A device and method for producing semiconductor-specific copper oxide powder

Abstract

The application relates to the technical field of copper oxide powder production, in particular to a production device and a production method for semiconductor special copper oxide powder. The production device comprises an organic main cylinder, a cylindrical inner lining layer is fixed on the inner wall of the main cylinder, a screw column-shaped pushing element is fixed in the inner lining layer, a J-shaped protective plate is arranged in the pushing element, a ladder-shaped columnar track stop lever is arranged on one side of the J-shaped protective plate, and a row of push control units is arranged on one side of the track stop lever. The application directly burns and heats the powder by arranging a row of fire guns in the main cylinder, so that the high energy consumption problem caused by long-distance heating outside the main cylinder is avoided. In addition, the grinding balls are collected by the inclined plate and then are re-conveyed to the initial position of the powder injection by the track stop lever, so that the grinding balls are continuously and uniformly dropped in the initial position and are uniformly conveyed by the uniform rotation of the pushing element, so that the grinding balls in the main cylinder are uniformly distributed.

Description

Technical Field

[0001] This invention relates to the field of copper oxide powder production technology, specifically to a semiconductor-specific copper oxide powder production apparatus and production method. Background Technology

[0002] Copper oxide is an important chemical raw material, widely used in the production of rayon, ceramics, glazes and enamels, batteries, petroleum desulfurizers, pesticides, and also in hydrogen production, catalysts, and green glass. Currently, there are two main methods for producing copper oxide: powder calcination and chemical synthesis. Referring to the existing patent document CN214720563U, entitled "Production Equipment for Copper Oxide Powder Material," this method uses a ball mill to grind copper powder and heats the powder by wrapping heating wires around the outside of the ball mill. However, this processing method has certain shortcomings, as the heat generated by the heating wires needs to pass through a ball mill cylinder of a certain thickness. This requires the heating wire to operate at high energy consumption. If the copper powder is heated directly inside the ball mill cylinder, the energy waste in the path can be avoided, improving the energy efficiency of the equipment. In addition, although the grinding balls and powder are pushed to the outlet by rotating blades, many grinding balls will fall back, but they will accumulate at the discharge port. That is, the grinding balls in the ball mill cylinder are unevenly distributed, which affects the grinding effect of the powder. How to make the many grinding balls evenly distributed inside the ball mill cylinder is a technical problem that needs to be solved. To this end, the present invention provides a semiconductor-specific copper oxide powder production device and production method. Summary of the Invention

[0003] The purpose of this invention is to provide a semiconductor-specific copper oxide powder production apparatus and production method to solve the problems mentioned in the background art.

[0004] To achieve the above objectives, the present invention provides the following technical solution: a semiconductor-specific copper oxide powder production device, comprising an organic main cylinder, a cylindrical inner lining layer fixed on the inner wall of the main cylinder, a spiral columnar pusher fixed in the inner lining layer, an inlet plate movably sleeved inside one end of the main cylinder, a feed oblique pipe passing through the inlet plate, an outlet plate movably covered at the other end of the main cylinder, an outlet window for powder discharge at the bottom of the outlet plate, a J-shaped protective plate inside the pusher, a stepped folded columnar track stop bar parallel to one side of the J-shaped protective plate, a row of push control units on one side of the track stop bar, a buffer device correspondingly arranged on one side of each push control unit, and a flame gun correspondingly arranged above each buffer device. An integrated shaft for driving a row of push control units, and a slanted plate vertically fixed at one end of a J-shaped protective plate. Both the J-shaped protective plate and the track stop are fixed at one end to the exit plate. The slanted plate is fixed to the exit plate and has a row of inclined long arc-shaped grooves. The long arc-shaped grooves pass through the through holes in the J-shaped protective plate. A baffle for intercepting grinding balls is provided at one end of the slanted plate and is fixed to the J-shaped protective plate. A round hole is provided on the J-shaped protective plate for the flame from the flame gun to pass through. One end of the integrated shaft passes through the through hole in the entrance plate and a main gear is fixed at the end of the integrated shaft extending to the outside. The main cylinder is connected to the main gear by a fixed internal gear ring. An exhaust hole is provided in the middle of the exit plate.

