Circuit board design method and circuit board

Abstract

The present application relates to the technical field of circuit board, and provides a circuit board design method and a circuit board, the circuit board comprises a first element and a plurality of second elements, each second element is connected to the first element through a corresponding signal line to receive the control signal sent by the first element through the signal line, the method comprises the following steps: determining the affected temperature rise upper limit value of the first element and the continuous working time upper limit value of the second element; obtaining the heat generation power of each second element and the heat transfer parameter of the circuit board; determining the minimum distance between the second element and the first element in the circuit board according to the affected temperature rise upper limit value of the first element, the continuous working time upper limit value of the second element, the heat generation power of the second element and the heat transfer parameter of the circuit board; and arranging the first element and the plurality of second elements according to the minimum distance between the second element and the first element. The present application can reasonably determine the distance between the control element and the controlled element in the circuit board.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of circuit board, in particular to a circuit board design method and circuit board. BACKGROUND

[0002] In the design of PCB (Printed Circuit Board), the position layout of each element is crucial to the size, stability and other performance quality parameters of the circuit board and the rationality of the wiring.

[0003] For the chip and controlled elements in the circuit board, if the elements controlled by the chip generate heat during operation, the heat will be radiated to the chip nearby, especially the controlled elements with large heat generation, which will cause the performance of the chip to decrease significantly or even be damaged. Currently, the chip and controlled elements in the circuit board either have a relatively large volume due to the large distance and insufficient compactness, or bring large temperature rise to the chip due to the small distance, which affects the performance of the circuit board. SUMMARY

[0004] The present application provides a circuit board design method and circuit board to solve the above technical problems, which can reasonably determine the distance between the control elements and the controlled elements in the circuit board, so as to make the circuit board as small as possible and prevent the temperature rise of the control elements from being too large, effectively guaranteeing the performance and reliability of the circuit board.

[0005] The technical scheme adopted by the present application is as follows:

[0006] A circuit board design method, the circuit board comprising a first element and a plurality of second elements, each of the second elements being connected to the first element through a corresponding signal line to receive the control signal emitted by the first element through the signal line, the method comprising the following steps: determining the upper limit value of the affected temperature rise of the first element and the upper limit value of the continuous working time of the second element; obtaining the heat generation power of each second element and the heat transfer parameter of the circuit board; determining the minimum distance between the second element and the first element in the circuit board according to the upper limit value of the affected temperature rise of the first element, the upper limit value of the continuous working time of the second element, the heat generation power of the second element and the heat transfer parameter of the circuit board; and arranging the first element and the plurality of second elements according to the minimum distance between the second element and the first element.

[0007] Further, the circuit board design method further comprises: after the layout of the first component and the plurality of second components is completed, constructing a test circuit board according to the completed current layout, wherein the distance between every two adjacent signal lines in the test circuit board is arbitrarily set; obtaining the resistance of the signal line between the second component and the first component, the ground resistance of the signal line at the first component end, and the ground resistance of the signal line at the second component end in the test circuit board; obtaining the length and thickness of the signal line in the test circuit board as the length and thickness of the signal line in the circuit board to be designed; determining the minimum distance between the adjacent signal lines in the circuit board according to the resistance of the signal line between the second component and the first component, the ground resistance of the signal line at the first component end, the ground resistance of the signal line at the second component end, the length and thickness of the signal line in the circuit board; and performing layout on the first component, the plurality of second components, and the plurality of signal lines according to the minimum distance between the second component and the first component and the minimum distance between the adjacent signal lines.

[0008] Further, the heat transfer parameters of the circuit board include the thermal conductivity coefficient and the temperature conductivity coefficient of the circuit board.

[0009] Further, the thermal conductivity coefficient and the temperature conductivity coefficient of the circuit board are the thermal conductivity coefficient and the temperature conductivity coefficient of the substrate used to manufacture the circuit board.

