Super-lens LED packaging structure, super-lens LED lamp panel and backlight system

Abstract

The invention relates to the technical field of super-lens packaging, in particular to a super-lens LED packaging structure, a super-lens LED lamp panel and a backlight system. According to the technical scheme, the LED lamp comprises an LED support, an LED wafer and a super lens, a metal electrical connection frame is arranged in the LED support, and a mounting step is arranged on the top of the LED support; the LED wafer is fixed in the LED bracket; and the super lens is fixed on the mounting step through packaging glue. According to the invention, the ultra-thin design is realized by integrally packaging the super lens and the LED wafer, the light is accurately regulated and controlled by using the microstructure on the surface of the super lens, the light spot uniformity is improved, the LED consumption and the dependence on the optical film are obviously reduced, the system adaptability is enhanced by the flexible layout of the driving chip, and the reliability is improved and the service life is prolonged by the closed packaging structure. The ultrathin performance, the optical performance, the cost and the reliability are comprehensively optimized, and an innovative solution is provided for a backlight system with high cost performance and high performance.

Description

Technical Field

[0001] The present invention relates to the technical field of superlens packaging, and particularly to a superlens LED packaging structure, a superlens LED lamp board, and a backlight system. Background Art

[0002] In existing LED backlight products, in order to achieve better optical consistency across the entire backlight surface, a large number of LEDs are generally arranged in an array on the backlight plane, and a secondary optical lens is encapsulated or surface-mounted on the LEDs to make the light present a uniform optical distribution on the plane. However, with the requirements for thinner products and further cost requirements, traditional LED technologies cannot achieve comprehensive improvements in terms of thinness, display effect, cost, etc. Therefore, this application proposes a superlens LED packaging structure, a superlens LED lamp board, and a backlight system. Summary of the Invention

[0003] The object of the present invention is to address the problem in the background art that traditional LED technologies cannot achieve comprehensive improvements in terms of thinness, display effect, cost, etc., and to propose a superlens LED packaging structure, a superlens LED lamp board, and a backlight system.

[0004] In a first aspect, the present application provides a superlens LED packaging structure, including:

[0005] An LED bracket, which has a metal electrical connection frame inside and an installation step at the top;

[0006] An LED chip, fixed inside the LED bracket and electrically connected to the metal electrical connection frame;

[0007] A superlens, fixed on the installation step through encapsulation glue, parallel to the light-emitting plane of the LED chip, forming a sealed packaging space;

[0008] Wherein, the surface of the superlens is provided with regularly arranged optical microstructures for regulating the light angle and spot uniformity emitted by the LED chip.

[0009] Optionally, the thickness of the superlens is 0.2 - 2 mm, the material is silicon or a transparent resin material, and the optical microstructures are formed by semiconductor manufacturing processes.

[0010] Optionally, the sealed packaging space is filled with encapsulation glue or remains unfilled to adapt to different optical property requirements.

[0011] Optionally, the LED bracket has a bowl-shaped structure, is made of epoxy resin or silicone resin, and the metal electrical connection frame is made of copper.

[0012] Optionally, the optical microstructure of the superlens is a columnar structure of a rectangle, a circle or a composite pattern, which is used to expand the light-emitting angle of a single LED to more than 120°.

[0013] In a second aspect, the present application provides a superlens LED lamp board, including:

[0014] A PCB board;

[0015] The superlens LED packaging structure as described in the first aspect is mounted on the PCB board (1) in a matrix form;

[0016] A driving chip, which is mounted on the PCB board or externally disposed, and is used to drive the light emission and dimming of the superlens LED packaging structure.

[0017] Optionally, the arrangement pitch of the superlens LED packaging structures is set according to the requirements of the light mixing height and the optical plane uniformity of the backlight system.

[0018] In a third aspect, the present application provides a backlight system, including:

[0019] The superlens LED lamp board as described in the second aspect;

[0020] An optical plane, which is arranged parallel to the upper part of the LED lamp board and includes a diffusion plate and an optical film group;

[0021] Wherein, the distance (OD value) between the optical plane and the LED lamp board is determined according to the optical characteristics of the superlens and the requirements of the spot uniformity.

[0022] Optionally, the optical film group includes at least one of a diffusion sheet, a prism sheet, and a quantum film.

[0023] Optionally, the thickness of the optical plane is 1-2 mm, and the number of LEDs is reduced by more than 20% compared with the traditional backlight system.

[0024] Compared with the prior art, the present application includes at least one of the following beneficial technical effects:

[0025] By integrally packaging the superlens and the LED wafer, the additional assembly of the traditional secondary lens is omitted, the thickness of the backlight module is reduced by more than 30%, and the optical plane (OD value) is significantly reduced, realizing the demand for ultra-thin display.

[0026] The microstructures (rectangles, circles or composite patterns) regularly arranged on the surface of the superlens can accurately control the light. The light-emitting angle of a single LED is expanded to more than 120°, the spot uniformity is improved by 30%, and the dependence on the diffusion film is reduced. The mass production characteristics of the semiconductor process of the superlens reduce the manufacturing cost. At the same time, the smaller number of LEDs (reduced by more than 20%) and the simplified film group (with a thickness of only 1-2 mm) greatly reduce the material and assembly costs.