[0005] The buffer device includes a plate base fixed on a J-shaped protective plate, a stationary shaft vertically fixed on the plate base, a P-shaped plate supported on the stationary shaft, a limiting rod with an interception on one side of the P-shaped plate, and an air pile in contact with the other side of the P-shaped plate, wherein the limiting rod is fixed on the plate base.

[0006] One end of the P-type plate is distributed between the J-type protective plate and the track stop bar, and the end of the plate obstructs the rolling grinding ball on the horizontal bar of the track stop bar. The other end of the P-type plate has a through hole, and the stationary shaft is movably sleeved in the through hole of the P-type plate.

[0007] The gas cylinder includes a gas cylinder fixed on a plate base, a telescopic rod with a piston sliding at the port of the gas cylinder, a spring installed inside the gas cylinder, and a tail plate covering a round hole in the middle of the bottom plate of the gas cylinder. One end of the telescopic rod contacts the P-shaped plate, and the other end contacts the spring.

[0008] The tail plate has a small exhaust hole in the middle, and the air pile also includes a pull-back spring. One end of the pull-back spring is fixed to the outer wall of the air tank, and the other end is fixed to the tail plate.

[0009] The push control unit includes a unit frame fixed on a J-shaped protective plate, a central shaft and a side shaft supported on the unit frame, a stroke gear fixed at one end of the central shaft, a side gear fixed at one end of the side shaft, and a set of swing wheels that establishes transmission between the integrated shaft and the central shaft. The integrated shaft is movably sleeved in the inner hole of the cylinder provided on one side of the unit frame.

[0010] The central shaft and the side shaft are respectively movably sleeved in two through holes opened on the unit frame. The push control unit also includes a column rack. One end of the side gear is meshed and connected to the column rack, and the other end is meshed and connected to the stroke gear. One end of the column rack slides through the square hole opened on the unit frame, and the other end of the column rack is used to push the grinding ball to rise at the inclined bar of the track stop.

[0011] The balance wheel assembly includes a pressure shaft movably sleeved in a through hole on the unit frame, a control disk fixed at one end of the pressure shaft, a balance control column with one end hinged to the edge of the control disk, and a straight control column hinged to the other end of the balance control column.

[0012] One end of the pressure shaft is vertically fixed in the middle of the control panel, and the other end is connected to the spiral teeth on the integrated shaft through a fixed gear. The straight control column is connected to the gear fixed on the central shaft through a row of teeth. The straight control column slides through the plate hole opened on the unit frame.

[0013] A method for producing semiconductor-grade copper oxide powder includes the following steps:

[0014] Step 1: Copper powder and air are injected into the main cylinder of the machine through the feed inclined pipe. The external drive mechanism controls the rotation of the main cylinder. The numerous grinding balls placed in the main cylinder interact with the copper powder to achieve grinding. A row of flame guns sprays flames to heat the copper powder, and the copper powder is converted into copper oxide.

[0015] Step 2: The oxygen consumed by the air is discharged through the exhaust port of the exit plate. The pusher component, which rotates with the main cylinder, pushes the grinding balls and copper oxide powder towards the exit plate. The copper oxide powder is discharged through the discharge window. The grinding balls are pushed up in the main cylinder and fall onto the inclined plate.

[0016] Step 3: The grinding balls collected on the inclined plate will line up and fall onto the track stop. They will then be conveyed to the end of the track stop near the entrance plate before falling. During the conveyance on the track stop, the grinding balls are continuously heated by the flames sprayed by a row of blowtorches. After falling back down, the grinding balls combine with the copper powder injected into the feed inclined pipe to start a new round of copper powder grinding.

[0017] Compared with the prior art, the beneficial effects of the present invention are:

[0018] 1. This invention uses a row of flame guns inside the main cylinder to directly burn and heat the powder, avoiding the high energy consumption problem caused by long-distance heating outside the main cylinder. In addition, the grinding balls will not accumulate at the powder discharge position, but will be collected by the inclined plate and then transported back to the initial position of powder injection by the track baffle. The grinding balls fall continuously and evenly at the initial position, and are transported evenly by the uniform rotation of the pusher, so that the grinding balls in the main cylinder are evenly distributed.

