Electronic device and assembling method thereof

Abstract

The invention discloses an electronic device and an assembling method thereof. The electronic device comprises a thin film circuit and a capacitor. The thin film circuit comprises a first part and a second part which are used for connecting a capacitor, and a grounding bonding pad; wherein a third part for attaching a capacitor is also arranged between the first part and the second part; the third part is adjacent to the grounding bonding pad; the capacitor comprises a first surface and a second surface, an electrode of the first surface is a positive electrode, and an electrode of the second surface is a negative electrode; the first surface is attached to the third part through a conductive layer, and the second surface is bonded with the grounding bonding pad. The problem of glue overflow in the capacitor assembling process is solved, and the stability and the yield of electronic devices are improved.

Description

Technical Field

[0001] The present invention relates to the field of electronic technology, and particularly to an electronic device and an assembly method thereof. Background Art

[0002] The solution of combining a thin-film circuit with a capacitor is one of the most commonly used solutions for miniaturizing electronic devices such as power amplifiers. Especially in the low-frequency band, it can greatly reduce the overall circuit size of the power amplifier. Due to the small size of the circuit package, zero-spacing chip mounting is often required between the thin-film circuit and the capacitor to meet the requirements of miniaturization.

[0003] Figure 1 FIG. is a schematic structural diagram of an electronic device provided by the prior art. As Figure 1 shown, the number of thin-film circuits is at least two, including a first thin-film circuit 11 and a second thin-film circuit 12. The two thin-film circuits are respectively connected to a capacitor 13 by zero-spacing chip mounting. Specifically, a capacitor 13 is clamped between the first thin-film circuit 11 and the second thin-film circuit 12. The positive electrode (front side) of the capacitor 13 is connected to the first thin-film circuit 11 through a connection point 14 on the left side of the front side of the capacitor 13, and the positive electrode of the capacitor 13 is connected to the second thin-film circuit 12 through a connection point 14 on the right side of the front side of the capacitor 13. On the back side of the capacitor 13, it is directly attached to the ground plane by silver paste. During the attachment process of the capacitor 13 to the ground plane, the silver paste is squeezed and seeps into the front side of the capacitor 13 and the front side of the thin-film circuit along the gap between the capacitor 13 and the thin-film circuit, thereby contaminating the thin-film circuit and even causing the connection point 14 to short-circuit, resulting in damage to the capacitor 13 and the thin-film circuit. Summary of the Invention

[0004] The present invention provides an electronic device and an assembly method thereof to solve the problem of glue overflow during capacitor assembly and improve the stability and yield of the electronic device.

[0005] According to one aspect of the present invention, there is provided an electronic device, comprising:

[0006] A thin-film circuit, the thin-film circuit includes a first part and a second part for connecting a capacitor, and a ground pad; wherein, a third part for attaching the capacitor is further provided between the first part and the second part; the third part is adjacent to the ground pad;

[0007] A capacitor, the capacitor includes a first surface and a second surface, the electrode on the first surface is the positive electrode, and the electrode on the second surface is the negative electrode; the first surface is attached to the third part through a conductive layer, and the second surface is bonded to the ground pad.

[0008] Optionally, the first part includes a first functional area, and the second part includes a second functional area;

[0009] The third part is spaced apart from the first functional area by a first preset distance, and the third part is spaced apart from the second functional area by a second preset distance.

[0010] Optionally, the first preset distance is equal to the second preset distance.

[0011] Optionally, the third part includes a positive capacitor line;

[0012] The first part further includes a first line, the first line is routed within the first functional area, and the first line is used to connect the first functional area and the positive capacitor line;

[0013] The second part further includes a second line, the second line is routed within the second functional area, and the second line is used to connect the second functional area and the positive capacitor line.

[0014] Optionally, the size of the positive capacitor line is greater than or equal to the size of the capacitor.

[0015] Optionally, the ground pads are distributed in a first pad area and a second pad area, and the first pad area and the second pad area are respectively located on both sides of the third part.

[0016] Optionally, the positive capacitor line is rectangular, the positive capacitor line includes a first side, a second side, a third side and a fourth side connected end to end, the first side is connected to the first line, the second side is spaced apart from the first pad area by a third preset distance, the third side is connected to the second line, and the fourth side is spaced apart from the second pad area by a fourth preset distance.

