Fool-proof method for preventing scrapped PCBs from being plated with gold on circuit board multi-connecting-piece layout

Abstract

The invention provides a fool-proof method for preventing a scrapped PCB from being plated with gold on circuit board multi-connecting-piece layout, and solves the problems that the scrapped circuit board unit still can be plated with gold in a subsequent production process, the production cost is high, and the risk that the scrapped circuit board unit is lost to a client is caused. The fool-proof method comprises the following steps of: in a multi-connecting-piece typesetting production process, confirming a circuit board unit which is scrapped in circuit manufacturing process production; cutting off a lead of the scrapped circuit board unit; all the continuous circuit board units enter a gold plating production process, gold fingers on the circuit board units with the leads not cut off are plated with gold, and gold fingers on the circuit board units with the leads cut off cannot be plated with gold; and selecting out the circuit board units which are not plated with gold in the forming process, and carrying out scrap treatment. The scrapped circuit board unit is not plated with gold in the subsequent process, so that the consumption cost of precious metal gold in the gold plating process is reduced; the production time of a test which can be identified only through an electrical testing function test is reduced, and the risk of missing to a client can be obviously reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of printed circuit board unit production, and in particular to a foolproof method for preventing gold plating of scrapped PCB boards in the multi-piece layout of printed circuit boards. Background Art

[0002] In the manufacturing of PCBs (printed circuit board units), multi-piece layout is a key process that combines multiple independent PCB units (single boards) onto a large-sized production panel to improve production efficiency, reduce costs, and simplify subsequent assembly processes. The advantages of multi-piece layout in printed circuit board unit manufacturing mainly include: improving production efficiency, reducing production costs, and ensuring product quality. By combining multiple PCB board units onto a larger board and completing the processing of multiple units at once, the number of equipment adjustments can be significantly reduced, thereby improving production efficiency.

[0003] The gold fingers of a PCB board are a set of gold-plated conductive contacts on the edge of a printed circuit board unit (PCB). They are named for their golden appearance and finger-like arrangement and are mainly used for plug-in connections (such as graphics cards, memory modules, etc.). The gold fingers of a PCB board need to be electroplated with hard gold (nickel + gold alloy) on the leads, with a thickness of about 3 - 50 μm, to ensure high wear resistance.

[0004] In current PCB products with gold finger products, there will be a certain scrap rate due to various reasons. For the scrap boards in the previous process, scrap marks will be made on the PCB board, and the circuits will be cut off to ensure functional obstacles. Then, after the PCB is cut into small boards, it can be detected through electrical testing, and then picked out and sent to the scrap warehouse for scrap treatment. For the product scrap operation method, for the boards that need to be scrapped, a scrap mark is made inside the board to cut off the circuit. The production process is as follows: circuit process production -> defective product picking -> making scrap marks -> gold plating production -> forming and picking out the scrap products.

[0005] The applicant of the present invention has found that the existing technology has at least the following technical problems: This production method has the following defects: Making scrap marks on the PCB board and cutting off the circuits. Since the scrapped PCB boards are located on a continuous production panel, at this time, the production panel cannot be cut off, and the scrapped boards cannot be cut off and removed from the production panel. And the method of only making scrap marks cannot prevent the gold fingers from being plated with gold. The continuous PCBs will still enter the gold plating process because they are not cut off; Gold plating is a high-cost process in the PCB process. The already scrapped small pieces are also plated with gold, resulting in a waste of costs; It is impossible to quickly pick out this scrap during the forming process and it needs to be identified through electrical function testing, which increases the production time of testing; If the scrap marks in the previous process are made on non-functional circuits and the gold fingers are intact, there is a risk of flowing to the customer side. Summary of the Invention

[0006] The object of the present invention is to provide a foolproof method for preventing gold plating of scrapped PCB boards in the multi-piece layout of circuit boards, so as to solve the technical problems existing in the prior art that the scrapped circuit board units will still be gold plated in the subsequent production process, resulting in high production costs and the risk of leakage to the customer side. The preferred technical solutions among the many technical solutions provided by the present invention will generate many technical effects, which will be elaborated in detail below.

[0007] To achieve the above object, the present invention provides the following technical solutions:

[0008] The foolproof method for preventing gold plating of scrapped PCB boards in the multi-piece layout of circuit boards provided by the present invention includes:

[0009] During the production process of multi-piece layout, confirm the circuit board units scrapped in the circuit manufacturing process;

[0010] Cut off the leads of the scrapped circuit board units;

[0011] All continuous circuit board units enter the gold plating production process. The gold fingers on the circuit board units with uncut leads are gold plated, while the gold fingers on the circuit board units with cut leads cannot be gold plated;

[0012] In the forming process, select the circuit board units that have not been gold plated and perform scrapping treatment.

