so on. The heat dissipation device 500 can also be a heat pipe device. A heat pipe medium can be filled in the heat pipe device. The heat pipe medium can be water, for example, and this embodiment does not limit this.

[0041] In this embodiment, the heat dissipation device 500 includes a vapor chamber 510 and a heat conducting member 520. The vapor chamber 510 is used to be thermally coupled with the heat generating components, and thus absorb and disperse the heat generated by the heat generating components. It can be understood that the vapor chamber 510 can transfer heat directly in contact with the heat generating components or indirectly through a heat conducting element. The heat conducting element can be a heat conducting adhesive, a heat conducting metal, etc., and this embodiment does not limit this. In this embodiment, the vapor chamber 510 is a generally plate-like structure. A heat conducting medium is filled inside the vapor chamber 510, and the heat conducting medium is water. The vapor chamber 510 is attached to the surface of the display screen 50 facing the middle plate 221. In this way, the heat generated by the display screen 50 can be directly conducted to the vapor chamber 510 and dispersed by the vapor chamber 510. At the same time, the vapor chamber 510 is attached to the surface of the middle plate 221 facing the display screen 50. In this way, the heat generated by the main board and the chip arranged on the main board can be directly transferred to the vapor chamber 510 through the middle frame 220.

[0042] The heat conducting member 520 is thermally coupled to the heat sink plate 510. The heat conducting member 520 can be components such as thermal conductive glue. In this embodiment, the heat conducting member 520 is a heat conducting sheet supported by copper, which has a relatively large thermal conductivity and can transfer heat quickly. The heat conducting member 520 can transfer heat by directly contacting the heat sink plate 510, or can transfer heat indirectly through the heat sink plate 510. In this embodiment, the heat conducting member 520 directly contacts at least a part of the heat sink plate 510 to transfer heat, so that the heat of the heating element absorbed by the heat sink plate 510 can be directly transferred to the heat conducting member 520 for diffusion. Specifically, in this embodiment, the middle plate 221 is provided with a through hole 224, the heat conducting member 520 passes through the through hole 224, and one side surface of the heat conducting member 520 is attached to the heat sink plate 510 to transfer heat.

[0043] At least a part of the heat conducting member 520 is exposed in the air duct 30, and then convective heat exchange is carried out with the air flow in the air duct 30. In this embodiment, the other side surface of the heat conducting member 520 is exposed in the air duct 30. It can be understood that being exposed in the air duct 30 means that at least a part is located in the air duct 30 and can carry out convective heat exchange with the air flow flowing through the air duct 30.

[0044] In order to further improve the heat convection efficiency and the heat dissipation efficiency, in this embodiment, the base 410 of the fan 400 can also contact the heat conducting member 520 to transfer heat or transfer heat through a heat conducting element. At the same time, the middle plate 221 of the middle frame 220 can also direct part of the heat to the base 410 of the fan 400. Since the fan 400 is located in the air duct 30, the base 410 is also at least partially located in the air duct 30. During the process of the fan 400 starting to form an air flow, the air flow can exchange heat with the base 410 and then take away the heat on the base 410, which can increase the heat exchange area and improve the heat exchange effect.

[0045] Further, please continue to refer to Figure 3 and Figure 4 , the fan 400 can also include heat dissipation fins 430. The heat dissipation fins 430 are arranged on the base 410 and are located in the air duct 30. The heat dissipation fins 430 can be one or more, and this embodiment does not limit this. In this embodiment, there are multiple heat dissipation fins 430. The multiple heat dissipation fins 430 can be evenly distributed around the rotation axis of the fan blade 420, and the multiple heat dissipation fins 430 can also be arranged around the outside of the fan blade 420. In this way, when the fan blade 420 of the fan 400 rotates, the air flow generated in the circumferential direction of the fan blade 420 will immediately carry out convective heat exchange with the heat dissipation fins 430. At this time, the temperature of the air flow is still relatively low, so the heat exchange efficiency will be higher.

[0046] To further improve the heat convection efficiency, the base 410 and the heat dissipation fins 430 can be made of materials with relatively high thermal conductivity, such as metal materials like copper and aluminum. Moreover, the base 410 and the heat dissipation fins 430 can be combined in an integrally formed manner, which is convenient for reducing the manufacturing cost and can also increase the thermal conductivity of the entire fan 400.

[0047] The working principle of the electronic device 10 provided in this embodiment is as follows:

[0048] During the use of the electronic device 10, part of the heat generated by the heating element is conducted to the air duct 30 through the heat spreader 510 and the heat conducting member 520 of the heat dissipation device 500. At the same time, part of the heat generated by the heating element is transferred to the base 410 and the heat dissipation fins 430 of the fan 400 through the middle frame 220. When the fan blade 420 starts, it drives the air flow to flow in the air duct 30, and the flowing air exchanges convective heat with the fan 400 and the heat conducting member 520, thereby taking away the heat.

[0049] During the startup process of the fan 400, to improve the heat exchange effect, the path of the air duct 30 can also be shortened. For example, in this embodiment, the decorative member 100 is disposed adjacent to the first edge 211, and the air outlet hole 223 is opened on the first edge 211. The advantage of this setting method is that after the air flow enters the air duct 30, it can quickly discharge from the air outlet hole 223. In this way, after the air flow exchanges heat with the heat dissipation device 500 and the fan 400, it can be quickly discharged, and the air flow will not contact other non-heating elements in the electronic device 10 to generate heat exchange, which can ensure that the air temperature for heat exchange with the heat dissipation device 500 and the fan 400 is relatively low, improving the heat exchange effect. It can be understood that in some other embodiments, the air outlet hole 223 can also be disposed on the second edge 212, the third edge 213, or the fourth edge 214, and this embodiment does not make any limitations in this regard.