[0017] Optionally, the third preset distance is equal to the fourth preset distance.

[0018] Optionally, the electronic device further includes: a back metal, and the second surface of the capacitor is connected to the back metal through the ground pad.

[0019] Optionally, the number of the capacitors is at least one.

[0020] Optionally, the first surface is attached to the third part by silver glue or solder;

[0021] And / or, the second surface is wire-bonded to the ground pad.

[0022] Optionally, the capacitor is a single-layer ceramic capacitor or a multi-layer ceramic capacitor.

[0023] According to another aspect of the present invention, there is provided an assembly method including any of the above-mentioned electronic devices, including:

[0024] Assemble the thin-film circuit inside the housing of the electronic device;

[0025] Attach the first surface of the capacitor to the third part of the thin-film circuit;

[0026] Electrically connect the second surface of the capacitor to the ground pad through a bonding process.

[0027] An embodiment of the present invention provides an integrated thin-film circuit. The first part and the second part are connected through the third part on a thin-film circuit, and the first part, the second part, and the third part are placed in a thin-film circuit. This setting ensures that during the attachment process of the first surface of the capacitor to the third part of the thin-film circuit, no conductive adhesive will flip to the second surface of the capacitor through both sides of the thin-film circuit. Moreover, the signal transmitted on the conductive adhesive is the positive signal of the capacitor, and this signal is communicable with the signals of the first part and the second part of the thin-film circuit. Therefore, even if the conductive adhesive is squeezed out of the edge of the capacitor, it will not cause the problem of short circuit between the positive and negative poles of the capacitor. In summary, the embodiment of the present invention sets an integrated thin-film circuit and attaches the capacitor to the thin-film circuit after flipping, which is more convenient for the assembly of the capacitor, reduces the assembly difficulty, avoids the short circuit caused by the overflowing conductive adhesive between the capacitor and the thin-film circuit, and thus improves the stability and yield of the electronic device.

[0028] It should be understood that the content described in this part is not intended to identify the key or important features of the embodiments of the present invention, nor is it used to limit the scope of the present invention. Other features of the present invention will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] To more clearly illustrate the technical solutions in the embodiments of the present invention, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0030] Figure 1 A schematic structural diagram of an electronic device provided by the prior art;

[0031] Figure 2 A schematic structural diagram of a thin-film circuit in an electronic device provided by an embodiment of the present invention;

[0032] Figure 3 A schematic structural diagram of an electronic device provided by an embodiment of the present invention;

[0033] Figure 4It is a schematic structural diagram of a thin-film circuit in another electronic device provided according to an embodiment of the present invention;

[0034] Figure 5 It is a schematic structural diagram of a thin-film circuit in yet another electronic device provided according to an embodiment of the present invention;

[0035] Figure 6 It is a schematic structural diagram of another electronic device provided according to an embodiment of the present invention;

[0036] Figure 7 It is a flowchart of an assembly method of an electronic device provided according to an embodiment of the present invention. Detailed implementation manners

[0037] In order to enable those skilled in the art to better understand the solution of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0038] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above drawings are used to distinguish similar objects, and do not necessarily need to describe a specific order or sequence. It should be understood that such data can be interchanged under appropriate circumstances so that the embodiments of the present invention described here can be implemented in an order other than those illustrated or described here. In addition, the terms "include" and "have" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device including a series of steps or units does not necessarily have to be limited to those clearly listed steps or units, but may include other steps or units not clearly listed or inherent to these processes, methods, products or devices.

[0039] The present invention provides an electronic device, Figure 2 It is a schematic structural diagram of a thin-film circuit in an electronic device provided according to an embodiment of the present invention, Figure 3 It is a schematic structural diagram of an electronic device provided according to an embodiment of the present invention. Refer to Figure 2 and Figure 3, the electronic device includes: a thin-film circuit 21 and a capacitor 23. The thin-film circuit 21 includes a first part 211 and a second part 212 for connecting the capacitor 23, and a ground pad 25; wherein, a third part 213 for attaching the capacitor 23 is further provided between the first part 211 and the second part 212; the third part 213 is adjacent to the ground pad 25; the capacitor 23 includes a first surface and a second surface 231, the electrode on the first surface is the positive electrode, and the electrode on the second surface 231 is the negative electrode; the first surface is attached to the third part 213 through a conductive layer, and the second surface 231 is bonded to the ground pad 25. In Figure 3 , the second surface 231 of the capacitor 23 is the surface perpendicular to the paper plane and facing outward, and the first surface of the capacitor 23 is the surface perpendicular to the paper plane and facing inward, that is, from Figure 3 's perspective, the second surface 231 (i.e., the negative electrode of the capacitor) of the capacitor 23 is seen.

