Camera module and optical device including the same

Abstract

A camera module according to an embodiment includes: a first substrate having a first terminal portion; an image sensor disposed on the first substrate; a base portion disposed on the first substrate; a lens driving device including a second substrate disposed on the base portion and having a second terminal portion; and a connection pin penetrating the base portion, and wherein one end of the connection pin contacts the first terminal portion and the other end of the connection pin contacts the second terminal portion.

Description

Technical Field

[0001] Embodiments relate to a camera module and an optical device including the camera module. Background Art

[0002] A camera module performs a function of photographing an object and storing the object as an image or a moving image, and the camera module is installed in various devices, such as mobile terminals such as mobile phones, laptop computers, drones, and vehicles.

[0003] Generally, the above devices are equipped with an ultra-small camera module. The camera module may perform an autofocus (AF) function that automatically adjusts the distance between an image sensor and a lens to adjust the focal length of the lens.

[0004] In addition, recently, the camera module has adopted an image stabilization (IS) technique to correct or prevent image blurring caused by camera movement due to an unstable fixing device or user movement.

[0005] Such an image stabilization (IS) technique includes an optical image stabilizer (OIS) technique and an image stabilization technique using an image sensor. Here, the OIS technique is a technique for correcting movement by changing an optical path, and the image stabilization technique using an image sensor is a technique for correcting movement by mechanical and electronic methods, but the OIS technique is often used.

[0006] Therefore, the camera module includes an actuator for performing an autofocus function and an image stabilization function. The actuator may also be referred to as a lens driving part, and provides a driving force for moving or tilting the lens driving part along a first axis, a second axis, and a third axis.

[0007] The lens driving part includes a driving coil for providing a driving force based on each axis and a position sensor for detecting the position of the lens module.

[0008] Therefore, in a conventional camera module, the number of solder joints between the actuator and a driver or a module connector increases, and thus problems occur during the soldering process. Here, the solder joint may refer to a connection contact point through which the actuator and the module connector or the driver are electrically connected. For example, the solder joint includes connection contact points between a plurality of driving coils and the module connector or the driver. For example, the solder joint includes connection contact points between a plurality of position sensors and the module connector or the driver.

[0009] At this time, generally each drive coil and each position sensor are connected to a module connector or a driver. Accordingly, there is generally a problem of an increase in soldering points between the actuator and the module connector or the driver, and thus the manufacturing process becomes complicated. In addition, in a conventional camera module, the volume of the circuit board increases as the number of soldering points increases, and there is a problem of design limitations due to space problems.

[0010] In addition, according to the conventional technology, there are electrical reliability problems due to defects in the soldering process. In addition, according to the conventional technology, cracks are generated at the soldering points in terms of shock reliability and environmental reliability.

[0011] (Patent Document 1) KR 10-2017-0053274A. Summary of the Invention

[0012] Technical Problem

[0013] An embodiment provides a camera module having a novel structure and an optical device including the camera module.

[0014] In addition, an embodiment provides a camera module capable of improving the bonding reliability between a lens driving device and a first substrate and an optical device including the camera module.

[0015] In addition, an embodiment provides a camera module capable of omitting a soldering process and an optical device including the camera module.

[0016] In addition, an embodiment provides a camera module having improved electrical reliability and an optical device including the camera module.

[0017] The technical problems to be solved by the proposed embodiments are not limited to the above technical problems, and other technical problems not mentioned can be clearly understood by those skilled in the art to which the proposed embodiments belong according to the following description.

[0018] Technical Solution

[0019] A camera module according to an embodiment includes: a first substrate having a first terminal portion; an image sensor disposed on the first substrate; a base disposed on the first substrate; a lens driving device including a second substrate disposed on the base and having a second terminal portion; and a connection pin penetrating the base, wherein one end of the connection pin contacts the first terminal portion and the other end of the connection pin contacts the second terminal portion.

[0020] In addition, the connecting pin includes: a body that penetrates the base; a first connecting portion that has an end portion protruding in a downward direction of the body and contacting the first terminal portion; and a second connecting portion that has another end portion protruding in an upward direction of the body and contacting the second terminal portion.

[0021] In addition, at least one of the first connecting portion and the second connecting portion has elasticity.

[0022] In addition, the base includes an insertion hole into which the body of the connecting pin is inserted, and the insertion hole penetrates the base at a position spaced apart from the outer end portion of the base.

[0023] In addition, the base includes a first region and a second region. The first region includes the insertion hole. The second region is adjacent to the first region, and the first region and the second region do not have a step.

[0024] In addition, the base includes a first region and a second region. The first region includes the insertion hole. The second region is adjacent to the first region, and the first region and the second region have a step.

[0025] In addition, a recess corresponding to the step is provided in the first region of the base, and the recess includes: a first recess provided on one surface of the base, and a first bonding member for coupling the first connecting portion and the first terminal portion is provided in the first recess; and a second recess provided on the other surface of the base opposite to the one surface, and a second bonding member for coupling the second connecting portion and the second terminal portion is provided in the second recess.

[0026] In addition, the lens driving device includes a driving coil provided on the second substrate. The second terminal portion includes a plurality of second terminals, and at least one of the plurality of second terminals is electrically connected to the driving coil.

[0027] In addition, the lens driving device further includes a mover that moves relative to the second substrate and includes a sensor unit; and at least another one of the plurality of second terminals includes a terminal electrically connected to the sensor unit.

[0028] In addition, the first terminal portion and the second terminal portion overlap in the optical axis direction. The insertion hole is aligned with the first terminal portion and the second terminal portion in the optical axis direction, and a peripheral region of the upper surface of the first substrate adjacent to the first terminal portion overlaps with the base in the optical axis direction.

[0029] In addition, the lens driving device further includes a holder, on which the second substrate is disposed. The second substrate includes: a first substrate region that is disposed on the holder and on which the driving coil is disposed; and a second substrate region that is bent from the first substrate region, and a second terminal portion is disposed on the second substrate region of the second substrate.

[0030] In addition, the second substrate region of the second substrate includes: a first sub-region that is bent from one end of the first substrate region of the second substrate and is disposed on a side portion of the holder; and a second sub-region that is bent from the first sub-region and is disposed on a lower portion of the holder, and the second terminal portion is disposed on a lower surface of the second sub-region facing the upper surface of the base.

[0031] In addition, the second terminal portion includes: a first portion that is disposed on the lower surface of the second sub-region and contacts a first connection portion of the connection pin; and a second portion that extends from the first portion and is disposed on a side surface of the first sub-region.

[0032] In addition, the lens driving device further includes a holder on which the second substrate is disposed. The second substrate includes a substrate region disposed on the holder and the driving coil is disposed on the substrate region. The second terminal portion is disposed on a lower surface of the substrate region. The holder includes a through hole that vertically overlaps with the second terminal portion, and a second connection portion of the connection pin passes through the through hole.

[0033] In addition, the second terminal portion includes a first portion disposed on the lower surface of the substrate region and contacting a first connection portion of the connection pin, and a second portion that extends from the first portion and is disposed on a side surface of the substrate region.

[0034] In addition, the first terminal portion includes a first-first terminal portion and a first-second terminal portion. The first-first terminal portion is disposed on one side of the image sensor in the upper surface of the first substrate, and the first-second terminal portion is disposed on the other side opposite to the one side of the image sensor in the upper surface of the first substrate. The second terminal portion includes a second-first terminal portion corresponding to the first-first terminal portion and a second-second terminal portion corresponding to the first-second terminal portion. The connection pin includes a first connection pin that respectively contacts the first-first terminal portion and the second-first terminal portion, and a second connection pin that respectively contacts the first-second terminal portion and the second-second terminal portion.

[0035] In addition, at least one of the first connection portion and the second connection portion includes a flat surface, and at least one of the first terminal portion and the second terminal portion includes a flat surface corresponding to the first connection portion or the second connection portion.

[0036] In addition, at least one of the first connection part and the second connection part includes an inwardly recessed surface, and at least one of the first terminal part and the second terminal part includes an outwardly protruding surface corresponding to the recessed surface of the first connection part or the second connection part.

[0037] In addition, at least one of the first connection part and the second connection part includes an outwardly protruding surface, and at least one of the first terminal part and the second terminal part includes an inwardly recessed surface corresponding to the protruding surface of the first connection part or the second connection part.

[0038] Meanwhile, the camera module of the embodiment includes: a first substrate including a first terminal part; an image sensor disposed on the first substrate; a base disposed on the first substrate; a lens driving device including a second substrate disposed on the base, wherein the second substrate includes a second terminal part; and a connection pin in contact with the first terminal part and the second terminal part, and the base includes a hole into which the connection pin is inserted, and at least one end of the connection pin has elasticity.

[0039] Meanwhile, the camera module of the embodiment includes: a substrate; an image sensor disposed on the substrate; a lens driving device disposed on the substrate; and a base disposed between the substrate and the lens driving device, the base including an upper surface having a first groove, a lower surface having a second groove, and a through hole penetrating the first groove and the second groove, and a side wall of the base in a region where the through hole is provided is exposed to the outside.

[0040] Meanwhile, the camera module of the embodiment includes: a first substrate including a plurality of first terminals; an image sensor disposed on the first substrate; a base disposed on the first substrate; a lens driving device including a second substrate disposed on the base and including a plurality of second terminals; and a connection part in contact with the plurality of first terminals and the plurality of second terminals, the base including an opening part corresponding to the image sensor and a first region through which the connection part passes, and the first region of the base is positioned between the opening part and a side surface of the base.

[0041] Effects of the Invention

[0042] The camera module of the embodiment can improve the electrical connection reliability between the driving substrate part and the lens driving device.

[0043] Specifically, the driving substrate part includes a first substrate, and the first substrate includes a first terminal part. Additionally, the lens driving device includes a second substrate, and the second substrate includes a second terminal part. At this time, the base of the filter part is disposed between the first substrate and the second substrate. The base includes an insertion hole. Additionally, the camera module of the embodiment includes a connection pin inserted into the insertion hole. At this time, the connection pin includes a first connection part that is connected to the first terminal part of the first substrate when inserted into the insertion hole of the base and a second connection part that is connected to the second terminal part of the second substrate. The connection part electrically couples the first substrate and the second substrate when supported by the base.

[0044] Therefore, the embodiment can omit the soldering process for electrically connecting the first terminal part and the second terminal part. By this, the embodiment can solve the problems of electrical reliability and physical reliability generated during the soldering process. Additionally, the embodiment can solve the problem of cracks generated at the position where the soldering process is performed due to various factors.

[0045] Moreover, the embodiment can ensure the flatness of the base provided with the infrared filter. Therefore, the embodiment can ensure the flatness of the infrared filter. Specifically, the base of the comparative example includes an opening part where the region where the second terminal part of the second substrate is formed is open. At this time, due to the technological development of the camera module, the size of the image sensor increases, and thus, the size of the infrared filter also increases. Additionally, the base of the comparative example must ensure the region where the opening part is formed, and thus, there is a problem of reduced rigidity of the base. Additionally, the comparative example has a problem that the size of the base increases due to the region where the opening part is formed, and thus, the overall size of the camera module increases. In contrast, the embodiment does not need to form an opening part in the base. Therefore, the embodiment can improve the rigidity of the base. Therefore, the camera module of the embodiment can improve the flatness of the base and also improve the flatness of the infrared filter.

[0046] Furthermore, the camera module of the comparative example performs a soldering process for electrically connecting the first substrate and the second substrate from the outside. Therefore, the camera module of the comparative example has a solder part for electrically connecting the first substrate and the second substrate, which is exposed to the outside of the camera module. Therefore, in the comparative example, problems of electrical reliability and physical reliability are caused due to the exposure of the solder part to the outside.

[0047] In contrast, the camera module of the embodiment electrically connects the first substrate and the second substrate using a connection pin. Accordingly, the camera module of the embodiment may have a contact point located inside the camera module between a first terminal portion of the first substrate and a second terminal portion of the second substrate. Accordingly, the embodiment may protect the contact point from various factors. Accordingly, the embodiment may also improve the electrical connectivity between the first substrate and the second substrate. In addition, the embodiment may improve the operational reliability of the camera module. BRIEF DESCRIPTION OF THE DRAWINGS

[0048] Figure 1 is a perspective view of a camera module according to an embodiment.

