Base station heat dissipation system

Abstract

The invention discloses a base station heat dissipation system, and relates to the technical field of base station heat dissipation, the base station heat dissipation system comprises a shell, a mounting groove is formed in the shell, and a power amplifier module, a digital unit module and a power supply module are arranged in the mounting groove; a first heat dissipation unit and a second heat dissipation unit are arranged on the outer bottom wall of the shell, the first heat dissipation unit corresponds to the power amplifier module in position, and the second heat dissipation unit corresponds to the digital unit module in position; the first heat dissipation unit and the second heat dissipation unit are isolated through a first isolation groove, and the first isolation groove is located at the boundary of the power amplifier module and the digital unit module. Heat generated by the power amplifier module is mainly dissipated through the first heat dissipation unit, heat generated by the digital unit module is mainly dissipated through the second heat dissipation unit, the first heat dissipation unit and the second heat dissipation unit are isolated through the first isolation groove, and the heat of the power amplifier module is effectively prevented from being transmitted to the digital unit module. Abnormal heat dissipation of main chips such as an FPGA influencing the digital board module is avoided, and the heat dissipation effect is improved.

Description

Technical Field

[0001] This application relates to the technical field of base station heat dissipation, and particularly to a base station heat dissipation system. Background Art

[0002] With the wide application of 5G communication and high-performance communication devices, the power density and heat generation of the base station RRU are increasing continuously. If the heat dissipation of the RRU is poor, it may lead to overheating of the device, performance degradation, and even failure.

[0003] In current RRU communication devices, in order to achieve the function of remote radio frequency signal, the device usually includes a power module, a digital unit module (with built-in lightning protection function), a power amplifier module, a cavity filter module, and related structural parts, connectors, and cables, etc. Multiple functional modules are integrated in a housing with limited volume, which seriously affects the heat dissipation effect and reduces the working performance of each module of the device. Summary of the Invention

[0004] In order to improve the heat dissipation effect and the working performance of the device, this application provides a base station heat dissipation system.

[0005] A base station heat dissipation system provided by this application adopts the following technical solutions:

[0006] A base station heat dissipation system includes a housing, an installation groove is provided in the housing, and a power amplifier module, a digital unit module, and a power module are provided in the installation groove;

[0007] The outer bottom wall of the housing is provided with a first heat dissipation unit and a second heat dissipation unit, the first heat dissipation unit corresponds to the position of the power amplifier module, and the second heat dissipation unit corresponds to the position of the digital unit module;

[0008] The first heat dissipation unit and the second heat dissipation unit are isolated by a first isolation groove, and the first isolation groove is located at the boundary between the power amplifier module and the digital unit module.

[0009] By adopting the above technical solutions, the heat generated by functional modules such as the power amplifier module, the digital unit module, the power module, and the lightning protection module is mainly transferred to the housing, so that most of the heat sources of the base station equipment are concentrated in the housing. The heat generated by the power amplifier module is mainly dissipated through the first heat dissipation unit, and the heat generated by the digital unit module is mainly dissipated through the second heat dissipation unit. The first isolation groove isolates the first heat dissipation unit and the second heat dissipation unit, effectively preventing the heat of the power amplifier module from being transferred to the digital unit module, avoiding abnormal heat dissipation of the main chips such as the FPGA of the digital board module, improving the heat dissipation effect. Since the devices selected for the power amplifier module are all temperature-resistant devices, while ensuring that the power amplifier module meets the heat dissipation requirements, it avoids overheating of the devices of the digital unit module and improves the working performance of the device.

[0010] Optionally, the digital board module includes an optical module, and a third heat dissipation unit is further provided on the outer bottom wall of the housing. The third heat dissipation unit corresponds to the position of the optical module and is used to dissipate the heat generated by the optical module; the third heat dissipation unit and the second heat dissipation unit are isolated by a second isolation groove.

[0011] By adopting the above technical solution, since the optical module in the digital unit module is a temperature-sensitive device, in order to further optimize its heat dissipation, the third heat dissipation unit and the second heat dissipation unit are isolated by a second isolation groove, so that the heat-sensitive devices such as the optical module can be independently dissipated through the third heat dissipation unit without being affected by additional heat sources, ensuring the performance of the optical module.

