Organic light emitting diode display device

Abstract

An organic light emitting diode display device is provided. The organic light emitting diode display device includes a display panel including an organic light emitting diode. The heat dissipation member faces the display panel. The heat dissipation member includes a plurality of heat dissipation layers having different thicknesses and different thermal conductivity from each other.

Description

[0001] Cross - reference to related applications

[0002] This application claims the priority of Korean Patent Application No. 10 - 2023 - 0184122, filed with the Korean Intellectual Property Office on December 18, 2023, the disclosure of which is incorporated herein by reference in its entirety. Technical field

[0003] The present disclosure relates to a display device, and more particularly, to an organic light - emitting diode display device whose heat dissipation speed can be increased. Background art

[0004] Organic light - emitting diode displays have a self - emitting property and do not require a separate light source compared to liquid crystal displays. Therefore, organic light - emitting diode displays have a reduced thickness and weight. In addition, organic light - emitting diode displays are becoming increasingly popular as next - generation displays for televisions, monitors, and portable electronic devices due to their high - quality characteristics such as low power consumption, high brightness, and high response speed. Summary of the invention

[0005] Aspects of the present disclosure provide an organic light - emitting diode display device whose heat dissipation speed can be increased.

[0006] According to an embodiment of the present disclosure, an organic light - emitting diode display device includes a display panel including organic light - emitting diodes. A heat dissipation member faces the display panel. The heat dissipation member includes a plurality of heat dissipation layers having different thicknesses and different thermal conductivities from each other.

[0007] In an embodiment, the plurality of heat dissipation layers includes: a first heat dissipation layer; and a second heat dissipation layer between the first heat dissipation layer and the display panel.

[0008] In an embodiment, the second heat dissipation layer has a higher thermal conductivity than that of the first heat dissipation layer and has a smaller thickness than that of the first heat dissipation layer.

[0009] In an embodiment, the ratio of the thickness of the first heat dissipation layer to the thickness of the second heat dissipation layer is about 19:1.

[0010] In an embodiment, the first heat dissipation layer has a thickness of about 820 μm and a thermal conductivity of about 240 W / mk, and the second heat dissipation layer has a thickness of about 100 μm and a thermal conductivity of about 1000 W / mk.

[0011] In an embodiment, the first heat dissipation layer includes natural graphite, and the second heat dissipation layer includes artificial graphite.

[0012] In an embodiment, the plurality of heat dissipation layers include: a first heat dissipation layer; a second heat dissipation layer between the first heat dissipation layer and the display panel; and a third heat dissipation layer between the first heat dissipation layer and the second heat dissipation layer.

[0013] In an embodiment, the third heat dissipation layer has a thickness greater than that of the second heat dissipation layer and less than that of the first heat dissipation layer, and the first heat dissipation layer has a thermal conductivity higher than that of the third heat dissipation layer and a conductivity lower than that of the second heat dissipation layer.

[0014] In an embodiment, the ratio of the thickness of the first heat dissipation layer, the thickness of the third heat dissipation layer, and the thickness of the second heat dissipation layer is about 16:3:1.

[0015] In an embodiment, the first heat dissipation layer has a thickness of about 500 μm or 820 μm and a thermal conductivity of about 240 W / mk, the second heat dissipation layer has a thickness of about 100 μm and a thermal conductivity of about 1000 W / mk, and the third heat dissipation layer has a thickness of about 300 μm and a thermal conductivity of about 202 W / mk.

[0016] In an embodiment, the first heat dissipation layer includes natural graphite, the third heat dissipation layer includes a metal, and the second heat dissipation layer includes artificial graphite.

[0017] In an embodiment, the third heat dissipation layer includes aluminum.

[0018] In an embodiment, the organic light emitting diode display device further includes a housing surrounding the plurality of heat dissipation layers.

[0019] In an embodiment, the housing has at least one exhaust hole penetrating the housing.

[0020] In an embodiment, the housing includes a first surface and a second surface facing each other. The second surface is arranged closer to the display panel than the first surface, and at least one exhaust hole penetrates the second surface of the housing.

[0021] In an embodiment, the organic light emitting diode display device further includes a housing selectively surrounding at least one of the plurality of heat dissipation layers.

[0022] In an embodiment, the plurality of heat dissipation layers include: a first heat dissipation layer; and a second heat dissipation layer between the first heat dissipation layer and the display panel, and the housing surrounds the first heat dissipation layer.

[0023] In an embodiment, the plurality of heat dissipation layers include: a first heat dissipation layer; a second heat dissipation layer between the first heat dissipation layer and the display panel; and a third heat dissipation layer between the first heat dissipation layer and the second heat dissipation layer, and the housing surrounds the first heat dissipation layer.

[0024] In an embodiment, the total thickness of the plurality of heat dissipation layers is in the range of about 50% to about 150% of the thickness of the display panel.

[0025] In an embodiment, the total thickness of the plurality of heat dissipation layers is in the range of about 0.5 mm to about 1.5 mm.

[0026] According to an aspect of the present disclosure, a display device includes a display panel. A heat dissipation member is disposed on the display panel and dissipates heat generated by the display panel from the display panel. The heat dissipation member includes: a first heat dissipation layer disposed on the display panel and extending in a first direction and a second direction intersecting the first direction; and a second heat dissipation layer disposed between the first heat dissipation layer and the display panel and extending in the first direction and the second direction. Compared with the second heat dissipation layer, the first heat dissipation layer has a heat diffusion characteristic of diffusing more heat generated by the display panel in the thickness direction of the heat dissipation member than in the first direction and the second direction.

[0027] The effects of the embodiments of the present disclosure are not limited to the above effects, and according to the following description, other effects not described herein will become apparent to those skilled in the art. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] These and / or other aspects will become apparent and more readily appreciated from the following description of non-limiting embodiments, taken in conjunction with the accompanying drawings, in which:

[0029] Figure 1 is an exploded perspective view of a display device according to an embodiment;

[0030] Figure 2 is a plan view of a display device according to an embodiment;

[0031] Figure 3 is a circuit diagram of a display device according to an embodiment;

[0032] Figure 4 is a side view of a display device according to an embodiment;

[0033] Figure 5 is a sectional view of a display device according to an embodiment;

[0034] Figure 6 is a sectional view of a display device according to an embodiment;

[0035] Figure 7 is a sectional view of a display device according to an embodiment;

[0036] Figure 8 is a sectional view of a display device according to an embodiment;

[0037] Figure 9 is a cross-sectional view of a display device according to an embodiment;

[0038] Figure 10 is a cross-sectional view of a display device according to an embodiment;

[0039] Figure 11 is a cross-sectional view of a display device according to an embodiment;

[0040] Figure 12 is a cross-sectional view of a display device according to an embodiment;

[0041] Figures 13 to 17 is a cross-sectional view illustrating the structure of a light-emitting element according to an embodiment;

[0042] Figure 18 is an illustration of an embodiment according to Figure 16 a cross-sectional view of an example of an organic light-emitting diode;

[0043] Figure 19 is an illustration of an embodiment according to Figure 17 a cross-sectional view of an example of an organic light-emitting diode;

[0044] Figure 20 is a cross-sectional view illustrating the pixel structure of a display device according to an embodiment;

[0045] Figure 21 is a diagram for explaining the effect of a display device according to an embodiment; and

[0046] Figure 22 is a diagram for explaining the effect of a display device according to an embodiment. Detailed Embodiments

[0047] Advantages and features of the present disclosure and methods for achieving them will become apparent from the following description of non-limiting embodiments with reference to the accompanying drawings. However, the present disclosure is not limited to the embodiments disclosed herein, but can be implemented in various different ways. These embodiments are provided so that the disclosure of the present disclosure is thorough and will fully convey the scope of the present disclosure to those skilled in the art. Note that the scope of the present disclosure is defined only by the claims.

[0048] As used herein, the phrase "element A is on element B" means that element A can be directly disposed on element B and / or element A can be indirectly disposed on element B via another element C. Throughout the description, like reference numerals denote like elements. The numbers, dimensions, ratios, angles, and quantities of the elements given in the drawings are illustrative only and not restrictive.

[0049] Although terms such as first, second, etc. are used to arbitrarily distinguish between the elements described by these terms, these terms do not necessarily aim to indicate the timing or other priorities of these elements. These terms are only used to distinguish one element from another. Thus, as used herein, within the scope of the technology of the present disclosure, the first element may be the second element.

[0050] The multiple features of the various embodiments of the present disclosure may be partially or fully combined. As will be clearly understood by those skilled in the art, various technical interactions and operations are possible. The various embodiments can be practiced individually or in combination.

[0051] Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings.

[0052] Figure 1 is an exploded perspective view of a display device 1 according to an embodiment.

[0053] Reference Figure 1 , the display device 1 according to an embodiment can be applied to a smart phone, a mobile phone, a tablet personal computer (PC), a personal digital assistant (PDA), a portable multimedia player (PMP), a television, a game console, a wristwatch-type electronic device, a head-mounted display, a monitor of a personal computer, a laptop computer, a car navigation system, a car dashboard, a digital camera, a video camera, an outdoor billboard, an electronic display board, a medical device, an inspection device, various household appliances such as a refrigerator and a washing machine, or an Internet of Things (IoT) device. However, the embodiments of the present disclosure are not necessarily limited thereto.

[0054] In this specification, for ease of explanation, a large display device such as a television (e.g., a large organic light-emitting diode display device) will be described as an example of the display device 1. In an embodiment, the television may have a high resolution or an ultra-high resolution such as HD, UHD, 4K, or 8K.