[0049] Figure 2 is a cross-sectional view of the camera module taken along line A-A'. Figure 1

[0050] Figure 3 is a cross-sectional view of the camera module taken along line B-B'. Figure 1

[0051] Figure 4 is Figure 1 an exploded perspective view of the camera module.

[0052] Figure 5 is Figure 4 a side view of the lens driving device.

[0053] Figure 6 is Figure 4 an exploded perspective view of the lens driving device.

[0054] Figure 7a is a perspective view of a second substrate according to a first embodiment as viewed from above.

[0055] Figure 7b is a perspective view of a second substrate according to a first embodiment as viewed from below.

[0056] Figure 8a is a perspective view of a second substrate according to a second embodiment as viewed from below.

[0057] Figure 8b is a perspective view of a second substrate according to a third embodiment as viewed from below.

[0058] Figure 9 is an exploded perspective view of a filter part according to a first embodiment.

[0059] Figure 10a is a perspective view of a connection pin according to a first embodiment.

[0060] Figure 10b ​​is a perspective view of a connection pin according to the second embodiment.

[0061] Figure 10c is a perspective view of a connection pin according to the third embodiment.

[0062] Figure 11 is a plan view of a state in which a connection pin is coupled to a base according to the first embodiment.

[0063] Figure 12 (a) in is a side view of a state in which a connection pin is coupled to a base according to the first embodiment.

[0064] Figure 12 (b) in is a cross-sectional view of a state in which a connection pin is coupled to a base according to the first embodiment.

[0065] Figure 13a is a perspective view of a base according to the second embodiment.

[0066] Figure 13b is a perspective view of a base according to the third embodiment.

[0067] Figure 14a is a cross-sectional view of a connection pin, a first terminal portion, and a second terminal portion according to the first embodiment.

[0068] Figure 14b is a cross-sectional view of a connection pin, a first terminal portion, and a second terminal portion according to the second embodiment.

[0069] Figure 14c is a cross-sectional view of a connection pin, a first terminal portion, and a second terminal portion according to the third embodiment.

[0070] Figure 15 is a plan view of a base of a comparative example as compared with the embodiment.

[0071] Figure 16 (a) in is a side view of a camera module of the comparative example.

[0072] Figure 16 (b) in is a side view of a camera module of the embodiment.

[0073] Figure 17 is a mobile terminal to which a camera module according to the embodiment is applied.

[0074] Figure 18 is a perspective view of a vehicle to which a camera module according to the embodiment is applied. Detailed Description of the Embodiment

[0075] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings.

[0076] However, the spirit and scope of the present disclosure are not limited to the parts of the described embodiments and can be implemented in various other forms, and within the spirit and scope of the present disclosure, one or more elements of the embodiments can be selectively combined and replaced.

[0077] In addition, unless explicitly defined and described otherwise, the terms (including technical terms and scientific terms) used in the embodiments of the present disclosure can be interpreted as having the same meaning as commonly understood by those of ordinary skill in the art to which the present invention pertains, and terms such as those defined in a common dictionary can be interpreted as having a meaning consistent with their meaning in the context of the related art.

[0078] In addition, the terms used in the embodiments of the present disclosure are for describing the embodiments and are not intended to limit the present disclosure. In this specification, unless specifically stated in a phrase, the singular form may also include the plural form, and when described as "at least one (or more) of A, B, and C", it may include at least one combination among all combinations that can be combined in A, B, and C.

[0079] Furthermore, when describing the elements of the embodiments of the present disclosure, terms such as first, second, A, B, (a), and (b) may be used. These terms are only used to distinguish an element from other elements, and the terms do not limit the nature, order, or sequence of the elements. In addition, when an element is described as "connected", "coupled", or "contacted" to another element, it may include not only the case where the element is directly "connected", "coupled", or "contacted" to the other element, but also the case where the element is "connected", "coupled", or "contacted" through another element between the element and the other element.

[0080] Furthermore, when described as being "on (above)" or "under (below)" each element, "on (above)" or "under (below)" may include not only the case where two elements are directly connected to each other, but also the case where one or more other elements are formed or provided between the two elements. In addition, when expressed as "on (above)" or "under (below)", based on one element, it may include not only the upward direction but also the downward direction.

[0081] The optical axis direction used below can be defined as the optical axis direction of the lens coupled to the camera actuator and the camera module, and the vertical direction can be defined as the direction perpendicular to the optical axis.

[0082] The "optical axis direction" used below is defined to include the optical axis direction of the lens module in the camera module. At the same time, the "optical axis direction" can be used interchangeably with the "vertical direction", "z-axis direction", etc.

[0083] In addition, the "autofocus function" used below is defined as a function that enables a clear image of an object to be obtained from an image sensor. For example, the "autofocus function" is defined as a function that automatically focuses on an object by adjusting the distance from the image sensor by moving a lens module in the optical axis direction according to the distance of the object. At the same time, "autofocus" can be used interchangeably with "AF (autofocus)".

[0084] In addition, the "image stabilization function" used below is defined as a function that moves or tilts a lens module in a direction perpendicular to the optical axis direction to cancel vibrations (movements) generated in the image sensor due to external forces. At the same time, "image stabilization" can be used interchangeably with "OIS (optical image stabilization)".

[0085] Before describing embodiments of the present invention, the configuration of an optical device according to an embodiment will be described.

[0086] The optical device may be any one of a mobile phone, a cellular phone, a smart phone, a portable smart device, a digital camera, a laptop computer, a digital broadcast terminal, a PDA (personal digital assistant), a PMP (portable multimedia player), and a navigation device. However, the type of the optical device is not limited thereto, and any device for taking images or pictures may be referred to as an optical device.

[0087] The optical device may include a body (not shown), a camera module, and a display unit (not shown). However, in the optical device, at least one of the body, the camera module, and the display unit may be omitted or changed.

[0088] The body may form the exterior of the optical device. For example, the body may include a rectangular three-dimensional shape. As another example, the body may be formed to be rounded at least in part. The body may house the camera module. The display unit may be provided on one surface of the body. For example, the display unit and the camera module may be provided on one surface of the body, and the camera module may be additionally provided on another surface (a surface opposite to the one surface) of the body.

[0089] The camera module may be provided in the body of the optical device. The camera module may be provided on one surface of the body. At least a part of the camera module may be housed inside the body. The camera module may be provided in a plurality of numbers. The plurality of camera modules may be provided on each of one surface and another surface of the body. The camera module may capture an image of an object.

[0090] The display unit may be provided on the main body. The display unit may be provided on one surface of the main body. That is, the display unit may be provided on the same surface as the camera module. Alternatively, the display unit may be provided on another surface of the main body. The display unit may be provided on a surface of the main body opposite to the surface on which the camera module is provided. The display unit may output an image captured by the camera module.

[0091] Figure 1 is a perspective view of a camera module according to an embodiment, Figure 2 is taken along line A-A', Figure 1 cross-sectional view of the camera module, Figure 3 is taken along line B-B', Figure 1 cross-sectional view of the camera module, Figure 4 is Figure 1 exploded perspective view of the camera module, Figure 5 is Figure 4 side view of the lens driving device, Figure 6 is Figure 4 exploded perspective view of the lens driving device, Figure 7a is a perspective view of a second substrate according to a first embodiment as viewed from above, Figure 7b is a perspective view of a second substrate according to a first embodiment as viewed from below, Figure 8a is a perspective view of a second substrate according to a second embodiment as viewed from below, Figure 8b is a perspective view of a second substrate according to a third embodiment as viewed from below, Figure 9 is an exploded perspective view of a filter portion according to a first embodiment, Figure 10a is a perspective view of a connection pin according to a first embodiment, Figure 10b is a perspective view of a connection pin according to a second embodiment, Figure 10c is a perspective view of a connection pin according to a third embodiment, Figure 11 is a plan view of a state in which a connection pin according to a first embodiment is coupled to a base, Figure 12 (a) in is a side view of a state in which a connection pin according to a first embodiment is coupled to a base, Figure 12 (b) in is a cross-sectional view of a state in which a connection pin according to a first embodiment is coupled to a base, Figure 13a is a perspective view of a base according to a second embodiment, Figure 13b is a perspective view of a base according to a third embodiment, Figure 14a is a cross-sectional view of a connection pin, a first terminal portion, and a second terminal portion according to a first embodiment, Figure 14b is a cross-sectional view of a connection pin, a first terminal portion, and a second terminal portion according to a second embodiment, Figure 14cCross-sectional view of a connection pin, a first terminal portion, and a second terminal portion according to the third embodiment Figure 15 Planar view of a base portion of a comparative example as compared with the embodiment Figure 16 In (a) is a side view of a camera module of a comparative example, and Figure 16 in (b) is a side view of a camera module of the embodiment

[0092] Hereinafter, with reference to Figures 1 to 16 the overall configuration of the camera module of the embodiment will be described

[0093] Before describing the embodiment, one of the first drive coil 222, the drive magnet 232, and the second drive coil 242 may be referred to as the "first drive portion", another one of the first drive coil 222, the drive magnet 232, and the second drive coil 242 may be referred to as the "second drive portion", and the remaining one of the first drive coil 222, the drive magnet 232, and the second drive coil 242 may be referred to as the "third drive portion". Meanwhile, the first drive coil 222 may be referred to as the "AF drive coil", the second drive coil 242 may be referred to as the "OIS drive coil", and the drive magnet 232 may be referred to as the "common magnet". Meanwhile, the first drive coil 222, the drive magnet 232, and the second drive coil 242 may be arranged such that their positions are exchanged with each other

[0094] In addition, the camera module of the embodiment may include a plurality of magnets. One magnet among the plurality of magnets may include the drive magnet 232

[0095] In addition, the camera module may include a sensing magnet 271 and a compensating magnet 272

[0096] At this time, one of the drive magnet 232, the sensing magnet 271, and the compensating magnet 272 may be referred to as the "first magnet", another one may be referred to as the "second magnet", and the remaining one may be referred to as the "third magnet"

[0097] With reference to Figures 1 to 4 , the camera module of the embodiment may include a lens module 100, a lens driving device 200, a driving substrate portion 300, a filter portion 400, and a connection pin 500

[0098] The driving substrate portion 300 may include a first substrate 310, an image sensor 320, a first terminal portion 330, a first device 340, and a second device 350. The first device 340 may be a driver device, and the second device 350 may be a motion sensor. The driving substrate portion 300 may also be referred to as the first substrate

[0099] Meanwhile, the camera module of the embodiment is described as including the lens module 100, the lens driving device 200, the driving substrate portion 300, the filter portion 400, and the connection pin 500, but one or more of these portions may be omitted or changed.

[0100] In addition, the lens module 100 may include a lens 120 and a lens barrel 110. The lens module 100 may include at least one lens 120 and a lens barrel 110 that houses the lens 120. However, the configuration of the lens module 100 is not limited to the lens barrel 110. For example, the configuration of the lens module 100 may be any holder structure capable of supporting one or more lenses 120.

[0101] The lens module 100 may be coupled inside the lens driving device 200.

[0102] The lens module 100 may be coupled to the bobbin 221 of the lens driving device 200. The lens module 100 may move together with the bobbin 221 of the lens driving device 200. For example, the lens module 100 may move integrally with the bobbin 221 of the lens driving device 200.

[0103] As an example, the lens module 100 may be coupled to the bobbin 221 by an adhesive member (not shown). As another example, the lens module 100 may be threadedly coupled to the bobbin 221. Meanwhile, the light passing through the lens module 100 may be irradiated onto the image sensor 320 of the driving substrate portion 300.

[0104] The filter portion 400 may be disposed on the image sensor 320. The filter portion 400 may block light in the infrared region from incident on the image sensor 320. The filter portion 400 may include a base 410 and an infrared filter 420. In addition, the filter portion 400 may include an adhesive member 430. That is, the adhesive member 430 may be disposed on the base 410. In addition, the infrared filter 420 may be attached or coupled to the base 410 by the adhesive member 430.