[0027] The driving chip can be surface-mounted or externally placed to adapt to different design scenarios; the LED arrangement pitch and the optical characteristics of the superlens are synergistically optimized to support diverse backlight requirements. The hermetic packaging structure avoids environmental interference, and the encapsulation glue fixation enhances mechanical stability, extends the LED service life, and ensures light efficiency consistency.

[0028] By integrally packaging the superlens and the LED wafer, the present invention achieves a ultra-thin design, and uses the microstructures on the surface of the superlens to precisely control light, improving the spot uniformity, significantly reducing the dependence on LED usage and optical films. At the same time, the mass production characteristics of semiconductor processes reduce the manufacturing cost, the flexible layout of the driving chip enhances the system adaptability, and the hermetic packaging structure improves the reliability and service life, comprehensively optimizing in terms of ultra-thinness, optical performance, cost, and reliability, providing an innovative solution for high-cost-performance and high-performance backlight systems. Description of the Drawings

[0029] Figure 1 It is a schematic structural diagram of a superlens LED packaging structure;

[0030] Figure 2 It is a schematic structural diagram of a superlens LED lamp board.

[0031] Reference numerals: 1, PCB board; 2, LED bracket; 3, LED wafer; 4, mounting step; 5, superlens; 6, optical plane; 7, driving chip. Detailed Embodiments

[0032] The technical solutions of the present invention will be further described below in conjunction with the drawings and specific embodiments.

[0033] Embodiment 1

[0034] As Figure 1 shown, a superlens LED packaging structure proposed by the present invention includes an LED bracket 2, an LED wafer 3, and a superlens 5. The structure will be described in detail below.

[0035] The interior of the LED bracket 2 is made of copper or other metal materials to form an electrical connection framework. On this basis, materials such as epoxy resin or silicone resin are used to form a bowl-shaped structure, and there is an installation step 4 for installing a superlens at the top. During the encapsulation process, the superlens 5 is assembled into the LED bracket 2 using encapsulation glue to form a sealed enclosed space, and the superlens 5 is parallel to the light-emitting plane of the LED chip 3. In the space formed by the LED bracket 2 and the superlens 5, encapsulation glue can be filled or not filled, which is designed according to the optical characteristics of the product. By integrally encapsulating the superlens 5 and the LED chip 3, the assembly process of the traditional secondary lens is simplified, the encapsulation process complexity is reduced, and at the same time, the sealed structure improves the optical stability and consistency, avoiding the interference of the external environment on the light effect.

[0036] In this embodiment, the LED chip 3 is fixed inside the LED bracket 2 and is electrically connected to the metal electrical connection framework; the LED chip is the light-emitting material of the LED, fixed on the LED bracket 2 through encapsulation glue, and is electrically connected to the metal layer of the LED bracket 2 through the electrodes of the LED chip 3 itself, or a metal wire is used to electrically connect the electrodes of the LED chip to the metal layer of the LED bracket. When a corresponding voltage is applied to the metal electrode of the LED bracket 2, the current is transmitted to the LED chip and causes the LED chip 3 to emit light. The design of direct electrical connection or wire bonding ensures the reliability of current transmission, improves the light-emitting efficiency, and at the same time, the fixing effect of the encapsulation glue enhances the mechanical stability of the LED chip 3 and extends the service life.

[0037] Among them, the superlens 5 is the core device of the present invention. The superlens 5 is rectangular or circular with a length, width or diameter of 1-10 mm and a thickness of 0.2-2 mm. Regularly arranged rectangular or circular and other forms of graphic columnar structures are designed on the surface, and through semiconductor processing technology, a metasurface is formed, and then the transmitted light is guided and constrained. The superlens 5 has an ultra-thin and ultra-small size compared with traditional silicon material or plastic material lenses, and has better optical characteristics, and can be quickly designed and mass-produced through semiconductor processes. When the LED chip 3 emits light, the light passes through the superlens 5 encapsulated in the LED bracket 2 to magnify the optical angle and form a larger-sized and better-uniformity light spot on a predetermined optical plane. The optical characteristics of the superlens 5 itself need to be designed according to the selection of the LED chip and the entire backlight module system.

[0038] Among them, the surface of the metalens 5 is provided with regularly arranged optical microstructures for regulating the light angle and spot uniformity of the light emitted by the LED chip 3. The optical microstructures of the metalens 5 are columnar structures with rectangular, circular or composite shapes, which are used to expand the light-emitting angle of a single LED to more than 120°. The silicon material and ultra-thin size of the metalens 5 significantly reduce the overall packaging thickness. The metasurface design realizes the expansion of the light-emitting angle of a single LED chip 3 to more than 120° by precisely regulating the light angle and distribution, while the spot uniformity is increased by more than 30%, reducing the dependence on additional optical films. Through customized optical microstructure design, the spot shape and uniformity can be flexibly adjusted according to different backlight requirements to meet diverse application scenarios, while reducing the number of LEDs used and lowering the system cost.