[0055] In addition, the display device 1 according to an embodiment can be variously classified according to the display method. For example, in some embodiments, the display device 1 can be classified as an organic light emitting diode display device, an inorganic electroluminescence (EL) display device, a quantum dot light emitting display device (QED), a micro light emitting diode display device, a nano light emitting diode display device, a plasma display panel (PDP), a field emission display (FED) device, a cathode ray tube (CRT) display device, a liquid crystal display (LCD) device, or an electrophoretic display (EPD) device. For ease of explanation, the organic light emitting diode display device will be described below as an example of the display device 1. Unless specifically distinguished, the organic light emitting diode display device applied to the described embodiment will be simply abbreviated as the display device 1. However, the embodiments of the present disclosure are not necessarily limited to the organic light emitting diode display device, and other display devices listed above or known in the art can also be applied.

[0056] In an embodiment, the display device 1 can include a heat dissipation member 60, a display panel 10, and a front cover 40. In an embodiment, for example, the heat dissipation member 60, the display panel 10, and the front cover 40 can be arranged along the third direction DR3. The display panel 10 can be arranged between the heat dissipation member 60 and the front cover 40 (e.g., in the third direction DR3).

[0057] In an embodiment, the display panel 10 can be a self-luminous display panel. The display panel 10 as a self-luminous display panel can be an organic light emitting display panel including organic light emitting diodes. However, the embodiments of the present disclosure are not necessarily limited thereto, and other types of display panels such as liquid crystal display panels, quantum dot organic light emitting display panels, quantum dot liquid crystal display panels, quantum nano light emitting display panels, and micro light emitting diode display panels can also be applied.

[0058] In an embodiment, the display panel 10 can include a substrate SUB (see Figure 4 ) and a display layer DU arranged on the substrate SUB (see Figure 4 ). The detailed structure of the display panel 10 will be described later with reference to Figure 4 etc.

[0059] The heat dissipation member 60 can face the display panel 10. In an embodiment, the heat dissipation member 60 can dissipate the heat generated from the display panel 10 and the driving board 30 away from the display panel 10 to another space inside the display device 1 or to the outside (e.g., the external environment). For example, in an embodiment, the heat dissipation member 60 can dissipate the heat generated from the display panel 10 and the driving board 30 to the internal space of the front cover 40 or to the outside of the display device 1 (e.g., the external environment).

[0060] According to an embodiment, the heat dissipation member 60 can include a metal such as aluminum.

[0061] The display device 1 including a heat dissipation member such as the heat dissipation member 60 can quickly dissipate or disperse the heat generated from the driving board 30.

[0062] In an embodiment, the front cover 40 and the heat dissipation member 60 can surround the display panel 10 and the driving board 30. The front cover 40 can protect the display panel 10 and the driving board 30 from external impacts.

[0063] In an embodiment, the front cover 40 can include a highly transparent material to allow the light emitted from the display panel 10 to pass through it. For example, in an embodiment, the front cover 40 can include a polymer resin such as polyimide or glass. However, the embodiments of the present disclosure are not necessarily limited thereto. In an embodiment, the front cover 40 can include an opening in the region overlapping with the display area DPA (see Figure 2 ).

[0064] In an embodiment, each of the heat dissipation member 60, the display panel 10, and the front cover 40 can include opposite long sides extending in a first direction DR1 and opposite short sides extending in a second direction DR2. However, the embodiments of the present disclosure are not necessarily limited thereto, and the shapes of the heat dissipation member 60, the display panel 10, and the front cover 40 can be changed.

[0065] In some embodiments, the display device 1 may not include the front cover 40.

[0066] Figure 2 is a plan view of the display device 1 according to an embodiment.

[0067] Reference Figure 2 , the display device 1 according to an embodiment can have a square shape in a plan view. For example, the display device 1 can have a rectangular shape (e.g., in a plane defined by a first direction DR1 and a second direction DR2). However, the embodiments of the present disclosure are not necessarily limited thereto.

[0068] In some embodiments, when the display device 1 is a television, the opposite long sides can be positioned in the horizontal direction. However, the embodiments of the present disclosure are not necessarily limited thereto, and the opposite long sides can also be positioned in the vertical direction, or the display device 1 can be rotatably mounted such that the opposite long sides can be variably positioned in the horizontal direction or the vertical direction.

[0069] The display device 1 can include a display area DPA and a non-display area NDA. The display area DPA can be an active area where an image is displayed. In an embodiment, the display area DPA can have a rectangular shape similar to the overall shape of the display device 1 in a plan view (e.g., in a plane defined by a first direction DR1 and a second direction DR2). However, the embodiments of the present disclosure are not necessarily limited thereto.

[0070] The display area DPA may include a plurality of pixels PX. The plurality of pixels PX may be arranged in a matrix form. In an embodiment, each of the plurality of pixels PX may be rectangular or square in a plan view (e.g., in a plane defined in a first direction DR1 and a second direction DR2). However, embodiments of the present disclosure are not necessarily limited thereto. For example, in an embodiment, each of the plurality of pixels PX may have a rhombus shape having each side inclined with respect to the side of the display device 1. The pixel PX may include pixels PX that provide light of different colors (e.g., wavelengths). For example, in an embodiment, the pixel PX may include a red pixel that provides red light, a green pixel that provides green light, and a blue pixel that provides blue light. However, embodiments of the present disclosure are not necessarily limited thereto, and the pixel PX may have various different colors. In an embodiment, the plurality of colored pixels PX may be alternately arranged in a stripe or pentile type.

[0071] In an embodiment, the non-display area NDA may be arranged around the display area DPA (e.g., in the first direction DR1 and / or the second direction DR2). The non-display area NDA may form a border of the display device 1. The non-display area NDA may completely or partially surround the display area DPA (e.g., in the first direction DR1 and / or the second direction DR2).

[0072] In some embodiments, the display area DPA may have a rectangular shape, and the non-display area NDA may be arranged adjacent to the four sides of the display area DPA. For example, in an embodiment, the non-display area NDA may include a first non-display area NDA1 arranged adjacent to the first opposite long side of the display device 1 (e.g., Figure 2 the lower side in the first direction DR1), a second non-display area NDA2 arranged adjacent to the second opposite long side (e.g., Figure 2 the upper side in the first direction DR1), a third non-display area NDA3 arranged adjacent to the first opposite short side (e.g., Figure 2 the left side in the second direction DR2), and a fourth non-display area NDA4 arranged adjacent to the second opposite short side (e.g., Figure 2 the right side in the second direction DR2).

[0073] In an embodiment, in the non-display area NDA, a driving circuit or a driving element for driving elements in the display area DPA may be arranged. For example, in the first non-display area NDA1 and the second non-display area NDA2, a pad portion may be positioned on the substrate SUB of the display panel 10, and an external device EXD may be mounted on the pad electrode of the pad portion. In an embodiment, each of the plurality of external devices EXD may include a circuit component CCM described later (seeFigure 4 ) Examples of the external device EXD may include a connection film, a printed circuit board, a driving chip DIC, a connector, and a wiring connection film. However, embodiments of the present disclosure are not necessarily limited thereto. For another example, in the third non-display area NDA3, a scan driver SDR directly disposed on the substrate SUB of the display panel 10 may be arranged.

[0074] Figure 3 is a circuit diagram of the display device 1 according to an embodiment.

[0075] Reference Figure 3 , a plurality of lines may be arranged on the substrate SUB of the display device 1. In an embodiment, the plurality of lines may include a scan line SCL, a sense signal line SSL, a data line DTL, a reference voltage line RVL, and a first power supply line ELVDL.

[0076] In an embodiment, the scan line SCL and the sense signal line SSL may extend in the second direction DR2. The scan line SCL and the sense signal line SSL may be connected to the scan driver SDR. In an embodiment, the scan driver SDR may include a driving circuit composed of a plurality of circuit layers. In an embodiment, the scan driver SDR may be arranged in the third non-display area NDA3. However, embodiments of the present disclosure are not necessarily limited thereto, and the scan driver SDR may also be arranged in the fourth non-display area NDA4, or may also be arranged in both the third non-display area NDA3 and the fourth non-display area NDA4. In an embodiment, the scan driver SDR may be connected to the signal connection line CWL, and at least one end of the signal connection line CWL may form a pad WPD_CW in the first non-display area NDA1 and / or the second non-display area NDA2, and thus may be connected to the external device EXD (see Figure 2 ).

[0077] In the drawings, the first direction DR1 and the second direction DR2 are horizontal directions and intersect each other. For example, the first direction DR1 and the second direction DR2 may be orthogonal to each other. In addition, the third direction DR3 may be a vertical direction intersecting the first direction DR1 and the second direction DR2, for example, orthogonal to the first direction DR1 and the second direction DR2. However, embodiments of the present disclosure are not necessarily limited thereto, and the first direction DR1, the second direction DR2, and the third direction DR3 may intersect at various different angles. In this specification, the direction indicated by the arrow of each of the first direction DR1 to the third direction DR3 may be referred to as one side, and the opposite direction may be referred to as the other side.

[0078] In an embodiment, the data line DTL and the reference voltage line RVL may extend in a first direction DR1 intersecting a second direction DR2. The first power supply line ELVDL may include a portion extending in the first direction DR1. The first power supply line ELVDL may further include a portion extending in the second direction DR2. In an embodiment, the first power supply line ELVDL may have a mesh structure. However, embodiments of the present disclosure are not necessarily limited thereto.