[0013] Preferably, the cutting off the leads of the scrapped circuit board units includes:

[0014] Cut off the leads on both sides of the scrapped circuit board unit to ensure that the gold fingers of the scrapped circuit board unit will not be gold plated during the gold plating process.

[0015] Preferably, the cutting off the leads of the scrapped circuit board units includes:

[0016] Use a tool to draw a cutting line along the arrangement direction of the leads, so that the cutting line cuts off all the leads in a row.

[0017] Preferably, the cutting line is one or more than two, and the cutting line is a straight line or a curve.

[0018] Preferably, the tool includes a coated knife.

[0019] Preferably, before cutting off the leads of the scrapped circuit board units, it further includes:

[0020] Set a scrapping mark on the dense circuit of the scrapped circuit board unit.

[0021] Preferably, the scrapping mark includes a cutting line, and the cutting line cuts off the circuit on the circuit board unit.

[0022] Preferably, selecting the unplated circuit board units in the molding process includes:

[0023] Identifying the unplated circuit board units in the molding process according to the color of the gold fingers of the circuit board units.

[0024] Preferably, before scrapping the unplated circuit board units selected in the molding process, it further includes:

[0025] Confirming whether the circuit board units with the leads cut are plated with gold.

[0026] Preferably, the anti-fooling method further includes:

[0027] Sending the scrapped unplated circuit board units to the scrap bin for scrapping treatment.

[0028] The anti-fooling method for preventing the gold plating of scrapped PCB boards in the multi-piece layout of the circuit boards provided by the present invention has the following beneficial effects compared with the prior art:

[0029] During the production process of the multi-piece layout, confirming the circuit board units scrapped in the circuit manufacturing process and cutting off the leads of the scrapped circuit board units. In this way, when the continuous circuit board units enter the gold plating process, the gold fingers of the circuit board units with the leads not cut are plated with gold, and the gold fingers of the circuit board units with the leads cut cannot be plated with gold, that is, the subsequent processes of the scrapped circuit board units will not be plated with gold, reducing the consumption and consumption cost of the precious metal "gold" in the gold plating process; the gold fingers are not plated with gold and the color is obvious. On the one hand, this scrapped product can be quickly picked out in the molding process, reducing the production time of the tests that need to be identified through the electrical test function. On the other hand, it can significantly reduce the risk of leakage to the customer side. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained according to these drawings.

[0031] Figure 1 It is a schematic diagram of the layout structure of the leads and dense circuits on the PCB board in the prior art;

[0032] Figure 2 It is a schematic diagram of the structure without the leads cut;

[0033] Figure 3 It is a schematic diagram of the structure of the leads after cutting;

[0034] Figure 4It is a partial structural schematic diagram of a PCB board with a cutting lead and a scrap mark;

[0035] Figure 5 It is a schematic flow diagram of an anti-fooling method for preventing gold plating of scrap PCB boards in the multi-piece layout of the circuit board of the present invention.

[0036] In the figure, 1 is the cutting line; 2 is the scrap mark; 100 is the lead; 200 is the dense circuit; 300 is the gold finger. Specific implementation manner

[0037] To make the objectives, technical solutions and advantages of the present invention clearer, the technical solutions of the present invention will be described in detail below. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other implementation manners obtained by those of ordinary skill in the art without making creative efforts fall within the scope protected by the present invention.

[0038] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "center", "length", "width", "height", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "side", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present invention. In the description of the present invention, unless otherwise specified, the meaning of "a plurality of" is two or more.

[0039] The embodiment of the present invention provides an anti-fooling method for preventing gold plating of scrap PCB boards in the multi-piece layout of the circuit board, which can reduce the consumption and consumption cost of the precious metal "gold" in the gold plating process.

[0040] The following combines Figures 2 - 5 to elaborate more specifically on the technical solutions provided by the present invention.

[0041] The anti-fooling method for preventing gold plating of scrap PCB boards in the multi-piece layout of the circuit board provided by the present invention includes: during the production process of the multi-piece layout, confirming the circuit board units scrapped in the circuit manufacturing process; cutting the leads of the scrapped circuit board units; all continuous circuit board units enter the gold plating production process, and the gold fingers 300 of the circuit board units with uncut leads 100 are gold-plated, while the gold fingers 300 of the circuit board units with cut leads 100 cannot be gold-plated; in the forming process, select the circuit board units that have not been gold-plated and perform scrap treatment.