[0010] Further, the relationship between the distance between the second component and the first component in the circuit board and the upper limit value of the affected temperature rise of the first component, the upper limit value of the continuous working time of the second component, the heat generation power of the second component, and the heat transfer parameters of the circuit board is:

[0011] ;

[0012] wherein, D 1 is the distance between the second component and the first component in the circuit board, k is the thermal conductivity coefficient of the circuit board, α is the temperature conductivity coefficient of the circuit board, t max is the upper limit value of the continuous working time of the second component, p is the average heat generation power of the second component in the continuous working time, Δ T max is the upper limit value of the affected temperature rise of the first component, which represents the maximum value of the temperature rise allowed by each second component to the first component.

[0013] Further, the relationship between the distance between the adjacent signal lines in the circuit board and the resistance of the signal line between the second element and the first element, the ground resistance of the signal line at the first element end, the ground resistance of the signal line at the second element end, the length and thickness of the signal line in the circuit board is:

[0014] ;

[0015] wherein, D 2 is the distance between the adjacent signal lines in the circuit board, R 1 is the ground resistance of the signal line at the first element end, R 2 is the ground resistance of the signal line at the second element end, R R is the resistance of the signal line between the second element and the first element, C C is the mutual capacitance between the adjacent two signal lines in the circuit board, M L is the mutual inductance between the adjacent two signal lines in the circuit board, l L is the length of the signal line in the circuit board, h T is the thickness of the signal line in the circuit board, ω ω is the angular frequency, K K is the Coulomb constant, μ 0 is the vacuum permeability, ε 0 is the vacuum dielectric constant, A th is a preset crosstalk parameter threshold.

[0016] Further, the preset crosstalk parameter threshold is obtained by manufacturing a test circuit comprising the first element, a plurality of the second elements and a plurality of the signal lines, and detecting in advance in the test the voltage of one of the adjacent two signal lines at the second element end and the voltage of the other signal line at the first element end in the test circuit.

[0017] Further, the second element is a power device, and the first element is a control chip.

[0018] Further, the second element is a power switch tube, an LED (Light Emitting Diode) or a power amplifier.

[0019] A circuit board designed by the circuit board design method.

[0020] The beneficial effects of the present application are:

[0021] The present application can determine the minimum distance between the second element and the first element in the circuit board according to the upper limit of the affected temperature rise of the first element, the upper limit of the continuous working time of the second element, the heat generating power of the second element and the heat transfer parameter of the circuit board, thereby reasonably determining the distance between the control element and the controlled element in the circuit board, which can make the circuit board as small as possible and prevent the temperature rise of the control element from being too large, effectively guaranteeing the performance and reliability of the circuit board.

[0022] Further, the present application can determine the minimum distance between the adjacent signal lines in the circuit board according to the resistance of the signal line between the second element and the first element, the resistance of the signal line to ground at the first element end, the resistance of the signal line to ground at the second element end, the length and thickness of the signal line in the circuit board, thereby reasonably determining the distance between the adjacent signal lines, which can make the circuit board as small as possible and effectively prevent the influence of the crosstalk between the adjacent signal lines on the performance of the circuit board. BRIEF DESCRIPTION OF DRAWINGS

[0023] Figure 1 The flow chart of the circuit board design method of the embodiment of the present application.

[0024] Figure 2 The flow chart of the circuit board design method of the further embodiment of the present application. DETAILED DESCRIPTION

[0025] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, but not all the embodiments. Based on the embodiments in the present application, all the other embodiments obtained by those skilled in the art without creative work are within the protection scope of the present application.

[0026] The circuit board to be designed by the embodiments of the present application comprises a first element and a plurality of second elements, each of the second elements is connected to the first element through a corresponding signal line to receive the control signal emitted by the first element through the signal line, that is, the first element is a control element and the second element is a controlled element.

[0027] In one embodiment of the present application, the circuit board is a PCB, the second element is an element which will generate obvious heat in the circuit board, such as a power device, and the first element is an element which will be negatively affected by the heat generated by the second element and controls the second element, such as a control chip. In a specific embodiment of the present application, the circuit board is a power main board or an audio amplification main board, the second element is a power switch tube, such as an IGBT (Insulate Gate Bipolar Transistor), or the second element is an LED, a power amplifier, etc.