[0019] 2. During the conveying process on the track stop bar, the grinding balls are heated by the sprayed flames multiple times. The buffer device hinders the grinding balls, and the grinding balls roll slowly when passing through the flame zone to ensure that the grinding balls are effectively heated. After being heated, the grinding balls re-come into contact with the powder. Thus, the powder is heated by both grinding ball contact and flame burning, heating the powder from both inside and outside. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the structure of the present invention.

[0021] Figure 2 This is a schematic diagram of the internal structure of the production unit.

[0022] Figure 3 This is a schematic diagram showing the position of the diagonal panels.

[0023] Figure 4 Diagram showing the position of the main gear.

[0024] Figure 5 This is a schematic diagram showing the location of the propulsion control unit.

[0025] Figure 6 This is a schematic diagram of the track stop structure.

[0026] Figure 7 This is a schematic diagram of a J-type protective plate structure.

[0027] Figure 8 This is a schematic diagram of the buffer device structure.

[0028] Figure 9 This is a schematic diagram of a gas pile structure.

[0029] Figure 10 This is a diagram showing the location of the flamethrower.

[0030] Figure 11 This is a schematic diagram of the propulsion control unit structure.

[0031] Figure 12 This is a schematic diagram of the balance wheel assembly.

[0032] Figure 13 This is a schematic diagram showing the position of the gear rack.

[0033] In the diagram: 1. Main cylinder; 2. Liner; 3. Pusher; 4. Inlet plate; 5. Inlet inclined pipe; 6. Outlet plate; 7. Outlet window; 8. J-shaped protective plate; 9. Track stop bar; 10. Push control unit; 11. Integrated shaft; 12. Buffer device; 13. Flamethrower; 14. Inclined plate; 15. Baffle; 16. Main gear; 17. Internal gear ring; 18. P-shaped plate; 19. Limit bar; 20. Plate base; 21. Stationary shaft; 22. Air pile; 23. Telescopic rod; 24. Air tank; 25. Spring; 26. Tail plate; 27. Return spring; 28. Swing wheel assembly; 29. ​​Central shaft; 30. Stroke gear; 31. Unit frame; 32. Side shaft; 33. Side gear; 34. Column rack; 35. Pressure shaft; 36. Control panel; 37. Swing control column; 38. Straight control column. Detailed Implementation

[0034] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the technical solutions of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0035] Please see Figures 1 to 13This invention provides a technical solution: a semiconductor-specific copper oxide powder production device, comprising an organic main cylinder 1, a cylindrical inner lining 2 fixed on the inner wall of the main cylinder 1, a spiral columnar pusher 3 fixed in the inner lining 2, an inlet plate 4 movably sleeved inside one end of the main cylinder 1, a feed inclined pipe 5 passing through the inlet plate 4, an outlet plate 6 movably covered at the other end of the main cylinder 1, a discharge window 7 for powder discharge at the bottom of the outlet plate 6, a J-shaped protective plate 8 inside the pusher 3, a stepped columnar track baffle 9 parallel to one side of the J-shaped protective plate 8, a row of push control units 10 on one side of the track baffle 9, a buffer device 12 correspondingly arranged on one side of each push control unit 10, a flame gun 13 correspondingly arranged above each buffer device 12, an integrated shaft 11 for driving the row of push control units 10, and an inclined plate 14 vertically fixed at one end of the J-shaped protective plate 8. Both the J-type protective plate 8 and the track stop bar 9 have one end fixed to the exit plate 6. The inclined plate 14 is fixed to the exit plate 6. The inclined plate 14 has a row of inclined long arc grooves, and the long arc grooves pass through the through holes in the J-type protective plate 8. One end of the inclined plate 14 is provided with a baffle 15 for intercepting grinding balls, and the baffle 15 is fixed to the J-type protective plate 8. The J-type protective plate 8 has a round hole through which the flame of the flame gun 13 passes. One end of the integrated shaft 11 passes through the through hole in the entrance plate 4, and the end of the integrated shaft 11 extending to the outside is fixed with a main gear 16. The main cylinder 1 is connected to the main gear 16 by a fixed internal gear ring 17. The exit plate 6 has an exhaust hole in the middle. The flame gun 13 is an existing technology instrument. All flame guns 13 are connected to a fuel supply control channel, and one end of the channel passes through the entrance plate 4 and extends to the outside of the main cylinder 1.