[0079] A wiring pad WPD may be disposed at at least one end of each of the data line DTL, the reference voltage line RVL, and the first power supply line ELVDL. Each wiring pad WPD may be disposed in a pad portion PDA of the non-display area NDA. In an embodiment, the wiring pad WPD of the data line DTL (hereinafter referred to as "data pad WPD_DT") may be disposed in the pad portion PDA of the first non-display area NDA1, and the wiring pad WPD of the reference voltage line RVL (hereinafter referred to as "reference voltage pad WPD_RV") and the wiring pad WPD of the first power supply line ELVDL (hereinafter referred to as "first power supply pad WPD_ELVD") may be disposed in the pad portion PDA of the second non-display area NDA2. Alternatively, the data pad WPD_DT, the reference voltage pad WPD_RV, and the first power supply pad WPD_ELVD may all be disposed in the same area, for example, in the first non-display area NDA1. The external device EXD (see Figure 2 ) may be mounted on the wiring pad WPD as described above. In an embodiment, the external device EXD may be mounted on the wiring pad WPD by an anisotropic conductive film, ultrasonic bonding, etc.

[0080] In an embodiment, each pixel PX on the substrate SUB of the display panel 10 may include a pixel driving circuit. The above lines may send driving signals to each pixel driving circuit while passing through or around each pixel PX. The pixel driving circuit may include a transistor and a capacitor. The number of transistors and capacitors in each pixel driving circuit can be changed differently and is not necessarily limited to those shown in the figure.

[0081] Figure 4 is a side view of the display device 1 according to an embodiment. Figure 5 is a cross-sectional view of the display device 1 according to an embodiment.

[0082] Refer to Figure 4 and Figure 5 , the display panel 10 may include a substrate SUB and a display layer DU.

[0083] The substrate SUB can be a base substrate or a base member. In an embodiment, the substrate SUB can be a flexible substrate capable of being bent, folded, curled, etc. For example, in an embodiment, the substrate SUB can include a polymer resin such as polyimide (PI). However, embodiments of the present disclosure are not necessarily limited thereto. In an embodiment, the substrate SUB can include a glass material or a metal material.

[0084] In an embodiment, the display layer DU can include a thin film transistor layer, a light emitting element layer, and a thin film encapsulation layer.

[0085] In an embodiment, the thin film transistor layer can include a plurality of thin film transistors constituting a pixel circuit of a pixel PX and Figure 3 each line described therein. The light emitting element layer can include a plurality of light emitting elements each including a first electrode, a light emitting layer, and a second electrode to emit light. The thin film encapsulation layer can cover the upper surface and side surfaces of the light emitting element layer and can protect the light emitting element layer. In an embodiment, the thin film encapsulation layer can include at least one inorganic layer and at least one organic layer.

[0086] In an embodiment, the circuit member CCM can be a connection film, a driving integrated circuit (IC) chip, a connector, a rigid printed circuit board (PCB), or a flexible printed circuit board (FPCB). In an embodiment where the circuit member CCM is a flexible member, the circuit member CCM can be bent such that at least a part of the circuit member CCM faces the rear surface of the substrate SUB.

[0087] The circuit member CCM can be mounted on the substrate SUB through a pad portion PDA. In an embodiment, one end of the circuit member CCM can be connected to the substrate SUB, and the other end of the circuit member CCM can be connected to the driving board 30. In an embodiment where a plurality of circuit members CCM are connected, both ends of each circuit member CCM can be connected to other circuit members CCM.

[0088] Through the bending of the circuit member CCM, the driving board 30 can be positioned behind the substrate SUB (e.g., in the third direction DR3). In an embodiment, the driving board 30 can be spaced apart from the display panel 10. In a non-limiting embodiment, the driving board 30 can be parallel to the display panel 10.

[0089] In an embodiment, as Figure 4 shown, the driving board 30 can be positioned on the opposite side of the display panel 10, with the heat dissipation member 60 interposed therebetween (e.g., in the third direction DR3). In an embodiment, the driving board 30 can be arranged to overlap the center of the heat dissipation member 60 in a plan view. In an embodiment, the driving board 30 can be supported and fixed by a support member SPT disposed between the heat dissipation member 60 and the driving board 30.

[0090] In an embodiment, the driving board 30 may include a processor, a memory, and / or an interface. In an embodiment, the driving board 30 may include various electronic components, such as integrated circuit chips and the like.

[0091] In the drawings, a chip-on-film (COF) structure is illustrated in which the substrate SUB, the circuit component CCM, and the driving board 30 are connected in this order. However, embodiments of the present disclosure are not necessarily limited thereto. For example, in an embodiment, a chip-on-plastic (COP) structure may be provided in which the driving board 30 is directly mounted on the substrate SUB without the need for the circuit component CCM and the substrate SUB itself is bent. However, other embodiments may be implemented in which the driving board 30 is disposed on the rear surface of the display panel 10 and the heat dissipation member 60 is disposed between the display panel 10 and the driving board 30 (e.g., in the third direction DR3).

[0092] The heat dissipation member 60 may be disposed between the display panel 10 and the driving board 30 (e.g., in the third direction DR3). For example, the heat dissipation member 60 may be disposed behind the display panel 10 and in front of the driving board 30.

[0093] In this specification and the drawings, "front" refers to the direction indicated by the third direction DR3, and "rear" refers to the direction indicated by the reverse direction of the third direction DR3 (hereinafter referred to as the third reverse direction).

[0094] In some embodiments, the heat dissipation member 60 may directly contact the rear surface of the display panel 10. Accordingly, the heat generated from the display panel 10 can be transferred to the heat dissipation member 60.

[0095] As illustrated in the drawings, in an embodiment, the heat dissipation member 60 may be spaced apart from the driving board 30 with the support member SPT interposed therebetween. However, embodiments of the present disclosure are not necessarily limited thereto. In some embodiments, in order to reduce the thickness of the display device 1 and increase the heat dissipation efficiency, the support member SPT may be omitted, and the heat dissipation member 60 may directly contact the driving board 30. Even in embodiments in which the support member SPT is provided, the distance between the heat dissipation member 60 and the driving board 30 may be minimized. Accordingly, the heat generated from the driving board 30 can be transferred to the heat dissipation member 60.

[0096] The heat dissipation member 60 may dissipate the heat generated from the display panel 10 and the driving board 30 to another space inside the display device 1 or to the outside (e.g., the external environment).

[0097] Figure 5 is a cross-sectional view of the display device 1 according to an embodiment.

[0098] As Figure 5As shown in the figure, the display device 1 according to the embodiment may include a rear cover 50, a display panel 10, a heat dissipation member 60, and an adhesive layer 750.

[0099] In an embodiment, the display panel 10 may include a light-blocking layer BM disposed in the non-display area NDA. For example, the light-blocking layer BM may be disposed on the edge of the display panel 10. In an embodiment, in a plan view, the light-blocking layer BM may be shaped like a closed curve surrounding the heat dissipation layer 650. For example, in a plan view, the light-blocking layer BM may be shaped like a quadrilateral ring.

[0100] In an embodiment, the adhesive layer 750 may be disposed between the edge of the rear cover 50 and the edge of the display panel 10 (e.g., in the third direction DR3). In a plan view, the adhesive layer 750 may be shaped like a closed curve surrounding the heat dissipation member 60 between the edge of the rear cover 50 and the edge of the display panel 10. For example, in a plan view, the adhesive layer 750 may be shaped like a quadrilateral ring surrounding the heat dissipation member 60. One surface of the adhesive layer 750 may be attached to the rear cover 50, and the other surface of the adhesive layer 750 may be attached to the display panel 10 (e.g., the substrate SUB of the display panel 10).

[0101] The heat dissipation member 60 may be disposed between the rear cover 50 and the display panel 10 (e.g., in the third direction DR3). In a plan view, the heat dissipation member 60 may have a quadrilateral shape. The heat dissipation member 60 may include a housing 600 and a heat dissipation layer 650. For example, the heat dissipation member 60 may be disposed in a first space S1 surrounded and defined by the rear cover 50, the display panel 10, and the adhesive layer 750.

[0102] The housing 600 may define a second space S2 (e.g., an internal space) in which a heat dissipation layer 650 is disposed. The housing 600 may include a first housing plate 601 and a second housing plate 602 that face each other in a third direction DR3. The first housing plate 601 and the second housing plate 602 may be spaced apart from each other in the third direction DR3. The first housing plate 601 and the second housing plate 602 may be joined to each other at their edges (e.g., the edges in a first direction DR1). For example, the edge of the first housing plate 601 may be bent toward the edge of the second housing plate 602, and the edge of the second housing plate 602 may be bent toward the edge of the first housing plate 601. Since the edges of the first housing plate 601 and the second housing plate 602 are in direct contact (and / or joined) with each other, the second space S2 of the housing 600 may be sealed. The portion where the edges of the first housing plate 601 and the second housing plate 602 are joined may be used as a flange 603 for sealing the housing 600. In an embodiment, the adhesive layer 750, the flange 603 of the housing 600, and the bent portion adjacent to the flange 603 may be covered by a light-blocking layer BM. For example, the adhesive layer 750, the flange 603 of the housing 600, and the bent portion adjacent to the flange 603 may overlap with the light-blocking layer BM (e.g., in the third direction DR3).

[0103] In an embodiment, the first housing plate 601 may include a first inner plate 601a and a first outer plate 601b. The first inner plate 601a and the first outer plate 601b may have substantially the same shape as each other. For example, in an embodiment, the first inner plate 601a and the first outer plate 601b may have the same shape as the shape of the first housing plate 601 described above. The first inner plate 601a and the first outer plate 601b may be in direct contact (and / or joined) with each other. The first inner plate 601a and the first outer plate 601b may have the same thickness. For example, in an embodiment, each of the first inner plate 601a and the first outer plate 601b may have a thickness of about 25 μm (e.g., the length in the third direction DR3). In an embodiment, the first inner plate 601a may include polyurethane, and the first outer plate 601b may include polyethylene terephthalate.