[0105] The infrared filter 420 may be disposed between the lens module 100 and the image sensor 320. The base 410 of the filter portion 400 may be disposed between the lens module 100 and the image sensor 320. Additionally, the infrared filter 420 may be mounted on the base 410. For example, the infrared filter 420 may be mounted on the through hole 411 of the base 410. The infrared filter 420 may be formed of a film material or a glass material. The infrared filter 420 may be formed by coating an infrared blocking coating material on a flat optical filter, such as a cover glass for protecting the imaging surface. As an example, the infrared filter 420 may be an infrared absorption filter capable of absorbing infrared rays. As another example, the infrared filter 420 may be an infrared reflection filter capable of reflecting infrared rays. The filter portion 400 may be disposed on the driving substrate portion 300. Preferably, the filter portion 400 may be disposed on the first substrate 310 of the driving substrate portion 300.

[0106] Meanwhile, the lens driving device 200 may be disposed on the driving substrate portion 300 and the filter portion 400. Preferably, the lens driving device 200 may be disposed on the filter portion 400. For example, the filter portion 400 may include an adhesive member 430 disposed on the upper surface of the base 410. Additionally, the holder 243 of the lens driving device 200 may be fixed to the filter portion 400 by the adhesive member 430. However, the embodiments are not limited thereto.

[0107] Preferably, the driving substrate portion 300 may be disposed on the lower portion of the filter portion 400. Additionally, the lens driving device 200 may be disposed on the upper portion of the filter portion 400.

[0108] The filter portion 400 may be coupled to the driving substrate portion 300, and the lens driving device 200 may be coupled to the filter portion 400.

[0109] The driving substrate portion 300 may include a first substrate 310. The image sensor 320 may be disposed on the first substrate 310. The first substrate 310 may be electrically connected to the image sensor 320.

[0110] At this time, the filter portion 400 and the lens driving device 200 may accommodate the image sensor 320 therein. With this structure, the light passing through the lens module 100 coupled to the lens driving device 200 may be irradiated onto the image sensor 320 mounted on the first substrate 310 of the driving substrate portion 300. The first substrate 310 may supply power (e.g., current) to the lens driving device 200.

[0111] Meanwhile, the first device 340, which is a control device for controlling the lens driving device 200, can be disposed on the first substrate 310. Additionally, the second device 350, which is a sensing device for determining the control conditions of the lens driving device 200, can be disposed on the first substrate 310.

[0112] The image sensor 320 can be disposed on the first substrate 310 of the driving substrate portion 300. The image sensor 320 can be electrically connected to the first substrate 310. For example, the image sensor 320 can be coupled to the first substrate 310 by surface mount technology (SMT). As another example, the image sensor 320 can be coupled to the first substrate 310 by flip chip technology. The image sensor 320 can be disposed such that the optical axis of the image sensor 320 is aligned with the lens module 100. That is, the optical axis of the image sensor 320 and the optical axis of the lens module 100 can be aligned. Through this, the image sensor 320 can obtain the light passing through the lens module 100. The image sensor 320 can convert the light irradiated onto the effective image area into an electrical signal. The image sensor 320 can be any one of a CCD (charge-coupled device), MOS (metal oxide semiconductor), CPD, and CID. However, the type of the image sensor 320 is not limited thereto, and the image sensor 320 can include any configuration capable of converting incident light into an electrical signal.

[0113] The first device 340 can be disposed on the first substrate 310. For example, the first device 340 can be disposed outside the lens driving device 200 on the first substrate 310. However, the embodiments are not limited thereto, and the first device 340 can be disposed inside the lens driving device 200 on the first substrate 310.

[0114] The first substrate 310 can include a first terminal portion 330. The first terminal portion 330 can be disposed on one surface of the first substrate 310. Preferably, the first terminal portion 330 can be disposed on the upper surface of the first substrate 310.

[0115] The first terminal portion 330 can be disposed around the image sensor 320 on the first substrate 310. The first terminal portion 330 can include a plurality of first terminals. For example, the first terminal portion 330 can include a plurality of first terminals electrically connected to the second substrate 241 of the lens driving device 200.

[0116] The first terminal portion 330 can be divided into a plurality of first terminal groups.

[0117] The first terminal portion 330 may include a first-first terminal portion 331, and the first-first terminal portion 331 includes a plurality of first-first terminals. The first-first terminal portion 331 may be disposed adjacent to one side of the image sensor 320 on the first substrate 310.

[0118] The first terminal portion 330 may include a first-second terminal portion 332, and the first-second terminal portion 332 includes a plurality of first-second terminals. The first-second terminal portion 332 may be disposed adjacent to the other side of the image sensor 320 opposite to the one side on the first substrate 310.

[0119] The first-first terminal portion 331 and the first-second terminal portion 332 may include the same number of terminals. For example, the number of the plurality of first-first terminals may be the same as the number of the plurality of first-second terminals. However, the embodiments are not limited thereto. For example, the number of the plurality of first-first terminals may be different from the number of the plurality of first-second terminals. However, the embodiments allow the number of the plurality of first-first terminals to be the same as the number of the plurality of first-second terminals. By this, the embodiments improve the weight balance of the camera module, and thus improve the operability.

[0120] For example, the plurality of first-first terminals may include eight terminals. In addition, the plurality of first-second terminals may also include eight terminals.

[0121] The plurality of first-first terminals may include power-related terminals, clock terminals, and OIS driving terminals. In addition, the plurality of first-second terminals may include Hall sensor terminals and ground terminals. For example, the first substrate 310 may be connected to a second driving coil 242 disposed on a second substrate 241. At this time, the second driving coil 242 may include a second-first driving coil (not shown) for driving in the x-axis direction and a second-second driving coil (not shown) for driving in the y-axis direction. In addition, the lens driving device 200 may include a first sensor unit (not shown) and a second sensor unit (not shown) for detecting the position of the housing 231 or the bobbin 221.

[0122] In addition, the plurality of first-first terminals of the first-first terminal portion 331 may include: a first-first-a terminal connected to one end of the second-first drive coil, a first-first-b terminal connected to the other end of the second-first drive coil, a first-first-c terminal connected to one end of the second-second drive coil, a first-first-d terminal connected to the other end of the second-second drive coil, a first-first-e terminal corresponding to the SDA terminal for transmitting a data signal, a first-first-f terminal corresponding to the SCL terminal for transmitting a clock signal, a first-first-g terminal for transmitting VDD power, and a first-first-h terminal for transmitting VSS power.

[0123] In addition, the plurality of first-second terminals of the first-second terminal portion 332 may include: a first-second-a terminal connected to the first input terminal of the first sensor unit, a first-second-b terminal connected to the first output terminal (e.g., positive terminal) of the first sensor unit, a first-second-c terminal connected to the second output terminal (e.g., negative terminal) of the first sensor unit, a first-second-d terminal connected to the first input terminal of the second sensor unit, a first-second-e terminal connected to the first output terminal (e.g., positive terminal) of the second sensor unit, a first-second-f terminal connected to the second output terminal (e.g., negative terminal) of the second sensor unit, a first-second-g terminal commonly connected to the second input terminals of the first sensor unit and the second sensor unit, and a first-second-h terminal for frame grounding.

[0124] The first terminal portion 330 may be formed of a metal material having high conductivity to transmit an electrical signal. For example, the first terminal portion 330 may be formed of at least one metal material selected from gold (Au), silver (Ag), platinum (Pt), titanium (Ti), tin (Sn), copper (Cu), and zinc (Zn). For example, the first terminal portion 330 may be formed of copper (Cu) which has high conductivity and is relatively inexpensive. The first terminal portion 330 may be formed by conventional manufacturing processes of a printed circuit board, such as an additive process, a subtractive process, an improved semi-additive process (MSAP), and a semi-additive process (SAP).

[0125] The first device 340 may also be referred to as a "drive device" or a "control device" or a "control unit", which drives or controls the lens drive device 200.

[0126] The first device 340 may separately control the direction, intensity, and amplitude of the current supplied to the first drive coil 222 and the second drive coil 242 of the lens drive device 200. However, the intensity of the current supplied to the first drive coil 222 may be controlled by a Hall driver device (not shown).

[0127] The first device 340 may control the lens driving device 200 to perform at least one of the autofocus function and the image stabilization function of the camera module. That is, the first device 340 may control the lens driving device 200 to move the lens module 100 in the optical axis direction, move the lens module 100 in a direction perpendicular to the optical axis direction, or tilt the lens module 100. In addition, the first device 340 may perform at least one of the feedback control of the autofocus function and the feedback control of the image stabilization function.

[0128] For example, the first device 340 may receive the position of the bobbin 221 or the housing 231 detected by the first sensor unit (not shown), and control the current applied to the first driving coil 222. Through this, the first device 340 may perform autofocus feedback control. In addition, the first device 340 may receive the position of the bobbin 221 or the housing 231 detected by the second sensor unit (not shown), and control the current applied to the second driving coil 242. Through this, the first device 340 may perform image stabilization feedback control.

[0129] At this time, the feedback control performed by the first device 340 occurs in real time, and thus a more accurate autofocus function and image stabilization function may be performed.

[0130] The second device 350 may be disposed on the first substrate 310 and spaced apart from the first device 340. The second device 350 may be a motion sensor. For example, the second device 350 may detect rotational angular velocity information due to the movement of the camera module. The second device 350 may be implemented as a biaxial or triaxial gyro sensor or an angular velocity sensor.

[0131] In addition, the driving substrate portion 300 may include a connector 360. The connector 360 may be disposed on the first substrate 310. For example, the connector 360 may be electrically connected to the first substrate 310. The connector 360 may include a port electrically connected to an external device (e.g., an optical device). The connector 360 may transmit the image signal obtained from the image sensor 320 to the optical device. In addition, the connector 360 may transmit the signal transmitted from the optical device to the first device 340 disposed on the first substrate 310.

[0132] The connection pin 500 may be coupled to the filter portion 400. For example, the connection pin 500 may penetrate the base 410 of the filter portion 400. The connection pin 500 may include a first connection portion 502 connected to the first substrate 310 of the driving substrate portion 300. In addition, the connection pin 500 may include a second connection portion 503 connected to the second substrate 241 of the lens driving device 200.

[0133] For example, the driving substrate portion 300 and the lens driving device 200 can be electrically connected to each other. For example, the first substrate 310 of the driving substrate portion 300 and the second substrate 241 of the lens driving device 200 can be electrically connected to each other.

[0134] At this time, the camera module according to the embodiment can electrically connect the first substrate 310 and the second substrate 241 using the connection pin 500. In addition, the connection pin 500 is provided to penetrate the base portion 410 of the filter portion 400. In addition, while penetrating the base portion 410, the connection pin 500 can be electrically connected to the first substrate 310 through the first connection portion 502 and to the second substrate 241 through the second connection portion 503.

[0135] Specifically, the first substrate 310 can include a first terminal portion 330. In addition, the lens driving device 200 can include a second substrate 241 having a second terminal portion (241P, see Figures 14a to 14c ).

[0136] At this time, in the camera module of the comparative example, the first terminal portion 330 and the second terminal portion 241P are connected to each other by soldering.

[0137] In contrast, in the present embodiment, the first substrate 310 and the second substrate 241 can be electrically connected to each other through the connection pin 500 penetrating the base portion 410. For example, the first connection portion 502 of the connection pin 500 can contact the first terminal portion 330 of the first substrate 310, and the second connection portion 503 of the connection pin 500 can contact the second terminal portion 241P of the second substrate 241. Therefore, the point on the second terminal portion 241P that contacts the second connection portion 503 of the connection pin 500 can be provided on the second substrate 241 in the horizontal direction rather than in the vertical direction. For example, as Figure 5 shown, when viewed from the side surface of the camera module, the portion of the second terminal portion 241P that substantially contacts the second connection portion 503 in the entire area of the second terminal portion 241P can be located on the lower portion of the second substrate 241. In contrast, the contact portion in the comparative example is located on the side portion of the second substrate. This can be achieved by the fact that the camera module of the present embodiment is interconnected between the first substrate 310 and the second substrate 241 through the connection pin 500, and thus the soldering process in the comparative example is omitted.