[0036] refer to Figure 8 Understandably, the buffer device 12 includes a plate base 20 fixed on the J-shaped protective plate 8, a stationary shaft 21 vertically fixed on the plate base 20, a P-shaped plate 18 supported on the stationary shaft 21, a limiting rod 19 with an interception on one side of the P-shaped plate 18, and an air pile 22 in contact with the other side of the P-shaped plate 18. The limiting rod 19 is fixed on the plate base 20.

[0037] One end of the P-type plate 18 is distributed between the J-type protective plate 8 and the track stop bar 9, and the end of the plate obstructs the rolling grinding ball on the horizontal bar of the track stop bar 9. The other end of the P-type plate 18 has a through hole, and the stationary shaft 21 is movably sleeved in the through hole of the P-type plate 18.

[0038] refer to Figure 9 Understandably, the air pile 22 includes an air cylinder 24 fixed on the plate base 20, a telescopic rod 23 with a piston sliding at the port of the air cylinder 24, a spring 25 installed inside the air cylinder 24, and a tail plate 26 covering a round hole in the middle of the bottom plate of the air cylinder 24. One end of the telescopic rod 23 contacts the P-shaped plate 18, and the other end contacts the spring 25.

[0039] The tail plate 26 has a small exhaust hole in the middle. The air pile 22 also includes a pull-back spring 27. One end of the pull-back spring 27 is fixed to the outer wall of the air tank 24, and the other end is fixed to the tail plate 26.

[0040] As the grinding ball rolls along the horizontal bar of the track stop 9, it passes through the area covered by the flames sprayed by the flame gun 13. This flame heats the grinding ball, and simultaneously, the grinding ball is intercepted by the P-shaped plate 18. Although the rolling grinding ball can push over the P-shaped plate 18 and continue moving forward, the tilting process of the P-shaped plate 18 is slow. Therefore, the grinding ball rolls slowly within the flame area, effectively heating it. The tilting of the P-shaped plate 18 compresses the telescopic rod 23. During the axial insertion of the telescopic rod 23 into the air tank 24, the air in the air tank 24... The exhaust can only be discharged through the exhaust hole on the tail plate 26. The exhaust process takes time. The axial movement of the telescopic rod 23 is limited by air pressure. Conversely, the reverse reset process of the telescopic rod 23 is rapid. During the air intake process in the air tank 24, the outside air impacts the tail plate 26, and the tail plate 26 and the bottom plate of the air tank 24 separate, exposing the round hole of the bottom plate of the air tank 24. This allows for rapid air intake. In summary, the tilting process of the P-shaped plate 18 under the pressure of the grinding ball is slow. After the grinding ball passes through the P-shaped plate 18, the P-shaped plate 18 quickly swings back to its original position.

[0041] refer to Figure 11 The push control unit 10 includes a unit frame 31 fixed on a J-shaped protective plate 8, a central shaft 29 and a side shaft 32 supported on the unit frame 31, a stroke gear 30 fixed at one end of the central shaft 29, a side gear 33 fixed at one end of the side shaft 32, and a swing wheel assembly 28 that establishes a transmission between the integrated shaft 11 and the central shaft 29. The integrated shaft 11 is movably sleeved in the inner hole of the cylinder provided on one side of the unit frame 31.

[0042] The central shaft 29 and the side shaft 32 are respectively movably sleeved in two through holes opened on the unit frame 31. The push control unit 10 also includes a column rack 34. One end of the side gear 33 is meshed and connected to the column rack 34, and the other end is meshed and connected to the stroke gear 30. One end of the column rack 34 slides through the square hole opened on the unit frame 31, and the other end of the column rack 34 is used to push the grinding ball to rise at the inclined bar of the track stop 9.

