Integrated semiconductor chip assembly installation structure

Abstract

The invention relates to the technical field of semiconductor chip assembly, in particular to an integrated semiconductor chip assembly mounting structure which comprises a packaging bottom shell, an infrared chip, a longitudinal clamping seat and a transverse clamping seat, a mounting groove and an inserting groove are formed in the packaging bottom shell, a flexible heat insulation part is arranged on the longitudinal clamping seat, and the transverse clamping seat is arranged in the mounting groove. And the longitudinal clamping seat and the transverse clamping seat are respectively inserted into the inserting grooves, so that the transverse clamping seat is propped against the two transverse sides of the infrared chip, and the longitudinal clamping seat is propped against the two longitudinal sides of the infrared chip, so that the flexible heat insulation part tightly presses the infrared chip on the bottom surface of the mounting groove. According to the integrated semiconductor chip assembly installation structure provided by the invention, the longitudinal clamping seat and the transverse clamping seat are inserted into the insertion groove so that the infrared chip can abut against and be fixed, and the flexible heat insulation piece presses the infrared chip on the bottom surface of the installation groove, so that the infrared chip does not need to be fixed by using glue; the problem of deviation of the infrared chip caused by poor deformation of colloid filled between the infrared chip and the packaging bottom shell due to thermal expansion and cold contraction is avoided.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor chip assembly, and in particular to an integrated semiconductor chip component installation structure. Background Art

[0002] An integrated semiconductor chip refers to a chip that is manufactured by first integrating transistors into core particles with specific functions, and then integrating the core particles into chips through semiconductor technology according to application requirements. Infrared chips are also integrated semiconductor chips.

[0003] According to publication number CN118398676A, publication (announcement) date: 2024.07.26, an infrared detector packaging assembly and its production method are disclosed, including a packaging shell, an infrared chip and a sheet-like getter; the infrared chip is arranged in the cavity of the packaging shell; the sheet-like getter is arranged above the infrared chip, and the projection of the sheet-like getter covers the reference shielding area of ​​the infrared chip and avoids the working area of ​​the infrared chip. In the present invention, the sheet-like getter is directly arranged above the infrared chip as a shielding layer, which blocks the reference shielding area of ​​the infrared chip that needs to be shielded in actual work, so that the sheet-like getter can maintain the vacuum of the cavity in the assembly while taking into account the function of the light-blocking sheet, simplifying the structure of the infrared detector packaging assembly, and at the same time, the stacked sheet-like getter and infrared chip greatly increase the ratio of the size of the infrared chip to the size of the entire packaging assembly compared to the related art, thereby reducing the size of the infrared detector packaging assembly.

[0004] In the prior art including the above-mentioned patent, during the production process of infrared detectors, the infrared chip is fixed to the cavity of the packaging shell by dispensing glue, and then the infrared chip and the bonding finger gold wire are bonded to complete the electrical connection of the infrared chip, that is, the colloid is used to fix the infrared chip before welding. When the infrared detector is used on a solar energy prime mover, the coefficients of thermal expansion and contraction of the colloid and the packaging shell are inconsistent. Due to the temperature difference between day and night in the infrared detector, the infrared chip is displaced due to the difference in thermal expansion and contraction of the colloid and the packaging shell, causing the working area of ​​the infrared chip to be offset. Summary of the invention

[0005] The object of the present invention is to provide an integrated semiconductor chip assembly mounting structure for solving the above-mentioned problems.

[0006] To achieve the above object, the present invention provides the following technical solution: An integrated semiconductor chip component mounting structure, including a packaging bottom case, an infrared chip, a longitudinal card seat and a transverse card seat. An installation groove and insertion slots linearly arranged in an array on the bottom surface of the installation groove are formed in the packaging bottom case. A flexible heat insulation member is provided on the longitudinal card seat. The longitudinal card seat and the transverse card seat are respectively inserted into the insertion slots so that the transverse card seat abuts against the transverse two sides of the infrared chip, and the longitudinal card seat abuts against the longitudinal two sides of the infrared chip so that the flexible heat insulation member presses the infrared chip against the bottom surface of the installation groove.

[0007] Preferably, it further includes connection seats and gold wires symmetrically arranged on both sides of the infrared chip. Connection fingers and bonding fingers are linearly arranged on the infrared chip and the connection seats respectively. Arc-shaped wrapping grooves and through slots communicating with the wrapping grooves are linearly arranged on the flexible heat insulation member. The flexible heat insulation member is located between the connection seat and the infrared chip, and the gold wires are wedge-bonded to the connection fingers and the bonding fingers so that the middle part of the gold wires is supported by the wrapping grooves.