[0040] Among them, the thin-film circuit 21 is an integrated structure, provided with a first part 211, a second part 212 and a third part 213. The positive electrode of the capacitor 23 is attached to the third part 213 through a conductive layer and is directly connected to the thin-film circuit 21. Exemplarily, the conductive layer can be conductive glue. The positive electrode of the capacitor 23 is electrically connected to the third part 213 through the conductive glue, thereby connecting the capacitor 23 to the first part 211 and the second part 212 of the thin-film circuit 21. The negative electrode of the capacitor 23 is bonded to the ground pad 25, and the negative electrode of the capacitor 23 can be grounded, making the second surface 231 of the capacitor 23 the ground plane. Optionally, the ground pad 25 is conducted with the casing of the electronic device to achieve grounding.

[0041] Exemplarily, the method for assembling the capacitor 23 to the thin-film circuit 21 of the electronic device is as follows: First, assemble the thin-film circuit 21 into the casing of the electronic device; then attach the first surface of the capacitor 23 to the third part 213 of the thin-film circuit 21 through conductive glue; finally, electrically connect the second surface 231 of the capacitor 23 to the ground pad 25 through a bonding process. Among them, in the process of attaching the first surface of the capacitor 23 to the third part 213 of the thin-film circuit 21 through conductive glue, compared with the prior art, it is equivalent to flipping the capacitor 23. Since there is no gap between the capacitor 23 and the parts on both sides, the conductive glue will not overflow from the first surface of the capacitor 23 to the second surface 231.

[0042] An embodiment of the present invention provides an integrated thin-film circuit. The first part 211 and the second part 212 are connected through the third part 213 on a thin-film circuit 21, and the first part 211, the second part 212, and the third part 213 are placed in a thin-film circuit 21. With this arrangement, during the attachment process of the first surface of the capacitor 23 to the third part 213 of the thin-film circuit 21, the conductive adhesive will not flip through both sides of the thin-film circuit 21 to the second surface 231 of the capacitor 23. And the signal transmitted on the conductive adhesive is the positive-pole signal of the capacitor 23, and this signal is connectable to the signals of the first part 211 and the second part 212 of the thin-film circuit 21. Therefore, even if the conductive adhesive is squeezed out of the edge of the capacitor 23, it will not cause the problem of short circuit between the positive and negative poles of the capacitor 23. In summary, the embodiment of the present invention sets an integrated thin-film circuit 21 and attaches the capacitor 23 after flipping it onto the thin-film circuit 21, which is more convenient for the assembly of the capacitor 23, reduces the assembly difficulty, avoids the short circuit caused by the overflowing conductive adhesive between the capacitor 23 and the thin-film circuit 21, and thus improves the stability and yield of the electronic device.

[0043] Continue to refer to Figure 2 and Figure 3 Based on the above embodiments, optionally, the first part 211 includes a first functional area 211A, and the second part 212 includes a second functional area 212A. The third part 213 is spaced from the first functional area 211A by a first preset distance d1, and the third part 213 is spaced from the second functional area 212A by a second preset distance d2.

[0044] Among them, the first functional area 211A and the second functional area 212A are functional structures of the thin-film circuit 21, which can provide different functional circuits for the thin-film circuit 21, and some of these functional circuits may need to be insulated from the positive pole of the capacitor 23. In the embodiment of the present invention, there is a first preset distance d1 between the third part 213 and the first functional area 211A, which is equivalent to setting a space margin, which is beneficial to preventing the conductive adhesive from short-circuiting with the first functional area 211A due to overflowing glue during the fitting process of the capacitor 23 and the third part 213. Similarly, in the embodiment of the present invention, there is a second preset distance d2 between the third part 213 and the second functional area 212A, which is equivalent to setting a space margin, which is beneficial to preventing the conductive adhesive from short-circuiting with the second functional area 212A due to overflowing glue during the fitting process of the capacitor 23 and the third part 213. With this arrangement, it is beneficial to avoid damage to the functions of the thin-film circuit 21, thereby ensuring the reliable operation of the thin-film circuit 21.