[0138] Hereinafter, the lens driving device 200, the driving substrate portion 300, the filter portion 400, and the connection pin 500 of the embodiment will be described in more detail.

[0139] Referring to Figure 6, the lens driving device 200 may include a cover member 210, a first mover 220, a second mover 230, a stator 240, a first support member 250, a second support member 260, and a sensor unit (not shown).

[0140] However, in the lens driving device 200, one or more of the cover member 210, the first mover 220, the second mover 230, the stator 240, the first support member 250, the second support member 260, and the sensor unit may be omitted or changed. In particular, as a configuration for autofocus feedback control and image stabilization feedback control, one or more sensor units in the sensor unit may be omitted.

[0141] The cover member 210 may form the exterior of the lens driving device 200. The cover member 210 may have a hexahedral shape with an open bottom. However, the shape of the cover member 210 is not limited thereto. The cover member 210 may be a non-magnetic material. If the cover member 210 is provided with a magnetic material, the magnetic force of the cover member 210 may affect one or more of the driving magnet 232, the sensing magnet 271, and the compensating magnet 272. The cover member 210 may be formed of a metal material.

[0142] The cover member 210 may be provided with a metal plate. In this case, the cover member 210 may block electromagnetic interference (EMI). Therefore, the cover member 210 may be referred to as an "EMI shielding cover". The cover member 210 may block radio waves generated outside the lens driving device 200 from flowing into the interior of the cover member 210. In addition, the cover member 210 can block radio waves generated inside the cover member 210 from being emitted to the outside of the cover member 210.

[0143] The cover member 210 may include an upper plate 211 and side plates 212. The cover member 210 may include an upper plate 211 and side plates 212 extending downward from the outer peripheral edge of the upper plate 211. The cover member 210 may be coupled to the holder 243. A part of the side plates 212 of the cover member 210 may be coupled to the holder 243.

[0144] The inner surface of the side plates 212 of the cover member 210 may be in direct contact with the outer surface of the holder 243. The inner surface of the side plates 212 of the cover member 210 may be coupled to the holder 243 by an adhesive (not shown).

[0145] The first mover 220, the second mover 230, the stator 240, the first support member 250, and the second support member 260 may be disposed in the internal space formed by the cover member 210 and the holder 243. With this structure, the cover member 210 can protect the internal components from external impacts while preventing the intrusion of external contaminants.

[0146] The cover member 210 may include an opening portion 213. The opening portion 213 may be provided on the upper plate 211 of the cover member 210. The opening portion 213 may expose the lens module 100 upward. The opening portion 213 may be formed in a shape corresponding to the lens module 100. The size of the opening portion 213 may be larger than the diameter of the lens module 100 such that the lens module 100 can be assembled through the opening portion 213. The light introduced through the opening portion 213 may pass through the lens module 100. At this time, the light passing through the lens module 100 may be converted into an electrical signal in the image sensor and acquired as an image.

[0147] The first mover 220 may be coupled to the lens module 100. The first mover 220 may accommodate the lens module 100 therein. The outer peripheral surface of the lens module 100 may be coupled to the inner peripheral surface of the first mover 220. The first mover 220 may move through the interaction with the second mover 230 and / or the stator 240. At this time, the first mover 220 may move integrally with the lens module 100. Meanwhile, the first mover 220 may move for the autofocus function. At this time, the first mover 220 may be referred to as an "AF mover". However, this is not limited to the first mover 220 being a member that moves only for the autofocus function. The first mover 220 may also move for the image stabilization function.

[0148] The first mover 220 may include a bobbin 221 and a first driving coil 222. However, at least one of the bobbin 221 and the first driving coil 222 of the first mover 220 may be omitted or changed.

[0149] The bobbin 221 may be provided inside the housing 231. The bobbin 221 may be provided in a through hole (not shown) of the housing 231.

[0150] The bobbin 221 may move along the optical axis direction based on the housing 231. The bobbin 221 may be arranged to move along the optical axis in a through hole (not shown) of the housing 231. The bobbin 221 may be coupled to the lens module 100. The inner peripheral surface of the bobbin 221 may be coupled to the outer peripheral surface of the lens module 100. The first driving coil 222 may be coupled to the bobbin 221. The outer peripheral surface of the bobbin 221 may be coupled to the first driving coil 222. The lower portion of the bobbin 221 may be coupled to the lower support member 252. The upper portion of the bobbin 221 may be coupled to the upper support member 251.

[0151] The bobbin 221 may include a through hole (not shown). Additionally, the lens module 100 may be provided in the through hole of the bobbin 221. For example, the lens module 100 may be threadedly coupled to the through hole of the bobbin 221. Alternatively, the lens module 100 may be coupled to the through hole of the bobbin 221 by an adhesive.

[0152] The first driving coil 222 may be coupled to the bobbin 221. For this purpose, the bobbin 221 may include a groove (not shown), in which a part of the outer peripheral surface of the bobbin is recessed inward. In addition, the first driving coil 222 may be received in the groove.

[0153] The upper support member 251 may be coupled to the upper surface of the bobbin 221. For this purpose, a coupling protrusion (not shown) for coupling the upper support member 251 may be formed on the upper side portion of the bobbin 221.

[0154] In addition, the lower support member 252 may be coupled to the lower surface of the bobbin 221.

[0155] The first driving coil 222 may be disposed on the bobbin 221. The first driving coil 222 may be disposed on the outer peripheral surface of the bobbin 221. The first driving coil 222 may be directly wound around the bobbin 221. The first driving coil 222 may face the driving magnet 232. In this case, when a current is supplied to the first driving coil 222 and a magnetic field is formed around the first driving coil 222, due to the electromagnetic interaction between the first driving coil 222 and the driving magnet 232, the first driving coil 222 may move relative to the driving magnet 232. The first driving coil 222 may have an electromagnetic interaction with the driving magnet 232. The first driving coil 222 may cause the bobbin 221 to move relative to the housing 231 in the optical axis direction by electromagnetic interaction with the driving magnet 232. As an example, the first driving coil 222 may be a single integrally formed coil. As another example, the first driving coil 222 may include a plurality of coils spaced apart from each other.

[0156] The first driving coil 222 may include a pair of leads for power supply. At this time, the pair of leads of the first driving coil 222 can be electrically connected to the upper support member 251. That is, the first driving coil 222 may be powered through the upper support member 251. As another example, the pair of leads of the first driving coil 222 may be electrically connected to the lower support member 252.

[0157] The second mover 230 may accommodate at least a part of the first mover 220 therein. The second mover 230 may move the first mover 220 or move together with the first mover 220. The second mover 230 may move by interacting with the stator 240. The second mover 230 may move for an image stabilization function. At this time, the second mover 230 may be referred to as an "OIS mover". The second mover 230 may move integrally with the first mover 220 when moving for the image stabilization function.

[0158] The second mover 230 may include a housing 231 and a drive magnet 232. However, at least one of the housing 231 and the drive magnet 232 of the second mover 230 may be omitted or changed.

[0159] The housing 231 may be disposed on the outer portion of the bobbin 221. The housing 231 may accommodate at least a portion of the bobbin 221 therein. For example, the housing 231 may include a hexahedron shape. The housing 231 may include four side surfaces and four corner portions disposed between the four side surfaces. The drive magnet 232 may be disposed on the housing 231. For example, the drive magnet 232 may be disposed on each of the four side surfaces of the housing 231. As another example, the drive magnet 232 may be disposed on each of the four corner portions of the housing 231. At least a portion of the outer surface of the housing 231 may be formed in a shape corresponding to the inner surface of the cover member 210. In particular, the outer surface of the housing 231 may be formed in a shape corresponding to the inner surface of the side plate 212 of the cover member 210. The housing 231 may be formed of an insulating material. The housing 231 may be formed of a material different from that of the cover member 210.

[0160] The upper support member 251 may be coupled to the upper portion of the housing 231. The lower support member 252 may be coupled to the lower portion of the housing 231.

[0161] In addition, the first sensor unit and / or the second sensor unit may be disposed in the housing 231.

[0162] For example, the first sensor unit 270 may include a sensing magnet 271, a compensating magnet 272, and a first Hall sensor (not shown).

[0163] The drive magnet 232 may be disposed in the housing 231. The drive magnet 232 may be disposed on the outer side portion of the first drive coil 222. The drive magnet 232 may face the first drive coil 222. The drive magnet 232 may interact electromagnetically with the first drive coil 222. The drive magnet 232 may be disposed on the upper side portion of the second drive coil 242. The drive magnet 232 may face the second drive coil 242. The drive magnet 232 may interact electromagnetically with the second drive coil 242. The drive magnet 232 may be commonly used for the autofocus function and the image stabilization function. However, the drive magnet 232 may include a plurality of magnets respectively for each of the autofocus function and the image stabilization function. As an example, the drive magnet 232 may be disposed on the side surface of the housing 231. In this case, the drive magnet 232 may be a flat magnet. The drive magnet 232 may have a flat plate shape. As another example, the drive magnet 232 may be disposed on the corner portion of the housing 231. At this time, the drive magnet 232 may be a corner magnet. The drive magnet 232 may have a hexahedron shape with an inner surface wider than an outer surface. The drive magnet 232 may include a plurality of magnets spaced apart from each other. The drive magnet 232 may include four magnets spaced apart from each other. In this case, the four magnets may be disposed in the housing 231 such that two adjacent magnets form 90° with each other. That is, the drive magnet 232 may be disposed on the four side surfaces of the housing 231 at the same interval.

[0164] The stator 240 may be disposed on the lower side portion of the housing 231. The stator 240 may be disposed on the lower side portion of the second mover 230.

[0165] The stator 240 may face the second mover 230. The stator 240 can support the second mover 230 in a movable manner. The stator 240 may move the second mover 230. At this time, the first mover 220 may also move together with the second mover 230.

[0166] The stator 240 may include a second substrate 241, a second drive coil 242, and a holder 243. However, in the stator 240, at least one of the second substrate 241, the second drive coil 242, and the holder 243 may be omitted or changed. The stator 240 may also be referred to as a second substrate portion.

[0167] The second substrate 241 may supply power to the second drive coil 242. The second substrate 241 may be coupled to the second drive coil 242. The second substrate 241 may be coupled to a base 410 of a filter portion 400 provided on a lower side portion of the holder 243. The second substrate 241 may be disposed on a lower surface of the second drive coil 242. The second substrate 241 may be disposed on an upper surface of the holder 243. The second substrate 241 may be disposed between the second drive coil 242 and the holder 243.

[0168] The second substrate 241 may include a flexible printed circuit board (FPCB).

[0169] According to an embodiment, the second substrate 241 may have a different structure or shape.

[0170] First, the second substrate 241 of the first embodiment will be described as follows.

[0171] Referring to Figure 7a and Figure 7b , the second substrate 241 may include a portion bent in at least a part thereof.

[0172] For example, the second substrate 241 may include a first region 241-1. The first region 241-1 may be a flat region. The first region 241-1 may be a rigid region. The first region 241-1 of the second substrate 241 may be disposed on the holder 243.

[0173] The first region 241-1 may include an opening portion 241-11. The opening portion 241-11 may be aligned with the lens module 100 and the image sensor 320 along the optical axis. For example, the opening portion 241-11 may be formed at a central portion of the first region 241-1 of the second substrate 241. The opening portion 241-11 may be formed to penetrate the first region 241-1 of the second substrate 241. The opening portion 241-11 can allow light passing through the lens module 100 to pass through. The opening portion 241-11 may be formed in a circular shape, but is not limited thereto.

[0174] The first region 241-1 of the second substrate 241 may include at least one through hole 241-12. The through hole 241-12 may penetrate the first region 241-1. The through hole 241-12 may include a plurality of through holes. The through hole 241-12 may be formed in each corner region of the upper surface of the first region 241-1 of the second substrate 241. The through hole 241-12 may be a through hole for the second support member 260 to pass through.