[0008] Preferably, a flexible installation coil in a spiral shape is provided at the first end of the longitudinal card seat. A spiral through slot is formed in the flexible heat insulation member to form a connection part matching the flexible installation coil. The longitudinal card seat is inserted into the insertion slot so that the flexible installation coil is located between the infrared chip and the connection seat.

[0009] Preferably, it further includes a getter. The two ends of the getter are welding parts. A working area and a reference area are provided on the first side surface of the infrared chip. The welding parts are respectively welded inside the packaging bottom case so that the middle part of the getter horizontally shields the reference area and exposes the working area, and the flexible heat insulation member supports the middle part of the getter below.

[0010] Preferably, supporting grooves spaced from the wrapping grooves are linearly arranged on the flexible heat insulation member. The middle part of the getter is in a wavy shape to form a bending part, and the supporting grooves support the bottom of the bending part.

[0011] Preferably, horizontally arranged extending parts are linearly arranged on the longitudinal card seat. The longitudinal card seat is inserted into the insertion slot so that the extending parts abut against the connection seat, and the extending parts are spaced from the bonding fingers.

[0012] Preferably, a movable plate is rotatably arranged on the extending part. Sliding grooves are symmetrically and linearly arranged in the installation groove. The first end of the movable plate is a contact end, and the contact end extends to the outside of the extending part. When the longitudinal card seat enters the insertion slot, the movable plate is driven to rotate so that the contact end abuts against the inner wall of the sliding groove.

[0013] Preferably, a counterweight portion is provided at the second end of the movable plate so that the movable plate is horizontally parallel to the extension portion in the default state, and the movable plate is driven to rotate to an inclined state so that the end face of the contact end abuts against the inner wall of the sliding groove and enters the sliding groove.

[0014] Preferably, the extension portion is aligned with the supporting groove, and an extrusion portion is provided at the second end of the movable plate. The extension portion abuts against the connecting seat so that the extrusion portion of the movable plate abuts against the connecting seat, and the top of the counterweight portion supports the bottom of the bent portion of the getter.

[0015] Preferably, limiting portions are symmetrically provided in the insertion slot, and limiting grooves are symmetrically formed on the longitudinal clamping seat and the transverse clamping seat respectively. The longitudinal clamping seat and the transverse clamping seat are inserted into the insertion slot so that the limiting portions abut against the limiting grooves.

[0016] In the above technical solution, an integrated semiconductor chip component mounting structure provided by the present invention has the following beneficial effects: The longitudinal clamping seat and the transverse clamping seat are inserted into the insertion slot to horizontally abut and fix the infrared chip. While the longitudinal clamping seat is inserted and fixed, the flexible heat insulation member presses the infrared chip against the bottom surface of the mounting groove, improving the stability of the fixation of the infrared chip. At the same time, it is not necessary to use colloid to fix the infrared chip, avoiding the problem of the offset of the infrared chip caused by the deformation difference of the colloid filled between the infrared chip and the encapsulation bottom shell due to thermal expansion and contraction, and improving the detection data accuracy of the infrared detector. Description of the Drawings

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments recorded in the present invention. For those of ordinary skill in the art, other drawings can also be obtained based on these drawings.

[0018] Figure 1 It is the overall structural schematic diagram provided by the embodiment of the present invention;

[0019] Figure 2 It is the overall structural cross-sectional view of the gold wire provided by the embodiment of the present invention;

[0020] Figure 3 It is the overall structural cross-sectional view of the movable plate provided by the embodiment of the present invention;

[0021] Figure 4 It is the structural schematic diagram of the encapsulation bottom shell provided by the embodiment of the present invention;

[0022] Figure 5 It is the structural schematic diagram of the infrared chip and the transverse clamping seat provided by the embodiment of the present invention;

[0023] Figure 6 Exploded structural schematic diagram of the longitudinal card holder, flexible heat insulator, gold wire and movable plate provided by the embodiment of the present invention;

[0024] Figure 7 Exploded structural schematic diagram of the encapsulation bottom shell, infrared chip and getter provided by the embodiment of the present invention;

[0025] Figure 8 Provided by the embodiment of the present invention Figure 2 Partial enlarged schematic diagram at position A in

[0026] Figure 9 Provided by the embodiment of the present invention Figure 3 Partial enlarged schematic diagram at position B in

[0027] Figure 10 Structural schematic diagram of the flexible heat insulator when it does not extrude the infrared chip provided by the embodiment of the present invention.