[0045] Continue to refer to Figure 2 and Figure 3, based on the above embodiments, optionally, the first preset distance d1 is equal to the second preset distance d2. The first preset distance d1 and the second preset distance d2 are arranged on both sides of the capacitor 23. This design method is a symmetric design, which is beneficial to reducing the process difficulty.

[0046] Continue to refer to Figure 2 and Figure 3 , based on the above embodiments, optionally, the third part 213 includes the positive electrode line 2131 of the capacitor 23. The first part 211 further includes a first line 2111. The first line 2111 is routed within the first functional area 211A, and the first line 2111 is used to connect the first functional area 211A and the positive electrode line 2131 of the capacitor. The second part 212 further includes a second line 2121. The second line 2121 is routed within the second functional area 212A, and the second line 2121 is used to connect the second functional area 212A and the positive electrode line 2131 of the capacitor. Among them, the first line 2111, the second line 2121, and the positive electrode line 2131 of the capacitor are all conductive lines, and the three can be integrally arranged. The capacitor 23 is attached to the positive electrode line 2131 of the third part 213 through a conductive layer, so that the positive electrode of the capacitor 23 can be conducted with the first line 2111 and the second line 2121. Exemplarily, the third part 213 is composed of the positive electrode line 2131 of the capacitor 23, and the third part 213 is the positive electrode line 2131 of the capacitor 23.

[0047] , based on the above embodiments, optionally, the size of the positive electrode line 2131 of the capacitor is greater than or equal to the size of the capacitor 23. By setting the positive electrode line 2131 of the capacitor with a size greater than or equal to that of the capacitor 23, the assembly of the capacitor 23 can be made more convenient and fast, and the assembly difficulty is reduced. And during the assembly process, the large-sized positive electrode line 2131 of the capacitor is equivalent to reserving an overflow range for the conductive adhesive, avoiding the conductive adhesive from contaminating the first functional area 211A and the second functional area 212A, and ensuring the firmness and reliability of the assembly of the capacitor 23.

[0048] Continue to refer to Figure 2 and Figure 3 , based on the above embodiments, optionally, the ground pads 25 are distributed in the first pad area 251 and the second pad area 252, and the first pad area 251 and the second pad area 252 are respectively located on both sides of the third part 213. Such a setting enables the negative electrode of the capacitor 23 to be grounded not only through the first pad area 231 but also through the second pad area 252, that is, to be grounded from both sides of the capacitor 23, which is beneficial to increasing the contact area between the ground pads 25 and the negative electrode of the capacitor 23, thereby reducing the ground resistance.

[0049] Continue to refer to Figure 2 and Figure 3On the basis of the above embodiments, optionally, the capacitor positive electrode line 2131 is a rectangle, and the capacitor positive electrode line 2131 includes a first side 2131A, a second side 2131B, a third side 2131C and a fourth side 2131D connected end to end, the first side 2131A is connected to the first line 2111, the second side 2131B is separated from the first pad area 251 by a third preset distance d3, the third side 2131C is connected to the second line 212, and the fourth side 2131D is separated from the second pad area 252 by a fourth preset distance d4. In the embodiment of the present invention, the second side 2131B is separated from the first pad area 251 by a third preset distance d3, which is equivalent to setting a space margin, which is conducive to preventing the conductive glue from short-circuiting with the ground pad 25 of the first pad area 251 due to glue overflow during the bonding process of the capacitor 23 and the third part 213. Similarly, in the embodiment of the present invention, the fourth side 2131D is spaced from the second pad area 252 by a fourth preset distance d4, which is equivalent to setting a space margin, which is helpful to prevent the conductive glue from short-circuiting with the ground pad 25 of the second pad area 252 due to glue overflow during the bonding process of the capacitor 23 and the third part 213. Such a setting is helpful to avoid damage to the function of the thin film circuit 21, thereby ensuring the reliable operation of the thin film circuit 21.