[0042] The anti-fooling method for preventing gold plating of scrapped PCB boards in the multi-piece layout of circuit boards provided by the present invention

[0043] During the production process of multi-piece layout, confirm the circuit board units scrapped during the circuit manufacturing process, and cut off the leads of the scrapped circuit board units. In this way, when the continuous circuit board units enter the gold plating process, the gold fingers 300 of the circuit board units with uncut leads are gold-plated, while the gold fingers 300 of the circuit board units with cut leads 100 cannot be gold-plated, that is, the subsequent processes of the scrapped circuit board units will not be gold-plated, reducing the consumption and consumption cost of the precious metal "gold" in the gold plating process.

[0044] Since the gold fingers are not gold-plated and the color is obvious, on the one hand, this scrapped product can be quickly picked out during the forming process, reducing the production time of the test that needs to be identified through the electrical test function. On the other hand, the risk of leakage to the customer can be significantly reduced.

[0045] Among them, "during the circuit manufacturing process of the circuit board unit, pick out the scrapped circuit board units", and the scrapped circuit board units refer to the circuit board units that cannot be used due to various reasons during the printing circuit, such as substrate defects, graphic transfer problems (dry film / wet film process defects), etching process problems, etc.

[0046] For such scrapped circuit board units, before cutting off the leads 100 of the scrapped circuit board units, it further includes: setting a scrapped mark 2 on the dense circuit 200 of the scrapped circuit board unit.

[0047] As an optional implementation method, see Figure 4 As shown, the scrapped mark 2 includes a cutting line, and the cutting line cuts off the circuit on the circuit board unit.

[0048] Cutting off at the position of the dense circuit 200 on the circuit board unit can, to a certain extent, prevent the scrapped circuit board units from flowing to the customer.

[0049] However, if only the scrapped mark 2 is made on the PCB board and the circuit is cut off, this method cannot prevent the gold fingers from being gold-plated; gold plating is a high-cost process in the PCB process, and the already scrapped small pieces are also gold-plated, resulting in waste of costs; it is impossible to quickly pick out this scrapped product during the forming process and it needs to be identified through the electrical test function, increasing the production time of the test; if the scrapped mark 2 in the previous process is made on the non-functional circuit and the gold fingers are intact, there is a risk of flowing to the customer.

[0050] Therefore, further, after setting the scrap mark 2 on the dense circuit 200 of the scrap circuit board unit in this embodiment, the lead 100 of the scrap circuit board unit is cut; all the circuit board units are sent into the gold plating production process. Among them, the gold fingers 300 of the circuit board units with the leads 100 not cut are gold plated, and the gold fingers 300 of the circuit board units with the leads 100 cut cannot be gold plated.

[0051] As an optional implementation manner, referring to Figure 5 As shown, cutting the lead 100 of the scrap circuit board unit includes: cutting the leads 100 on both sides of the scrap circuit board unit to ensure that the gold fingers 300 of the circuit board unit with the lead 100 cut will not be plated with gold during the gold plating process.

[0052] Among them, when the lead 100 is cut and the lead 100 is completely disconnected (the copper substrate is missing), there is no conductive substrate at the fracture, and it cannot be directly gold plated. The double-sided leads 100 of the scrap circuit board unit are cut to ensure that the lead 100 is completely disconnected (the copper substrate is missing) to prevent the scrap circuit board unit from being gold plated.

[0053] As an optional implementation manner, referring to Figure 5 As shown, cutting the lead 100 of the scrap circuit board unit includes: using a tool to draw a cutting line 1 along the arrangement direction of the lead 100 so that the cutting line 1 cuts all the leads 100 in a row.

[0054] Referring to Figure 3 and Figure 4 As shown, using a tool to completely disconnect the lead 100 to make the copper substrate missing, preventing the scrap circuit board unit from being gold plated in the subsequent gold plating process, saving precious metals and reducing production costs.

[0055] As an optional implementation manner, the cutting line 1 is one or more than two, the cutting line 1 is a straight line or a curve, and the shape of the cutting line 1 is not limited, and it should be ensured that the lead 100 can be completely cut.

[0056] As an optional implementation manner, the tool includes a coated tool. The coated tool (coated cutting tool) significantly improves the cutting performance by covering one or more layers of hard films (such as TiN, TiCN, AlCrN, etc.) on the tool surface. The coating can reduce the direct friction between the tool and the workpiece, and the service life is extended by 2-5 times, especially suitable for processing high-hardness materials (such as quenched steel, titanium alloy).

[0057] As an optional implementation manner, referring to Figure 5 As shown, selecting the unplated circuit board units in the forming process includes: identifying the unplated circuit board units in the forming process according to the color of the gold fingers 300 of the circuit board units.

[0058] The gold fingers 300 are not plated with gold and the color is obvious. On the one hand, during the molding process, this can be quickly picked out as scrap, reducing the production time of the tests that need to be identified through electrical test functions, and facilitating the direct identification of the scrapped circuit board units according to the color at the position of the leads 100. On the other hand, the risk of leaking to the customer can be significantly reduced.