[0104] In an embodiment, the second housing plate 602 may include a second inner plate 602a and a second outer plate 602b. The second inner plate 602a and the second outer plate 602b may have substantially the same shape as each other. For example, the second inner plate 602a and the second outer plate 602b may have the same shape as the shape of the second housing plate 602 described above. The second inner plate 602a and the second outer plate 602b may be in direct contact (and / or joined) with each other. The second inner plate 602a and the second outer plate 602b may have the same thickness. For example, in an embodiment, each of the second inner plate 602a and the second outer plate 602b may have a thickness of about 25 μm (e.g., the length in the third direction DR3). In an embodiment, the second inner plate 602a may include polyurethane, and the second outer plate 602b may include polyethylene terephthalate.

[0105] The first inner plate 601a and the second inner plate 602a may be in direct contact (and / or joined) with each other at an edge (e.g., an edge in the first direction DR1).

[0106] In an embodiment, the heat dissipation layer 650 may be disposed in the second space S2 defined by the housing 600. For example, the heat dissipation layer 650 may be disposed between the first housing plate 601 and the second housing plate 602. As a specific example, the heat dissipation layer 650 may be disposed between the first inner plate 601a and the second inner plate 602a (e.g., in the third direction DR3).

[0107] The heat dissipation layer 650 may include a plurality of heat dissipation layers. For example, in an embodiment, the heat dissipation layer 650 may include a first heat dissipation layer 651 and a second heat dissipation layer 652 stacked in the third direction DR3 within the second space S2 defined by the housing 600. The first heat dissipation layer 651 and the second heat dissipation layer 652 may include different materials from each other. In addition, the first heat dissipation layer 651 and the second heat dissipation layer 652 may have different thicknesses from each other. Here, the thickness of the heat dissipation layer 650 may mean the dimension of the heat dissipation layer 650 in the third direction DR3. In addition, the first heat dissipation layer 651 and the second heat dissipation layer 652 may have a thermal conductivity.

[0108] The first heat dissipation layer 651 may be disposed on the first housing plate 601. For example, the first heat dissipation layer 651 may be disposed within the housing 600 between the first housing plate 601 and the second heat dissipation layer 652 (e.g., in the third direction DR3). As a specific example, the first heat dissipation layer 651 may be disposed between the first inner plate 601a and the second heat dissipation layer 652 (e.g., disposed directly therebetween in the third direction DR3). One surface of the first heat dissipation layer 651 may be in direct contact with the first inner plate 601a of the housing 600, and the other surface of the first heat dissipation layer 651 may be in direct contact with the second heat dissipation layer 652. In an embodiment, the first heat dissipation layer 651 may have anisotropic heat diffusion characteristics that dissipate more heat in the area direction (e.g., in the first direction DR1 and the second direction DR2 that define the area of the first heat dissipation layer 651 in a plan view) than in the thickness direction (e.g., the third reverse direction). In an embodiment, the first heat dissipation layer 651 may have a thermal conductivity of about 240 W / mk. In an embodiment, the first heat dissipation layer 651 may include natural graphite. For example, in an embodiment, the first heat dissipation layer 651 may be substantially or entirely composed of natural graphite.

[0109] The second heat dissipation layer 652 may be disposed on the first heat dissipation layer 651 (e.g., disposed directly thereon in the third direction DR3). For example, the second heat dissipation layer 652 may be disposed within the housing 600 between the first heat dissipation layer 651 and the second housing plate 602 (e.g., in the third direction DR3). As a specific example, the second heat dissipation layer 652 may be disposed between the first heat dissipation layer 651 and the second inner plate 602a (e.g., in the third direction DR3). One surface of the second heat dissipation layer 652 may be in direct contact with the first heat dissipation layer 651, and the other surface of the second heat dissipation layer 652 may be in direct contact with the second inner plate 602a of the housing 600. In an embodiment, the second heat dissipation layer 652 may have anisotropic heat diffusion characteristics that dissipate more heat in the area direction (e.g., in the first direction DR1 and the second direction DR2 that define the area of the second heat dissipation layer 652 in a plan view) than in the thickness direction (e.g., the third reverse direction). In an embodiment, the second heat dissipation layer 652 may have a thermal conductivity of about 1000 W / mk. In an embodiment, the second heat dissipation layer 652 may include artificial graphite. For example, in an embodiment, the second heat dissipation layer 652 may be substantially or entirely composed of artificial graphite.

[0110] In an embodiment, the total thickness (T1 + T2) of the heat dissipation layer 650, which is the sum of the thickness T1 of the first heat dissipation layer 651 and the thickness T2 of the second heat dissipation layer 652, may be in the range of about 50% to about 200% of the thickness Tp of the display panel 10. For example, in an embodiment, the total thickness of the heat dissipation layer 650 may be in the range of about 50% to about 150% of the thickness of the display panel 10. Here, the thickness Tp of the display panel 10 may mean the thickness from the substrate SUB of the display panel 10 to the encapsulation layer of the display panel 10. For example, the thickness Tp of the display panel 10 may mean the distance from the lower surface of the substrate SUB to the upper surface of the encapsulation layer in the third direction DR3. According to an embodiment, the total thickness of the heat dissipation layer 650 may be in the range of about 0.5 mm to about 1.5 mm.

[0111] According to an embodiment in which the heat dissipation layer 650 includes a plurality of heat dissipation layers 650, the thicknesses of the plurality of heat dissipation layers 650 may be different from each other. For example, in an embodiment, the thickness T1 of the first heat dissipation layer 651 may be greater than the thickness T2 of the second heat dissipation layer 652. According to an embodiment, the ratio of the thickness of the first heat dissipation layer 651 made of natural graphite to the thickness of the second heat dissipation layer 652 made of artificial graphite may be about 19:1. For example, when the thickness T1 of the first heat dissipation layer 651 is about 19 μm, the thickness T2 of the second heat dissipation layer 652 may be about 1 μm. According to an embodiment, the thickness ratio between the first heat dissipation layer 651 and the second heat dissipation layer 652 may be greater than about 19:1. For example, when the thickness T1 of the first heat dissipation layer 651 is about 820 μm, the thickness T2 of the second heat dissipation layer 652 may be about 100 μm.

[0112] According to an embodiment, the thermal conductivity of the first heat dissipation layer 651 may be lower than the thermal conductivity of the second heat dissipation layer 652. For example, in an embodiment, the thermal conductivity of the first heat dissipation layer 651 may be about 240 W / mk, and the thermal conductivity of the second heat dissipation layer 652 may be about 1000 W / mk. In an embodiment, as described above, the thickness T1 of the first heat dissipation layer 651 may be greater than the thickness T2 of the second heat dissipation layer 652. For example, according to an embodiment, although the thermal conductivity of the first heat dissipation layer 651 made of natural graphite has a value smaller than the thermal conductivity of the second heat dissipation layer 652 made of artificial graphite, the thickness T1 of the first heat dissipation layer 651 may have a value greater than the thickness T2 of the second heat dissipation layer 652 (T1 > T2).

[0113] According to an embodiment, the area of the first heat dissipation layer 651 and the area of the second heat dissipation layer 652 may be the same in a plan view (e.g., in a plane defined by a first direction DR1 and a second direction DR2). For example, the area of the first heat dissipation layer 651 based on the dimensions in the first direction DR1 and the dimensions in the second direction DR2 may be the same as the area of the second heat dissipation layer 652 based on the dimensions in the first direction DR1 and the dimensions in the second direction DR2. For example, the edge (e.g., end) of the first heat dissipation layer 651 and the edge (e.g., end) of the second heat dissipation layer 652 may overlap each other in a third direction DR3 such that the entire region of the first heat dissipation layer 651 and the entire region of the second heat dissipation layer 652 overlap each other.

[0114] Figure 6 is a cross-sectional view of the display device 1 according to an embodiment.

[0115] Figure 6 The display device 1 Figure 5 is different from the display device 1 described above in that: it further includes an exhaust hole 601c. Therefore, this difference will be mainly described as follows, and for ease of description, the repeated description of similar or identical elements may be omitted.

[0116] As Figure 6 illustrated, the display device 1 (e.g., the first housing plate 601) may further include an exhaust hole 601c (e.g., a vent hole). The exhaust hole 601c may be disposed in the housing 600. For example, in an embodiment, the exhaust hole 601c may be disposed in the surface of the housing 600 on a side opposite to the contact surface between the housing 600 and the display panel 10. The exhaust hole 601c may penetrate the surface of the housing 600. For example, as Figure 6 shown, the exhaust hole 601c may penetrate the first housing plate 601 of the housing 600 in the third direction DR3, such as the entirety of the first inner plate 601a and the first outer plate 601b. A plurality of exhaust holes 601c may be provided. In an embodiment, in a plan view, the exhaust hole 601c may have a circular shape. However, the embodiments of the present disclosure are not necessarily limited thereto. The heated air inside the housing 600 may be released to the outside (e.g., the external environment) of the housing 600 through the exhaust hole 601c. Therefore, the heat dissipation effect of the heat dissipation member 60 can be further increased. Although Figure 6 a plurality of exhaust holes 601c are shown, in some embodiments, the housing 600 may include at least one exhaust hole 601c.

[0117] Figure 7 is a cross-sectional view of the display device 1 according to an embodiment.

[0118] Figure 7 The display device 1 Figure 5The display device 1 is different in that: it further includes a third heat dissipation layer 653. Therefore, this difference will be mainly described as follows, and for the sake of convenience of description, the repeated description of similar or identical elements may be omitted.

[0119] As Figure 7 As illustrated, the display device 1 may further include a third heat dissipation layer 653. For example, the heat dissipation layer 650 may include a first heat dissipation layer 651, a third heat dissipation layer 653, and a second heat dissipation layer 652 that are sequentially stacked on the first inner plate 601a along the third direction DR3.