[0028] Therefore, the distance between the second component and the first component is considered in the design of the circuit board according to the embodiment of the present application.

[0029] As shown in Figure 1 the design method of the circuit board according to the embodiment of the present application comprises the following steps:

[0030] S1, determining the affected temperature rise upper limit value of the first component and the continuous working time upper limit value of the second component.

[0031] The affected temperature rise upper limit value of the first component represents the maximum value of the temperature rise allowed by each second component to the first component, which can be pre-set according to the ability of the first component to withstand high temperature, the number of second components, and the heat dissipation condition of the circuit board, etc., and can be 5-10℃, for example.

[0032] The continuous working time upper limit value of the second component is the rated continuous working time of the circuit board product to be set, which is also pre-set as the affected temperature rise upper limit value of the first component.

[0033] S2, obtaining the heat generation power of each second component and the heat transfer parameter of the circuit board.

[0034] The heat generation power of the second component refers to the average heat generation power of the second component within the continuous working time.

[0035] The heat transfer parameter of the circuit board includes the thermal conductivity coefficient and the temperature conductivity coefficient of the circuit board.

[0036] Since the heat transfer parameter of the circuit board mainly depends on the substrate for making the circuit board, for example, the wiring only changes the thin copper layer, and does not have a great impact on the heat transfer parameter, at least it does not significantly affect the basic relationship between the temperature rise of the first component and the distance between the second component and the first component, therefore, in one embodiment of the present application, the thermal conductivity coefficient and the temperature conductivity coefficient of the substrate for making the circuit board can be used as the thermal conductivity coefficient and the temperature conductivity coefficient of the circuit board.

[0037] In another embodiment of the present application, the thermal conductivity coefficient and the temperature conductivity coefficient of the circuit board can also be used as the thermal conductivity coefficient and the temperature conductivity coefficient of the circuit board with reference to the heat transfer parameter of the circuit board. The heat transfer parameter reference circuit board refers to a pre-manufactured circuit board containing the first component, the plurality of second components and the plurality of signal lines, and the distance between the second component and the first component is determined according to the experience of the manufacturer. The heat transfer parameter of the heat transfer parameter reference circuit board is less different from the circuit board to be designed.

[0038] It should be noted that, although the heat transfer between the components in the circuit board includes both the circuit board heat transfer and the air heat transfer, the circuit board heat transfer accounts for a large proportion, and the commonly used air cooling heat dissipation will destroy the air heat transfer, thus the temperature rise of the first component caused by the second component is mainly caused by the circuit board heat transfer, and only the heat transfer of the circuit board itself is considered in the embodiment of the present application. In another aspect, by setting the upper limit of the affected temperature rise of the first component to be smaller, redundancy can be provided for the ignored air heat transfer, that is, it is feasible to only consider the heat transfer of the circuit board itself in the embodiment of the present application.

[0039] S3, determining the minimum distance between the second component and the first component in the circuit board according to the upper limit of the affected temperature rise of the first component, the upper limit of the continuous working time of the second component, the heat generation power of the second component and the heat transfer parameter of the circuit board.

[0040] In an embodiment of the present application, the relationship between the distance between the second component and the first component in the circuit board and the upper limit of the affected temperature rise of the first component, the upper limit of the continuous working time of the second component, the heat generation power of the second component and the heat transfer parameter of the circuit board is:

[0041] ;

[0042] wherein, D 1 is the distance between the second component and the first component in the circuit board, k is the thermal conductivity of the circuit board, α is the temperature conductivity of the circuit board, t max is the upper limit of the continuous working time of the second component, p is the average heat generation power of the second component in the continuous working time, Δ T max is the upper limit of the affected temperature rise of the first component, which represents the maximum value of the temperature rise of the first component caused by each second component.

[0043] That is, the minimum distance between the second component and the first component in the circuit board can be determined according to the above relationship, and when the above inequality is equal, the value of 1 calculated is the minimum distance between the second component and the first component in the circuit board. D

[0044] S4, arranging the first component and the plurality of second components according to the minimum distance between the second component and the first component.