[0050] Based on the above embodiments, optionally, the third preset distance d3 and the fourth preset distance d4 are equal. The third preset distance d3 and the fourth preset distance d4 are set on both sides of the capacitor 23. This design is a symmetrical design, which is conducive to reducing the difficulty of the process.

[0051] On the basis of the above embodiments, the electronic device may further include a back metal. The second surface 231 of the capacitor 23 is connected to the back metal via a ground pad 25. The back metal may be a tube shell of the electronic device or a separately provided metal layer. Connecting the ground pad 25 to the back metal is beneficial to maintaining the stability of the ground signal.

[0052] In the above embodiments, the ground pad 25 is exemplarily shown to be located in the first pad area 251 and the second pad area 252, which is not a limitation of the present invention. Figure 4 As shown, the ground pad 25 may be arranged to be located only in the first pad area 251 ; or the ground pad 25 may be arranged to be located only in the second pad area 252 .

[0053] In the above embodiments, it is exemplarily shown that the number of the capacitor 23 is one, which is not a limitation of the present invention. In its implementation mode, the number of the capacitor 23 may be set to at least two.

[0054] Figure 5 A schematic diagram of the structure of a thin film circuit in another electronic device provided by an embodiment of the present invention, Figure 6This is a schematic structural diagram of another electronic device provided by an embodiment of the present invention. Refer to Figure 5 and Figure 6 , based on the above embodiments, optionally, the number of capacitors 23 is two. Correspondingly, the number of the third parts 213 in the thin-film circuit 21 is two, and the ground pads 25 are correspondingly arranged around the two third parts 213. Exemplarily, the first part 211, the third part 213, the second part 212, and the third part 213 on the thin-film circuit 21 are arranged in sequence, and each part is connected through the circuit in the thin-film circuit 21.

[0055] Based on the above embodiments, optionally, the first surface is attached to the third part 213 by silver paste or solder, that is, the conductive layer is silver paste or solder. The second surface 231 and the ground pad 25 are wire-bonded by gold wire. Among them, silver paste and solder have conductivity. Attaching the first surface of the capacitor 23 to the third part by silver paste or solder can form a path between the positive electrode of the capacitor 23 and the third part 213, connect the capacitor 23 into the thin-film circuit 21, and this connection method is stable and reliable. Compared with the prior art, the embodiment of the present invention has lower process requirements for assembling the capacitor 23 and the thin-film circuit 21, so a wider range of conductive layer materials can be used. The second surface 231 is the negative electrode of the capacitor 23. Wire-bonding the second surface 231 and the ground pad 25 by gold wire can form a path between the negative electrode of the capacitor 23 and the ground pad 25 to ensure the reliable grounding of the capacitor 23.

[0056] Based on the above embodiments, optionally, the capacitor 23 is a single-layer ceramic capacitor or a multi-layer ceramic capacitor. Among them, a ceramic capacitor is a capacitor with ceramic as the dielectric. Its structure is composed of single-layer, two-layer or more alternating ceramic layers and metal layers. The metal layers are connected to the electrodes of the capacitor, and the positive and negative electrodes of the ceramic capacitor are respectively located on its two relatively arranged surfaces. Ceramic capacitors and multi-layer ceramic capacitors have stable performance, good insulation, and the characteristic of high voltage resistance, so they are widely used in electronic devices such as amplifier circuits.

[0057] The embodiment of the present invention provides an assembly method for an electronic device. This assembly method is applicable to the electronic device provided by any embodiment of the present invention, and thus has the same beneficial effects, which will not be elaborated here.

[0058] Specifically, Figure 7 This is a flowchart of an assembly method for an electronic device provided by an embodiment of the present invention. Refer to Figure 7 , the method includes the following steps:

[0059] S1. Assemble the thin-film circuit 21 into the housing of the electronic device.

[0060] Among them, the package is an encapsulation shell with excellent mechanical properties, insulation properties, airtightness properties, etc. Assembling the thin-film circuit 21 inside the package of the electronic device can isolate the thin-film circuit 21 from the outside world, making the thin-film circuit 21 more stable and operating more safely and reliably. Optionally, the package has conductivity, and the ground pad 25 of the thin-film circuit 21 can be electrically connected to the package.

[0061] S2. Attach the first surface of the capacitor 23 to the third part 213 of the thin-film circuit 21.