[0120] The third heat dissipation layer 653 may be disposed between the first heat dissipation layer 651 and the second heat dissipation layer 652 (e.g., in the third direction DR3). One surface of the third heat dissipation layer 653 may be in direct contact with the first heat dissipation layer 651, and the other surface of the third heat dissipation layer 653 may be in direct contact with the second heat dissipation layer 652. In an embodiment, the third heat dissipation layer 653 may have anisotropic heat diffusion characteristics that dissipate more heat in the area direction (e.g., the first direction DR1 and the second direction DR2 that define the area of the third heat dissipation layer 653 in a plan view) than in the thickness direction (e.g., the third reverse direction). In an embodiment, the third heat dissipation layer 653 may have a thickness T3 (T2 < T3 < T1) that is greater than the thickness T2 of the second heat dissipation layer 652 and less than the thickness T1 of the first heat dissipation layer 651. In an embodiment, the third heat dissipation layer 653 may have a thermal conductivity of about 202 W / mk. The third heat dissipation layer 653 may include a metal. For example, the third heat dissipation layer 653 may include aluminum (Al). For example, the third heat dissipation layer 653 may be substantially or completely composed of a metal such as aluminum (Al).

[0121] The thickness ratio among the first heat dissipation layer 651, the third heat dissipation layer 653, and the second heat dissipation layer 652 may be, for example, about 16:3:1. For example, when the thickness T1 of the first heat dissipation layer 651 is about 16 μm, the thickness T3 of the third heat dissipation layer 653 may be about 3 μm, and the thickness T2 of the second heat dissipation layer 652 may be about 1 μm. According to an embodiment, the thickness T1 of the first heat dissipation layer 651 may be about 820 μm (or 500 μm), the thickness T3 of the third heat dissipation layer 653 may be about 300 μm, and the thickness T2 of the second heat dissipation layer 652 may be about 100 μm.

[0122] According to an embodiment, the area of the first heat dissipation layer 651, the area of the third heat dissipation layer 653, and the area of the second heat dissipation layer 652 may be the same in a plan view. For example, the area of the first heat dissipation layer 651 based on the dimensions in the first direction DR1 and the dimensions in the second direction DR2, the area of the third heat dissipation layer 653 based on the dimensions in the first direction DR1 and the dimensions in the second direction DR2, and the area of the second heat dissipation layer 652 based on the dimensions in the first direction DR1 and the dimensions in the second direction DR2 may be equal to each other. In an embodiment, the edges (e.g., ends) of the first heat dissipation layer 651, the edges (e.g., ends) of the third heat dissipation layer 653, and the edges (e.g., ends) of the second heat dissipation layer 652 may overlap each other in the third direction DR3 such that the entire regions of the first heat dissipation layer 651, the entire region of the third heat dissipation layer 653, and the entire region of the second heat dissipation layer 652 overlap each other.

[0123] Although Figure 7 The embodiment shown in

[0124] Figure 8 is a cross-sectional view of the display device 1 according to an embodiment.

[0125] Figure 8 The display device 1 of Figure 7 is different from the display device 1 of

[0126] as Figure 8 illustrated, and further includes an exhaust hole 601c. Therefore, this difference will be mainly described as follows, and for the sake of convenience of description, the repeated description of similar or identical elements may be omitted. Figure 8 The exhaust hole 601c of Figure 6 is substantially the same as the exhaust hole 601c of Figure 8 above. Therefore, for the detailed description of the exhaust hole 601c of Figure 6 reference may be made to

[0127] Figure 9 is a cross-sectional view of the display device 1 according to an embodiment.

[0128] Figure 9 The display device 1 of the embodiment shown in Figure 5 is different from the display device 1 shown in

[0129] As shown Figure 9 Figure 9 In the embodiment where the heat dissipation layer 650 includes a plurality of heat dissipation layers 650, at least one heat dissipation layer 650 may be disposed outside the housing 600. For example, in an embodiment, among the first heat dissipation layer 651 and the second heat dissipation layer 652, the second heat dissipation layer 652 made of artificial graphite may be disposed outside the housing 600. As a specific example, the second heat dissipation layer 652 may be disposed between the housing 600 and the display panel 10. For example, the second heat dissipation layer 652 may be disposed between the second housing plate 602 and the display panel 10. For example, the second heat dissipation layer 652 may be disposed between the second outer plate 602b and the substrate SUB of the display panel 10 in the first space S1.

[0130]

[0130] In an embodiment, one surface of the second heat dissipation layer 652 may directly contact the housing 600 (for example, the second outer plate 602b of the housing 600), and the other surface of the second heat dissipation layer 652 may directly contact the display panel 10 (for example, the substrate SUB of the display panel 10).

[0131]

[0131] In an embodiment, one surface of the first heat dissipation layer 651 may directly contact the first inner plate 601a of the housing 600, and the other surface of the first heat dissipation layer 651 may directly contact the second inner plate 602a of the housing 600.

[0132] Figure 10 is a cross-sectional view of the display device 1 according to an embodiment.

[0133] Figure 10 The display device 1 of Figure 9 Figure 9 The display device 1 is different from the display device 1 described above in that it further includes an exhaust hole 601c. Therefore, this difference will be mainly described as follows, and for ease of description, the repeated description of similar or identical elements may be omitted.

[0134] As shown Figure 10 Figure 10 The display device 1 may further include an exhaust hole 601c. The exhaust hole 601c may be disposed in the housing 600. Since Figure 10 the exhaust hole 601c of Figure 6 is substantially the same as the exhaust hole 601c described above, the detailed description of the exhaust hole 601c of Figure 10 may refer to Figure 6 and the related description.

[0135] Figure 11 is a cross-sectional view of the display device 1 according to an embodiment.

[0136] Figure 11 The display device 1 of Figure 8The display device 1 is different in that: the position of the third heat dissipation layer 653 and the position of the second heat dissipation layer 652. Therefore, this difference will be mainly described as follows, and for the sake of convenience of description, the repeated description of similar or identical elements may be omitted.

[0137] As Figure 11 As illustrated, in an embodiment where the heat dissipation layer 650 includes a plurality of heat dissipation layers, at least one heat dissipation layer may be disposed outside the housing 600. The housing 600 may selectively surround at least one of the plurality of heat dissipation layers. For example, in an embodiment, among the first heat dissipation layer 651, the third heat dissipation layer 653, and the second heat dissipation layer 652, both the third heat dissipation layer 653 made of metal and the second heat dissipation layer 652 made of artificial graphite may be disposed outside the housing 600.

[0138] The third heat dissipation layer 653 may be disposed between the housing 600 and the second heat dissipation layer 652 (e.g., in the third direction DR3). For example, the third heat dissipation layer 653 may be disposed between the second housing plate 602 and the second heat dissipation layer 652. In an embodiment, the third heat dissipation layer 653 may be disposed between the second outer plate 602b and the second heat dissipation layer 652 in the first space S1 (e.g., directly therebetween). One surface of the third heat dissipation layer 653 may directly contact the second outer plate 602b, and the other surface of the third heat dissipation layer 653 may directly contact the second heat dissipation layer 652.

[0139] The second heat dissipation layer 652 may be disposed between the third heat dissipation layer 653 and the display panel 10 (e.g., in the third direction DR3). For example, the second heat dissipation layer 652 may be disposed between the third heat dissipation layer 653 and the display panel 10 (e.g., directly therebetween). In an embodiment, the second heat dissipation layer 652 may be disposed between the third heat dissipation layer 653 and the substrate SUB of the display panel 10 in the first space S1. One surface of the second heat dissipation layer 652 may directly contact the third heat dissipation layer 653, and the other surface of the second heat dissipation layer 652 may directly contact the substrate SUB of the display panel 10.

[0140] One surface of the first heat dissipation layer 651 may directly contact the first inner plate 601a of the housing 600, and the other surface of the first heat dissipation layer 651 may contact the second inner plate 602a of the housing 600.

[0141] Figure 12 is a cross-sectional view of the display device 1 according to an embodiment.

[0142] Figure 12 The display device 1 is different from the above Figure 11 The display device 1 is different in that it further includes an exhaust hole 601c. Therefore, this difference will be mainly described as follows, and for the sake of convenience of description, the repeated description of similar or identical elements may be omitted.

[0143] As Figure 12 shown in the figure, the display device 1 may further include an exhaust hole 601c. The exhaust hole 601c may be disposed in the housing 600. Since Figure 12 the exhaust hole 601c is substantially the same as the above-mentioned Figure 6 exhaust hole 601c, thus for Figure 12 the detailed description of the exhaust hole 601c, reference may be made to Figure 6 and related descriptions.

[0144] The light-emitting element included in each pixel PX of the display device 1 according to an embodiment may have a series structure, as will be described below with reference to Figures 13 to 20 the description.

[0145] Figures 13 to 17 FIG. is a cross-sectional view showing the structure of a light-emitting element according to an embodiment.

[0146] Referring to Figure 13 FIG., the light-emitting element (e.g., an organic light-emitting diode) according to an embodiment may include a pixel electrode 201, a common electrode 205, and an intermediate layer 203 (e.g., in the third direction DR3) between the pixel electrode 201 and the common electrode 205.

[0147] In an embodiment, the pixel electrode 201 may include a transparent conductive oxide, such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium oxide (In2O3), indium gallium oxide (IGO), or aluminum zinc oxide (AZO). The pixel electrode 201 may include a reflective layer containing silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), or a compound thereof. For example, in an embodiment, the pixel electrode 201 may have a three-layer structure of ITO / Ag / ITO. However, the embodiments of the present disclosure are not necessarily limited thereto.