[0045] The actual distance between the second component and the first component in the circuit board is preferably equal to the minimum distance determined in step S3, and of course, can be slightly larger than the minimum distance determined in step S3.

[0046] ​According to the circuit board design method, the minimum distance between the second element and the first element in the circuit board can be determined according to the upper limit of the affected temperature rise of the first element, the upper limit of the continuous working time of the second element, the heat generation power of the second element and the heat transfer parameter of the circuit board, so that the distance between the control element and the controlled element in the circuit board can be reasonably determined, the circuit board can be as small as possible, the temperature rise of the control element can be prevented from being too large, and the performance and reliability of the circuit board can be effectively ensured.

[0047] In view of factors such as wiring efficiency, space design, heat dissipation design, and power line interference prevention design, the signal lines of the circuit board in the above embodiment generally adopt parallel wiring, that is, each signal line is arranged in parallel and side by side between one end close to the first element and the other end close to the second element. In order to reduce the crosstalk between the signal lines, in principle, the smaller the distance between the second element and the first element, the better, but as described in the above embodiment, in the case of considering the temperature rise of the control element caused by the heat generation of the controlled element, the second element and the first element at least have the minimum distance determined in step S3. Under this distance, the crosstalk between adjacent signal lines is also a problem to be solved.

[0048] Therefore, for the circuit board of the embodiment of the present application, the crosstalk can also be reduced through relevant design. It should be understood that the greater the distance between adjacent signal lines, the smaller the crosstalk, but similar to the above embodiment, the distance between adjacent signal lines cannot be designed to be infinite, so the distance between adjacent signal lines can also be considered in the circuit board design.

[0049] As shown in Figure 2 , the circuit design method of the embodiment of the present application further comprises the following steps:

[0050] S5, after completing the layout of the first element and the plurality of second elements, a test circuit board is constructed based on the completed current layout, wherein the distance between each two adjacent signal lines in the test circuit board is arbitrarily set.

[0051] Since the test circuit board of the embodiment of the present application is only used for subsequent detection of relevant resistance parameters and is irrelevant to crosstalk, the distance between adjacent signal lines in the test circuit board of the embodiment of the present application can be arbitrarily set, and other parameters such as wire specifications and rules are the same as those of the circuit board to be designed.

[0052] S6, the resistance of the signal line between the second element and the first element, the resistance of the signal line to ground at the first element end and the resistance of the signal line to ground at the second element end in the test circuit board are obtained.

[0053] In the embodiment of the present application, the two ends of each signal line are connected to the first element and the second element, and the end connected to the first element is called the first element end, and the end connected to the second element is called the second element end. The resistance parameters can be obtained by testing in the test circuit board.

[0054] S7, the length and thickness of the signal line in the test circuit board are obtained as the length and thickness of the signal line in the circuit board to be designed.

[0055] In one embodiment of the present application, the lengths of the signal lines in the test circuit board and the circuit board to be designed are equal, or only have a small length difference. If the lengths of the signal lines in the test circuit board are not equal, the shortest length of each signal line is used as the length for subsequent calculation.

[0056] Since the first element and the second element also have a certain size, the length here is smaller than the actual distance between the second element and the first element.

[0057] S8, according to the resistance of the signal line between the second element and the first element, the ground resistance of the signal line at the first element end, the ground resistance of the signal line at the second element end, the length and thickness of the signal line in the circuit board, the minimum distance between the adjacent signal lines in the circuit board is determined.

[0058] In one embodiment of the present application, the relationship between the distance between the adjacent signal lines in the circuit board and the resistance of the signal line between the second element and the first element, the ground resistance of the signal line at the first element end, the ground resistance of the signal line at the second element end, the length and thickness of the signal line in the circuit board is:

[0059] ;

[0060] wherein, D 2 is the distance between the adjacent signal lines in the circuit board, R 1 is the ground resistance of the signal line at the first element end, R 2 is the ground resistance of the signal line at the second element end, R is the resistance of the signal line between the second element and the first element, C is the mutual capacity between the adjacent two signal lines in the circuit board, M is the mutual inductance between the adjacent two signal lines in the circuit board, l is the length of the signal line in the circuit board, h is the thickness of the signal line in the circuit board, ω is the angular frequency, K is the Coulomb constant, μ 0 is the vacuum permeability, ε 0 is the vacuum dielectric constant, A th is a preset crosstalk parameter threshold.