[0028] Explanation of reference numerals:

[0029] 1. Encapsulation bottom shell; 11. Installation groove; 111. Insertion groove; 1111. Limiting portion; 112. Sliding groove; 12. Connection seat; 121. Bonding finger; 13. Welding groove; 2. Encapsulation top shell; 21. Infrared window; 3. Infrared chip; 31. Working area; 32. Reference area; 33. Connection finger; 4. Longitudinal card holder; 41. Embedded portion; 42. Flexible installation roll; 43. Extension portion; 5. Transverse card holder; 51. Cross bar portion; 6. Flexible heat insulator; 61. Connection portion; 62. Wrapping groove; 621. Through slit; 63. Support groove; 7. Getter; 71. Bending portion; 72. Welding portion; 8. Movable plate; 81. Contact end; 82. Extrusion portion; 83. Counterweight portion; 9. Gold wire; 91. Limiting groove. Detailed implementation manners

[0030] In order to make the objectives, technical solutions and advantages of the embodiments of the present disclosure clearer, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present disclosure. Obviously, the described embodiments are some but not all of the embodiments of the present disclosure. All other embodiments obtained by those of ordinary skill in the art based on the described embodiments of the present disclosure without creative efforts shall fall within the scope of protection of the present disclosure.

[0031] As Figure 1-10As shown in the figure, an integrated semiconductor chip component mounting structure includes a packaging bottom case 1, an infrared chip 3, a longitudinal card holder 4, and a transverse card holder 5. An installation groove 11 and insertion slots 111 arranged in a linear array on the bottom surface of the installation groove 11 are formed in the packaging bottom case 1. A flexible heat insulation member 6 is provided on the longitudinal card holder 4. The longitudinal card holder 4 and the transverse card holder 5 are respectively inserted into the insertion slots 111 so that the transverse card holder 5 abuts against the two transverse sides of the infrared chip 3, and the longitudinal card holder 4 abuts against the two longitudinal sides of the infrared chip 3 so that the flexible heat insulation member 6 presses the infrared chip 3 against the bottom surface of the installation groove 11.

[0032] Specifically, it further includes a packaging top case 2. An infrared window 21 is provided on the packaging top case 2, and transverse ribs 51 are symmetrically provided on the transverse card holder 5. First, the transverse card holder 5 is inserted into the insertion slot 111, and then the infrared chip 3 is installed into the installation groove 11 so that the transverse ribs 51 of the transverse card holder 5 abut against the two transverse ends of the infrared chip 3 to complete the transverse fixation of the infrared chip 3. Then, the longitudinal card holder 4 is inserted into the insertion slot 111 so that the longitudinal card holder 4 moves to abut against the two longitudinal ends of the infrared chip 3 to complete the longitudinal fixation of the infrared chip 3. Along with the insertion of the longitudinal card holder 4, the flexible heat insulation member 6 moves synchronously to press and fix the infrared chip 3 at the bottom of the installation groove 11 to complete the fixation of the infrared chip 3, thereby facilitating the subsequent welding and wiring process of the infrared chip 3. The longitudinal card holder 4 and the transverse card holder 5 are inserted into the insertion slot 111 to make horizontal contact fixation with the infrared chip 3, and while the longitudinal card holder 4 is being inserted and fixed, the flexible heat insulation member 6 presses the infrared chip 3 against the bottom surface of the installation groove 11, improving the stability of the fixation of the infrared chip 3. At the same time, it is not necessary to use glue to fix the infrared chip 3, avoiding the problem of the infrared chip 3 shifting due to the thermal expansion and contraction deformation difference of the glue filled between the infrared chip 3 and the packaging bottom case 1, and improving the accuracy of the detection data of the infrared detector.

[0033] When the packaging top case 2 is connected to the packaging bottom case 1 through a solder sheet, the infrared window 21 of the packaging top case 2 is aligned with the infrared chip 3 in the installation groove 11.

[0034] Furthermore, limiting portions 1111 are symmetrically provided in the insertion slots 111, and limiting slots 91 are symmetrically formed on the longitudinal card holder 4 and the transverse card holder 5 respectively. The longitudinal card holder 4 and the transverse card holder 5 are inserted into the insertion slots 111 so that the limiting portions 1111 abut against the limiting slots 91. Limiting slots 91 are symmetrically formed on the embedding portion 41 of the longitudinal card holder 4. When the longitudinal card holder 4 and the transverse card holder 5 are inserted into the insertion slots 111, the limiting portions 1111 abut against the limiting slots 91 to improve the fixing stability of the longitudinal card holder 4 and the transverse card holder 5 inserted into the insertion slots 111, avoiding the problem of the infrared chip 3 shifting due to the detachment of the longitudinal card holder 4 or the transverse card holder 5.

[0035] In the above technical solution, the longitudinal card seat 4 and the transverse card seat 5 are inserted into the insertion slot 111, and the infrared chip 3 is fixed by horizontal contact. While the longitudinal card seat 4 is inserted and fixed, the flexible heat insulation member 6 presses the infrared chip 3 against the bottom surface of the installation groove 11, improving the stability of the fixation of the infrared chip 3. At the same time, there is no need to use colloid to fix the infrared chip 3, avoiding the problem of the offset of the infrared chip 3 caused by the difference in thermal expansion and contraction deformation of the colloid filled between the infrared chip 3 and the encapsulation bottom shell 1, and improving the accuracy of the detection data of the infrared detector.