[0148] The common electrode 205 may be disposed on the intermediate layer 203. In an embodiment, the common electrode 205 may include a metal, alloy, conductive compound, or any combination thereof having a low work function. For example, the common electrode 205 may include lithium (Li), silver (Ag), magnesium (Mg), aluminum (Al), aluminum-lithium (Al-Li), calcium (Ca), magnesium-indium (Mg-In), magnesium-silver (Mg-Ag), ytterbium (Yb), silver-ytterbium (Ag-Yb), ITO, IZO, or any combination thereof. The common electrode 205 may be a transmissive electrode, a transmissive-reflective electrode, or a reflective electrode.

[0149] In an embodiment, the intermediate layer 203 may include a polymer or small-molecule organic material that emits light of a predetermined color. In addition to various organic materials, the intermediate layer 203 may also include metal-containing compounds such as organometallic compounds, inorganic materials such as quantum dots, and the like.

[0150] In an embodiment, the intermediate layer 203 may include a light-emitting layer and a first functional layer and a second functional layer disposed below and above the light-emitting layer, respectively. For example, in an embodiment, the first functional layer may include a hole-transporting layer, or may include a hole-transporting layer and a hole-injecting layer. The second functional layer is a component disposed on the light-emitting layer and is optional. For example, in some embodiments, the intermediate layer 203 may or may not include the second functional layer. The second functional layer may include an electron-transporting layer and / or an electron-injecting layer.

[0151] In an embodiment, the intermediate layer 203 may include two or more light-emitting units sequentially stacked between the pixel electrode 201 and the common electrode 205 and a charge-generation layer disposed between the two light-emitting units. In an embodiment in which the intermediate layer 203 includes a light-emitting unit and a charge-generation layer, the light-emitting element (e.g., an organic light-emitting diode) may be a tandem light-emitting element. A light-emitting element (e.g., an organic light-emitting diode) having a stacked structure with multiple light-emitting units can increase color purity and light-emitting efficiency.

[0152] One light-emitting unit may include a light-emitting layer and a first functional layer and a second functional layer disposed below and above the light-emitting layer, respectively. In an embodiment, the charge-generation layer may include a negative charge-generation layer and a positive charge-generation layer. The light-emitting efficiency of an organic light-emitting diode as a tandem light-emitting element having multiple light-emitting layers can be further increased by the negative charge-generation layer and the positive charge-generation layer.

[0153] In an embodiment, the negative charge-generation layer may be an n-type charge-generation layer. The negative charge-generation layer may supply electrons. The negative charge-generation layer may include a host and a dopant. The host may include an organic material. The dopant may include a metal material. The positive charge-generation layer may be a p-type charge-generation layer. The positive charge-generation layer may supply holes. The positive charge-generation layer may include a host and a dopant. The host may include an organic material. The dopant may include a metal material.

[0154] In an embodiment, as Figure 14As shown in the figure, a light-emitting element (e.g., an organic light-emitting diode) may include a first emission unit EU1 including a first light-emitting layer EL1 and a second emission unit EU2 including a second light-emitting layer EL2, which are sequentially stacked (e.g., in a third direction DR3). A charge generation layer CGL may be disposed between the first emission unit EU1 and the second emission unit EU2 (e.g., in the third direction DR3). For example, in an embodiment, a light-emitting element (e.g., an organic light-emitting diode) may include a pixel electrode 201, a first light-emitting layer EL1, a charge generation layer CGL, a second light-emitting layer EL2, and a common electrode 205, which are sequentially stacked (e.g., in the third direction DR3). A first functional layer and a second functional layer may be disposed below and above the first light-emitting layer EL1, respectively. The first functional layer and the second functional layer may be disposed below and above the second light-emitting layer EL2, respectively. In an embodiment, the first light-emitting layer EL1 may be a blue light-emitting layer, and the second light-emitting layer EL2 may be a yellow light-emitting layer. However, the embodiments of the present disclosure are not necessarily limited thereto.

[0155] In an embodiment, as Figure 15 As shown in the figure, a light-emitting element (e.g., an organic light-emitting diode) may include a first emission unit EU1 and a third emission unit EU3, both of which include a first light-emitting layer EL1, and a second emission unit EU2 including a second light-emitting layer EL2. In an embodiment, a first charge generation layer CGL1 may be disposed between the first emission unit EU1 and the second emission unit EU2 (e.g., in the third direction DR3), and a second charge generation layer CGL2 may be disposed between the second emission unit EU2 and the third emission unit EU3 (e.g., in the third direction DR3). For example, a light-emitting element (e.g., an organic light-emitting diode) may include a pixel electrode 201, a first light-emitting layer EL1, a first charge generation layer CGL1, a second light-emitting layer EL2, a second charge generation layer CGL2, a first light-emitting layer EL1, and a common electrode 205, which are sequentially stacked (e.g., in the third direction DR3). In an embodiment, a first functional layer and a second functional layer may be disposed below and above the first light-emitting layer EL1, respectively. The first functional layer and the second functional layer may be disposed below and above the second light-emitting layer EL2, respectively. In an embodiment, the first light-emitting layer EL1 may be a blue light-emitting layer, and the second light-emitting layer EL2 may be a yellow light-emitting layer. However, the embodiments of the present disclosure are not necessarily limited thereto.

[0156] In an embodiment, as Figure 17As shown in the figure, in addition to the second light-emitting layer EL2, a light-emitting element (e.g., an organic light-emitting diode) may further include a third light-emitting layer EL3 and / or a fourth light-emitting layer EL4 disposed below and / or above the second light-emitting layer EL2 to be in direct contact with the second light-emitting layer EL2. The term "direct contact" may mean that no other layers are disposed between the second light-emitting layer EL2 and the third light-emitting layer EL3 and / or between the second light-emitting layer EL2 and the fourth light-emitting layer EL4. In an embodiment, the third light-emitting layer EL3 may be a red light-emitting layer, and the fourth light-emitting layer EL4 may be a green light-emitting layer. However, the embodiments of the present disclosure are not necessarily limited thereto.

[0157] For example, as Figure 16 shown in the figure, a light-emitting element (e.g., an organic light-emitting diode) may include, for example, in a third direction DR3, a pixel electrode 201, a first light-emitting layer EL1, a first charge generation layer CGL1, a third light-emitting layer EL3, a second light-emitting layer EL2, a second charge generation layer CGL2, a first light-emitting layer EL1, and a common electrode 205 stacked in sequence. Alternatively, as Figure 17 shown in the figure, a light-emitting element (e.g., an organic light-emitting diode) may include, for example, in a third direction DR3, a pixel electrode 201, a first light-emitting layer EL1, a first charge generation layer CGL1, a third light-emitting layer EL3, a second light-emitting layer EL2, a fourth light-emitting layer EL4, a second charge generation layer CGL2, a first light-emitting layer EL1, and a common electrode 205 stacked in sequence.

[0158] Figure 18 is a cross-sectional view of an example of the organic light-emitting diode shown in the figure. Figure 16 is a cross-sectional view of an example of the organic light-emitting diode shown in the figure. Figure 19 is a cross-sectional view of an example of the organic light-emitting diode shown in the figure. Figure 17 is a cross-sectional view of an example of the organic light-emitting diode shown in the figure.

[0159] Referring to Figure 18 , a light-emitting element (e.g., an organic light-emitting diode) may include, for example, in a third direction DR3, a first emission unit EU1, a second emission unit EU2, and a third emission unit EU3 stacked in sequence. The first charge generation layer CGL1 may be disposed between the first emission unit EU1 and the second emission unit EU2 (e.g., in the third direction DR3), and the second charge generation layer CGL2 may be disposed between the second emission unit EU2 and the third emission unit EU3 (e.g., in the third direction DR3). In an embodiment, both the first charge generation layer CGL1 and the second charge generation layer CGL2 may include a negative charge generation layer nCGL and a positive charge generation layer pCGL.

[0160] In an embodiment, the first emission unit EU1 may include a blue emission layer BEML. The first emission unit EU1 may further include a hole injection layer HIL and a hole transport layer HTL between the pixel electrode 201 and the blue emission layer BEML. In an embodiment, a p-doped layer may further be included between the hole injection layer HIL and the hole transport layer HTL. The p-doped layer may be formed by doping the hole injection layer HIL with a p-type doping material. In an embodiment, at least one of a blue light assist layer, an electron blocking layer, and a buffer layer may further be included between the blue emission layer BEML and the hole transport layer HTL. The blue light assist layer may improve the light emission efficiency of the blue emission layer BEML. For example, the blue light assist layer may increase the light emission efficiency of the blue emission layer BEML by adjusting the hole charge balance. The electron blocking layer may prevent electrons from being injected into the hole transport layer HTL. The buffer layer may compensate for the resonance distance according to the wavelength of the light emitted from the emission layer.

[0161] In an embodiment, the second emission unit EU2 may include a yellow emission layer YEML and a red emission layer REML disposed below the yellow emission layer YEML in direct contact with the yellow emission layer YEML. The second emission unit EU2 may further include a hole transport layer HTL between the positive charge generation layer pCGL of the first charge generation layer CGL1 and the red emission layer REML, and may further include an electron transport layer ETL between the yellow emission layer YEML and the negative charge generation layer nCGL of the second charge generation layer CGL2.

[0162] In an embodiment, the third emission unit EU3 may include a blue emission layer BEML. The third emission unit EU3 may further include a hole transport layer HTL between the positive charge generation layer pCGL of the second charge generation layer CGL2 and the blue emission layer BEML. The third emission unit EU3 may further include an electron transport layer ETL and an electron injection layer EIL between the blue emission layer BEML and the common electrode 205. The electron transport layer ETL may be a single layer or multiple layers. In an embodiment, at least one of a blue light assist layer, an electron blocking layer, and a buffer layer may further be included between the blue emission layer BEML and the hole transport layer HTL. At least one of a hole blocking layer and a buffer layer may further be included between the blue emission layer BEML and the electron transport layer ETL. The hole blocking layer may prevent holes from being injected into the electron transport layer ETL.