[0012] Optionally, heat dissipation copper blocks are provided between the power amplifier module and the bottom wall of the installation groove, and a plurality of heat dissipation copper blocks are arranged at intervals.

[0013] Optionally, the power amplifier module includes power amplifier tubes, and the heat dissipation copper blocks correspond to the positions of the power amplifier tubes.

[0014] Optionally, a groove is formed in the bottom wall of the housing, and the heat dissipation copper blocks are embedded in the groove.

[0015] By adopting the above technical solution, a groove is formed in the housing for avoidance, and the heat dissipation copper blocks are arranged in the groove to accommodate the heat dissipation copper blocks.

[0016] Optionally, the heat dissipation copper blocks are fixedly welded to the PCB board of the power amplifier module.

[0017] Optionally, a welding layer is provided on the side wall of the heat dissipation copper block close to the power amplifier module, and the welding layer is silver.

[0018] Optionally, a heat conduction layer is provided between the heat dissipation copper block and the bottom wall of the groove.

[0019] Optionally, screw holes are formed in the copper blocks, and the power amplifier module is fixedly connected to the housing through screws. The screws pass through the screw holes and press the power amplifier module against the heat dissipation copper blocks.

[0020] By adopting the above technical solution, the screws press the power amplifier module against the heat dissipation copper blocks, which effectively increases the pressure between the heat dissipation copper blocks and the housing and reduces the contact thermal resistance between the two.

[0021] Optionally, the first heat dissipation unit includes a plurality of first heat dissipation teeth, the second heat dissipation unit includes a plurality of second heat dissipation teeth, and both the first heat dissipation teeth and the second heat dissipation teeth are arranged along the first direction of the housing.

[0022] In summary, the present application includes at least one of the following beneficial technical effects:

[0023] 1. Heat generated by functional modules such as the power amplifier module, digital unit module, power supply module, and lightning protection module is mainly transferred to the housing, causing most of the heat sources of the base station equipment to be concentrated in the housing. The heat generated by the power amplifier module is mainly dissipated through the first heat dissipation unit, and the heat generated by the digital unit module is mainly dissipated through the second heat dissipation unit. The first isolation groove isolates the first heat dissipation unit and the second heat dissipation unit, effectively preventing the heat of the power amplifier module from being transferred to the digital unit module, avoiding abnormal heat dissipation of the main chips such as the FPGA of the digital board module, improving the heat dissipation effect. Since the devices selected for the power amplifier module are all temperature-resistant devices, while ensuring that the power amplifier module meets the heat dissipation requirements, overheating of the devices in the digital unit module is avoided, improving the operating performance of the equipment.

[0024] 2. Since the optical module in the digital unit module is a temperature-sensitive device, to further optimize its heat dissipation, the third heat dissipation unit and the second heat dissipation unit are isolated by the second isolation groove, enabling heat-sensitive devices such as the optical module to dissipate heat independently through the third heat dissipation unit without being affected by additional heat sources, ensuring the performance of the optical module. Description of the Drawings

[0025] Figure 1 is an exploded view of each module in the housing of the embodiment of the present application;

[0026] Figure 2 is a schematic structural diagram mainly showing the first heat dissipation unit, second heat dissipation unit, and third heat dissipation unit of the housing in the embodiment of the present application;

[0027] Figure 3 is a schematic structural diagram mainly showing the third heat dissipation unit in the embodiment of the present application;

[0028] Figure 4 is a schematic structural diagram mainly showing the installation structure of the heat dissipation copper block in the embodiment of the present application;

[0029] Figure 5 is a schematic structural diagram mainly showing the heat dissipation copper block and the power amplifier module in the embodiment of the present application.

[0030] Description of the reference numerals: 1, housing; 11, installation groove; 12, groove; 2, cavity filter; 3, power amplifier module; 4, digital unit module; 5, power supply module; 6, lightning protection module; 71, first heat dissipation unit; 72, second heat dissipation unit; 73, first isolation groove; 74, third heat dissipation unit; 741, bottom plate; 742, third heat dissipation teeth; 75, second isolation groove isolation; 8, heat dissipation copper block; 81, screw hole. Detailed Embodiment

[0031] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0032] It should be noted that all directional indications (such as up, down, left, right, front, back...) in the embodiments of the present invention are only used to explain the relative position relationship and movement conditions between components in a specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indications will also change accordingly.