[0175] The second substrate 241 may include a second region bent from the first region 241-1.

[0176] For example, the second substrate 241 may include a second region that is bent at at least one end of the first region 241-1. The second region may include a plurality of bent regions that are respectively bent at different ends of the first region 241-1.

[0177] The second region of the second substrate 241 may include a first bent region 241-2 that is bent downward from one end of the first region 241-1. Additionally, the second region of the second substrate 241 may include a second bent region 241-3 that is bent downward from the other end of the first region 241-1 opposite to the one end.

[0178] Additionally, a second terminal portion may be formed in the second region of the second substrate 241. The second terminal portion may be electrically connected to the first terminal portion 330 of the first substrate 310. For example, the second terminal portion of the second substrate 241 may be electrically connected to the first terminal portion 330 of the first substrate 310 via a connection pin 500.

[0179] At this time, the second region of the second substrate 241 may be divided into a plurality of sub-regions. For example, the second region of the second substrate 241 may include a first sub-region (241-21, see Figure 3 ) that is bent from the first region 241-1 and penetrates the holder 243. However, the embodiment is not limited thereto. For example, the first sub-region 241-21 of the second region of the second substrate 241 may not penetrate the holder 243, but may be provided on the side portion of the holder 243.

[0180] Additionally, the second region of the second substrate 241 may include a second sub-region (241-22, see Figure 3 ) that is bent from the first sub-region 241-21 and provided below the holder 243. That is, the first sub-region 241-21 may penetrate the holder 243 or be provided on the side portion of the holder 243.

[0181] For example, each of the first bent region 241-2 and the second bent region 241-3 of the second substrate 241 may include the first sub-region 241-21 and the second sub-region 241-22.

[0182] The second sub-region 241-22 of each of the first bent region 241-2 and the second bent region 241-3 may face the first region 241-1. For example, the upper surface of each second sub-region of the second sub-regions 241-22 of the first bent region 241-2 and the second bent region 241-3 may face the lower surface of the first region 241-1.

[0183] In addition, the second terminal portion of the first embodiment may be provided on the lower surface of the second sub-region 241-22 of the second region. For example, the second terminal portion may be provided to face the upper surface of the base 410 of the filter portion 400.

[0184] The second terminal portion may include a second-first terminal portion 241-2P provided on the lower surface of the second sub-region of the first bending region 241-2. The second-first terminal portion 241-2P may correspond to the first-first terminal portion 331 of the first terminal portion 330. Therefore, the number of the second-first terminal portions 241-2P may correspond to the number of the first-first terminal portions 331, but is not limited thereto. The second-first terminal portion 241-2P may include a plurality of second-first terminals connected to the plurality of first-first terminals of the first-first terminal portion 331 of the first substrate 310.

[0185] The second terminal portion may include a second-second terminal portion 241-3P provided on the lower surface of the second sub-region of the second bending region 241-3. The second-second terminal portion 241-3P may correspond to the first-second terminal portion 332 of the first terminal portion 330. Therefore, the number of the second-second terminal portions 241-3P may correspond to the number of the first-second terminal portions 332, but is not limited thereto. The second-second terminal portion 241-3P may include a plurality of second-second terminals connected to the plurality of first-second terminals of the first-second terminal portion 332 of the first substrate 310.

[0186] In addition, the second terminal portion of the second substrate 241 may be electrically connected to the first terminal portion 330 of the first substrate 310 through a connection pin 500 described later.

[0187] Meanwhile, referring to Figure 8a , the second substrate 241 in another embodiment may have a structure different from that of the first embodiment of Figure 7a and Figure 7b in the second terminal portion.

[0188] That is to say, the second terminal portion may include a plurality of parts.

[0189] For example, the second-first terminal portion 241-2P may include a plurality of parts. In addition, the second-second terminal portion 241-3P may include a plurality of parts. Hereinafter, the description will be based on the second-second terminal portion 241-3P. In addition, the second-first terminal portion 241-2P may have the same structure as the second-second terminal portion 241-3P described below.

[0190] The second - second terminal portion 241 - 3P may include a first portion 241 - 31P and a second portion 241 - 32P.

[0191] The first portion 241 - 31P of the second - second terminal portion 241 - 3P may be disposed in the second bending region 241 - 3 of the second substrate 241. For example, the first portion 241 - 31P of the second - second terminal portion 241 - 3P may be disposed below the second sub - region 241 - 22 of the second bending region 241 - 3 of the second substrate 241. The first portion 241 - 31P of the second - second terminal portion 241 - 3P may be the portion that contacts the second connection portion 503 of the connection pin 500. For example, the first portion 241 - 31P of the second - second terminal portion 241 - 3P may be a contact terminal that contacts the second connection portion 503.

[0192] In addition, the second part 241-32P of the second-second terminal part 241-3P can be disposed in the first sub-region 241-21 of the second bending region 241-3 of the second substrate 241. For example, the second part 241-32P of the second-second terminal part 241-3P can be disposed on a side part of the first sub-region 241-21. The second part 241-32P of the second-second terminal part 241-3P can be connected to the first part 241-31P of the second-second terminal part 241-3P. That is to say, the first part 241-31P and the second part 241-32P can be a terminal pattern and can be distinguished only by the arrangement positions. The second part 241-32P of the second-second terminal part 241-3P can be exposed to the outside of the camera module. At this time, when the second bending region 241-3 penetrates the holder 243, a side part of the holder 243 can include a recess (not shown) that horizontally overlaps with the second part 241-32P of the second-second terminal part 241-3P and exposes the second part 241-32P to the outside of the camera module. The second part 241-32P of the second-second terminal part 241-3P can be used as a test terminal. For example, in order to couple the second substrate 241 of the lens driving device 200 to the filter part 400 coupled to the first substrate 310 to which the image sensor 320 is attached, an active alignment (AA: active alignment) process must be performed to accurately focus the lens of the lens driving device 200 on the image sensor 320. In addition, the second part 241-32P of the second-second terminal part 241-3P can be connected to a holder during the active alignment process and can thus be used as a terminal for adjusting the position of the lens driving device 200. Meanwhile, when the active alignment process is completed, the second part 241-32P of the second-second terminal part 241-3P may not be used. Meanwhile, when the active alignment process is completed, the second part 241-32P of the second-second terminal part 241-3P can be covered by a separate insulating member (not shown). However, the embodiments are not limited thereto. For example, even after the active alignment process is completed, the second part 241-32P of the second-second terminal part 241-3P can be exposed to the outside of the camera module. In addition, the exposed second part 241-32P can be used as a terminal for testing the contact reliability between the first terminal part 330 of the first substrate 310 and the second terminal part of the second substrate 241 connected by the connection pin 500 in the use environment of the camera module.

[0193] Meanwhile, referring to Figure 8b , the second substrate 241 in another embodiment can have the same as Figure 7a , Figure 7b the first embodiment of Figure 8aa different structure from the second embodiment because it does not include a bent region.

[0194] Specifically, the second substrate 241 may only include the first region 241-1 in the structure of the first embodiment. For example, the second substrate 241 may not include a bent region that bends downward from the end of the first region 241-1. Additionally, the second terminal portion may be disposed on the lower surface of the first region 241-1 of the second substrate 241. At this time, the holder 243 may be disposed on the lower portion of the second substrate 241. Thus, the holder 243 may include an opening (not shown) that vertically overlaps with the second terminal portion disposed on the lower surface of the first region 241-1 of the second substrate 241. The second connection portion 503 of the connection pin 500 may be at least partially disposed within the opening of the holder 243. Through this, the second connection portion 503 may contact or be electrically connected to the second terminal portion disposed on the lower surface of the first region 241-1 of the second substrate 241 through the opening of the holder 243. Meanwhile, the second terminal portion disposed on the second substrate 241 of the third embodiment may also include a first portion and a second portion corresponding to the second embodiment. In this case, the first portion of the second terminal portion may be disposed on the lower surface of the first region 241-1, and the second portion of the second terminal portion may be disposed on the side surface of the first region 241-1.

[0195] Referring again to Figure 6 , the second drive coil 242 may be disposed on the holder 243. The second drive coil 242 may be disposed on the second substrate 241. The second drive coil 242 may be disposed on the upper surface of the second substrate 241. The second drive coil 242 may be disposed on the lower side portion of the drive magnet 232. The second drive coil 242 may be disposed between the drive magnet 232 and the holder 243. The second support member 260 may be coupled to the second drive coil 242. The second drive coil 242 can support the second mover 230 in a movable manner. At this time, although not shown in the drawings, the second drive coil 242 may include a substrate and a coil portion disposed on the substrate.

[0196] The second driving coil 242 may receive power through the first substrate 310, the connection pins 500, and the second substrate 241. The second driving coil 242 may face the driving magnet 232. In this case, when current is supplied to the second driving coil 242 and a magnetic field is formed around the second driving coil 242, due to the electromagnetic interaction between the second driving coil 242 and the driving magnet 232, the driving magnet 232 may move relative to the second driving coil 242. The second driving coil 242 may interact electromagnetically with the driving magnet 232. The second driving coil 242 may cause the housing 231 and the bobbin 221 to move in a direction perpendicular to the optical axis relative to the holder 243 by interacting electromagnetically with the driving magnet 232.

[0197] The first support member 250 may be coupled to the bobbin 221 and the housing 231. The first support member 250 can elastically support the bobbin 221. The first support member 250 may be elastic in at least a part thereof. At this time, the first support member 250 may be referred to as the "first elastic member". The first support member 250 can support the bobbin 221 in a movable manner. The first support member 250 can support the bobbin 221 so as to be movable in the optical axis direction relative to the housing 231. That is, the first support member 250 may support the bobbin 221 to drive AF. At this time, the first support member 250 may be referred to as the "AF support member". The first support member 250 may include an upper support member 251 and a lower support member 252. However, in the first support member 250, at least one of the upper support member 251 and the lower support member 252 may be omitted or changed.

[0198] The upper support member 251 is disposed at the upper side portion of the bobbin 221 and may be coupled to the bobbin 221 and the housing 231. The upper support member 251 may be coupled to the bobbin 221 and the housing 231. The upper support member 251 may be coupled to the upper portion of the bobbin 221 and the upper portion of the housing 231. The upper support member 251 can elastically support the bobbin 221. The upper support member 251 may be elastic in at least a part thereof. In this case, the upper support member 251 may be referred to as the "upper elastic member". The upper support member 251 can support the bobbin 221 in a movable manner. The upper support member 251 can support the bobbin 221 so as to be movable in the optical axis direction relative to the housing 231. The upper support member 251 may be formed as a leaf spring.

[0199] The lower support member 252 is provided on the lower side portion of the bobbin 221 and can be coupled to the bobbin 221 and the housing 231. The lower support member 252 can be coupled to the bobbin 221 and the housing 231. The lower support member 252 can be coupled to the lower portion of the bobbin 221 and the lower portion of the housing 231. The lower support member 252 can elastically support the bobbin 221. The lower support member 252 can be elastic in at least a part thereof. In this case, the lower support member 252 can be referred to as a "lower elastic member". The lower support member 252 can support the bobbin 221 in a movable manner. The lower support member 252 can support the bobbin 221 so as to be movable in the optical axis direction with respect to the housing 231. The lower support member 252 can be formed as a leaf spring.

[0200] The second support member 260 can support the housing 231 in a movable manner. The second support member 260 can elastically support the housing 231. The second support member 260 can be elastic in at least a part thereof. At this time, the second support member 260 can also be referred to as a "second elastic member". For example, the second support member 260 can support the housing 231 so as to be movable in a direction perpendicular to the optical axis with respect to the stator 240. At this time, the bobbin 221 can move integrally with the housing 231. As another example, the second support member 260 can support the housing 231 such that the housing 231 can be inclined with respect to the stator 240. That is, the second support member 260 can support the housing 231 and the bobbin 221 such that they drive the OIS. At this time, the second support member 260 can be referred to as an "OIS support member". For example, the second support member 260 can be formed of a wire.