[0163] Except for the stacked structure of the second emission unit EU2, Figure 19 the light-emitting element (e.g., organic light-emitting diode) illustrated in Figure 18 is the same as the light-emitting element (e.g., organic light-emitting diode) illustrated in Figure 19, the second emission unit EU2 may include a green emission layer GEML, a red emission layer REML disposed below the green emission layer GEML to directly contact the green emission layer GEML, and a yellow emission layer YEML disposed above the green emission layer GEML to directly contact the green emission layer GEML. The second emission unit EU2 may further include a hole transport layer HTL between the positive charge generation layer pCGL of the first charge generation layer CGL1 and the red emission layer REML, and may further include an electron transport layer ETL between the yellow emission layer YEML and the negative charge generation layer nCGL of the second charge generation layer CGL2.

[0164] Figure 20 is a cross-sectional view illustrating a pixel structure of the display device 1 according to an embodiment.

[0165] Reference Figure 20 , the display panel 10 of the display device 1 may include a plurality of pixels PX. In an embodiment, the plurality of pixels PX may include a first pixel PX1, a second pixel PX2, and a third pixel PX3. Each of the first pixel PX1, the second pixel PX2, and the third pixel PX3 may include a pixel electrode 201, a common electrode 205, and an intermediate layer 203. In an embodiment, the first pixel PX1 may be a red pixel, the second pixel PX2 may be a green pixel, and the third pixel PX3 may be a blue pixel. However, the embodiments of the present disclosure are not necessarily limited thereto.

[0166] In an embodiment, the pixel electrode 201 may be independently provided in each of the first pixel PX1, the second pixel PX2, and the third pixel PX3.

[0167] In an embodiment, the intermediate layer 203 of each of the first pixel PX1, the second pixel PX2, and the third pixel PX3 may include a first emission unit EU1 and a second emission unit EU2 sequentially stacked (e.g., in the third direction DR3) and a charge generation layer CGL between the first emission unit EU1 and the second emission unit EU2. The charge generation layer CGL may include a negative charge generation layer nCGL and a positive charge generation layer pCGL. The charge generation layer CGL may be a common layer continuously formed in the first pixel PX1, the second pixel PX2, and the third pixel PX3.

[0168] In an embodiment, the first emission unit EU1 of the first pixel PX1 may include, for example, in a third direction DR3, a hole injection layer HIL, a hole transport layer HTL, a red emission layer REML, and an electron transport layer ETL that are sequentially stacked on the pixel electrode 201. The first emission unit EU1 of the second pixel PX2 may include, for example, in the third direction DR3, a hole injection layer HIL, a hole transport layer HTL, a green emission layer GEML, and an electron transport layer ETL that are sequentially stacked on the pixel electrode 201. The first emission unit EU1 of the third pixel PX3 may include, for example, in the third direction DR3, a hole injection layer HIL, a hole transport layer HTL, a blue emission layer BEML, and an electron transport layer ETL that are sequentially stacked on the pixel electrode 201. In an embodiment, each of the hole injection layer HIL, the hole transport layer HTL, and the electron transport layer ETL of the first emission unit EU1 may be a common layer that is continuously formed in the first pixel PX1, the second pixel PX2, and the third pixel PX3.

[0169] In an embodiment, the second emission unit EU2 of the first pixel PX1 may include, for example, in the third direction DR3, a hole transport layer HTL, an auxiliary layer AXL, a red emission layer REML, and an electron transport layer ETL that are sequentially stacked on the charge generation layer CGL. The second emission unit EU2 of the second pixel PX2 may include, for example, in the third direction DR3, a hole transport layer HTL, a green emission layer GEML, and an electron transport layer ETL that are sequentially stacked on the charge generation layer CGL. The second emission unit EU2 of the third pixel PX3 may include a hole transport layer HTL, a blue emission layer BEML, and an electron transport layer ETL that are sequentially stacked on the charge generation layer CGL. In an embodiment, each of the hole transport layer HTL and the electron transport layer ETL of the second emission unit EU2 may be a common layer that is continuously formed in the first pixel PX1, the second pixel PX2, and the third pixel PX3. In an embodiment, in each of the second emission units EU2 of the first pixel PX1, the second pixel PX2, and the third pixel PX3, at least one of a hole blocking layer and a buffer layer may further be included between the emission layer and the electron transport layer ETL.

[0170] The thickness H1 of the red emission layer REML, the thickness H2 of the green emission layer GEML, and the thickness H3 of the blue emission layer BEML may be determined according to the resonance distance. The auxiliary layer AXL is a layer added to adjust the resonance distance and may include a resonance auxiliary material. For example, the auxiliary layer AXL may include the same material as the material of the hole transport layer HTL.

[0171] In Figure 20In [description], the auxiliary layer AXL is only arranged in the first pixel PX1. However, the embodiments of the present disclosure are not necessarily limited thereto. For example, the auxiliary layer AXL can be arranged in at least one of the first pixel PX1, the second pixel PX2, and the third pixel PX3 to adjust the resonance distance of each of the first pixel PX1, the second pixel PX2, and the third pixel PX3.

[0172] The display panel 10 of the display device 1 may further include a cover layer 207 arranged outside the common electrode 205. For example, in an embodiment, the cover layer 207 can be directly arranged above the common electrode 205 (e.g., in the third direction DR3). The cover layer 207 can increase the light emission efficiency through the principle of constructive interference. Therefore, the light extraction efficiency of the light-emitting element (e.g., organic light-emitting diode) can be increased, and thus the light emission efficiency of the light-emitting element (e.g., organic light-emitting diode) can be increased.

[0173] Figure 21 is a diagram for explaining the effects of the display device 1 according to an embodiment. For example, Figure 21 is for explaining the above Figure 5 diagram of the heat dissipation effect of the display device 1.

[0174] First, Figure 21 The second heat dissipation layer 652 in [description] may include an artificial graphite material. The thickness T2 of the second heat dissipation layer 652 can be about 100 μm, and the thermal conductivity of the second heat dissipation layer 652 can be about 1000 W / mk. In addition, Figure 21 The first heat dissipation layer 651 in [description] may include a natural graphite material. The thickness T1 of the first heat dissipation layer 651 can be about 820 μm, and the thermal conductivity of the first heat dissipation layer 651 can be about 240 W / mk.

[0175] In Figure 21 In [description], the arrow pointing in the third reverse direction indicates the heat dissipation direction of the display panel 10.

[0176] As Figure 21 illustrated in [description], the image pattern IMP can be displayed in a rectangular shape at the center of the display area of the display panel 10. The image pattern IMP may include, for example, pixels PX that provide light with the highest gray level of brightness. For example, the pixels PX that display the image pattern IMP may include organic light-emitting diodes that emit light with full white brightness.

[0177] Due to the all - white image pattern IMP, high heat can be generated from the region (e.g., the image pattern region AR1) of the display panel 10 corresponding to the image pattern IMP. The heat of the image pattern region AR1 can be transferred to the second heat dissipation layer 652. Then, the heat can diffuse around the region AR2 of the second heat dissipation layer 652 corresponding to the image pattern region AR1. In the region AR2 of the second heat dissipation layer 652 corresponding to the image pattern region AR1, the temperature can be the highest at the center of the region AR2 and can decrease as the distance from the center of the region AR2 increases. In an embodiment, since the second heat dissipation layer 652 has a thickness smaller than that of the first heat dissipation layer 651, compared with the first heat dissipation layer 651, the second heat dissipation layer 652 can diffuse more heat in its area direction (e.g., the first direction DR1 and the second direction DR2) than in its thickness direction (e.g., the third reverse direction).

[0178] The heat from the second heat dissipation layer 652 can be transferred to the first heat dissipation layer 651. Then, the heat can diffuse around the region AR3 of the first heat dissipation layer 651 corresponding to the image pattern region AR1. In the region AR3 of the first heat dissipation layer 651 corresponding to the image pattern region AR1, the temperature can be the highest at the center of the region AR3 and can decrease as the distance from the center of the region AR3 increases. In an embodiment, since the second heat dissipation layer 652 has a thickness smaller than that of the first heat dissipation layer 651, compared with the second heat dissipation layer 652, the first heat dissipation layer 651 can diffuse more heat in its thickness direction (e.g., the third reverse direction) than in its area direction (e.g., the first direction DR1 and the second direction DR2).

[0179] Since the first heat dissipation layer 651 and the second heat dissipation layer 652 as described above have different thermal conductivities and different thicknesses, in the second heat dissipation layer 652 made of artificial graphite, more heat can be diffused in the first direction DR1 and the second direction DR2, while in the first heat dissipation layer 651 made of natural graphite, more heat can be diffused in the third reverse direction. Therefore, the heat evenly diffused in the second heat dissipation layer 652 in the area direction (e.g., the first direction DR1 and the second direction DR2 that define the area of the second heat dissipation layer 652 in the plan view) can be dissipated through the first heat dissipation layer 651 in the thickness direction (e.g., the third reverse direction). Therefore, the heat transferred to the second heat dissipation layer 652 can be evenly diffused in the area direction of the second heat dissipation layer 652 (e.g., in the first direction DR1 and the second direction DR2) instead of being concentrated in the area corresponding to the image pattern area AR1. Therefore, the heat of the second heat dissipation layer 652 can be dissipated faster through the first heat dissipation layer 651. Therefore, the heat in the display panel 1 can be dissipated more effectively. In addition, screen afterimages (e.g., thermal transient afterimages) generated when heat is concentrated in the image pattern area AR1 through a specific image pattern IMP are removed or prevented. Therefore, the image quality of the display device 1 can be increased.