[0061] In other words, the minimum distance between adjacent signal lines on the circuit board can be determined based on the above relationship. When the above inequality is equal to 1, the calculated distance is... D The value of 2 represents the minimum distance between adjacent signal lines on the circuit board.

[0062] The above relationship has a preset crosstalk parameter threshold. A th Left side The physical meaning of this is: the magnitude of the quotient of the voltage phasor of one signal line at the second element terminal and the voltage phasor of the other signal line at the first element terminal. The magnitude of this value indicates the strength of crosstalk between two adjacent signal lines on the circuit board; the larger the magnitude, the stronger the crosstalk. Preset crosstalk parameter threshold. A th This is the upper limit of crosstalk between two adjacent signal lines that the control system consisting of the first and second elements can withstand. Below this upper limit, the first element can successfully send control signals to the second element, while above this upper limit, the control signals may be distorted.

[0063] In one embodiment of the present invention, a preset crosstalk parameter threshold can be obtained by manufacturing a test circuit comprising a first element, multiple second elements, and multiple signal lines, and by detecting in advance during the test the voltage of one signal line at the second element terminal and the voltage of the other signal line at the first element terminal of two adjacent signal lines in the test circuit. For example, two adjacent signal lines can be gradually brought closer together until the second element can no longer successfully receive the control signal sent by the first element. The magnitude of the quotient of the voltage phasor of one signal line at the second element terminal and the voltage phasor of the other signal line at the first element terminal, measured under the critical state, is the preset crosstalk parameter threshold. A th .

[0064] Since the test circuit is mainly used to test the robustness of the control system composed of the first and second components to crosstalk, the test circuit only needs to contain the first component, multiple second components, and multiple signal lines. There are no requirements for other parameters. Even the form of the circuit can be a circuit board or a simple form with wires connecting the first and second components.

[0065] S9, based on the minimum distance between the second element and the first element and the minimum distance between adjacent signal lines, arrange the first element, multiple second elements and multiple signal lines.

[0066] According to the circuit board design method of the further embodiment of the present application, the minimum distance between the adjacent signal lines in the circuit board can be determined according to the resistance of the signal line between the second component and the first component, the resistance of the signal line to ground at the first component end, the resistance of the signal line to ground at the second component end, the length and thickness of the signal line in the circuit board, so that the distance between the adjacent signal lines can be reasonably determined, the circuit board can be as small as possible, and the influence of the crosstalk between the adjacent signal lines on the performance of the circuit board can be effectively prevented.

[0067] The circuit board design method of the embodiment of the present application can be executed by a circuit board automatic design device, and the determination and acquisition of the parameters in each calculation condition can be from the storage device, the detection device or the input of the personnel operating the device.

[0068] Based on the circuit board design method of the above embodiment, the present application further provides a circuit board.

[0069] The circuit board of the embodiment of the present application is designed by the circuit board design method of any of the above embodiments, and the further embodiment of the circuit board of the present application can refer to each of the above embodiments, which will not be described here.

[0070] According to the circuit board of the embodiment of the present application, the distance between the control component and the controlled component is reasonable, the volume is small, the temperature rise of the control component is small, and the performance and reliability are high.

[0071] In addition, the crosstalk between the adjacent signal lines in the circuit board will not affect the performance.

[0072] In the description of the present application, the terms "first", "second" are only used for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more of the features. The meaning of "a plurality of" is two or more, unless otherwise specifically limited.

[0073] In the present application, unless otherwise specifically defined and limited, the terms "mounting", "connection", "connection", "fixing" and the like should be understood in a broad sense, for example, it can be fixed connection, or detachable connection, or integrated; it can be mechanical connection, or electrical connection; it can be directly connected, or indirectly connected through an intermediate medium; it can be the communication or interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0074] In the present application, unless specifically stated and limited otherwise, a first feature "on" or "under" a second feature can be directly in contact with the second feature, or indirectly in contact with the second feature through an intermediate medium. Also, a first feature "over", "above" and "on top of" a second feature can be directly above or obliquely above the second feature, or simply means that the first feature is horizontally higher than the second feature. A first feature "under", "below" and "underneath" a second feature can be directly below or obliquely below the second feature, or simply means that the first feature is horizontally lower than the second feature.