[0036] As another embodiment provided by the present invention, it further includes connection seats 12 and gold wires 9 symmetrically arranged on both sides of the infrared chip 3. Linear arrays of connection fingers 33 and bonding fingers 121 are respectively arranged on the infrared chip 3 and the connection seats 12. Arc-shaped wrapping grooves 62 and through slits 621 communicating with the wrapping grooves 62 are linearly arrayed on the flexible heat insulation member 6. The flexible heat insulation member 6 is located between the connection seats 12 and the infrared chip 3, and the gold wire 9 is wedge-bonded to the connection fingers 33 and the bonding fingers 121 so that the middle part of the gold wire 9 is supported by the wrapping grooves 62.

[0037] Specifically, as Figure 5 shown, connection fingers 33 are symmetrically arranged on the infrared chip 3, and bonding fingers 121 are also arranged on the symmetrically arranged connection seats 12 in the installation groove 11. The connection seats 12 are distributed on both sides of the infrared chip 3 so that the bonding fingers 121 and the connection fingers 33 are aligned one by one. Pins electrically connected to the bonding fingers 121 are arranged outside the encapsulation bottom shell 1. As Figure 8 shown, when the longitudinal card seat 4 is inserted into the insertion slot 111 to complete the fixation of the infrared chip 3, the longitudinal card seat 4 and the flexible heat insulation member 6 are located between the connection seats 12 and the infrared chip 3. When the gold wire 9 is wedge-bonded to electrically connect the bonding fingers 121 and the connection fingers 33, one end of the gold wire 9 is first welded to the connection finger 33, and then the welding splice pulls the gold wire 9 to move towards the connection seat 12. The welding splice drives the gold wire 9 to be pressed into the wrapping groove 62 through the through slit 621 to be supported, and then the welding splice welds the gold wire 9 to the bonding finger 121 and cuts it off, completing the electrical connection between the infrared chip 3 and the connection seat 12. The wrapping groove 62 of the flexible heat insulation member 6 supports the wedge-shaped arched part of the gold wire 9 during the welding process, ensuring the stability and accuracy of the gold wire 9 during the bonding process, and avoiding the problem of poor connection caused by the displacement of the bonding position of the gold wire 9. Secondly, the wrapping groove 62 is used to wrap and protect the wedge-shaped arched part of the gold wire 9, improving the protection of the gold wire 9 and avoiding the problem of poor connection caused by accidental collision or pulling of the gold wire 9 during the subsequent encapsulation process.

[0038] As another embodiment provided by the present invention, a flexible mounting coil 42 in a spiral shape is provided at the first end of the longitudinal card holder 4. A spiral through groove is formed in the flexible heat insulation member 6 to form a connecting portion 61 that cooperates with the flexible mounting coil 42. The longitudinal card holder 4 is inserted into the insertion groove 111 so that the flexible mounting coil 42 is located between the infrared chip 3 and the connecting seat 12.

[0039] Specifically, as Figure 8 shown, one end of the longitudinal card holder 4 close to the connecting seat 12 is the first end. A flexible mounting coil 42 is provided at the first end of the longitudinal card holder 4, and a spiral through groove is formed in the flexible heat insulation member 6 to form a connecting portion 61. The flexible heat insulation member 6 is inserted and fitted with the flexible mounting coil 42 through the connecting portion 61 to form an integral body, thereby improving the installation stability of the flexible heat insulation member 6 on the longitudinal card holder 4.

[0040] Since the infrared detector will inevitably be affected by the day-night temperature difference when used on a solar energy prime mover, and the gold wire 9 is a rigid metal wire, the gold wire 9 is prone to cracking and damage when subjected to axial pressure or tension. When the infrared chip 3 expands in volume due to heat, the infrared chip 3 will exert an axial pressure on the gold wire 9, or when the infrared chip 3 contracts in volume due to cold, the infrared chip 3 will exert an axial pressure on the gold wire 9. Therefore, when the infrared chip 3 is affected by the reciprocating day-night temperature difference, the gold wire 9 is prone to cracking of the surface plating due to the reciprocating action of axial pressure and tension, which further leads to a decrease in the service life of the gold wire 9 or even damage.