[0201] The first sensor unit 270 can be provided for autofocus feedback. The first sensor unit 270 can detect the movement of the bobbin 221 in the optical axis direction. The first sensor unit 270 can detect the amount of movement of the bobbin 221 in the optical axis direction and provide the detected amount to the first device 340 in real time. The first sensor unit 270 can include a first Hall sensor (not shown), a sensing magnet 271, and a compensating magnet 272.

[0202] In addition, the camera module may further include a second sensor unit (not shown). The second sensor unit may include a second Hall sensor. The second sensor unit may be provided for image stabilization feedback. In this case, the second sensor unit may be referred to as an "OIS feedback sensor". The second sensor unit may detect the movement of the housing 231. The second sensor unit may detect movement or tilt in a direction perpendicular to the optical axis of the housing 231 and / or the bobbin 221. The second sensor unit may detect the drive magnet 232. The second sensor unit may detect the drive magnet 232 disposed in the housing 231. The second sensor unit may detect the position of the housing 231. The second sensor unit may detect the amount of movement in a direction perpendicular to the optical axis of the housing 231.

[0203] The lens driving device 200 may further include a third substrate 280. The third substrate 280 may be electrically connected to the second substrate 241. For example, the third substrate 280 may be electrically connected to the first drive coil 222. The third substrate 280 may supply power to the first drive coil 222. At this time, the third substrate 280 may be electrically connected to at least one of the first support member 250 and the second support member 260. Therefore, the power supplied from the second substrate 241 to the third substrate 280 may be supplied to the first drive coil 222 via at least one of the first support member 250 and the second support member 260.

[0204] As described above, the lens driving device 200 may include a second substrate 241. In addition, the second terminal portion of the second substrate 241 may be disposed to face the upper surface of the base 410 of the filter portion 400 to be described later.

[0205] Meanwhile, reference will be made to Figures 9 to 12 to describe the overall structure of the filter portion 400.

[0206] Referring to Figures 9 to 12 , the filter portion 400 may include a base 410, an infrared filter 420, and an adhesive member 430.

[0207] The base 410 may be disposed below the lens driving device 200. For example, at least a part of the upper surface of the base 410 may be disposed to directly face at least a part of the second substrate 241. Preferably, at least a part of the upper surface of the base 410 may be disposed to directly face the lower surface of the second sub-region 241-22 of the second region of the second substrate 241.

[0208] The base 410 may include a through hole 411. The base 410 may have a mounting portion 412 formed around the through hole 411.

[0209] In addition, the bonding member 430 may be disposed on the upper surface of the base 410. The bonding member 430 can couple the lens driving device 200 to the base 410. Preferably, the bonding member 430 can couple the holder 243 of the lens driving device 200 to the base 410.

[0210] In addition, an adhesive may be applied to the mounting portion 412 of the base 410. Through this adhesive, the infrared filter 420 can be disposed on the mounting portion 412 of the base 410. The mounting portion 412 may be in the shape of a recess, cavity or hole recessed from the upper surface of the base 410, but is not limited thereto. For example, the mounting portion 412 may be a protrusion protruding from the upper surface of the base 410. For example, the mounting portion 412 of the base 410 may refer to a stepped portion provided to correspond to the area where the infrared filter 420 is disposed on the upper surface of the base 410.

[0211] The mounting portion 412 of the base 410 can be used to prevent the lower end portion of the lens module 100 from contacting or colliding with the infrared filter 420.

[0212] At this time, the mounting portion 412 can be formed along the side surface of the infrared filter 420. For example, the mounting portion 412 can be formed to surround the side surface of the infrared filter 420.

[0213] When viewed from above, the shape of the mounting portion 412 may be the same as the shape of the infrared filter 420, but is not limited thereto. The shape of the mounting portion 412 in another embodiment may be similar to or different from the shape of the infrared filter 420.

[0214] The through hole 411 of the base 410 allows the light passing through the infrared filter 420 to be incident on the image sensor 320. The through hole 411 can pass through the center of the base 410. The area of the through hole 411 can be smaller than the area of the infrared filter 420.

[0215] The base 410 is disposed on the first substrate 310 of the driving substrate portion 300. In addition, the base 410 can accommodate the infrared filter 420 therein. In addition, the base 410 can support the lens driving device 200 located on the upper side portion of the base.

[0216] In addition, the base 410 can support the connection pin 500 that is electrically connected between the first substrate 310 and the second substrate 241. That is, the base 410 can fix the connection pin 500.

[0217] For this purpose, the base 410 may include an insertion hole 415. The insertion hole 415 may be a through hole penetrating the base 410. The insertion hole 415 can be aligned with the first terminal portion 330 of the first substrate 310 and the second terminal portion of the second substrate 241 along the optical axis in the base 410.

[0218] The insertion hole 415 may include a first insertion hole 415-1 corresponding to the first-first terminal portion 331 of the first terminal portion 330 and the second-first terminal portion 241-2P of the second terminal portion.

[0219] In addition, the insertion hole 415 may include a second insertion hole 415-2 corresponding to the first-second terminal portion 332 of the first terminal portion 330 and the second-second terminal portion 241-3P of the second terminal portion.

[0220] The first insertion hole 415-1 and the second insertion hole 415-2 may be spaced apart from the outer end portion of the base 410. For example, the first insertion hole 415-1 and the second insertion hole 415-2 may penetrate the base 410 at positions spaced apart from the outer end portion of the base 410.

[0221] Meanwhile, the first insertion hole 415-1 may have a number corresponding to the number of the first-first terminal portion 331 and the second-first terminal portion 241-2P. In addition, the second insertion hole 415-2 may have a number corresponding to the number of the first-second terminal portion 332 and the second-second terminal portion 241-3P.

[0222] The connection pin 500 may be inserted and disposed in the insertion hole 415 of the base 410. The connection pin 500 may be coupled to the base 410. The connection pin 500 can be fixed in a state of being inserted into the insertion hole 415 of the base 410.

[0223] The connection pin 500 may include a plurality of first connection pins 510 inserted into the first insertion hole 415-1. In addition, the connection pin 500 may include a plurality of second connection pins 520 inserted into the second insertion hole 415-2.

[0224] The connection pin 500 may be disposed on the base 410 to electrically connect the first terminal portion 330 of the first substrate 310 and the second terminal portion of the second substrate 241.

[0225] The first connection pin 510 may be electrically connected between the first-first terminal portion 331 and the second-first terminal portion 241-2P. For example, one end of the first connection pin 510 may be in direct contact with the first-first terminal portion 331, and the other end may be in direct contact with the second-first terminal portion 241-2P. The first connection pin 510 may have a number corresponding to the number of terminals of each of the first-first terminal portion 331 and the second-first terminal portion 241-2P.

[0226] The second connection pin 520 may be electrically connected between the first-second terminal portion 332 and the second-second terminal portion 241-3P. For example, one end of the second connection pin 520 may be in direct contact with the first-second terminal portion 332, and the other end may be in direct contact with the second-second terminal portion 241-3P. The second connection pin 520 may have a number corresponding to the number of terminals of each of the first-second terminal portion 332 and the second-second terminal portion 241-3P.

[0227] For this purpose, the connection pin 500 including the first connection pin 510 and the second connection pin 520 may include a body 501. The body 501 of the connection pin 500 may penetrate the base 410. For example, the body 501 of the connection pin 500 may be inserted and fixed in the insertion hole 415 of the base 410.

[0228] In addition, the connection pin 500 may include a connection portion provided in the body 501. For example, the connection pin 500 may include a connection portion protruding from the body 501.

[0229] For example, the connection pin 500 may include a first connection portion 502 protruding downward from the body 501. The first connection portion 502 may be arranged to protrude in the downward direction of the base 410 when the body 501 is inserted into the insertion hole 415 of the base 410. The first connection portion 502 may be electrically connected to the first terminal portion 330 of the first substrate 310.

[0230] For example, the connection pin 500 may include a second connection portion 503 protruding upward from the body 501. The second connection portion 503 may protrude in the upward direction of the base 410 when the body 501 is inserted into the insertion hole 415 of the base 410. The second connection portion 503 may be electrically connected to the second terminal portion of the second substrate 241.

[0231] At this time, according to an embodiment, the connection pin 500 may have different structures. That is, the connection pin 500 may include a first connection portion 502 and a second connection portion 503. At this time, in one embodiment, the first connection portion 502 and the second connection portion 503 may be elastic. In addition, in another embodiment, the first connection portion 502 may not be elastic, and the second connection portion 503 may be elastic. In addition, in another embodiment, both the first connection portion 502 and the second connection portion 503 may not be elastic. This will be described in detail below.

[0232] That is, referring to Figure 10a, the connecting pin 500 of the first embodiment may include an elastic device (not shown). The elastic device may be disposed within the body 501 of the connecting pin 500. Accordingly, the first connecting portion 502 and the second connecting portion 503 may be pressed into the body 501 by the elastic device. Thus, the first connecting portion 502 and the second connecting portion 503 may be firmly coupled to the first terminal portion 330 and the second terminal portion.

[0233] For example, as Figure 10a shown in (a) of Figure 10a , the first connecting portion 502 and the second connecting portion 503 may protrude from the body 501 of the connecting pin 500 at a first height without contacting the first terminal portion 330 and the second terminal portion, respectively. Additionally, as

[0234] shown in (b) of Figure 10b , the first connecting portion 502 and the second connecting portion 503 may be pressed by the elastic device when contacting the first terminal portion 330 and the second terminal portion, thereby having a second height lower than the first height. Through this, the embodiment can firmly connect the first connecting portion 502 and the second connecting portion 503 to the first terminal portion 330 of the first substrate 310 and the second terminal portion of the second substrate 241, respectively, by pressing with the elastic device.

[0235] Meanwhile, referring to Figure 10bIn (a) and (b) thereof, the first connection portion 502 of the connection pin 500 may not have a height change both in a state of not contacting the first terminal portion 330 of the first substrate 310 and in a state of contacting the first terminal portion 330 of the first substrate 310. For example, the body 501 and the first connection portion 502 of the connection pin 500 of the second embodiment may be integrally formed. In addition, the second connection portion 503 of the connection pin 500 may protrude at a first height in a state of not contacting the second terminal portion of the second substrate 241, and may protrude at a second height lower than the first height in a state of contacting the second terminal portion. That is, when the first connection portion 502 and the first terminal portion 330 of the first substrate 310 are coupled, it may not be necessary to adjust the coupling position therebetween. Therefore, the first connection portion 502 may not be provided with an elastic device. However, when the second connection portion 503 and the second terminal portion of the second substrate 241 are coupled, it may be necessary to adjust the coupling position therebetween through an active alignment process. Therefore, the second connection portion 503 may be provided with an elastic device, and the efficiency of the active alignment process may be improved through this elastic device. At this time, when the elastic device is not provided in the first connection portion 502, in order to improve the bonding reliability between the first connection portion 502 and the first terminal portion 330 of the first substrate 310, the planar shape of the first connection portion 502 may correspond to the planar shape of the first terminal portion 330. In addition, the first terminal portion 330 may be bent in the vertical direction and / or the horizontal direction. This will be described in more detail below.

[0236] Meanwhile, referring to Figure 10c , the connection pin 500 of the third embodiment may not be provided with an elastic device in all of the plurality of connection portions. Preferably, the first connection portion 502 and the second connection portion 503 of the connection pin 500 may not be provided with an elastic device.

[0237] Therefore, referring to Figure 10c In (a) and (b) thereof, the first connection portion 502 of the connection pin 500 may not have a height change both in a state of not contacting the first terminal portion 330 of the first substrate 310 and in a state of contacting the first terminal portion 330 of the first substrate 310. For example, the body 501 and the first connection portion 502 of the connection pin 500 of the third embodiment may be integrally formed. In addition, the second connection portion 503 may not have a height change both in a state of not contacting the second terminal portion of the second substrate 241 and in a state of being connected to the second terminal portion of the second substrate 241. For example, the body 501 and the second connection portion 503 of the connection pin 500 in the third embodiment may be integrally formed.