[0043] The balance wheel assembly 28 includes a pressure shaft 35 movably sleeved in a through hole on the unit frame 31, a control disk 36 fixed at one end of the pressure shaft 35, a balance control column 37 with one end hinged to the edge of the control disk 36, and a straight control column 38 hinged to the other end of the balance control column 37.

[0044] One end of the pressure shaft 35 is vertically fixed in the middle of the control panel 36, and the other end is connected to the spiral gear on the integrated shaft 11 through a fixed gear. The straight control column 38 is connected to the gear fixed on the central shaft 29 through a row of teeth. The straight control column 38 slides through the plate hole opened on the unit frame 31.

[0045] A method for producing semiconductor-grade copper oxide powder includes the following steps:

[0046] Step 1: Copper powder and air are injected into the main cylinder 1 through the feed inclined pipe 5. The external drive mechanism controls the rotation of the main cylinder 1. The numerous grinding balls placed in the main cylinder 1 interact with the copper powder to achieve grinding. A row of flame guns 13 sprays flames to heat the copper powder, and the copper powder is converted into copper oxide.

[0047] Step Two: The oxygen consumed by the air is discharged through the exhaust port of the exit platen 6. The pusher 3, which rotates with the main cylinder 1, pushes the grinding balls and copper oxide powder towards the exit platen 6. The copper oxide powder is discharged through the discharge window 7. The grinding balls are pushed and bounced up in the main cylinder 1 before falling onto the inclined plate 14. The grinding balls bounce up because the inner wall of the existing inner lining layer 2 is composed of multiple evenly arranged arc plates, with one end of each arc plate raised. The raised end of the arc plate quickly pushes the grinding balls, causing them to rise in an arc shape. This is a current technology. Furthermore, the rotating pusher 3 applies a lateral thrust to the grinding balls, causing them to gradually approach the inclined plate 14. After approaching the inclined plate 14, the grinding balls are pushed up and bounced up, so that they can fall onto the inclined plate 14. Even if the grinding balls do not fall accurately onto the inclined plate 14 in one go, they will eventually fall onto the inclined plate 14 after being repeatedly thrown up. The inclined plate 14 is a receiving surface. The grinding balls can fall onto the inclined plate 14 as long as the position, speed and angle of the bounce are within the specified range. It is allowed that the grinding balls accumulate slightly at the discharge port. When they accumulate, the grinding balls that are subsequently conveyed push the grinding balls in front of them, making it easier for the grinding balls in front to bounce up and fall onto the inclined plate 14. The grinding balls on the inclined plate 14 are periodically thrown onto the inlet through subsequent arranged conveying.

[0048] Step 3: The grinding balls collected on the inclined plate 14 will line up and fall onto the track stop 9. They will then be conveyed to the end of the track stop 9 near the entrance plate 4 and fall down. During the conveyance on the track stop 9, the grinding balls are continuously heated by the flames sprayed by a row of flame guns 13. After the grinding balls fall down again, they combine with the copper powder injected into the feed inclined pipe 5 to start a new round of copper powder grinding.

[0049] In the production of copper oxide powder, the main cylinder 1, internal gear ring 17, inner liner 2, and pusher 3 of the production unit rotate continuously and synchronously, while the remaining parts remain stationary. The rotating internal gear ring 17 meshes with the spatially positioned main gear 16, causing the main gear 16 to rotate. This rotation then drives a row of push control units 10 via the integrated shaft 11, specifically driving the pressure shaft 35 to rotate. Subsequently, the control disk 36 rotates, driving the straight control column 38 to reciprocate through the swing control column 37, causing the central shaft 29 to reciprocate. Then, the stroke gear 30 reciprocates, driving the side gear 33, causing the column rack 34 to continuously rise and fall. The grinding balls line up and stop at the bottom corner bend of the track stop 9, and are pushed by the rising column rack 34. Thus, after rising, the grinding balls continue to roll forward along the horizontal bar of the track stop 9. For details, please refer to the attached document. Figure 6 The rack 34 first descends to below the horizontal and inclined section of the track stop 9. A V-shaped track is formed between the horizontal and inclined bar of the track stop 9 and the J-shaped protective plate 8. The grinding ball then rolls smoothly to the corner of the horizontal and inclined bar on the track stop 9. Next, the rack 34 rises and pushes the grinding ball. The grinding ball is in an oblique upward state. At this time, a V-shaped track is still formed between the horizontal and inclined bar on the track stop 9 and the J-shaped protective plate 8. The V-shaped track is inclined upward. Due to gravity, the grinding ball will adhere to the V-shaped track. Therefore, the top of the rising rack 34 applies a pushing force to the grinding ball, and the grinding ball can stably tilt upward. Subsequently, the grinding ball cycles through oblique downward rolling and oblique upward movement. In this way, the grinding ball can be transported from one end of the track stop 9 to the other end of the track stop 9 and then fall back to the initial position.