[0041] After the longitudinal card holder 4 is inserted into the insertion groove 111 to fix the infrared chip 3, the flexible heat insulation member 6 and the flexible mounting coil 42 are located between the infrared chip 3 and the connecting seat 12. Then, the spiral-shaped flexible mounting coil 42 and the flexible heat insulation member 6 are used to achieve flexible buffering and support between the infrared chip 3 and the connecting seat 12. When the infrared chip 3 expands in volume due to heat, the infrared chip 3 horizontally presses the flexible heat insulation member 6 and the flexible mounting coil 42. At this time, the flexible mounting coil 42 is horizontally pressed and extends vertically, so that the flexible heat insulation member 6 exerts a radially outward pressure on the gold wire 9 away from the infrared chip 3, so that the horizontal extension distance of the gold wire 9 becomes smaller and it is no longer subjected to the axial pressure of the infrared chip 3. If the infrared chip 3 contracts in volume due to cold, the flexible mounting coil 42 and the flexible heat insulation member 6 horizontally extend and closely adhere to the infrared chip 3 due to their own elastic force, and the flexible mounting coil 42 and the flexible heat insulation member 6 vertically contract, so that the flexible heat insulation member 6 exerts a radially inward pressure on the gold wire 9 close to the infrared chip 3, so that the horizontal extension distance of the gold wire 9 becomes larger and it is no longer subjected to the axial tension of the infrared chip 3.

[0042] Thereby, by using the flexible mounting coil 42 and the flexible heat insulation member 6 to adjust the radial pressure on the gold wire 9 according to the volume change of the infrared chip 3, the axial pressure on the gold wire 9 is converted into radial pressure, further improving the protection of the gold wire 9 and preventing the gold wire 9 from being damaged due to the volume change of the infrared chip 3 caused by thermal expansion and contraction.

[0043] As another embodiment provided by the present invention, it further includes a getter 7, the two ends of which are welding parts 72. A working area 31 and a reference area 32 are provided on the first side of the infrared chip 3. The welding parts 72 are respectively welded in the encapsulation bottom case 1 so that the middle part of the getter 7 horizontally blocks the reference area 32 and exposes the working area 31, and the flexible heat insulation member 6 is supported under the middle part of the getter 7.

[0044] Specifically, as Figure 4 shown, welding grooves 13 are symmetrically arranged in the encapsulation bottom case 1. As Figure 5 shown, the top surface of the infrared chip 3 is the first side, and the working area 31 and the reference area 32 on the infrared chip 3 are located between the connecting fingers 33.

[0045] If a sheet-shaped getter 7 is used as a light-shielding sheet and vertically arranged above the infrared chip 3 to block the reference area 32, this method can reduce the longitudinal size of the infrared sensor. Since the getter 7 will have a volume expansion problem during the process of absorbing gas, a certain vertical distance needs to be maintained between the getter 7 and the infrared chip 3 to avoid contact interference of the getter 7 on the infrared chip 3.

[0046] After the electrical connection between the infrared chip 3 and the connection seat 12 is completed through the gold wire 9, the welding parts 72 of the getter 7 can be respectively welded in the welding grooves 13 to complete the fixed installation of the getter 7. After the getter 7 is fixed, it shields above the reference area 32 and exposes the working area 31. And as Figure 9 shown, at this time, the flexible heat insulation member 6 is supported under the bottom of the getter 7, thereby using the flexible heat insulation member 6 to support the getter 7, avoiding the problem that the getter 7 sags vertically after absorbing gas and expanding in volume. Thus, the vertical distance between the getter 7 and the infrared chip 3 can be reduced to further reduce the vertical size of the infrared detector and reduce the space area occupied by the infrared detector packaging component. Secondly, since the flexible heat insulation member 6 is used to wrap the gold wire 9 to separate the gold wire 9 and the getter 7, the top of the gold wire 9 in a wedge-shaped bond is separated from the getter 7 by the flexible heat insulation member 6, thus avoiding the problem that the quality of the coating on the gold wire 9 deteriorates due to the high temperature generated when the getter 7 absorbs gas, and further improving the protection of the gold wire 9.

[0047] As another embodiment provided by the present invention, the flexible heat insulation member 6 is linearly arrayed with support grooves 63 spaced from the wrapping groove 62, the middle part of the getter 7 is wavy to form a bending part 71, and the support groove 63 supports the bottom of the bending part 71.

[0048] Specifically, as Figure 6 shown, the support grooves 63 are located on the flexible heat insulation member 6 and are spaced from the wrapping groove 62, and the middle part of the getter 7 is wavy to form a bending part 71. After the welding parts 72 of the getter 7 are respectively welded in the welding grooves 13, the support grooves 63 of the flexible heat insulation member 6 support the bottom of the bending part 71, so as to further increase the surface area of the getter 7 by using the wavy bending part 71 of the getter 7, improve the speed and amount of gas absorbed by the getter 7, and improve the use effect of the getter 7. Secondly, due to the increase in the surface area of the getter 7, the heat dissipation efficiency of the getter 7 can be further improved, avoiding the problem of deterioration of the surface coating of the gold wire 9 caused by heat accumulation on the getter 7.