[0039] Example 2

[0040] This Example 1 provides a metalens LED light board, as Figure 2 shown, which includes a PCB board 1, a metalens LED packaging structure as described in Example 1, and a driving chip 7.

[0041] Among them, the PCB board 1 mounts the metalens LED packaging structure on the PCB board 1 in a patch form. According to the product design requirements, several metalens LED packaging structures are arranged in a matrix on the PCB board 1, and a driving chip 7 corresponding to the LED is designed as needed. The whole constitutes the LED light board. When the LED light board is powered on, the driving chip drives the LED to emit light, and a uniform optical plane is formed on the backlight emitting plane. The matrix-arranged metalens LED packaging structures can achieve a more uniform optical plane on the premise of reducing the number of LEDs through optimized optical design. At the same time, the patch mounting simplifies the manufacturing process, reduces the assembly cost and production cycle.

[0042] In addition, the driving chip 7 is mounted on the PCB board 1 or externally placed, and is used to drive the light emission and dimming of the metalens LED packaging structure. The driving chip 7 is a chip used to drive the metalens LED packaging structure to emit light. One driving chip 7 can drive multiple LEDs to emit light in a constant current manner. The driving chip 7 does not have to be mounted on the LED light board, and can also be externally placed as a separate control board to control all the LED light boards. The arrangement spacing of the metalens LED packaging structures is set according to the requirements of the mixing height and optical plane uniformity of the backlight system. The flexible layout (mounting or external placement) of the driving chip enhances the adaptability of the system design. The constant current driving mode ensures the light intensity consistency, and the optimized design of the spacing further reduces the mixing height (OD value), making the thickness of the backlight module reduced by more than 20% compared with the traditional scheme.

[0043] Example 3

[0044] This embodiment provides a backlight system, including a superlens LED light board as described in Embodiment 2; and an optical plane 6. The optical plane 6 is disposed parallel above the LED light board and includes a diffusion plate and an optical film group. Among them, the OD value of the distance between the optical plane 6 and the LED light board is determined according to the optical characteristics of the superlens and the requirements of spot uniformity. The optical film group includes at least one of a diffusion sheet, a prism sheet, and a quantum film. The thickness of the optical plane is 1-2 mm, and the number of LEDs is reduced by more than 20% compared with the traditional backlight system. Through the optical expansion ability of the superlens, the number of film layers and the total thickness required for the optical plane are significantly reduced (only 1-2 mm is required), while the number of LEDs is reduced by more than 20%, the overall system cost is reduced by 10%-30%, and the display brightness and uniformity are better than the traditional solution.

[0045] The above specific embodiments are merely several alternative embodiments of the present invention. Based on the technical solutions of the present invention and the relevant inspirations of the above embodiments, those skilled in the art can make various alternative improvements and combinations to the above specific embodiments.

Claims

1. A superlens LED packaging structure, characterized in that: include: An LED bracket (2) having a metal electrical connection frame inside and a mounting step (4) on the top; An LED chip (3) is fixed in the LED bracket (2) and electrically connected to the metal electrical connection frame; The super lens (5) is fixed on the mounting step (4) by packaging glue and is parallel to the light-emitting plane of the LED chip (3) to form a closed packaging space; Wherein, the surface of the super lens (5) is provided with regularly arranged optical microstructures for adjusting the angle of light and the uniformity of light spots emitted by the LED chip (3).

2. A superlens LED packaging structure according to claim 1, characterized in that: The thickness of the super lens (5) is 0.2-2 mm, and the material is silicon or transparent resin material.

3. A superlens LED packaging structure according to claim 1, characterized in that: The enclosed packaging space is filled with packaging glue or remains unfilled.

4. A superlens LED packaging structure according to claim 1, characterized in that: The LED bracket (2) is in a bowl-cup-shaped structure and is made of epoxy resin or silicone resin; the metal electrical connection frame is made of copper.

5. A superlens LED packaging structure according to claim 1, characterized in that: The optical microstructure of the super lens (5) is a rectangular, circular or composite columnar structure, and is used to expand the light-emitting angle of a single LED to more than 120°.

6. A super lens LED light board, characterized in that: include: PCB board (1); The superlens LED packaging structure according to any one of claims 1 to 5 is mounted on the PCB board (1) in a matrix form; A driving chip (7) is mounted on the PCB board (1) or is externally mounted and is used to drive the light emission and dimming of the super lens LED packaging structure.

7. A super lens LED light board according to claim 6, characterized in that: The arrangement spacing of the super lens LED packaging structure is set according to the light mixing height and optical plane uniformity requirements of the backlight system.

8. A backlight system, characterized in that: include: The super lens LED light board as claimed in claim 6 or 7; The optical plane (6) is arranged parallel to the top of the LED light board and comprises a diffusion plate and an optical film group.

9. The backlight system according to claim 8, characterized in that: The optical film group includes at least one of a diffusion film, a prism film, and a quantum film.

10. The backlight system according to claim 9, characterized in that: The thickness of the optical plane (6) is 1-2 mm.

Images