[0033] In the present invention, unless otherwise clearly defined and limited, terms such as "connection" and "fixation" should be understood in a broad sense. For example, "fixation" can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal communication of two components or the interaction relationship between two components, unless otherwise clearly limited. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

[0034] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" can explicitly or implicitly include at least one of such features. In addition, the meaning of "and / or" appearing throughout the text includes three parallel solutions. Taking "A and / or B" as an example, it includes solution A, solution B, or the solution where A and B are satisfied simultaneously. In addition, the technical solutions between various embodiments can be combined with each other, but it must be based on the fact that those of ordinary skill in the art can implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the protection scope required by the present invention.

[0035] The embodiments of the present application disclose a base station heat dissipation system.

[0036] Referring to Figure 1 , a base station heat dissipation system includes a housing 1 and a cavity filter 2. An installation groove 11 is provided in the housing 1, and a power amplifier module 3, a digital unit module 4, a power supply module 5, and a lightning protection module 6 are provided in the installation groove 11. The housing 1 is an overall rectangular structure, and the length direction of the housing 1 in the present application is the first direction.

[0037] Among them, the power amplifier module 3 is a key component mainly used for amplifying signals, responsible for amplifying the radio frequency (RF) signals generated by the base station to ensure that the signals can cover a larger range and be transmitted to the user terminal. The power amplifier module 3 is the core part of realizing wireless communication in the 5G base station. Especially in the uplink and downlink of the base station, the power amplifier module 3 plays a crucial role.

[0038] The digital unit module 4 is usually responsible for signal processing, control, data exchange, network interface and other tasks of the base station. Digital signal processing: The digital unit is responsible for digitizing the received analog signals and converting them into digital signals that the base station can understand. Digital signal processing includes operations such as modulation and demodulation, error checking, encoding and decoding. Baseband signal processing: The digital unit performs baseband signal processing, and these baseband signals come from the wireless access part (radio unit). For example, operations such as modulation and demodulation, waveform generation and recovery are performed.

[0039] The power supply module 5 is responsible for providing stable and reliable power support for the entire base station system to ensure the normal operation of the base station and avoid system interruptions or failures caused by power problems. The lightning protection module 6 is to protect the base station equipment from damage caused by lightning and other electrical overvoltages, including structures such as lightning arresters and grounding systems.

[0040] The outer bottom wall of the housing 1 is provided with a first heat dissipation unit 71 and a second heat dissipation unit 72. The first heat dissipation unit 71 corresponds to the position of the power amplifier module 3, and the second heat dissipation unit 72 corresponds to the position of the digital unit module 4. That is, the projection of the power amplifier module 3 on the outer bottom wall of the housing 1 coincides or mostly coincides with the first heat dissipation unit 71, and the projection of the digital unit module 4 on the outer bottom wall of the housing 1 coincides or mostly coincides with the second heat dissipation unit 72.

[0041] Refer to Figure 1 and Figure 2 , the first heat dissipation unit 71 includes a number of first heat dissipation teeth, the second heat dissipation unit 72 includes a number of second heat dissipation teeth. The first heat dissipation teeth and the second heat dissipation teeth are both arranged along the first direction of the housing 1. The first heat dissipation teeth and the second heat dissipation teeth are integrally formed with the housing 1, which is convenient for production and manufacturing and does not require later assembly.

[0042] Refer to Figure 1 and Figure 2 , the power amplifier module 3 and the digital unit module 4 are arranged along the first direction of the housing 1, that is, distributed along the length direction of the housing 1. The power amplifier module 3 includes power amplifier tubes. The first heat dissipation unit 71 includes a number of first heat dissipation teeth, the second heat dissipation unit 72 includes a number of second heat dissipation teeth. The first heat dissipation teeth and the second heat dissipation teeth are both arranged along the first direction of the housing 1. The first heat dissipation teeth and the second heat dissipation teeth are integrally formed with the housing 1, and the first heat dissipation teeth and the second heat dissipation teeth are collinear. While ensuring the heat dissipation effect, it makes the housing 1 convenient for production and manufacturing.