[0050] Further, the axial direction of the air outlet hole 223 can also be set to be inclined with respect to the outer surface of the frame 222, that is, the included angle between the axial direction of the air outlet hole 223 and the outer surface of the frame 222 is less than 90°, or the axial direction of the air outlet hole 223 is not parallel to the plane direction of the middle plate 221, and the end of the air outlet hole 223 located on the inner surface of the frame 222 is closer to the rear cover 210 than the end of the air outlet hole 223 located on the outer surface of the frame 222. The advantage of this implementation is that when the fan 400 is started, the air flow enters from the air inlet hole 102 of the decorative member 100 provided on the rear cover 210 and is driven by the fan 400 to flow towards the air outlet hole 223. The flow direction of the air flow is generally the same as the axial direction of the air outlet hole 223, and no eddy current will be formed in the air duct 30, generating eddy current noise and affecting the normal use of the user. At the same time, since the air outlet hole 223 is inclined with respect to the outer surface of the frame 222, when the air flow flows out from the air outlet hole 223, it can have a longer contact area with the frame 222, and the heat exchange with the middle frame 220 will be more sufficient, which can improve the heat dissipation efficiency.

[0051] In some embodiments, to improve the dust and water resistance of the electronic device 10, refer to Figure 5 , a one-way valve piece 105 can also be provided at the air inlet hole 102 of the decorative member 100. The one-way valve piece 105 can be configured to open unidirectionally only under the air flow driven by the fan 400 when the fan 400 is started. In this way, when the fan 400 is not started, the one-way valve piece 105 can close the air inlet hole 102, which can prevent external dust and the like from entering the interior of the electronic device 10. In some embodiments, the fan 400 can be electrically connected to the processor, and the fan 400 can be configured to be controlled by the processor to start when the first preset condition is met and to be controlled by the processor to turn off when the second preset condition is met. The first preset condition can be, for example, that the temperature inside the electronic device 10 is greater than or equal to the first preset threshold, and the first preset threshold can be, for example, 40 - 45 °C. The second preset condition can be, for example, that the temperature inside the electronic device 10 is greater than or equal to the second preset threshold, and the second preset threshold can be, for example, 35 - 40 °C, etc.

[0052] The electronic device 10 provided by the embodiment of the present application forms an air duct 30 in the housing 200 by arranging an air inlet hole 102 on the decorative member 100, and arranges the fan 400 in the air duct 30. By using the fan 400 to drive the air flow to perform convective heat dissipation with the heat dissipation device 500 exposed in the air duct 30, the heat dissipation capacity of the electronic device 10 can be effectively improved. At the same time, since the air inlet hole 102 is arranged on the decorative member 100, it does not additionally occupy other spaces of the electronic device 10. And because the decorative member 100 itself protrudes from the rear cover 210 of the electronic device 10, in the thickness direction, the fan 400 has a larger installation space, so that the size of the entire electronic device 10 in the thickness direction can be thinned.

[0053] The foregoing is only the preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, various changes and modifications can be made to the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included within the protection scope of the present application.

Claims

1. An electronic device, characterized in that: include: A housing, wherein the housing comprises a middle frame and a back cover, the middle frame comprises a middle plate and a frame, the frame is arranged around the middle plate, the back cover is assembled to the frame, the back cover is provided with a decorative piece, the decorative piece is provided with one or more camera mounting holes and an air inlet, the housing is further provided with an air outlet, the air inlet and the air outlet are connected to form an air duct; A fan, the fan is arranged in the housing, and the fan is located in the air duct; as well as A heat dissipation device is at least partially exposed in the air duct.

2. The electronic device according to claim 1, characterized in that: The fan is arranged corresponding to the air inlet.

3. The electronic device according to claim 2, characterized in that: The rotation axis of the fan is coaxially arranged with the axis of the air inlet hole.

4. The electronic device according to claim 1, characterized in that: The air outlet is arranged on the frame.

5. The electronic device according to claim 4, characterized in that: The axial direction of the air outlet is inclined relative to the outer surface of the frame.

6. The electronic device according to claim 4, characterized in that: The back cover includes a first edge and a second edge relative to each other and a third edge and a fourth edge relative to each other, wherein the third edge and the fourth edge are connected between the first edge and the second edge, the decorative element is arranged adjacent to the first edge, and the air outlet is opened at the first edge.

7. The electronic device according to claim 1, characterized in that: The heat dissipation device includes a vapor chamber and a heat conducting member, wherein the vapor chamber is used for thermal coupling with the heating element, the heat conducting member is thermally coupled with the vapor chamber, and the heat conducting member is at least partially exposed in the air duct.

8. The electronic device according to claim 7, characterized in that: The fan comprises a base and fan blades, and the base is connected to the heat conducting member and / or the middle frame.

9. The electronic device according to claim 8, characterized in that: The fan further comprises heat dissipation fins, which are arranged on the base and located in the air duct.

10. The electronic device according to claim 7, characterized in that: The electronic device also includes a display screen, which is assembled on the frame and is located on two opposite sides of the middle plate with the back cover. The middle plate is provided with a through hole, the heat spreader is attached to the display screen, the heat conductor is passed through the through hole, one side surface of the heat conductor is attached to the heat spreader, and the other side surface is exposed in the air duct.

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