[0238] That is to say, when the first connection part 502 and the first terminal part 330 of the first substrate 310 are coupled, it may not be necessary to adjust the coupling position therebetween. In addition, in the case of a general autofocus camera module that does not require an active alignment process, an elastic device may not be provided in the second connection part 503 connected to the second terminal part of the second substrate 241.

[0239] As described above, the first substrate 310 and the second substrate 241 of the embodiment are electrically connected using the connection pins 500 instead of a separate soldering process.

[0240] For this purpose, the first terminal part 330 of the first substrate 310 and the second terminal part of the second substrate 241 may be aligned with the optical axis. For example, the first terminal part 330 of the first substrate 310 and the second terminal part of the second substrate 241 may be aligned with the connection pins 500 disposed therebetween on the optical axis.

[0241] Meanwhile, the process of electrically connecting the first substrate 310 and the second substrate 241 using the connection pins 500 will be briefly described below.

[0242] First, the image sensor 320 may be attached to the first substrate 310. After that, the base 410 equipped with the connection pins 500 may be disposed on the first terminal part 330 of the first substrate 310. At this time, when the first connection part 502 of the connection pin 500 contacts the first terminal part 330 of the first substrate 310, an adhesive member, such as epoxy resin, may be applied. Through the adhesive member, the first substrate 310 and the base 410 can be coupled.

[0243] After that, the second substrate 241 may be disposed on the base 410. After that, when the second connection part 503 of the connection pin 500 is connected to the second terminal part of the second substrate 241, an adhesive member, such as epoxy resin, may be applied. At this time, according to the embodiment, an active alignment process may be performed before applying the adhesive member. Then, the second substrate 241 of the lens driving device 200 may be coupled to the base 410 using the applied adhesive member.

[0244] Therefore, the embodiment can omit the soldering process for electrically connecting the first terminal part and the second terminal part. Therefore, the embodiment can solve the problems of electrical reliability and physical reliability that occur during the soldering process. In addition, the embodiment can solve the problem of cracks generated at the position where the soldering process is performed due to various factors.

[0245] Meanwhile, according to the embodiment, the base 410 of the filter part 400 may have different shapes or structures.

[0246] For example, as Figure 9 and Figure 11As shown in, the base 410 of the first embodiment may include a region in which an insertion hole 415 is formed and its peripheral region. In addition, the region in which the insertion hole 415 is formed and the peripheral region in the base 410 may be located on the same plane. For example, the region in which the insertion hole 415 is formed and the peripheral region in the base 410 may not have a step. By this, the embodiment can also improve the rigidity of the base 410. Therefore, the embodiment can minimize the deformation of the base 410 in the usage environment of the camera module. In addition, the embodiment can minimize the deformation of the base 410 caused by physical shock and / or thermal stress applied to the base 410 in the usage environment of the camera module.

[0247] Meanwhile, referring to Figure 13a , the base 410 may include a recess 413. For example, the base 410 may be provided with a recess 413 in a region surrounding the insertion hole 415 formed therein. The recess 413 may also be referred to as a recessed portion that is recessed from the upper surface of the base 410 toward the lower surface of the base 410. In addition, the recess 413 may be provided to surround the region in which the insertion hole 415 is formed.

[0248] Specifically, the insertion hole 415 may include a first insertion hole 415-1 and a second insertion hole 415-2. In addition, the recess 413 may have a first portion 413-1 provided to surround the first insertion hole 415-1. In addition, the recess 413 may include a second portion 413-2 provided to surround the second insertion hole 415-2 without being connected to the first portion 413-1.

[0249] At this time, in Figure 13a , the recess 413 is illustrated as being provided only on the upper surface of the base 410, but is not limited thereto. Preferably, the recess 413 may include a first recess provided on the lower surface of the base 410 and a second recess provided on the upper surface of the base 410. By this, when combined with the first substrate 310, the epoxy application process can be improved through the first recess. In addition, when combined with the second substrate 241, the epoxy application process can be improved by using the second recess.

[0250] At this time, the recess 413 provided in the base portion 410 of the second embodiment may be connected to the outer surface of the base portion 410. For example, the recess 413 may be exposed at a side portion of the base portion 410. Thus, in the second embodiment, when the base portion 410 is provided on the first substrate 310, the following epoxy side sealing process may be performed: applying an adhesive member, such as epoxy resin, to the recess 413 exposed through the side of the base portion 410. For example, when the first connection portion 502 of the connection pin 500 penetrating the base portion 410 is provided on the first substrate 310, side sealing may be performed on the side portion of the base portion 410 to fill the first recess with epoxy resin. Additionally, when the second substrate 241 may be provided on the second connection portion 503 of the connection pin 500 penetrating the base portion 410, the second recess may be filled with epoxy resin. Through this, the embodiment may fill the recess 413 with an adhesive member, such as epoxy resin. At this time, when allowing epoxy resin to be applied through the side sealing process, the recess 413 may serve as a dam to prevent the epoxy resin from overflowing into areas other than the area where the insertion hole 415 is provided (for example, the area where the through hole 411 is provided).

[0251] Meanwhile, referring to Figure 13b , the recess 413 provided in the base portion 410 may not be connected to the outer surface of the base portion 410 in a manner different from that of the base portion of the second embodiment. For example, the recess 413 may be provided at a distance from the outer surface of the base portion 410. Additionally, the recess 413 may serve as a dam to block the overflow of epoxy resin in all directions.

[0252] Meanwhile, in Figure 13b the structure of the recess, the recess 413 may be realized in a structure where only a part of the recess is connected to the outer surface of the base portion 410 and the recess as a whole is not connected to the outer surface. In this case, it is possible to minimize the overflow of the epoxy resin filled in the recess, while the gas generated during the curing of the epoxy resin can be easily discharged to the outside.

[0253] Meanwhile, the base portion 410 may be composed of multiple layers. Additionally, the recess 413 may be formed by processing any one of the multiple layers. However, the embodiment is not limited thereto. The base portion 410 may be composed of a single layer, and the base portion 410 composed of a single layer may be processed to form the recess 413 that does not penetrate the base portion.

[0254] Meanwhile, the connection pin 500, the first terminal portion 330 of the first substrate 310, and the second terminal portion 241P of the second substrate 241 may have various structures.

[0255] For example, referring to Figure 14a, the first connection portion 502 of the connection pin 500 of the first embodiment and the first terminal portion 330 of the first substrate 310 include contact portions that contact each other, and the contact portions may be flat.

[0256] In addition, the surface (e.g., the lower surface) of the first connection portion 502 of the connection pin 500 that contacts the first terminal portion 330 may be flat. In addition, the surface (e.g., the upper surface) of the first terminal portion 330 that contacts the first connection portion 502 may also be flat to correspond to the first connection portion 502.

[0257] Meanwhile, the second connection portion 503 of the connection pin 500 and the second terminal portion 241P of the second substrate 241 may include contact portions that contact each other.

[0258] In addition, the surface (e.g., the upper surface) of the second connection portion 503 of the connection pin 500 that contacts the second terminal portion 241P may be flat. In addition, the surface (e.g., the lower surface) of the second terminal portion 241P that contacts the second connection portion 503 may also be flat to correspond to the second connection portion 503.

[0259] Meanwhile, referring to Figure 14b , the first connection portion 502 of the connection pin 500 of the second embodiment and the first terminal portion 330 of the first substrate 310 may include contact portions that contact each other, and the contact portions may be recessed or protruding.

[0260] In addition, the surface (e.g., the lower surface) of the first connection portion 502 of the connection pin 500 that contacts the first terminal portion 330 may include a protruding portion that protrudes toward the first terminal portion 330. In addition, the surface (e.g., the upper surface) of the first terminal portion 330 that contacts the first connection portion 502 may include a recessed portion that is recessed toward the inside of the first terminal portion 330 and at the same time corresponds to the protruding portion of the first connection portion 502. In addition, when the first substrate 310 and the base portion 410 are coupled, the protruding portion of the first connection portion 502 may be inserted into the recessed portion of the first terminal portion 330. Through this, the embodiment can prevent misalignment between the first terminal portion 330 and the first connection portion 502 during the process of coupling the first connection portion 502 and the first terminal portion 330. Through this, the embodiment can improve the coupling reliability of the first terminal portion 330 and the first connection portion 502.

[0261] Meanwhile, the second connection portion 503 of the connection pin 500 and the second terminal portion 241P of the second substrate 241 may include contact portions that contact each other.

[0262] In addition, the surface (e.g., the upper surface) of the second connection portion 503 of the connection pin 500 that contacts the second terminal portion 241P may include a protruding portion that protrudes toward the second terminal portion 241P. In addition, the surface (e.g., the lower surface) of the second terminal portion 241P that contacts the second connection portion 503 may include a recessed portion that is recessed toward the inside of the second terminal portion 241P and corresponds to the protruding portion of the second connection portion 503 at the same time. In addition, when the second substrate 241 and the base portion 410 are coupled, the protruding portion of the second connection portion 503 may be inserted into the recessed portion of the second terminal portion 241P.

[0263] At this time, the width of the protruding portion of the second connection portion 503 may be different from the width of the recessed portion of the second terminal portion 241P. Preferably, the width of the protruding portion of the second connection portion 503 may be smaller than the width of the recessed portion of the second terminal portion 241P. Through this, the embodiment can enable the position of the second connection portion 503 to move when the protruding portion of the second connection portion 503 is inserted into the recessed portion of the second terminal portion 241P. Through this, the embodiment can easily perform the active alignment process.

[0264] Meanwhile, referring to Figure 14c , in the third embodiment, the first connection portion 502 of the connection pin 500 and the first terminal portion 330 of the first substrate 310 may include a contact portion that contacts each other, and the contact portion may be recessed or protruding.

[0265] In addition, the surface (e.g., the lower surface) of the first connection portion 502 of the connection pin 500 that contacts the first terminal portion 330 may include a recessed portion that is recessed toward the inside (e.g., toward the body 501). In addition, the surface (e.g., the upper surface) of the first terminal portion 330 that contacts the first connection portion 502 may include a protruding portion that protrudes toward the first connection portion 502 and corresponds to the recessed portion of the first connection portion 502 at the same time. In addition, when the first substrate 310 and the base portion 410 are coupled, the recessed portion of the first connection portion 502 can be inserted into the protruding portion of the first terminal portion 330. Through this, the embodiment can prevent misalignment between the first terminal portion 330 and the first connection portion 502 during the process of coupling the first connection portion 502 and the first terminal portion 330. Through this, the embodiment can improve the coupling reliability between the first terminal portion 330 and the first connection portion 502.

[0266] Meanwhile, the second connection portion 503 of the connection pin 500 and the second terminal portion 241P of the second substrate 241 may include a contact portion that contacts each other.

[0267] In addition, the surface (e.g., the upper surface) of the second connection portion 503 of the connection pin 500 that contacts the second terminal portion 241P may include a recessed portion that is recessed in an inward direction (e.g., toward the body 501). In addition, the surface (e.g., the lower surface) of the second terminal portion 241P that contacts the second connection portion 503 may include a protruding portion that protrudes toward the second connection portion 503 and corresponds to the recessed portion of the second connection portion 503 at the same time. In addition, when the second substrate 241 and the base 410 are coupled, the recessed portion of the second connection portion 503 may be inserted into the protruding portion of the second terminal portion 241P.

[0268] At this time, the width of the recessed portion of the second connection portion 503 may be different from the width of the protruding portion of the second terminal portion 241P. Preferably, the width of the recessed portion of the second connection portion 503 may be greater than the width of the protruding portion of the second terminal portion 241P. Through this, the embodiment can cause the position of the second connection portion 503 to move when the protruding portion of the second terminal portion 241P is inserted into the recessed portion of the second connection portion 503. Through this, the embodiment can easily perform the active alignment process.