[0059] As an alternative implementation, before picking out the unplated circuit board units during the molding process and performing scrap treatment, it further includes: confirming whether the gold fingers 300 on the circuit board units with the leads 100 cut off are plated with gold. If the gold fingers 300 of the scrapped circuit board units are plated with gold, it means that the leads 100 are not completely cut, and the cutting depth can be increased to ensure that the leads 100 are completely cut.

[0060] As an alternative implementation, the anti-fooling method further includes: sending the unplated scrapped circuit board units to the scrap bin for scrap treatment to further prevent them from flowing into the customer.

[0061] The anti-fooling method for preventing the gold plating of scrapped PCB boards in the multi-piece layout of the circuit board in this embodiment has the following beneficial effects:

[0062] 1. Reducing the consumption cost of the precious metal "gold" in the gold plating process.

[0063] 2. The gold fingers 300 are not plated with gold and the color is obvious, which can be seen at a glance visually. During the molding process, this can be quickly picked out as scrap, reducing the production time of the tests that need to be identified through electrical test functions.

[0064] 3. The gold fingers 300 are not plated with gold, significantly reducing the risk of leaking to the customer.

[0065] In the description of this specification, specific features, structures or characteristics can be combined in a suitable manner in any one or more embodiments or examples.

[0066] In the description of this specification, the description with reference to terms such as "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in a suitable manner in any one or more embodiments or examples. In addition, without contradiction, those skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples.

[0067] As described above, it is only the specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention can easily think of changes or substitutions, which should all be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims described above.

Claims

1. A foolproof method for preventing scrapped PCB boards from being gold-plated on a multi-piece layout, characterized in that: The fool-proofing method includes: During the multi-piece layout production process, confirm the circuit board units that are scrapped during the circuit process production; Cut off the leads of the scrapped circuit board unit; All continuous circuit board units enter the gold plating production process. The gold fingers on the circuit board units whose leads have not been cut off are gold plated, while the gold fingers on the circuit board units whose leads have been cut off cannot be gold plated; During the molding process, the circuit board units that are not gold-plated are selected and scrapped.

2. The foolproof method for preventing scrapped PCB boards from being gold-plated on a multi-piece layout of a circuit board according to claim 1, characterized in that: The method of cutting off the leads of the scrapped circuit board unit comprises: The leads on both sides of the scrapped circuit board unit are cut off to ensure that the gold fingers of the scrapped circuit board unit will not be plated with gold during the gold plating process.

3. The foolproof method for preventing scrapped PCB boards from being gold-plated on a multi-piece layout of a circuit board according to claim 1, characterized in that: The method of cutting off the leads of the scrapped circuit board unit comprises: A cutting tool is used to draw a cutting line along the arrangement direction of the leads, so that the cutting line cuts off all the leads in a row.

4. The foolproof method for preventing scrapped PCB boards from being gold-plated on a multi-piece layout of a circuit board according to claim 3, characterized in that: The number of the cutting lines is one or more than two, and the cutting lines are straight lines or curves.

5. The foolproof method for preventing scrapped PCB boards from being gold-plated on a multi-piece layout of a circuit board according to claim 3, characterized in that: The cutting tool comprises a coated cutting tool.

6. The foolproof method for preventing scrapped PCB boards from being gold-plated on a multi-piece layout of a circuit board according to claim 1, characterized in that: Before cutting off the leads of the scrapped circuit board unit, the method further comprises: A scrap mark is set on a dense line of the scrap circuit board unit.

7. The foolproof method for preventing scrapped PCB boards from being gold-plated on a multi-piece layout of a circuit board according to claim 6, characterized in that: The scrap mark includes a cut-off line, and the cut-off line cuts off a line on the circuit board unit.

8. The foolproof method for preventing scrapped PCB boards from being gold-plated on a multi-piece layout of a circuit board according to claim 1, characterized in that: The step of selecting the circuit board unit without gold plating in the molding process comprises: According to the color of the gold fingers of the circuit board unit, the circuit board unit that is not gold-plated is identified in the molding process.

9. The foolproof method for preventing scrapped PCB boards from being gold-plated on a multi-piece layout of a circuit board according to claim 1, characterized in that: In the molding process, the un-gold-plated circuit board units are selected and scrapped before being scrapped. Check whether the circuit board unit with the leads cut off is gold plated.

10. The foolproof method for preventing scrapped PCB boards from being gold-plated on a multi-piece layout of a circuit board according to claim 1, characterized in that: The fool-proofing method further comprises: The un-gold-plated scrapped circuit board units are sent to the scrap bin for scrapping.

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