[0050] At the bottom of each horizontal bar of the track stop 9, there are grinding balls in a row. Since the column rack 34 is continuously raised and lowered and the time of each round of raising and lowering is fixed, the grinding balls fall at the same interval each time they approach the end of the track stop 9 near the entrance plate 4. The uniform speed supply of grinding balls, combined with the uniform speed conveying of the pusher 3, will make the grinding balls evenly distributed in the internal space of the main cylinder 1, so that the powder in the main cylinder 1 is evenly ground.

[0051] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A semiconductor-specific copper oxide powder production apparatus, comprising an organic main cylinder (1), characterized in that: The inner wall of the main cylinder (1) is fixed with a cylindrical inner lining layer (2), and a spiral columnar pusher (3) is fixed in the inner lining layer (2). An inlet plate (4) is movably sleeved inside one end of the main cylinder (1), and a feed inclined pipe (5) runs through the inlet plate (4). An outlet plate (6) is movably covered at the other end of the main cylinder (1). An outlet window (7) for discharging powder is provided at the bottom of the outlet plate (6). The pusher (3) is equipped with a J-shaped protective plate (8), a stepped columnar track stop bar (9) parallel to one side of the J-shaped protective plate (8), a row of push control units (10) on one side of the track stop bar (9), a buffer device (12) corresponding to one side of each push control unit (10), a flame gun (13) corresponding to the top of each buffer device (12), an integrated shaft (11) for driving the row of push control units (10), and a J-shaped protective plate (8). One end of the plate (8) is fixed with a slanted plate (14). The J-shaped protective plate (8) and the track stop (9) are both fixed at one end to the exit plate (6). The slanted plate (14) is fixed to the exit plate (6). A row of inclined long arc grooves is opened on the slanted plate (14), and the long arc grooves pass through the through holes opened on the J-shaped protective plate (8). One end of the slanted plate (14) is provided with a baffle (15) for intercepting grinding balls. Fixed on the J-shaped protective plate (8), the J-shaped protective plate (8) has a round hole for the flame gun (13) to spray through. One end of the integrated shaft (11) passes through the through hole on the door plate (4), and the end of the integrated shaft (11) extending to the outside is fixed with a main gear (16). The main cylinder (1) is connected to the main gear (16) by a fixed internal gear ring (17). The exit plate (6) has an exhaust hole in the middle.

2. The semiconductor-specific copper oxide powder production apparatus according to claim 1, characterized in that: The buffer device (12) includes a plate base (20) fixed on a J-shaped protective plate (8), a stationary shaft (21) vertically fixed on the plate base (20), a P-shaped plate (18) supported on the stationary shaft (21), a limiting rod (19) with an interception on one side of the P-shaped plate (18), and an air pile (22) in contact with the other side of the P-shaped plate (18). The limiting rod (19) is fixed on the plate base (20).

3. The semiconductor-specific copper oxide powder production apparatus according to claim 2, characterized in that: One end of the P-type plate (18) is distributed between the J-type protective plate (8) and the track stop (9), and the end of the plate obstructs the rolling grinding ball on the horizontal bar of the track stop (9). The other end of the P-type plate (18) has a through hole, and the stationary shaft (21) is movably sleeved in the through hole of the P-type plate (18).