[0049] Secondly, since the bottom of the bending part 71 abuts against the support groove 63, when the vacuum degree in the infrared detector decreases significantly after long-term use, the getter 7 expands in volume after absorbing gas, so that the top of the bending part 71 arches vertically away from the infrared chip 3 to further avoid the problem of contact interference of the getter 7 with the infrared chip 3, and improve the protection of the infrared chip 3.

[0050] After the getter 7 expands in volume after absorbing gas, the bottom of the bending part 71 applies pressure to the inner wall of the support groove 63, and the position of the support groove 63 of the flexible heat insulation member 6 is pressed, so that the wrapping groove 62 of the flexible heat insulation member 6 is pressed against and tightly wraps the surface of the gold wire 9, thereby alleviating the surface oxidation problem of the gold wire 9 caused by the decrease in vacuum degree, further improving the protection of the gold wire 9, and improving the service life and connection stability of the gold wire 9.

[0051] As another embodiment provided by the present invention, the longitudinal card holder 4 is linearly arrayed with horizontal extension parts 43, the longitudinal card holder 4 is inserted into the insertion groove 111 so that the extension parts 43 abut against the connection seat 12, and the extension parts 43 are spaced from the bonding fingers 121.

[0052] Specifically, as Figure 6 shown, a plurality of extension parts 43 provided on the longitudinal card holder 4 are perpendicular to the embedding part 41 of the longitudinal card holder 4, as Figure 9As shown, after the embedding portion 41 is fully inserted into the insertion slot 111, the bottom of the extension portion 43 abuts against the connection base 12 to improve the installation stability of the longitudinal card holder 4, further avoiding the problem of the infrared chip 3 shifting caused by the loosening of the longitudinal card holder 4. The extension portion 43 and the bonding fingers 121 are spaced apart so that the extension portion 43 is separated between the respective bonding fingers 121, thereby avoiding the short-circuit problem caused by the accidental displacement of the gold wire 9 during the bonding to the bonding fingers 121 and improving the stability during the bonding process.

[0053] As another embodiment provided by the present invention, a movable plate 8 is rotatably provided on the extension portion 43. Sliding grooves 112 are symmetrically and linearly arrayed in the installation groove 11. The first end of the movable plate 8 is a contact end 81, and the contact end 81 extends to the outside of the extension portion 43. The longitudinal card holder 4 enters the insertion slot 111 so that the movable plate 8 is driven to rotate until the contact end 81 abuts against the inner wall of the sliding groove 112.

[0054] Specifically, as Figure 9 shown, the movable plate 8 is rotatably provided on the extension portion 43. One end of the movable plate 8 facing away from the infrared chip 3 is the first end, and one end of the movable plate 8 close to the infrared chip 3 is the second end. When it is necessary to insert the longitudinal card holder 4 into the insertion slot 111 to fix the infrared chip 3, the movable plate 8 rotates so that the contact end 81 enters and abuts against the sliding groove 112. When the longitudinal card holder 4 slides into the insertion slot 111, the contact end 81 abuts against the inner wall of the sliding groove 112 and slides to improve the vertical sliding stability of the longitudinal card holder 4, improve the horizontal support force on the longitudinal card holder 4, and avoid the problem that the longitudinal card holder 4 deforms toward the side away from the infrared chip 3 due to the extrusion of the flexible heat insulation member 6, thereby further improving the fixing stability of the longitudinal card holder 4 and the flexible heat insulation member 6 on the infrared chip 3.

[0055] As another embodiment provided by the present invention, a weight portion 83 is provided on the second end of the movable plate 8 so that the movable plate 8 is in a horizontal state and parallel to the extension portion 43 in the default state, and the movable plate 8 is driven to rotate into an inclined state so that the end face of the contact end 81 abuts against the inner wall of the sliding groove 112 and enters the sliding groove 112.

[0056] Specifically, as Figure 10As shown, due to the counterweight portion 83 provided on the movable plate 8, the weight of the counterweight portion 83 causes the movable plate 8 to be horizontally parallel to the extension portion 43 in the default state. When the movable plate 8 is in the default state, the distance that the contact end 81 extends is greater than the distance that the contact end 81 extends when the movable plate 8 is in an inclined state. As a result, when the movable plate 8 is in the default state, the longitudinal card seat 4 is stuck by the movable plate 8 and cannot be inserted into the insertion slot 111. It is necessary to first extend the contact end 81 of the movable plate 8 into the sliding slot 112 and apply a horizontal pressure to the longitudinal card seat 4 until the end face of the contact end 81 of the movable plate 8 abuts against the inner wall of the sliding slot 112. At this time, the longitudinal card seat 4 is exactly parallel to the insertion slot 111, and then the longitudinal card seat 4 can be inserted into the insertion slot 111. Thus, the movable plate 8 is used to complete the pre-positioning of the longitudinal card seat 4 before insertion, further improving the fixing stability of the infrared chip 3 when the longitudinal card seat 4 is inserted into the insertion slot 111.