[0269] Meanwhile, the connection pin 500, the first terminal portion 330, and the second terminal portion 241P of the embodiment may be implemented by Figures 14a to 14c a combination of the structures illustrated in

[0270] For example, the first connection portion 502 and the first terminal portion 330 may have Figure 14a the structure illustrated in Figure 14b or Figure 14c the structure illustrated in

[0271] For example, the first connection portion 502 and the first terminal portion 330 may have Figure 14b the structure illustrated in Figure 14a or Figure 14c the structure illustrated in

[0272] For example, the first connection portion 502 and the first terminal portion 330 may have Figure 14c the structure illustrated in Figure 14a or Figure 14b the structure illustrated in

[0273] Meanwhile, compared with the comparative example, the embodiment can ensure the flatness of the base 410, and through this, the flatness of the infrared filter 420 mounted on the base 410 can be ensured.

[0274] That is, due to the latest technological developments of the camera module, the size of the image sensor 320 has increased, and accordingly, the size of the infrared filter 420 has also increased.

[0275] At this time, as Figure 15 shown, the base 410a of the comparative example camera module includes a first opening portion 410b and second opening portions 410c and 410d. The infrared filter is disposed on the first opening portion 410b, and the second substrate of the lens driving device passes through the second opening portions 410c and 410d. The base 410a of the comparative example has second opening portions 410c and 410d formed in a region corresponding to the second substrate, which are used for soldering between the first substrate and the second substrate. Through this, the rigidity of the base 410a of the comparative example may be reduced due to the regions corresponding to the second opening portions 410c and 410d. Through this, there is a problem that the flatness of the base 410a of the comparative example camera module is reduced, and accordingly, the flatness of the infrared filter is reduced. In addition, the comparative example camera module needs to ensure a space for performing the soldering process of the first substrate and the second substrate.

[0276] In contrast, the base 410 of the embodiment can remove the second opening portions 410c and 410d of the comparative example, and accordingly, the rigidity of the base 410 can be improved. Through this, the camera module of the embodiment can improve the flatness of the base 410 and can also improve the flatness of the infrared filter 420.

[0277] In addition, due to the second opening portions 410c and 410d, the base of the comparative example is arranged such that the outer end portion of the first terminal portion of the first substrate is positioned more outwardly than the outer end portion of the base. In other words, the first terminal portion of the first substrate of the comparative example camera module does not overlap with the base in the optical direction. In addition, the first terminal portion of the first substrate of the comparative example camera module overlaps with the second opening portions 410c and 410d of the base along the optical axis.

[0278] In contrast, the outer end portion of the base 410 of the embodiment can be positioned more outwardly relative to the outer end portion of the first terminal portion 330. This means that the insertion hole 415 of the base 410 is positioned at a position spaced apart from the outer end portion of the base 410, and the first terminal portion 330 overlaps with the insertion hole 415 along the optical axis. Through this, the outer end portion of the base 410 can be set more outwardly relative to the outer end portion of the first terminal portion 330. In other words, at least a part of the first terminal portion 330 can overlap with the base 410 along the optical axis. In other words, the peripheral region of the first terminal portion 330 of the first substrate 310 overlaps with the base 410 along the optical axis.

[0279] In addition, as Figure 16As illustrated in (a) of [reference], in the camera module of the comparative example, the soldering process of the first substrate 310a and the second substrate 241a is performed outside the cover member 210a. Therefore, the solder part SB that electrically connects the first substrate 310a and the second substrate 241a is disposed outside the cover member 210a of the camera module. Therefore, in the camera module of the comparative example, there may be problems with electrical reliability and physical reliability due to the exposure of the solder part SB to the outside in the use environment.

[0280] In contrast, as Figure 16 illustrated in (b) of [reference], the camera module of the embodiment electrically connects the first substrate 310 and the second substrate 241 using the connection pins 500.

[0281] Therefore, in the embodiment, the contact point where the first terminal part 330 of the first substrate 310 and the second terminal part of the second substrate 241 are connected to each other can be set inside the camera module. Therefore, the embodiment can protect the contact point from various factors. Therefore, the embodiment can improve the electrical connectivity between the first substrate 310 and the second substrate 241. In addition, the embodiment can improve the operation reliability of the camera module.

[0282] Figure 17 A mobile terminal to which the camera module according to the embodiment is applied is shown.

[0283] As Figure 17 shown in [reference], the mobile terminal 1500 according to the embodiment may include a camera module 1000, a flash module 1530, and an autofocus device 1510 provided on the rear surface. The mobile terminal 1500 of this embodiment may further include a second camera module 1100.

[0284] The camera module 1000 may include an image capture function and an autofocus function. For example, the camera module 1000 may include an autofocus function using an image. The camera module 1000 may be the Figure 1 camera module illustrated in [reference].

[0285] The camera module 1000 processes a still image or a moving image frame obtained through an image sensor in a shooting mode or a video call mode. The processed image frame may be displayed on a predetermined display unit and may be stored in a memory. A camera (not shown) may be provided on the front surface of the body of the mobile terminal.

[0286] For example, the camera module 1000 may include a first camera module and a second camera module, and OIS may be implemented by the first camera module together with an AF or zoom function.

[0287] The flash module 1530 may include a light-emitting device that emits light therein. The flash module 1530 may be operated through the camera operation of the mobile terminal or through user control.

[0288] The autofocus device 1510 may include one of the packages in the package of the surface-emitting laser element that serves as a light-emitting unit.

[0289] The autofocus device 1510 may include an autofocus function using a laser. The autofocus device 1510 may be mainly used under conditions where the autofocus function of the image using the camera module 1000 deteriorates, for example, in a closed environment of 10 m or less than 10 m or in a dark environment. The autofocus device 1510 may include: a light-emitting unit having a vertical cavity surface-emitting laser (VCSEL) semiconductor device; and a light-receiving unit that converts light energy into electrical energy, such as a photodiode.

[0290] Figure 18 is a perspective view of a vehicle 700 to which a camera module according to an embodiment is applied.

[0291] For example, Figure 18 is an external view of a vehicle having a vehicle driving assistance device to which a camera module 1000 according to an embodiment is applied.

[0292] Referring to Figure 18 , the vehicle 700 according to an embodiment may include wheels 13FL and 13FR that are rotated by a power source and a predetermined sensor. The sensor may be a camera sensor 2000, but the embodiment is not limited thereto.

[0293] The camera 2000 may be a camera sensor to which a camera module 1000 according to an embodiment is applied.

[0294] The vehicle 700 according to an embodiment may acquire image information through the camera sensor 2000 that captures a front image or a surrounding image, and may determine an unrecognized situation of a lane by using the image information and generate a virtual lane when it is not recognized.

[0295] For example, the camera sensor 2000 may acquire a front image by photographing the front of the vehicle 700, and a processor (not shown) may acquire image information by analyzing an object included in the front image.

[0296] For example, when an object such as a lane, an adjacent vehicle, an obstacle to travel, and a median strip, a curb, a roadside tree corresponding to an indirect road marking is photographed in the image captured by the camera sensor 2000, the processor detects such an object to include it in the image information.

[0297] In this case, the processor can obtain distance information of an object detected by the camera sensor 2000 to further supplement the image information. The image information may be information about the object captured in the image.

[0298] Such a camera sensor 2000 may include an image sensor and an image processing module. The camera sensor 2000 can process a still image or a moving image obtained by the image sensor (e.g., CMOS or CCD). The image processing module can process the still image or the moving image obtained through the image sensor to extract necessary information and can transmit the extracted information to the processor.

[0299] At this time, the camera sensor 2000 may include a stereo camera to improve the measurement accuracy of the object and ensure more information, such as the distance between the vehicle 700 and the object, but the implementation is not limited thereto.

[0300] The vehicle 700 of this embodiment can provide an advanced driver assistance system (ADAS).

[0301] For example, the advanced driver assistance system (ADAS) may include: an automatic emergency braking system (AEB) that automatically decelerates or stops the vehicle when there is a risk of collision and the driver does not step on the brake pedal; a lane keeping assist system (LKAS) that adjusts the driving direction to keep the lane when the vehicle deviates from the lane; an advanced intelligent cruise control (ASCC) that automatically maintains a distance from the vehicle ahead when driving at a preset speed; an active blind spot detection (ABSD) that detects the risk of collision in the blind spot and helps with a safe lane change; a surround view monitoring system (AVM), etc., that visually displays the conditions around the vehicle.

[0302] Among these advanced driver assistance systems (ADAS), the camera module functions as a core component together with a radar, etc., and the proportion of the application of the camera module is gradually increasing.

[0303] For example, in the case of the automatic emergency braking system (AEB), the front camera sensor and the radar sensor of the vehicle can detect a vehicle or a pedestrian ahead and automatically apply emergency braking when the driver does not control the vehicle. Alternatively, in the case of the lane keeping assist system (LKAS), the camera sensor can detect whether the driver leaves the lane without using the turn signal and automatically operates the steering wheel to keep the lane. In addition, the surround view monitoring system (AVM) can visually display the conditions around the vehicle through the camera sensors provided on all sides of the vehicle.

[0304] The features, structures, and effects described in the above embodiments are included in at least one embodiment, but are not limited to one embodiment. In addition, those of ordinary skill in the art to which the embodiments pertain can combine or modify the features, structures, effects, etc. described in each of the embodiments even with respect to other embodiments. Therefore, it should be understood that the content related to such combinations and such modifications is included within the scope of the present invention.

[0305] In addition, the above mainly describes the embodiments, but these embodiments are only examples and do not limit the present invention. Those skilled in the art to which the present invention pertains can understand that several variations and applications not presented above can be made without departing from the essential features of the embodiments. For example, each component specifically represented in the embodiments can be varied. In addition, it should be understood that the differences related to such variations and such applications are included within the scope of the present invention defined by the appended claims.

Claims

1. A camera module, comprising: A first substrate having a first terminal portion; An image sensor disposed on the first substrate; A base disposed on the first substrate; A lens driving device including a second substrate disposed on the base and having a second terminal portion; And A connection pin penetrating the base, and Wherein one end of the connection pin contacts the first terminal portion and the other end of the connection pin contacts the second terminal portion.

2. The camera module according to claim 1, wherein, The connection pin includes: A body penetrating the base, A first connection portion having the one end protruding in a downward direction along the body and contacting the first terminal portion; and A second connection portion having the other end protruding in an upward direction along the body and contacting the second terminal portion.

3. The camera module according to claim 2, wherein, At least one of the first connection portion and the second connection portion has elasticity.

4. The camera module according to claim 2, wherein, The base includes an insertion hole into which the body of the connection pin is inserted, and Wherein the insertion hole penetrates the base at a position spaced apart from an outer end portion of the base.

5. The camera module according to claim 4, wherein, The base includes: A first region including the insertion hole, and A second region adjacent to the first region, and Wherein the first region and the second region do not have a step.

6. The camera module according to claim 4, wherein, The base includes: A first region including the insertion hole, and A second region adjacent to the first region, and Wherein the first region and the second region have a step.

7. The camera module according to claim 6, wherein, A recess corresponding to the step is provided in the first region of the base, and Wherein the recess includes: A first recess provided on one surface of the base, and a first bonding member for coupling the first connection portion and the first terminal portion is provided in the first recess; and A second recess provided on the other surface of the base opposite to the one surface, and a second bonding member for coupling the second connection portion and the second terminal portion is provided in the second recess.

8. The camera module according to claim 3, wherein, The lens driving device includes a driving coil disposed on the second substrate, Wherein the second terminal portion includes a plurality of second terminals, and Wherein at least one of the plurality of second terminals is electrically connected to the driving coil.

9. The camera module according to claim 8, wherein, The lens driving device further includes a mover that moves relative to the second substrate and includes a sensor unit, and Wherein at least another of the plurality of second terminals includes a terminal electrically connected to the sensor unit.

10. The camera module according to claim 8, wherein, The first terminal portion and the second terminal portion overlap in the optical axis direction, Wherein the insertion hole is aligned with the first terminal portion and the second terminal portion in the optical axis direction, and Wherein a peripheral region of the upper surface of the first substrate adjacent to the first terminal portion overlaps the base in the optical axis direction.

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