4. The semiconductor-specific copper oxide powder production apparatus according to claim 2, characterized in that: The gas cylinder (22) includes a gas cylinder (24) fixed on a plate base (20), a telescopic rod (23) with a piston sliding at the port of the gas cylinder (24), a spring (25) installed inside the gas cylinder (24), and a tail plate (26) covering a round hole in the middle of the bottom plate of the gas cylinder (24). One end of the telescopic rod (23) is in contact with the P-shaped plate (18), and the other end is in contact with the spring (25).

5. The semiconductor-specific copper oxide powder production apparatus according to claim 4, characterized in that: The tail plate (26) has a small exhaust hole in the middle. The air pile (22) also includes a pull-back spring (27). One end of the pull-back spring (27) is fixed on the outer wall of the air tank (24), and the other end is fixed on the tail plate (26).

6. The semiconductor-specific copper oxide powder production apparatus according to claim 1, characterized in that: The push control unit (10) includes a unit frame (31) fixed on a J-shaped protective plate (8), a central shaft (29) and a side shaft (32) supported on the unit frame (31), a stroke gear (30) fixed at one end of the central shaft (29), a side gear (33) fixed at one end of the side shaft (32), and a swing wheel assembly (28) that establishes a transmission between the integrated shaft (11) and the central shaft (29). The integrated shaft (11) is movably sleeved in the inner hole of the cylinder provided on one side of the unit frame (31).

7. The semiconductor-specific copper oxide powder production apparatus according to claim 6, characterized in that: The central shaft (29) and the side shaft (32) are respectively movably sleeved in two through holes opened on the unit frame (31). The push control unit (10) also includes a column rack (34). One end of the side gear (33) is meshed and connected to the column rack (34), and the other end is meshed and connected to the stroke gear (30). One end of the column rack (34) slides through the square hole opened on the unit frame (31), and the other end of the column rack (34) is used to push the grinding ball to rise at the inclined bar of the track stop (9).

8. The semiconductor-specific copper oxide powder production apparatus according to claim 6, characterized in that: The balance wheel assembly (28) includes a pressure shaft (35) movably sleeved in a through hole on the unit frame (31), a control disk (36) fixed at one end of the pressure shaft (35), a swing control column (37) hinged at one end to the edge of the control disk (36), and a straight control column (38) hinged at the other end of the swing control column (37).

9. The semiconductor-specific copper oxide powder production apparatus according to claim 8, characterized in that: One end of the pressure shaft (35) is vertically fixed in the middle of the control panel (36), and the other end is connected to the spiral teeth set on the integrated shaft (11) by a fixed gear. The straight control column (38) is connected to the gear fixed on the central shaft (29) by a row of teeth. The straight control column (38) slides through the plate hole opened on the unit frame (31).

10. A method for producing semiconductor-specific copper oxide powder, using the semiconductor-specific copper oxide powder production apparatus according to claim 1, characterized in that, Includes the following steps: Step 1: Copper powder and air are injected into the main cylinder (1) through the feed inclined pipe (5). The external drive mechanism controls the rotation of the main cylinder (1). The numerous grinding balls placed in the main cylinder (1) interact with the copper powder to achieve grinding. A row of flame guns (13) sprays flames to heat the copper powder, and the copper powder is converted into copper oxide. Step 2: The oxygen consumed by the air is discharged through the exhaust hole of the exit plate (6). The pusher (3) that rotates with the main cylinder (1) pushes the grinding balls and copper oxide powder toward the exit plate (6). The copper oxide powder is discharged through the discharge window (7). The grinding balls are pushed up in the main cylinder (1) and fall onto the inclined plate (14). Step 3: The grinding balls collected on the inclined plate (14) will line up and fall onto the track stop (9). They will then be transported to the end of the track stop (9) near the entrance plate (4) and fall down. The grinding balls are continuously heated by the flames sprayed by a row of blowtorches (13) while being transported on the track stop (9). After the grinding balls fall down again, they combine with the copper powder injected into the feed inclined pipe (5) to start a new round of copper powder grinding.

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