[0057] As another embodiment provided by the present invention, the extension portion 43 is aligned with the supporting groove 63. An extrusion portion 82 is provided on the second end of the movable plate 8. The extension portion 43 abuts against the connecting seat 12 so that the extrusion portion 82 of the movable plate 8 abuts against the connecting seat 12, and the top of the counterweight portion 83 supports the bottom of the bent portion 71 of the getter 7.

[0058] Specifically, when the flexible heat insulation member 6 and the flexible installation roll 42 are installed as a whole, the extension portion 43 is aligned with the supporting groove 63, as Figure 9 shown. When the longitudinal card seat 4 is inserted into the insertion slot 111 to fix the infrared chip 3, the extrusion portion 82 of the movable plate 8 abuts against the connecting seat 12, the end face of the contact end 81 of the movable plate 8 abuts against the inner wall of the sliding slot 112, and the top of the counterweight portion 83 supports the bottom of the bent portion 71 of the getter 7. When the infrared detector has been used for a long time and the vacuum degree in the infrared detector has dropped significantly, after the getter 7 absorbs gas, its volume expands, causing the bottom of the bent portion 71 to apply pressure to the inner wall of the supporting groove 63, and the bent portion 71 of the getter 7 bends downward to apply pressure to the counterweight portion 83. The movable plate 8 is pressed to drive the movable plate 8 to have a tendency to rotate and reset to the default state, and the contact end 81 of the movable plate 8 abuts in the sliding slot 112. As a result, the second end of the movable plate 8 applies a horizontal pressure to the flexible installation roll 42, causing the flexible installation roll 42 and the flexible heat insulation member 6 to deform and elongate vertically to increase the distance between the getter 7 and the infrared chip 3, further avoiding the problem that the volume-expanded getter 7 contacts and interferes with the infrared chip 3 and improving the protection of the infrared chip 3. Secondly, the flexible heat insulation member 6 is also pressed by the flexible installation roll 42 and the getter 7 to further closely wrap the gold wire 9, further improving the wrapping protection of the gold wire 9.

[0059] Working principle: First, insert the horizontal card seat 5 into the insertion slot 111. Then, install the infrared chip 3 into the installation slot 11, making the crossbar portion 51 of the horizontal card seat 5 abut against the horizontal two ends of the infrared chip 3 to complete the horizontal fixation of the infrared chip 3. Subsequently, the contact end 81 of the movable plate 8 extends into the sliding slot 112, and horizontally presses the longitudinal card seat 4 until the end face of the contact end 81 of the movable plate 8 abuts against the inner wall of the sliding slot 112. At this time, the longitudinal card seat 4 is exactly parallel to the insertion slot 111. Then, the longitudinal card seat 4 can be inserted into the insertion slot 111. Subsequently, insert the longitudinal card seat 4 into the insertion slot 111 again to complete the longitudinal fixation of the infrared chip 3. And with the insertion of the longitudinal card seat 4, the flexible heat insulation member 6 moves synchronously to squeeze the infrared chip 3 and fix it at the bottom of the installation slot 11, completing the fixation of the infrared chip 3;

[0060] Subsequently, the welding head first welds one end of the gold wire 9 to the connection finger 33. Then, the welding head pulls the gold wire 9 towards the connection seat 12. The welding head drives the gold wire 9 to be pressed into the wrapping groove 62 through the passing slot 621 and is supported. Subsequently, the welding head welds the gold wire 9 to the bonding finger 121 and cuts it off, completing the electrical connection between the infrared chip 3 and the connection seat 12;

[0061] Weld the welding portions 72 of the getter 7 to the welding grooves 13 respectively to complete the fixed installation of the getter 7. After the getter 7 is fixed, it is shielded above the reference area 32 and the working area 31 is exposed. The supporting groove 63 of the flexible heat insulation member 6 supports the bottom of the bent portion 71 of the getter 7;

[0062] Finally, weld the encapsulation bottom shell 1 and the encapsulation top shell 2 through the solder sheet, and the infrared window 21 of the encapsulation top shell 2 is aligned with the working area 31 of the infrared chip 3.

[0063] Only some exemplary embodiments of the present invention are described by way of illustration above. Undoubtedly, for those of ordinary skill in the art, without departing from the spirit and scope of the present invention, the described embodiments can be modified in various different ways. Therefore, the above drawings and descriptions are illustrative in nature and should not be construed as limiting the protection scope of the claims of the present invention.