[0062] Optionally, turn over the capacitor 23 so that its first surface (i.e., the positive electrode) is connected to the third part of the thin-film circuit 21 through a conductive adhesive such as silver paste or solder. Compared with the prior art, since there is no gap between the capacitor 23 and the parts on both sides, the conductive adhesive will not overflow from the first surface (positive electrode) of the capacitor 23 to the second surface 231 (negative electrode), resulting in a short circuit between the positive and negative electrodes of the capacitor 23.

[0063] S3. Electrically connect the second surface 231 of the capacitor 23 to the ground pad 25 through a bonding process.

[0064] Among them, the second surface 231 (i.e., the negative electrode) of the capacitor 23 is connected to the ground pad 25 in the form of a gold wire through a bonding process.

[0065] The embodiment of the present invention provides an integrated thin-film circuit 21. During the assembly process, the capacitor 23 is turned over and attached to the thin-film circuit 21, which is more convenient for the assembly of the capacitor 23, reduces the assembly difficulty, avoids the short circuit caused by the overflowing conductive adhesive between the capacitor 23 and the thin-film circuit 21, and thus improves the stability and yield of the electronic device.

[0066] It should be understood that the various forms of the flow shown above can be used, steps can be reordered, added or deleted. For example, the steps described in the present invention can be executed in parallel, sequentially, or in a different order, as long as the desired results of the technical solution of the present invention can be achieved. This is not limited herein.

[0067] The above specific embodiments do not constitute a limitation to the protection scope of the present invention. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. An electronic device, characterized in that, Comprising: A thin-film circuit, the thin-film circuit including a first part and a second part for connecting a capacitor, and a ground pad; wherein, a third part for attaching the capacitor is further provided between the first part and the second part; the third part is adjacent to the ground pad; A capacitor, the capacitor including a first surface and a second surface, the electrode on the first surface being the positive electrode and the electrode on the second surface being the negative electrode; the first surface is attached to the third part through a conductive layer, and the second surface is bonded to the ground pad.

2. The electronic device according to claim 1, wherein The first part includes a first functional area, and the second part includes a second functional area; The third part is spaced apart from the first functional area by a first preset distance, and the third part is spaced apart from the second functional area by a second preset distance.

3. The electronic device according to claim 2, wherein The first preset distance is equal to the second preset distance.

4. The electronic device according to claim 2, wherein The third part includes a capacitor positive electrode line; The first part further includes a first line, the first line is routed within the first functional area, and the first line is used to connect the first functional area and the capacitor positive electrode line; The second part further includes a second line, the second line is routed within the second functional area, and the second line is used to connect the second functional area and the capacitor positive electrode line.

5. The electronic device according to claim 4, characterized in that The size of the capacitor positive electrode line is greater than or equal to the size of the capacitor.

6. The electronic device according to claim 1, characterized in that The ground pads are distributed in a first pad area and a second pad area, and the first pad area and the second pad area are respectively located on both sides of the third part.

7. The electronic device according to claim 6, characterized in that, The capacitor positive electrode line is rectangular, the capacitor positive electrode line includes a first side, a second side, a third side and a fourth side connected end to end, the first side is connected to the first line, the second side is spaced apart from the first pad area by a third preset distance, the third side is connected to the second line, and the fourth side is spaced apart from the second pad area by a fourth preset distance.

8. The electronic device according to claim 7, wherein The third preset distance is equal to the fourth preset distance.

9. The electronic device according to claim 1, wherein Further comprising: A back metal, the second surface of the capacitor is connected to the back metal through the ground pad.

10. The electronic device according to claim 1, characterized in that, The number of the capacitors is at least one.

11. The electronic device according to claim 1, wherein The first surface is attached to the third part through silver paste or solder; And / or, the second surface and the ground pad are bonded by a gold wire.

12. The electronic device according to claim 1, wherein The capacitor is a single-layer ceramic capacitor or a multi-layer ceramic capacitor.

13. An assembly method of an electronic device according to any one of claims 1-12, characterized in that, Including: Assembling the thin-film circuit into the housing of the electronic device; Attaching the first surface of the capacitor to the third part of the thin-film circuit; Electrically connecting the second surface of the capacitor to the ground pad through a bonding process.

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