[0075] In the description of the specification, the description of the terms "one embodiment", "some embodiments", "an example", "a specific example", or "some examples" and the like means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the specification, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Also, the specific features, structures, materials or characteristics described can be combined in any appropriate manner in any one or more embodiments or examples. In addition, the person skilled in the art can combine and combine the different embodiments or examples described in the specification and the features of the different embodiments or examples, without contradiction.

[0076] Any process or method descriptions or descriptions of the flow diagrams in the specification or otherwise described herein can be understood as representing code modules, segments, or portions of code which include one or more executable instructions for performing specific logic functions or steps in the process, and the various embodiments of the application include additional implementations in which the order of steps can be changed, additional or alternative steps can be performed, and some steps can be performed in parallel or with partial concurrence, as will be appreciated by those skilled in the art. The description of a process or method is understood to extend to include data in addition to the described hardware elements, such as the signals, messages, and other information that can be communicated or otherwise exchanged between the hardware components in the process or method.

[0077] The logic and / or steps represented in flow diagrams or otherwise described herein, for example, can be considered as a sequence of instructions to implement logic functions, and can be embodied in any computer-readable medium for use by an instruction execution system, apparatus, or device, such as a computer-based system, processor- containing system, or other system that can fetch the instructions from the instruction execution system, apparatus, or device and execute the instructions. In the context of this specification, a "computer-readable medium" can be any means that can contain, store, communicate, propagate or transport the program for use by or in connection with the instruction execution system, apparatus, or device. The computer-readable medium can be a machine-readable storage device (e.g., magnetic, optical or other) a machine-readable storage diskette (e.g., floppy disk, optical disk, etc.), a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or Flash memory), optical fibers, and a portable compact disc read-only memory (CDROM), among others. Additionally, the computer-readable medium can be paper or another suitable medium upon which the program is printed, as the program can be electronically captured, for example via optical scanning of the paper or other medium, then compiled, interpreted, or otherwise processed in a suitable manner, if necessary, and stored in a computer memory.

[0078] It should be understood that aspects of the application can be implemented in hardware, software, firmware or combinations thereof. In the above embodiments, various steps or methods can be implemented in software or firmware that is stored in memory and executed by a suitable instruction execution system. For example, if implemented in hardware, as in another embodiment, any of the following technologies, known in the art, or combinations thereof, can be used: a discrete logic circuit having logic gates for implementing logic functions upon data signals, an application specific integrated circuit having appropriate combinational logic gates, a programmable gate array (PGA), a field programmable gate array (FPGA), or the like.

[0079] Those of skill in the art could readily implement the above described example methods with all or a portion of the disclosed steps carried out by a program for use with a computer system or similar electronic device, where the program is intended for use as intermediate steps to achieve the results indicated herein. Note that the software is not intended to be limited to the state of this technology, as it typically is defined to include any type of computer instruction or set of instructions, that can be employed to operate a computer system or other electronic device.

[0080] In addition, each function unit in each embodiment of the present application can be integrated in one processing module, or each unit can exist physically separately, or two or more units can be integrated in one module. The integrated module can be realized in the form of hardware, or in the form of software function module. When the integrated module is realized in the form of software function module and sold or used as an independent product, it can also be stored in a computer readable storage medium.

[0081] Although the embodiments of the present application have been shown and described above, it should be understood by those ordinary skilled in the art that the above embodiments are exemplary and cannot be understood as limiting the present application, and those ordinary skilled in the art can make changes, modifications, replacements and variations to the above embodiments within the scope of the present application.