Claims

1. An integrated semiconductor chip assembly mounting structure, characterized in that: The invention comprises a packaging bottom shell (1), an infrared chip (3), a longitudinal card seat (4) and a transverse card seat (5); the packaging bottom shell (1) is provided with a mounting groove (11) and plugging grooves (111) arranged in a linear array on the bottom surface of the mounting groove (11); a flexible heat insulating member (6) is arranged on the longitudinal card seat (4); the longitudinal card seat (4) and the transverse card seat (5) are respectively plugged into the plugging groove (111) so that the transverse card seat (5) contacts the transverse sides of the infrared chip (3); and the longitudinal card seat (4) contacts the longitudinal sides of the infrared chip (3) so that the flexible heat insulating member (6) presses the infrared chip (3) against the bottom surface of the mounting groove (11).

2. The integrated semiconductor chip assembly installation structure according to claim 1, characterized in that: The invention also comprises a connection seat (12) and a gold wire (9) symmetrically arranged on both sides of the infrared chip (3); the infrared chip (3) and the connection seat (12) are respectively provided with connection fingers (33) and bonding fingers (121) in a linear array; the flexible thermal insulation member (6) is provided with an arc-shaped wrapping groove (62) and a through slit (621) connected to the wrapping groove (62) in a linear array; the flexible thermal insulation member (6) is located between the connection seat (12) and the infrared chip (3); and the gold wire (9) is bonded to the connection finger (33) and the bonding finger (121) in a wedge shape so that the middle part of the gold wire (9) is supported by the wrapping groove (62).

3. The integrated semiconductor chip assembly installation structure according to claim 2, characterized in that: A vortex-shaped flexible mounting coil (42) is provided on the first end of the longitudinal clamping seat (4), a vortex-shaped through groove is provided on the flexible heat insulating member (6) to form a connecting portion (61) that matches the flexible mounting coil (42), and the longitudinal clamping seat (4) is plugged into the plug-in groove (111) so that the flexible mounting coil (42) is located between the infrared chip (3) and the connecting seat (12).

4. The integrated semiconductor chip assembly installation structure according to claim 3, characterized in that: It also includes a getter (7) having two ends formed as welding portions (72); a working area (31) and a reference area (32) are provided on the first side of the infrared chip (3); the welding portions (72) are respectively welded to the bottom shell (1) of the package so that the middle of the getter (7) parallelly blocks the reference area (32) and exposes the working area (31); and the flexible heat insulating member (6) is supported below the middle of the getter (7).

5. The integrated semiconductor chip assembly mounting structure according to claim 4, characterized in that: The flexible thermal insulation member (6) is provided with a linear array of supporting grooves (63) spaced apart from the wrapping grooves (62); the middle portion of the getter (7) is wavy to form a curved portion (71); and the supporting grooves (63) are supported on the bottom of the curved portion (71).

6. The integrated semiconductor chip assembly mounting structure according to claim 5, characterized in that: The longitudinal card seat (4) is provided with horizontal extension parts (43) arranged in a linear array, the longitudinal card seat (4) is inserted into the insertion slot (111) so that the extension parts (43) abut against the connection seat (12), and the extension parts (43) and the bonding fingers (121) are distributed at intervals.

7. The integrated semiconductor chip assembly mounting structure according to claim 6, characterized in that: A movable plate (8) is rotatably arranged on the extension portion (43), and a sliding groove (112) is provided in a symmetrical linear array in the installation groove (11). The first end of the movable plate (8) is a contact end (81), and the contact end (81) extends to the outside of the extension portion (43). The longitudinal card seat (4) enters the plug-in groove (111) so that the movable plate (8) is driven to rotate until the contact end (81) contacts the inner wall of the sliding groove (112).

8. The integrated semiconductor chip assembly mounting structure according to claim 7, characterized in that: A counterweight portion (83) is provided on the second end of the movable plate (8) so that the movable plate (8) is horizontal and parallel to the extension portion (43) in a default state, and the movable plate (8) is driven to rotate in an inclined state so that the end surface of the contact end (81) contacts the inner wall of the sliding groove (112) and enters the sliding groove (112).

9. The integrated semiconductor chip assembly mounting structure according to claim 8, characterized in that: The extension portion (43) is aligned with the supporting groove (63), and an extrusion portion (82) is provided on the second end of the movable plate (8). The extension portion (43) abuts against the connecting seat (12) so that the extrusion portion (82) of the movable plate (8) abuts against the connecting seat (12), and the top of the counterweight portion (83) supports the bottom of the curved portion (71) of the getter (7).

10. The integrated semiconductor chip assembly mounting structure according to claim 1, characterized in that: The inserting slot (111) is symmetrically provided with a limiting portion (1111), and the longitudinal clamping seat (4) and the transverse clamping seat (5) are symmetrically provided with limiting slots (91) respectively; the longitudinal clamping seat (4) and the transverse clamping seat (5) are inserted into the inserting slot (111) so that the limiting portion (1111) abuts against the limiting slot (91).

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