[0043] Refer to Figure 2 , between the first heat dissipation unit 71 and the second heat dissipation unit 72 is isolated by a first isolation groove 73, and the first isolation groove 73 is located at the boundary between the power amplifier module 3 and the digital unit module 4. The first isolation groove 73 is opened perpendicular to the first direction, that is, it extends along the width direction of the housing 1.

[0044] Refer to Figure 1 and Figure 2 , the digital unit module 4 includes an optical module. A third heat dissipation unit 74 is further provided on the outer bottom wall of the housing 1. The third heat dissipation unit 74 corresponds to the position of the optical module and is used to dissipate the heat generated by the optical module; in this embodiment, the third heat dissipation unit 74 is detachably provided on the bottom wall of the housing 1 and is fixed to the bottom wall of the housing 1 by screws.

[0045] Refer to Figure 2 and Figure 3 , the third heat dissipation unit 74 includes a bottom plate 741 and a plurality of third heat dissipation teeth 742; the third heat dissipation teeth 742 are parallel to the first heat dissipation teeth. A plurality of third heat dissipation teeth 742 are provided on the bottom plate 741. The third heat dissipation teeth 742 are perpendicular to the bottom plate 741 and are integrally formed with the bottom plate 741.

[0046] Optionally, refer to Figure 2 , between the third heat dissipation unit 74 and the second heat dissipation unit 72 is isolated by a second isolation groove 75. Since the optical module in the digital unit module 4 is a temperature-sensitive device, in order to further optimize its heat dissipation, between the third heat dissipation unit 74 and the second heat dissipation unit 72 is isolated by a second isolation groove 75, so that temperature-sensitive devices such as the optical module can independently dissipate heat through the third heat dissipation unit 74 without being affected by additional heat sources, ensuring the performance of the optical module.

[0047] Refer to Figure 1 and Figure 4 , between the power amplifier module 3 and the bottom wall of the installation groove 11 is provided with a heat dissipation copper block 8. A plurality of heat dissipation copper blocks 8 are arranged at intervals. The heat dissipation copper blocks 8 correspond to the positions of the power amplifier tubes, that is, the installation positions of the heat dissipation copper blocks 8 are the positions of the power amplifier tubes of the power amplifier module 3. The power amplifier tubes of the power amplifier module 3 are the main heat sources. The heat dissipation copper blocks 8 are made of copper and have a high thermal conductivity coefficient, which can quickly conduct the heat generated by the power amplifier tubes to the housing 1 made of metal material for effective heat dissipation through the housing 1.

[0048] Specifically, refer to Figure 4 and Figure 5The bottom wall of the housing 1 is provided with a groove 12, that is, the groove 12 is provided on the bottom wall of the mounting groove 11, and the heat dissipation copper block 8 is embedded in the groove 12. The groove 12 is provided in the housing 1 for avoidance treatment, and the heat dissipation copper block 8 is provided in the groove 12 to accommodate the heat dissipation copper block 8. A heat conducting layer is provided between the heat dissipation copper block 8 and the bottom wall of the groove 12, and the heat conducting layer is thermal conductive silicone grease. Before installing the heat dissipation copper block 8, thermal conductive silicone grease is applied in the groove 12 as a heat conducting layer to further improve the heat conduction capacity and facilitate the heat dissipation of the power amplifier module 3. Since the heat generation of the power amplifier module 3 is relatively large, the thermal conductive silicone grease is often selected to have good thermal conductivity and meet high reliability.

[0049] The heat dissipation copper block 8 is fixed to the PCB board of the power amplifier module 3 by welding. The heat dissipation copper block 8 is provided with a welding layer near the side wall of the power amplifier module 3, and the welding layer is silver. Welding fixation can effectively reduce the thermal resistance of the contact and is conducive to heat conduction. The premise of welding fixation is that the copper block itself needs to be electroplated with silver in advance to give the copper block good welding properties.

[0050] Reference Figure 4 and Figure 5 In order to further reduce the contact thermal resistance between the heat dissipation copper block 8 and the housing 1, a screw hole 81 is provided on the heat dissipation copper block 8, and the power amplifier module 3 is fixedly connected to the housing 1 by screws. The screws pass through the screw holes 81 to press the power amplifier module 3 onto the heat dissipation copper block 8. The screws pass through the PCB board of the power amplifier module 3 and the heat dissipation copper block 8, and are directly fastened to the corresponding position of the RRU device housing 1, which effectively increases the pressure between the heat dissipation copper block 8 and the housing 1 and reduces the contact thermal resistance between the two.