Claims

1. A circuit board design method, characterized in that, The circuit board includes a first component and a plurality of second components. Each second component is connected to the first component via a corresponding signal line to receive a control signal emitted by the first component through the signal line. The method includes the following steps: Determine the upper limit of the affected temperature rise of the first component and the upper limit of the continuous operating time of the second component; Obtain the heating power of each of the second elements and the heat transfer parameters of the circuit board; The minimum distance between the second element and the first element in the circuit board is determined based on the upper limit of the affected temperature rise of the first element, the upper limit of the continuous working time of the second element, the heating power of the second element, and the heat transfer parameters of the circuit board. The first element and a plurality of second elements are arranged according to the minimum distance between the second element and the first element; After completing the layout of the first element and the plurality of second elements, a test circuit board is constructed with the completed current layout, wherein the distance between any two adjacent signal lines in the test circuit board is arbitrarily set; Obtain the resistance of the signal line between the second component and the first component, the resistance of the signal line to ground at the first component end, and the resistance of the signal line to ground at the second component end in the test circuit board. The length and thickness of the signal lines in the test circuit board are obtained as the length and thickness of the signal lines in the circuit board to be designed. The minimum distance between adjacent signal lines in the circuit board is determined based on the resistance of the signal line between the second element and the first element, the resistance of the signal line to ground at the first element end, the resistance of the signal line to ground at the second element end, and the length and thickness of the signal lines in the circuit board. The first element, a plurality of second elements, and a plurality of signal lines are arranged according to the minimum distance between the second element and the first element and the minimum distance between adjacent signal lines.

2. The circuit board design method according to claim 1, characterized in that, The heat transfer parameters of the circuit board include its thermal conductivity and thermal conductivity.

3. The circuit board design method according to claim 2, characterized in that, The thermal conductivity and thermal conductivity of the substrate on which the circuit board is made are used as the thermal conductivity and thermal conductivity of the circuit board.

4. The circuit board design method according to claim 2, characterized in that, The relationship between the distance between the second element and the first element in the circuit board and the upper limit of the affected temperature rise of the first element, the upper limit of the continuous working time of the second element, the heating power of the second element, and the heat transfer parameters of the circuit board is as follows: ， in, D 1 represents the distance between the second component and the first component in the circuit board. k Let be the thermal conductivity of the circuit board. α The thermal conductivity of the circuit board is given. t max This is the upper limit of the continuous operating time of the second element. p Δ is the average heat generation power of the second element during continuous operation. T max The affected temperature rise limit of the first element represents the maximum allowable temperature rise that each second element can bring to the first element.

5. The circuit board design method according to claim 1, characterized in that, The relationship between the distance between adjacent signal lines in the circuit board and the resistance of the signal line between the second component and the first component, the resistance of the signal line to ground at the first component end, the resistance of the signal line to ground at the second component end, and the length and thickness of the signal lines in the circuit board is as follows: ， in, D 2 represents the distance between adjacent signal lines on the circuit board. R 1 represents the resistance to ground of the signal line at the first component terminal. R 2 represents the resistance to ground of the signal line at the second component terminal. R The resistance of the signal line between the second element and the first element. C This refers to the mutual capacitance between two adjacent signal lines on the circuit board. M This refers to the mutual inductance between two adjacent signal lines on the circuit board. l The length of the signal line in the circuit board. h The thickness of the signal lines in the circuit board. ω Angular frequency, K Let Coulomb's constant be 1. μ 0 is the permeability of free space. ε 0 is the vacuum dielectric constant. A th This is the preset crosstalk parameter threshold.

6. The circuit board design method according to claim 5, characterized in that, The preset crosstalk parameter threshold is obtained by manufacturing a test circuit that includes the first element, a plurality of the second elements, and a plurality of the signal lines, and by detecting in advance during the test the voltage of one signal line at the second element terminal and the voltage of the other signal line at the first element terminal of two adjacent signal lines in the test circuit.

7. The circuit board design method according to any one of claims 1-6, characterized in that, The second component is a power device, and the first component is a control chip.

8. The circuit board design method according to claim 7, characterized in that, The second component is a power switch, an LED, or a power amplifier.

9. A circuit board, characterized in that, Designed using the circuit board design method according to any one of claims 1-8.

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