[0180] <Equation 1>

[0181] Qcond = -kA(ΔT / Δx) (1).

[0182] The above Equation 1 is an equation regarding thermal conductivity. In the above Equation 1, Qcond is the thermal conductivity of the display device, k is the thermal conductivity of the heat dissipation layer (e.g., the thermal conductivity of the material used as the heat dissipation layer 650), A is the area of the heat dissipation layer (e.g., the area of the heat dissipation layer 650 defined by the first direction DR1 and the second direction DR2), ΔT / Δx is the temperature gradient, ΔT is the temperature difference between the heat provided to the heat dissipation layer and the heat passing through the heat dissipation layer, and Δx is the thickness of the heat dissipation layer.

[0183] Since the second heat dissipation layer 652 has an area larger than its thickness, heat is evenly diffused in the area direction of the second heat dissipation layer 652. Therefore, the amount of heat diffused and transferred through the second heat dissipation layer 652 and the first heat dissipation layer 651 can be increased.

[0184] Figure 21 The display device 1 of the embodiment illustrated in may have a low minimum discernible difference (JND) value. For example, according to Figure 21 the embodiment of, the display device 1 may have an increased JND value of 7.3 based on 2.6 JND.

[0185] JND refers to the difference in physical stimuli that causes the smallest perceptible difference. For example, JND refers to the minimum differences in brightness, saturation, and color that allow a person to perceive an afterimage. As the JND value decreases, the afterimage of the display device 1 decreases, thereby increasing the image quality of the display device 1.

[0186] Figure 22 is a diagram for explaining the effects of the display device 1 according to an embodiment. For example, Figure 22 is for explaining the above Figure 7 heat dissipation effect of the display device 1.

[0187] First, Figure 22 the second heat dissipation layer 652 in Figure 22 may include an artificial graphite material, the thickness T2 of the second heat dissipation layer 652 may be about 100 μm, and the thermal conductivity of the second heat dissipation layer 652 may be about 1000 W / mk. In addition, Figure 22 the third heat dissipation layer 653 in

[0188] In Figure 22 may include an aluminum material, the thickness T3 of the third heat dissipation layer 653 may be about 300 μm, and the thermal conductivity of the third heat dissipation layer 653 may be about 202 W / mk. In addition,

[0189] As Figure 22 illustrated, the image pattern IMP may be displayed in a rectangular shape at the center of the display area of the display panel 10. The image pattern IMP may include, for example, pixels PX that provide light having the highest gray level. For example, the pixels PX that display the image pattern IMP may include organic light emitting diodes that emit light having full white brightness.

[0190] Due to the all - white image pattern IMP, high heat may be generated from the image pattern area AR1 of the display panel 10 corresponding to the image pattern IMP. The heat of the image pattern area AR1 may be transferred to the second heat dissipation layer 652. Then, the heat may spread around the area AR2 corresponding to the image pattern area AR1 of the second heat dissipation layer 652. In the area AR2 of the second heat dissipation layer 652 corresponding to the image pattern area AR1, the temperature may be the highest at the center of the area AR2 and may decrease as the distance from the center of the area AR2 increases. In an embodiment, since the second heat dissipation layer 652 has a relatively small thickness, more heat may be spread in the area direction (e.g., the first direction DR1 and the second direction DR2) of the second heat dissipation layer 652 than in the thickness direction (e.g., the third reverse direction) of the second heat dissipation layer 652.

[0191] Heat from the second heat dissipation layer 652 can be transferred to the third heat dissipation layer 653. Then, the heat can diffuse around the region AR3 corresponding to the image pattern region AR1 in the third heat dissipation layer 653. In the region AR3 of the third heat dissipation layer 653 corresponding to the image pattern region AR1, the temperature can be the highest at the center of the region AR3 and can decrease as the distance from the center of the region AR3 increases. In an embodiment, the third heat dissipation layer 653 can be a metal layer, and the heat can be evenly diffused in the thickness direction and the area direction of the third heat dissipation layer 653.

[0192] Heat from the third heat dissipation layer 653 can be transferred to the first heat dissipation layer 651. Then, the heat can diffuse around the region AR4 corresponding to the image pattern region AR1 in the first heat dissipation layer 651. In the region AR4 of the first heat dissipation layer 651 corresponding to the image pattern region AR1, the temperature can be the highest at the center of the region AR4 and can decrease as the distance from the center of the region AR4 increases. In an embodiment, since the first heat dissipation layer 651 has a relatively large thickness, more heat can be diffused in the thickness direction (e.g., the third reverse direction) of the first heat dissipation layer 651 than in the area direction (e.g., the first direction DR1 and the second direction DR2) of the first heat dissipation layer 651.

[0193] Since the first heat dissipation layer 651, the third heat dissipation layer 653, and the second heat dissipation layer 652 as described above have different thermal conductivities and different thicknesses from each other, in the second heat dissipation layer 652 made of artificial graphite, more heat can be diffused in the first direction DR1 and the second direction DR2, while in the first heat dissipation layer 651 made of natural graphite, more heat is diffused in the third reverse direction. In addition, since the third heat dissipation layer 653 made of a metal material is disposed between the second heat dissipation layer 652 and the first heat dissipation layer 651, the heat of the second heat dissipation layer 652 can be evenly diffused to the first heat dissipation layer 651. Therefore, the heat evenly diffused in the area direction (e.g., the first direction DR1 and the second direction DR2) in the second heat dissipation layer 652 can be dissipated in the thickness direction (e.g., the third reverse direction) through the third heat dissipation layer 653 and the first heat dissipation layer 651. For example, the heat transferred to the second heat dissipation layer 652 may not be concentrated in the area AR2 corresponding to the image pattern area AR1, but may be evenly diffused in the area direction (e.g., the first direction DR1 and the second direction DR2) of the second heat dissipation layer 652. Therefore, the heat of the second heat dissipation layer 652 can be dissipated faster through the third heat dissipation layer 653 and the first heat dissipation layer 651. Therefore, the heat in the display panel 10 can be dissipated more effectively. In addition, screen afterimages (e.g., thermal transient afterimages) generated when heat is concentrated in the image pattern area AR1 through a specific image pattern IMP are removed or prevented. Therefore, the image quality of the display device 1 can be improved.

[0194] Figure 22 The display device 1 of the embodiment illustrated in may have a low JND value. For example, according to Figure 22 The display device 1 of the embodiment of may have an increased JND value of 7.6 based on 2.6 JND.

[0195] In the organic light emitting diode display device according to the present disclosure, the heat dissipation speed can be increased. In addition, since afterimages are minimized or prevented, the image quality can be improved.

[0196] However, the effects of the present disclosure are not limited to the effects described herein.

[0197] At the end of the detailed description, those skilled in the art will understand that many changes and modifications can be made to the described embodiments without substantially departing from the principles of the present disclosure. Therefore, the described embodiments of the present disclosure are used only in a general and descriptive sense and not for the purpose of limitation.

Claims

1. An organic light emitting diode display device, comprising: A display panel, the display panel comprising an organic light emitting diode; as well as a heat dissipation member, the heat dissipation member facing the display panel, The heat dissipation member includes a plurality of heat dissipation layers having different thicknesses and different thermal conductivities.

2. The organic light emitting diode display device according to claim 1, wherein: The plurality of heat dissipation layers include: a first heat dissipation layer; and A second heat dissipation layer is provided between the first heat dissipation layer and the display panel.

3. The organic light emitting diode display device according to claim 2, wherein: The second heat dissipation layer has a thermal conductivity higher than that of the first heat dissipation layer, and The second heat dissipation layer has a thickness smaller than that of the first heat dissipation layer.

4. The organic light emitting diode display device according to claim 3, wherein: The ratio of the thickness of the first heat dissipation layer to the thickness of the second heat dissipation layer is 19:

1.

5. The organic light emitting diode display device according to claim 3, wherein: The first heat dissipation layer has a thickness of 820 μm and a thermal conductivity of 240 W / mk, and The second heat dissipation layer has a thickness of 100 μm and a thermal conductivity of 1000 W / mk.

6. The organic light emitting diode display device according to claim 2, wherein: The first heat dissipation layer comprises natural graphite, and The second heat dissipation layer includes artificial graphite.

7. The organic light emitting diode display device according to claim 1, wherein: The plurality of heat dissipation layers include: a first heat dissipation layer; a second heat dissipation layer, the second heat dissipation layer being between the first heat dissipation layer and the display panel; and A third heat dissipation layer is between the first heat dissipation layer and the second heat dissipation layer.

8. The organic light emitting diode display device according to claim 7, wherein: The third heat dissipation layer has a thickness greater than that of the second heat dissipation layer and smaller than that of the first heat dissipation layer, and The first heat dissipation layer has a thermal conductivity higher than that of the third heat dissipation layer and lower than that of the second heat dissipation layer.

9. The organic light emitting diode display device according to claim 8, wherein: A ratio of the thickness of the first heat dissipation layer, the thickness of the third heat dissipation layer, and the thickness of the second heat dissipation layer is 16:3:

1.

10. The organic light emitting diode display device according to claim 8, wherein: The first heat dissipation layer has a thickness of 500 μm or 820 μm and a thermal conductivity of 240 W / mk, The second heat dissipation layer has a thickness of 100 μm and a thermal conductivity of 1000 W / mk, and The third heat dissipation layer has a thickness of 300 μm and a thermal conductivity of 202 W / mk.

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