[0051] The implementation principle of the embodiment of the present application is as follows: the heat generated by the functional modules such as the power amplifier module 3, the digital unit module 4, the power module 5 and the lightning protection module 6 is mainly transferred to the housing 1, so that most of the heat sources of the base station equipment are concentrated in the housing 1. The heat generated by the power amplifier module 3 is mainly dissipated through the first heat dissipation unit 71, and the heat generated by the digital unit module 4 is mainly dissipated through the second heat dissipation unit 72. The first isolation groove 73 isolates the first heat dissipation unit 71 and the second heat dissipation unit 72, effectively avoiding the heat transfer of the power amplifier module 3 to the digital unit module 4, avoiding the abnormal heat dissipation of the main chip such as the FPGA of the digital board module, and improving the heat dissipation effect. Since the devices selected for the power amplifier module 3 are all temperature-resistant devices, while ensuring that the power amplifier module 3 meets the heat dissipation requirements, the overheating of the digital unit module 4 devices is avoided, thereby improving the working performance of the equipment.

[0052] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A base station heat dissipation system, characterized in that: It comprises a housing (1), wherein a mounting groove (11) is arranged in the housing (1), and a power amplifier module (3), a digital unit module (4) and a power supply module (5) are arranged in the mounting groove (11); The outer bottom wall of the housing (1) is provided with a first heat dissipation unit (71) and a second heat dissipation unit (72), wherein the first heat dissipation unit (71) corresponds to the position of the power amplifier module (3), and the second heat dissipation unit (72) corresponds to the position of the digital unit module (4); The first heat dissipation unit (71) and the second heat dissipation unit (72) are isolated from each other by a first isolation slot (73), and the first isolation slot (73) is located at the boundary between the power amplifier module (3) and the digital unit module (4).

2. A base station heat dissipation system according to claim 1, characterized in that: The digital unit module (4) comprises an optical module, and the outer bottom wall of the housing (1) is also provided with a third heat dissipation unit (74), the third heat dissipation unit (74) corresponds to the position of the optical module and is used to dissipate heat generated by the optical module; the third heat dissipation unit (74) and the second heat dissipation unit (72) are isolated by a second isolation groove (75).

3. A base station heat dissipation system according to claim 1, characterized in that: A heat dissipation copper block (8) is arranged between the power amplifier module (3) and the bottom wall of the installation groove (11), and a plurality of the heat dissipation copper blocks (8) are arranged at intervals.

4. A base station heat dissipation system according to claim 3, characterized in that: The power amplifier module (3) comprises a power amplifier tube, and the heat dissipation copper block (8) corresponds to the position of the power amplifier tube.

5. A base station heat dissipation system according to claim 4, characterized in that: The bottom wall of the housing (1) is provided with a groove (12), and the heat dissipation copper block (8) is embedded in the groove (12).

6. A base station heat dissipation system according to claim 5, characterized in that: The heat dissipation copper block (8) is fixed to the PCB board of the power amplifier module (3) by welding.

7. A base station heat dissipation system according to claim 6, characterized in that: A welding layer is provided on the side wall of the heat dissipation copper block (8) close to the power amplifier module (3).

8. The base station heat dissipation system according to claim 5, characterized in that: A heat-conducting layer is provided between the heat-dissipating copper block (8) and the bottom wall of the groove (12).

9. The base station heat dissipation system according to claim 5, characterized in that: The heat dissipation copper block (8) is provided with a screw hole (81), and the power amplifier module (3) is fixedly connected to the housing (1) by means of a screw, and the screw passes through the screw hole (81) to press the power amplifier module (3) onto the heat dissipation copper block (8).

10. The base station heat dissipation system according to claim 1, characterized in that: The first heat dissipation unit (71) comprises a plurality of first heat dissipation teeth, and the second heat dissipation unit (72) comprises a plurality of second heat dissipation teeth, wherein the first heat dissipation teeth and the second heat dissipation teeth are both arranged along a first direction of the housing (1).

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